JPH113931A - Container and aliphatic polyketone resin compound - Google Patents
Container and aliphatic polyketone resin compoundInfo
- Publication number
- JPH113931A JPH113931A JP15367897A JP15367897A JPH113931A JP H113931 A JPH113931 A JP H113931A JP 15367897 A JP15367897 A JP 15367897A JP 15367897 A JP15367897 A JP 15367897A JP H113931 A JPH113931 A JP H113931A
- Authority
- JP
- Japan
- Prior art keywords
- container
- aliphatic polyketone
- semiconductor
- storage container
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Polyethers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、シリコンウエハ等
の半導体材料を収納する収納容器および脂肪族ポリケト
ン樹脂組成物に関し、特に、優れた帯電防止性能を有
し、半導体材料の汚染原因となる樹脂等の磨耗粉や揮発
分(アウトガスなど)の少ない帯電防止性能を有する、
シリコンウエハ等の半導体材料を収納する収納容器、お
よび該容器の素材として好適な脂肪族ポリケトン樹脂組
成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container for storing a semiconductor material such as a silicon wafer and an aliphatic polyketone resin composition, and more particularly to a resin having excellent antistatic performance and causing contamination of the semiconductor material. Has antistatic performance with little abrasion powder and volatile matter (outgas etc.)
The present invention relates to a storage container for storing a semiconductor material such as a silicon wafer, and an aliphatic polyketone resin composition suitable as a material for the container.
【0002】[0002]
【従来の技術】収納容器、例えば、半導体製造工程内で
用いられるウエハ搬送用カセットは、半永久的な帯電防
止性能を有することが求められる。これは、静電気によ
って帯電した樹脂部品が電子デバイスや処理装置に接触
すると、静電気放電によって損傷を与え、また、静電気
帯電したウエハ搬送用カセットは、空気中に浮遊する粒
子を引き寄せて、ウエハの汚染を招くからである。2. Description of the Related Art A storage container, for example, a wafer transfer cassette used in a semiconductor manufacturing process is required to have semi-permanent antistatic performance. This is because when electrostatically charged resin parts come into contact with electronic devices and processing equipment, they are damaged by electrostatic discharge, and the electrostatically charged wafer transport cassette attracts particles floating in the air to contaminate the wafers. This is because
【0003】そこで、帯電防止性能を有する収納容器と
して、カーボン繊維を含有するポリプロピレン(PP)
(特開平6−291177号公報)、カーボン繊維を含
有するポリブチレンテレフタレート(PBT)(特開平
8−88266号公報)、カーボン繊維を含有するポリ
エーテルエーテルケトン(PEEK)と液晶ポリエステ
ルとからなる樹脂組成物(特開平8−253671号公
報)を用いた容器が提案されている。[0003] Therefore, as a storage container having antistatic performance, polypropylene (PP) containing carbon fiber is used.
(JP-A-6-291177), polybutylene terephthalate (PBT) containing carbon fiber (JP-A-8-88266), a resin composed of polyetheretherketone (PEEK) containing carbon fiber and liquid crystal polyester. A container using the composition (JP-A-8-253671) has been proposed.
【0004】[0004]
【発明が解決しようとする課題】しかし、カーボン繊維
を含有するPPまたはPBTからなる容器は、カーボン
繊維の含有によって目的の帯電防止性能は満足するもの
の、樹脂の性能に由来する問題があった。例えば、P
P、PBT等の結晶性樹脂から形成される容器は、射出
成形時に結晶化を十分に行わないと成形収縮率が大きい
ものとなった。また、これらの樹脂は耐熱性が低く、容
器が高温に曝された場合に変形することがあった。さら
に、PPを主成分とする組成物から形成される容器は、
高温に曝された場合に大量の揮発分(アウトガスなど)
を発生するという問題があった。However, the container made of PP or PBT containing carbon fibers satisfies the desired antistatic performance by containing carbon fibers, but has a problem derived from the performance of the resin. For example, P
A container formed of a crystalline resin such as P or PBT would have a large molding shrinkage unless crystallization was sufficiently performed during injection molding. In addition, these resins have low heat resistance, and may be deformed when the container is exposed to high temperatures. Further, the container formed from the composition containing PP as a main component,
Large amounts of volatiles (such as outgas) when exposed to high temperatures
There was a problem that occurred.
【0005】また、PP,PBT,PEEK等を主成分
とする樹脂組成物は、帯電防止性能を発現するために大
量のカーボン繊維を配合するため、カーボン繊維に含ま
れる不純物や金属などによって半導体ウエハ等の電子部
品を汚染することがあった。さらに、電子部品と樹脂容
器との接触、搬送用装置と樹脂容器との接触等によって
樹脂やカーボン繊維から、汚染原因となる磨耗粉が発生
することがあった。[0005] In addition, a resin composition containing PP, PBT, PEEK or the like as a main component contains a large amount of carbon fibers in order to exhibit antistatic performance. And other electronic components. Further, due to the contact between the electronic component and the resin container, the contact between the transfer device and the resin container, and the like, abrasion powder that causes contamination may be generated from the resin or the carbon fiber.
