JPH1140650A - Wafer-detecting device equipped with wafer-aligning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To align wafers, and to simplify the whole constitution, even when a wafer sensor cannot be inserted between wafers. SOLUTION: A first wafer sensor device S1 is arranged on the one side face of a column so as to be movable back and forth for a wafer carrier, and a second wafer sensor device S2 is arranged on the other side face, so as to be selectively stoppable at a middle position Q2 and a forward edge position Q3 for the wafer carrier. Also, an aligning board 44 of a wafer-aligning device T is arranged between the first wafer sensor device S1 and the second wafer sensor device S2 so as to be selectively stoppable at each first and second middle position Q4 and Q5 and a forward edge position Q6 . The wafer-aligning device T is constituted so as to be movable back and forth independently of each first and second wafer sensor device S1 and S2 .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a vertical semiconductor manufacturing apparatus for detecting the presence or absence of a wafer in each storage shelf of a wafer carrier on a carrier stage device.
The present invention relates to a wafer detection device configured to perform wafer alignment at the same time.

[0002]

2. Description of the Related Art As shown in FIG. 1, a vertical type semiconductor manufacturing apparatus mounts a wafer boat B in a state where a large number of wafers are mounted in a multistage manner on a wafer support called a wafer boat B. By inserting it into the reactor just above and heating it,
This is an apparatus for performing a chemical treatment on the wafer W. This vertical semiconductor manufacturing apparatus is a carrier loader device (not shown) for inverting a wafer carrier C in which a large number of wafers W are stored in a vertical direction by 90 ° to horizontally store the stored wafers W.
And a carrier stage device A capable of rotating by a predetermined angle while the wafer carrier C is placed thereon, and a wafer W stored in a multistage shape in the wafer carrier C on the carrier stage device A, and A transfer robot device R for transferring the wafer W to the wafer boat B is provided, and each of these devices is disposed along a moving path of the wafer W in each processing chamber.

Here, the wafer W to be subjected to the chemical treatment is:
The wafer carrier C is loaded into the processing chamber while being vertically accommodated in the wafer carrier C, and the wafer carrier C is inverted by 90 ° by the carrier loader device (not shown).
The wafer W is placed on the carrier stage apparatus A after the storage posture of the wafer W is changed to the horizontal. Not all wafers W are stored in the respective storage shelves of the wafer carrier C, and wafers W may be stored in a part of the wafer W in a previous process in a state of being partially missing. Further, as described above, the wafer carrier C is inverted by 90 ° by the carrier loader device (not shown), and the storage posture of the wafer W is changed from vertical to horizontal. Placed on For this reason, some wafers W stored in the wafer carrier C on the carrier stage device A may protrude forward from a regular position that is concentric with the other wafers W when viewed from above.

[0004] As shown in FIGS. 17 and 18, a large number of storage shelves 52 are mounted on a carrier body 51.
Are provided in the up-down direction, and the ultra-thin disk-shaped wafer W is pushed into the storage shelf 5
2, the two outer peripheral surfaces of the wafer W come into contact with the arc-shaped inner peripheral surface 54 symmetrically provided in the back of the carrier body 51, and are stored in the regular storage position in the wafer carrier C. You. That is, wafer alignment is performed.

When a large number of wafers W are mounted on the wafer boat B in a multi-stage manner to perform a chemical treatment by heating,
If a missing portion of the wafer W is present in a part of the wafer W, or if there is a wafer W that is not concentric with other wafers W, the heating atmosphere of each of the wafers W is different from the other portions. This adversely affects the chemical treatment of the wafer W. For this reason, it is desirable to carry out the chemical treatment by mounting the wafers W on each stage of the wafer boat B such that the wafers W are not missing and are concentric with each other. In order to respond to this situation, as shown in FIGS. 19 and 20, a large number of wafer sensors 55 are attached to the movable body 56 at the same pitch as the storage pitch of a large number of wafers W stored in the wafer carrier C in multiple stages. The aligning plate 57 moves forward and backward with respect to the mounted wafer sensor device S ′ and the wafer carrier C on the carrier stage device A, and aligns a large number of wafers W stored in the wafer carrier C for proper storage. A wafer detection device K ′ having a wafer alignment device T ′ for storing in a position is used in the art. The wafer detection device K ′ is configured such that the wafer sensor device S ′ and the wafer alignment device T ′ are integrated with each other, and advance and retreat with respect to the wafer carrier C on the carrier stage device A.
The wafer sensor 55 of the wafer sensor device S ′ is moved between the wafers W stored in the wafer carrier C in a state where the wafer W ′ projecting from the normal storage position is pushed into the normal storage position by the advancement of the alignment plate 57. To detect the presence or absence.

