JPH1174178A - Wafer-processing device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer-processing technique which is capable of uniformly processing a wafer throughout its surface. SOLUTION: A slit nozzle 30 feeds a developing solution onto a wafer W from a developing solution feed opening while being moved along an X-axis. The slit nozzle 30 can be controlled in a vertical position through a vertical operation and inclination in a lengthwise direction (direction of Y-axis). When a developing solution is fed to the wafer W, a relative angle which the slit nozzle 30 makes with the wafer W is detected by sensors 32a and 32b, and the slit nozzle 30 is so controlled in lengthwise tilt as to be parallel with the wafer W. The space between the slit nozzle 30 and the wafer W in the direction in which the nozzle 30 advances is detected by a sensor 31, and the slit nozzle 30 is controlled in the vertical position, so as to make the movement locus of the slit nozzle 30 along the X-axis parallel to the wafer W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and method for performing a predetermined processing by discharging a processing liquid onto a thin substrate (hereinafter, simply referred to as a "substrate") such as a semiconductor substrate.

[0002]

2. Description of the Related Art Generally, for a substrate as described above,
A series of substrate processes are performed through a resist coating process, an exposure process, a developing process, and a heat treatment associated therewith.

[0003] Among these various processes, in the developing process, a rod-shaped discharge nozzle having a processing liquid supply port having a length equal to or longer than the diameter of the substrate is provided above the main surface of the substrate. A developing method has been proposed in which a discharge nozzle is moved in parallel with a substrate while the developer is dropped on a stationary substrate, so that the developer is applied to the entire main surface of the substrate.

[0004] According to this method, a uniform amount of the developing solution can be applied on the substrate surface, and a uniform developing result can be obtained.

[0005]

However, in the above method, it is often difficult to keep the distance between the substrate and the discharge nozzle constant due to the assembly accuracy of the apparatus or the substrate holding accuracy. That is, unless the assembly of the apparatus or the holding of the substrate is strictly accurate, the substrate and the discharge nozzle are in a relatively inclined state, and the distance between the substrate and the discharge nozzle cannot be kept constant.

If the distance between the substrate and the discharge nozzle cannot be maintained constant, the pressure of the developing solution supplied from the discharge nozzle becomes non-uniform in the surface of the substrate. Nature will arise.

In such a case, since the distance between the discharge nozzle and each substrate is different for each substrate to be processed, non-uniformity of the development processing results between the processed substrates also occurs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a substrate processing apparatus and method capable of obtaining a uniform processing result in a plane of a substrate.

Another object of the present invention is to provide a substrate processing apparatus and method capable of obtaining a uniform processing result even between substrates.

[0010]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process by applying a processing liquid to a substrate. Holding means for holding in a posture, (b) a processing liquid supply means having a processing liquid supply port having a length equal to or greater than the diameter of the substrate, and supplying the processing liquid to the substrate, (c) the processing Moving means for moving the liquid supply means in a substantially horizontal direction and in a direction perpendicular to the longitudinal direction of the processing liquid supply means, and (d) the trajectory of the processing liquid supply port drawn by movement by the movement means is the substrate. And a distance adjusting means for adjusting the distance between the processing liquid supply means and the substrate so as to be parallel to the main surface of the substrate.

Further, the invention according to claim 2 is the substrate processing apparatus according to claim 1, further comprising: (e) an interval detecting means for detecting an interval between the processing liquid supply means and the substrate. The distance adjusting means adjusts the distance between the processing liquid supply means and the substrate based on the result of the detection by the distance detecting means.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, the interval detecting means includes a processing liquid supply means at a position along the longitudinal direction of the processing liquid supply means. A longitudinal direction interval detecting unit for detecting an interval between the substrate and the substrate, wherein the interval adjusting unit is configured such that the processing liquid supply unit and the main surface of the substrate are parallel in the longitudinal direction of the processing liquid supply unit. Thus, a tilt adjusting means for adjusting the tilt of the processing liquid supply means is included.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, the processing liquid supply unit and the processing liquid supply unit are moved by the moving means to the interval detection unit. Moving direction interval detecting means for detecting an interval between the substrate and the main surface of the substrate, wherein the distance adjusting means includes a path by the movement of the processing liquid supply means in the direction of the movement of the processing liquid supply means and a main surface of the substrate; Elevating means for vertically elevating the processing liquid supply means such that the processing liquid supply means are parallel to each other.

