JPH11302525A - Resin composition for heat resistant plastic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition giving plastic card excellent in heat resistance and morphological stability by including polycarbonate resin and isophthalic acid modified polyethylene terephthalate. SOLUTION: This composition includes (A) 100 pts.wt of polycarbonate resin preferably having a viscosity average molecular weight of 10,000 to 100,000 and (B) 0.5 to 40 pts.wt. of the isophthalic acid modified polyethylene terephthalate having intrinsic viscosity of 0.7 to 1.2 measured in conformity to JIS K-7233. The amount of the isophthalic acid component in the component (B) is preferably 5 to 30 mole % based on the sum of the isophthalic acid and terephthalic acid used as monomers. A heat resistant plastic card excellent in adhesivity of a protective layer comprising thermoplastic resin established at least one side of the surface of the plastic card base is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic card such as a medical card, a cash card, a credit card and the like which has excellent heat resistance and shape stability and can be used even when stored or left under relatively high temperature conditions. The present invention relates to a resin composition. More specifically, the present invention relates to a resin composition for a heat-resistant plastic card which has excellent adhesion to the thermoplastic resin protective layer when a protective layer of a thermoplastic resin is provided on at least one surface layer of the plastic card.

[0002]

2. Description of the Related Art Conventionally, vinyl chloride resins have often been used for plastic cards. However, in the case of a plastic card made of a vinyl chloride resin, severe conditions exposed to relatively high temperatures in daily life, such as under the scorching sun,
When stored or left in a car or the like exposed to direct sunlight, there is a problem that shrinkage occurs and dimensional stability is poor.

[0003] In order to solve the above problems, the use of a plastic material having higher heat resistance than a vinyl chloride resin has been studied. The heat distortion temperature of vinyl chloride resin is 80
It is proposed to substitute a plastic material having a heat distortion temperature of 100 ° C. or more assuming storage and standing under high temperature conditions that can occur in daily life, such as a heat deformation temperature of 130 to 140 ° C. Has been considered as a candidate and has been studied.

[0004]

However, in the case of a plastic card, a transparent thermoplastic resin such as a polycarbonate resin is used for printing on at least one surface layer, or for protecting the surface layer even when printing is not performed. In some cases, resin films, sheets, etc. (hereinafter referred to as oversheets) may be bonded by means such as hot pressing. In such a case, depending on the temperature conditions of the hot pressing, bonding of the plastic card base material made of polycarbonate resin to the oversheet is performed. A problem of poor performance occurred.

Specifically, if the temperature condition is 160 ° C. or higher, the adhesion between the polycarbonate resin plastic card base material and the oversheet is good, but the ink used for printing is discolored or bleeds. However, there is a problem that the value as a plastic card is significantly impaired. To avoid this, if the temperature condition is lowered, the problems of discoloration and bleeding of the ink are solved, but the adhesion between the plastic card base material and the oversheet is poor, and there is a problem that the plastic sheet comes off during use.

[0006]

DISCLOSURE OF THE INVENTION The present inventors have conducted intensive studies to prevent the discoloration and bleeding of the ink and to improve the adhesion between the polycarbonate plastic card substrate and the oversheet. By blending the resin with a specific isophthalic acid-modified polyethylene terephthalate, it was found that discoloration and bleeding of the ink did not occur, and that the adhesion between the plastic card substrate and the oversheet was significantly improved, and the present invention was completed. Reached.

[0007] That is, the present invention provides a resin composition for heat-resistant plastic cards, characterized in that 0.5 to 40 parts by weight of isophthalic acid-modified polyethylene terephthalate is blended with 100 parts by weight of a polycarbonate resin. Is what you do.

Hereinafter, the resin composition for a heat-resistant plastic card of the present invention will be described in detail.

The polycarbonate resin used in the present invention can be obtained by a phosgene method of reacting various dihydroxydiaryl compounds with phosgene or a transesterification method of reacting a dihydroxydiaryl compound with a carbonate such as diphenyl carbonate. It is a polymer and a typical example is 2,2-bis (4
-Hydroxyphenyl) propane (bisphenol A)
And polycarbonate resins produced from the same.