The size of the wafer W stored in the wafer carrier C and carried into the processing chamber is not limited to one type, and a plurality of types of wafers W may be chemically processed by the same vertical semiconductor manufacturing apparatus. Sometimes you have to.
For example, for each of the 8-inch, 6-inch, and 5-inch wafers W, the storage pitch with respect to the wafer carrier C is 6.35 mm for the 8-inch wafer W, and 4.35 mm for the 6-inch and 5-inch wafers W. 76 mm. When processing three types of wafers W having different sizes, a number of wafer sensor devices S ′ corresponding to the types of storage pitches for the wafer carrier C are required. In this example, two types are required. The wafers W of 6 inches and 5 inches have different thicknesses, and the thicker wafers have a thickness of 2 mm. In this case, the interval between the wafers W that rise and fall within the wafer carrier C is 2.76 mm, and the existing wafer sensor 55 interferes with the wafers W and cannot be inserted between the wafers W. 17 and 18, reference numeral 58 denotes a pneumatic cylinder for moving the wafer sensor device S 'and the wafer aligning device T' forward and backward.

The conventional wafer detecting device K 'has a structure in which the wafer sensor device S' and the wafer aligning device T 'are integrally advanced and retracted. For those with a thickness of 2 mm,
There is a problem that not only the presence / absence cannot be detected but also the wafer alignment cannot be performed.

[0008]

A first object of the present invention is to provide a vertical semiconductor manufacturing apparatus having the above-described wafer sensor device, wherein each wafer sensor constituting the wafer sensor device is inserted between each wafer in a wafer carrier. The second problem is that the wafer alignment apparatus can be shared with a plurality of wafer sensor apparatuses even when the wafer alignment apparatus cannot be used. The purpose is to simplify the overall configuration.

[0009]

SUMMARY OF THE INVENTION In order to solve the first problem, the present invention is directed to a wafer stage mounted on a side of a carrier stage device on which a wafer carrier is placed, the wafers being accommodated in the wafer carrier in a multistage manner. A wafer sensor device in which a number of wafer sensors are mounted on the mounting plate at the same pitch as the storage pitch of the wafer carrier, and the alignment plate is advanced and retracted with respect to the wafer carrier; A wafer aligner for accommodating a large number of wafers accommodated in the carrier at a regular storage position, wherein the wafers projecting from the regular storage position of the wafer carrier by advancing the alignment plate of the wafer alignment device. Is pushed in and stored in the proper position, and each wafer sensor of the wafer sensor device is placed between each wafer stored in the wafer carrier. Is input, a wafer detection apparatus for detecting the presence or absence, the wafer orientation device is characterized in that it is configured to advance and return independently of the Wehasensa device. The present invention for solving the second problem is that the wafer alignment device can be shared with a plurality of wafer sensor devices.

When a wafer sensor can be inserted between the wafers, the wafer sensor device advances, and the wafer sensor is inserted between the wafers to detect the presence or absence of the wafer. At substantially the same time, the wafer aligning device advances, and the aligning plate pushes in the wafers that have protruded from the normal storage position, and stores each wafer in the normal position. If the wafer sensor cannot be inserted between the wafers, only the wafer aligning device advances, and the aligning plate pushes in the wafers protruding from the normal storage position to store each wafer in the normal position. In this case, the wafer sensor device is waiting at the retreat end position, and the presence or absence of a wafer is not detected.

