JPH11288957A - Bonding device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of bonding failures of a bonding, which is performed with a bonding device by detecting a leak in a chucking pressure of suction unit, which sucks a lead frame on a bonding stage to perform the positioning of a chip on the lead frame, and to improve the yield of the bonding device. SOLUTION: A bonding device is so constituted that suction unit 116 vacuum- adsorbs the lower surface of a lead frame 101 through suction holes 119, and a chucking pressure generated by the vacuum suction of the unit 116 is measured by a pressure gate 8 at all time. A vacuum-suction detection of information is conducted by this pressure gate 8 and when the value of the detected information is a prescribed value, set previously in a memory within a control unit, of smaller, a bonding work is made to stop.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and method for positioning and bonding a component to be bonded on a bonding stage, and more particularly to a pad (electrode) on an IC chip serving as a first bonding point as a semiconductor component. A wire bonding apparatus for performing a bonding connection between a wire and a lead of a lead frame as a frame to be a second bonding point by using a wire, wherein suction means for sucking and positioning a frame on a bonding stage provided in the wire bonding apparatus is provided. The present invention relates to a bonding apparatus and a method including a pressure measuring unit for detecting a leak.

[0002]

2. Description of the Related Art FIG. 6 shows a conventional wire bonding apparatus of this type.

As shown in FIG. 6, this wire bonding apparatus arranges and accommodates a plurality of lead frames 101 in which a plurality of IC chips 107 are attached at equal pitches along a longitudinal direction (in a direction perpendicular to the paper surface). A loader 105 for positioning the magazines 108 arranged in the same manner, a bonding stage 102 for taking out the lead frames 101 one by one from the magazine 108, transferring them by frame transfer means (not shown), and placing them on the bonding positions 109, and a lead frame. The two sides of the lead frame 101 are mounted on the bonding stage 102 while being guided by the guide rails 111 and 112.
The unloader 106 arranged and accommodated in the chip 08 and the IC chip 107 of the lead frame 101 positioned at the bonding position 109 on the bonding stage 102 (the first IC chip of the lead frame 101 in FIG. 6) face the opening 104a. The lead frame presser 104 is arranged and pressed (or can be released) toward the bonding stage 102 for positioning, and the gold wire or aluminum is attached to the pad and the lead of the IC chip 107 in the opening 104a of the lead frame presser 104. A capillary 113 for supplying a wire such as a wire to perform bonding connection, a bonding arm 114 attached to the tip of the capillary 113 and performing a swinging motion by a driving means (not shown) such as a linear motor or a cam drive; Driving means and bonding device Arm 114 or the like is made from the bonding head 115. placed on a movable XY table two-dimensionally (not shown) will be mounted.

The guide rails 111 and 112 regulate the lead frame 101 in the Y direction. The guide rail 111 is attached and fixed to a linear guide 111b slidable in the Y direction along a pair of tracks of a substantially U-shaped frame 111a attached and fixed on a frame (not shown) of the wire bonding apparatus. I have. A nut 111c, which is screwed and connected with a ball screw 111d, is further fixed to the guide rail 111. The guide rail 111 is fixed on the nut 111c, and is fixed to the shaft end of the ball screw 111d. A rotational force is applied by the pulse motor 111e to be reciprocated in the Y direction together with the nut 111c. Further, the guide rail 112 is also the guide rail 111.
Since the configuration is the same as that described above, the description thereof is omitted.

The guide rails 111 and 112 are reciprocated in the Y direction by a control means (not shown) and controlled to perform adjustment at an optimum interval so as to be adapted to the width of the lead frame 101.

The bonding stage 102
Has a heat block 103, and heats the lead frame 101 placed on the bonding stage 102 to an optimum temperature.

As shown in FIG. 6, the lead frame 101 has a substantially rectangular shape as a whole. As shown in FIG. 7, the lead frame 101 extends from each corner as a supporting portion. and the island 101a having a fishing pin (tie bars) 101a _1, one end between fishing pin 101a ₁ the other end becomes a free end portion is from a lead 101b composed are formed in the lead frame 101. On the island 101a, an IC chip 107 is attached with an adhesive or the like, and a plurality of pads (electrodes) 107a are provided on the IC chip 107.

Next, the operation of the conventional wire bonding apparatus having the above configuration will be described with reference to FIGS.

