JPH113931A - Container and aliphatic polyketone resin compound - Google Patents

Abstract

PROBLEM TO BE SOLVED: To give the charge preventive performance to the container in the less dimentional change while minimizing the production of abrasive particles and volatile component thereof, by a method wherein the component of the part in contact with semiconductor material is made of the composition containing carbon material and aliphatic polyketone, while specifying the surface resistivity of this component member. SOLUTION: A semiconductor wafer container 1 comprises opposing sidewalls 2a, 2b, a side end wall 3 connecting one end sidewalls 2a, 2b and a bridge supporting part 4 connecting the other end of the sidewalls 2a, 2b. Furthermore, in order to contain discal semiconductor wafers aligned in parallel in the arrow direction, the trenches 6a, 6b holding the side ends of the semiconductor wafers are oppositely bore inner surfaces 5a, 5b of the sidewalls 2a, 2b. In the container 1, the component member of the part in contact with the semiconductor material is made of a resin composition containing a carbon material and aliphatic polyketone as the essential components in the surface resistivity of 10<8> -10<12> Ω/sq.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container for storing a semiconductor material such as a silicon wafer and an aliphatic polyketone resin composition, and more particularly to a resin having excellent antistatic performance and causing contamination of the semiconductor material. Has antistatic performance with little abrasion powder and volatile matter (outgas etc.)
The present invention relates to a storage container for storing a semiconductor material such as a silicon wafer, and an aliphatic polyketone resin composition suitable as a material for the container.

[0002]

2. Description of the Related Art A storage container, for example, a wafer transfer cassette used in a semiconductor manufacturing process is required to have semi-permanent antistatic performance. This is because when electrostatically charged resin parts come into contact with electronic devices and processing equipment, they are damaged by electrostatic discharge, and the electrostatically charged wafer transport cassette attracts particles floating in the air to contaminate the wafers. This is because

[0003] Therefore, as a storage container having antistatic performance, polypropylene (PP) containing carbon fiber is used.
(JP-A-6-291177), polybutylene terephthalate (PBT) containing carbon fiber (JP-A-8-88266), a resin composed of polyetheretherketone (PEEK) containing carbon fiber and liquid crystal polyester. A container using the composition (JP-A-8-253671) has been proposed.

[0004]

However, the container made of PP or PBT containing carbon fibers satisfies the desired antistatic performance by containing carbon fibers, but has a problem derived from the performance of the resin. For example, P
A container formed of a crystalline resin such as P or PBT would have a large molding shrinkage unless crystallization was sufficiently performed during injection molding. In addition, these resins have low heat resistance, and may be deformed when the container is exposed to high temperatures. Further, the container formed from the composition containing PP as a main component,
Large amounts of volatiles (such as outgas) when exposed to high temperatures
There was a problem that occurred.

[0005] In addition, a resin composition containing PP, PBT, PEEK or the like as a main component contains a large amount of carbon fibers in order to exhibit antistatic performance. And other electronic components. Further, due to the contact between the electronic component and the resin container, the contact between the transfer device and the resin container, and the like, abrasion powder that causes contamination may be generated from the resin or the carbon fiber.

Accordingly, an object of the present invention is to provide an antistatic property, a small dimensional change in the environment in which the container is used, and a reduction in the amount of abrasion powder and volatile matter (such as outgas) that cause contamination of semiconductor materials. An object of the present invention is to provide an extremely small number of storage containers for storing semiconductor materials and an aliphatic polyketone resin composition suitable as a material for the containers.

[0007]

The present inventors have conducted various studies to solve these problems, and as a result, as a resin material for a container, a resin composition containing a carbon material and an aliphatic polyketone resin as main components is most suitable. Was found. Furthermore, it is possible to obtain a storage container that satisfies the required antistatic performance and reduces the generation of volatile components such as resin and carbon material abrasion powder and outgas that cause pollution by using a smaller amount of carbon material than before. We have found and completed the present invention.

That is, the present invention provides a container for storing a semiconductor material, wherein at least a constituent member of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin, An object of the present invention is to provide a storage container in which the surface resistivity of the component is 10 ⁸ to 10 ¹² Ω / sq.

Further, the present invention provides an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin as a resin composition suitable as a material for the storage container.

Hereinafter, the storage container and the aliphatic polyketone resin composition of the present invention (hereinafter, referred to as “resin composition of the present invention”) will be described in detail.

