JPH11293205A - Pressure-sensitive adhesive tape and its production - Google Patents

Pressure-sensitive adhesive tape and its production

Info

Publication number
JPH11293205A
JPH11293205A JP10104375A JP10437598A JPH11293205A JP H11293205 A JPH11293205 A JP H11293205A JP 10104375 A JP10104375 A JP 10104375A JP 10437598 A JP10437598 A JP 10437598A JP H11293205 A JPH11293205 A JP H11293205A
Authority
JP
Japan
Prior art keywords
pressure
adhesive tape
sensitive adhesive
resin
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10104375A
Other languages
Japanese (ja)
Other versions
JP4049442B2 (en
Inventor
Takeshi Yamada
武 山田
Tadatoshi Ogawa
忠俊 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumika Plastech Co Ltd
Original Assignee
Sumika Plastech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumika Plastech Co Ltd filed Critical Sumika Plastech Co Ltd
Priority to JP10437598A priority Critical patent/JP4049442B2/en
Publication of JPH11293205A publication Critical patent/JPH11293205A/en
Application granted granted Critical
Publication of JP4049442B2 publication Critical patent/JP4049442B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PROBLEM TO BE SOLVED: To prepare a pressure-sensitive adhesive tape satisfactory in manual cuttability and flexibility and in productivity as well and to provide a process for producing the same. SOLUTION: This tape consists of a support 1 made of a film made from a thermoplastic resin composition comprising 5-90 wt.%, polypropylene resin, 5-90 wt.% polyethylene resin, and 5-90 wt.% thermoplastic elastomer and made so that one of its surfaces may be smooth, and the other may be non-smooth and may have many groovy recesses in the direction of width of the pressure- sensitive adhesive tape and a pressure-sensitive adhesive layer 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は粘着テープ及びその
製造方法に関する。詳しくは、本発明は、粘着テープの
幅方向に多数の溝状の凹部を有する特定の熱可塑性樹脂
組成物製フィルムからなる基材に粘着剤を塗布してな
る、手切れ性および柔軟性が良好であり、且つ粘着テー
プの生産性も良好な粘着テープ及びその製造方法に関す
る。ここで、「手切れ性」とは、鋏や鋸歯状のカッター
等の切断具を使用せずに手の指先のみで粘着テープを幅
方向に真っ直ぐに切断し得る性能を意味する。
The present invention relates to a pressure-sensitive adhesive tape and a method for producing the same. Specifically, the present invention is obtained by applying a pressure-sensitive adhesive to a substrate made of a specific thermoplastic resin composition film having a large number of groove-shaped concave portions in the width direction of the pressure-sensitive adhesive tape, and has a hand-cutting property and flexibility. The present invention relates to a pressure-sensitive adhesive tape which is good and has good productivity of a pressure-sensitive adhesive tape, and a method for producing the same. Here, "hand-cutting property" means the ability to cut the adhesive tape straight in the width direction with only the fingertip of the hand without using a cutting tool such as scissors or a sawtooth-shaped cutter.

【0002】[0002]

【従来の技術】粘着テープは一般に、図1に示す通り、
樹脂・紙・布・金属等からなる基材1と基材1の上に塗
布された粘着剤層2とからなり、ロール状に重ね巻きさ
れた巻物の形態で市販されている。この形態の粘着テー
プは、粘着テープを巻物から必要な長さにまで引き出し
たあと所望の箇所で切断して用いられる。巻物からの粘
着テープの引き出し易さ(展開性)を高めるために、粘
着剤を塗布しない基材1の面である背面3の上に必要に
応じて剥離剤が塗布される。
2. Description of the Related Art Generally, an adhesive tape is, as shown in FIG.
It is composed of a base material 1 made of resin, paper, cloth, metal or the like, and an adhesive layer 2 applied on the base material 1, and is commercially available in the form of a roll wound in a roll shape. The adhesive tape of this form is used by extracting the adhesive tape to a required length from a scroll and cutting it at a desired location. A release agent is applied as necessary on the back surface 3 which is the surface of the base material 1 on which the adhesive is not applied, in order to enhance the ease of pulling out the adhesive tape from the scroll (developability).

【0003】粘着テープの幅方向に多数の溝状の凹部を
有する熱可塑性樹脂製フィルムからなる基材に粘着剤を
塗布してなる手切れ性の良好な粘着テープとして、特許
第2694854号公報に記載された粘着テープが知ら
れている。この粘着テープの基材1は、一方の面が平滑
面4に、他方の面が幅方向に多数の溝状の凹部5を有す
る非平滑面6に形成されてなるポリオレフィン樹脂製フ
ィルムからなる基材であって(図2参照)、この基材1
の非平滑面6の上に粘着剤7が塗布されてなる粘着テー
プ(図3参照)の良好な手切れ性は、幅方向に形成され
た多数の溝状の凹部8に因るものである。前記公報に具
体的に記載されているポリオレフィン樹脂は、ポリエチ
レン樹脂、ポリプロピレン樹脂、エチレンまたはプロピ
レンとブテン−1等のα−オレフィンとの共重合体樹脂
であり、実施例に記載された樹脂はポリエチレン樹脂で
ある。
[0003] Japanese Patent No. 2,694,854 discloses a pressure-sensitive adhesive tape having good hand-cutting properties obtained by applying a pressure-sensitive adhesive to a substrate made of a thermoplastic resin film having a large number of groove-shaped concave portions in the width direction of the pressure-sensitive adhesive tape. The described adhesive tapes are known. The base material 1 of this adhesive tape is formed of a polyolefin resin film having one surface formed on a smooth surface 4 and the other surface formed on a non-smooth surface 6 having a large number of groove-shaped recesses 5 in the width direction. Material (see FIG. 2),
The good hand-cutting property of the pressure-sensitive adhesive tape (see FIG. 3) formed by applying the pressure-sensitive adhesive 7 on the non-smooth surface 6 is caused by the large number of groove-shaped concave portions 8 formed in the width direction. . The polyolefin resin specifically described in the publication is a polyethylene resin, a polypropylene resin, a copolymer resin of ethylene or propylene and an α-olefin such as butene-1, and the resin described in Examples is polyethylene resin. Resin.

【0004】この粘着テープの基材の製造方法について
前記公報には、図4に示すように、溶融された樹脂10
を押出機11でフィルム状に押出した後、表面が非平滑
な面である絞ロール12(絞の形状はフィルムの幅方向
に多数の溝状の凹部を付与する形状であって、かかるロ
ールはエンボスロールとも言われている)と、表面が実
質的に平滑な面である平滑ロール13との間で該フィル
ムを押圧することによりフィルムの表面に絞の形状を転
写し、次いで、非平滑面の側が電極14に向き合うよう
に位置させて、表面が実質的に平滑な面である平滑ロー
ル15と電極14との間にフィルムを通すことによって
コロナ放電処理を施して基材を得る、という方法が例示
されている。なお、前記公報には、コロナ放電処理は必
要に応じて行なう旨記載されている。
[0004] Regarding the method of manufacturing the base material of the pressure-sensitive adhesive tape, as shown in FIG.
After being extruded into a film by an extruder 11, a squeezing roll 12 having a non-smooth surface (the shape of the squeezing is such that a large number of groove-shaped concave portions are provided in the width direction of the film. By pressing the film between a smooth roll 13 having a substantially smooth surface and a smooth roll 13, the shape of the squeezed pattern is transferred to the surface of the film. Is disposed so as to face the electrode 14, and a substrate is obtained by performing a corona discharge treatment by passing a film between the electrode 14 and the smooth roll 15 having a substantially smooth surface. Is exemplified. The publication describes that corona discharge treatment is performed as necessary.

【0005】[0005]

【発明が解決しようとする課題】しかし、前記公報に記
載された粘着テープは、基材用のポリオレフィン樹脂と
して分岐または線状低密度ポリエチレン樹脂を用いた場
合には、該樹脂の融点が比較的低いために、基材に粘着
剤を塗布した後の乾燥工程の温度を高めることができな
いので乾燥工程に時間がかかり、その結果、粘着テープ
の生産性が劣るという製造工程上の問題点を持ってお
り、逆に、融点の高い高密度ポリエチレン樹脂やポリプ
ロピレン樹脂を用いた場合には、粘着テープの生産性は
向上するものの粘着テープの柔軟性が低下し、また、図
4に示す押出機11と絞ロール12・平滑ロール13と
の間において、フィルムに対してその加工方向(図の上
下方向)に張力(配向)がかかってフィルムの幅方向の
引裂強度が増大し、その結果、粘着テープの手切れ性に
好ましくない影響を与える傾向があるという問題点を持
っている。
However, the pressure-sensitive adhesive tape described in the above publication has a relatively low melting point when a branched or linear low-density polyethylene resin is used as the polyolefin resin for the base material. Due to the low temperature, it is not possible to raise the temperature of the drying process after applying the pressure-sensitive adhesive to the base material, so the drying process takes time, and as a result, there is a problem in the manufacturing process that the productivity of the adhesive tape is poor. On the other hand, when a high-density polyethylene resin or a polypropylene resin having a high melting point is used, the productivity of the adhesive tape is improved, but the flexibility of the adhesive tape is reduced, and the extruder 11 shown in FIG. Between the squeezing roll 12 and the smoothing roll 13, tension (orientation) is applied to the film in the processing direction (vertical direction in the figure) to increase the tear strength in the width direction of the film, Results have a problem that tends to adversely affect the hand cutting property of the adhesive tape.