According to a fifth aspect of the present invention, there is provided a substrate processing method for performing a predetermined processing by applying a processing liquid to a substrate, wherein (a)
A holding step of holding the substrate in a substantially horizontal posture, and (b) a processing liquid supply step of supplying the processing liquid to the substrate from processing liquid supply means having a processing liquid supply port having a length equal to or greater than the diameter of the substrate. (C) an interval detecting step of detecting an interval between the processing liquid supply unit and the substrate, and (d) the processing liquid supply unit is substantially horizontal and perpendicular to a longitudinal direction of the processing liquid supply unit. And (e) moving the processing liquid supply means and the substrate so that the trajectory of the processing liquid supply port based on the movement is parallel to the main surface of the substrate based on the result of the detection. And an interval adjusting step for adjusting the interval.

According to a sixth aspect of the present invention, there is provided the substrate processing method according to the fifth aspect of the present invention, wherein, in the interval detecting step, the processing liquid supply means is provided at a position along the longitudinal direction of the processing liquid supply means. A longitudinal direction interval detecting step for detecting an interval between the means and the substrate, wherein the main surface of the processing liquid supply unit and the main surface of the substrate are parallel to each other in the longitudinal direction of the processing liquid supply unit. And a tilt adjusting step of adjusting the tilt of the processing liquid supply means so that

According to a seventh aspect of the present invention, there is provided the substrate processing method according to the fifth aspect of the present invention, wherein the processing solution supply means is moved to the interval detecting step while the processing solution supply means is moved in the moving step. And a moving direction interval detecting step of detecting an interval between the substrate and the substrate, wherein the interval adjusting step includes: a trajectory of the processing liquid supply unit due to the movement in the direction of the movement of the processing liquid supply unit; An elevating step of vertically elevating the processing liquid supply means so that the main surface is parallel to the main surface.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

In this embodiment, a description will be given of a substrate developing apparatus using a developing solution as a processing solution.

<A. Overall Schematic Configuration of Substrate Developing Apparatus> First, the overall schematic configuration of the substrate developing apparatus will be described. FIG. 1 is a front view showing a schematic configuration of a substrate developing apparatus which is an embodiment of the substrate processing apparatus according to the present invention. FIG. 2 is a plan view illustrating the substrate developing device of FIG.

In FIGS. 1 and 2 and each of the following figures, three-dimensional rectangular coordinates in which a horizontal plane parallel to the floor surface is an XY plane and a vertical direction is a Z direction in order to clarify the relationship therebetween. The system is attached. When the direction of (+ X) and the direction of (−X) are not distinguished, they are simply referred to as “X-axis direction” (the same applies to Y and Z).

The substrate developing apparatus 100 is an apparatus for performing a developing process by supplying a developing solution to the exposed substrate W, and includes a developing solution discharging process, a rinsing solution cleaning process, a spin dry process, etc. It is possible to do.

The substrate developing device 100 includes a spin motor 15 for rotating the substrate W, a slit nozzle 30 (FIG. 2) for discharging a developing solution onto the substrate W, and a rinsing liquid (this embodiment) when the developing process is completed. A rinse liquid discharge nozzle 65 for discharging pure water (in the embodiment), and a control unit 80 for controlling the operation of each mechanism provided in the apparatus.

The substrate W is suction-held by the turntable 11 in a horizontal posture. The rotating table 11 has a rotating shaft 12 suspended from the center of the lower surface thereof.
5 is connected. The rotation of the spin motor 15 is transmitted to the turntable 11 via the rotation shaft 12,
The substrate W sucked and held at 1 rotates around the vertical direction (Z-axis direction) as an axis. Note that the turntable 11 is provided with the substrate W
Is not limited to the form in which the substrate W is held by suction.
The rotary table may be configured to hold the peripheral edge of the rotary table.

In the substrate developing apparatus 100, the substrate W
Is rotated by the spin motor 15 mainly in a so-called spin dry process, which is a rinse solution cleaning process and a subsequent drying process.

The slit nozzle 30 receives a supply of a developing solution from a developing solution supply source (not shown) and spreads the developing solution on the main surface of the substrate to form a developing solution layer. "). That is, the slit nozzle 30 has a developer supply port 35 having a length equal to the diameter of the substrate W, and while the developer is dropped from the developer supply port 35 onto the stationary substrate W, The slit nozzle 30 is moved in the (+ X) direction parallel to the substrate W by using the direction moving mechanism 20, so that the developing solution is applied to the entire main surface of the substrate. Note that the length of the developer supply port 35 is not limited to be equal to the diameter of the substrate W, and may be longer. When the developer is applied, the substrate W
In consideration of the impact of the developing solution on the substrate W, the slit nozzle 30 starts dropping the developing solution shortly before being located above the substrate W, and moves the slit nozzle 30 in the (+ X) direction.

