JPH1152010A - Burn-in board and burn-in device with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase mounting density by providing a constitution with sockets which hold the first wiring boards on which semiconductor devices are mounted in such a way that the first wiring boards are inclined with respect to the second wiring boards. SOLUTION: On a main board 1a, a plurality of movable sockets 30 which can be set at any angle are installed, and a check terminal 7 to verify an electric waveform with each subboard 3 is provided. A socket 50 for fixing a package is held on the subboard 3, and a package 40 is arranged in the socket 50. The movable socket 30 is set at a predetermined angle, and then the convex connector of the subboard 3 is inserted and fitted into the concave connector of the movable socket 30. The check terminal 7 on the main board 1a sets the wiring of the main board 1a and the subboards 3 so as to obtain a normal waveform to each subboard 3. In this state, the main board 1a is placed in a burn-in device with the addition of convection heat 8 to perform burn-in.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board used for performing burn-in on a semiconductor device and a burn-in apparatus provided with the burn-in board.

[0002]

2. Description of the Related Art Burn-in involves applying a power supply voltage and a temperature stress higher than normal operations to a package (including a semiconductor integrated circuit element and facilitating handling during a test or the like; hereinafter, referred to as a package). This is a test for removing the initial failure of the package (the failure that causes damage). The tool used for this burn-in is called a burn-in board. FIG. 28 is a configuration diagram of a conventional burn-in board, and FIG. 29 is a side configuration diagram thereof. 28 and 29, on the surface of burn-in board 1000, sockets 5000 for fixing package 4000 are provided at regular intervals. A connector 1000 for supplying a signal is provided at one end of the burn-in board 1000.
a, and a check terminal 1000b at the other end for monitoring whether the input signal is supplied correctly. Whether the input signal is supplied correctly can be confirmed by checking the waveform with the package 4000 mounted. This burn-in board is rail 3000
And placed in a burn-in device. Also,
FIG. 30 shows a connection diagram of a conventional small burn-in board. FIG. 31 is a plan view of a small burn-in board.
FIG. 32 shows a side view thereof. In FIGS. 31 and 32, a package fixing socket 5300 is held on a small burn-in board 3300, and a package 4300 is disposed in the package fixing socket 5300. Also, a convex connector 3300a for connecting to a concave connector of another small burn-in board is provided at one end in the longitudinal direction of the small burn-in board 3300.
The other end is provided with a concave connector 3300b for connecting to a convex connector of another small burn-in board. This small burn-in board is rail 3000a
And placed in a burn-in device. Also,
FIG. 33 shows a side view of a conventional burn-in board. FIG.
4 is a plan view of the sub-board, and FIG. 35 is a side view thereof. In FIG. 34 and FIG.
A package fixing socket 5500 is held on 100, and a package 4500 is disposed in the package fixing socket 5500. Sub board 3
A protruding connector 3100a for connecting to a connector of the main board is attached to one end in the longitudinal direction of 100.

FIG. 36 shows, for example, Japanese Patent Application Laid-Open No. 4-26.
It is a perspective view of the conventional burn-in board shown in 3450 gazette. In FIG. 36, a plurality of cartridge connectors 5500 are installed on the main board 5400 at substantially right angles, and a connector 4800 is attached. The pattern wiring on the main board 5400 is connected to the connector 4800. Next, a package fixing socket 4100 is provided on the sub board 3500, and a connector 3700 is provided. Also, the connector 3700
Is connected to the pattern wiring on the sub-board 3500. Then, connect the connector 3700 to the cartridge connector 5.
The sub-board 3500 is attached to the main board 5400 at a substantially right angle by being inserted into the 500 to stand up.

[0004]

In the conventional burn-in board as described above, the height of the sub-boards formed on the main board is inevitably limited by the height of the burn-in device, and the height of the burn-in device is limited. The number of packages that can be mounted is limited. Further, since convection heat is generated in the burn-in apparatus, a dead point of convection heat, that is, a heat pool, is generated on a sub-board which is provided at a substantially right angle to the main board. If there are many places where the heat accumulation occurs, uniform burn-in cannot be performed. Accordingly, an object of the present invention is to increase the mounting density of a package capable of performing burn-in at a time on a sub-board and to obtain a burn-in board capable of performing uniform burn-in.