【0006】本発明の目的は、手切れ性および柔軟性が
良好であり、且つ粘着テープの生産性も良好な粘着テー
プ及びその製造方法を提供することにある。
An object of the present invention is to provide a pressure-sensitive adhesive tape having good hand-cutting properties and flexibility and good productivity of a pressure-sensitive adhesive tape, and a method for producing the same.

【0007】[0007]

【課題を解決するための手段】本発明者等は、粘着テー
プの幅方向に多数の溝状の凹部を有する熱可塑性樹脂製
フィルムからなる基材と粘着剤層とからなる粘着テープ
であって、手切れ性および柔軟性が良好であり、且つ粘
着テープの生産性も良好な粘着テープの開発について研
究を重ねてきた。その結果、基材用の樹脂として、ポリ
プロピレン系樹脂とポリエチレン系樹脂と熱可塑性エラ
ストマーとからなる熱可塑性樹脂組成物を用いることに
より、本発明の目的を達し得ることを見い出したことを
発端として、本発明を完成させるに至った。
Means for Solving the Problems The present inventors have developed an adhesive tape comprising a substrate made of a thermoplastic resin film having a large number of groove-shaped concave portions in the width direction of the adhesive tape, and an adhesive layer. Studies have been made on the development of a pressure-sensitive adhesive tape having good hand-cutting properties and flexibility, and good productivity of the pressure-sensitive adhesive tape. As a result, by using a thermoplastic resin composition comprising a polypropylene-based resin, a polyethylene-based resin, and a thermoplastic elastomer as the resin for the base material, it was found that the object of the present invention could be achieved, The present invention has been completed.

【0008】すなわち、本発明は、ポリプロピレン系樹
脂5重量%〜90重量%、ポリエチレン系樹脂5重量%
〜90重量%及び熱可塑性エラストマー5重量%〜90
重量%を含む熱可塑性樹脂組成物製のフィルムからなる
基材であって、一方の面が平滑面に他方の面が粘着テー
プの幅方向に多数の溝状の凹部を有する非平滑面に形成
されてなる基材と粘着剤層とからなる粘着テープであ
る。
[0008] That is, the present invention relates to a polypropylene-based resin of 5% by weight to 90% by weight and a polyethylene-based resin of 5% by weight.
~ 90% by weight and 5% by weight of thermoplastic elastomer ~ 90
A substrate made of a film made of a thermoplastic resin composition containing 1% by weight, one surface being formed on a smooth surface and the other surface being formed on a non-smooth surface having a number of groove-shaped recesses in the width direction of the adhesive tape. A pressure-sensitive adhesive tape comprising a base material and a pressure-sensitive adhesive layer.

【0009】また、本発明は、以下の工程からなる粘着
テープの製造方法である。 工程(1):ポリプロピレン系樹脂5重量%〜90重量
%、ポリエチレン系樹脂5重量%〜90重量%及び熱可
塑性エラストマー5重量%〜90重量%を含む熱可塑性
樹脂組成物製のフィルムからなる薄物を絞ロールと平滑
ロールとの間で押圧して、該薄物の幅方向に多数の溝状
の凹部を形成する工程 工程(2):必要に応じて、工程(1)で得られる薄物
と手切れ性の良好な他のフィルムとを積層して基材を得
る工程 工程(3):該基材の少なくとも一面に粘着剤を塗布す
る工程 以下、本発明について詳細に説明するが、本発明を図に
よって説明する場合、図示したものは本発明の例に過ぎ
ず、本発明は図示されたものに限定されるものではな
い。また、図は本発明を分かり易く描くことに重点を置
いており、縮尺は必ずしも実際のものを正確に反映した
ものではない。
Further, the present invention is a method for producing an adhesive tape comprising the following steps. Step (1): A thin material comprising a film made of a thermoplastic resin composition containing 5% to 90% by weight of a polypropylene resin, 5% to 90% by weight of a polyethylene resin, and 5% to 90% by weight of a thermoplastic elastomer. Is pressed between a squeezing roll and a smoothing roll to form a large number of groove-shaped concave portions in the width direction of the thin object. Step (2): If necessary, the thin object obtained in the step (1) and the hand Step of obtaining a substrate by laminating the film with another film having good cutting properties Step (3): Step of applying an adhesive on at least one surface of the substrate Hereinafter, the present invention will be described in detail. When illustrated by figures, what is illustrated is merely an example of the present invention, and the present invention is not limited to the illustrated one. Also, the figures focus on drawing the invention in an easy-to-understand manner, and the scales do not necessarily accurately reflect actual ones.

【0010】[0010]

【発明の実施の形態】本発明の粘着テープの基材にかか
るポリプロピレン系樹脂とはプロピレンから誘導される
高分子鎖を主体とする熱可塑性樹脂であって、公知の樹
脂であってもよい。該樹脂としてプロピレンの単独重合
体樹脂(ホモポリプロピレン樹脂);プロピレンとエチ
レンとの共重合体樹脂、プロピレンとブテンとの共重合
体樹脂、プロピレンとエチレンとブテンとの共重合体樹
脂等のプロピレンと1種また2種以上のα−オレフィン
との共重合体樹脂;これら樹脂の混合物を例示すること
ができ、共重合体樹脂はランダム共重合体樹脂であって
もブロック共重合体樹脂であってもかまわない。本発明
の目的である「粘着テープの生産性の向上」の観点か
ら、耐熱性に優れた(融点の高い)ホモポリプロピレン
樹脂が好ましい。ポリプロピレン系樹脂の物性は特に限
定されず、粘着テープの用途等に応じて適宜に設定すれ
ばよいが、手切れ性の観点からはメルトフローレート
(以下、MFRとも言う)が約30g/10分以上なる
大のものが好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION The polypropylene resin for the base material of the pressure-sensitive adhesive tape of the present invention is a thermoplastic resin mainly composed of a polymer chain derived from propylene, and may be a known resin. As the resin, propylene homopolymer resin (homopolypropylene resin); propylene such as a copolymer resin of propylene and ethylene, a copolymer resin of propylene and butene, and a copolymer resin of propylene, ethylene and butene; A copolymer resin with one or two or more α-olefins; a mixture of these resins may be exemplified, and the copolymer resin may be a random copolymer resin or a block copolymer resin. It doesn't matter. From the viewpoint of improving the productivity of the pressure-sensitive adhesive tape, which is the object of the present invention, a homopolypropylene resin having excellent heat resistance (high melting point) is preferred. The physical properties of the polypropylene-based resin are not particularly limited, and may be appropriately set according to the use of the pressure-sensitive adhesive tape. From the viewpoint of hand-cutting properties, the melt flow rate (hereinafter, also referred to as MFR) is about 30 g / 10 min. Larger ones are preferred.

【0011】本発明の粘着テープの基材にかかるポリエ
チレン系樹脂とは、エチレンから誘導される高分子鎖を
主体とする熱可塑性樹脂であって、公知の樹脂であって
もよい。該樹脂としてエチレンの単独重合体樹脂(ホモ
ポリエチレン樹脂);エチレンとプロピレンとの共重合
体樹脂、エチレンとブテンとの共重合体樹脂、エチレン
とプロピレンとブテンとの共重合体樹脂等のエチレンと
1種また2種以上のα−オレフィンとの共重合体樹脂;
これら樹脂の混合物を例示することができ、共重合体樹
脂はランダム共重合体樹脂であってもブロック共重合体
樹脂であってもかまわない。フィルムに成形するときの
製膜安定性の観点から、例えば高圧重合法によって製造
される分岐型低密度ポリエチレン樹脂などの溶融張力の
大きい樹脂が好ましい。ポリエチレン系樹脂のMFR・
密度などの物性については特に限定はなく、成形性や粘
着テープの用途等に応じて適宜に設定すればよい。
The polyethylene resin used as the base material of the pressure-sensitive adhesive tape of the present invention is a thermoplastic resin mainly composed of a polymer chain derived from ethylene, and may be a known resin. As the resin, a homopolymer resin of ethylene (homopolyethylene resin); a copolymer resin of ethylene and propylene, a copolymer resin of ethylene and butene, and a copolymer resin of ethylene, propylene and butene; Copolymer resins with one or more α-olefins;
A mixture of these resins can be exemplified, and the copolymer resin may be a random copolymer resin or a block copolymer resin. From the viewpoint of film formation stability when forming a film, a resin having a high melt tension, such as a branched low-density polyethylene resin produced by a high-pressure polymerization method, is preferable. MFR of polyethylene resin
The physical properties such as density are not particularly limited, and may be appropriately set according to the moldability, the use of the adhesive tape, and the like.

