JPS415379Y1 - - Google Patents
Info
- Publication number
- JPS415379Y1 JPS415379Y1 JP1964037533U JP3753364U JPS415379Y1 JP S415379 Y1 JPS415379 Y1 JP S415379Y1 JP 1964037533 U JP1964037533 U JP 1964037533U JP 3753364 U JP3753364 U JP 3753364U JP S415379 Y1 JPS415379 Y1 JP S415379Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1964037533U JPS415379Y1 (zh) | 1964-05-15 | 1964-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1964037533U JPS415379Y1 (zh) | 1964-05-15 | 1964-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS415379Y1 true JPS415379Y1 (zh) | 1966-03-24 |
Family
ID=31772473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1964037533U Expired JPS415379Y1 (zh) | 1964-05-15 | 1964-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS415379Y1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495577A (zh) * | 1972-05-02 | 1974-01-18 | ||
| JPS4911587A (zh) * | 1972-06-01 | 1974-02-01 |
-
1964
- 1964-05-15 JP JP1964037533U patent/JPS415379Y1/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495577A (zh) * | 1972-05-02 | 1974-01-18 | ||
| JPS4911587A (zh) * | 1972-06-01 | 1974-02-01 | ||
| JPS555703B2 (zh) * | 1972-06-01 | 1980-02-08 |