JPH1195071A - Manufacture and mounting structure for optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method and a mounting structure for an optical module, by which a central conductor and a microstrip line can be surely brought into contact mutually and deterioration in a high frequency transmission characteristic can be reduced. SOLUTION: An optical module is constructed of a chip carrier 1 on which a light modulator 14 is mounted, a lens 6A for admitting an optical signal to the light modulator 14, a lens 6B for admitting an optical signal radiated from the light modulator 14 to an optical fiber 2B, an electronic cooling element for operating the optical fibers 2A, 2B and the light modulator 14 at a constant temperature, a high frequency connector 5 for impressing a high frequency signal to the light modulator 14, and a package 4 housing these components. In the optical module, the high frequency connector 5 is inserted into a hole bored in the package 4, while a ring 20 is arranged between the package 4 and the high frequency connector 5, and the package 4 and the high frequency connector 5 are fixed via the ring 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing an optical module and a mounting structure for the optical module.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
For example, the document name: Journal of the Institute of Circuit Packaging, Vol. 10, N
o. 5 (1995) pp. 306-309 "Semiconductor light control device and mounting". Less than,
The structure of such a conventional optical module will be described.

FIG. 4 is a plan view of a conventional optical module, and FIG. 4A is an overall view of the optical module.
FIG. 4B is an enlarged view of a portion A in FIG. FIG. 5 is an optical axis sectional view of the optical module. As shown in these figures, this optical module comprises an optical modulator 107, a carrier 102 for mounting the optical modulator 107, and an optical modulator 1
07, an aspheric lens 105 for inputting an optical signal from the optical fiber 100, an aspheric lens 106 for inputting an optical signal emitted from the optical modulator 107 to the optical fiber 101, the optical fibers 100, 101, and light Modulator 10
A thermoelectric cooler 111 for operating the thermostat 7 at a constant temperature, a high-frequency connector 104 for applying a high-frequency electric field to the optical modulator 107, a strip line 110, a terminating resistor 109 for impedance matching, and a package for accommodating these. And an input / output electrical terminal 103.

The optical modulator 107 is an electro-absorption type optical modulator, and has an optical waveguide having a PIN structure.
By applying an electric field to the PIN layer, the amount of light absorption is changed, and light intensity is modulated. The optical modulator 107 and the strip line 110 are mounted on the carrier 102, and are connected by a wire bond 108. The carrier 102 is further mounted on the electronic cooling element 111, and the electronic cooling element 111 is fixed in a package.

The high-frequency connector 104 is fixed to a package and connected to one end of the strip line 110 on the carrier 102 (the side opposite to the side to which the optical modulator 107 is connected).

[0006]

However, in the above-mentioned conventional optical module, the optical modulator 107 and the strip line 110 are composed of the carrier 102 and the electronic cooling element 1.
11 and fixed inside the package, and the high-frequency connector 104 is also fixed at a predetermined position of the package in advance. (Variation), the thickness of the solder when each member is fixed with a solder material or the like, the mounting position of the high-frequency connector 104 on the package, the tolerance at the time of mounting, and the like, the height of the high-frequency connector 104 and the strip line 110. However, there is a problem that the high-frequency signal cannot be applied to the optical modulator 107 or the high-frequency transmission characteristics in this portion deteriorate. .

One solution to this problem is to:
It is conceivable to insert a spacer having an appropriate thickness under the carrier 102, the electronic cooling element 111, or both. This spacer is a plate material having a different thickness according to the shape of the insertion point. It is necessary to prepare various thicknesses in consideration of the tolerance of each member at the time of design. When assembling, measure the dimensions of each member in advance and select the optimal spacer thickness, or insert an appropriate spacer first, check the positional relationship visually, etc., and select the optimal spacer thickness Such a method is adopted.

However, in this method, a plurality of spacers must be prepared, and a step of selecting and fixing the spacers is required, so that the cost or the manufacturing time increases. In addition, there has been a problem that the number of fixing members increases due to an increase in the number of members, and the reliability decreases. SUMMARY OF THE INVENTION The present invention provides an optical module that can easily move the position of a high-frequency connector to securely contact a center conductor and a microstrip line and reduce deterioration of high-frequency transmission characteristics. And a mounting structure of the optical module.