When a plurality of wafer sensor devices are provided, each of the wafer sensor devices has a different storage pitch.
It is provided corresponding to each wafer of the group. The wafer alignment device is arranged so as to be shared by a plurality of wafer sensor devices, and can be stopped at an intermediate position corresponding to a plurality of types of wafers. When detecting the presence or absence of a wafer having a storage pitch of one group, the wafer sensor device advances to a position corresponding to the storage pitch of the wafer. At about the same time, the wafer aligner advances to a position corresponding to the wafer. As a result, the operation of detecting the presence or absence of a wafer having the storage pitch of one group and the operation of storing the protruding wafer at a proper position are performed. In exactly the same way, the wafer sensor device advances to a position corresponding to the storage pitch of the other group. At about the same time, the wafer aligner advances to a position corresponding to the wafer. As a result, the operation of detecting the presence or absence of the wafer having the storage pitch of the other group and the operation of storing the protruding wafer at the proper position are performed. In any case, when the wafer sensor cannot be inserted between the wafers, only the wafer aligning device moves forward, and the aligning plate pushes in the wafers protruding from the normal storage position to store each wafer in the normal position. Only done.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail by way of examples. FIG. 1 is a side view of main devices constituting a vertical semiconductor manufacturing apparatus, and FIG. 2 is a carrier stage device A.
FIG. 3 is a plan view of a wafer detection device K provided with a wafer alignment device T according to the present invention and a carrier stage device A, and FIG. 4 is a rear view of the wafer detection device K. As shown in FIG. 1, the vertical semiconductor manufacturing apparatus of the present embodiment mainly includes a wafer detecting device K, a carrier stage device A, a transfer robot device R, and a wafer boat B according to the present invention. The wafer W taken out from the lowermost stage of the wafer carrier C placed on the carrier stage device A by the operation of the transfer robot device R is stored in the storage shelf of the wafer boat B from the uppermost stage, and the wafer boat B reacts. The wafer W is inserted into the kettle and subjected to chemical treatment. The wafer detection device K provided with the wafer alignment device T according to the present invention includes:
It is arranged on the side of the carrier stage device A. The center line CL of the wafer detection device K is the carrier stage device A
, The wafer alignment device T is disposed on the center line CL, and the first and second wafer sensor devices S ₁ and S ₂ are substantially symmetrical with respect to the center line CL. Are located. Then, the advancing and retreating directions of the aligning plate 44 (described later) constituting the wafer aligning device T and the first and second wafer sensor devices S ₁ and S ₂ are parallel to each other,
The aligning plate 44 of the wafer aligning device T is directed in the radial direction of the carrier stage device A (the wafer W stored in the wafer carrier C).
(In the radial direction of the wafer carrier), and the first and second wafer sensor devices S ₁ , S ₂ advance and retreat substantially along the radial direction of the wafer W stored in the wafer carrier C.

First, the carrier stage device A will be described. As shown in FIGS. 1 and 2, a carrier stage device A of the present embodiment includes a plurality of carrier stands 3 on a three-stage carrier table 2 provided on a carrier support 1.
Are mounted at equal intervals along the circumferential direction. A wafer carrier C containing a large number (25 in this embodiment) of wafers W is placed in a substantially central portion of the carrier stand 3. Each wafer carrier C is placed so that the center D of the wafer W accommodated therein is arranged on the same pitch circle PC centering on the carrier column 1. The carrier column 1 is rotated by a set angle by a driving unit (not shown). Then, the wafer W in the wafer carrier C is taken out by the wafer transfer hand 5 attached to the tip of the arm 4 of the transfer robot device R.

As shown in FIG. 2, the carrier stage device A of this embodiment has three sizes (8 inches, 6 inches).
Inch, 5 inch) and two thicknesses t ₁ , t ₂ (0.8m
m, 2 mm) are placed in a state of being accommodated in the corresponding wafer carriers C, respectively. Table 1 shows the wafer W and the wafer carrier C used in this embodiment. In the present specification, hereinafter, only when it is necessary to distinguish the wafer W and the wafer carrier C by their sizes and thicknesses t ₁ and t ₂ , the “wafers W _{11 to} W ₃₁ (wafers of thickness t ₁ )” , the W ₁₂ to _W-32 (wafer having a thickness of t ₂₎ ", referred to as a" wafer carrier C ₁ -C ₃ ". These wafers W
Are stored at different pitches P ₁ and P _{2 and} are divided into two groups. That is, an 8-inch wafer W ₁₁
, The storing pitch P ₁ when W ₁₂ is accommodated in the wafer carrier C ₁ is 6.35 mm, a 6-inch wafer W _21,
W ₂₂ and 5-inch wafers W _31, W ₃₂ is the storing pitch P ₂ are both 4.7 when accommodated in the wafer carrier C _2, C ₃
6 mm. Note that the hatched portions in Table 1 are not used in this embodiment.
In this embodiment, for simplicity of explanation, a form in which a 6-inch wafer W ₂₁ (W ₂₂ ) is disposed adjacent to an 8-inch wafer W ₁₁ (W ₁₂ ). It will be described as.

[0015]

[Table 1]

The wafer detecting device K will be described. As shown in FIGS. 1 and 3, the wafer detection device K of this embodiment has a configuration in which a column 7 having a C-shaped cross section is erected on a rectangular base 6. The plan view have been first Wehasensa device S ₁ is disposed on the left side of the strut 7 (see FIG. 3), a second Wehasensa device S ₂ is disposed on the right side. The first and second wafer sensor devices S ₁ and S ₂ are:
This corresponds to the storage pitches P ₁ and P ₂ of the wafer W. That is,
The first wafer sensor device S ₁ has a storage pitch P ₁ of 6.3.
5 mm wafer (8 inch wafer W ₁₁ ,
W ₁₂ ), which is advanced and retracted by a first pneumatic cylinder 9 (described later). The second Wehasensa device S ₂ is the storing pitch P ₂ is a device for the wafer (size is 6 inch wafer W _21, W ₂₂ and 5-inch wafers W _31, W ₃₂₎ of 4.76 mm, the It is moved forward and backward by the second and third pneumatic cylinders 25 and 28 (both will be described later). First Wehasensa apparatus S ₁ and between the second Wehasensa device S _2, the wafer orientation device T is disposed.

