JPH1161192A - Composition for removing polymer deposit and removal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composition for removing a polymer deposit, having no problem of toxicity and inflammability, capable of efficiently separating and removing the polymer deposit in a short time, by adding a fixed amount of water to a water-soluble organic compound capable of swelling a polymer deposit attached to the surface of a material to be attached and completely mixing. SOLUTION: This composition is obtained by mixing (A) preferably 40-95 wt.% of a water-soluble organic compound such as ethylene glycol dimthyl ether capable of swelling a polymer deposit attached to the surface of a material to be attached with (B) water in such a ratio in a range as to give the composition which swells the polymer deposit without dissolving and has no inflammability. The composition is preferably prepared by mixing an organic compound (e.g. diisopropyl ketone) which can swell the polymer deposit attached to the surface of a material to be attached and has no complete miscibility with water with a surfactant (e.g. sodium laurate) and water in such a ratio in a range as to give the composition which is capable of swelling the polymer deposit without dissolving and has no inflammability followed by complete mixing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polymer adhering substance removing composition for separating and removing polymer adhering substances such as various synthetic resins adhering to the surface of a hard substrate such as metal and glass, and a composition for removing the same. The present invention relates to a method for removing polymer deposits used.

[0002]

2. Description of the Related Art A vinyl chloride resin film is formed on the surface of an organic photoconductor (OPC) drum for a copying machine or a printer having a photosensitive drum (organic photoconductor) layer formed on the surface of a metal drum or a metal plate. A resin layer (such as a tubular, tubular, linear, or plate-shaped hard substrate made of a hard material such as metal or glass, such as a polymer-coated decorative plate such as a formed PVC steel plate (vinyl chloride resin-coated steel plate). Separation and removal of polymer deposits from various resin-coated members on which polymer deposits are formed, or adherends on which polymer deposits such as hard substrates with resinous substances such as dirt components adhered to the surface One of the methods is to dissolve and remove it with a solvent. Halogen solvents such as methylene chloride, chloroform, and chlorofluorocarbon are widely used as solvents for removing these polymer deposits, and acetone and N, N-dimethylformamide (DMF) are also used. I have.

[0003]

In the method of dissolving and removing polymer deposits using these solvents, since the removed deposits dissolve in the solvent, the performance of the solvent gradually decreases. As it goes, the dissolved deposits may reattach. Further, the halogen-based solvent has a bad influence on the environment and does not meet the purpose of recycling. Furthermore, organic solvents, such as acetone and DMF, that have a dissolving effect on polymer deposits are generally flammable even at around room temperature, require careful handling, and may cause poisoning when inhaling steam. There was a problem of work safety. The present invention has been made in view of the circumstances of the prior art described above, and a polymer adhering substance removing composition that can efficiently separate and remove polymer adhering substances in a short time and has no toxicity or flammability problems and uses the same. It is an object of the present invention to provide a method for removing polymer deposits.

[0004]

The present invention adopts the following constitutions (1) to (7) as means for solving the above-mentioned problems. (1) A composition which is capable of swelling without dissolving the polymer deposit in a water-soluble organic compound (component A) capable of swelling the polymer deposit adhering to the adherend surface, and which is not flammable 1. A composition for removing polymer deposits, wherein water is added at a ratio within the range described below and thoroughly mixed.

(2) A surfactant (component C) is mixed with an organic compound (component B) capable of swelling polymer deposits adhering to the adherend surface and not being completely miscible with water. A polymer adhering substance removing composition characterized by being capable of swelling without dissolving the adhering substance, and adding water in a proportion within a range of a non-flammable composition and thoroughly mixing the same.

(3) An organic compound (component D) capable of swelling the polymer deposit attached to the surface of the adherend and having no complete miscibility with water does not cause the polymer deposit to swell and is completely mixed with water. A mixing aid (component E) comprising at least one of alcohols and glycol ethers having no mixing property and a surfactant (component C) can be mixed to swell without dissolving polymer deposits, A composition for removing polymer deposits, wherein water is added in a proportion within a range that results in a composition having no flammability and mixed thoroughly.

