JPH115160A - Solder wire delivery device - Google Patents

Solder wire delivery device

Info

Publication number
JPH115160A
JPH115160A JP15632797A JP15632797A JPH115160A JP H115160 A JPH115160 A JP H115160A JP 15632797 A JP15632797 A JP 15632797A JP 15632797 A JP15632797 A JP 15632797A JP H115160 A JPH115160 A JP H115160A
Authority
JP
Japan
Prior art keywords
thread solder
solder
solder wire
wire
thread
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15632797A
Other languages
Japanese (ja)
Other versions
JP3287271B2 (en
Inventor
Moriaki Kawasaki
守亮 川▲さき▼
Masayoshi Ueda
昌良 植田
Tamotsu Ikeda
保 池田
Nobuyuki Haji
信幸 土師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15632797A priority Critical patent/JP3287271B2/en
Publication of JPH115160A publication Critical patent/JPH115160A/en
Application granted granted Critical
Publication of JP3287271B2 publication Critical patent/JP3287271B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Forwarding And Storing Of Filamentary Material (AREA)
  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)

Abstract

PROBLEM TO BE SOLVED: To stably deliver a fine soldering wire by making a fine solder wire delivery rollers with a rubber which is softer than the soldering wire so that the soldering wire can be delivered without being crushed. SOLUTION: The solder wire 1 is pulled out from a roll 2 and guided to the delivery rollers 3.3 via a solder wire cut detecting unit 5. The delivery rollers 3.3 rotate by a signal from a solder wire delivery controller 8 and, deliver the solder wire to the wire stick detecting unit 6. The solder wire 1 comes into a solder wire aiming position fine adjustment unit 9 via a delivery tube 7 to be guided to the soldering part after its aiming position is finely adjusted. Because the delivery rollers 3.3 made of rubber is softer than the solder wire 1, the solder wire 1 can be guided to the soldering part through the delivery tube 7 and the solder wire aiming position fine adjustment unit 9 without being crushed. As the cross-section face of the solder wire 1 is not changed, it does not stuck driving the course of delivery route.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は例えば、電子部品の
はんだ付け等の局部非接触加熱源として利用される光ビ
ーム加熱装置等に用いられる糸はんだ送給装置に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thread solder feeding device used for a light beam heating device or the like used as a local non-contact heating source for, for example, soldering electronic components.

【0002】[0002]

【従来の技術】従来、例えば光ビーム加熱装置を用いて
電子部品等をはんだ付けする場合、はんだにはクリーム
はんだ又は糸はんだを使用する。この糸はんだを使用す
る場合、光ビーム加熱装置に用いる糸はんだ送給装置は
従来、図3のような構成であった。その構成について図
3と図4に沿って説明する。
2. Description of the Related Art Conventionally, when soldering electronic parts or the like using a light beam heating device, cream solder or thread solder is used as the solder. When this thread solder is used, the thread solder feeding device used for the light beam heating device has conventionally been configured as shown in FIG. The configuration will be described with reference to FIGS.

【0003】図3において、1は糸はんだ、2は前記糸
はんだ1を巻き付けたリール、3a、3aは糸はんだ1
の送りローラであり、それらの間隔は、使用する糸はん
だ径に合わせて調整される。また、送りローラ3aは金
属製であり、送給中に糸はんだ1が滑らないように送給
方向と垂直にローレットが刻んである。4は送りローラ
3a、3aを駆動するモータである。5は糸はんだ切れ
検出機構であり、糸はんだ1が途中で途切れることなく
送りローラ3aに正常に導入されているかどうかを検出
する。6は糸はんだつまり検出機構であり、糸はんだつ
まり検出機構6は、糸はんだ1が何らかの原因で送給チ
ューブ7以降で詰まる等で異常停止した場合、その状態
を検出する。8は糸はんだ送給コントローラであり、前
記モータ4に制御信号を送り、送りローラ3aの回転を
制御する。9は糸はんだねらい位置微調整機構であり、
先端部の位置を微調整する機構となっている。
In FIG. 3, 1 is a thread solder, 2 is a reel around which the thread solder 1 is wound, and 3a and 3a are thread solders 1.
And the distance between them is adjusted according to the diameter of the thread solder used. The feed roller 3a is made of metal, and has a knurl perpendicular to the feeding direction so that the thread solder 1 does not slip during feeding. A motor 4 drives the feed rollers 3a, 3a. Reference numeral 5 denotes a thread solder breakage detecting mechanism, which detects whether or not the thread solder 1 is normally introduced into the feed roller 3a without interruption. Reference numeral 6 denotes a thread solder clogging detection mechanism. If the thread solder 1 clogs after the feed tube 7 for some reason and stops abnormally, the thread solder clogging detection mechanism 6 detects the state. Reference numeral 8 denotes a thread solder feeding controller which sends a control signal to the motor 4 to control the rotation of the feed roller 3a. 9 is a fine adjustment mechanism for the position of the thread solder,
It is a mechanism for finely adjusting the position of the tip.