【0006】そこで、本発明の目的は、帯電防止性能を
有し、容器の使用環境下において寸法変化が少なく、半
導体材料への汚染原因となる磨耗粉や揮発分(アウトガ
スなど)の発生量が極めて少ない、半導体材料を収納す
る収納容器、および該容器用の素材として好適な脂肪族
ポリケトン樹脂組成物を提供することにある。Accordingly, an object of the present invention is to provide an antistatic property, a small dimensional change in the environment in which the container is used, and a reduction in the amount of abrasion powder and volatile matter (such as outgas) that cause contamination of semiconductor materials. An object of the present invention is to provide an extremely small number of storage containers for storing semiconductor materials and an aliphatic polyketone resin composition suitable as a material for the containers.
【0007】[0007]
【課題を解決するための手段】本発明者は、これらの課
題を解決するために種々検討した結果、容器の樹脂材料
として、炭素材料と脂肪族ポリケトン樹脂を主成分とす
る樹脂組成物が最適であることを見出した。さらに、従
来よりも少ない炭素材料配合量によって、求められる帯
電防止性能を満足し、汚染原因となる樹脂や炭素材料の
磨耗粉およびアウトガスなどの揮発分の発生を抑えた収
納容器が得られることを見いだし、本発明を完成した。The present inventors have conducted various studies to solve these problems, and as a result, as a resin material for a container, a resin composition containing a carbon material and an aliphatic polyketone resin as main components is most suitable. Was found. Furthermore, it is possible to obtain a storage container that satisfies the required antistatic performance and reduces the generation of volatile components such as resin and carbon material abrasion powder and outgas that cause pollution by using a smaller amount of carbon material than before. We have found and completed the present invention.
【0008】すなわち、本発明は、半導体材料を収納す
る容器であって、少なくとも半導体材料と接触する部分
の構成部材が、炭素材料と脂肪族ポリケトン樹脂とを含
む脂肪族ポリケトン樹脂組成物からなり、該構成部材の
表面抵抗率が108 〜1012Ω/sqである収納容器を
提供するものである。That is, the present invention provides a container for storing a semiconductor material, wherein at least a constituent member of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin, An object of the present invention is to provide a storage container in which the surface resistivity of the component is 10 8 to 10 12 Ω / sq.
【0009】また、本発明は、前記収納容器の素材とし
て好適な樹脂組成物として、炭素材料と脂肪族ポリケト
ン樹脂とを含む脂肪族ポリケトン樹脂組成物を提供する
ものである。Further, the present invention provides an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin as a resin composition suitable as a material for the storage container.
【0010】以下、本発明の収納容器および脂肪族ポリ
ケトン樹脂組成物(以下、「本発明の樹脂組成物」とい
う)について詳細に説明する。Hereinafter, the storage container and the aliphatic polyketone resin composition of the present invention (hereinafter, referred to as “resin composition of the present invention”) will be described in detail.
【0011】本発明の収納容器は、シリコンウエハ等の
半導体ウエハ、チップ、ベアチップ、磁気メモリディス
ク素板、あるいは各種電子部品などの材料の輸送、搬
送、貯蔵、加工処理等を行う際に、該材料を収納・保持
し、その損壊、汚損等を防止するものである。この収納
容器の形状、寸法等は、特に限定されず、収納・保持す
る材料の形状、寸法等に応じて適宜選択される。本発明
の収納容器は、半導体ウエハ、磁気メモリディスク素板
等の輸送、貯蔵用の容器として、また、半導体製造工
程、磁気メモリディスクの製造工程等における各種の処
理において、または各工程間を搬送する途中において、
半導体ウエハ、磁気メモリディスク素板、またはそれら
に各種加工処理を施した部材を保持、収納するための搬
送用容器として用いられるものである。特に、本発明の
収納容器は、半導体ウエハの収納容器(輸送、貯蔵用お
よび搬送用容器)として最適なものである。The container of the present invention is used for transporting, transporting, storing, processing, etc. materials such as semiconductor wafers such as silicon wafers, chips, bare chips, magnetic memory disk base plates, or various electronic parts. This is to store and hold the material and prevent its damage, fouling and the like. The shape, dimensions, and the like of the storage container are not particularly limited, and are appropriately selected according to the shapes, dimensions, and the like of the materials to be stored and held. The storage container of the present invention is used as a container for transport and storage of semiconductor wafers, magnetic memory disk base plates, and the like, and in various processes in a semiconductor manufacturing process, a magnetic memory disk manufacturing process, or between processes. On the way
It is used as a transport container for holding and storing semiconductor wafers, magnetic memory disk base plates, or members obtained by subjecting them to various types of processing. In particular, the storage container of the present invention is most suitable as a storage container (transport, storage and transport container) for semiconductor wafers.
