JPH1163550A - Electronic cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To heat air above a target object and prevent the surface of the target object from generating dew by a method wherein the target object to be cooled is placed on the upper surface of a cooling plate, an electronic cooling element is connected to the lower surface of the cooling plate, the thermal radiation fins are connected to the thermal radiation surface of the element and the thermal radiation part connected to the thermal radiation fins is positioned above the target object. SOLUTION: A cooling plate 5 on which upper surface is placed a case 15 for storing an object 17 to be cooled is cooled by a cooling surface of an electronic cooling element 1 connected to the lower surface of it. Thermal radiation fins 6 are connected to a thermal radiation surface of the electronic cooling element 1 and a thermal radiation section 14 of a heat transfer member 10 is connected to the thermal radiation fins 6. The thermal radiation section 14 is formed by a heat generating net and heat attained from the thermal radiation surface of the element 1 is transferred through a base plate 7 of the thermal radiation fins 6 and the lower part of the heat transfer member 10. In addition, the thermal radiation section 14 is positioned above the object 17 to heat air above the object 17. Due to this fact, a surface temperature of the object 17 contacted with the heated air is increased and its relative humidity is decreased, so that no dew is formed at the surface of the object.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic cooling device for preventing dew condensation on an object to be cooled, and more particularly to an electronic cooling device suitable for cooling a chemical analysis solution such as a solution or a test solution.

[0002]

2. Description of the Related Art Generally, when cooling various objects to be cooled,
Naturally, the object to be cooled has a lower temperature than the ambient temperature. However, in this case, the amount of dew condensation differs depending on the temperature difference, relative humidity, etc. at the part of the cooling object that is in contact with the humid air.
Condensation is common.

[0003]

When the object to be cooled is a chemical analysis solution such as a solution or a test solution, the solution is contained in a bottle, and the mouth of the bottle is closed with a rubber or other flexible stopper. When the liquid is poured, a syringe needle is inserted into the stopper to suck out the liquid inside.

At this time, if there is dew water on the surface of the stopper, accurate analysis cannot be performed because the dew water adheres to the injection needle when the injection needle is inserted and withdrawn when the liquid in the bottle is sucked out. There is a point.

[0005] The present invention is concerned with the above-mentioned points, and relates to an electronic cooling device for preventing dew condensation on the surface of an object to be cooled.

[0006]

In order to solve the above-mentioned problems, an electronic cooling device according to the present invention comprises a cooling plate on which an object to be cooled is placed on an upper surface, and a cooling surface on a lower surface of the cooling plate. An electronic cooling element, which is electrically joined, a radiating fin, which is joined to a radiating surface of the electronic cooling element, and a radiating part, which is thermally conductively joined to the radiating fin, and a radiating portion is located at a position above the object to be cooled. And a heat transfer body that heats the air above the object to be cooled.

Therefore, the cooling plate on which the object to be cooled is placed is cooled by the cooling surface of the electronic cooling element, and the heat dissipating portion of the heat transfer body joined to the heat dissipating fin joined to the heat dissipating surface of the electronic cooling element has: Since the air above the object to be cooled is heated, the temperature of the surface of the object to be cooled in contact with the heated air rises, the relative humidity decreases, and the condensation on the surface of the object to be cooled is prevented.

[0008]

FIG. 1 is a front view, FIG. 2 is a side view, FIG. 3 is a sectional front view of a cooling object storage case, FIG. 4 is a sectional side view thereof, and FIG. This will be described with reference to FIG.

1 is an electronic cooling element having a Peltier effect,
2 is a heat transfer spacer joined to the cooling surface on the upper surface of the element 1,
Reference numeral 3 denotes a thick rectangular plate-shaped heat insulating material, in which the element 1 and the heat transfer spacer 2 are embedded on both sides of the heat insulating material 3, respectively, and the upper surface of the heat transfer spacer 2 forms the same plane as the upper surface of the heat insulating material 3. ,
The heat radiating surface of the element 1 forms the same plane as the lower surface of the heat insulating material 3. Reference numeral 4 denotes a frame formed integrally with the peripheral portion of the upper surface of the heat insulating material 3.