【0004】以上のように構成された糸はんだ送給装置
について、以下その動作について説明する。糸はんだ1
はリール2より引き出され、糸はんだ切れ検出機構5を
通って送りローラ3aまで導かれる。そして、送りロー
ラ3aは糸はんだ送給コントローラ8からの信号により
回転し、導出された糸はんだ1を挟んで糸はんだつまり
検出機構6まで送り出すが、送りローラ3aの間隔が広
いと糸はんだ1がすべり、安定して送給できなくなるた
め糸はんだ1は図4のように送りローラ3aによって圧
接され、潰されながら送り出される。送り出された糸は
んだ1は糸はんだつまり検出機構6を経由して、送給チ
ューブ7を介して糸はんだねらい位置微調整機構9に入
り、ねらい位置を微調整され、はんだ付け部まで導かれ
るものである。
[0004] The operation of the yarn solder feeding device configured as described above will be described below. Thread solder 1
Is pulled out from the reel 2 and guided to the feed roller 3a through the thread solder breakage detecting mechanism 5. Then, the feed roller 3a is rotated by a signal from the thread solder feed controller 8, and sends out the thread solder 1 to the detection mechanism 6 with the derived thread solder 1 interposed therebetween. Since slipping and stable feeding cannot be achieved, the thread solder 1 is pressed by the feeding roller 3a as shown in FIG. 4, and is sent out while being crushed. The sent-out wire solder 1 passes through the wire solder, that is, the detection mechanism 6, and enters the thread solder aim position fine-adjustment mechanism 9 via the feeding tube 7, where the aim position is finely adjusted and guided to the soldering portion. It is.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記従来
の糸はんだ送給装置においては、送給チューブ7や糸は
んだねらい位置微調整機構9の内部は、糸はんだ1の送
り量を安定して送給し、かつ、糸はんだ供給位置の安定
性のため、糸はんだ1との遊びがほとんどなく、そのた
め送りローラ3aの間隔が狭く調整されると、糸はんだ
1が潰されすぎて送給チューブ7や糸はんだねらい位置
微調整機構9の内部で摺動抵抗となり詰まりやすくな
る。そのため送りローラ3aの間隔の調整は非常に難し
い作業となっており、また、特にφ0.2mm以下の極
細径の糸はんだの場合には、潰されることにより剛性が
さらに低下して送給経路途中で詰まりやすくなり、安定
して送給できないという問題点を有していた。
However, in the above-mentioned conventional thread solder feeding apparatus, the feed tube 7 and the inside of the thread solder aiming position fine adjustment mechanism 9 stably feed the thread solder 1 in an amount to be fed. In addition, due to the stability of the thread solder supply position, there is almost no play with the thread solder 1, and therefore, if the distance between the feed rollers 3 a is adjusted to be small, the thread solder 1 is crushed too much and the feed tube 7 or Sliding resistance is generated inside the fine adjustment mechanism 9 for the purpose of controlling the position of the thread solder, so that clogging easily occurs. Therefore, it is very difficult to adjust the interval between the feed rollers 3a. In particular, in the case of an ultra-fine thread solder having a diameter of 0.2 mm or less, the rigidity is further reduced by being crushed, and the middle of the feed path is reduced. And it was difficult to feed the paper stably.

【0006】本発明は上記従来の問題点を解決するもの
で、糸はんだ1を潰さずに送給することにより、送給チ
ューブ7や糸はんだねらい位置微調整機構9の内部で詰
まることがなく、細径の糸はんだでも安定して送給でき
る、糸はんだ送給装置を提供することを目的とする。
The present invention solves the above-mentioned conventional problems. By feeding the wire solder 1 without crushing it, it is possible to prevent the feed tube 7 and the wire solder aiming position fine adjustment mechanism 9 from being clogged. Another object of the present invention is to provide a thread solder feeding device capable of stably feeding even a small diameter thread solder.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に本発明は、糸はんだの送りローラと、前記送りローラ
を駆動するモータと、糸はんだ切れを検出する手段と、
糸はんだのつまりを検出する手段と、前記モータと検出
手段群を制御する制御手段と、糸はんだをはんだ付け部
まで導くガイド手段とを備え糸はんだ送給装置であっ
て、糸はんだの送りローラを糸はんだより柔らかいゴム
製とし、糸はんだが潰されないように送給するものであ
る。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a thread solder feed roller, a motor for driving the feed roller, a means for detecting thread solder breakage,
A thread solder feeding device comprising: means for detecting clogging of thread solder; control means for controlling the motor and a group of detecting means; and guide means for guiding the thread solder to a soldering portion. Is made of rubber which is softer than the thread solder, and is fed so that the thread solder is not crushed.

