JPH11292050A - Formed article of resin, and its manufacture - Google Patents

Formed article of resin, and its manufacture

Info

Publication number
JPH11292050A
JPH11292050A JP9631798A JP9631798A JPH11292050A JP H11292050 A JPH11292050 A JP H11292050A JP 9631798 A JP9631798 A JP 9631798A JP 9631798 A JP9631798 A JP 9631798A JP H11292050 A JPH11292050 A JP H11292050A
Authority
JP
Japan
Prior art keywords
resin
electromagnetic wave
wave shielding
mesh
molded article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9631798A
Other languages
Japanese (ja)
Other versions
JP4112673B2 (en
Inventor
Masahiro Yoshikawa
川 正 浩 吉
Katsumi Kameda
田 克 巳 亀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP09631798A priority Critical patent/JP4112673B2/en
Priority to US09/285,726 priority patent/US6291369B1/en
Priority to EP19990106144 priority patent/EP0949052B1/en
Priority to KR1019990011969A priority patent/KR19990082990A/en
Priority to DE1999621531 priority patent/DE69921531T2/en
Priority to TW88105539A priority patent/TW404921B/en
Publication of JPH11292050A publication Critical patent/JPH11292050A/en
Priority to US09/901,045 priority patent/US20010046822A1/en
Application granted granted Critical
Publication of JP4112673B2 publication Critical patent/JP4112673B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a resin formed article, and its manufacturing method in which an insert can be easily manufactured, and the adhesivity of the insert to an injection resin can be improved. SOLUTION: A soft mesh-like electromagnetic wave shielding fiber 11 is arranged in a forming die, and the forming die is seamed. The soft electromagnetic wave shielding fiber 11 is deformed following the shape of the inside of the forming die 1. An insert need not be manufactured to the shape of the forming die 1. Because the injection resin enters the surface of the mesh-like electromagnetic wave shielding fiber 11, the adhesivity of the electromagnetic wave shielding fiber 11 to the injection resin is improved.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂製成形品およ
びその製造方法に係り、とりわけ内部にインサート物を
有する樹脂製成形品およびその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded product and a method for producing the same, and more particularly to a resin molded product having an insert therein and a method for producing the same.

【0002】[0002]

【従来の技術】従来より内部にインサート物を有する樹
脂製成形品が知られている。またこのような樹脂製成形
品は、成形品の形状に対応したインサート物を成形金型
内に予め配置し、その後成形金型内に射出樹脂を射出す
ることにより得られる。
2. Description of the Related Art Conventionally, there has been known a resin molded product having an insert therein. Further, such a resin molded product is obtained by placing an insert corresponding to the shape of the molded product in a molding die in advance, and then injecting an injection resin into the molding die.

【0003】[0003]

【発明が解決しようとする課題】上述のようにインサー
ト物を有する樹脂製成形品を製造する際、成形品の形状
に対応したインサート物を予め成形金型内に配置する必
要がある。しかしながら、この場合、成形金型内の所定
位置にインサート物を配置しなければならず、成形作業
の自由度に制限が設けられているのが実情である。
As described above, when manufacturing a resin molded article having an insert, it is necessary to arrange an insert corresponding to the shape of the molded article in a molding die in advance. However, in this case, the insert must be arranged at a predetermined position in the molding die, and the degree of freedom of the molding operation is limited.

【0004】本発明はこのような点を考慮してなされた
ものであり、成形作業の自由度を大きく改善することが
できる樹脂製成形品およびその製造方法を提供すること
を目的とする。
[0004] The present invention has been made in view of the above points, and an object of the present invention is to provide a resin molded product capable of greatly improving the degree of freedom of a molding operation, and a method of manufacturing the same.

【0005】[0005]

【課題を解決するための手段】本発明は、射出樹脂と、
この射出樹脂に設けられた軟質性メッシュ状物と、を備
えたことを特徴とする樹脂製成形品、および上記記載の
樹脂製成形品の製造方法において、成形金型内にメッシ
ュ状物を配置する工程と、成形金型を型締めする工程
と、成形金型内に射出樹脂を射出する工程と、を備えた
ことを特徴とする樹脂製成形品の製造方法である。
The present invention provides an injection resin,
In the method of manufacturing a resin molded product, comprising the soft mesh material provided in the injection resin, and the resin molded product described above, the mesh material is disposed in a molding die. A molding step, a step of clamping the molding die, and a step of injecting the injection resin into the molding die.