Here, in the substrate developing apparatus 100 which is the substrate processing apparatus according to the present invention, the slit nozzle 30
So that the sensor 31 and the sensor 3
2a, 32b, an elevating mechanism 40 and a nozzle inclination correcting mechanism 70, which will be described later in detail.

The rinsing liquid discharge nozzle 65 has a function of discharging a rinsing liquid to the substrate W after the development processing and stopping the development processing. In addition, the rinsing liquid discharge nozzle 65 is configured to be rotatable around a vertical direction by a nozzle rotation motor 60, and is also capable of moving up and down by a rinsing liquid discharge nozzle raising / lowering unit 61 having an air cylinder therein. It is. This prevents the rinsing liquid discharge nozzle 65 from retreating from above the substrate W and interfering with the slit nozzle 30 except during rinsing liquid discharge. The raising and lowering mechanism of the rinsing liquid discharge nozzle raising and lowering section 61 is not limited to an air cylinder, and a known raising and lowering mechanism such as an actuator can be applied.

The control section 80 manages the operation of each processing section of the substrate developing apparatus 100. The control unit 80 is electrically connected to the motor 23 of the horizontal moving mechanism 20, the motor 41 of the elevating mechanism 40, and the nozzle support member 45, and the horizontal moving mechanism 20, the elevating mechanism 40, and the nozzle tilt correcting mechanism 70 Control.

As described above, it is often difficult to keep the distance between the substrate W and the slit nozzle 30 constant due to the assembly accuracy of the apparatus or the substrate holding accuracy. In the substrate developing device 100 of the present embodiment, since the slit nozzle 30 having at least the length of the diameter of the substrate W is moved in the X-axis direction, the longitudinal direction (Y-axis direction) of the slit nozzle 30 and the slit nozzle 30 Direction of movement (X
(In the axial direction), the gap between the slit nozzle 30 and the substrate W may not be constant. Therefore, the substrate developing device 100 is provided with an adjustment mechanism that keeps the distance between the slit nozzle 30 and the substrate W constant in each of the longitudinal direction and the moving direction. Hereinafter, these will be described.

<B. Adjustment Mechanism in Slit Nozzle Movement Direction> First, an adjustment mechanism for keeping a constant distance from the substrate W in the movement direction of the slit nozzle 30 will be described.

As described above, the horizontal movement mechanism 20 moves the slit nozzle 30 in the X-axis direction (the slit nozzle 3).
0 (in the direction perpendicular to the longitudinal direction). Here, the horizontal moving mechanism 20 includes a motor 23, a pulley 22
a, 22b and the belt 21. A pulley 22b is connected to a motor shaft of the motor 23, and a belt 21 is hung on the pulleys 22a and 22b.
That is, the belt 21 is configured to circulate and rotate with the rotation of the motor 23.

The belt 21 and the motor 41 of the lifting mechanism 40 are connected by the locking member 24. Therefore, with the forward or reverse rotation of the motor 23, the motor 41 moves forward or backward in the X-axis direction, and as a result, the slit nozzle 30 provided on the upper part of the elevating mechanism 40 becomes (+ X) or (-X). It will move in the direction.

Here, when the substrate W is not held strictly in the horizontal position on the turntable 11 or when the movement of the slit nozzle 30 by the horizontal moving mechanism 20 is not strictly moved in the horizontal direction, the slit nozzle 30 In the moving direction, the distance between the slit nozzle 30 and the substrate W is not maintained constant.

Therefore, in the substrate developing apparatus 100, the distance between the slit nozzle 30 and the substrate W in the moving direction of the slit nozzle 30 is adjusted by the sensor 31 and the elevating mechanism 40 so as to be constant.

The sensor 31 is fixed to the slit nozzle 30 and is a detection device for measuring the distance between the sensor 31 and the substrate W. As shown in FIG. 1 and FIG.
Numeral 1 is provided in front of the slit nozzle 30 in the traveling direction (+ X direction) of the slit nozzle 30 when the developer is filled. In addition, as a form of the sensor 31,
All known techniques, such as a detection device using reflected light from the substrate W, can be applied.