【0012】本発明の粘着テープの基材にかかる熱可塑
性エラストマーとは、ゴムと類似の物理的特性(例えば
柔軟性や反発弾性)を有しているにもかかわらず、通常
のゴムとは対照的に、熱可塑性樹脂と同様に加工し得る
高分子物質である。本発明にかかる熱可塑性エラストマ
ーは公知の熱可塑性エラストマーであってもよく、エチ
レンとプロピレンとの共重合体(EPR)、エチレンと
ブテンとの共重合体(EBR)、超低密度ポリエチレン
(ULDPE)、プロピレンとα−オレフィン(ブテン
等)との共重合体等のオレフィン系熱可塑性エラストマ
ー;オレフィン重合体の分子鎖の片末端または両末端に
スチレン重合体が結合した型の共重合体等のスチレン−
オレフィン系熱可塑性エラストマー;スチレンとブタジ
エンとのブロック共重合体(SB、SBS)やその水素
添加物(SEB、SEBS)等のスチレン−ブタジエン
系熱可塑性エラストマー;スチレンとイソプレンとのブ
ロック共重合体(SI、SIS)やその水素添加物(S
EP、SEPS)等のスチレン−イソプレン系熱可塑性
エラストマーを例示し得る。
The thermoplastic elastomer according to the substrate of the pressure-sensitive adhesive tape of the present invention is different from ordinary rubber in spite of having physical properties similar to rubber (for example, flexibility and resilience). It is a high molecular substance that can be processed similarly to a thermoplastic resin. The thermoplastic elastomer according to the present invention may be a known thermoplastic elastomer, and may be a copolymer of ethylene and propylene (EPR), a copolymer of ethylene and butene (EBR), or an ultra low density polyethylene (ULDPE). Olefinic thermoplastic elastomers, such as copolymers of propylene and α-olefins (butene, etc.); styrenes, such as copolymers of the type in which a styrene polymer is bonded to one or both ends of the molecular chain of the olefin polymer −
Olefin-based thermoplastic elastomers; styrene-butadiene-based thermoplastic elastomers such as block copolymers of styrene and butadiene (SB, SBS) and hydrogenated products thereof (SEB, SEBS); block copolymers of styrene and isoprene ( SI, SIS) and its hydrogenated products (S
Examples thereof include styrene-isoprene-based thermoplastic elastomers such as EP and SEPS.

【0013】本発明の粘着テープの基材にかかる好まし
い熱可塑性エラストマーは、フィルムの柔軟性や強度お
よび組成物における分散性を向上させる観点から、EP
RやEBR等のエチレンとα−オレフィンとの共重合体
であるオレフィン系熱可塑性エラストマーであって、密
度が0.910g/cc以下のものであり、柔軟性の観
点からは密度が0.900g/cc以下が好ましい。熱
可塑性エラストマーのMFRは特に制限されないが、組
成物における分散性の観点から、該MFRと組成物を構
成するポリプロピレン系樹脂やポリエチレン系樹脂のM
FRとが大きくかけ離れていなことが好ましい。
The preferred thermoplastic elastomer for the base material of the pressure-sensitive adhesive tape of the present invention is preferably made of EP from the viewpoint of improving the flexibility and strength of the film and the dispersibility in the composition.
An olefin-based thermoplastic elastomer, which is a copolymer of ethylene and α-olefin such as R or EBR, having a density of 0.910 g / cc or less and a density of 0.900 g from the viewpoint of flexibility. / Cc or less is preferred. Although the MFR of the thermoplastic elastomer is not particularly limited, from the viewpoint of dispersibility in the composition, the MFR and the MFR of the polypropylene-based resin or polyethylene-based resin constituting the composition are not limited.
It is preferable that the FR is not greatly different from the FR.

【0014】本発明の粘着テープの基材にかかる熱可塑
性樹脂組成物を構成する成分の配合割合は、ポリプロピ
レン系樹脂5重量%〜90重量%、ポリエチレン系樹脂
5重量%〜90重量%及び熱可塑性エラストマー5重量
%〜90重量%であるが、耐熱性に優れたフィルムを得
るという観点から、ポリプロピレン系樹脂が組成物の連
続相を形成し得る割合であるポリプロピレン系樹脂50
重量%以上が好ましい。また、フィルムの柔軟性や強度
を向上させる観点からは熱可塑性エラストマーを増量す
ればよく、製膜安定性を向上させる観点からはポリエチ
レン系樹脂を増量すればよい。
The components constituting the thermoplastic resin composition according to the base material of the pressure-sensitive adhesive tape of the present invention are 5 to 90% by weight of a polypropylene resin, 5 to 90% by weight of a polyethylene resin, The content of the thermoplastic elastomer is 5% by weight to 90% by weight, and from the viewpoint of obtaining a film having excellent heat resistance, the proportion of the polypropylene-based resin 50 is such that the polypropylene-based resin can form the continuous phase of the composition.
% By weight or more is preferred. From the viewpoint of improving the flexibility and strength of the film, the amount of the thermoplastic elastomer may be increased, and from the viewpoint of improving the film forming stability, the amount of the polyethylene resin may be increased.

【0015】本発明の粘着テープにかかる好ましい基
材、すなわち耐熱性・柔軟性・機械的強度がより優れた
基材の物性は、(イ)熱機械測定における1%以上の寸
法変化が観測される温度が120℃以上であること;
(ロ)前記1%の寸法変化時の荷重がMD方向およびT
D方向ともに1.0kg/20mm幅以下であること;
(ハ)引張試験における伸びがMD方向およびTD方向
ともに50%以上であることである。前記(イ)が満た
されている基材は耐熱性がより優れており、前記(ロ)
が満たされている基材は柔軟性がより優れており、前記
(ハ)が満たされている基材は機械的強度がより優れて
いる(伸びがあり脆くない)。
The physical properties of the preferable base material for the pressure-sensitive adhesive tape of the present invention, that is, the base material having more excellent heat resistance, flexibility and mechanical strength, are as follows. Temperature is 120 ° C. or higher;
(B) The load at the time of the dimensional change of 1% is MD direction and T
1.0 kg / 20 mm width or less in both D directions;
(C) The elongation in the tensile test is 50% or more in both the MD and TD directions. The base material satisfying the above (a) has more excellent heat resistance, and the above (b)
The base material satisfying (c) has more excellent flexibility, and the base material satisfying (c) has more excellent mechanical strength (elongation and not brittleness).

【0016】本発明の粘着テープにかかる基材は、MD
方向の伸びが700%以下であることが好ましい。伸び
が700%より大きい基材の場合、粘着テープを手で切
る際に切断の開始点において基材が伸びてしまい、その
部分にネッキング現象が発生して基材の引裂強度が上昇
し、その結果、手切れ性が良好でなくなる場合がある。
The base material for the pressure-sensitive adhesive tape of the present invention is MD
The elongation in the direction is preferably 700% or less. In the case of a substrate having an elongation of more than 700%, when the adhesive tape is cut by hand, the substrate expands at the starting point of cutting, and a necking phenomenon occurs in that portion, thereby increasing the tear strength of the substrate. As a result, the hand-cutting property may not be good.

【0017】本発明の粘着テープにかかる基材の典型的
な例は、基材の素材が前記公報に記載されたものと異な
る点を除いて、図2に示す基材1と同様の単層の基材で
ある。この図に示す基材は、一方の面が平滑面に、他方
の面が粘着テープの幅方向に多数の溝状の凹部を有する
非平滑面に形成された基材である。この基材への粘着剤
の塗布については、得られる粘着剤テープの粘着力およ
び展開性の観点から、図3に示すように基材1の非平滑
面4に塗布するのが好ましいが、基材1の平滑面4に塗
布してもかまわない。
A typical example of the base material according to the pressure-sensitive adhesive tape of the present invention is a single-layer material similar to the base material 1 shown in FIG. 2 except that the material of the base material is different from that described in the above publication. Of the base material. The substrate shown in this figure is a substrate in which one surface is formed as a smooth surface and the other surface is formed as a non-smooth surface having a number of groove-shaped concave portions in the width direction of the adhesive tape. Regarding the application of the pressure-sensitive adhesive to the substrate, it is preferable to apply the pressure-sensitive adhesive to the non-smooth surface 4 of the substrate 1 as shown in FIG. It may be applied to the smooth surface 4 of the material 1.

【0018】図3に示すように基材1の非平滑面4に粘
着剤を塗布するのが好ましい理由は、図1に示す巻物と
した場合に粘着剤層2の表面の平滑性が背面によって阻
害されないので粘着力の低下が起こらないからであり、
また、非平滑面にコロナ放電処理をする場合(図4参
照)、基材の平滑面がコロナ放電処理されないので(コ
ロナ放電処理の裏抜けが起こらないので)、展開性の低
下が起こらないからである。
The reason why it is preferable to apply an adhesive to the non-smooth surface 4 of the base material 1 as shown in FIG. 3 is that when the roll shown in FIG. Because it is not inhibited, the adhesive strength does not decrease,
Further, when corona discharge treatment is performed on the non-smooth surface (see FIG. 4), since the smooth surface of the base material is not subjected to corona discharge treatment (because strike-through of corona discharge treatment does not occur), the development property does not decrease. It is.

