JPH1145766A - Connector - Google Patents

Connector

Info

Publication number
JPH1145766A
JPH1145766A JP9202697A JP20269797A JPH1145766A JP H1145766 A JPH1145766 A JP H1145766A JP 9202697 A JP9202697 A JP 9202697A JP 20269797 A JP20269797 A JP 20269797A JP H1145766 A JPH1145766 A JP H1145766A
Authority
JP
Japan
Prior art keywords
terminal
contact
molded
main body
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9202697A
Other languages
Japanese (ja)
Inventor
Masanori Okita
雅則 大北
Hisahiro Ono
久博 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9202697A priority Critical patent/JPH1145766A/en
Publication of JPH1145766A publication Critical patent/JPH1145766A/en
Pending legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To connect electrical appliance without soldering by contacting one end of an elastic contact with a terminal of one appliance, and contacting one end of a conducting circuit, which is provided on a molding board contacting with the other end, with a contact terminal on other appliance side. SOLUTION: A terminal contacting part (no illustrated) on one end of an elastic contact 2 buried in a main body 1 is contacted with a PC card terminal which is mounted from the back surface of the connector main body 1. An inserting hole 31c is arranged in parallel in a molding body 31 of a molding board 3 which connects to the main body 1, and a conducting circuit 32 is formed on a molding body surface 3a. In this inserting hole 31c, a contacting part 22 on the other end of the elastic contact 2 is connected to the conducting circuit 32. One end side of the molding board 3, on which the conducting circuit 32 locates, is formed in the thin cross section edge shape. One end 31al of this molding board 3 is contacted to a connector terminal of a connector on a personal computer side, and the PC card is designed to conduct to the personal computer.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、PCカード等の電
気機器と、パーソナルコンピュータ等の別の電気機器と
を接続するコネクタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for connecting an electric device such as a PC card to another electric device such as a personal computer.

【0002】[0002]

【従来の技術】従来、この種のコネクタとして、図12
に示す構成のものが存在する。このものは、電気機器が
装着されるコネクタ本体Aと、コネクタ本体Aに並設さ
れて電気機器の端子に接触する端子接触部及びその端子
接触部に接続したコンタクトピンB1が導出された弾性
コンタクトBと、弾性コンタクトBのコンタクトピンB
1に半田でもって接続した導電回路部C1が形成された
回路基板Cと、回路基板Cの導電回路部C1に接続され
るとともに、別の電気機器の機器側コネクタ端子に接触
する基板コンタクトD1が並設された基板コネクタ部D
とを備えて構成される。
2. Description of the Related Art Conventionally, as this kind of connector, FIG.
There exists a thing of a structure shown in FIG. This is an elastic contact from which a connector main body A to which an electric device is mounted, a terminal contact portion arranged in parallel with the connector main body A to contact a terminal of the electric device, and a contact pin B1 connected to the terminal contact portion are led out. B and the contact pin B of the elastic contact B
1 and a circuit board C on which a conductive circuit section C1 connected by solder is formed, and a board contact D1 connected to the conductive circuit section C1 of the circuit board C and in contact with a device-side connector terminal of another electric apparatus. Side-by-side board connector D
And is provided.

【0003】さらに詳しくは、電気機器はPCカード等
で形成され2台が本体Aに装着されて、弾性コンタクト
Bは回路基板Cの一面C2側及び他面C3側へ並列配置
されて、各電気機器の端子にそれぞれ接触する。回路基
板Cは平板状の多層基板により、一面C2及び他面C
3、すなわち両面に導電回路部C1が形成されて、他面
C3側から一面C2側へ配線されたスルーホールが設け
られ、両面C2,C3の導電回路部C1が両面C2,C
3側へ配設されたコンタクトピンB1に、それぞれ半田
でもって接続される。そして、他面C3側へ形成された
導電回路部C1がスルーホールを介して一面側の導電回
路部C1と接続されて、基板コンタクトD1に接続され
る。
More specifically, the electric devices are formed of PC cards or the like, two of which are mounted on the main body A, and the elastic contacts B are arranged in parallel on one surface C2 side and the other surface C3 side of the circuit board C, and Contact each terminal of the device. The circuit board C is a flat multi-layer board, with one surface C2 and the other surface C2.
3, that is, a conductive circuit portion C1 is formed on both surfaces, a through-hole is provided from the other surface C3 side to the one surface C2 side, and the conductive circuit portions C1 on both surfaces C2 and C3 are formed on both surfaces C2 and C2.
Each of the contact pins B1 disposed on the third side is connected with solder. Then, the conductive circuit portion C1 formed on the other surface C3 side is connected to the conductive circuit portion C1 on the one surface side via a through hole, and is connected to the substrate contact D1.

【0004】また、電気機器は接地部を有したカードバ
ス対応のとき、電気機器を接地するグランドプレートE
が、回路基板Cの両面C2,C3側のコネクタ本体Aに
設けられて、両面C2,C3に設けられたグランド回路
に半田でもってそれぞれ半田付けされる。
When the electric equipment is compatible with a card bus having a grounding portion, a ground plate E for grounding the electric equipment is provided.
Are provided on the connector body A on both sides C2 and C3 of the circuit board C, and are respectively soldered to ground circuits provided on both sides C2 and C3.