The container of the present invention is used for transporting, transporting, storing, processing, etc. materials such as semiconductor wafers such as silicon wafers, chips, bare chips, magnetic memory disk base plates, or various electronic parts. This is to store and hold the material and prevent its damage, fouling and the like. The shape, dimensions, and the like of the storage container are not particularly limited, and are appropriately selected according to the shapes, dimensions, and the like of the materials to be stored and held. The storage container of the present invention is used as a container for transport and storage of semiconductor wafers, magnetic memory disk base plates, and the like, and in various processes in a semiconductor manufacturing process, a magnetic memory disk manufacturing process, or between processes. On the way
It is used as a transport container for holding and storing semiconductor wafers, magnetic memory disk base plates, or members obtained by subjecting them to various types of processing. In particular, the storage container of the present invention is most suitable as a storage container (transport, storage and transport container) for semiconductor wafers.

As an example of the storage container, there is a semiconductor wafer storage container 1 shown in FIG. This semiconductor wafer storage container 1 separates a plurality of semiconductor wafers individually,
It is for support. The semiconductor wafer storage container 1 includes side walls 2a and 2b facing each other, a side end wall 3 connecting one end of the side walls 2a and 2b, a side wall 2a and a side wall 2a.
b, and a bridging support 4 connecting the other ends of the side walls 2a.
And inner surfaces 5a and 5b of side wall 2b are provided with grooves 6a and 6b for holding the side edges of the semiconductor wafer in order to house the disk-shaped semiconductor wafer in parallel in the direction of arrow A.
However, it has the structure drilled facing.

[0013] In the container of the present invention, at least a constituent member of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone as essential components. May be composed entirely of the aliphatic polyketone resin composition, or only the portion in contact with the semiconductor material may be composed of the aliphatic polyketone resin composition. For example, in the container for semiconductor wafer shown in FIG. 1, which is an example of the container of the present invention, the side walls 2a and 2b having the grooves 6a and 6b for holding the side edges of the semiconductor wafer are made of an aliphatic polyketone resin. Composed of a composition, or at least a groove 6a
And only the members forming 6b are made of the aliphatic polyketone resin composition. Further, the storage container shown in FIG. 1 may be an integrally molded product, or may be a product obtained by assembling respective components. Further, the storage container may be a composite of a constituent member made of the composition of the present invention and a constituent member made of another resin or metal. Furthermore, the composition of the present invention may be integrated with another resin, metal or reinforcing material by outer molding.

The storage container of the present invention is not limited to the storage container for semiconductor wafers shown in FIG. 1. For example, two opposite panels having a plurality of grooves for isolating and supporting a plurality of wafers. A wafer storage frame having the following, a case for accommodating the frame, a lid for the case, a wafer transport container formed of a wafer holding jig or various constituent members constituting the same, and processing of a silicon wafer / magnetic disk. Before and after the transfer, wafer transfer cassette used to transfer, store and process wafers and disks, transfer trays for wafers, magnetic disks, IC chips, etc., chip washer,
The present invention can be applied to semiconductor / electronic component-related storage containers such as electronic component packaging materials, magnetic disk cases, and various storage boxes.

The aliphatic polyketone (hereinafter abbreviated as “PK”), which is an essential component of the polyketone resin composition used as the material of the container of the present invention, contains carbon monoxide and at least one ethylenically unsaturated compound. And preferably a linear alternating polymer of an ethylenically unsaturated hydrocarbon and carbon monoxide, for example, a polymer having a repeating unit represented by the following formula (1). Is a semi-crystalline thermoplastic aliphatic resin.

[0016]

Embedded image

In the above formula (1), G represents a group derived from an ethylenically unsaturated compound and having at least 3 carbon atoms, n and m each represent a positive integer, and m / (n
+ M) is 0.5 or less. Among the ethylenically unsaturated compounds for forming G, examples of the ethylenically unsaturated hydrocarbon include vinyl such as propene, 1-butene, 2-methylpropene, 1-hexene, 1-octene and 1-dodecene. Compounds having a group are exemplified, and among these, propene is particularly preferred. Further, as another example of the ethylenically unsaturated compound, a polymer having a functional group such as an ether, an amide, or a phosphonate group in a molecule may be used by using vinyl ethyl ether, N-vinyl pyrrolidone, dimethyl bityl phosphonate, or the like. . Further, ethylenically unsaturated hydrocarbons having an aryl substituent, for example,
Styrene, p-methylstyrene, p-ethylstyrene,
m-isopropylstyrene or the like can also be used. P
In K, G may be composed of one or more of these ethylenically unsaturated compounds.