The elevating mechanism 40 comprises a motor 41, a coupling 43, and a ball screw 44. Motor 4
1 is rotated by a ball screw 44 via a coupling 43.
Is transmitted to The ball screw 44 has a nozzle support member 45.
Is screwed. Therefore, the nozzle support member 45 and the slit nozzle 30 are raised and lowered in the vertical direction by the forward or reverse rotation of the motor 41. Note that the coupling 43 is a member for protecting the motor 41 by absorbing the axial displacement between the motor shaft 42 of the motor 41 and the ball screw 44.

When the developer is filled, the sensor 31
Nozzle 30 having a predetermined distance between the substrate and the substrate W
Control unit 8 so as to have a value corresponding to the distance between
0 controls the elevating mechanism 40 to move the slit nozzle 30 up and down. That is, the distance between the slit nozzle 30 and the substrate W is measured by the sensor 31 while the slit nozzle 30 is moved, and the lifting mechanism 40 is feedback-controlled based on the measurement result, and the trajectory caused by the movement of the slit nozzle 30 in the X-axis direction. The vertical position of the slit nozzle 30 is adjusted so that the substrate and the substrate W are parallel to each other.

The reason why the sensor 31 is disposed in front of the slit nozzle 30 is to facilitate feedback control. However, the position of the sensor 31 is not limited to the position in front of the slit nozzle 30 but may be in the rear. You may. In this case, the slit nozzle 3 is used without filling the developer.
0, the distance between the slit nozzle 30 and the substrate W is measured, and the slit nozzle 30
The control may be performed by obtaining the movement locus in the X-axis direction by calculation in advance.

<C. Adjusting Mechanism in the Longitudinal Direction of Slit Nozzle> Next, an adjusting mechanism for keeping a constant distance from the substrate W in the longitudinal direction of the slit nozzle 30 will be described. This adjustment is performed by the two sensors 32a and 32b and the nozzle inclination correcting mechanism 70.

FIG. 3 is a view for explaining an example of the nozzle inclination correcting mechanism 70 of the substrate developing apparatus 100. In the nozzle inclination correcting mechanism 70, the slit nozzle 30 is rotatably supported on a fulcrum 71 fixed to the nozzle support member 45 as an axis. Two motors 72a and 72b capable of exerting a mechanical action on both sides of the fulcrum 71 in the longitudinal direction of the slit nozzle 30 are provided. 2
The two motors 72a and 72b are controlled by the control unit 80 and cooperate to tilt the slit nozzle 30 by pushing and pulling the slit nozzle 30 in the vertical direction. Note that the two motors 72a and 72b may be cylinders, actuators, or the like.

The slit nozzle 30 is provided with two sensors 32a and 32b in the longitudinal direction.
The two sensors 32a and 32b are detection devices that measure the distance between the sensors and the substrate W. Based on the measurement results of the two sensors, the relative distance between the slit nozzle 30 and the substrate W in the longitudinal direction of the slit nozzle 30 is determined. The angle can be detected. Note that, as the form of the sensors 32a and 32b, all known technologies such as a detection device using reflected light from the substrate W can be applied as in the case of the sensor 31.

When the developer is filled, the controller 80 controls the nozzle inclination correcting mechanism 70 so that the distance between the two sensors 32a and 32b and the substrate W becomes equal.
The inclination of the slit nozzle 30 is adjusted. That is, the distance between the slit nozzle 30 and the substrate W at a plurality of positions along the longitudinal direction of the slit nozzle 30 is determined by the sensor 32a,
32b, the control unit 80 controls the nozzle inclination correcting mechanism 70 based on the measurement result, and the slit nozzle 30 and the substrate W in the longitudinal direction of the slit nozzle 30.
And the inclination of the slit nozzle 30 is adjusted so that is parallel.

Next, another example of the nozzle inclination correcting mechanism 70 will be described. FIG. 4 is a diagram illustrating another example of the nozzle inclination correcting mechanism 70 of the substrate developing device 100.

The nozzle tilt correcting mechanism 70 differs from the example of FIG. 3 in that the fulcrum 71 is directly used as the rotation axis of the motor 73, and the rotation of the motor 73 is the rotation operation of the slit nozzle 30 as it is. It is. The motor 73 is also controlled by the control unit 80, and the inclination of the slit nozzle 30 is adjusted based on the measurement results by the sensors 32a and 32b so that the slit nozzle 30 and the substrate W are parallel in the longitudinal direction of the slit nozzle 30. Is done.

