JPH11316882A - Metallic foil sheet like circuit for resonance tag or the like - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resonance tag which is superior in resonance characteristics and where resonance characteristics are easily erased and a resonance circuit is easily broken down. SOLUTION: A metallic foil 2 whose surface is coated with a thermally adhesive resin film 1 is stuck to a carrier sheet 4 like paper or a plastic film by an adhesive whose adhesion strength is reduced by heating, thus obtaining a laminated body 10. This laminated body 10 is used as a material, and a cut 9 of a prescribed pattern like a circuit is given to the metallic foil 2 of this laminated body 10 by a punching die 11, and the metallic foil 2 side of the laminated body 10 is joined with a support body 8 like a plastic film. The pattern part like a circuit is heated to transfer the metallic foil 2 like a circuit to the surface of the support body 8, thus obtaining a metallic foil sheet like a circuit of the resonance tag or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit-like metal foil sheet such as a resonance tag having a circuit that resonates with a radio wave of a specific frequency transmitted from a detection device.

[0002]

2. Description of the Related Art As is already known, a resonance tag is a tag provided with a circuit that resonates with a radio wave of a specific frequency, and the resonance tag is present in an area where a radio wave of a specific frequency is emitted. Due to the resonance, the buzzer and the warning lamp of the detection device can be operated. Therefore, in a department store, a discount store, a video rental store, a CD shop, and the like, the resonance tag is attached to a product or the like and used to prevent shoplifting and the like. This resonance tag is removed or the resonance circuit is destroyed at the time of payment at the cash register, but the customer does not pay the price and passes through the gate equipped with the specific detection device with this resonance tag attached to the product Then, a warning is issued by a buzzer, a lamp, or the like.

A resonance tag is basically composed of a plastic film as a dielectric, a spiral (coiled) circuit formed on at least one surface of the film, and a circuit for a capacitor electrode plate formed on the other surface. It is a spiral circuit that also serves as a capacitor, and is laminated on a base sheet such as paper as necessary. In addition to the above example, a spiral circuit is formed on both sides of a plastic film without forming a capacitor electrode plate at the end of the spiral circuit, and the circuits are formed so as to correspond to each other with the plastic film interposed therebetween. A circuit in which the circuit itself has the function of a capacitor electrode plate has been proposed.

A resonance circuit is composed of a resistor R, an inductance L and an electrostatic capacitance (capacitor capacitance) C. The capacitor capacitance C is a plastic (resin) film which is a dielectric and a spiral circuit formed on both surfaces thereof. The resistor R is formed by a metal foil forming a circuit. From these facts, in order to obtain a predetermined resonance frequency required for a resonance tag, a material configuration capable of obtaining extremely accurate dimensions and their tolerances is required.

[0005]

For the above-mentioned reasons, a spiral circuit is conventionally made of a plastic film, usually a dielectric, having a metal foil such as an aluminum foil laminated on one or both sides of a plastic film. In the same manner as in the above method, an etching resistant ink is printed on a metal foil on a plastic film in a predetermined pattern and etched with a chemical such as acid or alkali, or formed by a photoresist etching method. However, this etching method using a chemical solution requires a certain time for the metal foil to dissolve, and has problems such as disposal of the etching solution. In the past, there has been proposed a method of punching a thick metal foil into a predetermined circuit pattern for a printed wiring board and bonding it to a substrate, but this method lacks flexibility due to the lack of flexibility due to the thick metal foil. It is not suitable for applications such as tags. Also,
As a method of manufacturing FlexibleCircuit, there is a method of bonding metal foil to a substrate like a die stamping method and then punching out a predetermined circuit pattern to peel off unnecessary metal foil.
There is a drawback that the metal foil cannot be peeled unless it is strong and that the metal foil to be peeled and removed cannot be peeled efficiently unless it is in a continuous state.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide a resonance tag having a stable resonance characteristic without using an etching method, a wiring board of various electric appliances having a wiring circuit similar thereto, and a heater. It is intended to provide a circuit-like metal foil sheet that can be used for such purposes.

[0007]

The circuit-like metal foil sheet of the present invention, such as a resonance tag, is made of a laminate in which a metal foil is bonded to a carrier sheet such as paper or a plastic film, and is laminated by a punching die. Cut a predetermined circuit-like pattern into the metal foil of the body, align the metal foil surface of the laminate with a support such as a plastic film, and heat the circuit-like pattern portion from the carrier sheet or the support surface side of the laminate. And transferring the circuit-shaped metal foil to the surface of the support.