【0019】本発明の粘着テープにかかる基材の非平滑
面の凹部の形状は、例えば基材の一方の端から他方の端
まで切れ目なく連続的に形成されたブイ(V)字谷形の
形状である(図2参照)。図2に示す凹部の形状は、手
切れ性および手で切断したときの切断部の見栄えの良好
さの観点から好ましい形状であるが、本発明の粘着テー
プの基材にかかる凹部の形状はこの形状のものに限定さ
れず、ユー(U)字谷形のごとき他の形状のものであっ
てもよく、また、切れ目のある非連続的に形成されてな
る凹部であってもよい。
The shape of the concave portion on the non-smooth surface of the base material according to the pressure-sensitive adhesive tape of the present invention may be, for example, a buoy (V) valley shape formed continuously from one end to the other end of the base material without any break. Shape (see FIG. 2). The shape of the concave portion shown in FIG. 2 is a preferable shape from the viewpoint of the hand-cutting property and the good appearance of the cut portion when cut by hand. The shape is not limited to the shape, and may be another shape such as a U-shaped trough, or may be a discontinuous concavely formed concave portion.

【0020】本発明の粘着テープの基材にかかる凹部の
サイズ(図2参照)について、深さDは0.03mm〜
0.3mm、好ましくは0.04mm〜0.12mmで
あり、0.03mm未満では手切れ性が不満足であり、
0.3mmより大では手切れ性は良好なるものの長手方
向の抗張力が小であり、深さが極端に大になると巻物か
ら粘着テープを展開する時に粘着テープが思わぬ箇所で
切れるという不都合の起こることがある。隣接する凹部
の間隔Wは、手切れ性の良好な粘着テープを得るという
観点から0.5mm〜5mm、好ましくは0.6mm〜
1.4mmである。厚さTは粘着テープの用途等によっ
て適宜に決定すればよく、一般に0.04mm〜0.4
mmの範囲内である。また、厚さTと深さDとの差(T
−D)は、手切れ性の良好な粘着テープを得るという観
点から、一般に0.01mm〜0.1mmである。
Regarding the size of the concave portion (see FIG. 2) on the base material of the pressure-sensitive adhesive tape of the present invention, the depth D is 0.03 mm or more.
0.3 mm, preferably 0.04 mm to 0.12 mm, if less than 0.03 mm, the hand-cutting property is unsatisfactory,
If it is larger than 0.3 mm, the hand-cutting property is good, but the tensile strength in the longitudinal direction is small, and if the depth is extremely large, the inconvenience that the adhesive tape is cut at an unexpected place when the adhesive tape is developed from the roll occurs. Sometimes. The distance W between adjacent concave portions is 0.5 mm to 5 mm, preferably 0.6 mm to 5 from the viewpoint of obtaining an adhesive tape having good hand-cutting properties.
1.4 mm. The thickness T may be appropriately determined depending on the use of the pressure-sensitive adhesive tape, and is generally 0.04 mm to 0.4 mm.
mm. The difference between the thickness T and the depth D (T
-D) is generally 0.01 mm to 0.1 mm from the viewpoint of obtaining an adhesive tape having good hand-cutting properties.

【0021】本発明の粘着テープの基材にかかる凹部を
形成する方法は制限されないが、前記公報に記載された
方法(図4参照)、すなわち、熱可塑性樹脂組成物製の
フィルムからなる薄物を、多数の溝状の凹部を形成する
ための絞ロール(絞の形状は該フィルムの幅方向に多数
の溝状の凹部を付与する形状である)と平滑ロールとの
間で押圧して、該薄物の幅方向に多数の溝状の凹部を形
成するという方法が簡便で好ましい一般的な方法であ
る。
The method of forming the concave portion on the base material of the pressure-sensitive adhesive tape of the present invention is not limited. However, the method described in the above-mentioned publication (see FIG. 4), that is, the method of forming a thin film made of a film made of a thermoplastic resin composition, Pressing between a smoothing roll and a squeezing roll for forming a number of groove-shaped recesses (the shape of the squeezing is a shape providing a number of groove-shaped recesses in the width direction of the film); A method of forming a large number of groove-shaped concave portions in the width direction of a thin object is a simple method which is preferable and is a general method.

【0022】図4に示す方法で凹部を形成する場合、押
出機から押し出された直後の未だ軟化状態にあるフィル
ムをそのまま絞ロールと平滑ロールとの間で押圧しても
よいし、予め製造された室温下のフィルム(固化状態に
あるフィルム)を加熱して軟化させたあと、絞ロールと
平滑ロールとの間で押圧してもよい。なお、図4に示す
方法で凹部を有するフィルムを製造する場合、凹部の形
状を不都合な程度にまで変形させたり等しない限り、フ
ィルムの物性を高める等の目的のために、例えば絞ロー
ルと平滑ロールとによる押圧の後にフィルムを延伸して
もよい。
When the concave portion is formed by the method shown in FIG. 4, the film which has been softened immediately after being extruded from the extruder may be pressed as it is between the squeezing roll and the smoothing roll, or may be produced in advance. After the film at room temperature (the film in the solidified state) is heated and softened, the film may be pressed between the squeezing roll and the smoothing roll. When a film having a concave portion is manufactured by the method shown in FIG. 4, unless the shape of the concave portion is deformed to an inconvenient degree or the like, for the purpose of enhancing the physical properties of the film, for example, a squeezing roll is used. The film may be stretched after pressing with a roll.

【0023】ここで、本願明細書で用いられる「平滑」
とは、樹脂製フィルム等の分野で普通に用いられる実質
的な平滑を意味する用語である。すなわち、物理的に全
く凹凸のない厳密な意味での平滑を意味するものではな
く、絞ロール等を用いてフィルムに積極的に凹部等を形
成させる場合の非平滑に対して用いられる用語である。
従って、前記の絞ロールと平滑ロールとによる押圧後の
延伸によって、平滑ロールと接触した履歴を有する面に
多少の凹凸(非平滑面とは比較にならいな程度の僅かの
凹凸)が発生したとしても、その程度の凹凸を有する面
は非平滑面ではなく平滑面であると言う。
Here, "smooth" used in the present specification is used.
The term “substantially smooth” is a term commonly used in the field of resin films and the like. That is, it does not mean smoothness in a strict sense without any physical unevenness, but is a term used for non-smoothness when a concave portion or the like is positively formed in a film using a squeezing roll or the like. .
Therefore, it is assumed that some unevenness (a slight unevenness comparable to that of the non-smooth surface) occurs on the surface having a history of contact with the smooth roll due to stretching after pressing by the squeezing roll and the smooth roll. However, a surface having such irregularities is not a non-smooth surface but a smooth surface.

【0024】本発明の粘着テープにかかる粘着剤は特に
制限されず、粘着テープの分野において公知の粘着剤で
あってもよい。粘着剤としてアクリル系粘着剤、ビニル
エーテル系粘着剤、シリコン系粘着剤、ゴム系粘着剤等
を例示し得る。粘着剤の形態も特に制限されず、溶液型
粘着剤、エマルジョン型粘着剤、ホットメルト型粘着剤
等のどの型のものでもよい。粘着剤の塗布方法も特に制
限されず、例えばロールコーター法など粘着テープの分
野で公知の方法を採用してもよい。粘着剤層の厚さも特
に制限されず、粘着テープのサイズ(基材の幅や厚さ)
や用途等に応じて適宜決めればよく、一般に10μm〜
50μmである。
The pressure-sensitive adhesive for the pressure-sensitive adhesive tape of the present invention is not particularly limited, and may be a pressure-sensitive adhesive known in the field of pressure-sensitive adhesive tapes. Examples of the adhesive include an acrylic adhesive, a vinyl ether-based adhesive, a silicone-based adhesive, and a rubber-based adhesive. The form of the pressure-sensitive adhesive is not particularly limited, and may be any type such as a solution-type pressure-sensitive adhesive, an emulsion-type pressure-sensitive adhesive, and a hot-melt-type pressure-sensitive adhesive. The method of applying the pressure-sensitive adhesive is not particularly limited, and a method known in the field of pressure-sensitive adhesive tapes such as a roll coater method may be employed. The thickness of the pressure-sensitive adhesive layer is also not particularly limited, and the size of the pressure-sensitive adhesive tape (width and thickness of the base material)
And may be determined appropriately according to the application and the like.
50 μm.

【0025】本発明の粘着テープは、基材の一面のみに
粘着剤を塗布してなる粘着テープだけでなく、基材の両
方の面に粘着剤を塗布した両面粘着テープも意味するも
のとし、また、再剥離型のテープも意味するものであ
る。再剥離型の粘着テープとする場合、粘着剤は再剥離
型のテープの分野で公知の粘着剤の中から適宜選んでも
よい。
The pressure-sensitive adhesive tape of the present invention means not only a pressure-sensitive adhesive tape having only one surface of a substrate coated with a pressure-sensitive adhesive, but also a double-sided pressure-sensitive adhesive tape having both surfaces of a substrate coated with a pressure-sensitive adhesive, In addition, a removable tape is also meant. When a re-peelable pressure-sensitive adhesive tape is used, the pressure-sensitive adhesive may be appropriately selected from pressure-sensitive adhesives known in the field of re-peelable tapes.