In the examples shown in FIGS. 3 and 4, automatic control is performed based on the measurement results of the sensors 32a and 32b. However, the inclination of the slit nozzle 30 can be adjusted manually. FIG. 5 is a diagram illustrating another example of the nozzle inclination correcting mechanism 70 of the substrate developing device 100.

In the example of FIG. 5, the slit nozzle 30
Are rotatably supported on a fulcrum 71 as an axis. The two screws 75 a and 75 b are screwed into the nozzle support member 45, and the tips of the screws 75 a and 75 b abut on both sides of the fulcrum 71 in the longitudinal direction of the slit nozzle 30. Accordingly, the slit nozzle 30 can be adjusted to a desired inclination by rotating the two screws 75a and 75b and moving the same vertically.

When the inclination of the slit nozzle 30 is adjusted by the nozzle inclination correcting mechanism 70 shown in FIG.
A jig having a parallel surface may be placed on the main surface of the jig, and the two screws 75a and 75b may be adjusted so that the slit nozzle 30 contacts the jig surface with a line.

<D. Summary of Operation of Slit Nozzle> As described above, in the substrate developing apparatus 100 which is an embodiment of the substrate processing apparatus according to the present invention, the nozzle inclination correcting mechanism 70 and the elevating mechanism 40 are controlled to control the longitudinal direction of the slit nozzle 30. The distance from the substrate W is kept constant in each of the moving directions. In other words, when the developer is loaded on the substrate W by the slit nozzle 30,
While adjusting the inclination and vertical position of the slit nozzle 30 so that the surface of the trajectory of the developer supply port 35 drawn by the movement of the slit nozzle 30 is parallel to the main surface of the substrate W, the substrate from the developer supply port 35 is adjusted. The developer is supplied to W.

Therefore, the liquid pressure of the developing solution supplied from the slit nozzle 30 to the substrate W becomes uniform in the plane of the substrate W, and as a result, a uniform development processing result can be obtained in the plane of the substrate W.

Even when a plurality of substrates W are sequentially processed, the distance between the slit nozzle 30 and the substrate W is constant for each of the substrates W to be processed. Can also be obtained.

<E. Modifications> Although the embodiment of the present invention has been described above, the present invention is not limited to the above example, and the surface of the locus of the developer supply port 35 drawn by the movement of the slit nozzle 30 is Any form can be used as long as the inclination and the vertical position of the slit nozzle 30 can be adjusted so as to be parallel to the main surface of.

For example, in the nozzle inclination correcting mechanism 70 shown in FIG. 4, the fulcrum 71 is directly used as the rotation axis of the motor 73, but the rotation may be transmitted to the fulcrum 71 via a belt or the like. Good.

The nozzle inclination correcting mechanism 70 shown in FIG. 5 is not limited to the method using a jig, but the slit nozzle 30 is provided with a sensor similar to that shown in FIGS. While checking the result, the inclination of the slit nozzle 30 may be manually adjusted so that the slit nozzle 30 and the substrate W are parallel to each other.

Further, in the above embodiment, the substrate developing apparatus using a developing solution as the processing liquid has been described. However, the substrate processing apparatus according to the present invention is not limited to the substrate developing apparatus. The present invention is applicable to any substrate processing apparatus that performs a surface treatment on a substrate.

[0055]

As described above, according to the first, fifth, sixth and seventh aspects of the present invention, the trajectory of the processing liquid supply port drawn by the movement of the moving means is the main surface of the substrate. Since the distance between the processing liquid supply unit and the substrate is adjusted so as to be parallel to the processing liquid pressure of the processing liquid supplied to the substrate from the processing liquid supply unit becomes uniform in the plane of the substrate,
As a result, a uniform processing result can be obtained in the plane of the substrate. Further, even when a plurality of substrates are sequentially processed, since the distance between the processing liquid supply unit and the substrates is constant for each of the substrates to be processed, uniformity of the processing results between the processed substrates is also obtained. be able to.

Further, claims 2, 3 and 4
According to the invention, since the distance between the processing liquid supply means and the substrate is adjusted based on the result of the detection by the distance detection means, in addition to the above effects, the distance can be automatically adjusted, Processing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a front view showing a schematic configuration of a substrate developing apparatus which is an embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a plan view illustrating the substrate developing device of FIG.