[0009]

According to the present invention, in order to achieve the above object, [1] a carrier on which an optical element is mounted is constituted by a high frequency substrate on which a microstrip line and a terminating resistor are formed; Carrier having an optical element mounted thereon, a lens for inputting an optical signal to the optical element, a lens for inputting an optical signal emitted from the optical element to an optical fiber, and operating the optical fiber and the optical element at a constant temperature. A method for manufacturing an optical module comprising an electronic cooling element for applying a high-frequency signal to the optical element and a high-frequency input terminal for applying the high-frequency signal to the optical element, and a package for accommodating them. A high-frequency input terminal is inserted, a ring is provided between the package and the high-frequency input terminal, and the package and the high-frequency It is obtained so as to secure the force terminals.

[2] A carrier on which the optical element is mounted is composed of a high frequency substrate on which a microstrip line and a terminating resistor are formed, and a carrier for mounting the optical element and an optical signal for inputting an optical signal to the optical element. A lens and a lens for causing an optical signal emitted from the optical element to enter an optical fiber, an electronic cooling element for operating the optical fiber and the optical element at a constant temperature, and a high frequency for applying a high frequency signal to the optical element In a mounting structure of an optical module comprising an input terminal and a package for accommodating these, a package having a hole formed on a side surface, and a connector holder provided with a high-frequency input terminal are inserted into the hole,
The connector holder and a ring fixed between the packages are provided.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of an optical module showing an embodiment of the present invention, and FIG.
FIG. 3 is a sectional view taken along line A 'of FIG. 1, and FIG. 3 is a sectional view taken along line BB' of FIG.
In this embodiment, an example in which an optical modulator is used as an optical element will be described.

As shown in these figures, this optical module comprises an optical modulator (chip) 14, a chip carrier 1 for fixing the optical modulator 14, and optical fibers 2A for inputting and outputting optical signals. 2B, a high-frequency connector 5 for supplying a high-frequency electrical signal, a connector holder 21 for holding the high-frequency connector 5, and a light emitted from the optical modulator 14 for inputting an optical signal to the optical modulator 14. Lenses 6A and 6B for collecting signals,
Lens holders 7A and 7B for holding and fixing 6B,
A base 8 for mounting the lenses 6A and 6B and the chip carrier 1, an electronic cooling element 9 for keeping the optical modulator 14 mounted on the chip carrier 1 at a constant temperature, and a package 4 for holding and accommodating the above components. Ring 20 for fixing the package 4 and the connector holder 21
It is composed of

The chip carrier 1 includes a second high-frequency substrate 12 on which only the microstrip line 16 is formed, a first high-frequency substrate 11 on which the microstrip line 16 and the terminating resistor (thin film resistor) 10 are formed, And a carrier base 15 made of the same. The chip carrier 1 includes a first high-frequency substrate 11 and a second high-frequency substrate 12 at the center of a carrier base 15 and an optical modulator 1.
4 is opened and fixed by silver brazing or the like. The optical modulator 14 is fixed to the gap by Au / Sn soldering or the like, and is connected to the microstrip line 16 by a bonding wire 17.

In this embodiment, as shown in FIG.
The high frequency substrate 12 has a structure protruding rightward from the carrier base 15, and the protruding portion is abutted against the connector holder 21 to connect the center conductor 30 of the high frequency connector 5 to the microstrip line 16. The high-frequency connector 5 is fixed to the connector holder 21 by means such as screwing or screwing.

The outer shape of the connector holder 21 is preferably circular. Here, it is assumed to be a circle. A hole 31 having a diameter larger than the outer diameter of the connector holder 21 is provided in the package 4. The ring 20 has an outer diameter larger than the diameter of the hole 31 and an inner diameter substantially equal to the diameter of the connector holder 21. The ring 20 is connected to the connector holder 2
When it is inserted into the device, it is designed to move smoothly and not to create a large gap.

