JPH1197596A - Element cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To transfer heat quickly to the other end side of each fin member by inserting a plurality of U-shaped heat pipes into each fin member such that one side of the U-shaped heat pipe is located on one end side of each fin member and the other side thereof is located on the other end side of each fin member. SOLUTION: A plurality of U-shaped heat pipes 6 are evacuated and a specified quantity of working liquid is encapsulated therein. The U-shaped heat pipe 6 is inserted into each fin member 1 such that one side 6a of the U-shaped heat pipe is located on one end side 1a of each tin member 1 and the other side 6b thereof is located on the other end side 1b of each fin member 1. One side 6a of the U-shaped heat pipe is then heated to generate vapor of encapsulated working liquid which is then fed to the other side 6b of the U-shaped heat pipe thus heating the other side 6b of the U-shaped heat pipe. According to the arrangement, heat generated from an element to be cooled can be transferred quickly to the other end side 1b of each fin member 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to IC, L
The present invention relates to an element cooling device for cooling a semiconductor element such as an SI.

[0002]

2. Description of the Related Art FIG. 7 and FIG.
FIG. 1 is a front view and a side view showing a conventional element cooling device disclosed in JP-A-563-563. In each of these drawings, reference numeral 1 denotes a large number of fin members arranged at intervals of, for example, 1 to 2 mm and formed of an aluminum thin plate having a thickness of about 0.1 mm.
Reference numeral 2 denotes a plurality of tubular members which penetrate through the respective fin members 1 in the alignment direction and are fixedly integrated with the respective fin members 1 by expanding the tubes. For example, a copper tube having an outer diameter of about 8 mm is used. The fin member 1 and the tubular member 2
Constitutes the fin laminate 3. Reference numeral 4 denotes a heat receiving plate on which a cooled element 5 which needs to be cooled by generating heat, such as a semiconductor element such as an IC or an LSI, is mounted on one surface 4a, and the fin laminate 3 is mounted on the other surface 4b. Of each fin member 1 is in contact with each other.

Next, the operation will be described. For example, IC,
The heat generated in the element to be cooled 5 such as a semiconductor element such as an LSI is transmitted from the heat receiving plate 4 to each fin member 1, released into the atmosphere or the cooling air through each fin member 1, and repeated. Thereby, the element 5 to be cooled is cooled.

[0004]

However, in the above-mentioned conventional apparatus, the heat generated in the element 5 to be cooled is transmitted from the heat receiving plate 4 to one end 1a of each fin member 1 in contact with the heat receiving plate 4. The heat generated in the cooled element 5 is transmitted from one end 1a of each fin member 1 to the other end 1b of each fin member 1 located on the side opposite to the heat receiving plate 4 by heat conduction. From the one end 1a of the fin member 1 to the other end 1b of the fin member 1 through the heat receiving plate 4, and the fin efficiency is reduced.

[0005] The present invention has been made to solve the above-described problems, and has as its object to provide an element cooling device capable of quickly transferring heat.

[0006]

According to a first aspect of the present invention, there is provided an element cooling apparatus comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin heat-transmissive thin plate members; A heat receiving plate on which one end side is in contact with one surface and the element to be cooled is mounted on the other surface, one side of the U-shape is located at one end side of each fin member, and the other side of the U-shape is each fin member. A plurality of U-shaped heat pipes which are inserted into the respective fin members so as to be located on the other end side of the member, evacuated the inside, and filled with a predetermined amount of the working fluid are provided.

According to a second aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; And a heat receiving plate on which the element to be cooled is mounted on the other surface, one side of the U-shaped pipe is located at one end of each fin member, and the other side of the U-shaped pipe is It was inserted into each fin member so as to be located on the other end side, and one end and the other end of the U-shaped pipe were joined with a vent pipe to form a loop, and the inside of the loop was evacuated. Later, a plurality of loop heat pipes in which a predetermined amount of the working fluid is filled are provided.