As shown in FIG. 6, for example, one of the lowermost frames of each of the lead frames 101 in the magazine 108 of the loader 105 is extruded by a pusher (not shown) and a pair of Guide rails 111 and 11
2 and is conveyed onto the bonding stage 102.

When the lead frame 101 is placed on the bonding stage 102, the lead frame 101
Is pressed by the lead frame holder 104 to perform positioning.

Next, the capillary 113 attached to the tip of the bonding arm 114 wraps a wire between the pad 107a and the lead 101b of the IC chip 107 shown in FIG. This bonding connection is applied to the pads 107 of all the IC chips 107.
a) and the lead 101b, the lead frame presser 104 releases the pressing so that the frame transfer means can intermittently feed the next IC chip 107 by one pitch (also called one frame). Then, when the frame transfer means advances the next IC chip 107 by one frame, the lead frame holder 104 presses the lead frame 101 again to perform positioning and bonding connection. The above operation is performed on all the IC chips 107 and the leads 101b,
When the bonding of one lead frame 101 is completed, the lead frame 101 is transferred by the frame transfer means and accommodated in the empty magazine 108 loaded in the unloader 106.

[0012]

As shown in FIG. 6, a conventional wire bonding apparatus has a configuration in which a lead frame 101 on a bonding stage 102 is pressed by a lead frame retainer 104 and positioned.
As shown in FIG.
The end on the fixed side opposite to the free end of the lead 101b is pressed, and the free end of the lead 101b and the island 101a are arranged in the opening 104a and are not pressed. .

The free end of the lead 101b and the island 10 which are not pressed by the lead frame holder 104
8A, as shown in FIGS. 8A and 8B, the lower surface of the island 101a is suction-positioned by vacuum suction by the suction device 116 to perform positioning. This adsorption device 1
Reference numeral 16 denotes a suction hole 119 formed in the bonding stage 102 (also shown in FIG. 7), a pump 117 serving as a driving force for sucking the lead frame 101 on the bonding stage 102 from the suction hole 119, and a pump 117
7 and a connecting pipe 116 connecting the suction holes 119 to each other.

The mounting surface 102a of the bonding stage 102 on which the lead frame 101 is mounted has a flush configuration so as to hold the lead frame 101 at a uniform height. Accordingly, when the lead frame 101 is placed on the bonding stage 102 and is positioned by being sucked by the suction device 116, the bonding stage 10
2 and the lower surface of the lead frame 101 are held without any gap.

However, as shown in FIGS. 6 to 8, the lead frame 101 is made of a thin plate-shaped rectangular conductive metal or the like, so that it has flexibility. . Therefore, as shown in FIG. 8A, the free ends of the islands 101a and the leads 101b of the lead frame 101 may be warped. When such a warp is generated, even when suction is performed by the suction device 116, a leak occurs due to a gap between the lower surface of the lead frame 101 and the mounting surface 102 a of the bonding stage 102. (Leakage) may occur and sufficient positioning may not be performed.

When bonding is performed in a state where the leak has occurred, for example, as shown in FIG. 8A, a regular distance ha from the tip of the capillary 113 to the upper surface of the IC chip 107 and warpage occur. A difference of the distance s occurs with the distance hb in the case where there is. This difference in the distance s necessitates resetting the search level at which the bonding arm 114 descends at a high speed and switches to a low speed. Further, as shown in FIG.
When bonding is performed in a state where “a” is warped, since the suction device 116 does not perform sufficient positioning, the capillary 113 abuts on the pad 107 a (shown in FIG. 7) of the IC chip 107 and the ultrasonic horn of the bonding arm 114. When an ultrasonic vibration is applied via a (not shown), there is a possibility that the IC chip 107 is displaced and a bonding failure is caused.

Also, as shown in FIG. 8B, when foreign matter 120 such as dust or dust enters between the lower surface of the island 101a of the lead frame 101 and the mounting surface 102a of the bonding stage 102. As in the case described above, there is a possibility that a bonding failure may occur.

In view of the above, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and detects a leak (leak) of a suction means for sucking and positioning a lead frame on a bonding stage by a pressure measuring means. It is an object of the present invention to provide a bonding apparatus and method capable of preventing bonding defects and improving the yield.