In the present invention, the carrier sheet is bonded to the metal foil with an adhesive which is easily peeled off so that the punched portion of the metal foil can be easily peeled off from the carrier sheet when the metal foil is transferred to the surface of the support. Particularly, since only the punched portion is heated and transferred to the support, it is preferable to use an adhesive whose adhesive strength is reduced by heating. The punched portion heated by the use of such an adhesive has a lower adhesive strength than the non-heated portion, and the transfer to the support becomes easier. As such an adhesive, a pressure-sensitive adhesive to which a curing agent that promotes curing by heating is added can be used. In addition, an epoxy resin, a thermosetting resin such as a polyamide resin dispersed and mixed in an adhesive, and an adhesive composition or a fat or a wax, in which the resin is cured by heating to reduce the adhesive force, and is mixed. Adhesives that can be used to reduce the adhesive force due to the deposition of fats and oils or wax on the adhesive surface by heating can be used.

A heat-adhesive resin coating is usually provided on the metal foil surface of the laminate of the carrier sheet and the metal foil for subsequent transfer of the stamped metal foil to the support. When the support itself is a heat-adhesive plastic film or a surface coated with a heat-adhesive resin, it is not necessary to form a heat-adhesive resin film on the metal foil surface.

The carrier sheet is of such a thickness that it is not punched at the same time when the metal foil is punched into a predetermined circuit-like pattern, and is used when unwinding a roll-shaped laminate and working continuously. Any material may be used as long as it does not break the metal foil bonded to the substrate. Paper or polyethylene with appropriate thickness and strength, such as high-quality paper, parchment paper, etc.
Plastic films such as polypropylene and polyester can be used. Heat transfer and handling during heat transfer,
Paper is preferred in terms of cost and the like.

In the present invention, the metal foil is not particularly limited, such as copper foil, iron foil, aluminum foil, stainless steel foil, etc., but the present invention is applied to a thin soft aluminum foil or the like which has been conventionally difficult to process. Can be advantageously applied. Although the thickness of the metal foil can be several microns to several hundred microns,
For example, 3-150 μm, 10-60 μm for aluminum foil
Thick ones are preferred. As a half-cutting method for making a cut of a predetermined circuit-like pattern only in the metal foil, a punching technique generally known in label production, box making industry, or the like can be used.

The transfer of the metal foil punched into the circuit-like pattern from the laminate to the support is performed by using a heating mold or a heat sealer having a heating convex surface having substantially the same pattern as the circuit-like pattern. Is heated under pressure. Thereafter, when the laminate is peeled off from the support, the metal foil punched into a circuit-like pattern by heating under pressure is thermally bonded to the support and remains on the support, and unnecessary portions are removed together with the laminate. The support to which the circuit-like metal foil has been transferred may be further pressurized and heated as necessary to ensure adhesion of the metal foil. When heating after transfer of the metal foil, for example, the heating pattern surface of the mold does not need to be the same width as the width of the circuit of the punched metal foil, and may be narrower than that. Heating for transferring the circuit-like metal foil to the support may be performed from the support side when the support is a thin sheet such as paper or plastic film, or from both the carrier sheet and the support. May be.

In order to manufacture a resonance tag by the method of the present invention, a dielectric plastic film or a dielectric resin coating is used as a support, and a circuit-like metal foil is transferred to this dielectric support one by one by the above-described method. Then, a circuit or a capacitor portion is formed on both sides of the support to form a resonance circuit, thereby forming a resonance tag base material. When a resin coating is used as the support, for example, a predetermined resin solution is applied to release paper to form a resin coating, and the resin coating with release paper is used as a support, and a circuit-like metal foil is applied to the resin coating surface. After transferring, peel off,
Preferably, the circuit-like metal foil is transferred to the other surface of the peeled resin film with the metal foil, that is, the peeled surface to form a resonance tag base material. As the resin for the dielectric plastic film or the dielectric resin coating, those usually used in this kind of field can be used, and examples thereof include films such as polyethylene, polypropylene, polystyrene, and polyester or resin coatings. In addition, a heat-resistant product can be obtained by using a heat-resistant resin such as a polyimide resin as a support.