(4) An organic compound (component F) which is capable of swelling the polymer deposit adhering to the adherend surface and not being completely miscible with water is capable of swelling the polymer deposit and completely adsorbing water. A mixing aid (component G) and / or a surfactant (component C) comprising at least one kind of immiscible ketones and amides can be mixed to swell without dissolving polymer deposits, and A composition for removing polymer deposits, wherein water is added in a proportion within a range that results in a non-flammable composition, followed by complete mixing.

(5) A composition for removing polymer deposits, characterized by further adding a water-soluble acid (component H) to the composition of any one of the above (1) to (4). .

(6) The composition according to any one of the above (1) to (5) is brought into contact with the adherend to which the polymer adherent has adhered,
A method for removing polymer deposits, comprising swelling and separating and removing polymer deposits. (7) The adherend to which the polymer adherent is adhered is an organic photoconductor drum to which an organic photoconductor is adhered or a vinyl chloride composite material to which a vinyl chloride resin is adhered, wherein the adherend is an organic photoconductor. Alternatively, the method for removing polymer deposits according to the above (6), wherein the vinyl chloride resin is swollen and separated and removed.

The composition of the present invention comprises an organic compound (components A, B, and D) capable of swelling polymer deposits adhering to the adherend surface.
Or F) as a main component, to which water is added and mixed completely. The purpose of mixing with water is to suppress the dissolving power and express only the swelling property, to have no flammability even at a processing temperature of about 60 to 100 ° C., to facilitate washing with water and to improve workability. And so on. When the organic compound capable of swelling the polymer deposit as the main component is not completely mixed with water, it can be completely mixed by adding a surfactant or a suitable mixing aid and a surfactant. When the polymer deposit contains a specific component, addition of a small amount of acid is effective. The term "complete mixing" as used herein means that it is completely mixed with water and does not separate from water even at the processing temperature described above, and includes not only mutual dissolution but also an emulsion state. In addition, that it has complete mixing with water means that it can be completely mixed with water at an arbitrary ratio.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The composition of the above (1) is obtained by adding water to component A and mixing it completely. The amount of water to be added varies depending on the type of the component A, the type of the polymer deposit, and the like. However, according to the respective conditions, the composition can swell without dissolving the polymer deposit and has no flammability. The amount is within the range. Usually, the concentration of the component A is 40 to 95.
% By weight.

The component A is preferably an ester, ketone, ether or amide compound which has no flammability at around normal temperature, has a boiling point of 100 ° C. or more and can swell polymer deposits. Alternatively, it is used as a mixture of two or more. Specific examples of the component A include the following compounds. (Especially preferred) ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, acetylacetone (preferred) ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate,
Ethylene glycol monobutyl ether acetate, ethylene glycol diethyl ether, diethylene glycol diethyl ether (other than those usable above) diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether,
Ethylene glycol monoethyl ether

No flammability at normal temperature and boiling point of 100
Even when the temperature is increased by mixing water with an organic compound having a temperature of ℃ or more, the vapor pressure of water rises more than the vapor pressure of the organic compound on the liquid surface, which can be flammable. Absent. In this composition, the effect of removing polymer deposits increases exponentially as the content of the component A increases. In addition, while the effect can be easily adjusted by changing the composition, the organic component penetrates into the polymer deposit and the composition changes during the repetition of the treatment, so that the composition may need to be adjusted.

The composition (2) is a composition in which a surfactant (component C) is added to the component B for imparting swelling property, and water is further added to the composition for complete mixing. The mixing ratio of components B, C and water differs depending on the type of each component, the type of polymer deposit, etc., but depending on the respective conditions, the polymer deposit can be swelled without dissolving, and The amount is in the range that results in a composition having no properties. As a rough guide, the component B is 10 to 60% by weight and the component C is 5 to 5% by weight in the composition.
20% and water range from 20-85%.

Component B is a compound containing an ester group, a carbonyl group, or an ether group which is not flammable at around normal temperature, swells polymer deposits, and is not completely miscible with water, and has a molecular weight of 200 or less. Are preferred. Here, the compound used as the component B does not mix completely with water by itself, but can be completely mixed with water by adding a surfactant. These compounds are used alone or as a mixture of two or more.