【0005】[0005]

【発明が解決しようとする課題】上記した従来のコネク
タでは、弾性コンタクトB及び導電回路部C1を介し
て、PCカードと、パーソナルコンピュータ等で形成さ
れる別の電気機器とを接続できる。
In the above-mentioned conventional connector, the PC card can be connected to another electric device formed of a personal computer or the like via the elastic contact B and the conductive circuit portion C1.

【0006】しかしながら、弾性コンタクトBのコンタ
クトピンB1及びグランドプレートEと、回路基板Cに
形成された導電回路部C1とを半田でもって接続しなけ
ればならず、半田付け工程が必要不可欠になって、コス
トアップ要因の一つになっていた。
However, the contact pins B1 and the ground plate E of the elastic contact B must be connected to the conductive circuit portion C1 formed on the circuit board C by soldering, so that a soldering process is indispensable. , Was one of the cost-up factors.

【0007】本発明は、上記問題点に鑑みてなしたもの
で、その目的とするところは、半田付け工程を設けるこ
となく電気機器と別の電気機器とを接続できるコネクタ
を提供することにある。
[0007] The present invention has been made in view of the above problems, and an object of the present invention is to provide a connector which can connect an electric device to another electric device without providing a soldering step. .

【0008】[0008]

【課題を解決するための手段】上記した課題を解決する
ために、請求項1記載のものは、電気機器が装着される
本体と、本体に並設されて電気機器の端子に接触する端
子接触部及びその端子接触部に接続した接触部がそれぞ
れ導出された弾性コンタクトと、少なくとも一面側へ成
形本体面及び並設した挿通孔を有して立体成型された成
形本体を設けるとともに、挿通孔に挿通された弾性コン
タクトの接触部及び別の電気機器に設けられた機器側コ
ネクタ端子にそれぞれ接触する導電回路部が成形本体面
に並設された成形基板とを備えた構成にしてある。
Means for Solving the Problems To solve the above-mentioned problems, a first aspect of the present invention is directed to a main body on which an electric device is mounted, and a terminal contact provided in parallel with the main body and in contact with a terminal of the electric device. And a contact body connected to the terminal contact portion thereof is provided with an elastic contact, each of which is led out, and a molded body three-dimensionally molded having a molded body surface and an insertion hole arranged side by side on at least one side, and the insertion hole is provided in the insertion hole. It is configured to include a molded substrate on which a conductive circuit portion that contacts a contact portion of the inserted elastic contact and a device-side connector terminal provided in another electric device is arranged side by side on a molded body surface.

【0009】請求項2記載のものは、請求項1記載のも
のにおいて、前記本体に装着された複数台の前記電気機
器の各端子が前記弾性コンタクトの端子接触部にそれぞ
れ接触するものであって、前記成形基板は前記挿通孔及
び前記導電回路部が前記成形本体の両面側へそれぞれ並
設された構成にしてある。
According to a second aspect, in the first aspect, each terminal of the plurality of electric devices mounted on the main body comes into contact with a terminal contact portion of the elastic contact, respectively. The molded substrate has a configuration in which the insertion hole and the conductive circuit portion are arranged in parallel on both sides of the molded body.

【0010】請求項3記載のものは、請求項1又は請求
項2記載のものにおいて、前記成形基板は、前記機器側
コネクタ端子に接触する前記導電回路部の位置する一端
部側が、厚さの薄い断面エッジ状に形成された構成にし
てある。
According to a third aspect of the present invention, in the first or second aspect, the molded substrate has a thickness at one end side where the conductive circuit portion in contact with the device-side connector terminal is located. It is configured to have a thin cross-section edge shape.

【0011】請求項4記載のものは、請求項1乃至請求
項3のいづれかに記載のものにおいて、前記電気機器を
接地するグランドプレートが前記本体に設けられたもの
であって、前記成形基板はグランドプレートに接触する
グランド回路が前記成形本体面に設けられた構成にして
ある。
According to a fourth aspect of the present invention, in any one of the first to third aspects, a ground plate for grounding the electric device is provided on the main body. A ground circuit that contacts a ground plate is provided on the surface of the molded body.

【0012】請求項5記載のものは、請求項4記載のも
のにおいて、前記グランドプレートはグランド回路と接
続した導電面を有して、前記成形基板から前記弾性コン
タクトの端子接触部側へ延設された延設部でもって形成
された構成にしてある。
According to a fifth aspect of the present invention, in the fourth aspect, the ground plate has a conductive surface connected to a ground circuit, and extends from the molded substrate to a terminal contact side of the elastic contact. It has a configuration formed by the extended portion.

【0013】[0013]

【発明の実施の形態】本発明の第1実施形態を図1乃至
図9に基づいて以下に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS.

【0014】1は本体で、絶縁性の樹脂により、図5に
示すように、底部11及び第1開口部12a及び第2開
口部12bからなる開口部12を有して有底箱形に形成
され、開口部12が一方側へ2段に開口するとともに、
底部11に対して直交した一側壁に複数の切り欠き部1
3が並設される。
1 is a main body formed of an insulating resin, as shown in FIG. 5, having a bottomed box shape having a bottom 11 and an opening 12 composed of a first opening 12a and a second opening 12b. And the opening 12 is opened to one side in two steps,
A plurality of notches 1 are formed on one side wall orthogonal to the bottom 11.
3 are juxtaposed.