The dielectric plastic film and the dielectric resin film as the support can easily conduct the front and back circuits in order to connect the circuit of the metal foil formed on both surfaces thereof or to destroy the resonance circuit. For this purpose, holes or notches may be provided in advance at positions where the metal foils on the front and back of the support overlap. By changing the position where the hole or the notch is provided, it is possible to adjust the electric energy when the resonance state is diatbait (inactivated). The holes or cutouts can be used to connect upper and lower circuits in the case of a multilayer printed wiring board.

In the case of manufacturing a resonance tag, any thermoadhesive resin applied to the metal foil surface of the laminate can be used as long as it is suitable for application and has excellent dielectric properties. it can. If necessary, a filler or the like capable of improving or improving the dielectric properties of the film can be included in the resin film. If necessary, a dielectric plastic film may be laminated on the metal foil surface of the laminate, and a heat-adhesive resin may be applied on the plastic film. In this case, the metal foil is stamped together with the plastic film and transferred to the support.

Further, in the present invention, without using a support, a laminate obtained by punching a metal foil into a circuit-like pattern is used as a substitute for the heat-adhesive resin coating applied to the metal foil surface instead of the support. The resonance tag base material can be manufactured by applying pressure and heating from the carrier sheet side of the laminate with the foil sides together. In this case, the resin for the heat-adhesive resin film is also a dielectric resin as described above. The first laminate may be provided with a heat-adhesive resin coating on the metal foil surface, and may not be provided with a resin coating on the metal foil surface of the second laminate. A simple heat-adhesive resin coating may be provided on the foil surface, and a dielectric resin coating may be provided on the metal foil surface of the second laminate to join them together.

As described above, at least one surface of the resonance tag base material in which the coil-shaped metal foil as the resonance circuit is attached to both surfaces of the resin coating film, a reinforcing member such as paper, a plastic film or a sheet, or the like is formed by a conventional method. By attaching the decorative sheet, a desired resonance tag or resonance label can be obtained. For example, paper and a plastic film are bonded to one side of the resonance tag base material with an adhesive, an adhesive is applied to the other side of the base material, and a release paper is bonded to the upper surface, and the release paper is peeled off. It can be a resonance tag that can be directly attached to a product.

[0018]

According to the present invention, a laminate comprising a carrier sheet and a metal foil bonded thereto is used as a material, only the metal foil is punched in a required pattern, and the punched portion is supported by heating and pressing from the carrier sheet or the support surface. Because it is a method of transferring to the body, a predetermined circuit pattern can be formed even with a thin and soft metal foil compared to the conventional die stamp method, and the circuit pattern is not a continuous spiral shape, for example, large and small circles are concentric The pattern having the pattern formed in the above can also be formed. When using paper etc. as a carrier sheet, by attaching a mark for alignment to the carrier sheet, it is easy to align the metal foil circuit opposite the front and back with the support in between. It is possible to easily manufacture a resonance tag using a metal foil circuit opposed on both sides of a dielectric film as a capacitor. In addition, in the present invention, when the heat-adhesive resin film applied to the surface of the metal foil of the laminate is used as a dielectric layer, the dielectric layer is formed by applying a resin liquid, so that the conventional extrusion molding or the like is used. It becomes a dielectric film which is much more excellent in thickness tolerance than a plastic film, and a resonance tag having excellent resonance frequency characteristics and flexibility can be obtained.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments.

Embodiment 1 FIG. 1 is a flow sheet for explaining an example of a method of manufacturing a resonance tag, and is a cross-sectional view of members in each processing step. FIG. 1A shows a laminate as a raw material, a metal foil 2 having a carrier sheet 4 coated with a heat-adhesive resin film 1 on the surface with an adhesive 3.
Are pasted together. As shown in FIG. 1B, the laminate 10 is stamped and cut into the metal foil 2 to make a cut 9. The laminate 10 thus formed is then stacked on a support (plastic film) 8, and The pattern part is heat-pressed (FIG. 1C). Thereafter, when the laminate 10 is peeled off, only the heated metal foil 2 of the circuit pattern portion is transferred to the support 8 (FIG. 1D). The operation is repeated in the same manner as described above on the back surface of the support 8 having the circuit-shaped metal foil 2 provided on the front surface, and the circuit-shaped metal foil 2 is provided on both surfaces of the support 8 to obtain a resonance tag material ( 1E-G).