【0006】本発明によれば、成形金型内に予め配置さ
れた軟質性メッシュ状物は、成形金型を型締めする際、
成形金型内の形状に追従して変形する。また、メッシュ
状物はその表面に適度な凹凸を有するため、射出樹脂と
メッシュ状物との密着性が向上する。
[0006] According to the present invention, the soft mesh-like material placed in the molding die beforehand is used for clamping the molding die.
Deforms following the shape in the molding die. In addition, since the mesh-like object has moderate irregularities on its surface, the adhesion between the injection resin and the mesh-like object is improved.

【0007】[0007]

【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図1乃至図4は、本発明に
よる樹脂製成形品およびその製造方法を示す図である。
図1に示すように、樹脂製成形品10は射出樹脂12
と、この射出樹脂12の一側に配置された軟質性の電磁
波シールド繊維(メッシュ状物)11とを備えている。
このうち電磁波シールド繊維11は、インサート物とし
て電磁波を遮へいするものであり、具体的には図4
(a)(b)に示すように多数の線状体15からなるメ
ッシュ状の多孔性繊維からなっている。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 are views showing a resin molded product according to the present invention and a method for producing the same.
As shown in FIG. 1, a resin molded product 10 is an injection resin 12.
And a soft electromagnetic shielding fiber (mesh-like material) 11 disposed on one side of the injection resin 12.
Among them, the electromagnetic wave shielding fibers 11 are used to shield electromagnetic waves as inserts.
As shown in (a) and (b), it is made of a mesh-like porous fiber composed of a large number of linear bodies 15.

【0008】また各線状体15は合成樹脂、例えばポリ
エステル製の芯材15aと、この芯材15aの外面を覆
う金属層15bとからなっており、金属層15bは銅ま
たはニッケルを芯材15aの外面に無電解メッキするこ
とにより形成される。なお、線状体15をガラス製芯材
15aと、このガラス性芯材15aの外面を覆う金属層
15bとから構成してもよく、また線状体15を金属芯
材のみから構成しても良い。
Each linear member 15 is composed of a core material 15a made of a synthetic resin, for example, polyester, and a metal layer 15b covering the outer surface of the core material 15a. The metal layer 15b is made of copper or nickel made of the core material 15a. It is formed by electroless plating on the outer surface. The linear body 15 may be composed of a glass core 15a and a metal layer 15b covering the outer surface of the glass core 15a, or the linear body 15 may be composed of only the metal core. good.

【0009】また射出樹脂12としては汎用の熱可型性
樹脂を用いることができるが、例えばPC、HIPS、
PS、PP、PE、ABS、PVC、ナイロン等を用い
ることができる。
A general-purpose thermosetting resin can be used as the injection resin 12. For example, PC, HIPS,
PS, PP, PE, ABS, PVC, nylon and the like can be used.

【0010】更に透明性をもった射出樹脂12を用い、
かつ電磁波シールド繊維11が所望の光透過率を有する
ことにより、電磁波シールド特性に優れ、かつ全体とし
て透明性を有する樹脂成形品10を得ることができる。
Further, using an injection resin 12 having transparency,
In addition, since the electromagnetic wave shielding fiber 11 has a desired light transmittance, it is possible to obtain a resin molded product 10 having excellent electromagnetic wave shielding characteristics and transparency as a whole.

【0011】次にこのような構成からなる樹脂成形品の
製造方法について説明する。まず図2に示すように、ゲ
ート2aが設けられた固定金型2と、可動金型3とを有
する成形金型1を準備する。次に、固定金型2と可動金
型3とを開とした状態で、電磁波シールド繊維11が巻
出ロール5から巻出されて固定金型2と可動金型3との
間(成形金型1のキャビティ7内)に配置される。
Next, a method for manufacturing a resin molded product having the above-described structure will be described. First, as shown in FIG. 2, a molding die 1 having a fixed die 2 provided with a gate 2a and a movable die 3 is prepared. Next, in a state where the fixed mold 2 and the movable mold 3 are opened, the electromagnetic wave shielding fiber 11 is unwound from the unwinding roll 5, and the space between the fixed mold 2 and the movable mold 3 (forming mold). 1 cavity 7).

