JPH1147918A - Method for preventing fused-stickiness of molten solder - Google Patents
Method for preventing fused-stickiness of molten solderInfo
- Publication number
- JPH1147918A JPH1147918A JP21980697A JP21980697A JPH1147918A JP H1147918 A JPH1147918 A JP H1147918A JP 21980697 A JP21980697 A JP 21980697A JP 21980697 A JP21980697 A JP 21980697A JP H1147918 A JPH1147918 A JP H1147918A
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- liquid level
- solder
- fused
- sulfide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemical Treatment Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動はんだ付け装
置のはんだ槽やはんだ槽の液面を電気的に接触させて液
面高さを検知する液面センサー等の部材に溶融はんだが
融着しないようにする方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus, in which molten solder is fused to members such as a solder tank and a liquid level sensor for detecting a liquid level by bringing the liquid level of the solder tank into electrical contact. Regarding how not to.
【０００２】はんだ槽や液面センサー等は溶融はんだが
融着してはならないものであるため、従来のはんだ槽や
液面センサーはステンレスで作製されていた。その理由
は、ステンレスは鉄、ニッケル、クロムから成る合金で
あり、表面に強固なクロムの酸化膜が形成されているこ
とから、溶融はんだが該被膜によって融着しにくくなる
からである。つまり溶融はんだが融着するということ
は、清浄な金属面に溶融はんだが原子的に拡散して、は
んだ付けがなされる現象であるが、金属表面が非金属、
即ち酸化膜で覆われていると、溶融はんだは金属に直接
接触できなくなるため、溶融はんだが融着しなくなる。Conventional solder baths and liquid level sensors have been made of stainless steel because the molten solder must not be fused to the solder bath or liquid level sensor. The reason is that stainless steel is an alloy composed of iron, nickel and chromium, and since a strong chromium oxide film is formed on the surface, the molten solder is less likely to be fused by the coating. In other words, fusion of molten solder is a phenomenon in which molten solder is diffused atomically on a clean metal surface and soldering is performed.
That is, if the molten solder is covered with the oxide film, the molten solder cannot directly contact the metal, so that the molten solder does not fuse.
【０００３】このようにステンレスは、表面が強固な酸
化クロムの被膜で覆われているため、溶融はんだが融着
しないものであるが、この酸化膜でも機械的、或いは化
学的に除去されると、清浄な金属面が露出して溶融はん
だが融着してしまうものである。Since the surface of stainless steel is covered with a strong chromium oxide film as described above, the molten solder is not fused. However, even if this oxide film is mechanically or chemically removed, In this case, a clean metal surface is exposed and molten solder is fused.
【０００４】ステンレスの酸化膜が機械的に除去される
状態とは、たとえばステンレスでできたはんだ槽におい
て、溶融はんだに没した部分にはんだの酸化物が融着し
た場合、金ヘラでこの酸化物を掻き取るが、このとき金
ヘラでステンレス表面を傷付けてしまう状態である。こ
のようにステンレスが傷つけられると、この傷の部分の
酸化膜が除去されて清浄な金属が露出してしまい、周囲
にあった溶融はんだが、この傷の部分と融着してしま
う。[0004] The state in which the oxide film of stainless steel is mechanically removed means that, for example, in a solder bath made of stainless steel, when the oxide of the solder is fused to a portion immersed in the molten solder, the oxide is applied with a gold spatula. At this time, the surface of the stainless steel is damaged by the gold spatula. When the stainless steel is damaged in this way, the oxide film at the scratched portion is removed, and the clean metal is exposed, and the molten solder around the melted portion fuses with the scratched portion.
【０００５】またステンレスの酸化膜が化学的に除去さ
れる状態とは、酸化膜が付中のハロゲンに侵されて除去
されることである。自動はんだ付け装置では、フラック
スを用いてプリント基板のはんだ付けを行うが、フラッ
クス中にはフッ素や塩素等のハロゲンが含まれているた
め、自動はんだ付け装置で長期間はんだ付けを行ってい
ると、はんだ槽のステンレスがフラックス中のハロゲン
に侵されて酸化膜が除去され、溶融はんだが融着してし
まうものである。[0005] The state in which the oxide film of stainless steel is chemically removed means that the oxide film is removed by being attacked by halogen being applied. With an automatic soldering machine, soldering of a printed circuit board is performed using a flux.However, since the flux contains halogen such as fluorine and chlorine, soldering has been performed for a long time with the automatic soldering machine. In addition, the stainless steel in the solder bath is attacked by the halogen in the flux, the oxide film is removed, and the molten solder is fused.