【0015】2は弾性コンタクトで、弾性を有した銅合
金により、長尺状に形成され、棒状の端子接触部21、
及びその端子接触部21の反対側へ位置しその端子接触
部21に電気的に接続する平板状の接触部22が設けら
れ、接触部22が2段に折曲形成されて厚さ方向におけ
る寸法が所定寸法δに形成される。そして、端子接触部
21の接触部22側が本体1の各開口部12a,12b
に対応する底部11に固着されて、端子接触部21及び
接触部22が底部11からそれぞれ両側へ導出された状
態で、各開口部12に2列にわたって、つまり合計4列
にわたって所定ピッチで並設される。
Reference numeral 2 denotes an elastic contact, which is formed in an elongated shape from an elastic copper alloy and has a rod-shaped terminal contact portion 21;
And a flat contact portion 22 which is located on the opposite side of the terminal contact portion 21 and is electrically connected to the terminal contact portion 21. The contact portion 22 is bent in two steps and has a dimension in the thickness direction. Is formed to a predetermined dimension δ. The contact portion 22 side of the terminal contact portion 21 corresponds to each of the openings 12a and 12b of the main body 1.
The terminal contact portions 21 and the contact portions 22 are respectively led out to both sides from the bottom portion 11 in a state where the terminal contact portions 21 and the contact portions 22 are respectively extended from the bottom portion 11 to two rows, that is, four rows in total. Is done.

【0016】3は成形基板で、絶縁性の樹脂により、一
面側及び他面側の両面側へ両成形本体面3a,3aを有
して樹脂を3次元に立体成型した成形本体31と、両成
形本体面3a,3aに並設された導電回路部32とが設
けられて、いわゆるMID(Molded Inter
connection Device)を形成する。
Reference numeral 3 denotes a molded substrate, which is formed of an insulating resin, has two molded body surfaces 3a, 3a on one surface side and the other surface side, and has a three-dimensionally molded resin body 31; A conductive circuit portion 32 provided in parallel with the molded body surfaces 3a, 3a is provided, so-called MID (Molded Inter).
forming a connection device).

【0017】成形本体31は一端部31a1を有した一
片31aと、その一片31aの他端部から両面側へ突出
した他片31bとで側面略T字型に形成され、一片31
aの一端部31a1側が他片31bと比較して厚さの薄
い断面エッジ状に形成される。そして、図2及び図4に
示すように、複数個の挿通孔31cが一面側及び他面側
でそれぞれ2列にわたって、つまり合計4列にわたっ
て、一片31aに沿った状態で他片31bに所定ピッチ
で並設されるとともに、両成形本体面3a,3aに対す
る直交方向における空隙を弾性コンタクト2の所定寸法
δに比較して狭く形成される。
The molded body 31 is formed into a substantially T-shaped side surface by a piece 31a having one end 31a1 and another piece 31b protruding from the other end of the piece 31a toward both sides.
The one end 31a1 side of "a" is formed to have a thinner cross-sectional edge than the other piece 31b. Then, as shown in FIGS. 2 and 4, a plurality of insertion holes 31c are provided in two rows on one surface side and the other surface side, that is, over a total of four rows, at predetermined pitches in the other piece 31b along the one piece 31a. And the gap in the direction perpendicular to both the molded body surfaces 3a, 3a is formed narrower than the predetermined dimension δ of the elastic contact 2.

【0018】また、複数個の第1突出壁31dが、及び
第1突出壁31dと比較して高さの低い第2突出壁31
eが、挿通孔31cの対応位置にて一片31aから両面
側へ突設されて、所定ピッチでそれぞれ並設される。さ
らに、一片31aに沿って切り欠かれた第1グランドプ
レート圧入溝31fが一面側へ開口した状態で、及び第
2グランドプレート圧入溝31gが、それぞれ一片31
aに沿って他片31bに並設される。
Also, the plurality of first protruding walls 31d have a lower height than the first protruding walls 31d.
e project from the one piece 31a to both sides at a position corresponding to the insertion hole 31c, and are juxtaposed at a predetermined pitch. Further, in a state where the first ground plate press-fitting groove 31f cut out along the piece 31a is opened to the one surface side, and the second ground plate press-fitting groove 31g, the one piece 31
are arranged side by side with the other piece 31b along a.

【0019】導電回路部32は、図7に示すように、金
によりめっきで形成されて、第1導電回路部32a及び
第2導電回路部32bで構成され、両成形本体面3a,
3aにそれぞれ並設される。すなわち、第1導電回路部
32aが一片31a、第1突出壁31dの側面、及び第
1突出壁31dの突出面のそれぞれに、第2導電回路部
32bが一片31a、第2突出壁31eの側面、及び第
2突出壁31eの突出面に、互いに接続された状態でそ
れぞれ線状に形成されて両成形本体面3a,3aに並設
される。
As shown in FIG. 7, the conductive circuit portion 32 is formed by plating with gold, and includes a first conductive circuit portion 32a and a second conductive circuit portion 32b.
3a are provided side by side. That is, the first conductive circuit portion 32a has one piece 31a, the side surface of the first protruding wall 31d, and the protruding surface of the first protruding wall 31d, and the second conductive circuit portion 32b has one piece 31a and the side surface of the second protruding wall 31e. , And on the protruding surface of the second protruding wall 31e, each of which is linearly formed in a state of being connected to each other, and juxtaposed on both the molded body surfaces 3a, 3a.