[0019]

According to the present invention, there is provided a bonding apparatus comprising: a bonding stage on which a frame is mounted; transport means for transporting the frame on the bonding stage; and a lower surface of the frame on the bonding stage. Suction means, pressure measurement means for measuring the suction pressure by the suction means, and control for inputting information measured by the pressure measurement means and determining whether the input information is less than or less than a preset value The control means stops the bonding operation when the information measured by the pressure measuring means is less than or less than a preset value.

Further, the pressure measuring means of the bonding apparatus according to the present invention comprises a pressure gauge, and detects a leak between the lower surface of the frame and the upper surface of the bonding stage.

Further, the bonding method according to the present invention comprises:
A step of mounting and positioning the frame on the bonding stage by the conveying means; and a step of adsorbing the lower surface of the frame on the bonding stage by the adsorbing means to leak a suction pressure between the lower surface of the frame and the upper surface of the bonding stage. (Leak) is detected by the pressure measuring means, and the step of stopping the bonding operation when the information obtained by detecting the leak by the pressure measuring means is less than or less than a value preset in the control means. It is provided.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a wire bonding apparatus as an embodiment of the present invention will be described with reference to the drawings. The description of the same configuration as that of the conventional bonding apparatus shown in FIGS. 6 to 8 will be omitted, and only the main part will be described. In the following description, components having the same configuration and function as those of a conventional device are denoted by the same reference numerals.

FIG. 1 is a schematic diagram showing the configuration of a wire bonding apparatus according to the present invention, and FIG. 2 is a block diagram showing the configuration of circuits such as the image recognition device and the control device shown in FIG.

As shown in FIG. 1, the wire bonding apparatus includes a camera 1 as an image pickup means including a camera head 1a and a lens 1b, and a bonding arm having a capillary 113 for performing bonding and having an ultrasonic transducer. Bonding head 1 including 114, etc.
15, an XY table 2 capable of moving the camera 1 and the bonding head 115 in the horizontal and two-dimensional directions of the X direction and the Y direction, and an IC chip 107 as a semiconductor component which is a part to be bonded and imaged by the camera 1
Stage 102 on which is mounted and positioned
An image recognition device 3 as an image recognition means for receiving an output from the camera 1, a monitor 4 as a display means for receiving an output from the image recognition device 3, a drive of the XY table 2, and a bonding head 115 Drive device 5 as drive means for issuing a drive command for causing bonding arm 114 of the device to perform a vertical swinging motion
And a control unit 6 as a control unit including a microprocessor or the like that receives an output from the image recognition device 3 to generate a control signal to the drive unit 5 as a drive unit and performs various controls, and a control unit as a transport unit. It comprises a transfer device 7 and a pressure gauge 8 as a pressure measuring means for measuring a suction pressure of a suction device 116 (shown in FIGS. 3 and 8) as a suction means.

The image recognizing device 3, the control device 6, the driving device 5 and the like only need to be functionally provided, so that they may be configured as one device instead of as separate devices.

The transfer device 7 is provided with a Y
It has a guide rail 111 and a guide rail 112 for regulating the direction and a frame transfer means.

As shown in FIG. 2, the image recognizing device 3 includes a clock signal generating circuit 3a, a horizontal and vertical synchronizing signal generating circuit 3b, and a signal obtained by amplifying a video signal from the camera 1 with an amplifier 3c. An image processing circuit 3d that digitizes and performs image processing, a control circuit 3f that controls and determines the image processing circuit 3d, and image information or wire information on a portion to be bonded, that is, an electrode (pad) 107a (shown in FIG. 7). It has from the image memory 3e for storing image information relating to the image information and lead 101b relates to a ball formed at the tip (3e ₁ ~3e _n).

Further, as shown in FIG.
Is a command for setting various conditions, that is, bonding parameters and the like, to the control device 6 as an operating means. In the wire bonding apparatus according to the present invention, the presence / absence of frame detection can be set in advance when setting the bonding parameters. This frame detection is performed by a guide rail 111 shown in FIG.
And the guide rail 112 regulates the lead frame 101 in the Y direction, while the bonding stage 1
As shown in FIG. 2, the lead frame 101 mounted on the camera 02 is imaged by the camera 1 and recognized by the image recognition device 3 and when there is a deviation from a preset normal position, the frame transfer means shown in FIG. The displacement is corrected by moving in the X direction shown in FIG.

