JPH11345770A - Manufacturing device of semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor, using a vaporizing and supplying unit and a method for vaporizing and supplying by reducing washable of gas, preventing the increase in cost and improving treating efficiency. SOLUTION: An apparatus for manufacturing a semiconductor comprises a vaporizer 2 for vaporizing an organic metal compound liquid, a piping 'a' for introducing the gas vaporized by the vaporizer 2 to a plurality of reaction chambers 3A to 3C, and valves 5A to 5C for switching the vaporized gas at each of chambers 3A to 3C and supplying it. Thus, the vaporized gas is exhausted until the gas is stably obtained through vaporizing, and after the gas can be stably obtained, each of the chambers 3A to 3C is switched and the gas supply is switched at each of the chambers 3A to 3C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vaporization supply apparatus for vaporizing an organometallic compound and supplying it to a reaction chamber, and a semiconductor manufacturing apparatus using the vaporization supply method.

[0002]

2. Description of the Related Art FIG. 3 is a block diagram showing an apparatus for vaporizing and supplying an organometallic compound in a conventional semiconductor manufacturing apparatus. FIG.
Is a vaporizer 2 including a tank 1 for containing an organic metal compound in a liquid state, a high-frequency oscillator for evaporating the organic metal compound in the tank 1, and the like.
A supply pipe 4 for guiding the organometallic gas vaporized by the vaporizer 2 to one reaction chamber 3; a valve 5 for opening and closing the supply pipe 4; and an exhaust pipe for exhausting the gas vaporized by the vaporizer 2. 6, a valve 7 for opening and closing the exhaust pipe 6, and a pump 8 a provided in the exhaust pipe 6. In addition, a pump 8 b for exhaust is provided in an exhaust pipe 9 of the reaction chamber 3.
Is provided.

[0003] The operation of vaporizing and supplying the conventional vaporizing and supplying apparatus will be described below. First, the organic metal liquid in the tank 1 is vaporized by the vaporizer 2. Immediately after the operation of the vaporizer 2 is started, the operation of the vaporizer 2 is in an excessive state, so that a stable gas cannot be obtained. Therefore, when the gas in this state is supplied to the reaction chamber, a stable and uniform film quality can be obtained. May not be. For this reason, immediately after the start of the operation of the vaporizer 2, the valve 7 is opened while the valve 5 is closed, and the gas is temporarily exhausted by the exhaust pipe 6, so that the gas can be obtained stably for a predetermined time. Later, the valve 5 is opened and the valve 7 is opened.
Is closed to supply the vaporized gas to the reaction chamber 3.

[0004] In the above arrangement, in the conventional apparatus, one reaction chamber is connected to one vaporization supply device to supply gas. The reason that one reaction chamber is connected to one vaporization supply device is as described above when considering the gas supply amount required for one reaction chamber and the gas supply capacity from one vaporization supply device. Because gas must be exhausted and discarded until the gas becomes stable, it is necessary to reduce the amount discarded by a single vaporization supply device as much as possible, and to reduce the equipment cost of the vaporizer while effectively using the raw materials. is there.

[0005]

However, as described above, the vaporization supply device and the vaporization supply method in the conventional semiconductor manufacturing apparatus have one reaction chamber connected to and supplied to one vaporization supply device. Is fixed to
When the gas supply to the reaction chamber is not required, the vaporization supply device (vaporizer) must be stopped or the gas vaporized by the vaporizer must be exhausted each time. In the former case, that is, when the vaporizer is stopped, as shown in FIG. 4, the vaporizer is started each time the next supply is required, and the gas is started for a while each time the start is started. Must be discarded, and expensive gas is wasted, and processing cannot be performed during that time, so that the processing operation efficiency is reduced. On the other hand, in the latter case, that is, when the vaporizer is not stopped and the vaporized gas is exhausted, as shown in FIG. 5, the gas can be supplied immediately and the deterioration of the processing efficiency can be prevented. However, the amount of gas to be discarded becomes enormous, the gas waste is large, and the cost is increased.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the problem that the cost of the organic metal compound gas of the prior art is increased due to waste of the organic metal compound gas or the efficiency of the processing operation is reduced, and the waste of the gas is reduced to increase the cost. It is an object of the present invention to provide a vaporization supply apparatus and a semiconductor manufacturing apparatus using the vaporization supply method, which can prevent the occurrence of the above problem and improve the processing operation efficiency.

[0007]

In order to solve the above-mentioned problems, the present invention provides a vaporizer 2 for vaporizing an organometallic compound liquid and a plurality of reaction chambers 3A for vaporizing the gas vaporized by the vaporizer 2. Supply pipe 4A for leading to 3C;
A discharge pipe 6A for discharging gas vaporized by the vaporizer, and the gas vaporized by the discharge pipe 6A is discharged by the vaporizer 2 until gas can be stably obtained. After the gas has been stably obtained, the supply pipe 4A switches the gas supply to each of the plurality of reaction chambers 3A to 3C for each reaction chamber to supply the valves 5A, 5B, 5C, and 5C. 7 is provided.

Further, according to the present invention, while the organometallic compound liquid is vaporized by the vaporizer 2, the vaporized gas is discharged until the gas can be stably obtained by the vaporizer 2. After the gas is stably obtained by the reactor 2, the gas supply is switched and supplied to each of the reaction chambers 3A to 3C of the plurality of reaction chambers 3A to 3C.