[0005]

A burn-in board according to the present invention has a first wiring board on which a plurality of semiconductor devices to be burn-in mounted are placed and which is electrically connected to the semiconductor devices, and a first wiring. A second wiring board having an area where the board is arranged, and electrically connected to the first wiring board;
A socket provided on the second wiring board and holding the first wiring board so as to be inclined with respect to the second wiring board.

Further, a plurality of semiconductor devices to be burn-in mounted are mounted, and a first semiconductor device electrically connected to the semiconductor devices is mounted.
A second wiring board having an area in which the first wiring board is arranged, and a second wiring board electrically connected to the first wiring board; and a second wiring board provided on the first wiring board. A socket for holding the first wiring board so as to be inclined with respect to the wiring board.

The burn-in board according to claim 1 or 2, further comprising a socket for arbitrarily maintaining a relative inclination angle between the first wiring board and the second wiring board.

In the burn-in board according to the third aspect, the socket includes a concave connector to which the first wiring board is attached, an arm fixed to the concave connector, a holder to be attached to the second wiring board, and a recess. The flexible board is engaged with the connector and is joined to the second wiring board, and a fastening tool for fastening the arm to the holding tool.

Further, in the burn-in board according to the third aspect, the socket includes a concave connector to which the first wiring board is attached, an arm fixed to the concave connector, and a convex connector to be attached to the second wiring board. It is provided with a box-shaped holder provided, a flexible board which is engaged with the concave connector and is joined to the convex connector, and a fastening tool for fastening the arm to the box-shaped holder.

[0010] In the burn-in board according to the third aspect, the socket is a concave connector to which the first wiring board is attached, a protractor-type holder attached to the second wiring board and provided with an opening at a fixed angle, The flexible board is engaged with the concave connector and joined to the second wiring board, and is provided with an arm provided with a projection fixed to the concave connector and fitted into an opening of the protractor-type holder.

In the burn-in board according to the first or second aspect, an opening is provided in the first wiring board.

Further, in the burn-in board according to claim 1 or 2, the electric waveforms of the first wiring board and the second wiring board are checked by a common checker.

Further, in the burn-in board according to the first or second aspect, a concave connector for connecting a convex connector built in the checker is attached to the first wiring board and the second wiring board. is there.

Further, in the burn-in board according to the first or second aspect, the plurality of first wiring boards are inclined with respect to the second wiring board so that the trajectories of their ends draw substantially streamlines. This is what was kept.

Further, in the burn-in board according to the tenth aspect, the plurality of first wiring boards are inclined with respect to the second wiring board so that the trajectories of their ends draw a substantially hyperbolic spiral. It is what was held.

Further, in the burn-in board according to the tenth aspect, the plurality of first wiring boards are held with respect to the second wiring board so as to be inclined such that the trajectory of their ends substantially draws Lichuus. It is.

Further, there is provided a burn-in board comprising the burn-in board according to any one of claims 1 to 12, a furnace section provided with a partition for supporting the burn-in board, a heat source section, and a control section. .

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 shows a burn-in board according to the first embodiment. In FIG. 1, a plurality of movable sockets 30 that can be set at an arbitrary angle are mounted on a main board 1a, and have a check terminal 7 for checking an electric waveform with each sub-board before and after burn-in. . FIG.
FIG. 3 is a plan view of the sub board according to the first embodiment, and FIG.
Shows a side view thereof. 2 and 3, a package fixing socket 50 is held on the sub-board 3, and the package 40 is disposed in the package fixing socket 50. A protruding connector 3 a for connecting to the movable socket 30 is provided at one end in the longitudinal direction of the sub board 3. Further, the convex connector 3a
An opening 3c is provided in the vicinity. After the movable socket 30 is set at a certain angle, the convex connector 3a of the sub board 3 is inserted and fitted to the concave connector 30a of the movable socket 30. The check terminal 7 on the main board 1a sets the wiring of the main board 1a and the sub board 3 so that a normal waveform can be obtained electrically for each sub board. In this state, it is installed in a burn-in device and convection heat 8 is applied to perform burn-in.