【0012】このとき、成形金型1のキャビティ7内に
配置された電磁波シールド繊維11は、巻出ロール5と
巻取ロール6との間で張力をかけない状態で保持されて
いる。
At this time, the electromagnetic wave shielding fibers 11 arranged in the cavity 7 of the molding die 1 are held between the unwinding roll 5 and the winding roll 6 without tension.

【0013】次に図3に示すように、固定金型2に対し
て可動金型3が接近し、固定金型2と可動金型3が閉と
なる(型締めされる)。
Next, as shown in FIG. 3, the movable mold 3 approaches the fixed mold 2, and the fixed mold 2 and the movable mold 3 are closed (clamped).

【0014】このとき、成形金型1のキャビティ7内に
配置された電磁波シールド繊維11は軟質性となってお
り、かつ張力がかけられていないので、キャビティ7内
において電磁波シールド繊維11は固定金型2と可動金
型3との間のキャビティ7の形状に追従して変形する。
このようにして、キャビティ7内の所定位置に、所望の
形状に変形した電磁波シールド繊維11を配置すること
ができる。
At this time, since the electromagnetic wave shielding fibers 11 arranged in the cavity 7 of the molding die 1 are soft and are not tensioned, the electromagnetic wave shielding fibers 11 are fixed in the cavity 7 by the fixed metal. It deforms following the shape of the cavity 7 between the mold 2 and the movable mold 3.
In this manner, the electromagnetic wave shielding fiber 11 deformed into a desired shape can be arranged at a predetermined position in the cavity 7.

【0015】固定金型2と可動金型3とが型締めされる
と、電磁波シールド繊維11がキャビティ7の上方およ
び下方において固定金型2と可動金型3とによって挟持
される。
When the fixed mold 2 and the movable mold 3 are clamped, the electromagnetic wave shielding fiber 11 is sandwiched between the fixed mold 2 and the movable mold 3 above and below the cavity 7.

【0016】次に固定金型2のゲート2aから射出樹脂
12がキャビティ7内に射出され、射出樹脂に押されて
電磁波シールド繊維11が可動金型3側へ押付けられ
る。
Next, the injection resin 12 is injected into the cavity 7 from the gate 2a of the fixed mold 2, and is pushed by the injection resin to press the electromagnetic wave shielding fiber 11 against the movable mold 3.

【0017】この場合、電磁波シールド繊維11は多孔
性を有するため、その表面に適度な凹凸を有している。
このため電磁波シールド繊維11の凹凸部分に射出樹脂
12が入り込むことによって、電磁波シールド繊維11
と射出樹脂12との密着性を向上させることができる。
なお電磁波シールド繊維11はメッシュ状の多孔性繊維
となっているので、キャビティ7内において射出樹脂1
2の一部は電磁波シールド繊維11の孔を貫通して可動
金型3側へ流れることになる。このため樹脂が貫通しな
いフィルムを成形金型1のキャビティ7内に配置をした
場合に比較して、キャビティ7が複雑な形状であっても
射出樹脂をキャビティ7内に十分に行き渡らすことがで
き、樹脂成形品の形状の自由度を高めることができる。
In this case, since the electromagnetic wave shielding fiber 11 has porosity, the surface thereof has moderate irregularities.
Therefore, when the injection resin 12 enters the concave and convex portions of the electromagnetic wave shielding fiber 11, the electromagnetic wave shielding fiber 11
And the injection resin 12 can be improved in adhesion.
Since the electromagnetic wave shielding fiber 11 is a mesh-like porous fiber, the injection resin 1
A part of 2 flows through the hole of the electromagnetic wave shielding fiber 11 to the movable mold 3 side. For this reason, compared with the case where a film through which resin does not penetrate is arranged in the cavity 7 of the molding die 1, the injection resin can be sufficiently spread in the cavity 7 even if the cavity 7 has a complicated shape. In addition, the degree of freedom of the shape of the resin molded product can be increased.

