JPS401396B1 - - Google Patents
Info
- Publication number
- JPS401396B1 JPS401396B1 JP3079261A JP3079261A JPS401396B1 JP S401396 B1 JPS401396 B1 JP S401396B1 JP 3079261 A JP3079261 A JP 3079261A JP 3079261 A JP3079261 A JP 3079261A JP S401396 B1 JPS401396 B1 JP S401396B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5382—Adaptable interconnections, e.g. for engineering changes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3079261A JPS401396B1 (en) | 1961-08-25 | 1961-08-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3079261A JPS401396B1 (en) | 1961-08-25 | 1961-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS401396B1 true JPS401396B1 (en) | 1965-01-26 |
Family
ID=71783707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3079261A Pending JPS401396B1 (en) | 1961-08-25 | 1961-08-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS401396B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020108478A1 (en) * | 2018-11-28 | 2020-06-04 | 上海日馨生物科技有限公司 | Thiamine compound, preparation method and pharmaceutical composition thereof |
-
1961
- 1961-08-25 JP JP3079261A patent/JPS401396B1/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020108478A1 (en) * | 2018-11-28 | 2020-06-04 | 上海日馨生物科技有限公司 | Thiamine compound, preparation method and pharmaceutical composition thereof |
CN111233925A (en) * | 2018-11-28 | 2020-06-05 | 上海日馨生物科技有限公司 | Thiamine compound, preparation method and pharmaceutical composition thereof |
JP2022511468A (en) * | 2018-11-28 | 2022-01-31 | 上海日馨医▲薬▼科技股▲分▼有限公司 | Thiamine compound, production method and pharmaceutical composition thereof |
EP3889160A4 (en) * | 2018-11-28 | 2022-07-27 | Shanghai Raising Pharmaceutical Co., Ltd. | Thiamine compound, preparation method and pharmaceutical composition thereof |
US11591354B2 (en) | 2018-11-28 | 2023-02-28 | Shanghai Raising Pharmaceutical Co., Ltd. | Thiamine compound, preparation method and pharmaceutical composition thereof |