FIG. 2 is a perspective view of a manufacturing apparatus for continuously performing the above manufacturing method. In the figure, a laminate 50 supplied in a roll form is rewound to form a first laminate 50 for metal foil punching.
The metal foil that has been sent to the cutting press 60 and then punched out in combination with the support 51 is transferred to the support 51 by the first heating press 61. The laminated body 50 and the support body 51 are separated at the position of the reversing roll 67, the unnecessary laminate body 52 is wound up, and the support body 51a with the metal foil circuit is further heated and pressed by the first heat setting press 62. Is done. First for metal foil stamping
The cutting press 60 and the support 51 together with the first
FIG. 3 shows a portion to be transferred by the heating press 61.
In FIG. 3, reference numeral 90 denotes a perforation device for forming holes (see FIG. 10) used for connecting metal foil circuits provided on the front and back when the support 51 is a dielectric film. Thereafter, the support 51a provided with a metal foil circuit on one surface is inverted by a reversing roll 68 via a roll 70, and is unwound on the back surface thereof from the laminated roll 50 on the right side in FIG.
A metal foil circuit is provided on the back surface of the support body 51a similarly through the second heating press 64 and the second heat setting press 65 by being combined with the laminated body 50 from which metal foil has been punched out by the cutting press 63 in the same manner as described above. Product 5
Wound as 3. The product obtained above is then laminated with printed paper as necessary, or coated or laminated with an adhesive or release paper to form a resonance tag or a resonance label.

Embodiment 2 FIG. 4 is a flow sheet showing another embodiment of the present invention.
FIGS. 4A to 4D are similar to FIGS. 1A to 1D of the first embodiment, and the circuit-shaped metal foil 2 is provided on one surface of the support 7.
The laminated body 10 obtained by stamping the metal foil 2 is overlaid on the upper surface of the upper metal foil 2 and heated and pressed to form the circuit metal foil 2 on the circuit metal foil 2. An adhesive 6 for application is applied to the support 7 of the resonance label material thus obtained, and the upper surface thereof is covered with the release paper 5 to obtain a resonance label. When the resonance label is used, the release paper 5 is peeled off and attached to a product or the like with an adhesive 6.

FIG. 5 is a perspective view of a manufacturing apparatus for continuously performing the above-described method of manufacturing a resonance label. As in the case of the apparatus of FIG. 2, the laminate 50 supplied in a roll is unwound and sent to a first cutting press 60 for metal foil punching, and then combined with a support 51 to form a punch. The extracted metal foil is transferred to the support 50 by the first heating press 61. Combined laminate 50 and support 5
1 is separated at the position of the reversing roll 67, and the unnecessary laminate 5
2 is wound up, and the support body 51a provided with the metal foil circuit is further heated and pressed by the first heat setting press 62. After that, unlike the case of FIG. 2, the support 51a provided with the metal foil circuit on one side is sent without being turned over by the roll 68, and is unwound from the laminate roll 50 arranged at the center of the apparatus, and the In the same manner as described above, the metal foil circuit is combined with the laminated body 50 from which the metal foil has been punched out by the cutting press 63, and further passed through the second heating press 64 and the second heat setting press 65 on the metal foil circuit on the support. Is wound up as a product 54. The product obtained above is coated with a pressure-sensitive adhesive on the surface of the support and bonded with release paper to form a resonance label having a configuration shown in FIG. 4g.

Embodiment 3 FIG. 6 shows a roll apparatus in which the press of the cutting press, the heating press and the heat setting press is a lithographic system. FIG.
In the figures, 80 and 83 indicate first and second cutting die rolls, 81 and 84 indicate heating rolls, and 82 and 85 indicate heat setting rolls. In this apparatus, for example, as shown in FIG. 7, one of the cutting die rolls 80 is a metal roll having a cutting blade 801 on its surface, the other roll 80b is a rubber roll having a smooth surface, and the heat setting roll 81
Are two rolls 81a and 81b having a heating pattern 811 protruding on the surface in the same manner as the letterpress printing roll (FIG. 8), and the heat setting roll 82 is two smooth rolls (FIG. 9). The apparatus of FIG. 6 is the same as the apparatus of FIG. 5 except that each press is a roll press.