[0017] First, a description will be given of the first Wehasensa apparatus S ₁ and its supporting member. First wafer sensor device S ₁
Are the shareable to the wafer W _11, W ₁₂ of the two thicknesses t _1, t ₂ at 8 3in of first, the wafer W ₁₁ thickness t ₁ (0.8 mm) Will be described as a device for Then, a first Wehasensa support member of the apparatus S ₁ and the second Wehasensa device S ₂ of the support member, most because they have the same function, the same reference numerals are assigned to the mutually corresponding members, first the subscript "a" is the sign of the support member Wehasensa apparatus S _1, the sign of the second Wehasensa device S ₂ of the support member will be denoted the subscript "b". As shown in FIGS. 3 to 5, a support bracket 8 a having an L-shaped cross section is fixed to the upper part of both sides of the column 7 along the vertical direction. A first pneumatic cylinder 9 is mounted horizontally near the center in the vertical direction of the support bracket 8a. A sensor mounting plate 12a is vertically mounted on the tip of the cylinder rod 11 of the first pneumatic cylinder 9. The sensor mounting plate 12a is attached along the vertical direction, its length, the length corresponding to each wafer carrier C ₁ placed on the carrier stand 3 of three-stage constituting the carrier stage device A It is.

A guide bush 13a is mounted on the upper and lower ends of the support bracket 8a. A guide rod 14a is horizontally mounted along the longitudinal direction of the cylinder rod 11 at a position corresponding to the guide bush 13a on the sensor mounting plate 12a, and is inserted through the guide bush 13a. Therefore, when the cylinder rod 11 of the first pneumatic cylinder 9 is protruded, the sensor mounting plate 12a
It moves forward while being guided by 4a. Further, the support bracket 8a and the sensor mounting plate 12a are connected by two stopper rods 15a. As shown in FIGS. 5 to 7, the front end of the stopper rod 15a is mounted on the sensor mounting plate 12a. The support plate 8a is fixed to the back surface of the support bracket 8a, and the stopper rod 15a is inserted through the support bracket 8a and the support plate 16a, and the male screw portion 1 at the rear end thereof is provided.
A stopper nut 18a and a locking nut 19a are screwed to 7a. When the cylinder rod 11 of the first pneumatic cylinder 9 is projected, the stopper nut 18a
6a, the forward end position of the sensor mounting plate 12a is determined. That is, by adjusting the screwing position of the stopper nut 18a against the male screw portion 17a of the stopper rod 15a, to adjust the forward end position of the sensor mounting plate 12a (first Wehasensa apparatus S ₁ of the forward end position Q ₁₎ it can. On the front surface of the sensor mounting plate 12a,
Each of the three _first wafer sensor devices S ₁ is connected to each wafer carrier C.
₁ is installed facing each other.

[0019] a description will be given of the first Wehasensa apparatus S _1. As shown in FIGS. 8 and 9, the front surface portion of the movable member 21a constituting the Wehasensa apparatus S _1, the sensor support plate 22 corresponding to the number of wafers W ₁₁ accommodated in the wafer carrier C ₁ is , storing pitch P of the wafer W ₁₁
Projected at the same pitch as ₁ . The light emitting element 23a of the wafer sensor 23 is attached to the lower surface of each sensor support plate 22 except for the lowermost sensor support plate 22a, and the upper surface of each sensor support plate 22 except for the uppermost sensor support plate 22b, A light receiving element 23b is mounted at a position facing the light emitting element 23a. The pair of the light emitting element 23a and the light receiving element 23b are viewed from the front of the sensor support plate 22 (FIG.
(See Reference). As shown in FIG. 15, by advancing the movable member 21a, when to insert the Wehasensa 23 between and if the wafer W _11, presence or absence of the wafer W ₁₁ size 8 inch in the wafer carrier C ₁ is detected You.