【0026】本発明の粘着テープの基材は図2に示す単
層フィルムに限定されず、本発明の目的を阻害さえしな
ければ、粘着テープの用途等に応じて、図2に示すよう
な単層のフィルムと、樹脂・紙・布・金属等からなる手
切れ性の良好な他のフィルムとの積層フィルムなる多層
のものであってもよい。多層の基材を用いた本発明の粘
着テープを図5に例示する。この図に示す粘着テープの
基材21は、図2に示すような凹部を有するフィルム2
2(基材の上側のフィルム)と、手切れ性の良好なフィ
ルム23(基材の下側のフィルム)との積層フィルムか
らなる基材である。基材の下側のフィルム23として例
えば延伸フィルムを使用する場合、一軸に延伸されたポ
リプロピレン樹脂製フィルムなどのポリオレフィン樹脂
製延伸フィルムと、基材の上側のフィルム22とを、粘
着テープの手切れ性が阻害されないように延伸フィルム
の延伸の方向と粘着テープの幅方向とが一致するように
延伸フィルムを位置させて、両フィルムを接着剤で積層
するという方法で基材を製造し得る。図5に示す基材の
他の製造方法として、下側のフィルム23の上に上側の
フィルム22を成形するための樹脂組成物を押出成形し
て積層した後、上側のフィルム22に凹部24を形成す
るという方法も例示し得る。図5に示す粘着テープは粘
着剤25を上側のフィルム22に塗布したものである
が、粘着剤25は下側のフィルム23又は基材21の両
面に塗布してもよい。
The base material of the pressure-sensitive adhesive tape of the present invention is not limited to the single-layer film shown in FIG. 2, and as long as the object of the present invention is not impaired, the base material shown in FIG. It may be a multi-layer film composed of a single-layer film and another film made of resin, paper, cloth, metal, or the like and having good hand-cutting properties. FIG. 5 shows an example of the pressure-sensitive adhesive tape of the present invention using a multilayer substrate. The base material 21 of the pressure-sensitive adhesive tape shown in FIG.
2 (a film on the upper side of the substrate) and a film 23 (a film on the lower side of the substrate) having good hand-cutting properties. For example, when a stretched film is used as the film 23 on the lower side of the base material, the stretched film made of a polyolefin resin such as a uniaxially stretched polypropylene resin film and the film 22 on the upper side of the base material are cut into pieces of adhesive tape. The base material can be manufactured by a method in which the stretched film is positioned so that the stretching direction of the stretched film and the width direction of the pressure-sensitive adhesive tape coincide with each other so that the properties are not impaired, and both films are laminated with an adhesive. As another manufacturing method of the base material shown in FIG. 5, after a resin composition for forming the upper film 22 is extruded and laminated on the lower film 23, the concave portion 24 is formed in the upper film 22. The method of forming may also be exemplified. The adhesive tape shown in FIG. 5 has the adhesive 25 applied to the upper film 22, but the adhesive 25 may be applied to both surfaces of the lower film 23 or the base 21.

【0027】多層の基材を用いた本発明の粘着テープの
別の態様を図6に例示する。この図に示す粘着テープの
基材は、図2に示すような凹部31を有するフィルム3
2の非平滑面と手切れ性の良好なフィルム34とを接着
剤35で積層してなるものであり、粘着剤36は前者の
フィルム32の平滑面36に塗布されている。この基材
の製造方法として、双方のフィルムを別々に製造した
後、非平滑面を基材の内側に位置させて接着剤で積層し
て基材を得るという方法を例示し得る。なお、図示はし
ていないが、粘着剤は図の上側のフィルムに塗布しても
よく、また基材の両面に塗布してもよい。
FIG. 6 shows another embodiment of the pressure-sensitive adhesive tape of the present invention using a multilayer substrate. The base material of the adhesive tape shown in this figure is a film 3 having a concave portion 31 as shown in FIG.
2 is formed by laminating a non-smooth surface and a film 34 having good hand-cutting properties with an adhesive 35, and an adhesive 36 is applied to the smooth surface 36 of the former film 32. As a method for producing the substrate, a method in which both films are separately produced, the non-smooth surface is located inside the substrate, and the substrate is obtained by laminating with an adhesive can be exemplified. Although not shown, the adhesive may be applied to the film on the upper side of the figure or may be applied to both surfaces of the substrate.

【0028】図5や図6に例示する手切れ性の良好なフ
ィルムの厚さは一般に1μm〜100μm、好ましくは
10μm〜50μm、より好ましくは15μm〜25μ
mである。厚さが1μm未満のフィルムを製造すること
は技術的に困難であり、100μmを越えるフィルムは
粘着テープの手切れ性を阻害する場合がある。本発明の
粘着テープの基材にかかるフィルムの表面は、フィルム
と粘着剤との親和性を高めるために、また、多層のフィ
ルムからなる基材を用いる場合にはフィルムと接着剤と
の親和性を高めるために、必要に応じて、コロナ放電処
理(図4参照)やプライマー処理されてもよい。
The thickness of a film having good hand-cutting properties exemplified in FIGS. 5 and 6 is generally 1 μm to 100 μm, preferably 10 μm to 50 μm, more preferably 15 μm to 25 μm.
m. It is technically difficult to produce a film having a thickness of less than 1 μm, and a film having a thickness of more than 100 μm may hinder the adhesive tape from being cut. The surface of the film according to the substrate of the pressure-sensitive adhesive tape of the present invention, in order to increase the affinity between the film and the adhesive, and when using a substrate composed of a multilayer film, the affinity between the film and the adhesive If necessary, a corona discharge treatment (see FIG. 4) or a primer treatment may be performed.

【0029】多層のフィルムからなる基材を用いる場
合、フィルム同士の接着に用いられる接着剤としてはポ
リエステル系接着剤、塩素化ポリプロピレン系接着剤、
ウレタン系接着剤、ニトリル−ブタジエンゴム(NB
R)などのゴム系接着剤、エチレン−ビニルアルコール
(EVA)系接着剤、これら接着剤の混合物等を例示す
ることができ、これらの接着剤は公知のものであっても
構わない。好ましい接着剤はポリエステル系接着剤や塩
素化ポリプロピレン系接着剤などである。接着剤の形態
は特に制限されず、溶液型接着剤、エマルジョン型接着
剤、ホットメルト型接着剤等のどの型のものでもよい。
When a substrate composed of a multilayer film is used, the adhesive used for bonding the films is polyester-based adhesive, chlorinated polypropylene-based adhesive,
Urethane adhesive, nitrile-butadiene rubber (NB
R) and the like, rubber-based adhesives such as R), ethylene-vinyl alcohol (EVA) -based adhesives, mixtures of these adhesives, and the like, and these adhesives may be publicly known. Preferred adhesives include polyester-based adhesives and chlorinated polypropylene-based adhesives. The form of the adhesive is not particularly limited, and may be any type such as a solution adhesive, an emulsion adhesive, and a hot melt adhesive.

【0030】本発明の粘着テープの基材として多層のも
のを使用する場合、層の数は図5や図6に例示する2層
のもののみならず3層もしくはそれ以上のものであって
もよく、また、それぞれの層や粘着剤は、顔料等の着色
剤や酸化防止剤、分散剤、充填剤、帯電防止剤などを含
んでいてもよい。
When a multi-layered base material is used as the base material of the pressure-sensitive adhesive tape of the present invention, the number of layers is not limited to two as shown in FIGS. 5 and 6, but may be three or more. Also, each layer and pressure-sensitive adhesive may contain a coloring agent such as a pigment, an antioxidant, a dispersant, a filler, an antistatic agent, and the like.

【0031】[0031]

【実施例】以下、実施例によって本発明を更に詳細に説
明するが、本発明はこれら実施例によってその範囲を限
定されるものではない。実施例および比較例に示した物
性の測定方法は以下の通りである。破断点伸び JIS K−7113に準拠して、試験速度500mm
/分で23℃の雰囲気下で測定した。1%引張荷重 JIS K−7113に準拠して23℃の雰囲気下で測
定した。伸長開始時の応力−変形曲線に対し、1%変形
時の応力を求めた。熱機械測定 セイコー電子工業製のTMA220を使用し、試験片と
して3mm×20mmの短冊片をテープ加工方向に平行
に切り出し、チャック間10mmとして温度上昇速度1
0℃/分にて定荷重測定を実施し、1%、すなわち0.
1mmの伸長が観測された最低の温度を耐熱性の指標と
した。フィルム製膜加工性 樹脂組成物を押出機に導入してテープ記載フィルムの成
形をする際に、押出量変動や引き取り成形不良現象が発
生せず、おおよそ20m/分の引き取り速度で良好なフ
ィルム成形ができることを判断基準とした。
EXAMPLES The present invention will be described in more detail with reference to the following examples, but the scope of the present invention is not limited by these examples. The measuring methods of the physical properties shown in Examples and Comparative Examples are as follows. Elongation at break Test speed 500 mm according to JIS K-7113
Per minute in an atmosphere of 23 ° C. 1% tensile load Measured in an atmosphere at 23 ° C. in accordance with JIS K-7113. The stress at the time of 1% deformation was determined for the stress-deformation curve at the start of elongation. Using thermal mechanical analysis Seiko Instruments of TMA220, cut parallel to the tape processing direction strips of 3 mm × 20 mm as a test piece, the temperature rise rate of 1 as a chuck distance 10mm
A constant load measurement was performed at 0 ° C./min and 1%, that is, 0.
The lowest temperature at which the elongation of 1 mm was observed was used as an index of heat resistance. When a film- forming processable resin composition is introduced into an extruder to form a film described on a tape, no fluctuation in the amount of extrusion or poor take-off molding occurs, and good film forming is performed at a take-up speed of approximately 20 m / min. Was determined as a criterion.