As the dihydroxydiaryl compound, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl), in addition to bisphenol A,
Butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4 -Hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane,
2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis (4-hydroxy-3,
Bis (hydroxyaryl) alkanes such as 5-dichlorophenyl) propane, bis (hydroxyaryl) such as 1,1-bis (4-hydroxyphenyl) cyclopentane and 1,1-bis (4-hydroxyphenyl) cyclohexane Cycloalkanes, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-
Dihydroxy diaryl ethers such as 3,3'-dimethyldiphenyl ether; dihydroxy diaryl sulfides such as 4,4'-dihydroxy diphenyl sulfide; 4,4'-dihydroxy diphenyl sulphoxide; 4,4'-dihydroxy-3,3 Dihydroxydiarylsulfoxides such as'-dimethyldiphenylsulfoxide; and dihydroxydiarylsulfones such as 4,4'-dihydroxydiphenylsulfone and 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfone.

These may be used alone or as a mixture of two or more kinds. In addition, piperazine, dipiperidyl hydroquinone, resorcin, 4,4'-dihydroxydiphenyl and the like may be used in combination.

Further, the above-mentioned dihydroxyaryl compound and a phenol compound having three or more valences as shown below may be mixed and used.

The phenols having three or more valences include phloroglucin, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -heptene, and 2,4,6-dimethyl-2,4,6-triphenol. -(4-hydroxyphenyl) -heptane, 1,3,5-tri- (4-hydroxyphenyl) -benzol, 1,1,1-tri- (4-hydroxyphenyl) -ethane and 2,2-bis- [4,4-
(4,4'-dihydroxydiphenyl) -cyclohexyl] -propane.

The viscosity average molecular weight of the polycarbonate resin is usually from 10,000 to 100,000, preferably from 15,500.
000-35,000, more preferably 23,000-
32,000. In producing such a polycarbonate resin, a molecular weight regulator, a catalyst and the like can be used as required.

The isophthalic acid-modified polyethylene terephthalate used in the present invention has an intrinsic viscosity of 0.7 to 1.2, preferably 0.9 to 1.1, measured according to JIS K-7233. Can be suitably used.

The isophthalic acid component of the isophthalic acid-modified polyethylene terephthalate is from 5 to 30 based on the total amount of isophthalic acid and terephthalic acid as monomers constituting the isophthalic acid-modified polyethylene terephthalate.
Preferably it is mol%. More preferably, 8 to 2
The range is 5 mol%.

The amount of the isophthalic acid-modified polyethylene terephthalate is 0.5 to 40 parts by weight based on 100 parts by weight of the polycarbonate resin. If the amount is less than 0.5 part by weight, the adhesiveness to the oversheet is inferior. A more preferable compounding amount is 1 to 1
0 parts by weight.

The method of mixing the polycarbonate resin and the isophthalic acid-modified polyethylene terephthalate is not particularly limited, and a known mixer such as a tumbler, ribbon,
A method of mixing with a blender, a high-speed mixer, or the like, followed by melt-kneading is used.

Further, as long as the effects of the present invention are not impaired,
At the time of mixing, various additives such as an antioxidant, an antistatic agent, a release agent, a lubricant, a light stabilizer, an ultraviolet absorber, and a dye / pigment may be added as necessary.

[0020]

EXAMPLES The present invention will be described below in more detail with reference to examples, but the present invention is not limited to these examples. In addition, "part" and "%" are based on weight.