Next, FIG. 3, with reference to FIGS. 10 and 11, a description will be given of the second Wehasensa device S ₂ and the support member. Configuration of the second Wehasensa device S _2, except that the mounting pitch of the sensor support plate 22 are different, because it is exactly the same as the first Wehasensa device S ₁ structure, where, the first support member Wehasensa device S ₁ Only different parts will be described. An L-shaped cylinder bracket 24 is fixed to a side portion of the column 7 and a rear portion near a center in the vertical direction of the support bracket 8b. The front end of the cylinder rod 26 of the second pneumatic cylinder 25 is attached to the cylinder bracket 24. Further, a lower end of a bracket 27 bent into a crank shape is attached to an end of the second pneumatic cylinder 25 opposite to the cylinder rod 26. The rear end of the third pneumatic cylinder 28 is attached to the upper end of the bracket 27 along the axial direction of the second pneumatic cylinder 25. Cylinder rod 2 of third pneumatic cylinder 28
9 is attached to the sensor attachment plate 12b. Since the substantially central portion in the longitudinal direction of the support bracket 8b is cut off, there is no problem in mounting the third pneumatic cylinder 28. On the front surface of the sensor mounting plate 12b, corresponding to the wafer carriers C ₂ and C ₃ mounted on the three-stage carrier stand 3 of the carrier stage device A,
Second Wehasensa device S ₂ is attached three. Only the third pneumatic cylinder 28 or the second pneumatic cylinder 25
And Operating the both third pneumatic cylinder 28, the second Wehasensa device S ₂ mounted to the sensor mounting plate 12b is being guided by the two guide rods 14b while moving forward and backward. Each of the wafers W ₂₁ and W ₃₁ having a thickness t ₁ (0.8 mm) and a size of 6 inches and 5 inches has the same storage pitch P ₂ (4.76) in each of the wafer carriers C ₂ and C _3.
mm), the second wafer sensor device S
₂ is commonly used for the 6-inch and 5-inch wafers W ₂₁ and W ₃₁ .

Here, only the third pneumatic cylinder 28 is operated, and its cylinder rod 29 is projected. Then, as shown in FIGS. 10 and 15, second Wehasensa device S ₂ is presence on the size of the wafer W ₂₁ 6 inches is advanced to the intermediate position Q ₂ detectable. In this state, the cylinder rod 2 of the second pneumatic cylinder 25
6 is projected. Then, since the distal end of the cylinder rod 26 is attached to the cylinder bracket 24, the second pneumatic cylinder 25 itself is advanced. At the same time, the third pneumatic cylinder 28 is also advanced. Then, FIGS. 11 and 15
As shown, the second Wehasensa device S _2, it existence for the wafer W ₃₁ size of 5 inches is advanced to the advanced end position Q ₃ detectable. In this way, only the third pneumatic cylinder 28, or both by selectively activating the second pneumatic cylinder 25 and the third pneumatic cylinder 28, with the thickness t ₁ 6-inch or 5 3in the presence or absence of each wafer W _21, W ₃₁ is detected in the.

Next, the wafer aligning apparatus T will be described. As shown in FIGS. 3 and 12, an L-shaped cylinder bracket 31 is fixed to one side surface of the column 7. The distal end of a cylinder rod 33 of a fourth pneumatic cylinder 32 disposed along the front-rear direction of the wafer detection device K is attached to the cylinder bracket 31. A lower end of a bracket 34 bent into a crank shape is attached to a rear end of the fourth pneumatic cylinder 32. At the upper end of the bracket 34,
Along the axial direction of the cylinder rod 33 of the fourth pneumatic cylinder 32, the cylinder rod 3 of the fifth pneumatic cylinder 35
6 are attached. The rear end face of the fifth pneumatic cylinder 35 is provided with the cylinder rod 3 of the fifth pneumatic cylinder 35.
The rear end face of the sixth pneumatic cylinder 37 is mounted on the same straight line as the axis of the sixth cylinder. Since the opening 38 is provided in the portion of the column 7 where the sixth pneumatic cylinder 37 is provided, the sixth pneumatic cylinder 37 can be attached without any trouble. The above-described fourth to sixth pneumatic cylinders 32, 3
The axes 5 and 37 are arranged along the radial direction of the wafer W. The distal end of the cylinder rod 39 of the sixth pneumatic cylinder 37 is attached to an attachment plate 41 disposed along the up and down direction of the column 7. A guide bush 42 is mounted on the support column 7 above and below the sixth pneumatic cylinder 37. Each guide rod 43 mounted at a position corresponding to the guide bush 42 on the mounting plate 41 is a guide. The bush 42 is inserted. As shown in FIGS. 13 and 14, when any one of the cylinder rods 33, 36, 39 of the fourth to sixth pneumatic cylinders 32, 35, 37 is projected, the mounting plate 41 becomes two guides. It advances while being guided by the rod 43. The mounting plate 41 includes the pneumatic cylinders 32, 35,
37, the first intermediate positions Q ₄ , 6 corresponding to the wafers W _11, W ₁₂ having a size of 8 inches.
It can be stopped at any of the forward end position Q ₆ corresponding to the second intermediate position Q _5, 5 inch size wafer W _31, W ₃₂ which corresponds to the inch size wafer W _21, W ₂₂ .