Specific examples of Component B include diisopropyl ketone, diethyl ketone, 1-pentanone, 2-pentanone, 1-hexanone, 2-hexanone, 3-hexanone, cyclohexanone, ethylene glycol monobutyl ether acetate, diisopropyl ether, Ethylene glycol acetate and the like can be mentioned.

Component C is a surfactant added for the purpose of allowing component B to be completely mixed with water. Specific examples include higher fatty acid metal salts (such as sodium laurate and sodium oleate) and alkylbenzene sulfones. Sodium acid, higher alcohol ester salt (lauryl sulfate sodium salt, etc.) anionic surfactant; quaternary ammonium salt type or amine salt type cationic surfactant; higher alcohol (lauryl alcohol, cetyl alcohol, coconut oil reduced alcohol, etc.) ), Alkyl (octyl, nonyl,
Nonionic surfactants such as dodecyl) phenol, alkylene oxide (ethylene oxide, propylene oxide, etc.) addition type (alkylene oxide alkylphenyl ether, alkylene oxide alkyl ether, etc.) or polyhydric alcohol ester type (sorbitan, sugar ester, etc.).

Component B can be completely mixed with water by adding a surfactant (component C). Thereby, even if it is heated to a processing temperature to be described later, it does not have flammability, and washing with water after the processing becomes easy.

The composition of the above (3) is obtained by mixing a mixing aid component E and a surfactant (component C) with a swelling-imparting component D, further adding water, and mixing them completely. It is. The mixing ratio of components D, E, C and water varies depending on the type of each component, the type of polymer deposit, etc., but depending on the respective conditions, the polymer deposit can be swollen without dissolving, In addition, the amount is in a range that results in a non-flammable composition. As a rough guide, component D is 5 to 20%, component E is 5 to 20%, and component C is 5 to 20% by weight in the composition.
20% and water is in the range of 40-85%.

As the component D, a compound containing an ester group, a carbonyl group, or an ether group which is not flammable at around normal temperature, swells polymer deposits, and is not completely miscible with water is preferable. These groups may be simultaneously contained therein. Desirably, in the case of a low-molecular compound having a molecular weight of 200 or less and generally having a similar structure, the effect is higher as the molecular weight is lower. Compounds having no hydroxyl group in the molecule are more effective. These compounds are used alone or as a mixture of two or more.

Specific examples of the component D include the following compounds. (Especially preferred) -n-butyl acetate, -n-propyl acetate, ethyl acetate, 2-oxohydrofuran, diisopropyl ketone, diethyl ketone, 1-pentanone, 2
-Pentanone, 1-hexanone, 2-hexanone, 3-
Hexanone, cyclohexanone (preferred) -n-butyl acrylate, isopropyl acetate, ethyl 3-oxobutanoate, amyl acetate, isobutyl acetate, dimethyl glutarate, butyl methoxyacetate, isoamyl acetate, dimethyl adipate, dimethyl adipate, diethyl carbonate, ethyl acetoacetate , Diethyl malonate, ethylene glycol monobutyl ether acetate (other than those usable above) -sec-butyl acetate,
Diisopropyl ether, ethylene glycol dimethacrylate, dimethyl malonate, ethylene glycol diacetate

As the component E, compounds of alcohols and glycol ethers which are not flammable at around normal temperature, do not dissolve and / or swell polymer deposits and are not completely miscible with water are preferred. Used alone or as a mixture of two or more. Specific examples of Component E include 1-butanol, 2-butanol, sec-butanol, tert-butanol, amyl alcohol, hexanol, cyclohexanol, n-decyl alcohol,
Polyethylene glycol, ethylene glycol monoisopropyl ether, 1-ethoxy-2-propanol,
Examples thereof include ethylene glycol mono-n-butyl ether and 3-methyl-3-methoxybutanol.

The component C is a surfactant added for the purpose of allowing the components D and E to be completely mixed with water, and specific examples are as described above.