Hereinafter, the assembly of the optical module will be described. First, the chip carrier 1 on which the optical modulator 14 is mounted in the package 4, the base 8, and the thermoelectric cooler 9 are fixed to predetermined positions by soldering or the like. Next, the ring 20 is inserted into the connector holder 21 to which the high-frequency connector 5 is fixed, and these are held by an appropriate jig.
Insert the 0 side into the hole 31. Then, the connector holder 21 and the ring 20 are appropriately moved so that the center conductor 30 comes into contact with the microstrip line 16 of the second high-frequency board 12, and an optimum position is determined.

After the optimum position is determined, the outside of the package 4 and the ring 20 is determined by means such as laser spot welding.
And [the inside of the ring 20 and the connector holder 21] are fixed. When airtightness is required for the module, it can be realized by performing laser spot welding many times along the outer periphery of the ring 20. Similar assembly can be performed using solder.

In this embodiment, an example in which a connector is used as a high-frequency input / output terminal has been described. However, a similar configuration can be adopted for a ceramic terminal or the like. As described above, according to this embodiment, a hole 31 is formed in the package 4, the ring 20 is inserted into the connector holder 21, and the ring 20 is used.
Since the structure is adopted in which the package 4 and the connector holder 21 are fixed, the following effects can be obtained.

(1) Even if the height of the microstrip line 16 of the second high-frequency substrate 12 varies due to the tolerance (variation in thickness) of each member, the high-frequency connector 5
Can be easily moved, and the center conductor 30 and the microstrip line 16 can be surely brought into contact with each other, so that deterioration of high-frequency transmission characteristics can be reduced.

(2) Since a height adjusting part such as a spacer is not required, a step of selecting and fixing the spacer is not required, and the cost or the manufacturing time can be reduced. In addition, it is possible to reduce a decrease in reliability due to an increase in the number of fixing parts due to an increase in the number of members. In the above embodiment, an example in which the present invention is applied to a module using an optical modulator has been described. However, the present invention is also applicable to a high-frequency IC package using a high-frequency connector, a semiconductor laser module, and a hybrid IC device.

It should be noted that the present invention is not limited to the above embodiment, but various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0022]

As described above, according to the present invention, the following effects can be obtained. (1)
According to the first aspect of the present invention, the position of the high-frequency connector can be easily moved even if the height of the microstrip line of the second high-frequency substrate varies due to the tolerance (variation in thickness) of each member. By this, the center conductor and the microstrip line can be reliably contacted,
Deterioration of high frequency transmission characteristics can be reduced.

(2) According to the second aspect of the present invention, since there is no need for a height adjusting component such as a spacer, the step of selecting and fixing the spacer is not required, and the cost or the manufacturing time is reduced. Can be. In addition, a decrease in reliability due to an increase in the number of fixing parts due to an increase in the number of members can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of an optical module showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA ′ of FIG.

FIG. 3 is a sectional view taken along line BB ′ of FIG. 1;

FIG. 4 is a plan view of a conventional optical module.

FIG. 5 is an optical axis sectional view of a conventional optical module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip carrier 2A, 2B Optical fiber 4 Package 5 High frequency connector 6A, 6B Lens 7A, 7B Lens holder 8 Base 9 Electronic cooling element 10 Terminating resistor (thin film resistor) 11 First high frequency substrate 12 Second high frequency substrate 14 Optical modulator (chip) 15 Carrier base 16 Microstrip line 17 Bonding wire 20 Ring 21 Connector holder 30 Central conductor 31 Hole

Claims (2)

[Claims] 1. A carrier on which an optical element is mounted comprises a high-frequency transmission path, and a carrier for mounting the optical element, a condenser lens, the optical fiber, and a high-frequency signal for applying a high-frequency signal to the optical element. In a method for manufacturing an optical module including an input terminal and a package for accommodating the input terminal, a hole is formed in the package, the high-frequency input terminal is inserted into the hole, and a ring is provided between the package and the high-frequency input terminal. And fixing the package and the high frequency input terminal via the ring. 2. A high-frequency transmission line for applying a high-frequency signal to the carrier on which the optical element is mounted, the carrier on which the optical element is mounted, a condenser lens, the optical fiber, and the optical element. In the mounting structure of an optical module including terminals and a package for accommodating the terminals, (a) a package having a hole formed in a side surface and (b) a connector holder having a high-frequency input terminal are inserted into the hole. And a ring fixed between the connector holder and the package.