【0032】 ◎:極めて良好 ○:良好 ×:不良(フィルムに厚薄変動が激しく現れる)実施例1 ポリプロピレン系樹脂として住友化学工業株式会社製ノ
ーブレンX101A(密度0.890g/cm3 ,MF
R50g/10分)を60重量%、ポリエチレン系樹脂
として住友化学工業株式会社製スミカセンG701(密
度0.919g/cm3 ,MFR6.8g/10分)を
20重量%、さらに熱可塑性エラストマーとしてダウケ
ミカル日本株式会社製エンゲージEG8200(密度
0.870g/cm3 ,MFR5.0g/10分)を2
0重量%、それぞれペレット混合して185℃で押出加
工を行い溶融シートを得た。該溶融シートの一面を平滑
面に形成できるようなゴムロールと、他面を凹凸面に形
成できるような表面を有する絞りロールとで、20m/
分の速度で引き取りつつ押圧し、冷却固化して絞り模様
を転写した。この際、該ゴムロールおよび絞りロールの
表面温度が約60℃となるようにロール内を循環する温
水の温度を調節した。さらに該フィルムの凹凸面の表面
を45ダインとなるようにコロナ放電処理することによ
り粘着テープ用基材フィルムを得た。
◎: extremely good 良好: good ×: poor (fluctuations in thickness are apparent in the film) Example 1 As a polypropylene resin, Noblen X101A manufactured by Sumitomo Chemical Co., Ltd. (density 0.890 g / cm 3 , MF)
R50 g / 10 min), 60 wt%, Sumikasen G701 (density 0.919 g / cm 3 , MFR 6.8 g / 10 min) manufactured by Sumitomo Chemical Co., Ltd. as a polyethylene resin, 20 wt%, and Dow Chemical as a thermoplastic elastomer. Engage EG8200 (density 0.870 g / cm 3 , MFR 5.0 g / 10 min) manufactured by Japan Co., Ltd.
Pellets were mixed at 0% by weight and extruded at 185 ° C. to obtain a molten sheet. A rubber roll capable of forming one surface of the molten sheet as a smooth surface and a squeezing roll having a surface capable of forming the other surface as an uneven surface are 20 m / m.
The material was pressed while being taken up at a speed of one minute, cooled and solidified, and the drawn pattern was transferred. At this time, the temperature of the hot water circulating in the roll was adjusted so that the surface temperatures of the rubber roll and the squeezing roll were about 60 ° C. Further, a base film for an adhesive tape was obtained by subjecting the surface of the uneven surface of the film to a corona discharge treatment so as to have 45 dynes.

【0033】絞加工の施された厚さ100μmの樹脂組
成物フィルムの凹凸面にアクリル系の粘着剤としてブチ
ルアクリレート(80重量%)と2−エチルヘキシルア
クリレート(20重量%)とからなる共重合体の40重
量%醋酸エチルとトルエンの混合溶液(粘度約4000
cps)をロールコーターで塗布し、120℃に設定さ
れた乾燥炉を30m/分の速度で通過させて乾燥し、樹
脂組成物フィルムに厚さ30μmのアクリル粘着剤層を
形成して粘着テープを得た。
A copolymer comprising butyl acrylate (80% by weight) and 2-ethylhexyl acrylate (20% by weight) as an acrylic pressure-sensitive adhesive on the uneven surface of a drawn 100 μm thick resin composition film. Of a 40% by weight mixed solution of ethyl acetate and toluene (viscosity of about 4000
cps) with a roll coater, passed through a drying furnace set at 120 ° C. at a speed of 30 m / min, and dried to form a 30 μm-thick acrylic pressure-sensitive adhesive layer on the resin composition film. Obtained.

【0034】得られた粘着テープの物性その他の表1に
示す。表に示されるとおり、粘着テープとして求められ
る手切れ性、柔軟性が良好であり、また基材フィルム成
形時の製膜加工性も良好であることがわかる。また耐熱
温度からもわかるように、粘着剤塗布加工を行う際の乾
燥温度を120℃と比較的高温に設定してもフィルムに
変形が起こらないために、この温度での乾燥が可能であ
り、その結果乾燥速度を高速にできるといった経済的に
有利な点がある。実施例2・3 熱可塑性エラストマーとして、実施例2においては日本
合成ゴム株式会社製ダイナロン1320P(MFR3.
5g/10分)を、実施例3においては三井精油化学株
式会社製タフマーA4085(MFR4.0g/10
分)を使用した以外は実施例1と全く同様にして粘着テ
ープを得た。両実施例においても、耐熱性の点から粘着
剤塗布加工時の温度は120℃に設定でき、その結果乾
燥温度を30m/分の経済速度に設定することができ
た。
The physical properties of the resulting pressure-sensitive adhesive tape and other properties are shown in Table 1. As shown in the table, it is understood that the hand-cutting property and flexibility required for the pressure-sensitive adhesive tape are good, and the film-forming workability at the time of forming the base film is also good. Also, as can be seen from the heat resistant temperature, even if the drying temperature at the time of performing the adhesive application processing is set to a relatively high temperature of 120 ° C., since the film does not deform, it is possible to dry at this temperature, As a result, there is an economic advantage that the drying speed can be increased. Examples 2.3 As a thermoplastic elastomer, in Example 2, Dynalon 1320P (MFR3.
5 g / 10 min) in Example 3 and Tuffmer A4085 (MFR 4.0 g / 10 min.
Ex.) Was obtained in the same manner as in Example 1 except that the adhesive tape was used. In both examples, the temperature at the time of applying the pressure-sensitive adhesive could be set to 120 ° C. from the viewpoint of heat resistance, and as a result, the drying temperature could be set to an economic speed of 30 m / min.

【0035】得られた粘着テープの物性その他を表1に
示す。いずれの場合でも、実施例1とほぼ同等のテープ
物性が得られており、また基材フィルムの製膜加工性に
ついても問題のないものであった。実施例4・5 用いる熱可塑性樹脂としては3種類とも実施例1と同じ
であるが、その混合割合を実施例4の場合は80重量%
/10重量%/10重量%とし、また実施例5の場合は
50重量%/25重量%/25重量%とした。それ以外
については実施例1と全く同等にして粘着テープを得
た。実施例4の場合においては実施例1と同様に、乾燥
条件として温度120℃、速度30m/分が可能であっ
たが、実施例5の場合は温度を120℃にするとフィル
ムに若干の変形が見られたため110℃にて行い、速度
を25m/分とした。
Table 1 shows the physical properties and the like of the obtained pressure-sensitive adhesive tape. In each case, almost the same tape properties as those of Example 1 were obtained, and there was no problem in the film forming processability of the base film. Examples 4 and 5 The three types of thermoplastic resins used are the same as in Example 1, but the mixing ratio is 80% by weight in Example 4.
/ 10% by weight / 10% by weight, and in the case of Example 5, it was 50% by weight / 25% by weight / 25% by weight. Otherwise, an adhesive tape was obtained in exactly the same manner as in Example 1. In the case of Example 4, as in Example 1, as the drying conditions, a temperature of 120 ° C. and a speed of 30 m / min were possible, but in Example 5, when the temperature was set to 120 ° C., the film was slightly deformed. Since it was seen, it was performed at 110 ° C., and the speed was 25 m / min.

【0036】得られた粘着テープの物性その他を表1に
示す。いずれの場合でも、粘着テープとしての適性に優
れ、また基材フィルムの製膜加工性も良好なものであっ
た。 比較例1 熱可塑性樹脂として高密度ポリエチレン(日本ポリケム
株式会社製ノバテックHD HJ381(密度0.96
0g/cm3 ,MFR10g/10分))35重量%
と、低密度ポリエチレン(日本ポリケム株式会社製ノバ
テックLD LC720(密度0.915g/cm3
MFR10g/10分))65重量%との混合物を使用
する以外は、実施例1と全く同様にして粘着テープを得
た。ただしこの場合、実施例のいような120℃の乾燥
条件で粘着剤塗布加工を行うことは不可能であり、90
℃に設定せざるを得なかったために、乾燥速度を約10
m/分と低速にして乾燥させねばならず、経済性に劣る
ものであった。
Table 1 shows the physical properties and the like of the obtained adhesive tape.
Show. In any case, excellent suitability as adhesive tape
In addition, the film formability of the base film is also good.
Was. Comparative Example 1 High-density polyethylene (Nippon Polychem) as a thermoplastic resin
Novatec HD HJ381 (Density 0.96)
0 g / cmThree, MFR 10 g / 10 min)) 35% by weight
And low-density polyethylene (Nova made by Nippon Polychem Co., Ltd.)
Tech LD LC720 (density 0.915g / cmThree,
MFR 10 g / 10 min)) using a mixture with 65% by weight
Except that the adhesive tape was obtained in exactly the same manner as in Example 1.
Was. However, in this case, drying at 120 ° C.
It is impossible to perform the adhesive application processing under the conditions,
° C.
Must be dried at a low speed of m / min.
Was something.

