JPH1154011A - Relay and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact relay which is easy to assemble and can be mass-produced, and its manufacturing method. SOLUTION: A spiral flat coil 15 is formed around a through hole 12 provided in a semiconductor substrate 10 on a surface of the semiconductor substrate 10 by a semiconductor process. On the other hand, first and second layer core bodies 14, 16 of conductive magnetic material is formed on the rear surface of the semiconductor substrate 10 by a thick film forming means. Then, by protruding a protuberance 17 from a surface of the first layer core body 14 exposed from a through hole 12, a coil contact plate 20 having a tip of this protuberance 17 as a fixed contact 19 can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a relay, and more particularly to a microminiature relay formed by stacking substantially plate-shaped components.

[0002]

2. Description of the Related Art Conventionally, as a small relay formed by stacking substantially plate-shaped components, for example, a relay disclosed in Japanese Patent Application Laid-Open No. Hei 9-115405 shown in FIGS. 4 and 5 has been considered. That is, the base 1 and the movable contact plate 2
, Auxiliary yoke 3, coil plate 4, plate-shaped core 5
And an insulating cover 6.

The base 1 is formed by insert-molding a pair of coil terminals 1b and 1c, a movable contact terminal 1d and a fixed contact terminal 1e in a box-shaped base body 1a having a substantially rectangular plane.
Each terminal (the coil terminals 1b and 1c in FIG. 1)
(Not shown) are bent up on the outer surface of the base body 1a. In particular, the annular movable contact terminal 1 is formed from the bottom corner of the recess 1f provided on the upper surface of the base body 1a.
d is exposed.

[0004] The movable contact plate 2 is connected to the base body 1.
This is a thin plate made of a conductive magnetic material having a planar shape that can be fitted into the recess 1f of FIG. By forming a flat C-shaped slit by press working, etching or the like, the hinge portion 2b is formed, and the movable contact piece 2c and the annular support 2a are partitioned. Further, the hinge portion 2b
Is thin and the movable contact piece 2c can be rotated by a small external force, so that there is an advantage that a highly sensitive relay can be obtained. The movable contact plate 2 is fitted into the recess 1f of the base 1, and the annular support 2a is electrically connected to the movable contact terminal 1d by pressing, welding, brazing, or the like, so that the movable contact piece is provided. 2c is supported rotatably about the hinge 2b in the plate thickness direction.

[0005] The auxiliary yoke 3 secures a rotating space for the movable contact piece 2c and reduces magnetic resistance. For this reason, it is a thin plate made of an annular insulating material having an outer peripheral shape that can be fitted into the recess 1f of the base body 1a. The auxiliary yoke 3 is fitted into the recess 1f of the base 1 and stacked on the movable contact plate 2, so that the upper surface thereof and the base body 1a
Is substantially flush with the upper surface (FIG. 5).

[0006] The coil plate 4 is connected to the base body 1a.
Is formed of a single-crystal silicon substrate having a planar shape capable of substantially covering the upper surface of the substrate, having a through hole 4a at the center thereof, and a flat coil (not shown) formed on the back surface thereof by a semiconductor process. Then, the coil plate 4 has the connection holes 4b, 4
The electrical connection is achieved by inserting the coil terminals 1b and 1c of the base 1 into the terminal c. However, the fixed contact terminal 1e protrudes from the through hole 4d of the coil plate 4.

The plate-shaped core 5 is made of a conductive magnetic plate having a planar shape capable of substantially covering the coil plate 4, and is an iron core 5 which is a protrusion formed by extrusion.
The leading end of a is a fixed contact 5b. Further, a cutout portion 5c for electrically connecting to the fixed contact terminal 1e is provided at a corner of the plate-like core body 5. Then, the iron cores 5a of the plate-shaped core 5 are fitted into the through holes 4a of the coil plate 4, respectively, and the cutout portions 5c of the plate-shaped core 5 are
Is electrically connected to the movable contact terminal 1e by pressing, welding, brazing, caulking or the like. As a result, the fixed contact 5b protrudes slightly downward from the lower surface of the coil plate 4, and faces the movable contact piece 2c so as to be able to contact and separate from the movable contact piece 2c while maintaining a predetermined contact gap (FIG. 5).

As shown in FIG. 5, the insulating cover 6 comprises a coil plate 4 and a plate-like core 5 mounted on the base 1.
It may be a resin molded article having a planar shape that covers the surface, or may be formed by casting or low-pressure molding of an epoxy resin or the like.

The relay having the above-mentioned structure is surface-mounted on a printed circuit board 7 via a solder 8.