【０００６】はんだ槽に溶融はんだが融着してしまう
と、溶融はんだはステンレスの中方に拡散が進行してゆ
き、ついにははんだ槽のステンレスに穴をあけてしま
い、該穴から溶融はんだがこぼれ出すという事故を起こ
す。[0006] When the molten solder is fused to the solder bath, the diffusion of the molten solder proceeds into the stainless steel, and eventually a hole is made in the stainless steel in the solder bath, and the molten solder spills out of the hole. Cause an accident of taking out.
【０００７】また自動はんだ付け装置のはんだ槽では、
溶融はんだをノズルから噴流させ、この噴流した溶融は
んだに走行してくるプリント基板を接触させてはんだ付
けを行うものであるが、はんだ槽内の溶融はんだの液面
が所定の高さになっていないと正常なはんだ付けができ
ない。つまり、はんだ槽の液面が低いとプリント基板が
溶融はんだに接触できずに未はんだとなってしまい、ま
た逆にはんだ槽の液面が高すぎるとプリント基板の上面
にはんだが被って不必要箇所に融着してしまう。In a solder bath of an automatic soldering apparatus,
Molten solder is jetted from the nozzle, and the printed printed circuit board is brought into contact with the jetted molten solder to perform soldering.However, the liquid level of the molten solder in the solder bath is at a predetermined height. Otherwise, normal soldering cannot be performed. In other words, if the liquid level in the solder bath is low, the printed circuit board will not be able to contact the molten solder and will be unsoldered. Conversely, if the liquid level in the solder bath is too high, the upper surface of the printed circuit board will be unnecessarily covered with solder. It will fuse to the spot.
【０００８】そのため自動はんだ付け装置では、はんだ
槽の液面を液面センサーで監視し、液面を常に一定に保
つようにしている。この液面センサーとは、先端が鋭く
尖ったステンレスの丸棒を用い、ステンレスの丸棒を溶
融はんだの液面に接触させておく。このステンレスの丸
棒と溶融はんだ間に電気を通じておき、溶融はんだの液
面が下がったときにステンレスの丸棒と液面とが離れて
電気が切れるが、この電気が切れた信号によりはんだ自
動供給装置を稼働させて、はんだ槽にはんだを供給す
る。そしてはんだの供給で液面が所定の高さに回復した
ならば、液面センサーが液面と接触して電気が通電し、
その信号ではんだ自動供給装置を止める。つまり液面セ
ンサーは、はんだの液面と接したり、離れたりすること
により信号を発するものである。Therefore, in the automatic soldering apparatus, the liquid level in the solder bath is monitored by a liquid level sensor so that the liquid level is always kept constant. This liquid level sensor uses a stainless steel round bar with a sharp pointed tip, and the stainless steel round bar is brought into contact with the liquid level of the molten solder. Electricity is passed between the stainless steel round bar and the molten solder, and when the liquid level of the molten solder drops, the stainless steel round bar separates from the liquid level and the electricity is cut off. Start the equipment and supply solder to the solder bath. Then, when the liquid level recovers to a predetermined level by supplying the solder, the liquid level sensor contacts the liquid level and electricity is supplied,
At that signal, the automatic solder feeder is stopped. That is, the liquid level sensor emits a signal when it comes into contact with or separates from the liquid level of the solder.
【０００９】ところで、この液面センサーに溶融はんだ
が融着すると、液面が下がって、本来液面センサーと液
面とが離れる状態になっても、液面センサーに融着した
溶融はんだとはんだ槽内の溶融はんだとがつながったま
まとなり、適正な信号を送れなくなる。By the way, when the molten solder is fused to the liquid level sensor, the liquid level is lowered, and even if the liquid level sensor and the liquid surface are originally separated from each other, the molten solder and the solder fused to the liquid level sensor may be used. The molten solder in the bath remains connected, and an appropriate signal cannot be sent.
【００１０】従来より、はんだ槽に溶融はんだが融着し
ないようにするために、フッ素樹脂をコーティングする
ことがなされていた（特開昭６１−８２９６６号）。フ
ッ素樹脂は溶融はんだの融着を防止する効果を有し、し
かも耐熱性があってはんだ付け温度でも充分耐えられる
ものである。Conventionally, a fluorine resin has been coated in order to prevent the molten solder from being fused to the solder bath (Japanese Patent Application Laid-Open No. 61-82966). Fluororesin has an effect of preventing fusion of molten solder, and has heat resistance and can withstand soldering temperature sufficiently.
