JPH11340395A - Water-cooled-type thyristor valve - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a water-cooled-type thyristor valve that can maintain insulation characteristics without increasing the height. SOLUTION: Piping 7A at the left side of a best frame 11 is connected to the upper part of a header pipe 8A at the left side of a thyristor module 6 at a lower stage by a pair of insulation piping 9A. The upper part of a header pipe 8B at the left side of the thyristor module 6 at an upper stage is connected to the lower part of the header pipe 8A by insulation piping 9B. For header pipes 8C and 8D at the right side of the upper and lower thyristor modules 6, connection can be made in the same manner, that is the upper part of the header pipe 8C is connected to the lower part of the header pipe 8D by insulation piping 9C, and the upper part of the header pipe 8D is connected to the upper part of a piping 7B by a pair of insulation piping 9D.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a water-cooled thyristor valve.

[0002]

2. Description of the Related Art FIG. 5A is a plan view showing a conventional water-cooled thyristor valve, FIG. 5B is a main circuit connection diagram of the conventional water-cooled thyristor valve, and FIG. FIG. 2B is a front view of the valve, and FIG. 2B is a right side view of FIG.

In FIGS. 5 (a), 6 (a) and 6 (b), the left and right upper surfaces of an underframe 11 fixed to the installation surface of the water-cooled thyristor valve via anchor bolts (not shown) are shown. In a plan view not shown, L-shaped stainless steel pipes 7A and 7B are symmetrically placed.

A pipe (not shown) for supplying cooling water to the pipe 7A is connected to a rear end of the pipe 7A on the left side, and a cooling water discharged from the pipe 7B is connected to a rear end of the pipe 7B on the right side. A pipe (not shown) for discharging water is connected.

[0005] A pair of insulators 10 made of glass fiber reinforced plastic pipes are erected on the upper surface of the underframe 11 on the left and right sides of the intermediate portion and the rear portion. Fixed.

At the upper end of these insulators 10, a unit frame 5 having a concave vertical section is placed as an outer frame of a thyristor module 6 incorporating a water-cooled thyristor stack, an anode reactor, and the like. It is fixed to a flange portion formed at the upper end of 10.

At each of the four corners of the unit frame 5 of the thyristor module 6, insulators 10B which are slightly longer than the lower insulator 10A are erected, and the lower thyristor module 6 is also provided at the upper end of these insulators 10B. The same thyristor module 6 as above is mounted via a unit frame.

[0008] A pair of insulating pipes 9J made of fluorocarbon resin and having upper ends bent rearward are respectively erected through joints on the upper part of the front end of the left pipe 7A. It is connected to a lower part of a header tube 8J made of a cylindrical stainless steel tube via a joint 12 and an L-shaped connecting pipe.

The rear portion of the header tube 8J is connected to a joint provided on the left front side of the thyristor module 6 via a joint and piping. A lower end of an insulating pipe 9K whose upper and lower ends are bent backward is connected to a right front surface of the header pipe 8J via a joint 12, and a lower end of the header pipe 8K is connected to an upper end of the insulating pipe 9K. And an L-shaped connection pipe.

An insulating pipe 9L of the same product as the left insulating pipe 9J is erected symmetrically via a joint above the front end of the right pipe 7B, and the upper ends of these insulating pipes 9L are also connected to the joint 12L. And 8M header tube via L-shaped connecting pipe
Connected to the bottom.

The rear portion of the header tube 8M is connected to a joint provided on the right front side of the thyristor module 6 via a joint and piping. The lower end of the insulation pipe 9M is connected to the front surface on the left side of the header pipe 8M via the joint 12,
A header pipe 8L is connected to the joint 12 via an L-shaped connection pipe at the upper end of the insulating pipe 9M.

The thyristor module 6 has a structure shown in FIG.
As shown in FIG. 1, a thyristor stack 1 composed of a plurality of thyristors 1 and a cooling block is incorporated slightly in front of an intermediate portion, and a water-cooled anode reactor 4 is housed on the right side of the thyristor stack 1.

At the rear of the thyristor stack 1, a capacitor 3 and a resistor 2 are incorporated on the left and right. The left end of the capacitor 3 is connected to the anode side of the thyristor stack 1 as shown in FIGS. 5 (a) and 5 (b). The right end of the resistor 2 is connected to the cathode side of the thyristor stack 1, and the cathode side is connected to the left end of the anode reactor 4.