【0012】この収納容器の一例として、図1に示す半
導体ウエハ用収納容器1が挙げられる。この半導体ウエ
ハ用収納容器1は、複数の半導体ウエハを個別に隔離、
支持するためのものである。この半導体ウエハ用収納容
器1は、対向する側壁2aおよび2bと、側壁2aと側
壁2bの一端を連結する側端壁3と、側壁2aと側壁2
bの他端を連結する架橋支持部4とからなり、側壁2a
と側壁2bの内面5aおよび5bには、円板状の半導体
ウエハを矢印A方向に平行して整列して収納するため
に、半導体ウエハの側端を保持する溝6aおよび6b
が、対向して穿設されている構造を有するものである。As an example of the storage container, there is a semiconductor wafer storage container 1 shown in FIG. This semiconductor wafer storage container 1 separates a plurality of semiconductor wafers individually,
It is for support. The semiconductor wafer storage container 1 includes side walls 2a and 2b facing each other, a side end wall 3 connecting one end of the side walls 2a and 2b, a side wall 2a and a side wall 2a.
b, and a bridging support 4 connecting the other ends of the side walls 2a.
And inner surfaces 5a and 5b of side wall 2b are provided with grooves 6a and 6b for holding the side edges of the semiconductor wafer in order to house the disk-shaped semiconductor wafer in parallel in the direction of arrow A.
However, it has the structure drilled facing.
【0013】本発明の収納容器は、少なくとも半導体材
料と接触する部分の構成部材が、炭素材料と脂肪族ポリ
ケトンとを必須成分として含む脂肪族ポリケトン樹脂組
成物から構成されるものであり、収納容器の全体が脂肪
族ポリケトン樹脂組成物で構成されていてもよいし、半
導体材料と接触する部分のみが脂肪族ポリケトン樹脂組
成物で構成されていてもよい。例えば、本発明の収納容
器の一例である前記の図1に示す半導体ウエハ用収納容
器においては、半導体ウエハの側端を保持する溝6aお
よび6bを有する側壁2aと側壁2bを、脂肪族ポリケ
トン樹脂組成物で構成する、あるいは少なくとも溝6a
および6bを形成する部材のみを脂肪族ポリケトン樹脂
組成物で構成するものである。また、図1に示す収納容
器は、一体成形品であってもよいし、各構成部材を組立
たものであってもよい。さらに、この収納容器は、本発
明の組成物からなる構成部材と、他の樹脂または金属か
らなる構成部材とを複合化してなるものでもよい。さら
にまた、本発明の組成物と他の樹脂、金属または補強材
とをアウター成形によって一体化させてなるものでもよ
い。[0013] In the container of the present invention, at least a constituent member of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone as essential components. May be composed entirely of the aliphatic polyketone resin composition, or only the portion in contact with the semiconductor material may be composed of the aliphatic polyketone resin composition. For example, in the container for semiconductor wafer shown in FIG. 1, which is an example of the container of the present invention, the side walls 2a and 2b having the grooves 6a and 6b for holding the side edges of the semiconductor wafer are made of an aliphatic polyketone resin. Composed of a composition, or at least a groove 6a
And only the members forming 6b are made of the aliphatic polyketone resin composition. Further, the storage container shown in FIG. 1 may be an integrally molded product, or may be a product obtained by assembling respective components. Further, the storage container may be a composite of a constituent member made of the composition of the present invention and a constituent member made of another resin or metal. Furthermore, the composition of the present invention may be integrated with another resin, metal or reinforcing material by outer molding.
【0014】また、本発明の収納容器は、前記図1に示
す半導体ウエハ用収納容器に限定されず、例えば、複数
のウエハを隔離、支持するための複数の溝をもつ相対す
る2枚のパネルを有するウエハ収納枠と、該枠を収める
ケースと、ケースの蓋と、ウエハ押さえ治具から構成さ
れるウエハ輸送用容器またはそれらを構成する各種の構
成部材、シリコンウエハ・磁気ディスクの加工処理を行
う前後に、ウエハ・ディスクの搬送・貯蔵・処理等を行
うために用いるウエハ搬送用カセット、ウエハ・磁気デ
ィスク・ICチップ等の搬送用トレイ、チップ洗浄器、
電子部品包装材、磁気ディスクケース、各種保管用ボッ
クス等の半導体・電子部品関連の収納容器に適用するこ
とができる。The storage container of the present invention is not limited to the storage container for semiconductor wafers shown in FIG. 1. For example, two opposite panels having a plurality of grooves for isolating and supporting a plurality of wafers. A wafer storage frame having the following, a case for accommodating the frame, a lid for the case, a wafer transport container formed of a wafer holding jig or various constituent members constituting the same, and processing of a silicon wafer / magnetic disk. Before and after the transfer, wafer transfer cassette used to transfer, store and process wafers and disks, transfer trays for wafers, magnetic disks, IC chips, etc., chip washer,
The present invention can be applied to semiconductor / electronic component-related storage containers such as electronic component packaging materials, magnetic disk cases, and various storage boxes.