The pressure gauge 8 as a pressure measuring means is
Digital output is possible.
Is output to the control device 6 and simultaneously displayed on the monitor 4 as display means.

The operation of the wire bonding apparatus having the above configuration will be described below with reference to FIGS. FIG. 4 is a flowchart showing the flow of a bonding operation in the case where the presence of frame detection is set in advance when setting the bonding parameters using the keyboard. FIG. 5 is a flowchart showing the flow of frame detection in advance when setting the bonding parameters using the keyboard. It is a flowchart which shows the flow of the bonding operation in the case of setting none.

First, the keyboard 9 (shown in FIG. 2) is used to set various conditions of the wire bonding apparatus, that is, bonding parameters (also referred to as self-teaching).
Make the settings for When the setting of various conditions by the keyboard 9 is completed, the wire bonding apparatus is started.

First, the case where the presence of a frame detect is set in advance when setting the bonding parameters using the keyboard shown in FIG. 4 will be described. Next, when the setting of the bonding parameters using the keyboard shown in FIG. A case where no detection is set will be described. 4 and 5 show the IC chip 10
The part to be bonded, such as the pad 107a or the lead 101b, is called a work.

FIG. 4 shows a case where "detect" is set in advance for frame detection when setting bonding parameters using the keyboard.

As shown in FIGS. 1 and 6, the lead frame 101 is pushed out one by one from a magazine 108 of the loader 105 by a pusher (not shown), and the guide rail 111 and the guide rail 111 of the transport device 7 (shown in FIG. 1). The first I of the lead frame 101 guided by 112
C chip 107 is positioned to press the lead frame 101 on the bonding stage 102 by placed on to the lead frame presser 104 on the bonding stage 102 (transferring step of the work in step S _1).

Next, as shown in FIG. 2, the lead frame 101 is imaged by the camera 1 and frame detection is performed by the image recognition device 3 (step S ₂ ). The frame detection is performed on the XY table 2 stored in the memory of the control circuit 3f in the image recognition device 3 in advance by using, for example, a display for two-point alignment formed on the lead frame 101. The deviation is detected by comparing with the normal coordinates, and the deviation is within a predetermined range set in advance. ), The positioning is performed as it is, and if the deviation is not within the predetermined range, the lead frame presser 10
4 is released and the lead frame 1 is
04 is moved in the X direction shown in FIG. 6 to make a correction to match the regular coordinates (step S ₂ ).

The frame Detect is completed in step S ₂ is positioned on the bonding stage (including the case where the deviation amount by the frame-detect is not corrected in the case of the predetermined range), the lead frame 101, FIG. As shown in FIG. 3, the lower surface is vacuum-sucked through suction holes 119 of a suction device 116 as suction means. The adsorption pressure of the adsorption device 116 is
It is constantly measured by a pressure gauge 8 as a pressure measuring means and is displayed on a monitor 4 as a display means. The pressure measured by the display on the monitor 4 is visible.

The control device 6 reads the pressure gauge 8 from the adsorption device 11
Since the suction pressure measurement information (hereinafter, information is also referred to as data) of No. 6 is input, vacuum suction detection is performed based on the input data (step S ₃ ).

In this vacuum suction detection, a predetermined value is set from the keyboard 9 in a memory as storage means (not shown) in the control device 6, and the pressure is equal to or less than the set pressure (in the following description, less than the set pressure). (Including the case described below)), the suction force is not sufficient, that is, as shown in FIGS. 8A and 8B,
Some kind of leak between the mounting surface 102a of the bonding stage 102 and the lead frame 101
(Leakage) is determined. The value of the attraction force (predetermined value) in the control device 6 can be set in advance by inputting using the keyboard 9 or an empirically obtained value can be appropriately set using the keyboard 9. .

The control device 6 is provided with the suction device 116.
The measurement information (or data) is converted as a pressure display if the value preset in the control device is related to pressure, and is converted into a digitized value if it is a digitized value. Shall be. In short, it has been converted to a comparable numerical value.

[0040] The control device 6, as the suction force by the vacuum suction detection step S ₃ is less than a specified value, that is, when it is determined that "the leakage Yes", the bonding is not performed apparatus of the wire bonding apparatus stopping (step S _6). When the wire bonding apparatus is stopped, the wire bonding apparatus is notified by a warning means such as an alarm which can be notified to the outside, and information on "leakage" causing the stop of the apparatus, that is, information on the monitor 4, that is, An error display is provided.