Next, the operation of the relay having the above configuration will be described. First, when no voltage is applied to the coil terminals 1b and 1c and the flat coil of the coil plate 4 is not excited, the movable contact piece 2c and the fixed contact 5b face each other with a predetermined contact gap, and The contact terminal 1d and the fixed contact terminal 1e are open.

When a voltage is applied to the coil terminals 1b and 1c to excite the flat coil, a magnetic flux is generated along the axis of the iron core 5a. For this reason, magnetic flux flows in a closed magnetic circuit formed by the iron core 5a, the movable contact piece 2c, the auxiliary yoke 3, and the plate-shaped core 5. As a result, the movable contact piece 2c is attracted to the iron core 5a of the plate-shaped core body 5 against the spring force of the hinge portion 2b of the movable contact plate 2, and the fixed contact 5b
To close the electrical circuit.

Then, when the excitation of the flat coil is released, the above-mentioned magnetic flux disappears, and the movable contact piece 2c returns to the original state by the spring force of the hinge portion 2b.
Are separated from the fixed contact 5b, and the electric circuit is opened.

[0013]

However, in the above-described relay, the iron core 5a of the plate-shaped core 5 must be inserted into the through hole 4a of the coil plate 4 and assembled. Therefore, the assembling accuracy is low, and there is a limit to miniaturization. In particular, when the size is reduced, there is a problem that the assembling work is more troublesome and mass production becomes difficult.

[0014] In view of the above problems, it is an object of the present invention to provide a small-sized relay that can be easily assembled and mass-produced, and a method of manufacturing the same.

[0015]

In order to achieve the above object, a relay according to the present invention has at least one spiral coil provided on a surface of the semiconductor substrate around a through hole provided in the semiconductor substrate. Form a layered core made of conductive magnetic material on the back surface of the semiconductor substrate by thick film forming means,
A coil contact plate having a fixed contact at a tip end of a protrusion protruding from an exposed surface of the layered core exposed through the through hole, and a plate thickness via at least one hinge portion extending from the support; A movable contact plate which is supported so as to be freely driven in the direction, and which is opposed to the fixed contact so as to be able to contact and separate from the fixed contact.

At least one spiral coil is provided on the surface of the semiconductor substrate around a pair of through holes provided in the semiconductor substrate, and a layered core made of a conductive magnetic material is formed on the back surface of the semiconductor substrate by thick film forming means. A coil contact plate that forms a body, and has a fixed contact point at the tip of a pair of protrusions protruding from the exposed surface of the layered core that is exposed through the through hole, and at least one extending from the support. A movable contact plate, which is supported so as to be able to be driven in a thickness direction via a hinge portion, may be configured to include a movable contact plate which is opposed to the fixed contact so as to be able to contact and separate therefrom.

The spiral coil may be formed flat on the surface of the semiconductor substrate by a semiconductor process.

In order to achieve the above object, a method of manufacturing a relay includes forming a first layered core made of a conductive magnetic material on a back surface of a semiconductor substrate having a through hole by using a thick film forming means.
After cutting off the tip protruding from the through hole to make it flush, at least one spiral flat coil is formed around the through hole on the surface of the semiconductor substrate by a semiconductor process. The step of forming a protrusion made of a conductive magnetic material and the second layered core on the front and back surfaces by thick film forming means may be used.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a relay according to the present invention will be described with reference to FIGS. The first embodiment of the present invention is substantially the same as the relay according to the conventional example. The difference is that as shown in FIGS. 1 and 2, a coil contact plate 20 formed by performing a semiconductor process on a semiconductor substrate 10 is used. The point to use. The coil contact plate 20 is manufactured as follows. That is, as shown in FIG. 2, an etching mask 11 is formed on the front and back surfaces of the single crystal silicon substrate 10, and a deep etching is performed to form a through hole 12 (FIG. 2).
(C)). Then, after removing the etching mask 11 and forming a thermal oxide film (not shown) on the entire surface, a metal is deposited to form a plating underlayer 13 (FIG. 2D). Next, after the conductive magnetic material is plated to form the first layered core 14, the conductive magnetic material protruding from the single crystal silicon substrate 10 is polished to be flush (FIGS. 2E and 2F). )). Further, after the flat coil 15 is formed by a semiconductor process, a conductive magnetic material is plated to form the second layered core body 16 and the protrusion 17 (FIGS. 2G and 2H). Finally,
After the surface of the flat coil 15 is covered with the lift-off resin film 18 and the tip of the protrusion 17 is gold-plated to form the fixed contact 19, the resin film 18 is removed to complete the coil contact plate 20 ( FIG. 2 (i)).