The right end of the upper anode reactor 4 is connected to the anode terminal of the lower thyristor stack 1 by a conductor, and the right end of the lower anode reactor 4 is connected to the ground terminal attached to the frame 11 of the thyristor valve. It is connected.

In the water-cooled thyristor valve configured as described above, the cooling water supplied to the rear end of the left pipe 7A rises through the insulating pipe 9J as shown by the arrow C1 and is connected to the header at the upper end. It flows into the pipe 8J, and a part thereof is supplied to the lower thyristor module 6 as shown by an arrow C3.

Other than the cooling water that has flowed into the header pipe 8J, it rises up the insulating pipe 9K and flows into the upper header pipe 8K as shown by the arrow C2, and further flows into the thyristor module 6 behind it as shown by the arrow C5. Flows into.

The cooling water flowing into the upper and lower thyristor modules 6 passes through the cooling block of the thyristor stack 1 and the anode reactor 4 on the right side, and passes through the right header tube 8L,
8M flows out as indicated by arrow C6.

The cooling water flowing into the upper header pipe 8L flows down the insulating pipe 9M as shown by the arrow C7, flows into the lower header pipe 8M, and flows from the lower thyristor module 6. Along with the water, the right insulating pipe 9L flows down as shown by the arrow C8, and the right pipe 7B
Is discharged from The thyristors of the thyristor stack 1 and the anode reactor 4 are cooled by the cooling water.

Incidentally, in DC power transmission and large-sized frequency conversion equipment, the number of thyristor modules superimposed on the water-cooled thyristor valve increases with the increase in the voltage, and the height of the water-cooled thyristor valve also increases.

With the increase in the height of the water-cooled thyristor valve, the strength of the insulator incorporated in the water-cooled thyristor valve also needs to be increased. Water-cooled thyristor valves are required to be manufactured as low as possible due to restrictions on the height of the building in which they are installed. For this reason, the insulating tube for the cooling water connecting the upper and lower thyristor stacks 1 is made of fluororesin, and the withstand voltage characteristics are considered.

[0021]

However, in the water-cooled thyristor valve configured as described above, if dust adheres to the surface of the insulating tube during a long-term operation, the creepage withstand voltage characteristics may be reduced. .

For this reason, the surface of the insulating tube is cleaned on a regular maintenance / inspection day, but the withstand voltage characteristics may still be reduced depending on the installation environment of the water-cooled thyristor valve.

It is conceivable to increase the height of the insulator to increase the creepage insulation distance of the insulating tube. However, this cannot be adopted because not only must the strength of the insulator be increased, but also because of the above-mentioned building restrictions.

It is also conceivable to increase the creeping insulation distance by curving the insulating tube. However, since the pressure loss of the cooling water increases, the capacity of the discharge pump must be increased. Therefore, an object of the present invention is to provide a water-cooled thyristor valve that can maintain insulation characteristics without increasing the height.

[0025]

According to a first aspect of the present invention, there is provided a semiconductor module stacked in a plurality of stages via insulating columns, and a module insulated connecting pipe for vertically connecting relay pipes on both sides of the semiconductor module. A water-cooled thyristor valve having an insulating supply pipe whose upper end is connected to one end of the relay pipe of the semiconductor module and an insulating discharge pipe whose upper end is connected to the other end of the semiconductor module; The upper end of the discharge pipe is connected to the upper part of the relay pipe of the lower semiconductor module, and the module insulating connecting pipe is connected to the upper part of the relay pipe of the upper semiconductor module and the lower part of the relay pipe of the lower semiconductor module. .

According to a second aspect of the present invention, there is provided a semiconductor module stacked in a plurality of stages via insulating pillars, a module insulating connecting pipe for vertically connecting relay pipes on both sides of the semiconductor module, and a semiconductor insulating module on one side of the semiconductor module. In a water-cooled thyristor valve having an insulating supply pipe whose upper end is connected to the relay pipe and an insulating discharge pipe whose upper end is connected to the other relay pipe on the other side of the semiconductor module, the upper ends of the insulating supply pipe and the insulating discharge pipe are placed in the upper stage. Connected to the top of the relay tube of the semiconductor module,
The module insulating connection pipe is connected to an upper part of the relay pipe of the upper semiconductor module and a lower part of the relay pipe of the lower semiconductor module.