【0018】このようにして成形金型1のキャビティ7
内で樹脂成形品10が得られる。その後、電磁波シール
ド繊維11が樹脂成形品10の形状分だけ図示しないカ
ッターで破断され、電磁波シールド繊維11はさらに巻
取ロールbによって巻取られる。
In this manner, the cavity 7 of the molding die 1
The resin molded product 10 is obtained within. Thereafter, the electromagnetic wave shielding fiber 11 is broken by a cutter (not shown) by the shape of the resin molded product 10, and the electromagnetic wave shielding fiber 11 is further wound up by a winding roll b.

【0019】このように本実施の形態によれば、電磁波
シールド特性を有する樹脂成形品10を容易かつ簡単に
製造することができる。
As described above, according to the present embodiment, it is possible to easily and easily manufacture the resin molded product 10 having the electromagnetic wave shielding characteristics.

【0020】なお、上記実施の形態において、樹脂成形
品10のメッシュ状物として電磁波シールド繊維11を
用いた例について説明したが、これに限らず電磁波シー
ルド繊維11の代わりに合成樹脂製不織布を用いてもよ
く、また多数の孔を有する合成樹脂製フィルムを用いて
もよい。
In the above-described embodiment, an example in which the electromagnetic wave shielding fiber 11 is used as the mesh-like material of the resin molded product 10 has been described. However, the present invention is not limited to this. Alternatively, a synthetic resin film having a large number of holes may be used.

【0021】また樹脂成形品10を作製した後で電磁波
シールド繊維11を破断した例を説明したが、固定金型
2と可動金型3とにカッターを設け、固定金型2と可動
金型3との型締め時に予め電磁波シールド繊維11を破
断しておいてもよい。
Also, an example has been described in which the electromagnetic wave shielding fiber 11 is broken after the resin molded article 10 has been manufactured. However, the fixed mold 2 and the movable mold 3 are provided with a cutter, and the fixed mold 2 and the movable mold 3 are provided. The electromagnetic shielding fiber 11 may be broken in advance at the time of the mold clamping.

【0022】[0022]

【実施例】次に本発明の具体的実施例について説明す
る。本実施例は、ケース(樹脂成形品10)を電磁波シ
ールド繊維11を用いて製造したものである。
EXAMPLES Next, specific examples of the present invention will be described. In this embodiment, a case (resin molded article 10) is manufactured by using an electromagnetic wave shielding fiber 11.

【0023】このような電磁波シールド繊維11は、ポ
リエステル製の芯材15aに、ニッケルおよび銅を無電
解メッキして金属層15bを形成した線状体15により
作製することができる。
Such an electromagnetic wave shielding fiber 11 can be manufactured from a linear body 15 in which a metal layer 15b is formed by electroless plating nickel and copper on a polyester core material 15a.

【0024】次に電磁波シールド繊維11を成形金型1
内に配置し、成形金型1のキャビティ7内に射出樹脂1
2を射出して樹脂成形品10を得た。
Next, the electromagnetic wave shielding fiber 11 is molded
The injection resin 1 is placed in the cavity 7 of the molding die 1.
2 was injected to obtain a resin molded product 10.

【0025】具体的な製造条件は以下のとおりである。
使用した成形金型1は、100×100×15の箱型の
樹脂成形品10に対応している。
The specific manufacturing conditions are as follows.
The molding die 1 used corresponds to a 100 × 100 × 15 box-shaped resin molded product 10.

【0026】使用した成形機は、日本製鋼所製J350
EPU(型締350トン)であり、150×300にカ
ットされた電磁波シールド繊維11が可動金型3の上部
に固定され、電磁波シールド繊維11の下部はフリーの
状態でセッティングされた。
The molding machine used was J350 manufactured by Japan Steel Works.
EPU (350 tons of mold clamp), the electromagnetic wave shielding fiber 11 cut into 150 × 300 was fixed to the upper part of the movable mold 3, and the lower part of the electromagnetic wave shielding fiber 11 was set in a free state.