Next, FIG. 4 shows a first embodiment of the movable socket 30. In FIG. 4, the movable socket 30 includes a concave connector 30a into which a convex connector 3a attached to an end of the sub board 3 is inserted, an arm 30b fixed to the concave connector 30a, and a holder attached to the main board 1a. 30d, a flexible board 30e engaged with the concave connector 30a and joined to the main board 1a, and a screw 30c for fastening the arm 30b and the holder 30d. Therefore, by setting the arm 30b and the holder 30d at an arbitrary angle and tightening with the screw 30c, the sub-board 3 can be attached at an arbitrary angle with respect to the main board 1a. The detachable connection between the movable connector 30 and the concave connector 30a is also possible.

FIG. 5 shows a second embodiment of the movable socket. In FIG. 5, the movable socket 31 is all the same except for the holder in the first embodiment. That is, a box-shaped holder 31d is provided instead of the holder 30d. The box-shaped holder 31d is provided with a convex connector 31f, and is connected to one end of a flexible board 31e extending from the concave connector 31a. According to this movable socket, it is possible to use the existing main board in which the concave connector is installed on the main board 1a as it is.

FIG. 6 shows a third embodiment of the movable socket. In FIG. 6, the movable socket 32 is the first
A protractor-type holder 32d provided with an opening 32g at a fixed angle instead of the holder and the screw in the embodiment of the present invention, and a protractor-type holder 32d provided with a projection 32h on the arm 32b.
32g. Other configurations are the same as those of the first embodiment. According to the movable socket, it is not necessary to rely on the tightening force of the screw as compared with the first embodiment, and the angle of the arm 32b can be fixed easily.

According to the first embodiment, not only is the sub-board erected to simply increase the mounting density compared to the conventional example, but the sub-board is angled with respect to the main board in consideration of thermal efficiency. Since the package is mounted obliquely, heat around the package can be easily circulated and more packages can be mounted, and even if the number of burn-in boards is small, the burn-in capability per operation can be increased. Also,
By providing an opening through which hot air can pass through the sub-board, heat flow is improved and convection is generated, so that heat accumulation around the package is prevented and heat is evenly applied to each package. Further, even in the case of a contact failure due to the package fixing socket, the maintenance can be easily performed because the sub board can be replaced only by replacing the sub board. Further, different types of packages providing the same signal, for example, a PGA (Pin Grid Array, hereinafter referred to as PGA) sub-board and a QFP (Quad F)
Lat Package, hereinafter referred to as QFP. The connection can be easily made only by replacing the sub-boards in the sub-board combination of the above.

Embodiment 2 FIG. FIG. 7 shows a burn-in board according to the second embodiment. In FIG. 7, a movable socket 3 which can be set at an arbitrary angle is provided on a main board 1b.
A plurality of 0s are attached, and a concave connector 2 for connecting to a convex connector built in a checker 70 described later is provided at one end in the longitudinal direction. FIG. 8 shows the second embodiment.
FIG. 9 is a side view of the sub-board shown in FIG. 8 and 9, a package fixing socket 51 is held on the sub-board 300, and the package 41 is disposed in the package fixing socket 51. A convex connector 3 for connecting to the movable socket 30 is provided at one end of the sub board 300 in the longitudinal direction.
00a is provided at the other end thereof with a concave connector 300b for connection to a convex connector built in the checker 70 described later. Further, an opening 300c is provided near the convex connector 300a. After the movable socket 30 is set at a certain angle, the convex connector 300a of the sub board 300 is inserted into and attached to the movable socket 30. In this state, it is installed in a burn-in apparatus and convection heat is applied to perform burn-in.

There is no check terminal on the main board 1b for checking the electric waveform. The electrical waveform check is performed by a separate checker 70. FIG. 10 is a plan view of this checker, and FIG. 11 is a side view thereof.
10 and 11, the checker 70 includes a movable socket 70b whose angle can be adjusted, a check terminal 70a, a cable 70c, and the like. The wiring of the main board 1a and the sub-board 3 is set so that an electrically normal waveform can be obtained by inserting the checker 70. The convex connector built in the checker 70 is inserted into the concave connector 2 of the main board 1b. Also, a check can be made by inserting a convex connector into the sub-board. First, by checking the main board 1b, it is detected which sub-board has a waveform that is different from the electrically normal waveform, and the checker 70 is inserted into the sub-board serving as a target, and which package is electrically connected. Check if the waveform is different from the normal waveform.