According to a third aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat receiving plate that is in contact with the surface of the fin member, and the U-shaped one side is located at one end of each fin member, and the U-shaped other side is the other end of each fin member. The plurality of U inserted in each fin member so as to be located on the side
The U-shaped heat pipe includes a U-shaped heat pipe and a communication pipe communicating with one end of the U-shaped heat pipe.

According to a fourth aspect of the present invention, there is provided an element cooling device, comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat-receiving plate that is in contact with the surface of the fin member, the one surface of the U-shape is located at one end of each of the fin members, and the other side of the U-shape is the other surface of the fin member. A plurality of U-shaped heat pipes inserted into the respective fin members so as to be located on the ends, a first communication pipe communicating one end of the U-shaped heat pipe with a U-shaped heat pipe, and a U-shaped heat pipe. And a second communication pipe communicating with the other end of the U-shaped heat pipe.

According to a fifth aspect of the present invention, there is provided an element cooling apparatus comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat-receiving plate that is in contact with the surface of the fin member, the one surface of the U-shape is located at one end of each of the fin members, and the other side of the U-shape is the other surface of the fin member. A plurality of U-shaped heat pipes inserted into the respective fin members so as to be located on the ends, a first communication pipe communicating one end of the U-shaped heat pipe with a U-shaped heat pipe, and a U-shaped heat pipe. A second communication pipe communicating with the other end of the U-shaped heat pipe,
A vent pipe is provided that joins the end of the first communication pipe and the end of the second communication pipe to form a loop.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In each of these figures, 1 is aligned at an interval of, for example, 1 to 2 mm, and has a thickness of 0.1.
A large number of fin members 4 formed of an aluminum thin plate having a thickness of about mm, and a heat receiving element 5 on one surface 4a of which a cooled element 5 that needs to be cooled by generating heat, such as a semiconductor element such as an IC or an LSI, is mounted. One end side 1a of each fin member 1 is in contact with the other surface 4b.
6 is a U-shaped one side 6a is one end side 1a of each fin member 1.
, Each of which is inserted into each of the fin members 1 such that the other side 6b of the U-shape is located at the other end 1b of each of the fin members 1, and after evacuating the inside, a predetermined amount of hydraulic fluid is sealed therein. Is a U-shaped heat pipe. Evacuation of the U-shaped heat pipe 6 is pre-sealed at one end, and is evacuated from the other end. Each fin member 1 and a plurality of U
The fin laminated body corresponding to the above-described conventional apparatus is constituted by the letter-shaped heat pipe 6.

Next, the operation will be described. For example, IC,
Heat generated in a cooled element 5 such as a semiconductor element such as an LSI is transmitted from the heat receiving plate 4 to each of the fin members 1 and is radiated from each of the fin members 1 to the atmosphere or a cooling air, and a U-shaped heat pipe. The U-shaped one side 6a of 6 is heated. When the U-shaped one side 6a of the U-shaped heat pipe 6 is heated, the working fluid enclosed therein is heated to generate steam, and the U-shaped heat pipe 6 is heated as shown by a dashed arrow. The vapor of the hydraulic fluid moves to the U-shaped other side 6b, and heats the U-shaped other side 6b. Thereby, each fin member 1 around the other side 6b of the U-shape, ie, each fin member 1
Is heated and radiated from the other end 1b of each of the fin members 1 into the atmosphere or into the cooling air, and the working fluid is condensed and liquefied. The working fluid condensed and liquefied on the other side 6b of the U-shaped heat pipe 6 returns to the one side 6a of the U-shaped heat pipe 6 and these operations are naturally repeated. The element 5 to be cooled is cooled.

In the first embodiment, one side 6a of the U-shape is located at one end 1a of each fin member 1, and the other side 6b of the U-shape is located at the other end 1b of each fin member 1. As a result, the heat generated by the U-shaped heat pipe 6 inserted into each fin member 1 allows the heat generated in the element 5 to be cooled to be quickly transferred to the other end 1 b of each fin member 1. As a result, the fin efficiency is improved, so that higher performance (smaller size) can be achieved.