【0015】本発明の収納容器の素材として用いられる
ポリケトン樹脂組成物の必須成分である脂肪族ポリケト
ン(以下、「PK」と略記する)は、一酸化炭素と少な
くとも1種のエチレン性不飽和化合物との線状交互ポリ
マーであり、好ましくは、エチレン性不飽和炭化水素と
一酸化炭素との線状交互ポリマーであり、例えば、下記
式(1)で表される繰り返し単位を有する重合体からな
る、半結晶性の熱可塑性脂肪族系樹脂である。The aliphatic polyketone (hereinafter abbreviated as “PK”), which is an essential component of the polyketone resin composition used as the material of the container of the present invention, contains carbon monoxide and at least one ethylenically unsaturated compound. And preferably a linear alternating polymer of an ethylenically unsaturated hydrocarbon and carbon monoxide, for example, a polymer having a repeating unit represented by the following formula (1). Is a semi-crystalline thermoplastic aliphatic resin.
【0016】[0016]
【化1】 Embedded image
【0017】前記式(1)において、Gはエチレン性不
飽和化合物に由来する、少なくとも3個の炭素原子を有
する基を示し、nおよびmは正の整数を示し、m/(n
+m)が0.5以下である。Gを形成するためのエチレ
ン性不飽和化合物の中でも、エチレン性不飽和炭化水素
としては、例えば、プロペン、1−ブテン、2−メチル
プロペン、1−ヘキセン、1−オクテン、1−ドデセン
等のビニル基を有する化合物が例示され、これらの中で
は、特にプロペンが好ましい。また、エチレン性不飽和
化合物の他の例として、ビニルエチルエーテル、N−ビ
ニルピロリドン、ジメチルビチルホスホネート等を用
い、エーテル、アミドまたはホスホネート基等の官能基
を分子内に有する重合体としてもよい。さらに、アリー
ル置換基を有するエチレン性不飽和炭化水素、例えば、
スチレン、p−メチルスチレン、p−エチルスチレン、
m−イソプロピルスチレン等を用いることもできる。P
Kにおいて、Gは、これらのエチレン性不飽和化合物の
1種もしくは複数種から構成されるものであってもよ
い。In the above formula (1), G represents a group derived from an ethylenically unsaturated compound and having at least 3 carbon atoms, n and m each represent a positive integer, and m / (n
+ M) is 0.5 or less. Among the ethylenically unsaturated compounds for forming G, examples of the ethylenically unsaturated hydrocarbon include vinyl such as propene, 1-butene, 2-methylpropene, 1-hexene, 1-octene and 1-dodecene. Compounds having a group are exemplified, and among these, propene is particularly preferred. Further, as another example of the ethylenically unsaturated compound, a polymer having a functional group such as an ether, an amide, or a phosphonate group in a molecule may be used by using vinyl ethyl ether, N-vinyl pyrrolidone, dimethyl bityl phosphonate, or the like. . Further, ethylenically unsaturated hydrocarbons having an aryl substituent, for example,
Styrene, p-methylstyrene, p-ethylstyrene,
m-isopropylstyrene or the like can also be used. P
In K, G may be composed of one or more of these ethylenically unsaturated compounds.
【0018】また、このPKは、通常、融点が175〜
300℃であるものであり、210〜270℃のものが
典型的なものである。This PK usually has a melting point of 175 to 175.
The temperature is 300 ° C., and a temperature of 210 to 270 ° C. is typical.
【0019】このPKの分子量は、毛細管粘度計(例え
ば、ウベローデ型粘度計)を用い、60℃のm−クレゾ
ール中で測定した極限粘度数(LVN)で、好ましくは
0.5〜10dl/g、特に好ましくは0.8〜4dl
/gであるものである。The molecular weight of this PK is a limiting viscosity number (LVN) measured in m-cresol at 60 ° C. using a capillary viscometer (for example, Ubbelohde viscometer), preferably 0.5 to 10 dl / g. And particularly preferably 0.8 to 4 dl.
/ G.
【0020】このPKの具体例として、Shell Chemical
s 社から、商品名CARILON DP R−1000で市販されている
ものが挙げられる。As a specific example of this PK, Shell Chemical
One available from the company s under the trade name CARILON DP R-1000.