【0008】[0008]

【発明の実施の形態】上記構成により、糸はんだは潰さ
れずに送りローラによって送り出されるため、ガイド手
段等の送給経路途中で摺動抵抗となって詰まることなく
円滑にはんだ付け部に送給されるという作用を有する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the above configuration, since the thread solder is sent out by the feed roller without being crushed, it is smoothly fed to the soldering portion without being clogged due to sliding resistance in the feeding path of the guide means and the like. It has the effect of being done.

【0009】以下本発明の一実施例について、図1およ
び図2を参照しながら説明する。図1は本発明の実施の
形態の糸はんだ送給装置の構成を示すものである。図1
において、図1は糸はんだ、2は糸はんだ1を巻き付け
たリールである。3,3はゴム製の送りローラで、この
送りローラ3,3の間隔は、使用する糸はんだ径に関係
なく一定の間隔となっている。4は送りローラ3,3を
駆動するモータ。5は糸はんだ切れ検出機構であり、糸
はんだ1が途中で切れることなく送りローラ3に正常に
導入されているかどうかを検出する。6は糸はんだつま
り検出機構で、この糸はんだつまり検出機構6は、糸は
んだ1が何らかの原因で送給チューブ7以降で詰まる等
で異常停止した場合、その状態を検出する。8は糸はん
だ送給コントローラであり、モータ4に制御信号を送
り、送りローラ3,3の回転を制御する。9は糸はんだ
ねらい位置微調整機構であり、先端部の位置を微調整す
る機構となっている。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 shows a configuration of a thread solder feeding device according to an embodiment of the present invention. FIG.
In FIG. 1, FIG. 1 shows a reel around which a solder wire 2 is wound. Reference numerals 3 and 3 denote rubber feed rollers, and the interval between the feed rollers 3 and 3 is constant regardless of the diameter of the thread solder used. Reference numeral 4 denotes a motor for driving the feed rollers 3 and 3. Reference numeral 5 denotes a thread solder break detecting mechanism, which detects whether the thread solder 1 is normally introduced into the feed roller 3 without being cut off in the middle. Reference numeral 6 denotes a thread solder clogging detection mechanism. When the thread solder clogging detection mechanism 6 is stopped abnormally due to clogging of the feed tube 7 and thereafter for some reason, the state is detected. Reference numeral 8 denotes a thread solder feed controller which sends a control signal to the motor 4 to control the rotation of the feed rollers 3 and 3. Reference numeral 9 denotes a thread soldering target position fine adjustment mechanism, which is a mechanism for finely adjusting the position of the tip end.

【0010】以上のように構成された糸はんだ送給装置
について、以下その動作について説明する。糸はんだ1
はリール2より引き出され、糸はんだ切れ検出機構5を
通って送りローラ3,3まで導かれる。そして、送りロ
ーラ3,3は糸はんだ送給コントローラ8からの信号に
より回転し、導かれた糸はんだ1を図2のように挟んで
糸はんだつまり検出機構6まで送り出す。さらに、送り
出された糸はんだ1は糸はんだつまり検出機構6を経由
して、送給チューブ7を介して糸はんだねらい位置微調
整機構9に入り、ねらい位置を微調整され、はんだ付け
部まで導かれる。本実施の形態のゴム製の送りローラ
3,3は糸はんだ1よりも柔らかく、そのため糸はんだ
1は潰されずに送給チューブ7、糸はんだねらい位置微
調整機構9を通って、はんだ付け部まで導かれる。さら
に、糸はんだ1の断面形状が変化しないので送給経路中
で抵抗となって詰まることがなく、細径の糸はんだでも
安定して送給することができる効果を有する。
The operation of the yarn soldering apparatus configured as described above will be described below. Thread solder 1
Is pulled out from the reel 2 and is guided to the feed rollers 3 and 3 through the thread solder breakage detecting mechanism 5. Then, the feed rollers 3, 3 are rotated by a signal from the thread solder feed controller 8, and feed the guided thread solder 1 to the thread solder, that is, to the detection mechanism 6, as shown in FIG. Further, the sent wire solder 1 passes through the wire solder blockage detecting mechanism 6 and enters the thread solder aiming position fine adjustment mechanism 9 via the feeding tube 7, and the aim position is finely adjusted and guided to the soldering portion. I will The rubber-made feed rollers 3 and 3 of this embodiment are softer than the thread solder 1, so that the thread solder 1 is not crushed, passes through the feed tube 7, the thread solder aiming position fine adjustment mechanism 9, and reaches the soldering portion. Be guided. Furthermore, since the cross-sectional shape of the thread solder 1 does not change, there is no resistance and clogging in the feeding path, and there is an effect that even small-diameter thread solder can be stably fed.