According to the second embodiment, the first embodiment
The check terminal on the main board is unnecessary compared to
The wiring structure of the main board is simple and easy to manufacture. In addition, since the main board and the sub-board can be checked by one checker, the check components can be shared and a compact burn-in board can be configured. In addition, detailed electrical waveform checking can be performed on each sub-board down to the minimum number of packages, and the visibility of the check terminals can be easily adjusted by adjusting the angle, so that the work efficiency can be improved. In addition, by providing an opening through which hot air can pass through the sub-board, heat flow is improved and convection is generated, so that heat accumulation around the package is prevented and heat is evenly applied to each package. . Further, even in the case of a contact failure due to the package fixing socket, the maintenance can be easily performed because the sub board can be replaced only by replacing the sub board. Furthermore, it is possible to easily connect only different sub-boards in different types of packages that provide the same signal, for example, a combination of a PGA sub-board and a QFP sub-board.

Embodiment 3 FIG. FIG. 12 shows a burn-in board according to the third embodiment. In FIG. 12, a plurality of concave connectors 10 are mounted on the main board 1c,
There is a check terminal 7a for checking the electrical waveform with each sub-board before and after burn-in. FIG. 13 is a plan view of a sub board according to the third embodiment, and FIG. 14 is a side view thereof. 13 and 14, a package fixing socket 53 is held on the sub-board 310, and the package 43 is disposed in the package fixing socket 53. A movable socket 33 is attached to one end of the sub board 310 in the longitudinal direction. Further, an opening 310c is provided near the movable socket 33.
Is provided. Before and after the convex connector 33a of the movable socket 33 of the sub board 310 is inserted and fitted into the concave connector 10 of the main board 1c, depending on the package for mounting the movable socket 33 on the sub board 310 and the number of sub boards 310 to be attached. The tilt can be set freely. In addition, the mounting position and the sub board 31 are set so that heat around the package is easily circulated.
It is possible to change the slope of zero. The check terminal 7a on the main board 1c sets the wiring of the main board 1c and the sub board 310 so that a normal waveform can be obtained electrically for each sub board. In this state, the convection heat 8a is installed in the burn-in apparatus to perform burn-in.

According to the third embodiment, the first embodiment
Has the same effect as.

Embodiment 4 FIG. 15 shows a burn-in board according to the fourth embodiment. In FIG. 15, a plurality of concave connectors 10 are mounted on the main board 1d,
A checker 7 similar to that of the second embodiment is provided at one end in the longitudinal direction.
1 is provided with a concave connector 20 for connecting to the convex connector built in. FIG. 16 is a plan view of a sub board according to the fourth embodiment, and FIG. 17 is a side view thereof. 16 and 17, a package fixing socket 55 is held on the sub-board 330, and the package 45 is disposed in the package fixing socket 55. A movable socket 33 is attached to one end of the sub board 330 in the longitudinal direction.
An opening 330c is provided in the vicinity. Further, the other end is provided with a concave connector 330b for connecting to a convex connector built in the checker 71 as in the second embodiment. Before and after the convex connector 33a of the movable socket 33 of the sub board 330 is inserted and fitted into the concave connector 10 of the main board 1d, depending on the package for mounting the movable socket 33 on the sub board 330 and the number of sub boards 330 to be attached. The tilt can be set freely. In addition, the mounting position and the sub board 33 are set so that heat around the package is easily circulated.
It is possible to change the slope of zero. Main board 1
d is installed in a burn-in device with the sub-board 330 attached, and burn-in is performed by applying convective heat.

The configuration and function of the above-described checker 71 are the same as in the second embodiment.

The fourth embodiment has the same effect as the second embodiment.