【0021】また、脂肪族ポリケトン樹脂組成物のもう
1つの必須成分である炭素材料は、帯電防止性能の向上
を目的として配合されるものである。この炭素材料とし
ては、例えば、ケッチェンブラック等のカーボンブラッ
クに代表されるカーボン粉末、ピッチ系カーボン繊維、
PAN系カーボン繊維等の各種カーボン繊維などが例示
される。この炭素材料は、いかなる形状のものであって
もよく、特に限定されない。また、ポリケトン樹脂組成
物における配合量、およびその形状は、収納容器に求め
られる要求性能、例えば、帯電防止性能、機械的性能等
に応じて適宜調整することができる。特に、帯電防止性
能および高温下での容器の剛性維持等の観点からは、カ
ーボン繊維単独、あるいは、カーボン繊維とカーボン粉
末とを併用することが好ましい。炭素材料の配合量は、
通常、PKと炭素材料の合計量に対して1〜50重量%
の範囲、好ましくは2〜30重量%の範囲である。The carbon material, which is another essential component of the aliphatic polyketone resin composition, is blended for the purpose of improving antistatic performance. As the carbon material, for example, carbon powder represented by carbon black such as Ketjen black, pitch-based carbon fiber,
Various carbon fibers such as PAN-based carbon fibers are exemplified. This carbon material may have any shape and is not particularly limited. The amount of the polyketone resin composition and the shape thereof can be appropriately adjusted according to the required performance required for the storage container, for example, antistatic performance, mechanical performance, and the like. In particular, from the viewpoint of antistatic performance and maintaining the rigidity of the container at high temperatures, it is preferable to use carbon fibers alone or to use carbon fibers and carbon powder in combination. The compounding amount of the carbon material is
Usually, 1 to 50% by weight based on the total amount of PK and carbon material
, Preferably in the range of 2 to 30% by weight.
【0022】さらに、脂肪族ポリケトン樹脂組成物は、
前記PKおよび炭素材料以外に、本発明の目的を阻害し
ない範囲において、他の樹脂や、酸化防止剤、補強材、
安定剤、改質剤、ゴム、着色剤等の各種添加剤を含有し
ていてもよい。Further, the aliphatic polyketone resin composition comprises:
Other than the PK and the carbon material, other resins, antioxidants, reinforcing materials, and the like, as long as the object of the present invention is not impaired.
Various additives such as a stabilizer, a modifier, a rubber, and a coloring agent may be contained.
【0023】この脂肪族ポリケトン樹脂組成物の製造
は、PKと炭素材料、および必要に応じて配合される各
種添加剤を、所定の割合で、押出機、ニーダー等に供給
して、溶融混練する公知の方法にしたがって、行うこと
ができる。In the production of the aliphatic polyketone resin composition, PK, a carbon material, and various additives blended as required are supplied at a predetermined ratio to an extruder, a kneader, or the like, and are melt-kneaded. It can be performed according to a known method.
【0024】本発明の収納容器の製造は、前記脂肪族ポ
リケトン樹脂組成物を、を所要の形状に成形することに
よって行うことができる。成形方法は、特に限定され
ず、例えば、射出成形等の方法によって行うことができ
る。また、PKと炭素材料を直接あるいはPKと高濃度
の炭素材料を含有するPKを同時に成形機に供給し、成
形することも可能である。The production of the container of the present invention can be carried out by molding the aliphatic polyketone resin composition into a required shape. The molding method is not particularly limited, and for example, can be performed by a method such as injection molding. It is also possible to directly supply the PK and the carbon material or simultaneously supply the PK and the PK containing the high-concentration carbon material to the molding machine to perform molding.
【0025】本発明の収納容器は、表面抵抗率が108
〜1012Ω/sq、好ましくは10 9 〜1011Ω/sq
であるものである。本発明において、収納容器の構成材
料として用いられる脂肪族ポリケトン樹脂組成物の必須
成分であるPKが、樹脂単体の表面抵抗率が他の樹脂に
比べて低いため、従来の樹脂組成物よりも少ない炭素材
料の配合によって、帯電防止性能に必要な前記範囲の表
面抵抗率を得ることができると考えられる。すなわち、
樹脂や炭素材料の脱落に起因する磨耗粉の発生量も必然
的に少なくなるほか、炭素材料が有する汚染原因物質、
例えば、含有金属や揮発物の混入も避けることができ
る。さらに、本発明の収納容器は、PKが有する低い表
面抵抗率と炭素材料による帯電防止効果によって、帯電
減衰性能にも優れるものである。また、本発明の収納容
器は、耐磨耗性に優れるPKにより、磨耗粉の発生源に
なり得るカーボン粉末の脱落が抑えられるものと考えら
れる。The container of the present invention has a surface resistivity of 108
-1012Ω / sq, preferably 10 9-1011Ω / sq
It is something that is. In the present invention, the constituent material of the storage container
Of aliphatic polyketone resin composition used as a filler
As a component, PK, the surface resistivity of the resin alone is different from that of other resins.
Low carbon material compared to conventional resin composition
Table of the above range required for antistatic performance depending on the blending of additives
It is considered that the sheet resistivity can be obtained. That is,
Inevitable amount of abrasion powder due to resin and carbon material falling off
In addition to the pollutants that carbon materials have,
For example, the inclusion of metals and volatiles can be avoided.
You. Furthermore, the storage container of the present invention has a low table that PK has.
Charging due to sheet resistance and antistatic effect of carbon material
It also has excellent damping performance. In addition, the storage container of the present invention
Is a source of abrasion powder due to its excellent abrasion resistance PK
It is thought that the falling off of possible carbon powder can be suppressed
It is.