Among the components D, those which are not completely mixed with water only by adding a surfactant (component C) can be completely mixed with water by adding a mixing aid (component E). Also,
Component D includes those which can be completely mixed with water only by adding a surfactant (Component C), but a mixing aid (Component E)
Is added, mixing becomes easier, and a stable composition is obtained. Thereby, even if it is heated to a processing temperature to be described later, it does not have flammability, and washing with water after the processing becomes easy. This composition is less affected by the mixing ratio of each component than the composition of the above (1), and can maintain a certain degree of processability. Even when the component E is a small amount of at least about 5%, a sufficient effect can be obtained. Demonstrate.

The composition of the above (4) is obtained by mixing a mixing aid component G and a surfactant (component C) with a swelling-imparting component F, further adding water, and mixing them completely. It is. The mixing ratio of components F, G, C and water is different depending on the type of each component, the type of polymer deposit, etc., but depending on the respective conditions, the polymer deposit can be swollen without dissolving, In addition, the amount is in a range that results in a non-flammable composition. As a rough guide, the component F is 5 to 20%, the component G is 5 to 30%, and the component C is 5 to 2% by weight in the composition.
0% and water ranges from 30-85%.

The component F in this composition is the same as the component D, and the same component C as a surfactant can be used. Component G is preferably a compound of ketones, ethers or amides which are not flammable at about normal temperature, are capable of swelling polymer deposits, and are not completely miscible with water. Used as a mixture of more than one species. Specific examples of the component G include the following compounds. (Especially preferred) acetylacetone, diisopropylketone, diethylketone, 1-pentanone, 2-pentanone, 1-hexanone, 2-hexanone, 3-hexanone, cyclohexanone, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether (preferred) Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate,
Ethylene glycol monobutyl ether (other than the above) Ethylene glycol diethyl ether, diethylene glycol diethyl ether, diisopropyl ether, ethylene glycol dimethacrylate, ethylene glycol diacetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, triethylene glycol monomethyl Ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether

In the above compounds, diisopropyl ketone, diethyl ketone, 1-pentanone, 2-pentanone, 1-hexanone, 2-hexanone, 3-hexanone, cyclohexanone, ethylene glycol monobutyl ether acetate, diisopropyl ether and ethylene glycol diacetate are , Component F.

Among the components F, those which are not completely mixed with water only by adding a surfactant (component C) can be completely mixed with water by adding a mixing aid (component G). Also,
Component F includes those which can be completely mixed with water only by adding a surfactant (component C), but a mixing aid (component G)
Is added, mixing becomes easier, and a stable composition is obtained. Thereby, even if it is heated to a processing temperature to be described later, it does not have flammability, and washing with water after the processing becomes easy. Since this composition uses the swellable component G as a mixing aid, the processability can be improved as compared with the composition (3). In addition, although there is little influence of the mixing ratio of each component and a certain degree of processability can be maintained, the effect of the mixing ratio is slightly larger than that of the composition (3).

The composition of the above (5) comprises the above (1) to
An acid (component H) is added to any of the compositions of (4). The addition of an acid is particularly effective when the polymer adhered to the adherend contains an adhesive component containing an ether bond or an ester bond such as an epoxy resin silicon-based binder. This is presumably because a small amount of acid hydrolyzes a part of the bond to promote exfoliation.

The acid used as component H may be either a strong acid or a weak acid. For example, as the strong acid, hydrochloric acid, sulfuric acid, nitric acid, trifluoroacetic acid, methanesulfonic acid, trifluoromethanesulfonic acid, phenylsulfonic acid and the like can be mentioned, and 0.0001 wt%, preferably 0.001 wt%.
%, The effect is exhibited. In addition, other than strong acids, for example, carboxylic acid such as citric acid, oxalic acid, tartaric acid, malonic acid, succinic acid, adipic acid, glutaric acid, and benzoic acid, phosphoric acid, boric acid, etc. in an amount of 0.01 wt% or more, preferably, 0.1 wt% or more, particularly preferably,
It is desirable to add 0.5 wt% or more. If the amount of the acid added is too large, decomposition of the compounds used as the swellability-imparting component or the mixing aid or reaction with these compounds occurs, so the upper limit of the amount added is not too strong for the acidity, and the pH is not too strong.
The amount is 2 or more, preferably 3 or more. When the composition to which the acid is added is used for a long period of time, by using a compound containing no amide group, ester group, or carbonyl group as other A, B, D, E, F, and G components, Deterioration of the liquid (composition) can be suppressed.