Further, the control device 6, when the suction force by the vacuum suction detection step S ₃ exceeds the predetermined value, "leak free" to recognize the workpiece is the next step as a (Step S _4). The recognition of the work is performed by an image recognition device 3 as an image recognition means as shown in FIGS. The image recognition apparatus 3, are previously stored image information and position information concerning the pad 107a and lead 101b as the bonding site in the internal image memory 3e (3e ₁ ~3e _n) (referred to as normal coordinates) .

The image recognizing device 3 sends image information obtained by capturing the workpiece on which the vacuum suction detection (step S ₃ ) has been performed by the camera 1 to the image processing circuit 3d, and sends the image information to the image processing circuit 3d.
Performs pattern matching between the memory 3e (3e ₁ ~3e _n) image information and the image information of the normalized obtained by the camera 1 by calling the necessary information from. This pattern matching uses a known technique already proposed by the present applicant. This pattern matching process is performed for each of the pad 107a and the lead 101b as a bonded portion.

If there is no displacement of the work as a result of the recognition of the work (step S ₄ ), the bonding is started as it is (step S ₅ ).

If there is a displacement of the work due to the recognition of the work (step S ₄ ), a deviation from the regular coordinates is obtained by the pattern matching process, and the bonding position coordinates (XY) are determined based on the deviation. The data of the coordinate position calculated and corrected based on the coordinates of the table 2) is stored in a memory (not shown) in the control circuit 3f.

If the deviation amount exceeds the preset allowable range even after the correction by the pattern matching processing (No in FIG. 4), the apparatus is stopped and bonding is not performed, and an error message is displayed. It is carried out (step S _6).

In the work recognition by the image recognition device 3 (step S ₄ ), when it is determined that the displacement is within the preset allowable range and that the bonding can be performed (Yes in FIG. 4) ), the CPU starts to bonding (step S _5).

When the bonding of the wires to the pads 107a and the leads 101b of all the IC chips 107 of the lead frame 101 is completed, the transfer device 7 is arranged and accommodated in the empty magazine 108 of the unloader 106.

When "None" of the frame detect is set in advance when setting the bonding parameters using the keyboard shown in FIG.

As shown in FIGS. 1 and 6, the lead frame 101 is pushed out one by one from a magazine 108 of the loader 105 by a pusher (not shown), and the guide rail 111 and the guide rail 111 of the transporting device 7 (shown in FIG. 1). The first I of the lead frame 101 guided by 112
C chip 107 is positioned to press the lead frame 101 on the bonding stage 102 by placed on to the lead frame presser 104 on the bonding stage 102 (transferring step of the work in step S _10). Conveying of this work is shown in FIG. 4, the same as step S _1.

Next, since the control device 6 receives the measurement information (hereinafter, information is also referred to as data) of the suction pressure of the suction device 116 from the pressure gauge 8, the vacuum suction is performed based on the input data. the detection (step S _11). The vacuum suction detection is shown in FIG. 4, the same as step S _3.

In this vacuum suction detection, a predetermined value is set from the keyboard 9 in a memory as storage means (not shown) in the control device 6, and the pressure is equal to or less than the set pressure (in the following description, less than the set pressure). (Including the case described below)), the suction force is not sufficient, that is, as shown in FIGS. 8A and 8B,
Some kind of leak between the mounting surface 102a of the bonding stage 102 and the lead frame 101
(Leakage) is determined. The value of the attraction force (predetermined value) in the control device 6 can be set in advance by inputting using the keyboard 9 or an empirically obtained value can be appropriately set using the keyboard 9. .

[0052] The control device 6, when the suction force by the vacuum suction detection step S ₁₁ exceeds a predetermined value,
"Leak free" to recognize the workpiece is the next step as a (Step S _14). Recognition of this work is shown in FIG. 4, the same as step S _4.

The recognition of the work is performed by an image recognition device 3 as image recognition means, as shown in FIGS.
The image recognition apparatus 3, inside the image memory 3e (3e ₁ to 3
e _n ) pad 107 a as a bonded portion
In addition, image information, position information, and the like regarding the lead 101b are stored in advance (referred to as regular coordinates).