Fourth Embodiment FIG. 10 shows a modification of the resonance tag obtained by the method of the first embodiment. A plastic dielectric film 12 is used as a support, and holes 13 are provided in the dielectric film 12 in advance. FIG. 3 is an exploded perspective view of a resonance tag in which a circuit of a metal foil 2 is formed on both surfaces of a film 12. The holes 13 are used to connect circuits on both sides of the dielectric film 12 or to break a resonance circuit. In this case, an uncoated portion may be formed on the heat-adhesive resin coating 1 provided on the surface of the metal foil 2 of the laminate at a position corresponding to the hole 13 of the dielectric film 12. The resonance tag of FIG. 10 does not form a capacitor electrode plate at the end of the spiral circuit, forms a spiral circuit of the metal foil 2 on both sides of the dielectric film 12, and forms the circuit with the dielectric film 12 interposed therebetween. By forming them so as to face each other, the circuit itself has a role of a capacitor electrode plate. Depending on the position of the hole 13, electric energy or the like when the resonance circuit is broken can be adjusted.

In a conventional resonance tag, a plastic film or the like formed in advance is used as a dielectric layer, and a coil portion of a resonance circuit is formed on both surfaces thereof. In a method of transmitting a very strong resonance frequency to a resonance circuit, which is one of the conventional methods for erasing a resonance circuit, the dielectric layer is thick and does not easily short-circuit with a preformed plastic film. The method is based on a method in which a short-circuit-prone portion is formed near the provided capacitor electrode plate. The present invention is different from the conventional plastic film in that the dielectric layer is formed of a very thin resin layer having a thickness of several microns having a dielectric property also serving as an adhesive. When a strong resonance frequency is transmitted, for example, the portion A of the resonance circuit 21 shown in FIG.
Many electrons are accumulated in the weakest part of the electric field, such as the bent part of the coil 22, and a part of the dielectric layer in the part A is destroyed and electrically short-circuited. Circuit can be destroyed. The electrically weakest portion is not limited to the bent portion of the coil, and may be provided by means such as making the coil a narrow width or making the coil partially thin. In FIG. 11, reference numeral 23 denotes a connection portion for connecting the resonance circuits 21 (metal foil) laminated with a dielectric layer interposed therebetween. The destruction effect of the above circuit is obtained by bonding two coils 22 forming a resonance circuit to each other with a dielectric layer interposed therebetween without forming a capacitor electrode plate at the end of the resonance circuit. There is a more remarkable effect in the case of a resonance tag having the role of a capacitor electrode plate. The resonance circuit according to the present invention is not limited to the above-described erasing method, and the resonance characteristics can be erased by a method of mechanically pressing and connecting the resonance circuits on both front and back sides used in a conventional resonance tag or the like.

The resonance label of the type in which the adhesive 6 is applied to one side of the resonance tag base material A and the upper surface thereof is covered with the release paper 5 is used. May occur (see FIG. 12). At this time, the resonance characteristics may be lost (inactivated) by the electrostatic discharge. In order to prevent such a defect, it is preferable to select an adhesive that does not generate static electricity, or to provide a non-applied portion 6a on the application surface of the adhesive 6, as shown in FIGS. FIG. 13 is a perspective view showing an example in which a non-applied portion is linearly provided, and FIG. 14 is a plan view showing the pressure-sensitive adhesive applied surface. The linear non-applied portion 6a may be provided parallel to the direction in which the release paper 5 is peeled off, or may be provided at right angles. FIG. 15 shows an example in which non-applied portions are provided in a grid pattern. In addition, the adhesive may be applied at an appropriate interval such as providing an adhesive at halftone dots (a large number of dots). The method of providing the non-applied portion and applying the adhesive as described above is particularly effective in the case of the resonance tag of the present invention in which the dielectric layer is extremely thin.

