JPH1187872A - Ground terminal mounting structure of electronic apparatus - Google Patents
Ground terminal mounting structure of electronic apparatusInfo
- Publication number
- JPH1187872A JPH1187872A JP26770197A JP26770197A JPH1187872A JP H1187872 A JPH1187872 A JP H1187872A JP 26770197 A JP26770197 A JP 26770197A JP 26770197 A JP26770197 A JP 26770197A JP H1187872 A JPH1187872 A JP H1187872A
- Authority
- JP
- Japan
- Prior art keywords
- ground terminal
- sheet metal
- mounting structure
- printed circuit
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子機器のグラウン
ド端子取付構造に関する。The present invention relates to a ground terminal mounting structure for electronic equipment.
【０００２】[0002]
【従来の技術】従来、携帯用無線機等の電子機器がプリ
ント基板２枚構成の場合、両プリント基板間のグラウン
ド強化を行なう必要が発生したときは、図２に示すよう
に、一方のプリント基板３に取り付けたシールド板１１
等から板バネ１１Ａを延設して、他方のプリント基板４
のグラウンドパターンに接触させていた。2. Description of the Related Art Conventionally, in a case where an electronic device such as a portable radio has two printed boards, when it is necessary to strengthen the ground between the two printed boards, as shown in FIG. Shield plate 11 attached to substrate 3
The leaf spring 11A is extended from the
In contact with the ground pattern.
【０００３】また、図３に示すように、両プリント基板
３及び４の各グラウンドパターン間にピン１２を立てて
半田付けをして固定させることによりグラウンド強化を
行なっていた。Further, as shown in FIG. 3, the ground is strengthened by setting pins 12 between the respective ground patterns of the printed boards 3 and 4 and fixing them by soldering.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の板バネ
によるグラウンド強化では、安定しないため板バネの接
触が動いてガサノイズを発生する等の問題が多く発生し
ていた。However, in the conventional ground reinforcement using a leaf spring, there are many problems such as the occurrence of noise due to movement of the contact of the leaf spring due to instability.
【０００５】本発明の目的は、上記従来の問題を解決し
た電子機器のグラウンド端子取付構造を提供することに
ある。An object of the present invention is to provide a ground terminal mounting structure for an electronic device which solves the above-mentioned conventional problems.
【０００６】[0006]
【課題を解決するための手段】本発明にかかる電子機器
のグラウンド端子取付構造は、請求項１に記載のよう
に、板金部と、該板金部の両端に形成された取付部とか
らなるグラウンド端子を、所定間隔の２枚のプリント基
板の間に配置し、前記板金部の片側の縁を前記プリント
基板のうちの一方のプリント基板に形成されたグラウン
ドパターンに接触させ、前記取付部を前記プリント基板
のうちの他方のプリント基板に形成されたグラウンドパ
ターンに接触させながら電子機器の適所に固定するよう
に構成したことを特徴とする。According to a first aspect of the present invention, there is provided a ground terminal mounting structure for an electronic device, comprising a sheet metal portion and mounting portions formed at both ends of the sheet metal portion. A terminal is arranged between two printed boards at a predetermined interval, one edge of the sheet metal part is brought into contact with a ground pattern formed on one of the printed boards, and the mounting part is The electronic device is characterized in that it is fixed to an appropriate place of an electronic device while being in contact with a ground pattern formed on the other printed circuit board of the printed circuit boards.
【０００７】[0007]
【発明の実施の形態】図１は本発明に係る電子機器のグ
ラウンド端子取付構造の一実施例を示し、（Ａ）は分解
斜視図、（Ｂ）は取付後の断面図である。図１におい
て、１はグラウンド端子であり、板金部１Ａと、板金部
１Ａの両端に形成された取付部１Ｂとからなる。板金部
１Ａは両端が折り曲げられ、折り曲げ部分の下部に切り
欠き部１ｂが形成されて、上部に取付部１Ｂが形成され
ている。1A and 1B show an embodiment of a ground terminal mounting structure for an electronic device according to the present invention, wherein FIG. 1A is an exploded perspective view and FIG. 1B is a sectional view after mounting. In FIG. 1, reference numeral 1 denotes a ground terminal, which comprises a sheet metal part 1A and mounting parts 1B formed at both ends of the sheet metal part 1A. The sheet metal portion 1A has both ends bent, a cutout portion 1b is formed at a lower portion of the bent portion, and a mounting portion 1B is formed at an upper portion.