【0027】使用した射出樹脂は以下の3種類であっ
た。 ポリカーボネイト(PC) 高衝撃ポリスチロール(HIPS) 耐熱ポリプロピレン(耐熱PP)
The following three types of injection resins were used. Polycarbonate (PC) High impact polystyrene (HIPS) Heat-resistant polypropylene (Heat-resistant PP)

【0028】次に樹脂成形品10の性状について述べ
る。樹脂成形品10の成形状況は、電磁波シールド繊維
11による弊害はなく、通常の樹脂成形品と全く同様と
なっていた。また電磁波シールド繊維11と射出樹脂1
2の密着状況は、顕微鏡で見る限り、電磁波シールド繊
維11の間に射出樹脂12が入り込み、噛み込むような
状況となって両者が完全に密着した。
Next, the properties of the resin molded product 10 will be described. The molding condition of the resin molded product 10 was exactly the same as that of a normal resin molded product without any adverse effect due to the electromagnetic wave shielding fiber 11. Further, the electromagnetic wave shielding fiber 11 and the injection resin 1
The adhesion state of No. 2 was such that when viewed with a microscope, the injection resin 12 entered between the electromagnetic wave shielding fibers 11 and bitten into each other, so that the two completely adhered.

【0029】深さ10mmの成形品10に対し、フラッ
トな電磁波シールド繊維11の追従性は良好で、周りに
障害のない状況でほぼ100%の追従性を示した。また
樹脂の射出圧力および温度を変化させても、電磁波シー
ルド繊維11の破損はみられなかった。
The flat electromagnetic wave shielding fiber 11 had good followability with respect to the molded product 10 having a depth of 10 mm, and showed almost 100% followability without any obstacles around. Even when the injection pressure and temperature of the resin were changed, no breakage of the electromagnetic wave shielding fiber 11 was observed.

【0030】[0030]

【発明の効果】以上のように本発明によれば、成形金型
の型締めする際、軟質のメッシュ状物を成形金型内の形
状に追従して変形させることができる。このため成形金
型内の形状に合わせた形状を有するインサート物を予め
作製しておく必要はない。また、射出樹脂とメッシュ状
物との密着性を向上させることができるので、射出樹脂
とメッシュ状物との間に別の接着剤等を設ける必要はな
い。
As described above, according to the present invention, when the mold is clamped, the soft mesh-like material can be deformed following the shape in the mold. Therefore, it is not necessary to prepare an insert having a shape corresponding to the shape in the molding die in advance. In addition, since the adhesion between the injection resin and the mesh can be improved, it is not necessary to provide another adhesive or the like between the injection resin and the mesh.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による樹脂成形品を示す断面図。FIG. 1 is a sectional view showing a resin molded product according to the present invention.

【図2】本発明による樹脂成形品の製造方法において成
形金型が開いた状態を示す概略図。
FIG. 2 is a schematic diagram showing a state in which a molding die is opened in the method for producing a resin molded product according to the present invention.

【図3】本発明による樹脂成形品の製造方法において成
形金型が閉じた状態を示す概略図。
FIG. 3 is a schematic diagram showing a state in which a molding die is closed in the method for producing a resin molded product according to the present invention.

【図4】電磁波シールド繊維を示す図。FIG. 4 is a diagram showing an electromagnetic wave shielding fiber.

【符号の説明】[Explanation of symbols]

1 成形金型 2 固定金型 3 可動金型 7 キャビティ 10樹脂成形品 11 電磁波シールド繊維 12 射出樹脂 DESCRIPTION OF SYMBOLS 1 Molding die 2 Fixed die 3 Movable die 7 Cavity 10 Resin molding 11 Electromagnetic shielding fiber 12 Injection resin