【0037】得られた粘着テープの物性その他を表1に
示す。該テープは耐熱性が劣るものであり、粘着剤塗布
加工時の乾燥温度を低温にせざるを得ないものとなって
いる。比較例2 ポリプロピレン系樹脂およびポリエチレン系樹脂は実施
例1と同じものを用いたが、熱可塑性エラストマーは混
合せず、ポリプロピレン系樹脂とポリエチレン系樹脂と
の混合割合を80重量%/20重量%とした以外は実施
例1と全く同様にして粘着テープを得た。該テープの粘
着剤塗布加工時の乾燥条件は実施例1の場合と同等の条
件が可能であった。
Table 1 shows the physical properties and the like of the obtained pressure-sensitive adhesive tape. The tape is inferior in heat resistance, and the drying temperature at the time of applying the pressure-sensitive adhesive must be lowered. Comparative Example 2 The same polypropylene-based resin and polyethylene-based resin as in Example 1 were used, but the thermoplastic elastomer was not mixed, and the mixing ratio of the polypropylene-based resin and the polyethylene-based resin was 80% by weight / 20% by weight. A pressure-sensitive adhesive tape was obtained in exactly the same manner as in Example 1 except that this was performed. The same drying conditions as in Example 1 were possible for drying the tape during the application of the adhesive.

【0038】得られた粘着テープの物性その他を表1に
示す。該テープはTDの引張伸びが非常に低く、テープ
として使用する際にMDに縦裂けしやすいものとなって
おり、実質上使用が困難なものであった。また1%変形
荷重の値が大きく柔軟性に乏しいテープとなっており、
この点においてもテープとしての適性に劣るものであっ
た。比較例3 ポリプロピレン系樹脂および熱可塑性エラストマーは実
施例1と同じものを用いたが、ポリエチレン系樹脂は混
合せず、ポリプロピレン系樹脂と熱可塑性エラストマー
との混合割合を60重量%/40重量%とした以外は実
施例1と全く同様にして粘着テープを得た。ただし該テ
ープの基材フィルムを押出加工する際に、いわゆる引き
取りサージングと呼ばれる成形不良現象が発生し、フィ
ルムに著しい厚簿変動が見られたため、該基材フィルム
からなる粘着テープは実質上商品価値のないものであっ
た。比較例4 基材フィルムの押出成形加工を行う際に、ゴムロールお
よび絞りロールの表面温度が約15℃となるようにロー
ル内を循環する温水の温度を調節した以外は実施例1と
全く同様にして粘着テープを得た。
Table 1 shows the physical properties and the like of the obtained pressure-sensitive adhesive tape. This tape had a very low tensile elongation of TD, and was apt to be longitudinally torn by MD when used as a tape, making it practically difficult to use. In addition, the value of 1% deformation load is large and it is a tape with poor flexibility,
Also in this respect, the tape was inferior in suitability. Comparative Example 3 The same polypropylene-based resin and thermoplastic elastomer as in Example 1 were used, but the polyethylene-based resin was not mixed, and the mixing ratio between the polypropylene-based resin and the thermoplastic elastomer was 60% by weight / 40% by weight. A pressure-sensitive adhesive tape was obtained in exactly the same manner as in Example 1 except that this was performed. However, when the base film of the tape was extruded, a molding defect phenomenon called so-called take-over surging occurred, and a remarkable variation in thickness was observed in the film. There was no one. Comparative Example 4 Extrusion molding of a base film was performed in exactly the same manner as in Example 1 except that the temperature of the hot water circulating in the roll was adjusted so that the surface temperatures of the rubber roll and the squeezing roll were about 15 ° C. To obtain an adhesive tape.

【0039】得られた粘着テープの物性その他を表1に
示す。該テープはMDの伸びが非常に大きいために、手
でカットする際に容易にフィルムの変形が起こり、その
結果手切れ性が劣るものであった。
Table 1 shows the physical properties and the like of the obtained pressure-sensitive adhesive tape. Since the tape had a very large MD elongation, the film was easily deformed when cut by hand, resulting in poor hand-cutting properties.

【0040】[0040]

【表1】 [Table 1]

【0041】[0041]

【発明の効果】本発明によれば、一方の面が平滑面に、
他方の面が幅方向に多数の溝状の凹部を有する非平滑面
に形成されてなる基材と、粘着剤層とからなる粘着テー
プにおいて、基材をポリプロピレン系樹脂10重量%〜
80重量%、ポリエチレン系樹脂10重量%〜80重量
%及び熱可塑性エラストマー10重量%〜80重量%を
含む熱可塑性樹脂組成物製フィルムからなる基材とする
ことにより、手切れ性および柔軟性が良好な粘着テープ
を、高い生産性で得ることができる。
According to the present invention, one surface becomes a smooth surface,
In a pressure-sensitive adhesive tape composed of a non-smooth surface having a large number of groove-shaped recesses in the width direction on the other surface and a pressure-sensitive adhesive layer, the base material is made of 10% by weight of a polypropylene resin.
By using a substrate made of a thermoplastic resin composition film containing 80% by weight, 10% by weight to 80% by weight of a polyethylene resin and 10% by weight to 80% by weight of a thermoplastic elastomer, hand-cutting properties and flexibility are improved. A good adhesive tape can be obtained with high productivity.

【図面の簡単な説明】[Brief description of the drawings]

【図1】ロール状に重ね巻きされた巻物の形態の粘着テ
ープを示す斜視図である。
FIG. 1 is a perspective view showing an adhesive tape in the form of a roll wound in a roll shape.

【図2】一方の面が平滑面に、他方の面が幅方向に多数
の溝状の凹部を有する非平滑面に形成されてなる樹脂製
基材を示す斜視図である。
FIG. 2 is a perspective view showing a resin base material in which one surface is formed as a smooth surface and the other surface is formed as a non-smooth surface having a number of groove-shaped recesses in the width direction.

【図3】図2に示す基材と粘着剤層とからなる粘着テー
プを示す斜視図である。
FIG. 3 is a perspective view showing an adhesive tape including a base material and an adhesive layer shown in FIG. 2;

【図4】図2に示す基材の製造方法を示す断面図であ
る。
FIG. 4 is a cross-sectional view showing a method of manufacturing the base material shown in FIG.

【図5】多層の基材を用いた本発明の粘着テープを示す
斜視図である。
FIG. 5 is a perspective view showing an adhesive tape of the present invention using a multilayer base material.

【図6】多層の基材を用いた本発明の別の粘着テープを
示す斜視図である。
FIG. 6 is a perspective view showing another pressure-sensitive adhesive tape of the present invention using a multilayer substrate.

【符号の説明】 1…基材 2…粘着剤層 3…背面 4…平滑面 5…凹部 6…非平滑面 8…凹部 10…溶融された樹脂 11…押出機 12…絞ロール 13…平滑ロール 14…電極 15…平滑ロール 21…基材 22…凹部を有するフィルム 23…手切れ性の良好なフィルム 24…凹部 25…粘着剤 30…基材 31…凹部 32…凹部を有するフィルム 33…非平滑面 34…手切れ性の良好なフィルム 35…接着剤 36…平滑面[Explanation of Signs] 1 ... Substrate 2 ... Adhesive layer 3 ... Back surface 4 ... Smooth surface 5 ... Concave 6 ... Non-smooth surface 8 ... Concave 10 ... Molten resin 11 ... Extruder 12 ... Squeezing roll 13 ... Smooth roll DESCRIPTION OF SYMBOLS 14 ... Electrode 15 ... Smooth roll 21 ... Substrate 22 ... Film with a concave part 23 ... Film with good hand-cutting property 24 ... Concave part 25 ... Adhesive 30 ... Substrate 31 ... Concave part 32 ... Film with a concave part 33 ... Non-smooth Surface 34: Film with good hand cutting properties 35: Adhesive 36: Smooth surface

Claims (20)