In particular, a water-cooled thyristor valve according to the third aspect of the invention is characterized in that a fold is formed on the outer periphery of an insulating connecting pipe, an insulating supply pipe or an insulating discharge pipe. Further, in the water-cooled thyristor valve according to the present invention, the relay tube is made of an insulating material.

According to the first, second, and third aspects of the present invention, the insulating creepage distance between the insulating connecting pipe and the insulating discharge pipe is increased, and the distance between the lower semiconductor module and the ground and between the ground and the upper and lower parts are increased. Withstand voltage characteristics between semiconductor modules. In the invention corresponding to claim 4,
The insulation distance between the lower semiconductor module and the ground and between the upper and lower semiconductor modules is further increased.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a water-cooled thyristor valve of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 are plan views showing a first embodiment of a water-cooled thyristor valve of the present invention. FIGS.
It is a figure corresponding to (a) and corresponding to Claim 1 and Claim 2.

FIGS. 1 and 2 (a) and 2 (b) are different from FIGS. 5 and 6 shown in the prior art in the connection structure between the insulating tube and the header tube. It is exactly the same as FIG. Therefore, the same elements as those in FIGS. 5 and 6 are denoted by the same reference numerals, and description thereof will be omitted.

That is, a pair of insulating pipes 9A, which are slightly longer than the insulating pipe 9J shown in FIG. 6, are respectively erected above the front end of the left pipe 7A via joints. Is connected to the upper part of the header pipe 8A via the joint 12 and the L-shaped connection pipe.

The rear portion of the header tube 8A is connected to a joint provided on the left front side of the thyristor module 6 via a joint and piping. The lower end of the insulation pipe 9B is connected to the lower right part of the header pipe 8A via a joint 12 and an L-shaped connection pipe, and the upper end of the header pipe 8B is connected to the upper end of the insulation pipe 9B via the joint 12. It is connected.

An insulating pipe 9D of the same product as the left insulating pipe 9A is also erected symmetrically via a joint above the front end of the right pipe 7B, and the upper ends of these insulating pipes 9D are also connected to the joint. 12 and header tube 8D via L-shaped connection pipe
Connected to the top.

The rear portion of the header tube 8D is connected to a joint provided on the right front side of the thyristor module 6 via a joint and piping. At the lower part on the left side of the header pipe 8D, an insulation pipe 9C is provided via a joint 12 and an L-shaped connection pipe.
Is connected to a header pipe 8C via a joint 12 at the upper end of the insulating pipe 9C.

In the water-cooled thyristor valve configured as described above, the cooling water supplied to the left pipe 7A rises in the insulating pipe 9A as shown by the arrow A1, and the header pipe 8A connected to the upper end. And a part thereof is supplied to the lower thyristor module 6 as shown by an arrow A3.

In addition to the cooling water that has flowed into the header pipe 8A, the insulating pipe 9B is moved up and an arrow A2 is placed on the upper header pipe 8B.
And flows into the rear thyristor module 6 as shown by arrow A5.

The cooling water flowing into the upper and lower thyristor modules 6 passes through the respective cooling blocks of the thyristor stack 1 and the right anode reactor 4, and then passes through the right header pipe, as in the prior art shown in FIG. It flows out to 8C and 8D as shown by arrow A6.

The cooling water flowing into the upper header pipe 8C flows down the insulating pipe 9C as shown by an arrow A7, flows into the lower header pipe 8D, and flows from the lower thyristor module 6 into the cooling water. Along with the water, the right insulating pipe 9D flows down as shown by the arrow A8, and the right pipe 7B
Is discharged from

In the water-cooled thyristor valve configured as described above, the insulating pipe 9 connecting the upper and lower header pipes is used.
B, 9C, lower header pipes 8A, 8D and pipes 7A, 7B
Since the length of the insulating tubes 9A and 9D connecting the pipes can be increased, the creeping insulation distance between the inner and outer peripheries of the pipe made of fluororesin can be increased, and the withstand voltage characteristics can be improved.