The composition for removing polymer deposits of the present invention is brought into contact with the adherend by a method such as spraying on the adherend or dipping the adherend in the composition. The deposits swell and separate from the adherend and can be removed. The higher the processing temperature is, the shorter the processing time is. However, if the temperature is too high, there will be restrictions in terms of handling properties and equipment. Therefore, the temperature is preferably in the range of room temperature to 100 ° C, particularly 60 to 90 ° C.

The composition for removing polymer deposits and the method for removing polymer deposits using the same according to the present invention can be applied to a hard material such as a tube, tube, line, or plate made of a hard material such as metal or glass. It is suitable for separating and removing polymer deposits from various resin-coated members having a resin layer (polymer deposits) formed on the surface of a substrate, and in particular, a photoreceptor resin (organic photoconductor) coated on the surface. Separation of resin layer from organic photoconductor (OPC) drum for copiers and printers, recovery of polycarbonate part from compact disk boards, separation of acrylic resin from acrylic resin coated products, vinyl chloride resin layer on the surface Separation of PVC resin from PVC steel sheet or PVC coated wire
Suitable for recovery. Since the adherend after removing the polymer adherent by this method is not damaged at all,
It can be reused simply by performing a simple post-treatment such as washing with water. Further, the polymer adhering body separated by this method can be reused by drying under reduced pressure or the like depending on its component (for example, vinyl chloride) and then reshaping. In addition, this method not only separates and removes polymer deposits from various resin-coated members as described above, but also separates polymer deposits deposited on a hard base material in layers, such as removal of a coating film from a structure. Widely applicable to removal.

[0033]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited by these examples. (Example 1) Test on composition (1) of the present invention [Test Example 1-1: Type of component A] A steel sheet having a thickness of 0.1 mm was applied to the surface of a steel sheet.
Using a sample obtained by cutting a commercially available polyvinyl chloride steel sheet having a 5 mm vinyl chloride layer bonded thereto (epoxy adhesive) into a 30 cm square, a removal test was performed using the polymer adhering matter removing composition (1) of the present invention. Was. The test was as follows: component A: 80 wt%, water: 2
A composition obtained by changing the type of the component A at a composition of 0 wt% to 80 ° C.
The measurement was performed by immersing the sample in a solution heated to a predetermined temperature and measuring the time required until the sample was peeled off. Table 1 shows the results.

[0034]

[Table 1]

[Test Example 1-2: Effect of Concentration of Component A] Component A was triethylene glycol dimethyl ether.
Except that the concentration was changed, the same operation as in Test Example 1-1 was performed.
The time required for peeling was measured. Table 2 shows the results.

[0036]

[Table 2]

[Test Example 1-3: Kind of Component A] Diameter 30
A photosensitive drum (OPC drum) for copying, in which a photosensitive resin layer having a thickness of about 10 μm was formed on the surface of an aluminum drum having a length of 250 mm and a length of 250 mm, was prepared using a component A: 80 wt
%, Water: 20 wt%, and a composition in which the type of the component A was changed was immersed in a solution heated to 80 ° C., and the time required until the photosensitive resin layer was peeled was measured. Table 3 shows the results.

[0038]

[Table 3]

[Test Example 1-4: Effect of Concentration of Component A] Component A was triethylene glycol dimethyl ether.
The same operation as in Test Example 1-3 was carried out except that the concentration was changed,
The time required for peeling was measured. Table 4 shows the results.

[0040]

[Table 4]

(Example 2) Test on the composition (3) of the present invention [Test Example 2-1: Kinds of the component D] Using the same sample of the PVC steel sheet used in Example 1, A removal test was performed using the polymer adhering matter removing composition (3). In the test, component D: 15 wt%, component E (3-methyl-3-methoxybutanol): 15 wt%, component C (polyethylene oxide alkyl ether: 5 wt% + butyl oleate sulfide sodium salt: 15 wt%): 20 wt
%, Water: 50 wt%, and the composition obtained by changing the type of the component D was immersed in a solution heated to 80 ° C., and the time required for peeling was measured. The results are shown in Tables 5 and 6.