(Examples 1 to 9 and Comparative Examples 1 to 3) Polycarbonate resin and isophthalic acid-modified polyethylene terephthalate were premixed in a tumbler based on the mixing ratio in Table 1 and melted and mixed in a single screw extruder to obtain various resin compositions. A product pellet was obtained. The contents of the plastics used are as follows: Polycarbonate resin (hereinafter abbreviated as PC): PC: Caliber 200-3 manufactured by Sumitomo Dow Co., Ltd. Isophthalic acid-modified polyethylene terephthalate (hereinafter abbreviated as PETI): PETI-1 : Kuraray Co., Ltd. KL-576K Intrinsic viscosity: 1.01 Isophthalic acid content: 25 mol% PETI-2: Kuraray Co., Ltd. Kurapet KS-760K Intrinsic viscosity: 0.85 Isophthalic acid content: 8 mol % PETI-3: Kurapet KD-750 manufactured by Kuraray Co., Ltd. Intrinsic viscosity: 0.79 Isophthalic acid content: 5 mol%

The pellets of the obtained various resin compositions were extruded at 260 ° C. using a T-die to obtain a sheet having a thickness of 0.9 mm. The obtained sheet was further subjected to hot press working at 240 ° C. to prepare a resin plate having a thickness of 0.75 to 0.8 mm.

The resin plate was cut into a size of 14 cm x 14 cm, an aluminum foil was placed on one half of the surface, an oversheet (*) was placed on the entire surface, and heat was applied at 150 ° C and 160 ° C, respectively. Press processing was performed, and the resin plate and the oversheet were bonded. Thereafter, the test piece was cut into a test piece having a length of 14 cm and a width of 2 cm so as to include the aluminum foil part in the length direction, and the aluminum foil was removed to obtain a test piece for measuring the adhesion to the oversheet. (*) Polycarbonate resin oversheet: 28 mm caliber 301-4 manufactured by Sumitomo Dow Co., Ltd.
Extrusion was performed at 0 ° C. to form a film having a thickness of 200 μm.
This was used as an overseat.

Using the obtained test piece, a peeling test was performed in a constant temperature room at a temperature of 23 ° C. and a relative humidity of 50% under the following conditions. Tensile tester: Universal tensile tester UC manufactured by Orientec
T-1T Tensile speed: 20 mm / min The load at the peeling start point is shown in Table 1 as the adhesive strength.
In addition, the adhesive strength was 2.5 kgf or more, or the one in which the oversheet was broken without peeling was judged to be acceptable.

On the other hand, a test piece was prepared by injection molding using the pellets of each of the obtained resin compositions, and was subjected to ASTM-D-
According to 648, the deflection temperature under load was measured in a constant temperature room at a temperature of 23 ° C. and a relative humidity of 50%. This temperature is 100
Those with a temperature of at least ° C were accepted. Table 1 shows the results.

[0026]

[Table 1]

[0027]

By using the resin composition of the present invention for the base material of a plastic card, excellent adhesion to the thermoplastic resin protective layer provided on at least one surface layer of the plastic card base material is obtained. A heat-resistant plastic card can be obtained.

Claims (6)

[Claims] 1. A resin composition for a heat-resistant plastic card, comprising 0.5 to 40 parts by weight of isophthalic acid-modified polyethylene terephthalate with respect to 100 parts by weight of a polycarbonate resin. 2. The heat-resistant plastic card resin composition according to claim 1, wherein the blending amount of the isophthalic acid-modified polyethylene terephthalate is 1 to 10 parts by weight. 3. The heat-resistant plastic card resin composition according to claim 1, wherein the isophthalic acid-modified polyethylene terephthalate has an intrinsic viscosity of 0.7 to 1.2. 4. The heat-resistant plastic card resin composition according to claim 1, wherein the isophthalic acid-modified polyethylene terephthalate has an intrinsic viscosity of 0.9 to 1.1. 5. An isophthalic acid-modified polyethylene terephthalate having an isophthalic acid component in an amount of 5 to 3 based on the total amount of isophthalic acid and terephthalic acid as monomers constituting the isophthalic acid-modified polyethylene terephthalate.
The resin composition for a heat-resistant plastic card according to claim 1 or 2, which is 0 mol%. 6. An isophthalic acid-modified polyethylene terephthalate having an isophthalic acid component in an amount of from 8 to 2 based on the total amount of isophthalic acid and terephthalic acid as monomers constituting the isophthalic acid-modified polyethylene terephthalate.
The resin composition for a heat-resistant plastic card according to claim 1, wherein the content is 5 mol%.