JPS4115301Y1 - - Google Patents
Info
- Publication number
- JPS4115301Y1 JPS4115301Y1 JP9480864U JP9480864U JPS4115301Y1 JP S4115301 Y1 JPS4115301 Y1 JP S4115301Y1 JP 9480864 U JP9480864 U JP 9480864U JP 9480864 U JP9480864 U JP 9480864U JP S4115301 Y1 JPS4115301 Y1 JP S4115301Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9480864U JPS4115301Y1 (enrdf_load_stackoverflow) | 1964-02-08 | 1964-02-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9480864U JPS4115301Y1 (enrdf_load_stackoverflow) | 1964-02-08 | 1964-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4115301Y1 true JPS4115301Y1 (enrdf_load_stackoverflow) | 1966-07-18 |
Family
ID=31833043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9480864U Expired JPS4115301Y1 (enrdf_load_stackoverflow) | 1964-02-08 | 1964-02-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4115301Y1 (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5023593B1 (enrdf_load_stackoverflow) * | 1969-02-03 | 1975-08-08 | ||
JPS5552838U (enrdf_load_stackoverflow) * | 1978-10-03 | 1980-04-09 | ||
JPS5823485A (ja) * | 1981-08-03 | 1983-02-12 | Mitsubishi Electric Corp | 加圧接触形半導体装置 |
-
1964
- 1964-02-08 JP JP9480864U patent/JPS4115301Y1/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5023593B1 (enrdf_load_stackoverflow) * | 1969-02-03 | 1975-08-08 | ||
JPS5552838U (enrdf_load_stackoverflow) * | 1978-10-03 | 1980-04-09 | ||
JPS5823485A (ja) * | 1981-08-03 | 1983-02-12 | Mitsubishi Electric Corp | 加圧接触形半導体装置 |