JPS4114750Y1 - - Google Patents

Info

Publication number
JPS4114750Y1
JPS4114750Y1 JP1964001555U JP155564U JPS4114750Y1 JP S4114750 Y1 JPS4114750 Y1 JP S4114750Y1 JP 1964001555 U JP1964001555 U JP 1964001555U JP 155564 U JP155564 U JP 155564U JP S4114750 Y1 JPS4114750 Y1 JP S4114750Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1964001555U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1964001555U priority Critical patent/JPS4114750Y1/ja
Publication of JPS4114750Y1 publication Critical patent/JPS4114750Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1964001555U 1964-01-11 1964-01-11 Expired JPS4114750Y1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1964001555U JPS4114750Y1 (zh) 1964-01-11 1964-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1964001555U JPS4114750Y1 (zh) 1964-01-11 1964-01-11

Publications (1)

Publication Number Publication Date
JPS4114750Y1 true JPS4114750Y1 (zh) 1966-07-09

Family

ID=31728979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1964001555U Expired JPS4114750Y1 (zh) 1964-01-11 1964-01-11

Country Status (1)

Country Link
JP (1) JPS4114750Y1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153916A (zh) * 1974-05-31 1975-12-11
JPS59174278U (ja) * 1983-05-09 1984-11-21 竹内工業株式会社 ペン

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153916A (zh) * 1974-05-31 1975-12-11
JPS5337009B2 (zh) * 1974-05-31 1978-10-06
JPS59174278U (ja) * 1983-05-09 1984-11-21 竹内工業株式会社 ペン
JPS643507Y2 (zh) * 1983-05-09 1989-01-30

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