Embodiment 2 FIG. Embodiment 2 of the present invention will be described with reference to FIG. In FIG. 3, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a
Is one surface and 4b is the other surface. 7, one side 7b of the U-shaped pipe 7a is located at one end 1a of each fin member 1, and the other side 7c of the U-shaped pipe 7a is
Is inserted into each fin member 1 so as to be located on the other end side 1b of the U-shaped pipe 7a, and the end of one side 7b and the end of the other side 7c of the U-shaped pipe 7a are joined by a vent pipe 7d to form a loop. This is a plurality of loop heat pipes in which a predetermined amount of working fluid is filled after evacuation of the inside of the loop. Each fin member 1 and the plurality of loop-shaped heat pipes 7 constitute a fin laminate corresponding to the above-described conventional device.

Next, the operation will be described. Cooled element 5
Is transmitted from the heat receiving plate 4 to each of the fin members 1 and is radiated from the fin members 1 to the atmosphere or the cooling air, and at the same time, one side 7b of the U-shaped pipe 7a of the loop heat pipe 7 Heat. When one side 7b of the U-shaped pipe 7a of the loop heat pipe 7 is heated, the working fluid sealed therein is heated to generate steam,
As indicated by the dashed arrow, the vapor of the working fluid moves to the other side 7c of the U-shaped pipe 7a of the loop-shaped heat pipe 7, and heats the other side 7c of the U-shaped pipe 7a. This allows U
Each fin member 1 around the other side 7c of the U-shaped pipe 7a, that is, the other end 1b of each fin member 1 is heated and radiated from the other end 1b of each fin member 1 into the atmosphere or into a cooling air, The working fluid condenses and liquefies. The working fluid condensed and liquefied on the other side 7c of the U-shaped pipe 7a of the loop-shaped heat pipe 7 flows in the same direction without opposing the flow of the steam, and passes through the vent pipe 7d of the loop-shaped heat pipe 7 to become U-shaped.
The cooling element 5 is cooled by returning to one side 7b of the V-shaped pipe 7a and repeating these operations naturally.

In the second embodiment, one side 7b of the U-shaped pipe 7a is located at one end 1a of each fin member 1, and the other side 7c of the U-shaped pipe 7a is
Is inserted into each fin member 1 so as to be located on the other end side 1b of the U-shaped pipe, and the end of one side 7b and the end of the other side 7c of the U-shaped pipe 7a are joined by a vent pipe 7d to form a loop. Due to the heat transport effect of the heat pipe 7, the heat generated in the element 5 to be cooled can be quickly transferred to the other end 1b of each fin member 1, and the fin efficiency is improved, so that high performance (miniaturization) is achieved. ) Can be achieved. Further, the working fluid in the loop-shaped heat pipe 7 circulates in a loop in the inside thereof, so that the vapor flow and the liquid flow are unidirectional, so that the return of the condensed liquid is not hindered by the vapor flow. Therefore, the heat transport amount increases, and the cooling capacity can be greatly improved. Further, by evacuating the vent pipe 7d of the loop-shaped heat pipe 7, the length of the pipe to be evacuated is halved compared to the first embodiment, and the evacuating time is reduced to about half. Work efficiency can be greatly improved.

Embodiment 3 Third Embodiment A third embodiment of the present invention will be described with reference to FIG. In FIG. 4, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a
Is one surface and 4b is the other surface. 8 is inserted into each fin member 1 such that one side 8a of the U-shape is located at one end 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end 1b of each fin member 1. A plurality of U-shaped heat pipes are worn. Reference numeral 9 denotes a communication pipe which communicates the ends of the U-shaped one side 8a of the U-shaped heat pipe 8 with each other. These U
After evacuating the insides of the heat pipe 8 and the communication pipe 9, a predetermined amount of the working fluid is filled. Each fin member 1, the plurality of U-shaped heat pipes 8, and the communication pipe 9 constitute a fin laminate equivalent to the above-described conventional device.