【特許請求の範囲】[Claims] 【請求項1】 ポリプロピレン系樹脂5重量%〜90重
量%、ポリエチレン系樹脂5重量%〜90重量%及び熱
可塑性エラストマー5重量%〜90重量%を含む熱可塑
性樹脂組成物製のフィルムからなる基材であって、一方
の面が平滑面に他方の面が粘着テープの幅方向に多数の
溝状の凹部を有する非平滑面に形成されてなる基材と粘
着剤層とからなる粘着テープ。
1. A base comprising a film made of a thermoplastic resin composition containing 5% to 90% by weight of a polypropylene resin, 5% to 90% by weight of a polyethylene resin and 5% to 90% by weight of a thermoplastic elastomer. A pressure-sensitive adhesive tape, comprising: a base material having one surface formed on a smooth surface and the other surface formed on a non-smooth surface having a large number of groove-shaped recesses in the width direction of the pressure-sensitive adhesive tape; and a pressure-sensitive adhesive layer.
【請求項2】 ポリプロピレン系樹脂がホモポリプロピ
レン樹脂である請求項1記載の粘着テープ。
2. The pressure-sensitive adhesive tape according to claim 1, wherein the polypropylene resin is a homopolypropylene resin.
【請求項3】 ポリプロピレン系樹脂がメルトフローレ
ート30g/10分以上のホモポリプロピレン樹脂であ
る請求項1記載の粘着テープ。
3. The adhesive tape according to claim 1, wherein the polypropylene resin is a homopolypropylene resin having a melt flow rate of 30 g / 10 minutes or more.
【請求項4】 ポリプロピレン系樹脂の含有割合が50
重量%〜80重量%である請求項1記載の粘着テープ。
4. The content ratio of the polypropylene resin is 50.
The pressure-sensitive adhesive tape according to claim 1, wherein the amount is from 80% by weight to 80% by weight.
【請求項5】 ポリエチレン系樹脂が高圧重合法によっ
て製造される分岐型低密度ポリエチレン樹脂である請求
項1記載の粘着テープ。
5. The pressure-sensitive adhesive tape according to claim 1, wherein the polyethylene resin is a branched low-density polyethylene resin produced by a high-pressure polymerization method.
【請求項6】 熱可塑性エラストマーが密度0.910
g/cc以下のエチレンとα−オレフィンとの共重合体
である請求項1記載の粘着テープ。
6. The thermoplastic elastomer has a density of 0.910.
2. The pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive tape is a copolymer of g / cc or less of ethylene and an α-olefin.
【請求項7】 基材が下記(イ)〜(ハ)を満たす基材
である請求項1記載の粘着テープ。 (イ)熱機械測定における1%以上の寸法変化が観測さ
れる温度が120℃以上であること (ロ)前記1%の寸法変化時の荷重がMD方向およびT
D方向ともに1.0kg/20mm幅以下であること (ハ)引張試験における伸びがMD方向およびTD方向
ともに50%以上であること
7. The pressure-sensitive adhesive tape according to claim 1, wherein the base material satisfies the following (a) to (c). (A) The temperature at which a dimensional change of 1% or more in thermomechanical measurement is observed is 120 ° C. or more. (B) The load at the time of the dimensional change of 1% is MD direction and T
1.0 kg / 20 mm width or less in both D directions (c) Elongation in tensile test is 50% or more in both MD and TD directions
【請求項8】 基材が、MD方向の伸びが700%以下
の基材である請求項1記載の粘着テープ。
8. The pressure-sensitive adhesive tape according to claim 1, wherein the base material has an elongation in the MD direction of 700% or less.
【請求項9】 基材が熱可塑性樹脂組成物製フィルムな
る単層である請求項1記載の粘着テープ。
9. The pressure-sensitive adhesive tape according to claim 1, wherein the base material is a single layer made of a film made of a thermoplastic resin composition.
【請求項10】 凹部の深さが0.03mm〜0.3m
m、凹部の間隔が0.5mm〜5mm、基材の厚さが4
0μm〜400μmであって、基材の厚さと凹部の深さ
との差が0.01mm〜0.1mmである請求項1記載
の粘着テープ。
10. The depth of the recess is 0.03 mm to 0.3 m.
m, the interval between concave portions is 0.5 mm to 5 mm, and the thickness of the base material is 4
2. The pressure-sensitive adhesive tape according to claim 1, wherein the thickness is from 0 μm to 400 μm, and the difference between the thickness of the base material and the depth of the concave portion is from 0.01 mm to 0.1 mm.
【請求項11】 以下の工程からなる粘着テープの製造
方法。 工程(1):ポリプロピレン系樹脂5重量%〜90重量
%、ポリエチレン系樹脂5重量%〜90重量%及び熱可
塑性エラストマー5重量%〜90重量%を含む熱可塑性
樹脂組成物製のフィルムからなる薄物を絞ロールと平滑
ロールとの間で押圧して、該薄物の幅方向に多数の溝状
の凹部を形成する工程 工程(2):必要に応じて、工程(1)で得られる薄物
と手切れ性の良好な他のフィルムとを積層して基材を得
る工程 工程(3):該基材の少なくとも一面に粘着剤を塗布す
る工程
11. A method for producing a pressure-sensitive adhesive tape, comprising the following steps. Step (1): A thin material comprising a film made of a thermoplastic resin composition containing 5% to 90% by weight of a polypropylene resin, 5% to 90% by weight of a polyethylene resin, and 5% to 90% by weight of a thermoplastic elastomer. Is pressed between a squeezing roll and a smoothing roll to form a large number of groove-shaped concave portions in the width direction of the thin object. Step (2): If necessary, the thin object obtained in the step (1) and the hand Step of laminating with another film having good cutting properties to obtain a substrate Step (3): applying an adhesive to at least one surface of the substrate
【請求項12】 ポリプロピレン系樹脂がホモポリプロ
ピレン樹脂である請求項11記載の粘着テープの製造方
法。
12. The method according to claim 11, wherein the polypropylene resin is a homopolypropylene resin.
【請求項13】 ポリプロピレン系樹脂がメルトフロー
レート30g/10分以上のホモポリプロピレン樹脂で
ある請求項11記載の粘着テープの製造方法。
13. The method according to claim 11, wherein the polypropylene resin is a homopolypropylene resin having a melt flow rate of 30 g / 10 minutes or more.
【請求項14】 ポリプロピレン系樹脂の含有割合が5
0重量%〜80重量%である請求項11記載の粘着テー
プの製造方法。
14. The content ratio of the polypropylene resin is 5
The method for producing a pressure-sensitive adhesive tape according to claim 11, wherein the content is 0% to 80% by weight.
【請求項15】 ポリエチレン系樹脂が高圧重合法によ
って製造される分岐型低密度ポリエチレン樹脂である請
求項11記載の粘着テープの製造方法。
15. The method for producing an adhesive tape according to claim 11, wherein the polyethylene resin is a branched low-density polyethylene resin produced by a high-pressure polymerization method.
【請求項16】 熱可塑性エラストマーが密度0.91
0g/cc以下のエチレンとα−オレフィンとの共重合
体である請求項11記載の粘着テープの製造方法。
16. The thermoplastic elastomer has a density of 0.91.
The method for producing a pressure-sensitive adhesive tape according to claim 11, which is a copolymer of ethylene and an α-olefin of 0 g / cc or less.
【請求項17】 基材が下記(イ)〜(ハ)を満たす基
材である請求項11記載の粘着テープの製造方法。 (イ)熱機械測定における1%以上の寸法変化が観測さ
れる温度が120℃以上であること (ロ)前記1%の寸法変化時の荷重がMD方向およびT
D方向ともに1.0kg/20mm幅以下であること (ハ)引張試験における伸びがMD方向およびTD方向
ともに50%以上であること
17. The method for producing a pressure-sensitive adhesive tape according to claim 11, wherein the base material satisfies the following (a) to (c). (A) The temperature at which a dimensional change of 1% or more in thermomechanical measurement is observed is 120 ° C. or more. (B) The load at the time of the dimensional change of 1% is MD direction and T
1.0 kg / 20 mm width or less in both D directions (c) Elongation in tensile test is 50% or more in both MD and TD directions
【請求項18】 基材が、MD方向の伸びが700%以
下の基材である請求項11記載の粘着テープの製造方
法。
18. The method for producing a pressure-sensitive adhesive tape according to claim 11, wherein the substrate is a substrate having an elongation in the MD direction of 700% or less.
【請求項19】 基材が熱可塑性樹脂組成物製フィルム
なる単層である請求項11記載の粘着テープの製造方
法。
19. The method for producing a pressure-sensitive adhesive tape according to claim 11, wherein the substrate is a single layer of a film made of a thermoplastic resin composition.
【請求項20】 凹部の深さが0.03mm〜0.3m
m、凹部の間隔が0.5mm〜5mm、基材の厚さが4
0μm〜400μmであって、基材の厚さと凹部の深さ
との差が0.01mm〜0.1mmである請求項11記
載の粘着テープの製造方法。
20. The recess has a depth of 0.03 mm to 0.3 m.
m, the interval between concave portions is 0.5 mm to 5 mm, and the thickness of the base material is 4
The method for producing a pressure-sensitive adhesive tape according to claim 11, wherein the difference between the thickness of the base material and the depth of the recess is 0.01 mm to 0.1 mm.
JP10437598A 1998-04-15 1998-04-15 Adhesive tape and method for producing the same Expired - Fee Related JP4049442B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10437598A JP4049442B2 (en) 1998-04-15 1998-04-15 Adhesive tape and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10437598A JP4049442B2 (en) 1998-04-15 1998-04-15 Adhesive tape and method for producing the same

Publications (2)

Publication Number Publication Date
JPH11293205A true JPH11293205A (en) 1999-10-26
JP4049442B2 JP4049442B2 (en) 2008-02-20

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JP2006022193A (en) * 2004-07-07 2006-01-26 Sekisui Film Kk Adhesive tape substrate and adhesive tape
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US10662018B2 (en) 2013-10-23 2020-05-26 Fukumaru Co., Ltd. Adhesive tape, adhesive tape roll, and tape dispenser
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