[0042]

[Table 5]

[0043]

[Table 6]

[Test Example 2-2: Kinds of Component E] The composition of the polymer adhering matter removing composition (3) of the present invention was composed of Component D (ethyl acetate): 15 wt%, Component E: 15 wt%, Component C
(Polyethylene oxide alkyl ether: 5 wt% +
Oleic acid butyl ester sulfide sodium salt: 15w
(t%): 20 wt%, water: 50 wt%, and the same operation as in Test Example 2-1 was carried out except that the type of the component E was changed, and the time required until peeling was measured. Table 7 shows the results.

[0045]

[Table 7]

[Test Example 2-3: Kinds of Component C] The composition of the polymer adhering substance removing composition (3) of the present invention was composed of a component D (ethyl acetate): 15 wt% and a component E (glycerol): 15
wt%, component C (C-1: 5 wt% + butyl oleate sulfide sodium salt: 15 wt%): 20 wt
%, Water: 50 wt%, and the operation was performed in the same manner as in Test Example 2-1 except that the type of C-1 was changed, and the time required for peeling was measured. Table 8 shows the results.

[0047]

[Table 8]

[Test Example 2-4: Influence of Composition Ratio 1] The component of the polymer deposit removing composition (3) of the present invention was Component D
(Ethyl acetate), component E (3-methoxy-3-methylbutanol), component C-1 (polyethylene oxide alkyl ether, component C-2 (butyl oleate sulfide sodium salt)), water, and the composition of each component The operation was performed in the same manner as in Test Example 2-1 except that the ratio was changed, and the time required until peeling was measured.

[0049]

[Table 9]

[Test Example 2-5: Effect of composition ratio 2] Component D
The operation was performed in the same manner as in Test Example 2-4, except that ethyl acetate was changed to 2-oxohydrofuran, and the time required for peeling was measured. Table 10 shows the results.

[0051]

[Table 10]

Test Example 2-6: Kinds of Component D Example 1
The same photoreceptor drum for copying (O
PC Drum), Component D: 15 wt%, Component E (3-methyl-3-methoxybutanol): 15 wt%, Component C
(Polyethylene oxide alkyl ether: 5 wt% +
Oleic acid butyl ester sulfide sodium salt: 15w
t%): 20 wt%, water: 50 wt%, and component D
The composition was changed into a solution heated to 80 ° C., and the time required until the photosensitive resin layer was peeled off was measured. Table 11 shows the results.

[0053]

[Table 11]

(Example 3) Test on the composition (4) of the present invention [Test Example 3-1: Kinds of the component G] Using the same PVC steel sheet sample as used in Example 1, A removal test was performed using the polymer deposit removing composition (4). The test was conducted with component F (ethyl acetate): 15 wt%, component G: 15 wt%
%, Component C (polyethylene oxide alkyl ether:
The sample was immersed in a solution obtained by heating a composition having a composition of 5 wt% + sodium butyl oleate sulfide sodium salt: 15 wt%): 20 wt% and water: 50 wt% and changing the type of the component G to 80 ° C. The measurement was performed by measuring the time required until peeling. The results are shown in Tables 12 and 13.

[0055]

[Table 12]

[0056]

[Table 13]

Test Example 3-2: Influence of Composition Ratio The composition of the polymer deposit removing composition (4) of the present invention was changed to Component F.
(Ethyl acetate), component G (acetylacetone), component C
(Polyethylene oxide alkyl ether: 5 wt% +
Oleic acid butyl ester sulfide sodium salt: 15w
(t%): 20 wt%, water, and the same operation as in Test Example 3-1 except that the composition ratio of component F, component G and water was changed, and the time required until peeling was measured. Table 14 shows the results.

[0058]

[Table 14]

Test Example 3-3: Kinds of Component G Example 1
The same photoreceptor drum for copying (O
PC Drum), Component F (ethyl acetate): 15 wt%,
Component G: 15 wt%, Component C (polyethylene oxide alkyl ether: 5 wt% + butyl oleate sulfide sodium salt: 15 wt%): 20 wt%, water:
A composition having a composition of 50 wt% and the type of the component G was changed to 8
It was immersed in a solution heated to 0 ° C., and the time required until the photosensitive resin layer was peeled off was measured. Table 15 shows the results.