【0020】また、図2及び図3における網状の斜線部
で示すように、半田メッキで形成されたグランド回路3
2cは、第1グランドプレート圧入溝31fの底部と一
片31aの両側部とが接続するよう、一片31a及び他
片31bの両側部における一面側の成形本体面3aに、
並びに両成形本体面3a,3aに直交した側部3bにそ
れぞれ設けられている。また、第2グランドプレート圧
入溝31gの底部と一片31aの両側部とが接続するよ
う、同様に他面側の成形本体面3aに設けられる。
As shown by the hatched portions in FIGS. 2 and 3, a ground circuit 3 formed by solder plating is used.
2c is formed on the molding body surface 3a on one side on both sides of the one piece 31a and the other piece 31b so that the bottom of the first ground plate press-fit groove 31f is connected to both sides of the one piece 31a.
In addition, they are provided on the side portions 3b orthogonal to both the molding body surfaces 3a, 3a. Similarly, a second main body press-fitting groove 31g is provided on the molding body surface 3a on the other side so that the bottom of the second press-fit groove 31g and the two sides of the piece 31a are connected.

【0021】4はグランドプレートで、金属により、長
尺薄板状に形成され、図5に示すように、グランド接続
片41及び突起42aが一面側へ設けられたグランド接
触片42を有して、グランド接触片42の端部が本体1
の第1開口部12a及び第2開口部12bに対応する底
部11に固着される。そして、グランド接続片41が底
部11から各開口部12a,12bへ導出されるととも
に、グランド接触片42が各開口部12a,12bの反
対側へそれぞれ導出されて、複数個が本体1に並設され
る。
Reference numeral 4 denotes a ground plate, which is formed of a metal into a long thin plate shape, and has a ground contact piece 42 provided with a ground connecting piece 41 and a projection 42a on one side as shown in FIG. The end of the ground contact piece 42 is the main body 1
Is fixed to the bottom 11 corresponding to the first opening 12a and the second opening 12b. The ground connection piece 41 is led out from the bottom 11 to each of the openings 12a and 12b, and the ground contact piece 42 is led out to the opposite side of each of the openings 12a and 12b. Is done.

【0022】PCカード5は、電気機器を形成し、ファ
ックスモデム等を内蔵したものであり、電気信号を入出
力するカード端子51が設けられて、そのカード端子が
2列にわたって並設され、弾性コンタクト2の端子接触
部21に接触する。また、金属からなり電気機器を接地
するグランド接地板(図示せず)が上面に設けられる。
The PC card 5 forms an electric device and has a built-in fax modem and the like. The PC card 5 is provided with card terminals 51 for inputting and outputting electric signals. It contacts the terminal contact portion 21 of the contact 2. In addition, a ground ground plate (not shown) made of metal and grounding the electric device is provided on the upper surface.

【0023】機器側コネクタ6は、銅合金からなる一対
の機器側コネクタ端子61,61を有して、別の電気機
器を形成するパーソナルコンピュータ(図示せず)に設
けられたマザーボード62に接続されている。そして、
一対の機器側コネクタ端子61,61が、各成形本体面
3a,3aに形成された第1導電回路部32a及び第2
導電回路部32bにそれぞれ接触する。
The device-side connector 6 has a pair of device-side connector terminals 61 made of a copper alloy, and is connected to a motherboard 62 provided on a personal computer (not shown) forming another electric device. ing. And
A pair of device-side connector terminals 61, 61 are formed on the first conductive circuit portion 32a and the second
The conductive circuit portions 32b are in contact with each other.

【0024】ここで、図6及び図7に示すように、本体
1に並設された弾性コンタクト2は、底部11から導出
された接触部22が成形本体31の挿通孔31cに挿通
される。このとき、成形本体31の挿通孔31cが弾性
コンタクト2の所定寸法δに比較して空隙を狭く形成さ
れているので、各接触部22が成形本体31の第1突出
壁31d及び第2突出壁31eにそれぞれ並設された第
1導電回路部32a及び第2導電回路部32bと、弾接
した状態で確実に接触する。
Here, as shown in FIGS. 6 and 7, in the elastic contacts 2 arranged in parallel with the main body 1, the contact portions 22 derived from the bottom 11 are inserted into the insertion holes 31c of the molded main body 31. At this time, since the insertion hole 31c of the molding body 31 is formed to have a smaller gap than the predetermined dimension δ of the elastic contact 2, each contact portion 22 is formed by the first protruding wall 31d and the second protruding wall 31 of the molding body 31. The first conductive circuit portion 32a and the second conductive circuit portion 32b arranged in parallel with each other are securely contacted with each other in a state of elastic contact.

【0025】同様に、本体1に設けられたグランドプレ
ート4は、各グランド接触片42が成形本体31に並設
された第1グランドプレート圧入溝31f、及び第2グ
ランドプレート圧入溝31gにそれぞれ圧入されて、各
突起42aが他片31bの各成形本体面3a,3aに形
成されたグランド回路32cにそれぞれ接触する。
Similarly, the ground plate 4 provided on the main body 1 is press-fitted into the first gland plate press-fit groove 31f and the second gland plate press-fit groove 31g in which the respective ground contact pieces 42 are juxtaposed with the molded body 31. Then, each projection 42a comes into contact with a ground circuit 32c formed on each molded body surface 3a of the other piece 31b.