【０００８】２は電子機器のケースであり、ネジ穴２Ｂ
が形成された取付用リブ２Ａと、薄壁部２Ｄに連結する
連結部２Ｃが一体形成されている。３はプリント基板で
あり、その縁付近に直線状に形成されたグラウンドパタ
ーン３Ａを備えている。４はプリント基板であり、その
コーナーに、表裏両面にグラウンドパターン４Ａと、切
り欠き部４Ｂを備えている。５は電子機器のシャーシで
あり、ネジ穴５Ａが形成されている。６はネジ、７はプ
リント基板３のキースイッチパターンに接するゴム製キ
ートップである。[0008] Reference numeral 2 denotes a case of an electronic device, which has a screw hole 2B.
Are formed integrally with a connecting rib 2A formed with the connecting wall 2A and a connecting portion 2C connected to the thin wall portion 2D. Reference numeral 3 denotes a printed circuit board having a ground pattern 3A formed linearly near the edge thereof. Reference numeral 4 denotes a printed circuit board, which is provided with a ground pattern 4A and a cutout 4B at both corners of the printed circuit board. Reference numeral 5 denotes a chassis of the electronic device, in which a screw hole 5A is formed. Reference numeral 6 denotes a screw, and reference numeral 7 denotes a rubber key top that comes into contact with the key switch pattern of the printed circuit board 3.
【０００９】組立時、ケース２の底部にキートップ７及
びプリント基板３を位置決めし、次に、グラウンド端子
１を、その切り欠き部１ｂを連結部２Ｃをまたがせなが
ら配置し、板金部１Ａの下縁１ａをプリント基板３のグ
ラウンドパターン３Ａに接触させる。次いで、グラウン
ド端子１の取付部１Ｂ上にプリント基板４の切り欠き部
４Ｂを位置決めして置き、グラウンドパターンに接触さ
せる。さらに、プリント基板４の上にシャーシ５を置
き、ネジ６をネジ穴５Ａ、切り欠き部４Ｂ、ネジ穴１Ｃ
ネジ穴２Ｂに挿入しネジ止めして固定する。At the time of assembling, the key top 7 and the printed circuit board 3 are positioned on the bottom of the case 2, then the ground terminal 1 is arranged with its notch 1b straddling the connecting portion 2C, and the sheet metal portion 1A Is brought into contact with the ground pattern 3A of the printed circuit board 3. Next, the cutout portion 4B of the printed circuit board 4 is positioned and placed on the mounting portion 1B of the ground terminal 1, and is brought into contact with the ground pattern. Further, the chassis 5 is placed on the printed circuit board 4, and the screws 6 are screw holes 5A, the notches 4B, and the screw holes 1C.
It is inserted into the screw hole 2B and fixed with screws.
【００１０】このように、２枚のプリント基板３及び４
の間にグラウンド端子１をはさんでネジ止めをすること
により、各プリント基板のグラウンドパターン３Ａ及び
４Ａをグラウンド端子１を介して接続したので、２枚の
プリント基板３及び４のグラウンドを安定させることが
できる。また、キートップ７の全周にある防水リブをプ
リント基板３で押さえているためプリント基板３が反る
場合があるが、グラウンド端子１の下縁１ａによって２
面押しをしてやることで、ソリ防止してプリント基板３
の本来の位置を保持できる構造になっている。また、グ
ラウンド端子１は、ネジ６（ケースとシャーシ固定用）
のすぐ近くにあり、また、スペース効率もよく、工具も
必要なく、グラウンド強化が行なえる。Thus, the two printed circuit boards 3 and 4
The ground pattern 3A and 4A of each printed circuit board are connected via the ground terminal 1 by screwing with the ground terminal 1 interposed therebetween, so that the ground of the two printed boards 3 and 4 is stabilized. be able to. Also, the printed board 3 may be warped because the waterproof ribs on the entire periphery of the key top 7 are pressed by the printed board 3.
Pressing the surface prevents warpage and prevents printed circuit board 3
Has a structure that can maintain the original position. The ground terminal 1 is a screw 6 (for fixing the case and the chassis).
It is very close to the building, is space efficient, requires no tools, and can enhance the ground.
【００１１】[0011]
【発明の効果】本発明に係るグラウンド端子取付構造に
よれば、プリント基板間のグラウンドを安定して強化で
きると共にプリント基板のソリ防止に役立つ。According to the ground terminal mounting structure of the present invention, it is possible to stably strengthen the ground between the printed boards and to prevent warpage of the printed boards.
【図１】本発明にかかる電子機器のグラウンド端子取付
構造の一実施例を示し、（Ａ）は分解斜視図、（Ｂ）は
取付後の断面図である。1A and 1B show an embodiment of a ground terminal mounting structure of an electronic device according to the present invention, wherein FIG. 1A is an exploded perspective view and FIG. 1B is a cross-sectional view after mounting.