[0060]

[Table 15]

Example 4 Test on Composition (5) of the Invention in Which Acid Was Added to Composition (1) [Test Example 4-1: Acid Concentration 1] Same as that used in Example 1 Using a sample of a PVC steel sheet, a removal test was performed using the polymer deposit removing composition (5) of the present invention. The test was conducted for component A (triethylene glycol dimethyl ether): 60
The test was carried out by immersing the sample in a solution obtained by adding hydrochloric acid to wt% and the remainder being water and heating the mixture to 80 ° C., and measuring the time required for peeling. Table 16 shows the results.

[0062]

[Table 16]

[Test Example 4-2: Acid Concentration 2] The same operation as in Test Example 4-1 was carried out except that citric acid was used instead of hydrochloric acid, and the time required for peeling was measured. Table 1 shows the results
FIG.

[0064]

[Table 17]

Test Example 4-3: Type of Acid The same operation as in Test Example 4-1 was carried out except that the type of acid to be added was changed, and the time required for peeling was measured. The results are shown in Table 18.

[0066]

[Table 18]

[Test Example 4-4: Acid Concentration 3] The same photoreceptor drum for copying (OP
Using a C drum), citric acid was added to the component A (triethylene glycol dimethyl ether): 60 wt%, and the remaining water was immersed in a solution heated to 80 ° C.
The time required for the photoconductor resin layer to separate was measured. The results are shown in Table 19.

[0068]

[Table 19]

Example 5 Test on Composition (5) of the Invention in Which Acid was Added to Composition (3) [Test Example 5-1: Acid Concentration 1] Same as that used in Example 1 Using a sample of a PVC steel sheet, a removal test was performed using the polymer deposit removing composition (5) of the present invention. The test was conducted with component D (ethylene glycol monobutyl ether acetate): 1
Hydrochloric acid was added to 0 wt%, component E (3-methyl-3-methoxybutanol): 15 wt%, component C (polyethylene oxide alkyl ether: 5 wt% + butyl oleate sodium sulfide: 15 wt%): 20 wt%, The test was carried out by immersing the sample in a liquid obtained by heating the composition with the remainder being water at 80 ° C., and measuring the time required until the sample was peeled off. The results are shown in Table 20.

[0070]

[Table 20]

Test Example 5-2: Acid Concentration 2 The same operation as in Test Example 5-1 was carried out except that citric acid was used instead of hydrochloric acid, and the time required for peeling was measured. Table 2 shows the results
It is shown in FIG.

[0072]

[Table 21]

Test Example 5-3: Kind of Acid The operation was performed in the same manner as in Test Example 5-1 except that the kind of acid to be added was changed, and the time required for peeling was measured. The results are shown in Table 22.

[0074]

[Table 22]

[Test Example 5-4: Acid Concentration 3] The same photoreceptor drum for copying (OP
C drum), component D (ethylene glycol monobutyl ether acetate): 10 wt%, component E (3-methyl-3-methoxybutanol): 15 wt%, component C
(Polyethylene oxide alkyl ether: 5 wt% +
Oleic acid butyl ester sulfide sodium salt: 15w
t%): A composition obtained by adding citric acid to 20 wt% and the remainder being water was immersed in a solution heated to 80 ° C., and the time required until the photosensitive resin layer was peeled was measured. The results are shown in Table 23.

[0076]

[Table 23]

Example 6 Test on Composition (5) of the Invention in Which Acid was Added to Composition (4) [Test Example 6-1: Acid Concentration 1] The same as that used in Example 1 Using a sample of a PVC steel sheet, a removal test was performed using the polymer deposit removing composition (5) of the present invention. The test was for component F (ethylene glycol monobutyl ether acetate): 7
Hydrochloric acid was added to 20% by weight of component G (ethylene glycol diethyl ether): 13% by weight, and component C (polyethylene oxide alkyl ether: 5% by weight + sodium butyl oleate sulfide sodium salt: 15% by weight), and the remainder was mixed with water. The test was carried out by immersing the sample in a solution heated to 80 ° C. and then measuring the time required for peeling. The results are shown in Table 24.