Next, FIGS. 3A and 4 show a second embodiment of the water-cooled thyristor valve of the present invention, and correspond to FIGS. 1 and 2 shown in the first embodiment. , Claim 2
FIG. FIGS. 3A and 4 differ from FIGS. 1 and 2 described above in the connection configuration of the insulating tube and the header tube, and are otherwise the same as FIGS. 1 and 2.

That is, the upper ends of a pair of long insulating pipes 9E whose lower ends are connected to the left pipe 7A via a joint are connected to the left front header pipe 8F of the upper thyristor module 6.
Is connected via a joint 12 to the upper part of the head. The lower end of the insulating tube 9F connected to the upper left side of the upper header tube 8F is connected to the lower right side of the header tube 8E.

Similarly, the upper ends of a pair of long insulating pipes 9H whose lower ends are connected to the right pipe 7B via a joint are connected to the upper part of the right front header pipe 8G of the upper thyristor module 6 via a joint. ing. The lower end of the insulating pipe 9G connected to the upper left side of the upper header pipe 8G is connected to the lower left side of the header pipe 8H on the lower right side.

In the water-cooled thyristor valve configured as described above, the cooling water supplied to the left pipe 7A rises in the insulating pipe 9E as shown by the arrow B1, and the header pipe 8F connected to the upper end. And a part thereof is supplied to the upper thyristor module 6 as shown by an arrow B4.

Other than the cooling water that has flowed into the header pipe 8F, it flows down the insulating pipe 9F, flows into the lower header pipe 8E as shown by the arrow B2, and further flows into the thyristor module 6 behind it as shown by the arrow B5. Flows into.

The cooling water flowing into the upper and lower thyristor modules 6 passes through each cooling block of the thyristor stack 1 and the anode reactor 4 on the right side, as in FIGS. 1 and 2, and then flows into the right header tubes 8G and 8H. It flows out as indicated by arrow B6.

The cooling water flowing into the upper header pipe 8G rises along the insulating pipe 9G as shown by the arrow B7, flows into the upper header pipe 8G, and flows from the upper thyristor module 6. Along with the water, it flows down the right insulating pipe 9H as shown by arrows B8 and B9, and is discharged from the right pipe 7B.

In the water-cooled thyristor valve having such an insulating pipe, the upper thyristor module whose temperature rises higher than that of the lower thyristor module due to the outside air raised by the lower thyristor module is connected to the upstream side of the lower thyristor module. The cooling temperature of the upper and lower thyristor modules can be equalized by cooling with the cooling water.

Further, the withstand voltage between the lower thyristor module 6 and the installation surface can be increased. As shown in FIG. 3 (b), an insulating pipe 13 having continuous folds on its outer periphery is used as the insulating pipe, and is connected to a cap nut 14 by packing or the like to increase the creepage distance. The invention corresponding to No. 3 may be adopted.

Further, the header tube and the joint may be made of a fluororesin material to increase the withstand voltage characteristics of the upper and lower thyristor modules and the lower stage and the installation surface.

In the above embodiment, the thyristor is used as an element of the semiconductor module. However, in the case of a water-cooled type, an optical thyristor, a GTO thyristor, or an IGBT is similarly used regardless of the type of the element. Can be applied.

[0051]

As described above, according to the invention corresponding to claim 1, the upper ends of the insulating supply pipe and the insulating discharge pipe are connected to the upper part of the relay pipe of the lower semiconductor module, and the module insulating connecting pipe is connected to the upper semiconductor module. By connecting to the upper part of the relay pipe and the lower part of the relay pipe of the lower semiconductor module, the insulating creepage distance between the insulated connecting pipe and the insulating discharge pipe is extended, and the distance between the lower semiconductor module and the ground and between the upper and lower semiconductor modules is increased. Since the withstand voltage characteristics are improved, a water-cooled thyristor valve capable of maintaining the insulating characteristics without increasing the height can be obtained.