This PK usually has a melting point of 175 to 175.
The temperature is 300 ° C., and a temperature of 210 to 270 ° C. is typical.

The molecular weight of this PK is a limiting viscosity number (LVN) measured in m-cresol at 60 ° C. using a capillary viscometer (for example, Ubbelohde viscometer), preferably 0.5 to 10 dl / g. And particularly preferably 0.8 to 4 dl.
/ G.

As a specific example of this PK, Shell Chemical
One available from the company s under the trade name CARILON DP R-1000.

The carbon material, which is another essential component of the aliphatic polyketone resin composition, is blended for the purpose of improving antistatic performance. As the carbon material, for example, carbon powder represented by carbon black such as Ketjen black, pitch-based carbon fiber,
Various carbon fibers such as PAN-based carbon fibers are exemplified. This carbon material may have any shape and is not particularly limited. The amount of the polyketone resin composition and the shape thereof can be appropriately adjusted according to the required performance required for the storage container, for example, antistatic performance, mechanical performance, and the like. In particular, from the viewpoint of antistatic performance and maintaining the rigidity of the container at high temperatures, it is preferable to use carbon fibers alone or to use carbon fibers and carbon powder in combination. The compounding amount of the carbon material is
Usually, 1 to 50% by weight based on the total amount of PK and carbon material
, Preferably in the range of 2 to 30% by weight.

Further, the aliphatic polyketone resin composition comprises:
Other than the PK and the carbon material, other resins, antioxidants, reinforcing materials, and the like, as long as the object of the present invention is not impaired.
Various additives such as a stabilizer, a modifier, a rubber, and a coloring agent may be contained.

In the production of the aliphatic polyketone resin composition, PK, a carbon material, and various additives blended as required are supplied at a predetermined ratio to an extruder, a kneader, or the like, and are melt-kneaded. It can be performed according to a known method.

The production of the container of the present invention can be carried out by molding the aliphatic polyketone resin composition into a required shape. The molding method is not particularly limited, and for example, can be performed by a method such as injection molding. It is also possible to directly supply the PK and the carbon material or simultaneously supply the PK and the PK containing the high-concentration carbon material to the molding machine to perform molding.

The container of the present invention has a surface resistivity of 10⁸
-10¹²Ω / sq, preferably 10 ⁹-10¹¹Ω / sq
It is something that is. In the present invention, the constituent material of the storage container
Of aliphatic polyketone resin composition used as a filler
As a component, PK, the surface resistivity of the resin alone is different from that of other resins.
Low carbon material compared to conventional resin composition
Table of the above range required for antistatic performance depending on the blending of additives
It is considered that the sheet resistivity can be obtained. That is,
Inevitable amount of abrasion powder due to resin and carbon material falling off
In addition to the pollutants that carbon materials have,
For example, the inclusion of metals and volatiles can be avoided.
You. Furthermore, the storage container of the present invention has a low table that PK has.
Charging due to sheet resistance and antistatic effect of carbon material
It also has excellent damping performance. In addition, the storage container of the present invention
Is a source of abrasion powder due to its excellent abrasion resistance PK
It is thought that the falling off of possible carbon powder can be suppressed
It is.

[0026]

The present invention will be further described with reference to the following examples.

Example 1 Polyketone resin (Shell Chem)
Pallets consisting of a resin composition are prepared by melting and kneading 88% by weight of ICALS (trade name: CARILON DP R-1000) and 12% by weight of PAN-based carbon fiber (average fiber diameter: 6 μm, average fiber length: 70 μm). did. The pellets are supplied to an injection molding machine having a mold clamping force of 200 tons, and a cylinder temperature of 260 ° C., a mold temperature of 120 ° C., and an injection pressure of 100 ° C.
Molded under the condition of 0 kg / cm ² ,
An accommodating container (wafer transfer cassette) for an inch diameter wafer was manufactured. The obtained storage container was measured or evaluated for dimensional stability, surface resistivity, charge decay performance, outgas generation amount, and abrasion powder generation amount according to the following methods. Table 1 shows the results.

(1) Dimensional stability The molded storage container was washed with isopropyl alcohol using a dedicated wafer washing machine, and then dried with hot air at 80 ° C. Then, it was exposed to air at 150 ° C. for 2 minutes. At this time, the dimensions (length B (distance between facing grooves) shown in FIG. 1) of the wafer storage frame after the formation of the storage container and after the cleaning test were measured, and the value obtained by the following equation was calculated. Use as an index. [(Length after cleaning test)-(Length after molding)] / (Length after molding)

(2) Surface resistivity A test piece was cut out from the flat portion of the side wall 3 of the storage container in accordance with ASTM standard D-257, and the surface resistivity was measured.