【0026】このものの機器側コネクタ6に装着する装
着方法を図8及び図9に基づいて説明する。本体1及び
一端部31a1が断面エッジ状に形成された成形基板3
は、一対の機器側コネクタ端子61,61に斜め方向か
ら挿入されて、マザーボード62側へ向かって回転され
る(図8)。そして、両成形本体面3a,3aにそれぞ
れ形成された第1導電回路部32a及び第2導電回路部
32bが、一対の機器側コネクタ端子61,61にそれ
ぞれ接触して、パーソナルコンピュータのマザーボード
62と電気的に接続される(図9)。また、グランド回
路32cは機器側コネクタ6のアース端子(図示せず)
に接続される。
A method of mounting the connector on the device side connector 6 will be described with reference to FIGS. Formed substrate 3 in which main body 1 and one end 31a1 are formed in an edge shape in cross section
Is inserted obliquely into the pair of device-side connector terminals 61, 61 and rotated toward the motherboard 62 (FIG. 8). Then, the first conductive circuit portion 32a and the second conductive circuit portion 32b respectively formed on both the molded body surfaces 3a, 3a come into contact with the pair of device-side connector terminals 61, 61, respectively, and are connected to the motherboard 62 of the personal computer. It is electrically connected (FIG. 9). The ground circuit 32c is a ground terminal (not shown) of the device-side connector 6.
Connected to.

【0027】このとき、機器側コネクタ6に装着する装
着スペースが狭い場合であっても、成形基板3は一端部
31a1が厚さの薄い断面エッジ状に形成されているの
で、マザーボード62側へ向かって回転して、容易に機
器側コネクタ端子61,61に装着することができる。
At this time, even when the mounting space for mounting on the device-side connector 6 is narrow, the molded substrate 3 has the one end portion 31a1 formed in a thin cross-sectional edge shape, so that it faces the motherboard 62 side. And can be easily attached to the device-side connector terminals 61, 61.

【0028】次いで、図10(PCカード5を一台のみ
しか図示せず)に示すように、2台のPCカード5は本
体1を保持した金属フレーム13にそれぞれ挿入され
て、本体1の第1開口部12a及び第2開口部12bに
それぞれ装着される。そして、2台のPCカード5の各
カード端子51は、第1開口部12a及び第2開口部1
2bで各2列に並設された弾性コンタクト2の端子接触
部21に、また各グランド接地板が各グランドプレート
4のグランド接続片41に、それぞれ接触して接続され
る。
Next, as shown in FIG. 10 (only one PC card 5 is shown), the two PC cards 5 are inserted into the metal frames 13 holding the main body 1, respectively. It is attached to each of the first opening 12a and the second opening 12b. The card terminals 51 of the two PC cards 5 are connected to the first opening 12 a and the second opening 1.
2b, the respective ground contact plates 21 of the elastic contacts 2 arranged in two rows and the respective grounding plates are connected to the ground connection pieces 41 of the respective grounding plates 4 to be connected thereto.

【0029】このようにして、2台のPCカード5は弾
性コンタクト2及び成形基板3の導電回路部32を介し
て、パーソナルコンピュータのマザーボード62に接続
される。また、グランドプレート4及びグランド回路3
2cを介して、機器側コネクタ6のアース端子に接続さ
れて接地される。
As described above, the two PC cards 5 are connected to the motherboard 62 of the personal computer via the elastic contacts 2 and the conductive circuit section 32 of the molded board 3. The ground plate 4 and the ground circuit 3
Via 2c, it is connected to the ground terminal of the device side connector 6 and grounded.

【0030】かかる第1実施形態のコネクタにあって
は、上記したように、成形基板3が挿通孔31cを有し
て立体成型された成形本体31を設けるとともに、導電
回路部32が両成形本体面3a,3aに並設されたか
ら、挿通孔31cに挿通された弾性コンタクト2の接触
部22が成形本体31の他端部側にて、及び一対の機器
側コネクタ端子61,61が一端部31a1側にて導電
回路部32にそれぞれ接触して、半田を使用し弾性コン
タクト2の接触部22と回路基板の導電回路部とを接続
した従来と異なって、半田付け工程を省略できるので低
コスト化を容易に実現することができる。
In the connector of the first embodiment, as described above, the molded substrate 3 is provided with the three-dimensional molded body 31 having the insertion hole 31c, and the conductive circuit portion 32 is formed of the two molded bodies 31. Since the contact portions 22 of the elastic contacts 2 inserted into the insertion holes 31c are provided at the other end of the molded body 31, and the pair of device-side connector terminals 61, 61 are provided at one end 31a1. The soldering process can be omitted, unlike the related art in which the contact portion 22 of the elastic contact 2 is connected to the conductive circuit portion of the circuit board using solder by contacting the conductive circuit portion 32 on the side, respectively, so that the cost is reduced. Can be easily realized.

【0031】また、本体1に装着された2台のPCカー
ド5の各カード端子51が、各弾性コンタクト2の端子
接触部21に接触するものであれば、成形基板3の挿通
孔31c及び導電回路部32が成形本体31の両面側へ
並設されたから、他面側から一面側へ配線するスルーホ
ールを設けた多層基板を使用しなければならなかった従
来と異なって、高価な多層基板を使用する必要がなくな
って、さらに低コスト化を実現することができる。
If the card terminals 51 of the two PC cards 5 mounted on the main body 1 are in contact with the terminal contact portions 21 of the elastic contacts 2, the insertion holes 31c of the molded board 3 and the conductive Since the circuit portions 32 are juxtaposed on both sides of the molded body 31, unlike the conventional case where a multilayer substrate having a through hole for wiring from the other surface to the one surface must be used, an expensive multilayer substrate is used. There is no need to use it, and the cost can be further reduced.