Embodiment 5 FIG. 18 shows a burn-in board according to the fifth embodiment. In FIG. 18, on the main board 1e, a plurality of concave connectors 35 inclined at a constant angle with respect to the horizontal line of the main board 1e are attached at substantially equal intervals, and electric waveforms with each sub-board before and after burn-in are provided. Has a check terminal 7b for confirming. FIG. 19 is a plan view of a sub board similar to that of the first embodiment, and FIG. 20 is a side view thereof. 19 and 20, a package fixing socket 57 is held on the sub-board 350, and the package 47 is disposed in the package fixing socket 57. Further, a convex connector 350a for connecting to the concave connector 35 is attached to one end of the sub board 350 in the longitudinal direction. Further, an opening 350c is provided near the convex connector 350a. The convex connector 350a of the sub board 350 is replaced with the concave connector 35 of the main board 1e.
It is inserted and fitted. The wiring of the main board 1e and the sub board 350 is set so that the check terminal 7b on the main board 1e can obtain an electrically normal waveform for each sub board. In this state, the convection heat 8b is installed in the burn-in apparatus to perform burn-in.

According to the fifth embodiment, the first embodiment
Has the same effect as. In addition, the mounting angle of the sub-board to the main board is fixed by the inclination of the concave connector mounted on the main board. However, compared to the movable socket according to the other embodiments, the structure is the simplest and the mounting is stable. Can be obtained.

Embodiment 6 FIG. FIG. 21 shows a burn-in board according to the sixth embodiment. In FIG. 21, a plurality of concave connectors 35 inclined at a constant angle with respect to the horizontal line of the main board 1f are attached at substantially equal intervals on the main board 1f, and a second embodiment is provided at one end in the longitudinal direction.
A concave connector 21 for connecting to a convex connector built in a checker 73 similar to the above is provided. FIG.
FIG. 2 is a plan view of a sub board according to a sixth embodiment, and FIG.
3 shows a side view thereof. 22 and 23,
A package fixing socket 57 is provided on the sub board 370.
Is held, and the package 47 is disposed in the package fixing socket 57. Also, the sub board 37
0 has a convex connector 370a at one end in the longitudinal direction for connecting to the concave connector 35, and a concave connector at the other end for connecting to a convex connector built in the checker 73 as in the second embodiment. 370b is attached.
Further, an opening 370c is provided near the convex connector 370a.
Is provided. Convex connector 370 of sub board 370
a is inserted and attached to the concave connector 35 of the main board 1f. In this state, it is installed in a burn-in apparatus and convection heat is applied to perform burn-in.

According to the sixth embodiment, the second embodiment
Has the same effect as.

Embodiment 7 FIG. FIG. 24 shows a first example of the burn-in board according to the seventh embodiment. In FIG. 24, a plurality of movable sockets similar to those of the first embodiment are arranged on a main board 1g at substantially logarithmic intervals. The movable sockets have different inclination angles. The sub-board described in the first embodiment is mounted on the movable socket. The trajectory of the other end of the sub-board that is not mounted on the movable socket is substantially a hyperbolic spiral (r).
= A / θ), and the angle of the movable socket is adjusted and arranged on the main board 1g. In the equation r relating to the polar coordinates of the hyperbolic spiral, a indicates a radius and θ indicates a rotation angle.

In the burn-in board equipped with the sub-boards as described above, the Reynolds number Re of the convective heat is proportional to the wind speed in the burn-in apparatus. In the laminar flow region, the vortex is guided to the end on the movable socket side. The vortex that has reached the vicinity of the movable socket escapes from the gap of the movable socket and assimilates with the main flow of convection heat.

FIG. 25 shows a second embodiment of the burn-in board according to the same embodiment. In FIG. 25, on the main board 1h, a plurality of movable sockets similar to those of the first embodiment are arranged at substantially logarithmic intervals. The movable sockets have different inclination angles. The sub-board described in the first embodiment is mounted on the movable socket. The trajectory of the other end of the sub-board that is not mounted on the movable socket is substantially Lithus (r = | a /
The angle adjustment of the movable socket and the arrangement on the main board 1f are performed so as to draw √θ |). In the equation r relating to the polar coordinates of the Lichuus, a represents a radius, and θ represents a rotation angle.

In the burn-in board with the sub-board mounted as described above, the Reynolds number Re of the convection heat is proportional to the wind speed in the burn-in device, as described above.
In the case of 1,000 or more, the convection heat 8d hits the end of each sub-board that traces the trajectory, and guides the vortex to the end on the movable socket side. The vortex that has reached the vicinity of the movable socket escapes from the gap of the movable socket and assimilates with the main flow of convection heat.