(3) Charge Attenuation Performance A plate made of SUS was attached to the test piece of (2), and the test piece was charged to -5 kv, and then discharged to -0.5 kV.
The time to decay to v was measured. The discharge time within 0.5 seconds was evaluated as ○, the 0.5 to 1 second as Δ, and the case exceeding 1 second as X.

(4) Outgas Generation The storage container was cut, the cut piece was put in a vial, sealed, heated at 80 ° C. for 2 hours, and the collected gas was subjected to gas chromatography to derive from various gas components. The total area of the peaks to be calculated was calculated. For the gas generation amount, the outgas generation charge was similarly measured for a PP storage container containing a carbon material, and the peak total area of gas chromatography was calculated as 1
The values are shown as relative values when 00 is set.

(5) Amount of Wear Powder Generated 25 wafers cleaned with RCA (ammonia, hydrogen peroxide, water) are stored in a storage container, and are actually transported for one hour in a semiconductor manufacturing process. Was investigated. The number of abrasion powders having a size of 0.3 μm or more per wafer was 2 or less, 〜１０, 3 to 10;

(Examples 2 and 3) The types and amounts of carbon materials were
A storage container was manufactured in the same manner as in Example 1 except that the conditions were changed as shown in Table 1, and dimensional stability, surface resistivity, charge decay performance, outgas generation amount, and abrasion powder generation amount were measured or evaluated. As Ketjen Black, Ketjen Black EC manufactured by Ketjen Black International Co., Ltd. was used, and the same carbon fibers as those used in Example 1 were used. Table 1 shows the results.

(Comparative Examples 1 to 3)
A resin composition containing the same carbon fibers as those used in Example 1 and PP, PBT or PEEK in the amounts shown in Table 1 was prepared, and stored in the same manner as in Example 1 except that these resin compositions were used. The container was manufactured, and dimensional stability, surface resistivity, charge decay performance, outgas generation amount and abrasion powder generation amount were measured or evaluated. Table 1 shows the results.

[0035]

[Table 1]

From the results shown in Table 1, the semiconductor wafer storage container made of a resin composition composed of PK and a carbon material showed that the conventional containers shown in Comparative Examples in all of the evaluation items (1) to (5). It can be seen that this is superior to the storage container made of the resin (PP, PBT, PEEK). In addition, the storage containers of Comparative Examples 1 to 3 made of the conventional resin composition require a large amount of the carbon material compounded in order to exhibit the same surface resistivity as the example, and the outgas amount and the amount of abrasion powder are large. It turns out that it becomes.

When a semiconductor wafer storage container made of PK was actually used in a semiconductor manufacturing process, cleaning,
No problems occurred under any use environment such as drying and heat treatment, and the composition could be used favorably. Further, the antistatic property and the charge decay property were excellent, and no trouble caused by static electricity occurred.

[0038]

The storage container of the present invention has antistatic performance, has a small dimensional change under the environment in which the container is used, and generates abrasion powder and volatile matter (outgas, etc.) which cause contamination of semiconductor materials. Is extremely small. In addition, the storage container has a high dimensional accuracy and an extremely small amount of abrasion powder due to contact between the semiconductor material and the container during transfer, contact between the transfer device and the container, and the like. Further, it is excellent in heat resistance, chemical resistance, etc., maintains its shape even in various chemical liquid treatments, solvent washing, drying, and heating steps in a semiconductor manufacturing process, and has a very small amount of outgas.

Further, the aliphatic polyketone resin composition of the present invention is suitable as a material constituting the storage container of the present invention having the above characteristics.

[Brief description of the drawings]

FIG. 1 illustrates an example of a semiconductor wafer storage container.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Storage container for semiconductor wafers 2a, 2b Side wall 3 Side end wall 4 Bridge support part 5a, 5b Inner surface of side wall 6a, 6b Groove

Claims (4)

[Claims] 1. A container for storing a semiconductor material, wherein at least a component of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin. Surface resistivity is 10 ⁸ or more
A storage container having 10 ¹² Ω / sq. 2. The container according to claim 1, wherein the carbon material is at least one selected from carbon fibers and carbon powder. 3. An aliphatic polyketone resin composition comprising a carbon material and an aliphatic polyketone resin. 4. The aliphatic polyketone resin composition according to claim 3, wherein said carbon material is at least one selected from carbon fibers and carbon powders.