Next, the operation will be described. Cooled element 5
The other end 1 of each fin member 1 from the heat receiving plate 4 of the heat generated in
The transmission operation up to b is the same as in the first embodiment. In the third embodiment, the end portions of the U-shaped one sides 8a of the plurality of U-shaped heat pipes 8 are communicated with each other by the communication pipe 9, whereby the internal pressure is equalized, and the hydraulic fluid is equalized. Since the evaporation temperature of the heat receiving plate 4 becomes constant, cooling can be uniformly performed over the entire surface of the heat receiving plate 4. In addition, the provision of the communication pipe 9 enables the operations of evacuating the inside and enclosing the working fluid to be completed at one time, thereby reducing the manufacturing cost.

Embodiment 4 Embodiment 4 of the present invention will be described with reference to FIG. In FIG. 5, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a
Is one surface and 4b is the other surface. 8 is inserted into each fin member 1 such that one side 8a of the U-shape is located at one end 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end 1b of each fin member 1. A plurality of U-shaped heat pipes are worn. Reference numeral 10 denotes a first communication pipe which connects the ends of the U-shaped one side 8a of the U-shaped heat pipe 8 to each other, and 11 denotes a U-shaped heat pipe.
This is a second communication pipe which connects the ends of the U-shaped other side 8b of the U-shaped heat pipe 8 to each other. These U-shaped heat pipes 8
After the insides of the first and first communication pipes 10 and 11 are evacuated, a predetermined amount of working fluid is filled. Each fin member 1, the plurality of U-shaped heat pipes 8, and each of the communication pipes 10 and 11 constitute a fin laminate equivalent to the above-described conventional device.

Next, the operation will be described. Cooled element 5
The other end 1 of each fin member 1 from the heat receiving plate 4 of the heat generated in
The transmission operation up to b is the same as in the third embodiment described above. In the fourth embodiment, the first communication pipe 10 connects the ends of the U-shaped one side 8a of the plurality of U-shaped heat pipes 8 to each other, and the second communication pipe 11 connects the plurality of U-shaped heat pipes. The ends of the other side 8b of the U-shaped heat pipe 8 communicate with each other, whereby the internal steam pressure becomes more uniform, and the evaporation temperature of the working fluid becomes constant.
Cooling and heat radiation can be performed more uniformly over the entire surface of the heat receiving plate 4.

Embodiment 5 Embodiment 5 of the present invention will be described with reference to FIG. 6, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a
Is one surface and 4b is the other surface. 8 is inserted into each fin member 1 such that one side 8a of the U-shape is located at one end 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end 1b of each fin member 1. A plurality of attached U-shaped heat pipes, 10 is a first communication pipe connecting the ends of the U-shaped one side 8a of the U-shaped heat pipe 8, and 11 is a U-shaped heat pipe 8 of the U-shaped heat pipe 8. Is a second communication pipe which communicates the end portions of the other side 8b with each other. 12 and 13 are first and second communication pipes 1
It is a vent pipe which joins the ends of 0 and 11 to form a loop. After evacuating the inside of the U-shaped heat pipe 8, the first and first communication pipes 10, 11, and the vent pipes 12, 13, a predetermined amount of working fluid is filled. Each fin member 1, a plurality of U-shaped heat pipes 8, each communication pipe 1
The fin laminate corresponding to the above-described conventional apparatus is constituted by the vent pipes 0 and 11 and the respective vent pipes 12 and 13.