According to the seventh embodiment, the first embodiment
Alternatively, compared with the burn-in board according to the third embodiment, convection heat can be applied more uniformly, and the thermal efficiency of burn-in can be improved.

Embodiment 8 FIG. FIG. 26 is an overall view of a burn-in device according to the eighth embodiment. FIG. 27 shows a state in which the burn-in board of the first embodiment is being burned in, for example. In FIG. 26, this burn-in device 1
Reference numeral 00 denotes a furnace unit 110, a heat source unit 120, and a control unit 130. The furnace unit 110 is provided with a partition 110a for supporting a burn-in board.
A fan 110b is provided at the boundary between the two. Heat source 1
Control of the heat of the fan 20, the speed of the fan 110b, and the like are performed by the control unit 130. Next, in FIG.
In the burn-in board supported by Oa, hot air 120a from the heat source unit 120 is constantly supplied by the fan 110b, and the hot air 120a is also circulated inside the furnace unit 110.

[0041]

In the burn-in board according to the present invention, a plurality of semiconductor devices to be burn-in mounted are mounted, and a first wiring board electrically connected to the semiconductor device and a first wiring board are arranged. A second wiring board electrically connected to the first wiring board, and a second wiring board provided on the second wiring board, wherein the first wiring board is inclined with respect to the second wiring board. By having a socket for holding the burn-in board, the burn-in capability per operation can be improved even if the number of burn-in boards is small.

A plurality of semiconductor devices to be subjected to burn-in processing are mounted, and a first semiconductor device electrically connected to the semiconductor devices is provided.
A second wiring board having an area in which the first wiring board is arranged, and a second wiring board electrically connected to the first wiring board; and a second wiring board provided on the first wiring board. By providing a socket for holding the first wiring board so as to be inclined with respect to the wiring board, even if the number of burn-in boards is small, the burn-in capability per operation can be further improved.

Further, in the burn-in board according to the first or second aspect, the socket has a socket for arbitrarily maintaining a relative inclination angle between the first wiring board and the second wiring board, so that burn-in work efficiency is improved. Can be improved.

In the burn-in board according to the third aspect, the socket includes a concave connector to which the first wiring board is attached, an arm fixed to the concave connector, a holder to be attached to the second wiring board, and a recess. The first wiring board is mounted at an arbitrary angle with respect to the main board by being constituted by a flexible board which is engaged with the connector and is joined to the second wiring board, and a fastening tool whose arm is fastened to the holder. The convex connector of the first wiring board and the concave connector of the socket can be freely attached and detached.

In the burn-in board according to the third aspect, the socket includes a concave connector to which the first wiring board is attached, an arm fixed to the concave connector, and a convex connector to be attached to the second wiring board. A box-shaped holder provided, a flexible board that is engaged with the concave connector and is joined to the convex connector, and a fastening tool whose arm is fastened to the box-shaped holder, so that the second wiring board is mounted on the second wiring board. It is possible to use the existing main board provided with the concave connector as it is.

Further, in the burn-in board according to the third aspect, the socket is a concave connector to which the first wiring board is attached, a protractor-type holder attached to the second wiring board and provided with an opening at a fixed angle, Tightening of the fastener by comprising a flexible board engaged with the concave connector and joined to the second wiring board, and an arm fixed to the concave connector and provided with a projection fitted into the opening of the protractor-type holder There is no need to rely on force, and the angle of the arm can be fixed easily.

In the burn-in board according to the first or second aspect of the present invention, by providing an opening in the first wiring board, heat flow is improved and convection is caused, so that heat accumulation around the package can be prevented. Therefore, it is possible to apply heat evenly to each package.

Further, in the burn-in board according to the first or second aspect, the electric waveforms of the first wiring board and the second wiring board are checked by a common checker, so that the check parts can be shared. Thus, a compact burn-in board can be configured.

Further, in the burn-in board according to the first or second aspect, a concave connector for connecting a convex connector built in the checker is attached to the first wiring board and the second wiring board. Further, it is possible to use a common confirmation component, and to configure a compact burn-in board.