【図２】従来の電子機器のグラウンド端子取付構造の一
例を示し、（Ａ）は断面図、（Ｂ）は斜視図である。FIGS. 2A and 2B show an example of a conventional ground terminal mounting structure of an electronic device, wherein FIG. 2A is a cross-sectional view and FIG.
【図３】従来の電子機器のグラウンド端子取付構造の他
の例を示す斜視図である。FIG. 3 is a perspective view showing another example of a ground terminal mounting structure of a conventional electronic device.
【図４】FIG. 4
【符号の説明】 １ グラウンド端子 １Ａ 板金部 １Ｂ 取付部 １Ｃ ネジ穴 １ａ 下縁 １ｂ 切り欠き部 ２ ケース ２Ａ 取付用リブ ２Ｂ ネジ穴 ２Ｃ 連結部 ２Ｄ 薄壁部 ３ プリント基板 ３Ａ グラウンドパターン ４ プリント基板 ４Ａ グラウンドパターン ４Ｂ 切り欠き部 ５ シャーシ ５Ａ ネジ穴 ６ ネジ ７ キートップ[Description of Signs] 1 Ground terminal 1A Sheet metal part 1B Mounting part 1C Screw hole 1a Lower edge 1b Cutout part 2 Case 2A Mounting rib 2B Screw hole 2C Connecting part 2D Thin wall part 3 Printed circuit board 3A Ground pattern 4 Printed circuit board 4A Ground pattern 4B Notch 5 Chassis 5A Screw hole 6 Screw 7 Key top
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１０年５月８日[Submission date] May 8, 1998
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図４[Correction target item name] Fig. 4
【補正方法】削除[Correction method] Deleted
Claims (1)
取付部とからなるグラウンド端子を、所定間隔の２枚の
プリント基板の間に配置し、前記板金部の片側の縁を前
記プリント基板のうちの一方のプリント基板に形成され
たグラウンドパターンに接触させ、前記取付部を前記プ
リント基板のうちの他方のプリント基板に形成されたグ
ラウンドパターンに接触させながら電子機器の適所に固
定するように構成したことを特徴とする電子機器のグラ
ウンド端子取付構造。1. A ground terminal comprising a sheet metal part and mounting parts formed at both ends of the sheet metal part is disposed between two printed boards at a predetermined interval, and one edge of the sheet metal part is fixed to the edge. The mounting portion is fixed to a proper position of an electronic device while being in contact with a ground pattern formed on one of the printed circuit boards, and the mounting portion is in contact with a ground pattern formed on the other printed circuit board of the printed circuit board. A ground terminal mounting structure for an electronic device, wherein the ground terminal mounting structure is configured as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26770197A JP3529992B2 (en) | 1997-09-12 | 1997-09-12 | Ground terminal mounting structure for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26770197A JP3529992B2 (en) | 1997-09-12 | 1997-09-12 | Ground terminal mounting structure for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1187872A true JPH1187872A (en) | 1999-03-30 |
| JP3529992B2 JP3529992B2 (en) | 2004-05-24 |
Family
ID=17448350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26770197A Expired - Lifetime JP3529992B2 (en) | 1997-09-12 | 1997-09-12 | Ground terminal mounting structure for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3529992B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130758A (en) * | 2006-11-20 | 2008-06-05 | Nec Saitama Ltd | Insulating structure and electronic equipment using the same |
| JP2013532389A (en) * | 2010-07-02 | 2013-08-15 | トムソン ライセンシング | System for grounding in electronic equipment |
| JP2017227536A (en) * | 2016-06-22 | 2017-12-28 | カシオ計算機株式会社 | Connection device and timepiece |
-
1997
- 1997-09-12 JP JP26770197A patent/JP3529992B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130758A (en) * | 2006-11-20 | 2008-06-05 | Nec Saitama Ltd | Insulating structure and electronic equipment using the same |
| JP2013532389A (en) * | 2010-07-02 | 2013-08-15 | トムソン ライセンシング | System for grounding in electronic equipment |
| US9179530B2 (en) | 2010-07-02 | 2015-11-03 | Thomson Licensing | System for grounding in an electronic device |
| JP2017227536A (en) * | 2016-06-22 | 2017-12-28 | カシオ計算機株式会社 | Connection device and timepiece |
| US10103461B2 (en) | 2016-06-22 | 2018-10-16 | Casio Computer Co., Ltd. | Connection device and timepiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3529992B2 (en) | 2004-05-24 |
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