In front of the mounting plate 41, three aligning plates 44 are provided along the vertical direction of the mounting plate 41, and each wafer carrier C ₁ mounted on the three-stage carrier stand 3 of the carrier stage device A. It is attached at a position corresponding to the height of the -C _3. Two movable rods 45 project from the rear end face of each alignment plate 44 at a predetermined interval, are inserted into the guide cylinder 46, and protrude from the rear end face of the mounting plate 41. At the rear end of each movable rod 45, a retaining ring 47 is mounted, and has a function of retaining. Further, since a compression spring 48 is elastically mounted on each movable rod 45, each alignment plate 44 is constantly urged forward.

The operation of the wafer detecting apparatus K according to the present invention will be described with reference to FIG. 3, FIG. 5, and FIGS. First, 8-inch 6 inches describes the operation of each wafer W _11, W _21, W ₃₁ of thickness at 5 inches of t _1. As shown in FIG. 3, when the carrier column 1 of the carrier stage device A is rotated by a set angle,
It housed in the wafer detecting device K and the wafer carrier C ₁ 8
And the wafer W ₁₁ size of inch is opposed, the wafer W
The center D of ₁₁ is located on the center line CL of the wafer detection device K. As shown in FIGS. 5 and 15, the cylinder rod 11 of the first pneumatic cylinder 9 is projected. The second and third of each pneumatic cylinders 25 and 28 to advance and return a second Wehasensa device S ₂ have their cylinder rod 2
Stand by with 6,29 retracted. First Wehasensa device S ₁ is advanced together with the sensor mounting plate 12a, and stops at the advanced end position Q _1. In this state, between and if the wafer W ₁₁ is inserted Wehasensa 23, the wafer W size 8 inch in the wafer carrier C ₁
The presence or absence of ₁₁ is detected.

As shown in FIGS. 12 and 15, almost simultaneously with the projection of the cylinder rod 11 of the first pneumatic cylinder 9, the cylinder rod 39 of the sixth pneumatic cylinder 37 is projected. Mounting plate 41 is advanced, stopped at the first intermediate position Q ₄ of the wafer orientation device T. Alignment plate 44
Accordingly, the wafer W ₁₁ projecting from the normal position of the wafer carrier C ₁ is pressed, all the wafers W ₁₁ is accommodated in the accommodating position of normal. That is, wafer alignment is performed. Each aligning plate 44, because it is biased via a compression spring 48, never wafer W ₁₁ is damaged. After Doo alignment detection and wafer presence or absence of the wafer W ₁₁ is performed in the wafer carrier C _1, the pneumatic cylinders 9 of the first and sixth,
Each of the 37 cylinder rods 11, 39 is retracted.

The carrier stage device A rotates by a set angle and stops. A wafer detection device K, 8 inch and the size of the wafer W 6 inch placed adjacent to ₁₁ the size of the wafer W ₂₁ is opposed, the center D a wafer detection device K of the wafer W ₂₁ Is located on the center line CL. As shown in FIGS. 10 and 15, the cylinder rod 29 of the third pneumatic cylinder 28 projects. 8 inch wafer W ₁₁
As with the second Wehasensa device S ₂ moves forward together with the sensor mounting plate 12b, and stops at an intermediate position Q ₂ of the second Wehasensa device S _2. In this state, the wafer W ₂₁ Wehasensa 23 is inserted into what is between the wafer W size 6 inch in the wafer carrier C _{2 21}
Is detected.

As shown in FIGS. 13 and 15, almost simultaneously with the protruding of the cylinder rod 29 of the third pneumatic cylinder 28, the cylinders of the fourth and sixth pneumatic cylinders 32, 37 The rods 33 and 39 are projected.
Mounting plate 41 is advanced, stopped at the second intermediate position Q ₅ of the wafer orientation device T. The alignment carrier 44 allows the wafer carrier C
Wafer W ₂₁ projecting from the position of the _second normalized is pushed, all the wafers W ₂₁ is accommodated in the accommodating position of normal.
That is, wafer alignment is performed. After performing preparative justified detection and wafer presence or absence of the wafer W ₂₁ is the wafer carrier C _2, the third, fourth and sixth respective pneumatic cylinders 28 and 32 of,
Each of the 37 cylinder rods 29, 33, 39 is retracted. Subsequently, as shown in FIGS. 11 and 15, the second and third pneumatic cylinders 2
5 and 28 and fourth to sixth pneumatic cylinders 32 and 3
5,37 actuated is collected by alignment detection and wafer sizes presence of the wafer W ₃₁ of 5 inches is performed.