3 is a diagram illustrating an example of a nozzle inclination correcting mechanism of the substrate developing device of FIG.

FIG. 4 is a diagram illustrating another example of a nozzle inclination correcting mechanism of the substrate developing device of FIG.

FIG. 5 is a view for explaining another example of the nozzle inclination correcting mechanism of the substrate developing device of FIG. 1;

[Explanation of symbols]

 Reference Signs List 20 horizontal movement mechanism 30 slit nozzle 31, 32a, 32b sensor 35 developer supply port 40 elevating mechanism 70 nozzle inclination correcting mechanism 80 control unit W substrate

Claims (7)

[Claims] 1. A substrate processing apparatus for performing a predetermined processing by applying a processing liquid to a substrate, comprising: (a) holding means for holding the substrate in a substantially horizontal posture; and (b) a diameter equal to or larger than the diameter of the substrate. A processing liquid supply port for supplying the processing liquid to the substrate, and (c) the processing liquid supply means in a substantially horizontal direction and a longitudinal direction of the processing liquid supply means. (D) the processing liquid supply means and the substrate so that the trajectory of the processing liquid supply port drawn by the movement by the movement means is parallel to the main surface of the substrate. And a distance adjusting means for adjusting the distance between the substrates. 2. The substrate processing apparatus according to claim 1, further comprising: (e) interval detecting means for detecting an interval between said processing liquid supply means and said substrate, wherein said interval adjusting means is said interval detecting means. A substrate processing apparatus that adjusts an interval between the processing liquid supply unit and the substrate based on a result of the detection by the method. 3. The substrate processing apparatus according to claim 2, wherein the distance detecting means detects a distance between the processing liquid supply means and the substrate at a position along the longitudinal direction of the processing liquid supply means. Direction interval detecting means, wherein the interval adjusting means tilts the processing liquid supply means so that the processing liquid supply means and the main surface of the substrate are parallel to each other in the longitudinal direction of the processing liquid supply means. A substrate processing apparatus, comprising: a tilt adjusting means for adjusting. 4. The substrate processing apparatus according to claim 2, wherein the distance detecting means detects the distance between the processing liquid supply means and the substrate while moving the processing liquid supply means by the moving means. A direction interval detecting unit, wherein the interval adjusting unit performs the processing so that a trajectory of the processing liquid supply unit due to the movement and a main surface of the substrate are parallel to each other in the direction of the movement of the processing liquid supply unit. A substrate processing apparatus comprising: elevating means for elevating and lowering a liquid supply means in a vertical direction. 5. A substrate processing method for performing a predetermined processing by applying a processing liquid to a substrate, comprising: (a) a holding step of holding the substrate in a substantially horizontal posture; and (b) a diameter equal to or greater than the diameter of the substrate. A processing liquid supply step of supplying the processing liquid to the substrate from a processing liquid supply unit having a processing liquid supply port having a length of: c) an interval detection step of detecting an interval between the processing liquid supply unit and the substrate (D) a movement step of moving the processing liquid supply means in a substantially horizontal direction and a direction perpendicular to the longitudinal direction of the processing liquid supply means; and (e) supplying the processing liquid based on the result of the detection. A substrate processing method, comprising: an interval adjusting step of adjusting an interval between the processing liquid supply unit and the substrate such that a locus of the opening due to the movement of the opening is parallel to a main surface of the substrate. 6. The substrate processing method according to claim 5, wherein the interval detecting step detects an interval between the processing liquid supply unit and the substrate at a position along the longitudinal direction of the processing liquid supply unit. A step of detecting the longitudinal direction of the processing liquid, wherein the step of adjusting the distance of the processing liquid supply means is such that the processing liquid supply means and the main surface of the substrate are parallel to each other in the longitudinal direction of the processing liquid supply means. A substrate adjusting method including an inclination adjusting step of adjusting an inclination. 7. The substrate processing method according to claim 5, wherein the interval detecting step detects an interval between the processing liquid supply unit and the substrate while moving the processing liquid supply unit in the moving step. A moving direction interval detecting step, wherein the interval adjusting step is such that a locus of the processing liquid supply unit due to the movement and a main surface of the substrate are parallel in the moving direction of the processing liquid supply unit. A substrate processing apparatus, comprising: an elevating step of elevating and lowering the processing liquid supply means in a vertical direction.