As described above, the present invention has been described with reference to a resonance tag and a label, but according to the method of the present invention, an arbitrary width, for example, 1 mm
Since it is possible to transfer a metal foil having a linear pattern having a width of about 10 mm from various widths to various articles, it is not limited to the above-mentioned application examples of the resonance tag, the single-layer or the multilayer printed wiring board, and the like. Manufacture of hot carpets, electric blankets and hot plates for snow melting by applying to sheets and woven fabrics, and apply to glass sheets to prevent fogging of automobile window glass, glass for greenhouses and vinyl sheets for greenhouses To make defrosted glass and sheets. Further, the present invention can be applied to various uses such as giving a metal pattern to a ceramic body such as pottery or a lacquer ware.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a member in each step for explaining an embodiment of the present invention.

FIG. 2 is a perspective view of a manufacturing apparatus for one embodiment of the present invention.

FIG. 3 is a perspective view showing an application example of a part of the apparatus shown in FIG. 2;

FIG. 4 is a sectional view of a member in each process for explaining another embodiment of the present invention.

FIG. 5 is a perspective view of a manufacturing apparatus for another embodiment of the present invention.

FIG. 6 is a perspective view showing an example of another manufacturing apparatus for carrying out the present invention.

FIG. 7 is a side view showing an example of a cutting die roll of the apparatus of FIG.

FIG. 8 is a side view showing an example of a heating roll of the apparatus of FIG.

FIG. 9 is a side view showing an example of a heat setting roll of the apparatus of FIG.

FIG. 10 is an exploded perspective view showing an example of the resonance tag of the present invention.

FIG. 11 is an explanatory diagram showing an example of a method of erasing the resonance characteristics of the resonance tag of the present invention.

FIG. 12 is a perspective view showing a state in which release paper is peeled from a resonance tag base material.

FIG. 13 is a perspective view showing an example of an application pattern of an adhesive on a resonance tag base material.

FIG. 14 is a plan view showing an example of an application pattern of an adhesive on a resonance tag base material.

FIG. 15 is a plan view showing another example of an application pattern of an adhesive on a resonance tag base material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermoplastic resin film 2 Metal foil 3 Adhesive 4 Carrier sheet 5 Release paper 6 Adhesive 7 Support (paper) 8 Support (plastic film) 9 Cut 10 Laminated body 11 Mold 12 Dielectric film 50 Lamination Body 51 Support 53 Product 60 First cutting press 61 First heating press 62 First heat setting press

Claims (9)

[Claims] 1. A first laminate having a heat-adhesive resin film formed on the surface of a metal foil bonded to a carrier sheet is punched into a metal foil of the laminate with a predetermined circuit-like pattern. A cut is made, a metal foil is stuck to a carrier sheet on the first laminate having the cut, and a second laminate having a predetermined circuit-like pattern cut in the metal foil is laminated by a punching die. First and / or second
A circuit-like metal foil sheet formed by heating the circuit-like pattern portion from the side of the carrier sheet of the laminate, and forming a circuit-like metal foil on both sides thereof via the heat-adhesive coating. 2. A resonance tag comprising the circuit-like metal foil sheet according to claim 1. 3. The laminate for producing a circuit-like metal foil sheet according to claim 1, wherein the carrier sheet and the metal foil are adhered to each other with an easily peelable adhesive. 4. The adhesive for laminating a carrier sheet and a metal foil, wherein the adhesive strength is reduced by heating with a curing agent mixed with an adhesive.
The laminate according to the above. 5. A dielectric plastic film or a dielectric resin coating film in which holes or cutouts for connecting circuits of metal foil provided on both front and back surfaces of a support are provided at predetermined positions in advance are used as the support. A resonance tag comprising a metal foil circuit laminated on both sides of a support. 6. A circuit of a coiled metal foil laminated on both front and back surfaces of a dielectric resin coating film as a support, by transmitting a strong resonance frequency to the resonance circuit, thereby forming a bent portion of the coil portion. A short circuit in an electrically weak part such as the above to break a resonance circuit. 7. The resonance tag according to claim 6, wherein the resonance tag has a coil portion of the resonance circuit laminated to face each other with a dielectric film interposed therebetween. 8. A resonance tag in which an adhesive is applied to at least one surface of a resonance tag base material and a release paper is adhered to an upper surface of the resonance tag base material so that resonance characteristics are not impaired by static electricity or the like generated when the release paper is peeled off. A resonance tag comprising a non-coated portion and an adhesive applied thereto. 9. The resonance tag according to claim 8, wherein the non-applied portion of the pressure-sensitive adhesive has a linear or lattice shape with an appropriate width.