Next, the operation will be described. Cooled element 5
The other end 1 of each fin member 1 from the heat receiving plate 4 of the heat generated in
The transmission operation up to b is the same as in the fourth embodiment. In the fifth embodiment, the vent pipes 12 and 13
The ends of the first and second communication pipes 10 and 11 are joined to form a loop, and the working fluid circulates in a loop inside the working pipe. The hydraulic fluid condensed and liquefied on the other side 8b from the U-shaped one side 8a to the other side 8b is directed to the second communication pipe 11, and the hydraulic fluid of the second communication pipe 11 is passed through the vent pipes 12 and 13, respectively. The condensed liquid returns to the one communication pipe 10 from the first communication pipe 10 to one side 8a of the U-shape of each U-shaped heat pipe 8 so that the vapor flow and the liquid flow are in one direction. Is not hindered by the steam flow, so that the amount of heat transport increases as compared with the above-described fourth embodiment, and the cooling capacity can be greatly improved.

[0023]

According to a first aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat receiving plate that is in contact with the surface of the fin member, and the U-shaped one side is located at one end of each fin member, and the U-shaped other side is the other end of each fin member. A plurality of U-shaped heat pipes, which are inserted into each fin member so as to be located on the side and are evacuated to the inside and filled with a predetermined amount of working fluid, are provided. By the effect, heat generated in the element to be cooled can be quickly transferred to the other end of each fin member,
Since the fin efficiency is improved, higher performance (smaller size) can be achieved.

According to a second aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; And a heat receiving plate on which the element to be cooled is mounted on the other surface, one side of the U-shaped pipe is located at one end of each fin member, and the other side of the U-shaped pipe is It was inserted into each fin member so as to be located on the other end side, and one end and the other end of the U-shaped pipe were joined with a vent pipe to form a loop, and the inside of the loop was evacuated. Later, by providing a plurality of loop heat pipes filled with a predetermined amount of the working fluid, heat generated by the element to be cooled is quickly transmitted to the other end of each fin member due to the heat transport effect of the loop heat pipe. Can transfer heat, fin efficiency Since the upper, it is possible to improve the performance (reduction in size). In addition, the working fluid in the loop heat pipe circulates in a loop inside the heat pipe, and the vapor flow and the liquid flow are in one direction, so that the return of the condensate is not hindered by the vapor flow. The amount of heat transport increases, and the cooling capacity can be greatly improved.

According to a third aspect of the present invention, there is provided an element cooling apparatus comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat receiving plate that is in contact with the surface of the fin member, and the U-shaped one side is located at one end of each fin member, and the U-shaped other side is the other end of each fin member. The plurality of U inserted in each fin member so as to be located on the side
By providing a U-shaped heat pipe and a communication pipe communicating one end of the U-shape of the U-shaped heat pipe, the internal pressure becomes uniform, and the evaporating temperature of the working fluid becomes constant. In addition, uniform cooling can be performed over the entire surface of the heat receiving plate.

According to a fourth aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat-receiving plate that is in contact with the surface of the fin member, the one surface of the U-shape is located at one end of each of the fin members, and the other side of the U-shape is the other surface of the fin member. A plurality of U-shaped heat pipes inserted into the respective fin members so as to be located on the ends, a first communication pipe communicating one end of the U-shaped heat pipe with a U-shaped heat pipe, and a U-shaped heat pipe. By providing the second communication pipe communicating with the other end of the U-shape of the heat pipe, the internal steam pressure becomes more uniform, and the evaporating temperature of the working fluid becomes constant. Cooling and heat radiation can be performed more uniformly.

According to a fifth aspect of the present invention, there is provided an element cooling device comprising: a plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity; A heat-receiving plate that is in contact with the surface of the fin member, the one surface of the U-shape is located at one end of each of the fin members, and the other side of the U-shape is the other surface of the fin member. A plurality of U-shaped heat pipes inserted into the respective fin members so as to be located on the ends, a first communication pipe communicating one end of the U-shaped heat pipe with a U-shaped heat pipe, and a U-shaped heat pipe. A second communication pipe communicating with the other end of the U-shaped heat pipe,
By providing the vent pipe which joins the end of the first communication pipe and the end of the second communication pipe to form a loop,
Since the vapor flow and the liquid flow are in one direction, the return of the condensate is not hindered by the vapor flow, so that the heat transport amount is increased as compared with the above-described claim 4, and the cooling capacity is greatly increased. Can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing Embodiment 1 of the present invention.