According to the invention corresponding to claim 2, the upper ends of the insulating supply pipe and the insulating discharge pipe are connected to the upper part of the relay pipe of the upper semiconductor module, and the module insulating connecting pipe is connected to the relay pipe of the upper semiconductor module. By connecting to the lower part of the relay pipe of the upper and lower semiconductor modules, the insulation creepage distance between the insulating connection pipe and the insulating discharge pipe is extended, and the withstand voltage characteristics between the lower semiconductor module and the ground and between the upper and lower semiconductor modules are improved. Since it has been raised, it is possible to obtain a water-cooled thyristor valve capable of maintaining the insulating properties without increasing the height.

In particular, according to the invention corresponding to claim 3,
By forming folds on the outer circumference of the insulated connection pipe, insulated supply pipe, or insulated discharge pipe, the insulation creepage distance between the insulated connection pipe and the insulated discharge pipe is extended, and the space between the lower semiconductor module and the ground and between the upper and lower semiconductor modules is reduced. Since the withstand voltage characteristics are improved, a water-cooled thyristor valve capable of maintaining the insulating characteristics without increasing the height can be obtained.

Furthermore, according to the invention corresponding to claim 4, the insulation distance between the lower semiconductor module and the ground and between the upper and lower semiconductor modules is increased by manufacturing the relay tube from an insulating material. It is possible to obtain a water-cooled thyristor valve capable of maintaining the insulation characteristics without increasing the size.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of a water-cooled thyristor valve of the present invention.

FIG. 2A is a front view showing a first embodiment of a water-cooled thyristor valve of the present invention, and FIG. 2B is a right side view of FIG.

FIG. 3 (a) is a plan view showing a second embodiment of the water-cooled thyristor valve of the present invention, and FIG. 3 (b) is a partial detailed view showing a third embodiment of the water-cooled thyristor valve of the present invention. .

FIG. 4A is a front view showing a water-cooled thyristor valve according to a second embodiment of the present invention, and FIG. 4B is a right side view of FIG.

FIG. 5A is a plan view illustrating an example of a conventional water-cooled thyristor valve, and FIG. 5B is a main circuit connection diagram illustrating an example of a conventional water-cooled thyristor valve.

FIG. 6A is a front view showing an example of a conventional water-cooled thyristor valve, and FIG. 6B is a right side view of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Thyristor stack, 2 ... Resistor, 3 ... Capacitor, 4 ... Anode reactor, 5 ... Unit frame, 6 ... Thyristor module, 7A, 7B ... Piping, 8A, 8B,
8C, 8D, 8E, 8F, 8G, 8H ... header tube, 9
A, 9B, 9C, 9D, 9E, 9F, 9G, 9H: insulating pipe, 10A, 10B: insulator, 11: underframe, 12: joint.

Claims (4)

[Claims] 1. A semiconductor module stacked in a plurality of stages via insulating columns, a module insulating connecting pipe for vertically connecting relay pipes on both sides of the semiconductor module, and an upper end connected to a relay pipe on one side of the semiconductor module. A water-cooled thyristor valve provided with an insulating supply pipe to be connected and an insulating discharge pipe whose upper end is connected to a relay pipe on the other side of the semiconductor module, wherein the upper ends of the insulating supply pipe and the insulating discharge pipe are connected to the lower semiconductor. A water-cooled thyristor valve connected to an upper part of a relay pipe of a module, wherein the module insulating connection pipe is connected to an upper part of the relay pipe of the upper semiconductor module and a lower part of a relay pipe of the lower semiconductor module. 2. A semiconductor module stacked in a plurality of stages via insulating pillars, a module insulating connecting pipe vertically connecting relay pipes on both sides of the semiconductor module, and an upper end connected to a relay pipe on one side of the semiconductor module. A water-cooled thyristor valve provided with an insulating supply pipe to be connected and an insulating discharge pipe whose upper end is connected to the relay pipe on the other side of the semiconductor module, wherein the upper ends of the insulating supply pipe and the insulating discharge pipe are connected to the upper semiconductor. A water-cooled thyristor valve connected to an upper part of a relay pipe of a module, wherein the module insulating connection pipe is connected to an upper part of the relay pipe of the upper semiconductor module and a lower part of a relay pipe of the lower semiconductor module. 3. The water-cooled thyristor valve according to claim 1, wherein a fold is formed on an outer periphery of the insulated connection pipe, the insulated supply pipe, or the insulated discharge pipe. 4. The water-cooled thyristor valve according to claim 1, wherein the relay pipe is made of an insulating material.