【0011】[0011]

【発明の効果】以上の説明から明らかなように、本発明
の糸はんだ送給装置は、糸はんだよりも柔らかいゴム製
の送りローラにより糸はんだを送給するため糸はんだは
潰されず、したがって、送給経路中で摺動抵抗となって
つまることなく、細径の糸はんだの場合でも安定して送
給することが可能となる優れた効果を奏するものであ
る。
As is clear from the above description, the thread solder feeding apparatus of the present invention feeds the thread solder by a rubber feed roller which is softer than the thread solder, so that the thread solder is not crushed. This provides an excellent effect that the wire can be stably fed even in the case of a small-diameter thread solder without becoming a sliding resistance in the feeding path and becoming boring.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態における糸はんだ送給装置
の全体構成を示す概略ブロック構成図
FIG. 1 is a schematic block diagram showing the overall configuration of a thread solder feeding device according to an embodiment of the present invention.

【図2】同糸はんだ送給装置の送りローラ部の一部拡大
側断面図
FIG. 2 is a partially enlarged side cross-sectional view of a feed roller portion of the thread solder feeding device.

【図3】従来の糸はんだ送給装置の全体構成を示す概略
ブロック構成図
FIG. 3 is a schematic block diagram showing the entire configuration of a conventional thread solder feeding device.

【図4】従来の糸はんだ送給装置の送りローラ部の一部
拡大側断面図
FIG. 4 is a partially enlarged side sectional view of a feed roller portion of a conventional thread solder feeding device.

【符号の説明】[Explanation of symbols]

1 糸はんだ 2 リール 3 ゴム製の送りローラ 4 モータ 5 糸はんだ切れ検出機構(糸はんだ切れを検出する手
段) 6 糸はんだつまり検出機構(糸はんだのつまりを検出
する手段) 7 送給チューブ(ガイド手段) 8 糸はんだ送給コントローラ(モータと検出手段群を
制御する制御手段) 9 糸はんだねらい位置微調整機構(ガイド手段)
DESCRIPTION OF SYMBOLS 1 Thread solder 2 Reel 3 Rubber feed roller 4 Motor 5 Thread solder break detection mechanism (means for detecting breakage of thread solder) 6 Thread solder blockage detection mechanism (means for detecting blockage of thread solder) 7 Feed tube (guide) Means) 8 thread solder feed controller (control means for controlling motor and detection means group) 9 thread solder aim position fine adjustment mechanism (guide means)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 土師 信幸 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Nobuyuki Hashi 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 糸はんだを送る送りローラと、前記送り
ローラを駆動するモータと、糸はんだ切れを検出する手
段と、糸はんだのつまりを検出する手段と、前記モータ
および検出手段群を制御する制御手段と、糸はんだをは
んだ付け部まで導くガイド手段とを備えた糸はんだ送給
装置であって、糸はんだの送りローラを糸はんだよりも
柔らかいゴム製とし、糸はんだが潰されないよう送給す
る糸はんだ送給装置。
1. A feed roller for feeding thread solder, a motor for driving the feed roller, a means for detecting breakage of thread solder, a means for detecting clogging of thread solder, and controlling the motor and a group of detection means. What is claimed is: 1. A thread solder feeder comprising a control means and a guide means for guiding thread solder to a soldering part, wherein a feed roller for thread solder is made of rubber softer than thread solder, and is fed so that the thread solder is not crushed. Thread solder feeding device.
JP15632797A 1997-06-13 1997-06-13 Thread solder feeder Expired - Fee Related JP3287271B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15632797A JP3287271B2 (en) 1997-06-13 1997-06-13 Thread solder feeder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15632797A JP3287271B2 (en) 1997-06-13 1997-06-13 Thread solder feeder

Publications (2)

Publication Number Publication Date
JPH115160A true JPH115160A (en) 1999-01-12
JP3287271B2 JP3287271B2 (en) 2002-06-04

Family

ID=15625370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15632797A Expired - Fee Related JP3287271B2 (en) 1997-06-13 1997-06-13 Thread solder feeder

Country Status (1)

Country Link
JP (1) JP3287271B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114333253A (en) * 2021-12-23 2022-04-12 江苏蓝慧智能装备科技有限公司 Solder strip surface tin nodule detection alarm device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114333253A (en) * 2021-12-23 2022-04-12 江苏蓝慧智能装备科技有限公司 Solder strip surface tin nodule detection alarm device
CN114333253B (en) * 2021-12-23 2023-04-07 江苏蓝慧智能装备科技有限公司 Solder strip surface tin nodule detection alarm device

Also Published As

Publication number Publication date
JP3287271B2 (en) 2002-06-04

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