【0026】[0026]
【実施例】以下、実施例によって本発明をさらに説明す
る。The present invention will be further described with reference to the following examples.
【0027】(実施例1)ポリケトン樹脂(Shell Chem
icals 社製 商品名CARILON DP R-1000 )88重量%と
PAN系カーボン繊維(平均繊維径:6μm、平均繊維
長:70μm)12重量%とを溶融混練して、樹脂組成
物からなるペレットを調製した。このペレットを、型締
力200tonの射出成形機に供給して、シリンダー温
度260℃、金型温度120℃、および射出圧力100
0kg/cm2 の条件で成形して、図1に示す構造の6
インチ径のウエハ用の収納容器(ウエハ搬送用カセッ
ト)を製造した。得られた収納容器について、下記の方
法にしたがって、寸法安定性、表面抵抗率、帯電減衰性
能、アウトガス発生量および磨耗粉発生量を測定または
評価した。結果を表1に示す。Example 1 Polyketone resin (Shell Chem)
Pallets consisting of a resin composition are prepared by melting and kneading 88% by weight of ICALS (trade name: CARILON DP R-1000) and 12% by weight of PAN-based carbon fiber (average fiber diameter: 6 μm, average fiber length: 70 μm). did. The pellets are supplied to an injection molding machine having a mold clamping force of 200 tons, and a cylinder temperature of 260 ° C., a mold temperature of 120 ° C., and an injection pressure of 100 ° C.
Molded under the condition of 0 kg / cm 2 ,
An accommodating container (wafer transfer cassette) for an inch diameter wafer was manufactured. The obtained storage container was measured or evaluated for dimensional stability, surface resistivity, charge decay performance, outgas generation amount, and abrasion powder generation amount according to the following methods. Table 1 shows the results.
【0028】(1)寸法安定性 成形された収納容器を、ウエハ専用洗浄機を用いてイソ
プロピルアルコールで洗浄した後、80℃の温風で乾燥
させた。その後、150℃の空気中に2分間曝した。こ
のとき、収納容器の成形後と洗浄試験後におけるウエハ
収納枠の寸法(図1に示す長さB(対面する溝間距
離))を測定し、下記の式で求められる値を寸法安定性
の指標とする。 〔(洗浄試験後長さ)−(成形後長さ)〕/(成形後長
さ)(1) Dimensional stability The molded storage container was washed with isopropyl alcohol using a dedicated wafer washing machine, and then dried with hot air at 80 ° C. Then, it was exposed to air at 150 ° C. for 2 minutes. At this time, the dimensions (length B (distance between facing grooves) shown in FIG. 1) of the wafer storage frame after the formation of the storage container and after the cleaning test were measured, and the value obtained by the following equation was calculated. Use as an index. [(Length after cleaning test)-(Length after molding)] / (Length after molding)
【0029】(2)表面抵抗率 ASTM規格D−257に準拠して、収納容器の側端壁
3の平面部から試験片を切出し、表面抵抗率を測定し
た。(2) Surface resistivity A test piece was cut out from the flat portion of the side wall 3 of the storage container in accordance with ASTM standard D-257, and the surface resistivity was measured.
【0030】(3)帯電減衰性能 (2)の試験片に、SUS製の板状電極を取り付け、試
験片を−5kvに帯電させた後、放電させて−0.5k
vにまで減衰する時間を測定した。放電時間0.5秒以
内を○、0.5〜1秒を△、1秒を超える場合を×と判
定した。(3) Charge Attenuation Performance A plate made of SUS was attached to the test piece of (2), and the test piece was charged to -5 kv, and then discharged to -0.5 kV.
The time to decay to v was measured. The discharge time within 0.5 seconds was evaluated as ○, the 0.5 to 1 second as Δ, and the case exceeding 1 second as X.
【0031】(4)アウトガス発生量 収納容器を切削し、切削片をバイアル瓶に入れて密閉
し、80℃で2時間加熱した後、採取したガスをガスク
ロマトグラフィーに供し、各種ガス成分に由来するピー
クの総面積を算出した。ガス発生量は、炭素材料を含有
するPP製収納容器について、同様にアウトガス発生料
を測定し、ガスクロマトグラフィーのピーク総面積を1
00とした場合の相対値で示した。(4) Outgas Generation The storage container was cut, the cut piece was put in a vial, sealed, heated at 80 ° C. for 2 hours, and the collected gas was subjected to gas chromatography to derive from various gas components. The total area of the peaks to be calculated was calculated. For the gas generation amount, the outgas generation charge was similarly measured for a PP storage container containing a carbon material, and the peak total area of gas chromatography was calculated as 1
The values are shown as relative values when 00 is set.