FIG. 2 is a front view showing the first embodiment of the present invention.

FIG. 3 is a perspective view showing a second embodiment of the present invention.

FIG. 4 is a perspective view showing a third embodiment of the present invention.

FIG. 5 is a perspective view showing a fourth embodiment of the present invention.

FIG. 6 is a perspective view showing a fifth embodiment of the present invention.

FIG. 7 is a front view showing a conventional device.

FIG. 8 is a side view showing a conventional device.

[Explanation of symbols]

Reference Signs List 1 fin member, 1a one end side, 1b other end side, 4 heat receiving plate, 6 U-shaped heat pipe, 6a one side, 6b
The other side, 7 loop heat pipe, 7a U-shaped pipe, 7b one side, 7c the other side, 7d vent pipe, 8
U-shaped heat pipe, 8a one side, 8b other side,
9 communication pipe, 10 first communication pipe, 11 second communication pipe, 1
2 vent pipe, 13 vent pipe.

 ────────────────────────────────────────────────── ─── Continued from the front page (72) Inventor Tetsuro Ogushi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (5)

[Claims] 1. A large number of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity, one end of each of the fin members is in contact with one surface, and is covered with the other surface. A heat receiving plate on which a cooling element is mounted, and each of the fin members such that one side of the U-shape is located at one end of each of the fin members and the other side of the U-shape is located at the other end of each of the fin members A plurality of U-shaped heat pipes, each of which is inserted into a plurality of U-shaped heat pipes and a predetermined amount of a working fluid is filled after evacuation of the inside. 2. A plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity, one end of each of the fin members is in contact with one surface, and is covered with the other surface. The heat receiving plate on which the cooling element is mounted, and one side of the U-shaped pipe is located at one end of each of the fin members, and the other side of the U-shaped pipe is located at the other end of each of the fin members. Inserted into each fin member, one end and the other end of the U-shaped pipe are joined by a vent pipe to form a loop, and after evacuating the inside of the loop, a predetermined amount of working fluid is filled. And a plurality of loop heat pipes. 3. A plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity, one end of each of the fin members is in contact with one surface, and is covered with the other surface. A heat receiving plate on which a cooling element is mounted, and each of the fin members such that one side of the U-shape is located at one end of each of the fin members and the other side of the U-shape is located at the other end of each of the fin members A plurality of U-shaped heat pipes inserted into
A communication pipe for communicating one end of the U-shaped heat pipe with one side of the U-shape. 4. A large number of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity, one end of each of the fin members is in contact with one surface, and is covered with the other surface. A heat receiving plate on which a cooling element is mounted, and each of the fin members such that one side of the U-shape is located at one end of each of the fin members and the other side of the U-shape is located at the other end of each of the fin members A plurality of U-shaped heat pipes inserted into
The first connecting the U-shaped one end of the U-shaped heat pipe
An element cooling device comprising: a communication pipe; and a second communication pipe that communicates with the other end of the U-shaped heat pipe on the other side of the U-shape. 5. A plurality of fin members which are arranged at predetermined intervals and are formed of thin plate members having good heat conductivity, one end of each of the fin members is in contact with one surface, and is covered with the other surface. A heat receiving plate on which a cooling element is mounted, and each of the fin members such that one side of the U-shape is located at one end of each of the fin members and the other side of the U-shape is located at the other end of each of the fin members A plurality of U-shaped heat pipes inserted into
The first connecting the U-shaped one end of the U-shaped heat pipe
The communication pipe, a second communication pipe communicating with the other end of the U-shape of the U-shaped heat pipe, and an end of the first communication pipe and an end of the second communication pipe are joined to each other. An element cooling device, comprising: a vent pipe forming a loop.