[0078]

[Table 24]

Test Example 6-2: Acid concentration 2 The same operation as in Test example 6-1 was carried out except that citric acid was used instead of hydrochloric acid, and the time required for peeling was measured. Table 2 shows the results
It is shown in FIG.

[0080]

[Table 25]

Test Example 6-3: Kind of Acid The operation was performed in the same manner as in Test Example 6-1 except that the kind of acid to be added was changed, and the time required for peeling was measured. The results are shown in Table 26.

[0082]

[Table 26]

Test Example 6-4: Acid Concentration 3 The same photoreceptor drum for copying (OP
Using a C drum), component F (ethylene glycol monobutyl ether acetate): 7 wt%, component G (ethylene glycol diethyl ether): 13 wt%, component C (polyethylene oxide alkyl ether: 5 wt% + butyl oleate sodium sulfide) Salt: 15wt
%): A composition in which citric acid was added to 20 wt% and the remainder was water was immersed in a solution heated to 80 ° C., and the time required until the photoconductor resin layer was peeled off was measured. The results are shown in Table 27.

[0084]

[Table 27]

[0085]

The composition for removing polymer deposits of the present invention comprises:
It is a composition that has excellent performance of removing polymer deposits adhering to the surface of the adherend, is nontoxic and inflammable, and has good miscibility with water, so that it is easy to clean after use. By using this composition, polymer deposits can be efficiently separated and removed in a short time, and there is no problem in handling such as toxicity and flammability. Further, since the adherend after separating and removing the polymer deposit is not damaged at all, it can be reused only by performing a simple post-treatment such as washing with water. Further, there is also an advantage that the separated polymer deposit can often be reused after removing the impregnated organic compound.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor ▲ Yoshi ▼ Tetsuo Oka 1-32-23 Kuwazu, Higashi-Sumiyoshi-ku, Osaka-shi, Osaka Inside Kentos Co., Ltd. (72) Inventor Hisai Fukai 1-35, Sugamo, Toshima-ku, Tokyo No. 8

Claims (7)

[Claims] 1. A polymer adhering substance adhered to an adherend surface can be swelled in a water-soluble organic compound (component A) capable of swelling without dissolving the polymer adhering substance, and is not flammable. A composition for removing polymer deposits, wherein water is added in a proportion within the range of the composition and the mixture is thoroughly mixed. 2. A surfactant (component C) is mixed with an organic compound (component B) which is capable of swelling polymer deposits adhering to an adherend surface and is not completely miscible with water. A polymer adhering substance removing composition characterized by being able to swell without dissolving a kimono and adding water in a proportion within a range that results in a non-flammable composition, followed by complete mixing. 3. An organic compound (component D) capable of swelling the polymer deposit attached to the surface of the adherend and not being completely miscible with water does not cause the polymer deposit to swell and is completely mixed with water. Alcohols and glycol ethers that have no reactivity
A mixture of a mixing aid (component E) and a surfactant (component C) composed of at least two or more species, which can be swelled without dissolving the polymer deposit and dissolving the composition, and the proportion of a range which is not flammable. A polymer adhering substance removing composition, wherein water is added thereto and mixed thoroughly. 4. An organic compound (component F) capable of swelling the polymer deposit attached to the surface of the adherend and having no complete mixing with water is capable of swelling the polymer deposit and completely mixing with the water. A mixing aid (component G) and / or a surfactant (component C) composed of at least one of non-soluble ketones and amides can be mixed to swell without dissolving polymer deposits, and are flammable A composition for removing polymer deposits, wherein water is added at a ratio within a range that results in a non-toxic composition, followed by complete mixing. 5. A composition for removing polymer deposits, wherein the composition according to claim 1 is further added with a water-soluble acid (component H). 6. The method according to claim 1, wherein the adherend to which the polymer is adhered is brought into contact with the composition according to claim 1 to swell and separate and remove the polymer. To remove high molecular deposits. 7. The adherend to which the polymer adherent is adhered is an organic photoconductor drum to which an organic photoconductor is adhered or a vinyl chloride composite material to which a vinyl chloride resin is adhered. 7. The method according to claim 6, wherein the conductor or the vinyl chloride resin is swollen and separated and removed.