【００１１】[0011]
【発明が解決しようとする課題】しかしながらフッ素樹
脂のコーティングは、ステンレスとの接着が強固でな
く、金ヘラで掻いたり、物が当たったりすると簡単に剥
離してしまうものであった。またフッ素樹脂は絶縁物で
あるため、液面センサーに用いた場合は、溶融はんだと
接触しても溶融はんだとの通電がなく、液面センサーと
しては全く用をなさないものであった。本発明は、ステ
ンレスと溶融はんだの融着を完全に防止するばかりでな
く、液面センサーとしても通電性のある表面が得られる
方法を提供することにある。However, the fluororesin coating has a poor adhesion to stainless steel, and easily peels off when scratched or hit by an object with a gold spatula. Further, since the fluororesin is an insulating material, when it is used for a liquid level sensor, it does not conduct electricity with the molten solder even when it comes into contact with the molten solder, and thus has no use as a liquid level sensor. An object of the present invention is to provide a method that not only completely prevents fusion of stainless steel and molten solder but also obtains a conductive surface as a liquid level sensor.
【００１２】[0012]
【課題を解決するための手段】本発明者がステンレスに
酸化膜が形成されていたり、フッ素樹脂がコーティング
されていても、溶融はんだがステンレスに融着してしま
う原因について鋭意研究を重ねた結果、酸化膜やフッ素
樹脂は金属表面に付着した状態で金属表面を覆っている
ものであるため、機械的、或いは化学的行為で剥離した
り、反応したりするものであることが分かった。そこで
本発明者は、金属表面に非金属が侵入した状態になって
いれば、金属的、化学的な行為がなされても、該非金属
は剥離したり、反応したりしないことに着目して本発明
を完成させた。Means for Solving the Problems The inventor of the present invention has conducted intensive studies on the cause of the fusion of the molten solder to the stainless steel even when the stainless steel has an oxide film or is coated with a fluorine resin. Since the oxide film and the fluororesin cover the metal surface while adhering to the metal surface, it has been found that the oxide film and the fluororesin are peeled off or reacted by mechanical or chemical action. Therefore, the present inventor paid attention to the fact that if a nonmetal invaded the metal surface, the nonmetal would not peel or react even if a metallic or chemical action was performed. Completed the invention.
【００１３】本発明は、溶融はんだの融着を嫌う部材
を、溶融状態の硫黄を含むアルカリ金属塩中に浸漬し
て、該部材表面に硫化物と窒化物を主体とした化合物層
を生成させたことを特徴とする溶融はんだの融着防止方
法である。According to the present invention, a member which refuses to fuse molten solder is immersed in a molten sulfur-containing alkali metal salt to form a compound layer mainly composed of sulfide and nitride on the surface of the member. This is a method for preventing fusion of molten solder.
【００１４】[0014]
【発明の実施の形態】本発明では、硫黄を含む塩化リチ
ウム、塩化ナトリウム、塩化カリウム、等のアルカリ金
属塩を溶融させ、該溶融塩中に部材を一定時間浸漬す
る。すると部材表面に硫化物と窒化物を主体とした化合
物と窒素が拡散するようになる。このように部材表面に
硫化物や窒化物が拡散すると表面が清浄な金属とならな
いため、溶融はんだが融着しない。またこれらの硫化物
や窒化物は金属表面を覆っているのではなく、表面から
１０〜２０μｍの深さに形成されており、それ故、機械
的化学的行為がなされても剥離したり、反応したりしな
い。本発明で溶融はんだを融着させない部材としては、
ステンレスの他、鉄合金である。DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, an alkali metal salt such as lithium chloride, sodium chloride, potassium chloride or the like containing sulfur is melted, and the member is immersed in the molten salt for a certain period of time. Then, a compound mainly composed of sulfides and nitrides and nitrogen diffuse into the surface of the member. If sulfides or nitrides diffuse on the surface of the member in this manner, the surface does not become a clean metal, and thus the molten solder does not fuse. In addition, these sulfides and nitrides do not cover the metal surface, but are formed at a depth of 10 to 20 μm from the surface. Do not do. As a member that does not fuse the molten solder in the present invention,
Other than stainless steel, it is an iron alloy.