According to such a configuration, once the operation of the vaporizer 2 is started, it is not necessary to stop the vaporizer 2 even if the processing in one reaction chamber is completed. Therefore, as shown in FIG. If the gas is discarded only when the first vaporizer 2 is started,
Thereafter, only by switching the valve, a stable gas can be continuously supplied, and the work processing efficiency can be improved without wasting the gas.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an apparatus for vaporizing and supplying an organometallic compound according to an embodiment of the present invention.
The vaporization supply device according to the embodiment includes a tank 1 containing an organic metal compound in a liquid state, a vaporizer 2 including a high-frequency oscillator for vaporizing the organic metal compound in the tank 1, and the like. A supply pipe 4A for guiding the vaporized organometallic gas to a plurality of (here, three) reaction chambers 3A to 3C, and a supply pipe 4A provided upstream of each of the reaction chambers 3A to 3C, and provided to each of the reaction chambers 3A to 3C. Valves 5A to 5C for opening and closing the pipe 4A, an exhaust pipe 6A for exhausting gas vaporized by the vaporizer 2, and a valve 7 for opening and closing the exhaust pipe 6A. Exhaust pumps 8A are provided respectively in exhaust pipes 9A to 9C from the reaction chambers 3A to 3C.
-8C are provided, and an exhaust pump 8D is provided in the exhaust pipe 6A.
Is provided.

Hereinafter, the vaporizing / supplying operation of the vaporizing / supplying device in the semiconductor manufacturing apparatus according to the embodiment will be described. In the embodiment, as shown in FIG. 2, an operation mode is adopted in which a gas is sequentially supplied from the reaction chamber 3A to the reaction chamber 3C, and a film forming process is sequentially performed in the reaction chambers 3A to 3C.

First, the organic metal liquid in the tank 1 is vaporized by the vaporizer 2. Immediately after the start of the operation of the vaporizer 2, since the operation of the vaporizer 2 is in an excessive state, a stable gas cannot be obtained.
Therefore, if the gas in this state is supplied to the reaction chamber, stable and uniform film quality may not be obtained. Therefore, immediately after the operation of the vaporizer 2 is started, it is considered that the valve 7 is opened while the valves 5A to 5C are closed, and the gas is temporarily exhausted by the exhaust pipe 6A, so that the gas can be obtained stably. After a predetermined time, the valve 5A is opened and the valve 7 is closed to supply the vaporized gas to the reaction chamber 3A.

When the processing in the reaction chamber 3A is completed, the reaction chamber 3B is in a film formation processing start state, and the valve 5A is used to switch the gas supply from the reaction chamber 3A to the reaction chamber 3B.
Is closed and the valve 5B is opened.

Similarly, when the processing in the reaction chamber 3B is completed, the reaction chamber 3C is in a film formation processing start state, and the valve 5B is closed and the valve 5C is switched to switch the gas supply from the reaction chamber 3B to 3C. To open. When the processing in the reaction chamber 3C is completed, for example, the processing in the reaction chamber 3A is performed again next.

According to the above-described vaporization supply apparatus or vaporization supply method, once the operation of the vaporizer 2 starts, it is not necessary to stop the vaporizer 2 even if the processing in one reaction chamber is completed. Therefore, as shown in FIG. 3, if the gas is discarded only at the first start of the vaporizer 2, the stable gas can be continuously supplied at all times only by switching the valve, and the gas is wasted. Without increasing the work processing efficiency. As the above-mentioned organometallic compound, PETa (pentaethoxy tantalum) or the like can be used, or TEOS (tetraethyl orthosilicate) can be used.

[0016]

As is apparent from the above description, according to the present invention, while the organometallic compound liquid is vaporized by the vaporizer, the liquid is vaporized until the gas is stably obtained by the vaporization. After the gas is discharged and the gas is obtained stably by the vaporization, the gas supply is switched and supplied to each of the plurality of reaction chambers, thereby reducing waste of the gas. , Prevent cost increase,
Also, there is an effect that the processing work efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a block diagram of a vaporization supply device of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a time chart illustrating a gas supply operation of the embodiment.

FIG. 3 is a block diagram showing a vaporization supply device in a conventional semiconductor manufacturing apparatus.

FIG. 4 is a time chart showing a conventional gas supply operation.

FIG. 5 is a time chart showing another example of the conventional gas supply operation.

[Explanation of symbols]

 Reference Signs List 1 tank 2 vaporizer 3A-3C reaction chamber 4A supply pipe 5A-5C, 7 valve 6A exhaust pipe

Claims (2)

[Claims] 1. A vaporizer for vaporizing an organometallic compound liquid, a supply pipe for introducing gas vaporized by the vaporizer to a plurality of reaction chambers, and discharging a gas vaporized by the vaporizer. The discharge pipe for discharging the gas vaporized by the discharge pipe until the gas can be stably obtained by the vaporizer, and after the gas is stably obtained. Is, by the supply pipe,
A semiconductor manufacturing apparatus comprising a vaporization supply device comprising: a valve for switching and supplying a gas supply for each of the plurality of reaction chambers. 2. An organic metal compound liquid is vaporized by a vaporizer, and a vaporized gas is discharged until a gas can be stably obtained by the vaporizer, and the gas is stabilized by the vaporizer. After that, a semiconductor manufacturing apparatus using a vaporization supply method in which a gas supply is switched and supplied to each of a plurality of reaction chambers.