JPS4120805B1 - - Google Patents
Info
- Publication number
- JPS4120805B1 JPS4120805B1 JP7091463A JP7091463A JPS4120805B1 JP S4120805 B1 JPS4120805 B1 JP S4120805B1 JP 7091463 A JP7091463 A JP 7091463A JP 7091463 A JP7091463 A JP 7091463A JP S4120805 B1 JPS4120805 B1 JP S4120805B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7091463A JPS4120805B1 (ko) | 1963-12-27 | 1963-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7091463A JPS4120805B1 (ko) | 1963-12-27 | 1963-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4120805B1 true JPS4120805B1 (ko) | 1966-12-05 |
Family
ID=13445240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7091463A Pending JPS4120805B1 (ko) | 1963-12-27 | 1963-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4120805B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053569A1 (en) * | 2000-01-20 | 2001-07-26 | Nikko Materials Company, Limited | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
-
1963
- 1963-12-27 JP JP7091463A patent/JPS4120805B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053569A1 (en) * | 2000-01-20 | 2001-07-26 | Nikko Materials Company, Limited | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |