JPH1154548A - Ic chip electrode connecting structure for non-contact tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a good electric connection and to produce the same effect as is the case with using a bump, by deforming a connecting member such that it is exposed to the surface of a chip-opposed electrode, and by connecting the exposed part of the connecting member of the chip-opposed electrode side to a chip electrode, a chip-opposed electrode and an electrode not-opposed to the chip. SOLUTION: An electrode 4c which is not opposed to a chip is made on the backside of a polyethylene telephthalate (PET) substrate 2 as a film-like insulating substrate. In this respect, a connecting member 6 made of metal resistant to activation is passed through a chip-opposed electrode 4a, the PET substrate and the electrode 4c which is not opposed to the chip, and is exposed to the surface of the chip-opposed electrode 4a. Further, an IC chip 1 is bonded with an adhesive 5 such that a chip electrode 3 is electrically connected to the upper surface of the exposed part 6d of the connecting member 6 of the chip-opposed electrode side. This may be modified within the spirit of the invention.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a non-contact ID (Iden
The present invention relates to an IC chip electrode connection structure in a non-contact tag suitable for electrical connection between a chip electrode of an IC chip and an electrode formed on a substrate at the time of manufacturing a tag.

[0002]

2. Description of the Related Art A non-contact ID tag is one of important elemental technologies as a distribution sorting device instead of a bar code.
By using this non-contact ID tag, it is possible to identify a tag hidden behind a baggage, which is difficult to identify with a barcode. This non-contact ID tag has a tag antenna that is excited by an externally applied AC magnetic field on a thermoplastic plastic substrate such as PET (polyethylene terephthalate), and a tag IC (Integr.
ated Circuit).

FIG. 8 is a block diagram showing a hardware configuration of a non-contact ID tag system. Referring to FIG.
The D tag will be described. Here, IC1 for tag
Numeral 01 denotes a microminiature microcomputer formed into a chip, a memory 101a for storing ID information, a transmission / reception circuit 101b for modulating and demodulating information for communication, and a microprocessor for performing processing such as information encryption and calculation. (Not shown).

[0004] The tag antenna 102 is a sheet-like coil formed on the front and back surfaces of the substrate. The tag antenna 102 generates an induced electromotive force by a radio wave received as a "receiving antenna", thereby converting the received radio wave into electric energy. do it,
The tag IC 101 built in the non-contact ID tag 100 is driven. That is, in the tag antenna 102, the coil is excited by an externally applied alternating magnetic field, and the tag IC 101 can be driven by using the excitation energy (induced voltage).
Further, the received radio wave information is passed to the tag IC 101.

Further, the tag antenna 102 transmits ID information stored in the tag IC 101 as a “transmission antenna” to the outside of the tag.
That is, since the tag ID 101 includes the memory 101a that stores the ID information and the transmission / reception circuit 101b that transmits the ID information to the outside as a wireless signal, even if the non-contact ID tag 100 is hidden behind a package, , The tag IC 101 is driven only by excitation, and ID information can be transmitted.

For reading an ID from the non-contact ID tag 100 or writing to the non-contact ID tag 100, a dedicated reader (READER) / writer (WRITER:
Writer) 200 is used. This reader / writer 200
Has a transmitting antenna 201 for performing non-contact power supply to the non-contact ID tag 100 and transmitting ID information to the non-contact ID tag 100, and a receiving antenna 202 for receiving an ID transmitted from the non-contact ID 100 tag. And a modulator 207 for modulating information for communication and an oscillator 2
05, an amplifier 206, a filter 203, and a demodulator 204 for demodulating received data. The reader / writer 200 is also connected to a host computer (not shown) that processes information obtained from the non-contact ID tag.

Here, the radio wave output from the transmission antenna 201 of the reader / writer 200 causes the tag antenna 1
02, an induced electromotive force is generated in the contactless ID tag 100
Is started, and the data of the tag IC 101 is returned from the tag antenna 102 to the reader / writer 200. Also,
The signal received by the reception antenna 202 of the reader / writer 200 is changed to reception data usable by the system via the filter 203 and the demodulator 204 and sent to a host computer (not shown). Writing to the tag IC 101 is enabled by modulating a radio wave generated from the reader / writer 200 by a modulator (not shown) on the non-contact ID tag 100 side.

With such a configuration, for example, in a luggage transportation / sorting system at an airport, a non-contact ID tag storing information such as a flight name and a destination on which luggage is loaded as ID information is attached to each luggage. It should be noted that, when sorting the luggage, the above-described I
D information can be received, and the trouble of identifying a tag hidden behind a baggage, such as a barcode, can be omitted.

Now, in manufacturing such a non-contact tag, it is important to obtain a reliable electric connection between the chip electrode portion of the IC chip and the electrode portion formed on the substrate. . By the way, in a general semiconductor product manufacturing technique, as a method of electrically connecting a chip electrode portion of an IC chip and an electrode portion formed on a substrate, a chip electrode portion of the IC chip or a printed circuit board is used. A protrusion called a bump is formed on the formed electrode portion, and the IC chip and the substrate are bonded by pressing or bonding with a conductive adhesive therebetween, thereby improving the biting between the electrodes and improving the conductivity. Methods for obtaining sex are known.

Here, as a known bump forming method, a ball is fixed to an electrode portion formed on the surface of a printed circuit board or a chip electrode portion of an IC chip by a ball bonding method, and then a ball neck is formed. A method of forming a bump by tearing a metal wire at a portion is known (see Japanese Patent Publication No. 4-41519). In addition, after bonding the ball to the electrode portion formed on the surface of the printed circuit board or the chip electrode portion of the IC chip by using a ball bonding method to form the bottom of the bump, a metal wire is looped over the ball. Then, the end of the metal wire is fixed on the input / output electrode pad and cut, so that the top of the inverted U-shaped bump made of the metal wire and having a uniform height is formed integrally with the bottom. A method is also known in which the tips of the balls fixed by the method are arranged at a uniform height and bumps projecting in two steps are formed (see Japanese Patent No. 250661).

[0011] In addition to the above-described method using wire bonding, as a method for forming a bump, a metal having good conductivity is deposited on an electrode through a stencil mask or the like, and the volume is increased, thereby forming a pyramidal shape. A method of forming a metal projection (i.e., a bump) is known. Further, a method is also known in which bumps are formed by forming irregularities on the silicon surface of an IC chip by anisotropic etching and depositing a metal having good conductivity on the surface of the irregularities.

After bumps are formed on the electrode portions formed on the surface of the printed circuit board or on the electrode portions of the IC chip by the above-described various methods, the bumps and the electrodes are arranged so as to be in contact with each other. After that, the IC chip and the substrate are bonded using a conductive adhesive or the like.
The material used for the electrode is that it is easy to form a film by plating or the like, and that an oxide film is relatively unlikely to be formed on the surface. Copper is often used because it can be easily joined.

A conventional example of a method of electrically connecting electrodes formed on the front and back surfaces of a printed circuit board will be described with reference to FIG. FIGS. 9A to 9D are side sectional views for explaining a conventional example of a method for electrically connecting electrodes formed on the front and back surfaces of a printed circuit board. There are two methods of electrically connecting the electrode portions 304 formed on the front and back surfaces of the printed circuit board 302 to each other: (1) a case where a hole portion 322 penetrating the front and back surfaces of the printed circuit board 302 is formed in the electrode portion 304; , (2)
The case where the electrode portion 304 does not have a hole penetrating the front and back surfaces of the printed circuit board 302 will be described.

(1) In the case where a hole penetrating the front and back surfaces of the printed board is formed in the electrode section (1-1) Method by vapor deposition FIG. A side showing a method of electrically connecting the electrode portions 304 formed on the front and back surfaces of the printed circuit board 302 by depositing a conductive metal on the printed circuit board 302 in which the holes 322 that penetrate the printed circuit board 302 are formed. FIG. 9A is a cross-sectional view. As shown in FIG. 9A, by depositing a conductive metal in a hole 322 formed in the electrode portion 304 of the printed circuit board 302, an evaporation droop 305 is formed on the inner wall of the hole 322. Is formed, and the vapor deposition is repeated while changing the angle, thereby connecting the vapor deposition droop 305 formed on the inner wall of the hole 322 to form on the front and back surfaces of the printed circuit board 302. By connecting the electrode portion 304 is to do the electrode portions 304 formed respectively on the front and back surfaces of the printed circuit board 302 to electrically connect.

(1-2) Plating Method FIG. 9 (b) shows a printed circuit board 302 in which a hole 322 penetrating the front and back surfaces of the printed circuit board 302 is formed in the electrode section 304. Metal plating 3
FIG. 9B is a side cross-sectional view showing a method of electrically connecting the electrode portions 304 formed on the front and back surfaces of the printed circuit board 302 by applying No. 08, respectively. As shown in FIG. The inner wall of the hole 322 formed in the electrode portion 304 is plated with a conductive metal, so that the plated portion 308 connects the electrode portions 304 formed on the front and back surfaces of the printed circuit board 302, and
The electrode portions 304 formed on the front and back surfaces of the second electrode 2 are electrically connected to each other.

(1-3) Method Using Rivets or Conductive Adhesive FIG. 9C shows a printed circuit board 302 in which a hole 322 penetrating the front and back surfaces of the printed circuit board 302 is formed in the electrode section 304. Rivets 310 made of conductive metal
FIG. 10 is a side sectional view showing a method of electrically connecting electrode portions 304 formed on the front and back surfaces of the printed circuit board 302 with each other, as shown in FIG. 9C. Hole 32 formed in 304
2, electrode portions 304 formed on the front and back surfaces of the printed circuit board 302 are connected by disposing a rivet 310 made of a conductive metal, a conductive adhesive, and the like. The electrode portions 304 are electrically connected to each other.

(2) In the case where a hole penetrating the front and back surfaces of the printed circuit board is not formed in the electrode portion. The following method is known as a conventional example for electrically connecting the electrode portions 304 formed on the back surface respectively. (2-1) Connection at Ends FIG. 9D shows electrode portions formed on the front and back surfaces of a printed circuit board 302 in which holes are not formed in the electrode portions. 304
FIG. 10 is a side cross-sectional view showing a method of electrically connecting the printed circuit boards to each other, as shown in FIG.
At the side edges of the printed circuit board 302, a conductive adhesive 320 or the like is provided so as to connect the electrode sections 304 formed on the front and back surfaces thereof. Is electrically connected.

(2-2) Forming a hole in the electrode portion As in the case of a long printed circuit board or the like, it is possible to dispose a conductive adhesive or the like at the side end as described above due to its shape or the like. If it is not possible, a hole is previously formed in the electrode portion by means such as laser or sand blast, and then the front and back surfaces of the printed circuit board are formed by the method described in (1-1) to (1-3) above. Are electrically connected to each other.

[0019]

However, in the above-described conventional method of connecting an IC chip electrode at the time of manufacturing a non-contact tag, good conduction between the electrode portion on the substrate and the chip electrode portion of the IC chip is required. In addition, bumps are formed on the electrode portion on the substrate and the chip electrode portion of the IC chip. In order to form the bumps, a process dedicated to bump formation must be provided, and the process is complicated. There is a problem that the cost is high.

Further, the conventional method of electrically connecting the electrodes formed on the front and back surfaces of the substrate is complicated, requires special equipment, and may cause uncertain conduction. Further, conventionally, copper used as a material of an electrode formed on a substrate is expensive, so that inexpensive aluminum must be used for cost reduction.
However, aluminum is easily activated to form an oxide on the surface, and aluminum oxide (Al ₂ O ₃ ), which is an oxide thereof, has a high insulating property.

For this reason, when aluminum is to be used as a material of an electrode, an aluminum oxide (Al ₂ O ₃ ) film formed on the surface of the electrode is required to obtain good electrical connection between the electrodes. There is a problem of how to break the membrane. For example, in a circuit such as an IC chip, when a metal such as aluminum which is easily activated and forms an oxide film having a high insulating property on a surface is used as a material of an electrode, the surface of the electrode is oxidized by ultrasonic waves or the like. A method of connecting while breaking the film is known, but such a method requires dedicated equipment, and is unsuitable when bonding opposing electrodes to each other. There is also.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of the above-described problems, and is directed to a chip electrode portion of an IC chip and a metal which is formed on a substrate and which easily forms an activated oxide film having a high insulating property on the surface. When electrically connecting to the electrode part consisting of
A good electrical connection can be obtained by breaking the oxide film formed on the electrode surface, and it is not necessary to previously form bumps on the chip electrode portion of the IC chip or the electrode portion on the substrate. An IC chip in a non-contact tag, which can obtain good electrical connection and can easily and surely electrically connect electrode portions formed on the front and back surfaces of a substrate. It is an object to provide an electrode connection structure.

[0023]

According to the first aspect of the present invention, there is provided an IC chip electrode connection structure in a non-contact tag according to the present invention, wherein an IC chip having a chip electrode portion and a metal foil pattern portion are formed on the front and back surfaces, respectively. In the non-contact tag comprising a film-shaped insulating substrate, the metal foil pattern portion of the film-shaped insulating substrate is connected to the chip electrode portion in opposition to the IC chip and activated and oxidized on the surface. A chip-facing electrode portion made of a metal that easily generates an object, and a chip non-aperture formed on a film-like insulating substrate surface opposite to the surface on which the chip-facing electrode portion is formed and facing the chip-facing electrode portion. The counter electrode portion is connected via a metal connection member that penetrates through the film-shaped insulating substrate and is hardly activated so that the connection member is exposed on the surface of the chip counter electrode portion. The chip electrode portion, the chip counter electrode portion, and the chip non-counter electrode portion are configured such that the chip counter electrode portion surface exposed portion of the connection member is electrically connected to the chip electrode portion. Are connected.

Further, in the IC chip electrode connection structure in the non-contact tag according to the present invention, an IC having a chip electrode portion is provided.
A film-like insulation formed with a chip and a metal foil pattern portion including a chip counter electrode portion made of a metal which is connected to the chip electrode portion in opposition to the IC chip and activated and easily generates an oxide on the surface. In a non-contact tag including a substrate, a metal connecting member that penetrates through the film-shaped insulating substrate and is hardly activated with respect to the chip-facing electrode portion of the film-shaped insulating substrate, The chip electrode portion and the chip counter electrode are attached so as to be exposed on the surface of the electrode portion so that the chip electrode portion surface exposed portion of the connection member is electrically connected to the chip electrode portion. And a connection section (claim 2).

Furthermore, in the IC chip electrode connection structure in the non-contact tag according to the first and second aspects, the connection member may be configured as a caulking member that penetrates the film-shaped insulating substrate and can be caulked at both ends. (Claim 3).
Furthermore, in the IC chip electrode connection structure in the non-contact tag according to claim 1 or 2, the metal foil pattern portion is configured as an aluminum foil pattern portion, and the connection member is configured as a copper or iron connection member. (Claim 4).

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an IC chip electrode connection structure in a non-contact tag according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram for explaining the present IC chip electrode connection structure. However, the procedure for connecting the IC chip electrodes will be schematically described with reference to FIG.

Now, PET as a film-like insulating substrate
(Polyethylene terephthalate) On the surface of the substrate 2,
By adhering a coil-shaped aluminum foil made of aluminum, which is a metal which is easily activated to generate an oxide on the surface, the sheet-shaped coil portion 4b (see FIG. 4B) and the chip counter electrode portion 4a are separated from each other. An aluminum foil coil (metal foil pattern portion) 4 is formed on the other hand. On the other hand, the back surface of the PET substrate 2 (the chip opposing electrode portion 4a on the PET substrate 2)
The aluminum foil coil (metal pattern portion) 4A composed of the sheet-like coil portion 4b (see FIG. 4B) and the chip non-opposing electrode portion 4c is formed on the surface where no is formed. In connecting the electrodes, first, the PET substrate 2 is placed with its surface (the surface of the PET substrate 2 on which the chip opposing electrode portion 4a is formed) facing upward.

When the chip non-facing electrode portion 4c is provided on the back surface of the PET substrate 2 as described above,
A connection member 6 made of a metal (for example, copper, iron, or the like) that is hardly activated is penetrated through the chip counter electrode portion 4a, the PET substrate 2, and the chip non-counter electrode portion 4c on the surface of the chip counter electrode portion 4a. The IC chip 1 is provided so as to be exposed, and furthermore, the IC chip 1 is brought into contact with (ie, electrically connected to) the chip electrode portion 3 on the upper surface of the chip counter electrode portion surface exposed portion 6d of the connection member 6. It is bonded by an adhesive 5 (see the right half of FIG. 1).

On the other hand, when the chip non-opposing electrode portion 4c is not provided on the back surface of the PET substrate 2, a metal (for example, copper) which is hardly activated so as to penetrate the chip opposing electrode portion 4a and the PET substrate 2 is provided. , Iron, etc.)
The chip electrode portion 3 is provided so as to be exposed on the surface of the chip counter electrode portion 4a, and further contacts the chip electrode portion 3 with the upper surface of the chip counter electrode portion surface exposed portion 6d of the connection member 6 (that is, is electrically connected). 1), the IC chip 1 is bonded by the adhesive 5 (see the left half of FIG. 1).

In the above embodiment, the size of the upper surface of the connection member 6 (that is, the exposed surface of the chip counter electrode portion) is determined when the chip non-counter electrode portion 4c is provided on the back surface of the PET substrate 2. Is smaller than the chip electrode portion 3 (see the right half of FIG. 1), and is larger than the chip electrode portion 3 when the chip non-opposing electrode portion 4c is not provided on the back surface of the PET substrate 2. However, the present invention is not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

The caulking member 6A as the connecting member 6 will be described with reference to FIG. FIG. 2 shows the caulking member 6.
FIG. 3 is a side cross-sectional view showing an example of the shape of A. As shown in FIG. 2, the caulking member 6A has a shaft portion 6a and a head portion 6b, and is configured so that both sides thereof can be caulked. I have. That is, the caulking member 6A is caulked at both ends (vertical direction in FIG. 2) after penetrating the PET substrate 2 by the shaft portion 6a, and the tip portion (lower portion in FIG. 2) of the shaft portion 6a is caulked. , As shown by the dashed line in FIG.
It can be deformed so as to be larger than the through hole formed in the PET substrate 2.

Further, the upper surface of the head 6b of the caulking member 6A is formed flat so as to be connected to the chip electrode portion 3 of the IC chip 1, and the head 6b is exposed to the chip opposing electrode portion surface exposed portion 6d. It is used as The contact surface 6c of the head 6b, which is in contact with the chip opposing electrode portion 4a, is provided with irregularities of ± several tens of μm. The caulking member 6A is rotated around the shaft portion 6a while rotating. By penetrating through the PET substrate 2 and crimping from above and below, the chip opposing electrode portion 4a and the uneven portion formed on the contact surface 6c of the caulking member 6A rub against each other, and are formed on the surface of the chip opposing electrode portion 4a. The aluminum oxide film is broken. As a result, the chip opposing electrode portion 4a and the caulking member 6 are connected in a state where good electrical connection is obtained by being connected in a state where the aluminum oxide film is broken.

Further, since the chip electrode portion 3 of the IC chip 1 is made of gold, there is no possibility that an oxide film having a high insulating property is formed on the surface thereof, and it is necessary to provide a means for intentionally breaking the oxide film on the surface. There is no. That is, by connecting the chip opposing electrode portion 3 of the IC chip 1 to the upper surface of the surface exposed portion 6d of the caulking member chip opposing electrode portion, good electrical connection between the chip electrode portion 3 and the chip opposing electrode portion 4a is achieved. Can be obtained.

FIG. 4 shows an embodiment of the connecting member 6.
A caulking member (needle caulking member) 6B having a needle-like shape and having both ends caulked as shown in FIG. That is, the needle-shaped caulking member 6B is
When penetrating the needle-shaped caulking member 6B through the PET substrate 2 (elongated PET substrate 2 '), the needle-shaped caulking member 6B and the chip opposing electrode portion 4a, the chip non-opposing electrode portion 4c, and the sheet The aluminum oxide film formed on the surface of the chip opposing electrode portion 4a, the chip non-opposing electrode portion, and the sheet-shaped coil portion 4b is ruptured by rubbing with the coil-shaped coil portion 4b, and the needle-shaped caulking member 6B
Good electrical connection can be obtained between the chip and the chip opposing electrode portion 4a.

Further, as shown in FIG. 4D, the upper surface of the needle-like caulking member 6B and the upper surface of the chip-facing electrode portion 4a are exposed such that the needle-like caulking member 6B is exposed on the surface of the chip opposing electrode portion 4a. By crimping the needle-shaped caulking member 6B so that the surface of the chip counter electrode portion 4a is flush with the surface of the chip counter electrode portion 4d, the chip counter electrode portion surface exposed portion 6d is formed on the upper surface of the chip counter electrode portion 4a. By connecting the electrode portion 3, the tip electrode portion 3, the needle-shaped caulking member 6
B, chip counter electrode portion 4a and chip non-counter electrode portion 4c
And a good electrical connection can be obtained.

Further, as another embodiment of the connecting member 6,
It has a wedge-shaped cross-sectional shape as shown in FIG.
A caulking member (wedge-shaped caulking member) 6C whose both ends are caulked is also conceivable. That is, when the wedge-shaped caulking member 6C penetrates the PET substrate 2 (the long PET substrate 2 '), the wedge-shaped caulking member 6 and the chip opposing electrode portion 4a rub against each other.
The film of aluminum oxide formed on the surface of a is broken, and good electrical connection can be obtained between the wedge-shaped caulking member 6C and the chip counter electrode portion 4a.

Further, as shown in FIG. 4D, the upper surface of the wedge-shaped caulking member 6C and the upper surface of the chip-facing electrode portion 4a are exposed such that the wedge-shaped caulking member 6C is exposed on the surface of the chip opposing electrode portion 4a. Are formed on the upper surface of the chip counter electrode portion 4a to form the chip counter electrode portion surface exposed portion 6d, and the chip electrode portion 3 is connected to the chip counter electrode portion surface exposed portion 6d. Thereby, good electrical connection can be obtained between the chip electrode portion 3 and the wedge-shaped connection member and the chip counter electrode portion 4a.

Here, a method of manufacturing a non-contact tag having an IC chip electrode connection structure in a non-contact tag according to an embodiment of the present invention will be described in detail with reference to FIGS. Here, FIG. 3 is a flowchart for explaining a manufacturing process of a non-contact tag having an IC chip electrode connection structure as one embodiment of the present invention, and FIGS. 4 and 5 are each a flowchart of FIG. FIGS. 6 and 7 are views for explaining a non-contact tag in the process, and FIGS. 6 and 7 show the structure of the non-contact tag in each process of the flowchart shown in FIG. 3 as viewed from above (the side to which the IC chip 1 is bonded). FIG.

First, in manufacturing a non-contact tag,
An aluminum foil 4 'is stuck on the entire front and back surfaces of the long PET substrate 2' (Step S1 in FIG. 3). FIG. 4A is a side sectional view of the non-contact tag in this state, and FIG. 6A is a top view thereof. Next, the aluminum foil 4 'formed on the front and back surfaces of the long PET substrate 2' is etched so that a predetermined number of non-contact tags can be obtained.
Is formed into a coil shape, and the chip opposing electrode portion 4a is formed on the front side (the surface on which the chip opposing electrode portion 4a is formed) of the long PET substrate 2 '.
And an aluminum foil coil 4 composed of a sheet-shaped coil portion 4b, and on the other hand, on the other side of the long PET substrate 2 '(the surface opposite to the surface on which the chip opposing electrode 3 is formed on the long PET substrate 2'). Forms an aluminum foil coil 4A composed of a chip non-facing electrode portion 4c and a sheet-like coil portion 4b (Step S2 in FIG. 3). FIG. 4B is a side sectional view of the non-contact tag in this state, and FIG.
Shown in

Further, a connecting member (caulking member) is passed through the electrode portions of the plurality of aluminum foil coils 4 formed on the surface of the long PET substrate 2 ', that is, the chip opposing electrode portion 4a and the sheet-like coil portion 4b. (Step S in FIG. 3)
3). FIG. 4 is a side sectional view of the non-contact tag in this state.
It is shown in (c). Here, shown at the right end in FIG.
The needle-shaped caulking member 6B described above is passed through the chip-facing electrode portion 4a, the long PET substrate 2 ', and the chip-non-facing electrode portion 4c. Good electrical connection can be obtained with the counter electrode portion 4c.

Similarly, the needles described above are also attached to the sheet-shaped coil portion 4b and the long PET substrate 2 'formed on the front and back surfaces of the long PET substrate 2' shown at the left end in FIG. Through the caulking member 6B, a good electrical connection is obtained even between the needle caulking member 6B and the sheet-shaped coil portions 4b formed on the front and back surfaces of the long PET substrate 2 '. be able to.

On the other hand, the above-described wedge-shaped caulking member 6C is made to penetrate the chip opposing electrode portion 4a and the long PET substrate 2 'shown at the center in FIG. Good electrical connection can be obtained between the portion 4a and the wedge-shaped caulking member 6C. next,
By pressing (caulking) each of the needle-shaped caulking members 6B and the wedge-shaped caulking members 6C from above and below,
Each connecting member is deformed so that the upper surface of each connecting member and the upper surface of each electrode section are flush with each other (Step S in FIG. 3).
4). That is, the needle-shaped caulking member 6B shown at the right end in FIG. 4D is deformed to be flush with the upper surface of the chip opposing electrode portion 4a so as to be exposed on the surface of the chip opposing electrode portion 4a ( Caulked), chip counter electrode portion 4a
Forming a chip opposing electrode portion surface exposed portion 6d on the upper surface of
Further, the needle-shaped caulking member 6B shown at the left end in FIG.
Is deformed (caulked) so as to be exposed on the surface of the sheet-shaped coil portion 4b so as to be flush with the upper surface portion of the sheet-shaped coil portion 4b, and is further shown at the center in FIG. 4D. The wedge-shaped caulking member 6C is connected to the chip opposing electrode portion 4a.
The upper surface of the chip opposing electrode portion 4a is deformed (caulked) so as to be flush with the upper surface of the chip opposing electrode portion 4a so that the chip opposing electrode portion surface exposed portion 6d is formed on the upper surface of the chip opposing electrode portion 4a. is there. FIG. 4D is a side sectional view of the non-contact tag in this state, and FIG.
Shown in

Next, the upper surface of the wedge-shaped caulking member 6C provided on the chip counter electrode portion 4a and the needle-shaped caulking member 6
The chip electrode portion 3 of the IC chip 1 is brought into close contact with the upper surface of B, and is fixed with the adhesive 5 (step S in FIG. 3).
5). At this time, since the needle-shaped caulking member 6B and the wedge-shaped caulking member 6C are made of a metal (for example, copper, iron or the like) which is hardly activated, there is no possibility that an insulating oxide film is formed on the surface. Chip electrode part 3 of IC chip 1
And a good electrical connection between the needle-shaped caulking member 6B and the wedge-shaped caulking member 6C. FIG. 5A is a side sectional view of the non-contact tag in this state, and FIG. 7B is a top view thereof.

Next, the laminate processing is performed (step S6 in FIG. 3), and the entire long PET substrate 2 'on which the IC chip 1, the aluminum foil coil 4 and the aluminum foil coil 4A are formed is covered with the laminate 8. FIG. 5B is a side sectional view of the non-contact tag in this state. Further, by cutting the plurality of non-contact tags formed on the long PET substrate 2 'in this manner, the individual non-contact tags 150 are cut.
(Step S7 in FIG. 3). FIG. 5C is a side view schematically showing the non-contact tag in this state.
Finally, the completed non-contact tag 150 is placed on the printing paper 160.
(Step S8 in FIG. 3). FIG. 5D is a side view schematically showing the non-contact tag in this state.
FIG. 7C shows a top view. In FIG. 7C, reference numeral 150 denotes a non-contact tag, 160 denotes printing paper, 160a denotes a printing surface of the printing paper 160, 170 denotes a barcode, and 180 denotes a character printed on the printing surface 160a.

As described above, according to the IC chip electrode connection structure in the non-contact tag as one embodiment of the present invention,
The connecting member 6, which is a metal joining member that is hardly activated,
The connecting member 6 is deformed so as to be exposed on the surface of the chip opposing electrode portion 4a while penetrating the PET substrate 2 (elongated PET substrate 2 '). Are connected (that is, electrically connected), and the chip electrode portion 3 is connected to the chip opposing electrode portion 4a and the chip non-opposing electrode portion 4c. Electrode part 4a
Good electrical connection can be obtained with the chip non-facing electrode portion 4c, and the same effect as in the case of using bumps can be obtained.

That is, since it is not necessary to form bumps on the electrode portions in advance, a complicated process for forming bumps can be omitted, so that time for the bump forming process can be saved and it is economical. . When penetrating the connecting member 6 through the PET substrate 2 (long PET substrate 2 ′) or when caulking the connecting member 6, a chip made of a metal such as aluminum that is activated and easily generates an oxide on the surface. Since the aluminum oxide film formed on the surface of the counter electrode portion 4a or the chip non-counter electrode portion 4c can be broken,
Good electrical connection can be obtained between the connection member 6 and the chip opposing electrode portion 4a or the chip non-opposing electrode portion 4c.

Further, the surface exposed portion 6d of the chip opposing electrode portion
The chip electrode unit 3 is connected to the chip counter electrode unit 4a and the chip non-counter electrode unit 4c so that the chip electrode unit 3 is electrically connected to the chip electrode unit 3. Also, since good electrical connection can be obtained between the chip non-facing electrode portion 4c and the electrode, it is preferable to use inexpensive aluminum as a material of the electrode, since an oxide having high insulating property is easily formed on the surface but inexpensive. And cost can be reduced.

In the case where the chip opposing electrode portion 4a is made of a metal such as titanium which is easily activated other than aluminum, the same applies to the case where the structure according to the above-described embodiment is applied in a similar manner. The effect can be obtained. Furthermore, in the above-described embodiment, PET (polyethylene terephthalate) is used as the material of the film-shaped insulating substrate, but the material is not limited thereto, and a thermoplastic plastic such as PE (polyethylene) may be used. Good.

Further, in the above-described embodiment, the needle-shaped caulking member 6B, the wedge-shaped caulking member 6C, or the like is used as the connecting member 6, but the shape of such a connecting member is not limited thereto. However, various modifications can be made without departing from the spirit of the present invention. In addition,
In the embodiment described above, the chip opposing electrode portion 3 of the IC chip 1 is brought into close contact with the chip opposing electrode portion surface exposed portion 6d, and then bonded with the adhesive 5, but such an adhesive is It is not limited, and a hot melt or a conductive adhesive may be used.

In the above-described embodiment, the chip electrode portion 3 of the IC chip 1 is replaced with the chip-facing electrode portion surface exposed portion 6d.
Is fixed by the adhesive 5 after being brought into close contact with the substrate, but is not limited thereto, and a conductive adhesive or hot melt is applied to the exposed surface 6d of the chip counter electrode portion, and the conductive adhesive or the hot melt is applied. The chip electrode section 3 of the IC chip 1 may be attached to the hot melt.

That is, since these conductive adhesives and hot melts have conductivity, the conductive adhesive and the hot melt are placed between the chip electrode part 3 of the IC chip 1 and the chip counter electrode part surface exposed part 6d. Even if an agent or hot melt intervenes,
Good electrical connection can be obtained between the chip electrode portion 3 of the IC chip 1 and the chip exposed electrode portion surface exposed portion 6d, and a similar effect can be obtained.

[0052]

As described in detail above, according to the IC chip electrode connection structure of the non-contact tag of the present invention, the metal connection member which is hardly activated is penetrated through the film-like insulating substrate. The chip electrode portion and the chip counter electrode portion are deformed so that the connection member is exposed on the surface of the chip counter electrode portion, and the chip electrode portion is electrically connected to the chip counter electrode portion surface exposed portion. And by connecting the chip non-facing electrode portion, the chip electrode portion,
A good electrical connection can be obtained between the chip counter electrode portion and the chip non-counter electrode portion, and the same effect as in the case of using a bump can be obtained. Therefore, a bump is formed on the electrode portion in advance. Since there is no need, a complicated step for forming a bump can be omitted, and there is an advantage that time for the step of forming a bump can be saved and it is economical.

Further, according to the IC chip electrode connection structure in the non-contact tag of the present invention, a metal connection member which is hardly activated is penetrated through the film-like insulating substrate, and this connection member is opposed to the chip. The chip electrode is mounted so as to be exposed on the surface of the electrode portion, and the chip electrode portion and the chip counter electrode portion are connected so that the chip electrode portion is electrically connected to the chip exposed electrode portion surface exposed portion. A good electrical connection can be obtained between the part and the chip counter electrode part, and the same effect as in the case of using a bump can be obtained. Therefore, it is not necessary to form a bump on the electrode part in advance. Therefore, there is an advantage that a complicated process for forming a bump can be omitted, time for the bump forming process can be saved, and the process is economical.

Further, according to the IC chip electrode connection structure in the non-contact tag according to the third aspect of the present invention, in the case where the connection member is formed as a caulking member that penetrates the film-like insulating substrate and can be caulked at both ends. Similarly, a good electrical connection can be obtained between the chip electrode portion, the chip counter electrode portion and the chip non-counter electrode portion, or between the chip electrode portion and the chip counter electrode portion, and a bump is used. Since the same effect as in the case can be obtained, it is not necessary to form a bump on the electrode portion in advance, so that a complicated process for forming the bump can be omitted, and the time for the bump forming process can be reduced. It has the advantage of saving money and being economical.

Further, according to the IC chip electrode connection structure in the non-contact tag of the present invention, the metal foil pattern portion of the film-like insulating substrate is formed as an aluminum foil pattern portion, and the connection member is made of copper. Alternatively, even in the case of being configured as an iron connection member, similarly, a good electrical connection between the chip electrode section, the chip counter electrode section and the chip non-counter electrode section, or between the chip electrode section and the chip counter electrode section. Since a connection can be obtained and the same effect as in the case of using a bump can be obtained, there is no need to form a bump on an electrode portion in advance, so that a complicated process for forming a bump is omitted. Has the advantage of being economical and saving time for the bump making process. Because it can use, there is an advantage that the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram for explaining an IC chip electrode connection structure in a non-contact tag as one embodiment of the present invention.

FIG. 2 is a side sectional view showing an example of a shape of a caulking member.

FIG. 3 is a flowchart illustrating a manufacturing process of a non-contact tag.

4A to 4D are side sectional views of a non-contact tag in each step of the flowchart shown in FIG.

FIGS. 5A to 5D are views for explaining each step of the flowchart shown in FIG. 3;

FIGS. 6A and 6B are views of the structure of the non-contact tag in each step of the flowchart shown in FIG. 3, as viewed from above.

FIGS. 7A to 7C are views of the structure of the non-contact tag in each step of the flowchart shown in FIG. 3, as viewed from above.

FIG. 8 is a block diagram showing a hardware configuration of a contactless ID tag system.

FIGS. 9A to 9D are side sectional views for explaining a conventional electrical connection method for electrodes formed on the front and back surfaces of a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 PET board (film-like insulating substrate) 2 'Long PET board (film-like insulating substrate) 3 Chip electrode part 4 Aluminum foil coil part (metal foil pattern part) 4' Aluminum foil 4A Aluminum foil coil part 4a chip Counter electrode part 4b Sheet coil part 4c Chip non-counter electrode part 5 Adhesive 6 Connecting member 6a Shaft part 6b Head 6c Contact surface 6d Chip counter electrode part surface exposed part 6A Swaging member 6B Needle swaging member 6C Wedge swaging member

Claims (4)

[Claims] 1. A non-contact tag comprising an IC chip having a chip electrode portion and a film-like insulating substrate having a metal foil pattern portion formed on each of the front and back surfaces, wherein the metal foil pattern of the film-like insulating substrate is provided. A chip counter electrode portion made of a metal which is connected to the chip electrode portion in opposition to the IC chip and is activated and easily generates an oxide on the surface; and a side opposite to a surface on which the chip counter electrode portion is formed. A non-chip opposing electrode portion formed at a position facing the chip opposing electrode portion on the film-like insulating substrate surface, through a metal connection member that penetrates through the film-like insulating substrate and is hardly activated. The connecting member is connected so as to be exposed on the surface of the chip opposing electrode portion, and the exposed surface of the chip opposing electrode portion of the connecting member is electrically connected to the chip electrode portion. So as to be, and the tip electrode portion, characterized in that the above chip counter electrode unit and the chip non-facing electrode portions are connected, IC chip electrode connection structure in the non-contact tag. 2. An IC chip having a chip electrode portion, and a chip counter electrode portion made of a metal which is connected to the chip electrode portion in opposition to the IC chip and is activated to easily generate an oxide on the surface. In a non-contact tag comprising a film-shaped insulating substrate having a metal foil pattern portion formed thereon, the chip-facing electrode portion of the film-shaped insulating substrate is made of a metal that penetrates the film-shaped insulating substrate and is hardly activated. A connection member is attached so that the connection member is exposed on the surface of the chip counter electrode portion, and the chip electrode portion surface exposed portion of the connection member is electrically connected to the chip electrode portion. An IC chip electrode connection structure in a non-contact tag, wherein the chip electrode portion and the chip counter electrode portion are connected. 3. The IC for a non-contact tag according to claim 1, wherein the connection member is configured as a caulking member that penetrates the film-shaped insulating substrate and can be caulked at both ends. Chip electrode connection structure. 4. The metal foil pattern portion is configured as an aluminum foil pattern portion, and the connection member is configured as a copper or iron connection member. 3. The IC chip electrode connection structure in the non-contact tag according to 1.