【0032】(5)磨耗粉発生量 収納容器にRCA(アンモニア、過酸化水素、水)洗浄
したウエハ25枚を収納し、実際に半導体製造工程内を
1時間搬送した後、ウエハへの磨耗粉の付着数を調査し
た。ウエハ1個あたりの0.3μm以上の磨耗粉の数が
2個以下を○、3〜10個を△、10個を超える場合を
×と判定した。(5) Amount of Wear Powder Generated 25 wafers cleaned with RCA (ammonia, hydrogen peroxide, water) are stored in a storage container, and are actually transported for one hour in a semiconductor manufacturing process. Was investigated. The number of abrasion powders having a size of 0.3 μm or more per wafer was 2 or less, 〜10, 3 to 10;
【0033】(実施例2、3)炭素材料の種類と量を、
表1に示すとおりに代えた以外は、実施例1と同様に収
納容器を製造し、寸法安定性、表面抵抗率、帯電減衰性
能、アウトガス発生量および磨耗粉発生量を測定または
評価した。なお、ケッチェンブラックは、ケッチェンブ
ラックインターナショナル(株)製ケッチェンブラック
ECを用い、カーボン繊維は実施例1で用いたものと同
じものを用いた。結果を表1に示す。(Examples 2 and 3) The types and amounts of carbon materials were
A storage container was manufactured in the same manner as in Example 1 except that the conditions were changed as shown in Table 1, and dimensional stability, surface resistivity, charge decay performance, outgas generation amount, and abrasion powder generation amount were measured or evaluated. As Ketjen Black, Ketjen Black EC manufactured by Ketjen Black International Co., Ltd. was used, and the same carbon fibers as those used in Example 1 were used. Table 1 shows the results.
【0034】(比較例1〜3)各例において、実施例1
で用いたものと同じカーボン繊維と、PP、PBTまた
はPEEKとを表1に示す配合量で含む樹脂組成物を調
製し、これらの樹脂組成物を用いた以外は、実施例1と
同様に収納容器を製造し、寸法安定性、表面抵抗率、帯
電減衰性能、アウトガス発生量および磨耗粉発生量を測
定または評価した。結果を表1に示す。(Comparative Examples 1 to 3)
A resin composition containing the same carbon fibers as those used in Example 1 and PP, PBT or PEEK in the amounts shown in Table 1 was prepared, and stored in the same manner as in Example 1 except that these resin compositions were used. The container was manufactured, and dimensional stability, surface resistivity, charge decay performance, outgas generation amount and abrasion powder generation amount were measured or evaluated. Table 1 shows the results.
【0035】[0035]
【表1】 [Table 1]
【0036】表1に示す結果から、PKと炭素材料とか
らなる樹脂組成物を素材とする半導体ウエハ用収納容器
は、(1)〜(5)のすべての評価項目において、比較
例に示す従来の樹脂(PP,PBT,PEEK)からな
る収納容器よりも優れたものであることが分かる。ま
た、従来の樹脂組成物からなる比較例1〜3の収納容器
は、実施例と同じ表面抵抗率を示すためには、多量の炭
素材料配合量が必要となり、アウトガス量や磨耗粉量が
多くなることが分かる。From the results shown in Table 1, the semiconductor wafer storage container made of a resin composition composed of PK and a carbon material showed that the conventional containers shown in Comparative Examples in all of the evaluation items (1) to (5). It can be seen that this is superior to the storage container made of the resin (PP, PBT, PEEK). In addition, the storage containers of Comparative Examples 1 to 3 made of the conventional resin composition require a large amount of the carbon material compounded in order to exhibit the same surface resistivity as the example, and the outgas amount and the amount of abrasion powder are large. It turns out that it becomes.
【0037】PKを素材とする半導体ウエハ用収納容器
を実際に半導体製造工程で使用してみたところ、洗浄、
乾燥、加熱処理等のいずれの使用環境下においても全く
問題を生じず、好適に用いることができた。また、帯電
防止性能および帯電減衰性にも優れ、静電気によるトラ
ブルも全く生じなかった。When a semiconductor wafer storage container made of PK was actually used in a semiconductor manufacturing process, cleaning,
No problems occurred under any use environment such as drying and heat treatment, and the composition could be used favorably. Further, the antistatic property and the charge decay property were excellent, and no trouble caused by static electricity occurred.
【0038】[0038]
【発明の効果】本発明の収納容器は、帯電防止性能を有
し、容器の使用環境下において寸法変化が少なく、半導
体材料への汚染原因となる磨耗粉や揮発分(アウトガス
等)の発生量が極めて少ないものである。また、この収
納容器は、寸法精度が良く、搬送時の半導体材料と容器
との接触、搬送用装置と容器との接触等による磨耗粉の
発生量が極めて少ないものである。さらに、耐熱性、耐
薬品性等に優れ、半導体製造工程内の各種薬液処理、溶
剤洗浄、乾燥、加熱工程においても形状を維持し、アウ
トガスの発生量が極めて少ないものである。The storage container of the present invention has antistatic performance, has a small dimensional change under the environment in which the container is used, and generates abrasion powder and volatile matter (outgas, etc.) which cause contamination of semiconductor materials. Is extremely small. In addition, the storage container has a high dimensional accuracy and an extremely small amount of abrasion powder due to contact between the semiconductor material and the container during transfer, contact between the transfer device and the container, and the like. Further, it is excellent in heat resistance, chemical resistance, etc., maintains its shape even in various chemical liquid treatments, solvent washing, drying, and heating steps in a semiconductor manufacturing process, and has a very small amount of outgas.