【0032】また、一対の機器側コネクタ端子61,6
1に接触する導電回路部32が位置する成形基板3の一
端部31a1側が、厚さの薄い断面エッジ状に形成され
たから、PCカード5とパーソナルコンピュータとを接
続するとき、成形基板3を機器側コネクタ端子61,6
1に一端部31a1側から斜め方向へ挿入して、一端部
に位置する導電回路部32を機器側コネクタ端子61,
61に接触して、機器側コネクタ6に装着する装着スペ
ースが狭い場合であっても、容易にパーソナルコンピュ
ータに実装することができる。
Further, a pair of device-side connector terminals 61, 6
When the PC card 5 and the personal computer are connected to each other, the molded substrate 3 is connected to the device side because the one end 31a1 of the molded substrate 3 where the conductive circuit portion 32 that is in contact with 1 is located is formed in a thin cross-sectional edge shape. Connector terminals 61, 6
1 is inserted obliquely from one end 31a1 side, and the conductive circuit portion 32 located at one end is connected to the device-side connector terminal 61,
Even when the mounting space for mounting the connector 6 on the device side is small due to the contact with the connector 61, it can be easily mounted on a personal computer.

【0033】また、電気機器を接地するグランドプレー
ト4が本体1に設けられたものであれば、そのグランド
プレート4に接触するグランド回路32cが成形基板3
の両成形本体面3a,3aに設けられたから、グランド
回路32cをPCカード5の接地板及び機器側コネクタ
6のアース端子に接触させて、容易に電気機器を接地す
ることができる。
If the main body 1 is provided with a ground plate 4 for grounding the electric equipment, the ground circuit 32c contacting the ground plate 4 is formed on the molded substrate 3
Since the ground circuit 32c is provided on both the molded body surfaces 3a, 3a, the electrical circuit can be easily grounded by bringing the ground circuit 32c into contact with the ground plate of the PC card 5 and the ground terminal of the device-side connector 6.

【0034】なお、第1実施形態では、2台のPCカー
ド5が本体1に装着されて、各PCカード5のカード端
子51が各弾性コンタクト2の端子接触部21に接触す
るとともに、成形基板3の挿通孔31c及び導電回路部
32が成形本体31の両面側へ並設されたものとした
が、1台が本体1に装着される場合は、挿通孔31c及
び導電回路部32が成形本体31の一面側のみへ並設さ
れていればよく、限定されない。
In the first embodiment, two PC cards 5 are mounted on the main body 1 so that the card terminals 51 of each PC card 5 come into contact with the terminal contact portions 21 of each elastic contact 2 and the molded board The three insertion holes 31c and the conductive circuit portion 32 are arranged side by side on both sides of the molded body 31. However, when one unit is mounted on the main body 1, the insertion hole 31c and the conductive circuit portion 32 are It is sufficient that they are juxtaposed only on one side of the base 31, and there is no limitation.

【0035】また、第1実施形態では、成形基板3の一
端部側31a1が厚さの薄い断面エッジ状に形成された
ものとしたが、機器側コネクタ6に装着する装着スペー
スが広い場合は、エッジ状に形成しなくてもよく、限定
されない。
In the first embodiment, the one end 31a1 of the molded substrate 3 is formed to have a thin cross-sectional edge. However, if the mounting space for mounting the device-side connector 6 is wide, It does not have to be formed in an edge shape and is not limited.

【0036】本発明の第2実施形態を図11に基づいて
以下に説明する。なお、第2実施形態では第1実施形態
と異なる機能について述べることとし、第1実施形態と
実質的に同一機能を有する部材については、同一符号を
付して説明を省略する。第2実施形態では、成形本体3
1は第1グランドプレート圧入溝31f、及び第2グラ
ンドプレート圧入溝31gが他片31bに並設されてい
ない。
A second embodiment of the present invention will be described below with reference to FIG. In the second embodiment, functions different from those in the first embodiment will be described, and members having substantially the same functions as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted. In the second embodiment, the molded body 3
In 1, the first ground plate press-fitting groove 31 f and the second ground plate press-fitting groove 31 g are not juxtaposed with the other piece 31 b.

【0037】7は延設部で、絶縁性の樹脂により、グラ
ンドプレートを形成し、成形基板3の成形本体31から
弾性コンタクト2の端子接触部21側へ延設されて、グ
ランド回路32cに接続された導電面71が半田めっき
でもって表面に形成される。
Reference numeral 7 denotes an extended portion, which forms a ground plate with an insulating resin, extends from the molded body 31 of the molded substrate 3 to the terminal contact portion 21 of the elastic contact 2, and is connected to the ground circuit 32c. Conducted surface 71 is formed on the surface by solder plating.

【0038】かかる第2実施形態のコネクタにあって
は、上記したように、グランドプレートがグランド回路
32cと接続した導電面71を有して、成形基板3から
弾性コンタクト2の端子接触部21側へ延設された延設
部7でもって形成されたから、別体に設けられたグラン
ドプレート4を必要とした従来と異なって、延設部7と
成形基板3とを一体に成形し部品点数を削減して、さら
に低コスト化を図ることができる。
In the connector according to the second embodiment, as described above, the ground plate has the conductive surface 71 connected to the ground circuit 32c, and extends from the molded substrate 3 to the terminal contact portion 21 side of the elastic contact 2. Unlike the conventional case that requires the separately provided ground plate 4, the extending portion 7 and the molded substrate 3 are integrally formed to reduce the number of parts. The cost can be reduced, and the cost can be further reduced.