The connection between the fixed contact and the fixed contact terminal of the base (not shown) may be made in the same manner as in the above-described conventional example. Others are almost the same as the above-mentioned conventional example,
Description is omitted. Further, the flat coil 15 may be formed after the protrusion 17 is formed.

According to the present embodiment, the first and second layered cores 14 and 16, the projection 17 and the flat coil 15 can be integrally formed on the semiconductor substrate 10 by a semiconductor process. Therefore, not only the number of parts and the number of assembling steps are reduced, but also a small relay with high assembling accuracy can be obtained.

In the second embodiment, as shown in FIG. 3, a pair of fixed contacts 19, 19 are formed through a pair of through holes 12, 12 of a semiconductor substrate 10, and a so-called twin contact system is used. . Since the manufacturing method is almost the same as that of the first embodiment, the description is omitted. According to the present embodiment, a so-called twin contact system is used, so that a relay with high contact reliability and high magnetic efficiency can be obtained.

In the above embodiment, the coil contact plate composed of the first and second layered cores has been described. However, a layered core composed of only a single layer may be used. Further, the spiral coil is not limited to a flat coil formed by a semiconductor process, and may be a coil formed by winding an extremely fine copper wire.

[0024]

As is apparent from the above description, according to the first aspect of the present invention, a coil contact plate having a layered core formed on one surface of a semiconductor substrate by a semiconductor process can be obtained.
For this reason, a small-sized relay can be obtained which has higher assembly accuracy than the conventional example, requires less labor for production, and can be mass-produced. According to the second aspect of the present invention, since the movable contact piece comes into contact with the two fixed contacts, a so-called twin contact system is provided. For this reason, in addition to the effects described above, a relay having high contact reliability and high magnetic efficiency can be obtained. According to the invention of claim 3, a flat coil is formed on the surface of the semiconductor substrate by a semiconductor process. For this reason, a more compact relay suitable for mass production can be obtained. According to the invention of claim 4, after forming the first layered core, the second layered core and the projection are formed. For this reason, the first layered core, the second layered core, and the protrusion can be separately formed to have a desired thickness, which has an effect of facilitating manufacture.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a coil contact plate of a relay according to a first embodiment of the present invention.

FIG. 2 is a process chart showing a method for manufacturing the coil contact plate shown in FIG.

FIG. 3 is a sectional view showing a coil contact plate of a relay according to a second embodiment of the present invention.

FIG. 4 is an exploded perspective view of a relay according to a conventional example.

5 is a cross-sectional view showing a state where the relay of FIG. 4 is mounted on a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Semiconductor substrate, 14 ... 1st layered core, 15 ... Flat coil, 16 ... 2nd layered core, 17 ... Projection, 19 ... Fixed contact, 20 ... Coil fixed contact plate.

Claims (4)

[Claims] At least one spiral coil is provided around a through hole provided in a semiconductor substrate on a surface of the semiconductor substrate, and a layered core made of a conductive magnetic material is formed on a back surface of the semiconductor substrate by thick film forming means. A coil contact plate that forms a body, and has a fixed contact point at the tip of a protrusion protruding from the exposed surface of the layered core exposed through the through hole; and at least one hinge portion extending from the support And a movable contact plate in which the movable contact piece supported so as to be able to be driven in the plate thickness direction via the movable contact plate is detachably opposed to the fixed contact. 2. At least one spiral coil is provided on a surface of the semiconductor substrate around a pair of through holes provided in the semiconductor substrate, and is formed of a conductive magnetic material on a rear surface of the semiconductor substrate by a thick film forming means. A coil contact plate having a layered core formed thereon, and having a fixed contact at a tip end of a pair of protrusions protruding from an exposed surface of the layered core exposed through the through-hole; and at least extending from the support. A movable contact plate, comprising: a movable contact plate supported so as to be freely driven in a plate thickness direction via one hinge portion; 3. The relay according to claim 1, wherein the spiral coil is formed flat on a surface of the semiconductor substrate by a semiconductor process. 4. A first layered core made of a conductive magnetic material is formed on a back surface of a semiconductor substrate provided with a through hole by a thick film forming means, and a tip protruding from the through hole is cut off to be flush. After that, at least one spiral flat coil is formed around the through hole on the surface of the semiconductor substrate by a semiconductor process, and then a protrusion made of a conductive magnetic material is formed on the front and back surfaces of the semiconductor substrate by thick film forming means. A method for manufacturing a relay, comprising forming a portion and a second layered core.