Further, in the burn-in board according to the first or second aspect, the plurality of first wiring boards are inclined with respect to the second wiring board so that the trajectories of their ends draw substantially streamlines. It is possible to improve the thermal efficiency of the burn-in by holding it.

Further, in the burn-in board according to the tenth aspect, the plurality of first wiring boards are inclined with respect to the second wiring board so that the trajectories of their ends draw a substantially hyperbolic spiral. By keeping the temperature, it is possible to further improve the thermal efficiency of burn-in.

Further, in the burn-in board according to the tenth aspect, the plurality of first wiring boards are held with respect to the second wiring board so as to be inclined such that the trajectories of their ends substantially depict Lichuus. Thus, the thermal efficiency of burn-in can be further improved.

Further, a burn-in apparatus comprising the burn-in board according to any one of claims 1 to 12, a furnace section provided with a partition for supporting the burn-in board, a heat source section, and a control section. This can further improve the thermal efficiency of burn-in.

[Brief description of the drawings]

FIG. 1 is a burn-in board diagram according to a first embodiment of the present invention.

FIG. 2 is a plan view of a sub board according to the first embodiment of the present invention.

FIG. 3 is a side view of the sub board according to the first embodiment of the present invention.

FIG. 4 is a first example of the movable socket according to the first embodiment of the present invention.

FIG. 5 is a second example of the movable socket according to the first embodiment of the present invention.

FIG. 6 is a third example of the movable socket according to the first embodiment of the present invention.

FIG. 7 is a burn-in board diagram according to a second embodiment of the present invention.

FIG. 8 is a plan view of a sub board according to a second embodiment of the present invention.

FIG. 9 is a side view of a sub board according to a second embodiment of the present invention.

FIG. 10 is a plan view of a checker according to Embodiment 2 of the present invention.

FIG. 11 is a side view of a checker according to Embodiment 2 of the present invention.

FIG. 12 is a burn-in board diagram according to a third embodiment of the present invention.

FIG. 13 is a plan view of a sub board according to Embodiment 3 of the present invention.

FIG. 14 is a side view of a sub board according to Embodiment 3 of the present invention.

FIG. 15 is a burn-in board diagram according to a fourth embodiment of the present invention.

FIG. 16 is a plan view of a sub board according to a fourth embodiment of the present invention.

FIG. 17 is a side view of a sub board according to Embodiment 4 of the present invention.

FIG. 18 is a burn-in board diagram according to a fifth embodiment of the present invention.

FIG. 19 is a plan view of a sub board according to a fifth embodiment of the present invention.

FIG. 20 is a side view of a sub board according to Embodiment 5 of the present invention.

FIG. 21 is a burn-in board diagram according to a sixth embodiment of the present invention.

FIG. 22 is a plan view of a sub board according to a sixth embodiment of the present invention.

FIG. 23 is a side view of a sub board according to Embodiment 6 of the present invention.

FIG. 24 is a first example of the burn-in board according to the seventh embodiment of the present invention.

FIG. 25 is a second example of the burn-in board according to the seventh embodiment of the present invention.

FIG. 26 is an overall view of a burn-in device according to an eighth embodiment of the present invention.

FIG. 27 is a burn-in state diagram according to an eighth embodiment of the present invention.

FIG. 28 is a configuration diagram of a conventional burn-in board.

FIG. 29 is a side view of a conventional burn-in board.

FIG. 30 is a connection diagram of a conventional small burn-in board.

FIG. 31 is a plan view of a conventional small burn-in board.

FIG. 32 is a side view of a conventional small burn-in board.

FIG. 33 is a side view of a conventional burn-in board.

FIG. 34 is a plan view of a conventional sub-board.

FIG. 35 is a side view of a conventional sub board.

FIG. 36 is a perspective view of a conventional burn-in board.