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】射出樹脂と、 この射出樹脂に設けられた軟質性メッシュ状物と、を備
えたことを特徴とする樹脂製成形品。
1. A resin molded article comprising: an injection resin; and a soft mesh-like material provided on the injection resin.
【請求項2】メッシュ状物は電磁波シールド繊維からな
ることを特徴とする請求項1記載の樹脂製成形品。
2. The resin-made molded product according to claim 1, wherein the mesh-like material is made of electromagnetic wave shielding fibers.
【請求項3】電磁波シールド繊維は芯材と、芯材の外面
を覆う金属層とからなる多数の線状体を有することを特
徴とする請求項2記載の樹脂製成形品。
3. The molded article made of resin according to claim 2, wherein the electromagnetic wave shielding fiber has a large number of linear bodies composed of a core material and a metal layer covering an outer surface of the core material.
【請求項4】芯材は合成樹脂製となっていることを特徴
とする請求項3記載の樹脂製成形品。
4. The resin molded article according to claim 3, wherein the core material is made of a synthetic resin.
【請求項5】芯材はガラス製となっていることを特徴と
する請求項3記載の樹脂製成形品。
5. The resin molded product according to claim 3, wherein the core material is made of glass.
【請求項6】電磁波シールド繊維は金属製芯材からなる
多数の線状体を有することを特徴とする請求項2記載の
樹脂製成形品。
6. The resin molded article according to claim 2, wherein the electromagnetic wave shielding fiber has a large number of linear bodies made of a metal core material.
【請求項7】射出樹脂は透明性を有し、かつ電磁波シー
ルド繊維は所望の光透過率を有し、これにより全体とし
て透明性を有することを特徴とする請求項2記載の樹脂
成形品。
7. The resin molded article according to claim 2, wherein the injection resin has transparency, and the electromagnetic wave shielding fiber has a desired light transmittance, thereby having transparency as a whole.
【請求項8】メッシュ状物は合成樹脂製の不織布からな
ることを特徴とする請求項1記載の樹脂製成形品。
8. The resin-made molded article according to claim 1, wherein the mesh-like material is made of a synthetic resin non-woven fabric.
【請求項9】メッシュ状物は多数の孔を有する合成樹脂
製フィルムからなることを特徴とする請求項1記載の樹
脂製成形品。
9. The resin molded article according to claim 1, wherein the mesh-like object is made of a synthetic resin film having a large number of holes.
【請求項10】請求項1記載の樹脂製成形品の製造方法
において、 開状態の成形金型内にメッシュ状物を配置する工程と、 成形金型を型締めする工程と、 成形金型内に射出樹脂を射出する工程と、 を備えたことを特徴とする樹脂製成形品の製造方法。
10. The method of manufacturing a resin molded article according to claim 1, wherein a step of arranging a mesh-like object in an open molding die; a step of clamping the molding die; And a step of injecting an injection resin into the molded article.
【請求項11】成形金型を型締めする際、張力をかけな
い状態でメッシュ状物を成形金型内で保持して、メッシ
ュ状物を成形金型内の形状に追従して変形させることを
特徴とする請求項10記載の樹脂製成形品の製造方法。
11. When the mold is clamped, the mesh is held in the mold without applying tension, and the mesh is deformed to follow the shape in the mold. The method for producing a resin molded product according to claim 10, characterized in that:
JP09631798A 1998-04-08 1998-04-08 Manufacturing method of resin molded products Expired - Fee Related JP4112673B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP09631798A JP4112673B2 (en) 1998-04-08 1998-04-08 Manufacturing method of resin molded products
US09/285,726 US6291369B1 (en) 1998-04-08 1999-04-05 Resin molding
KR1019990011969A KR19990082990A (en) 1998-04-08 1999-04-07 Resin molding product, method for preparation, apparatus for preparation and case thereof
DE1999621531 DE69921531T2 (en) 1998-04-08 1999-04-07 Plastic molding, process for its preparation, apparatus for carrying out the process and container
EP19990106144 EP0949052B1 (en) 1998-04-08 1999-04-07 Resin molding, method of manufacturing the same, apparatus for carrying out the method, and case
TW88105539A TW404921B (en) 1998-04-08 1999-04-07 Formed article of resin, its manufacture method, its manufacture device, and the housing
US09/901,045 US20010046822A1 (en) 1998-04-08 2001-07-10 Resin molding manufacturing method, apparatus for carrying out the method and case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09631798A JP4112673B2 (en) 1998-04-08 1998-04-08 Manufacturing method of resin molded products

Publications (2)

Publication Number Publication Date
JPH11292050A true JPH11292050A (en) 1999-10-26
JP4112673B2 JP4112673B2 (en) 2008-07-02

Family

ID=14161656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09631798A Expired - Fee Related JP4112673B2 (en) 1998-04-08 1998-04-08 Manufacturing method of resin molded products

Country Status (1)

Country Link
JP (1) JP4112673B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100531A (en) * 2008-01-18 2008-05-01 Dainippon Printing Co Ltd Resin-made molded article

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100531A (en) * 2008-01-18 2008-05-01 Dainippon Printing Co Ltd Resin-made molded article
JP4549397B2 (en) * 2008-01-18 2010-09-22 大日本印刷株式会社 Plastic molded product

Also Published As

Publication number Publication date
JP4112673B2 (en) 2008-07-02

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