【0039】さらに、本発明の脂肪族ポリケトン樹脂組
成物は、前記特性を有する本発明の収納容器を構成する
材料として好適なものである。Further, the aliphatic polyketone resin composition of the present invention is suitable as a material constituting the storage container of the present invention having the above characteristics.
【図1】 半導体ウエハ用収納容器の一例を説明する
図。FIG. 1 illustrates an example of a semiconductor wafer storage container.
1 半導体ウエハ用収納容器 2a,2b 側壁 3 側端壁 4 架橋支持部 5a,5b 側壁の内面 6a,6b 溝 DESCRIPTION OF SYMBOLS 1 Storage container for semiconductor wafers 2a, 2b Side wall 3 Side end wall 4 Bridge support part 5a, 5b Inner surface of side wall 6a, 6b Groove
Claims (4)
くとも半導体材料と接触する部分の構成部材が、炭素材
料と脂肪族ポリケトン樹脂とを含む脂肪族ポリケトン樹
脂組成物からなり、該構成部材の表面抵抗率が108 〜
1012Ω/sqである収納容器。1. A container for storing a semiconductor material, wherein at least a component of a portion in contact with the semiconductor material is made of an aliphatic polyketone resin composition containing a carbon material and an aliphatic polyketone resin. Surface resistivity is 10 8 or more
A storage container having 10 12 Ω / sq.
ボン粉末から選ばれる少なくとも1種である請求項1に
記載の収納容器。2. The container according to claim 1, wherein the carbon material is at least one selected from carbon fibers and carbon powder.
脂肪族ポリケトン樹脂組成物。3. An aliphatic polyketone resin composition comprising a carbon material and an aliphatic polyketone resin.
ボン粉末から選ばれる少なくとも1種である請求項3に
記載の脂肪族ポリケトン樹脂組成物。4. The aliphatic polyketone resin composition according to claim 3, wherein said carbon material is at least one selected from carbon fibers and carbon powders.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15367897A JPH113931A (en) | 1997-06-11 | 1997-06-11 | Container and aliphatic polyketone resin compound |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15367897A JPH113931A (en) | 1997-06-11 | 1997-06-11 | Container and aliphatic polyketone resin compound |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH113931A true JPH113931A (en) | 1999-01-06 |
Family
ID=15567782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15367897A Withdrawn JPH113931A (en) | 1997-06-11 | 1997-06-11 | Container and aliphatic polyketone resin compound |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH113931A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005042617A1 (en) | 2003-10-31 | 2005-05-12 | Fuji Xerox Co. Ltd. | Method for producing aliphatic polymer having ketone group in main chain and method for producing composition comprising aliphatic polymer having ketone group in main chain |
JP2005133034A (en) * | 2003-10-31 | 2005-05-26 | Fuji Xerox Co Ltd | Aliphatic polyetherketone polymer and resin composition |
JP2007283542A (en) * | 2006-04-13 | 2007-11-01 | Nakamoto Pakkusu Kk | Conductive material for packing electronic parts and packing container for electronic parts |
-
1997
- 1997-06-11 JP JP15367897A patent/JPH113931A/en not_active Withdrawn
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005042617A1 (en) | 2003-10-31 | 2005-05-12 | Fuji Xerox Co. Ltd. | Method for producing aliphatic polymer having ketone group in main chain and method for producing composition comprising aliphatic polymer having ketone group in main chain |
JP2005133034A (en) * | 2003-10-31 | 2005-05-26 | Fuji Xerox Co Ltd | Aliphatic polyetherketone polymer and resin composition |
JP2005133035A (en) * | 2003-10-31 | 2005-05-26 | Fuji Xerox Co Ltd | Method for manufacturing aliphatic polyketone polymer and aliphatic polyketone polymer-containing composition |
KR100779150B1 (en) * | 2003-10-31 | 2007-11-28 | 후지제롯쿠스 가부시끼가이샤 | Method for producing aliphatic polymer having ketone group in main chain and method for producing composition aliphatic polymer having ketone group in main chain |
US7528215B2 (en) | 2003-10-31 | 2009-05-05 | Fuji Xerox Co., Ltd. | Aliphatic polymer having ketone group and ether bonding in its main chain and resin composition containing the same |
US7576172B2 (en) | 2003-10-31 | 2009-08-18 | Fuji Xerox Co., Ltd. | Method of preparing aliphatic polymer having ketone group in main chain thereof and method of preparing composition containing the same |
JP2007283542A (en) * | 2006-04-13 | 2007-11-01 | Nakamoto Pakkusu Kk | Conductive material for packing electronic parts and packing container for electronic parts |
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