Reference numeral 5 denotes a rectangular cooling plate fitted into the frame portion 4 and pressed against the upper surface of the heat insulating material 3, and is thermally conductively connected to the cooling surface of the element 1 via the heat transfer spacer 2. .

Reference numeral 6 denotes a radiating fin in which the upper substrate 7 is joined to the lower surface of the heat insulating material 3 and to the radiating surface of the element 1, and 8 denotes a radiating fin provided on the lower surface of the radiating fin 6.
To blow.

Reference numeral 9 denotes a recess formed on the upper surface on both sides of the substrate 7 of the heat radiation fin 6, reference numeral 10 denotes a plate-like heat transfer member provided on both sides, and a lower inwardly bent piece 11 corresponds to the recess 9 Located in
The bent piece 11 is fixed to the substrate 7 by a flat screw (not shown), and the heat transfer body 10 is led upward from both side surfaces of the heat insulating material 3. Reference numerals 12 and 13 denote heat insulating plates affixed to the outer and inner surfaces of the lower portion of the heat transfer body 10, and reference numeral 14 denotes a heat radiating portion formed of a heat generating net formed on the upper portion of the heat transfer body 10. Heat is transferred through the substrate 7 of the heat radiation fin 6 and the lower part of the heat transfer body 10.

Reference numeral 15 denotes a box-shaped storage case for the object to be cooled having an open upper surface, and 16 denotes a heat insulating plate adhered to a peripheral surface of the case 15, and the object to be cooled 17, for example, the chemical analysis solution is placed in the case 15. A large number of bottles, which are accommodated and closed by a flexible stopper, are accommodated in an upright state, a case 15 is placed on the upper surface of the cooling plate 5, and the heat radiating portion 14 is
7 and heats air above the object 17 to be cooled.

That is, the air A outside the radiator 14 is shown in FIG.
When the air A flows in the direction of the arrow, the air A is heated by the heat radiating portion 14 and flows above the cooling
The temperature of the upper surface of the upper surface 7 rises, as shown in FIG. 5, the relative humidity of the upper surface is reduced, and dew condensation on the upper surface is prevented.

Since the temperature of the air above the object to be cooled 17 is increased by utilizing the heat generated by the electronic cooling element 1,
It does not require a separate heat source and can be configured inexpensively.

The shape of the heat transfer body 10 can be selected at an effective position according to the flow of air.

[0017]

Since the present invention is configured as described above, it has the following effects. The cooling plate 5 on which the cooling object 17 is placed is cooled by the cooling surface of the electronic cooling element 1, and the heat dissipating part 14 of the heat transfer body 10 joined to the heat dissipating fin 6 joined to the heat dissipating surface of the electronic cooling element 1. However, since the air above the cooling object 17 is heated, the temperature of the surface of the cooling object 17 that is in contact with the heated air rises, the relative humidity decreases, and the condensation on the surface of the cooling object 17 is prevented. In particular, it has a remarkable effect on cooling a chemical analysis solution such as a solution or a test solution.

[Brief description of the drawings]

FIG. 1 is a front view of one embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a cutaway front view of the cooling object storage case of FIG. 1;

FIG. 4 is a cut-away side view of FIG. 3;

FIG. 5 is a relationship diagram between temperature and relative humidity.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic cooling element 5 Cooling plate 6 Heat dissipation fin 10 Heat transfer body 14 Heat dissipation part 17 Cooling object

Claims (1)

[Claims] A cooling plate having an upper surface on which an object to be cooled is placed; an electronic cooling device having a cooling surface thermally conductively bonded to a lower surface of the cooling plate; and a cooling surface bonded to a heat radiation surface of the electronic cooling device. A radiating fin, and a radiator that is thermally conductively connected to the radiating fin, wherein a radiating portion is located above the object to be cooled and heats the air above the object to be cooled. Electronic cooling device.