【００１５】[0015]
【実施例】Ｋ2ＳＯ4、ＬｉＣｌ、ＫＣｌからなる金属塩
を５６５℃に溶融保持し、この溶融金属塩中に先を尖ら
せたステンレスの丸棒を９０分間浸漬処理した。そして
このステンレス棒を自動はんだ付け装置のはんだ槽の液
面センサーとして使用して、３ケ月後にステンレス丸棒
の先端を観察したが、溶融はんだの融着は全くなかっ
た。また、該液面センサーは、はんだ槽の溶融はんだに
浸漬されているときは通電しており、はんだ槽の液面が
下がって、先端が液面から少しでも上の位置になると完
全に液面と離れて通電が切れるという信頼性のある液面
検知が行われていた。この液面センサーを溶融はんだ中
に浸漬し、浸漬した部分を金ヘラで擦っても溶融はんだ
は融着しなかった。EXAMPLE A metal salt composed of K 2 SO 4 , LiCl and KCl was melted and held at 565 ° C., and a sharpened stainless steel rod was immersed in the molten metal salt for 90 minutes. The stainless steel bar was used as a liquid level sensor in a solder bath of an automatic soldering apparatus, and after 3 months, the tip of the stainless steel round bar was observed, but there was no fusion of the molten solder. The liquid level sensor is energized when it is immersed in the molten solder in the solder tank, and when the liquid level of the solder tank drops and the tip is slightly above the liquid level, the liquid level sensor is completely , The liquid level detection was performed with reliability. Even if this liquid level sensor was immersed in the molten solder and the immersed portion was rubbed with a gold spatula, the molten solder was not fused.
【００１６】一方、何の処理もしていない先を尖らせた
ステンレスの丸棒を同様に液面センサーとして３ケ月使
用したところ、この先端に溶融はんだが融着し、先端が
侵食されて丸くなっていた。先端に溶融はんだが融着し
た液面センサーは、液面が下がって液面センサーの先端
が液面よりも上になっても、はんだ槽の溶融はんだが糸
を引いたようにつながっており、完全に切れるにはさら
に液面センサーと液面とが離れなければならなった。On the other hand, a sharpened stainless steel round bar that had not been subjected to any treatment was similarly used for three months as a liquid level sensor. The molten solder was fused to the tip, and the tip was eroded and rounded. I was The liquid level sensor with the molten solder fused to the tip is connected as if the molten solder in the solder tank pulled the thread even if the liquid level dropped and the tip of the liquid level sensor was above the liquid level, In order to completely cut, the liquid level sensor and the liquid level had to be further separated.
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば、
はんだ槽や液面センサーのような部材に全く溶融はんだ
が融着しなくなるため、はんだ槽においては溶融はんだ
の侵食による溶融はんだの流出事故が回避でき、また液
面センサーにおいては液面の検知を正確に行うことがで
きるという安全性、信頼性に優れた効果を奏することが
できるものである。As described above, according to the present invention,
Since molten solder does not fuse to components such as the solder bath and the liquid level sensor at all, it is possible to prevent the molten solder from flowing out due to the erosion of the molten solder in the solder bath, and the liquid level sensor detects the liquid level. It is possible to achieve an effect excellent in safety and reliability that it can be performed accurately.
Claims (1)
態の硫黄を含むアルカリ金属塩中に浸漬して、該部材表
面に硫化物と窒化物を主体とした化合物層を生成させた
ことを特徴とする溶融はんだの融着防止方法。1. A member that refuses to fuse molten solder is immersed in an alkali metal salt containing sulfur in a molten state to form a compound layer mainly composed of sulfide and nitride on the surface of the member. A method for preventing fusion of molten solder, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21980697A JPH1147918A (en) | 1997-08-01 | 1997-08-01 | Method for preventing fused-stickiness of molten solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21980697A JPH1147918A (en) | 1997-08-01 | 1997-08-01 | Method for preventing fused-stickiness of molten solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1147918A true JPH1147918A (en) | 1999-02-23 |
Family
ID=16741337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21980697A Pending JPH1147918A (en) | 1997-08-01 | 1997-08-01 | Method for preventing fused-stickiness of molten solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1147918A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6851596B2 (en) | 2002-06-11 | 2005-02-08 | Senju Metal Industry Co., Ltd. | Wave soldering apparatus |
-
1997
- 1997-08-01 JP JP21980697A patent/JPH1147918A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6851596B2 (en) | 2002-06-11 | 2005-02-08 | Senju Metal Industry Co., Ltd. | Wave soldering apparatus |
| CN1331377C (en) * | 2002-06-11 | 2007-08-08 | 千住金属工业株式会社 | Wave soldering equipment |
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