[Explanation of symbols]

1a Main board 1b
Main board 1c Main board 1d
Main board 1e Main board 1f
Main board 1g Main board 1h
Main board 2 Recessed connector 3
Sub board 3c Opening 20 Recessed connector 21
Recessed connector 30 Movable socket 31
Movable socket 30a Recessed connector 30b
Arm 30c Screw 30d
Holder 30e Flexible board 31a Recessed connector 31d
Box-shaped holder 31e Flexible board 31f
Convex connector 32 Movable socket 32b Arm 32d
Protractor type holder 32g Opening 32h
Projection 33 Movable socket 35
Recessed connector 40 Package 70 Checker 71
Checker 73 Checker 100 Burn-in device 300 Sub-board 300b
Recessed connector 310 Sub board 310c
Opening 330 Sub-board 330b
Recessed connector 350 Sub board 350c
Opening 370 Sub board 370b
Recessed connector

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[Procedure amendment]

[Submission date] November 18, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 13

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

Further, a burn-in board according to any one of claims 1 to 12, a furnace section provided with a partition for supporting the burn-in board, and a fan at a boundary between the furnace section and the furnace section.
The heat source section where the fan is provided , and the heat adjustment and fan of the heat source section
And a control unit for adjusting the fan speed .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0053

[Correction method] Change

[Correction contents]

Further, a burn-in board according to any one of claims 1 to 12, a furnace section provided with a partition for supporting the burn-in board, and a fan at a boundary between the furnace section and the furnace section.
The heat source section where the fan is provided , and the heat adjustment and fan of the heat source section
By using a burn-in device including a control unit for adjusting the fan speed, it is possible to further improve the burn-in thermal efficiency.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsu Kumaki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (13)

[Claims] A first semiconductor device on which a burn-in process is to be performed, and a first semiconductor device electrically connected to the semiconductor device;
And a region in which the first wiring board is disposed, wherein the first
A second wiring board electrically connected to the second wiring board; and a socket provided on the second wiring board and holding the first wiring board so as to be inclined with respect to the second wiring board. And a burn-in board having. 2. A first semiconductor device on which a plurality of semiconductor devices to be subjected to a burn-in process are mounted and electrically connected to the semiconductor device.
And a region in which the first wiring board is disposed, wherein the first
A second wiring board electrically connected to the first wiring board; and a socket provided on the first wiring board and holding the first wiring board so as to be inclined with respect to the second wiring board. And a burn-in board having. 3. The burn-in board according to claim 1, further comprising a socket for arbitrarily maintaining a relative inclination angle between the first wiring board and the second wiring board. 4. A socket having a concave connector to which a first wiring board is attached, an arm fixed to the concave connector, a holder attached to a second wiring board, and a second connector which is engaged with the concave connector and engages with the second connector. 4. The burn-in board according to claim 3, wherein the burn-in board is composed of a flexible board joined to the wiring board, and a clamp for clamping the arm to the holder. 5. 5. A socket comprising: a concave connector to which a first wiring board is attached; an arm fixed to said concave connector; and a box-shaped holder provided with a convex connector to be attached to a second wiring board. 4. The burn-in board according to claim 3, wherein said flexible board is engaged with said concave connector and joined to said convex connector, and said arm is fastened to said box-shaped holder. 6. A socket having a concave connector to which a first wiring board is attached, a protractor-type holder attached to a second wiring board and having an opening provided at a predetermined angle, and a second connector which is engaged with the concave connector and has a second connector. 4. The burn-in board according to claim 3, wherein the burn-in board comprises a flexible board bonded to a wiring board, and an arm provided with a projection fixed to the concave connector and fitted into an opening of the protractor-type holder. 7. The burn-in board according to claim 1, wherein an opening is provided in the first wiring board. 8. An electric waveform of the first wiring substrate and the second wiring substrate is confirmed by a common confirmer.
Or the burn-in board according to claim 2. 9. The burn-in board according to claim 8, wherein a concave connector for connecting a convex connector built in the checker is attached to the first wiring board and the second wiring board. 10. The method according to claim 1, wherein the plurality of first wiring boards are held with respect to the second wiring board so that the trajectories of their ends are substantially streamlined. Burn-in board. 11. The burn-in board according to claim 10, wherein the plurality of first wiring boards are held with respect to the second wiring board so that the trajectories of their ends draw a substantially hyperbolic spiral. . 12. The burn-in board according to claim 10, wherein a plurality of the first wiring boards are held with respect to the second wiring board so that the trajectories of their ends are drawn substantially in the form of Litchus. 13. A burn-in apparatus comprising: the burn-in board according to claim 1; a furnace section provided with a partition for supporting the burn-in board; a heat source section; and a control section.