【0039】[0039]

【発明の効果】請求項1記載のものは、成形基板が挿通
孔を有して立体成型された成形本体を設けるとともに、
導電回路部がその成形本体面に並設されたから、挿通孔
に挿通された弾性コンタクトの接触部が成形本体の他端
部側にて、コネクタの機器側コネクタ端子が一端部側に
て導電回路部にそれぞれ接触して、半田を使用し弾性コ
ンタクトの接触部と回路基板の回路パターンを接続した
従来と異なって、半田付け工程を省略できるので低コス
ト化を容易に実現することができる。
According to the first aspect of the present invention, a three-dimensional molded body is provided with a molded substrate having an insertion hole.
Since the conductive circuit portion is arranged side by side on the molded body surface, the contact portion of the elastic contact inserted into the insertion hole is on the other end side of the molded body, and the device terminal of the connector is the conductive circuit on one end side. The soldering process can be omitted, unlike the related art in which the contact portions of the elastic contacts are connected to the circuit patterns of the circuit board by using solder by contacting the respective portions, so that the cost can be easily reduced.

【0040】請求項2記載のものは、請求項1記載のも
のの効果に加えて、本体1に装着された複数台の電気機
器の各端子が、各弾性コンタクトの端子接触部に接触す
るものであれば、成形基板の挿通孔及び導電回路部が成
形本体の両面側へ並設されたから、一面側から他面側へ
配線するスルーホールを設けた多層基板を使用しなけれ
ばならなかった従来と異なって、高価な多層基板を使用
する必要がなくなって、さらに低コスト化を図ることが
できる。
According to a second aspect of the present invention, in addition to the effect of the first aspect, each terminal of the plurality of electric devices mounted on the main body 1 comes into contact with the terminal contact portion of each elastic contact. If there is, the insertion hole and the conductive circuit part of the molded board are arranged side by side on both sides of the molded body, so that it had to use a multilayer board with a through hole to wire from one side to the other side Differently, it is not necessary to use an expensive multi-layer substrate, and the cost can be further reduced.

【0041】請求項3記載のものは、請求項1又は請求
項2記載のものの効果に加えて、機器側コネクタ端子に
接触する導電回路部が位置する成形基板の一端部側が、
厚さの薄い断面エッジ状に形成されたから、電気機器と
別の電気機器とを接続するとき、成形基板を機器側コネ
クタ端子に一端部側から斜め方向へ挿入し、一端部に位
置する導電回路部を機器側コネクタ端子に接触して、装
着スペースが狭い場合であっても、容易に別の電気機器
に実装することができる。
According to a third aspect of the present invention, in addition to the effects of the first or second aspect, one end of the molded substrate on which the conductive circuit portion that contacts the device-side connector terminal is located,
When connecting an electric device to another electric device, the molded substrate is inserted obliquely from one end side to the electric device side connector terminal when the electric device is connected to another electric device because it is formed in a thin cross-sectional edge shape, and the conductive circuit located at one end portion Even if the mounting space is narrow by contacting the part with the device-side connector terminal, it can be easily mounted on another electric device.

【0042】請求項4記載のものは、請求項1乃至請求
項3のいづれかに記載のものの効果に加えて、電気機器
を接地するグランドプレートが本体に設けられたもので
あれば、グランドプレートに接触するグランド回路が成
形基板の成形本体面に設けられたから、グランド回路を
電気機器の接地板及び機器側コネクタのアース端子に接
触させて、容易に電気機器を接地するすることができ
る。
According to a fourth aspect of the present invention, in addition to the effects of any one of the first to third aspects, if a ground plate for grounding an electric device is provided in the main body, the ground plate may be replaced with a ground plate. Since the contacting ground circuit is provided on the molded body surface of the molded substrate, the ground circuit can be brought into contact with the ground plate of the electric device and the ground terminal of the device-side connector to easily ground the electric device.

【0043】請求項5記載のものは、請求項4記載のも
のの効果に加えて、グランドプレートがグランド回路と
接続した導電面を有して、成形基板から弾性コンタクト
の端子接触部側へ延設された延設部でもって形成された
から、別体に設けられたグランドプレートを必要とした
従来と異なって、延設部と成形基板とを一体に成形し部
品点数を削減して、さらに低コスト化を図ることができ
る。
According to a fifth aspect of the present invention, in addition to the effect of the fourth aspect, the ground plate has a conductive surface connected to the ground circuit, and extends from the molded substrate to the terminal contact portion side of the elastic contact. Unlike the conventional case that requires a separately provided ground plate, the extended portion and the molded board are integrally molded to reduce the number of parts, which further reduces the cost. Can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.

【図2】同上の成形基板の正面図である。FIG. 2 is a front view of the molded substrate according to the first embodiment.

【図3】同上の成形基板の平面図である。FIG. 3 is a plan view of the molded substrate according to the first embodiment.

【図4】同上の成形基板の側断面図(X−X断面矢視
図)である。
FIG. 4 is a side sectional view (XX sectional view taken along arrow) of the molded substrate of the above.

【図5】同上の本体の側断面図である。FIG. 5 is a side sectional view of the main body.

【図6】同上の本体及び成形基板の側断面図である。FIG. 6 is a side sectional view of the main body and a molded substrate of the same.