The result detected by each of the wafer sensor devices S ₁ and S ₂ is taught to the transfer robot device R. Then, when the wafer transfer hand 5 of the transfer robot device R pulls out the wafer W, the wafer transfer hand 5 passes through the missing portion of the wafer W.
In this manner, the wafer transfer hand 5 of the transfer robot device R takes out the wafer W while passing through the missing portion of the wafer W in each wafer carrier C, and
To be stored. After the chemical processing of the wafer W is completed, the wafer transfer hand 5 of the transfer robot device R similarly stores the wafer W while passing through the missing portion of the wafer W in each wafer carrier C.

An 8-inch size and a thickness t ₁ (0.8 m
the wafer W ₁₁ of m), likewise the case of the wafer W ₁₂ thickness t ₂ (2 mm), since the storing pitch P ₁ is 6.35 mm, the wafer W ₁₁ relative to the thickness of the sensor support plate 22,
W ₁₂ How widely between the death (5.55mm, 4.35m
m), since the wafer sensor 23 can be inserted, both wafers W _{11 are}
The O aligned detected and the wafer presence or absence of W ₁₂ substantially can be performed simultaneously. Also, in the case of wafers W ₂₁ and W _{31 having} sizes of 6 inches and 5 inches and a thickness of t ₁ (0.8 mm), the storage pitch P ₁ is 4.76 mm. wafer W _21, W ₃₁ How widely between and are (3.96mm), can be similarly performing O aligned detection and wafer existence in comparison with. However, in the case of a wafer W _22, W ₃₂ of the thickness t ₂ (2 mm) in size 6 inches and 5 inches,
For storing pitch P ₁ is 4.76 mm, narrow between and if the wafer W _22, W ₃₂ relative to the thickness of the sensor support plate 22 (2.76 mm), it is impossible to insert the Wehasensa 23. Therefore, it is impossible to detect the presence of both the wafer W _22, W _32. These wafers W ₂₂ and W ₃₂
In this case, as shown in FIG. 16, only wafer alignment is performed. Whether the operation of the wafer detection device K of this embodiment is possible or not
It is shown in Table 1. In Table 1, .largecircle. Indicates that the wafer detection device K of the present embodiment can perform both the detection of the presence or absence of the wafer W and alignment of the wafer, and .DELTA. Indicates that the wafer can be aligned only. . The hatched portions of the wafer W are not used in this embodiment.

The wafer detecting device K of this embodiment has a configuration including two wafer sensor devices and one wafer aligning device, and the wafer aligning device is configured to be shared with the wafer sensor device. Therefore, detection of the presence or absence of two types of wafers having a size of 8 inches and thicknesses, alignment of the wafers,
It is possible to detect and align a wafer having a size of 6 inches or 5 inches and a thickness of 0.8 mm, and to align a wafer having a size of 6 inches or 5 inches and a thickness of 2 mm. However, a configuration having one second wafer sensor device and one wafer alignment device may be employed. In the case of the wafer detection apparatus of this embodiment, detection of presence / absence of a wafer having a size of 6 inches and 5 inches and a thickness of 0.8 mm and alignment of the wafer are performed. Similarly, in the case of a wafer having a thickness of 2 mm, only wafer alignment is performed.
Further, the third embodiment is a wafer detection device having a configuration including the first and second wafer sensor devices and one corresponding wafer alignment device. The operability of the wafer detection device of this embodiment is the same as that of the wafer detection device of this embodiment.

As shown in Table 1, the wafer detection apparatus of this embodiment can detect the presence or absence of four types of wafers and align the wafers, and can align the two types of wafers. It is. However, by mounting a plurality of pneumatic cylinders in a plurality of stages, it is also possible to adopt a configuration in which the presence or absence of more types of wafers can be detected and the wafers can be aligned. Further, in this embodiment, a plurality of pneumatic cylinders are arranged in series as a driving device for moving the second wafer sensor device and the wafer aligning device forward and backward. However, a single pneumatic cylinder may be used by using a multi-position cylinder. Further, a drive device other than the pneumatic cylinder may be used.