【図7】同上の成形基板の拡大斜視図である。FIG. 7 is an enlarged perspective view of the same molded substrate.

【図8】同上の機器側コネクタ端子に実装される状態の
側断面図である。
FIG. 8 is a side sectional view showing a state of being mounted on the device-side connector terminal of the above.

【図9】同上の機器側コネクタ端子に実装された状態の
側断面図である。
FIG. 9 is a side cross-sectional view showing a state where it is mounted on the device-side connector terminal of the above.

【図10】同上のPCカードが装着される状態の斜視図
である。
FIG. 10 is a perspective view showing a state in which the PC card is mounted.

【図11】本発明の第2実施形態を示す斜視図である。FIG. 11 is a perspective view showing a second embodiment of the present invention.

【図12】従来例を示す斜視図である。FIG. 12 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 本体 2 弾性コンタクト 21 端子接触部 22 接触部 3 成形基板 3a 成形本体面 31 成形本体 31a1 一端部 31c 挿通孔 32a 第1導電回路部(導電回路部) 32b 第2導電回路部(導電回路部) 32c グランド回路 4 グランドプレート 5 PCカード(電気機器) 51 カード端子(端子) 6 機器側コネクタ 61 機器側コネクタ端子 7 延設部 71 導電面 DESCRIPTION OF SYMBOLS 1 Main body 2 Elastic contact 21 Terminal contact part 22 Contact part 3 Molded substrate 3a Molded main body surface 31 Molded main body 31a1 One end part 31c Insertion hole 32a First conductive circuit part (conductive circuit part) 32b Second conductive circuit part (conductive circuit part) 32c Ground circuit 4 Ground plate 5 PC card (electric device) 51 Card terminal (terminal) 6 Device side connector 61 Device side connector terminal 7 Extension part 71 Conductive surface

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電気機器が装着される本体と、本体に並
設されて電気機器の端子に接触する端子接触部及びその
端子接触部に接続した接触部がそれぞれ導出された弾性
コンタクトと、少なくとも一面側へ成形本体面及び並設
した挿通孔を有して立体成型された成形本体を設けると
ともに、挿通孔に挿通された弾性コンタクトの接触部及
び別の電気機器に設けられた機器側コネクタ端子にそれ
ぞれ接触する導電回路部が成形本体面に並設された成形
基板と、を備えたことを特徴とするコネクタ。
At least one of a main body to which an electric device is mounted, a terminal contact portion provided in parallel with the main body and contacting a terminal of the electric device, and an elastic contact from which a contact portion connected to the terminal contact portion is led out. A three-dimensional molded body having a molded body surface and a juxtaposed insertion hole on one side is provided, and a contact portion of an elastic contact inserted into the insertion hole and a device-side connector terminal provided in another electric device. A molded circuit board in which conductive circuit portions respectively contacting with the molded body are arranged side by side on the molded body surface.
【請求項2】 前記本体に装着された複数台の前記電気
機器の各端子が各前記弾性コンタクトの端子接触部に接
触するものであって、前記成形基板は前記挿通孔及び前
記導電回路部が前記成形本体の両面側へそれぞれ並設さ
れたことを特徴とする請求項1記載のコネクタ。
2. The method according to claim 2, wherein each terminal of the plurality of electric devices mounted on the main body comes into contact with a terminal contact portion of each of the elastic contacts, and the molded substrate has the insertion hole and the conductive circuit portion. The connector according to claim 1, wherein the connector is arranged on both sides of the molded body.
【請求項3】 前記成形基板は、前記機器側コネクタ端
子に接触する前記導電回路部の位置する一端部側が、厚
さの薄い断面エッジ状に形成されたことを特徴とする請
求項1又は請求項2記載のコネクタ。
3. The molded substrate according to claim 1, wherein one end of the molded circuit board where the conductive circuit portion in contact with the device-side connector terminal is located has a thin cross-sectional edge. Item 2. The connector according to Item 2.
【請求項4】 前記電気機器を接地するグランドプレー
トが前記本体に設けられたものであって、前記成形基板
はグランドプレートに接触するグランド回路が前記成形
本体面に設けられたことを特徴とする請求項1乃至請求
項3のいづれかに記載のコネクタ。
4. A ground plate for grounding the electric device is provided on the main body, and a ground circuit for contacting the ground plate is provided on a surface of the molded main body. The connector according to any one of claims 1 to 3.
【請求項5】 前記グランドプレートはグランド回路と
接続した導電面を有して、前記成形基板から前記弾性コ
ンタクトの端子接触部側へ延設された延設部でもって形
成されてなることを特徴とする請求項4記載のコネク
タ。
5. The ground plate has a conductive surface connected to a ground circuit, and is formed with an extended portion extending from the molded substrate to a terminal contact portion side of the elastic contact. The connector according to claim 4, wherein
JP9202697A 1997-07-29 1997-07-29 Connector Pending JPH1145766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9202697A JPH1145766A (en) 1997-07-29 1997-07-29 Connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9202697A JPH1145766A (en) 1997-07-29 1997-07-29 Connector

Publications (1)

Publication Number Publication Date
JPH1145766A true JPH1145766A (en) 1999-02-16

Family

ID=16461670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9202697A Pending JPH1145766A (en) 1997-07-29 1997-07-29 Connector

Country Status (1)

Country Link
JP (1) JPH1145766A (en)

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