[0032]

The wafer detecting device according to the present invention includes a wafer sensor device and a wafer aligning device, which are configured to advance and retreat independently of each other. for that reason,
Even when the wafer is thick and a wafer sensor cannot be inserted into a wafer carrier in which the wafer is stored, the wafer can be aligned. When the wafer sensor can be inserted between the wafers, detection of the presence or absence of the wafer and alignment of the wafer can be performed almost simultaneously. Further, when the wafer alignment device can be shared by a plurality of wafer sensor devices, the overall configuration of the wafer detection device including the wafer alignment device can be simplified.

[Brief description of the drawings]

FIG. 1 is a side view of main devices constituting a vertical semiconductor manufacturing apparatus.

FIG. 2 is a plan view of the carrier stage device A.

FIG. 3 is a plan view of a wafer detection device K provided with a wafer alignment device T according to the present invention and a carrier stage device A.

FIG. 4 is a rear view of the wafer detection device K.

5 is a side view of the inserted state during the first Wehasensa device S ₁ is 8-inch size of the wafer W _11.

FIG. 6 is an enlarged side view of a part of a stopper rod 15a in a state where a cylinder rod 11 of a first pneumatic cylinder 9 is projected.

FIG. 7 is an enlarged side view of the retracted state.

8 is a side view of a first Wehasensa device S _1.

FIG. 9 is a sectional view taken along line XX of FIG. 8;

10 is a side view of the inserted state during the second Wehasensa device S ₂ is 6-inch size wafer W _21.

It is a side view of the inserted state during the wafer W ₃₁ in FIG. 11 also 5 inches size.

[12] the wafer orientation device T is a side view of a state in which the alignment wafer of the wafer W ₁₁ in the size of 8 inches.

[13] Also, a side view of a state in which the alignment size of the wafer of the wafer W ₂₁ 6 inches.

[14] Also, a side view of a state in which the alignment wafer of the wafer W ₃₁ size of 5 inches.

FIG. 15 is an operation explanatory diagram of each of the wafer sensor devices S ₁ and S ₂ and the wafer alignment device T for wafers W _11, W _{21 and} W _{31 having} a thickness t ₁ .

FIG. 16 is an operation explanatory diagram of each of the wafer sensor devices S ₁ and S ₂ and the wafer aligning device T for wafers W _12, W _{22 and} W _{32 having} a thickness t ₂ .

FIG. 17 is a front view of a wafer carrier C.

18 is a sectional view taken along line YY of FIG.

FIG. 19 is a side view of a conventional wafer alignment apparatus T ′.

FIG. 20 is a plan view similarly.

[Explanation of symbols]

A: Carrier stage device C _{1 to} C ₃ : Wafer carrier K: Wafer detection device P ₁ , P ₂ : Storage pitch Q ₁ : Advance end position of _first wafer sensor device Q ₂ : Intermediate position of second wafer sensor device Q ₃ : Advance end position of second wafer sensor device Q ₄ : First intermediate position of wafer alignment device Q ₅ : Second intermediate position of wafer alignment device Q ₆ : Advance end position of wafer alignment device S ₁ , S ₂ : Wafer sensor device T: wafer orientation device _{W 11, W 21, W 31} : wafer W ₁₂ having a thickness of 0.8mm, W _22, W _32: thickness 2mm wafer 21a: movable body (mounting plate) 21b: movable body (mounting plate 23: Wafer sensor 44: Alignment plate

Claims (3)

[Claims] 1. A large number of wafer sensors are mounted on a mounting plate at the same pitch as the storage pitch of each wafer stored in a multistage manner in the wafer carrier, which is installed on a side of a carrier stage device on which a wafer carrier is mounted. A wafer sensor device that is moved forward and backward with respect to the wafer carrier, and the alignment plate is moved forward and backward with respect to the wafer carrier,
A wafer aligner for accommodating a large number of wafers accommodated in the wafer carrier at a regular accommodation position, wherein the alignment plate of the wafer alignment device is advanced to protrude from the regular accommodation position of the wafer carrier. The wafer sensor of the wafer sensor device is inserted between the wafers housed in a wafer carrier in a state where the wafer is pushed in and housed in a regular position, and detects the presence or absence of the wafer sensor. A wafer detection device provided with a wafer alignment device, wherein the alignment device is configured to move forward and backward independently of the wafer sensor device. 2. A first method for detecting the presence or absence of two groups of wafers having different storage pitches with respect to a wafer carrier.
And a wafer alignment device is provided between the first and second wafer sensor devices, and the wafer alignment device can be shared by the first and second wafer sensor devices. Item 2. A wafer detection device provided with the wafer alignment device according to Item 1. 3. The first and second wafer sensor devices are arranged close to each other, and the directions of movement of the respective wafer sensor devices are parallel to each other and substantially along the radial direction of the wafer stored in each wafer carrier. A wafer detection device comprising the wafer alignment device according to claim 2.