The image recognizing device 3 sends image information obtained by taking an image of the workpiece on which the vacuum suction detection (step S ₁₁ ) is performed by the camera 1 to the image processing circuit 3d, and sends the image information to the image processing circuit 3d.
Performs pattern matching between the memory 3e (3e ₁ ~3e _n) image information and the image information of the normalized obtained by the camera 1 by calling the necessary information from. This pattern matching uses a known technique already proposed by the present applicant. This pattern matching process is performed for each of the pad 107a and the lead 101b as a bonded portion.

If there is no displacement of the work as a result of the work recognition (step S ₁₄ ), the bonding is started as it is (step S ₁₆ ).

If there is a displacement of the work due to the recognition of the work (step S ₁₄ ), the amount of displacement from the regular coordinates is obtained by the pattern matching processing, and the bonding position coordinates (XY) are determined based on this displacement. The data of the coordinate position calculated and corrected based on the coordinates of the table 2) is stored in a memory (not shown) in the control circuit 3f.

If the deviation amount exceeds the preset allowable range even after the correction by the pattern matching processing (No in FIG. 5), the apparatus is stopped and an error is displayed without performing the bonding. (step S _15).

In the recognition of the workpiece by the image recognition device 3 (step S ₁₄ ), when it is determined that the deviation is within the preset allowable range and that the bonding can be performed (Yes in FIG. 5) ), The bonding is started (step S ₁₆ ).

When the bonding of the wires to the pads 107a and the leads 101b of all the IC chips 107 of the lead frame 101 is completed, the transfer device 7 is arranged and accommodated in the empty magazine 108 of the unloader 106.

[0060] The control device 6 is, as suction force by vacuum suction detection step S ₁₁ is below a predetermined value,
That is, when it is determined that "the leakage Yes" performs frame Detect (step S _12). The frame Detect is shown in FIG. 4, the same as step S _2.

[0061] As shown in FIG. 5, the setting by loading parameters in Bonn, even if you did not select a mode of frame-detect "no", the determination of "leakage Yes" in the vacuum suction detection in step S ₁₁ has been made In such a case, the frame detection is automatically performed. Frame Detect by a step S _12, shown in FIG. 4 is the same as the frame-detect in step S _2, the description thereof is omitted.

[0062] and is positioned on the bonding stage and the frame-detect in step S ₁₂ is completed (including the case where the deviation amount by the frame-detect is not corrected in the case of the predetermined range), vacuum suction detection is performed ( step S _13). The vacuum suction detection is shown in FIG. 4, the same as step S _3.

[0063] by vacuum suction detection by step S _13, in the case of "leakage Yes" performs the process of step S _15, in the case of the apparatus is stopped, "leakage Mu" performs processing of step S ₁₄ .

In this embodiment, the wire bonding apparatus has been described. However, the present invention can be applied to other bonding apparatuses such as a tape bonding apparatus. Further, it can be appropriately changed and used within the scope of the present invention.

[0065]

As described above, according to the present invention, since the pressure measuring means for detecting the leak of the suction means for sucking and positioning the frame on the bonding stage is provided, the bonding failure is prevented. In addition, the yield can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a wire bonding apparatus according to the present invention.

FIG. 2 is a block diagram illustrating a configuration of a circuit such as an image recognition device and a control device illustrated in FIG. 1;

FIG. 3 is a schematic diagram including a partial cross section showing a state in which a lead frame on a bonding stage is suctioned by a suction device and the suction force is measured by a pressure gauge.

FIG. 4 is a flowchart showing a flow in a case where “present” of frame detection is set in advance when setting a bonding parameter using a keyboard.

FIG. 5 is a flowchart showing a flow in a case where “absence” of frame detection is set in advance when setting bonding parameters using a keyboard.

FIG. 6 is a plan view showing a schematic configuration of a conventional wire bonding apparatus.

FIG. 7 is a partially enlarged plan view of a lead of a lead frame and an IC chip.

8A shows a warped state of an island of a lead frame, and is a partial cross-sectional view including a bonding stage and a pressure gauge taken along the line AA in FIG. 7, and FIG. FIG. 8 is a partial cross-sectional view including a bonding stage and a pressure gauge, showing a state in which a foreign substance has entered the lower surface of the island, as viewed from line AA of FIG. 7.

[Explanation of symbols]

 Reference Signs List 1 camera 2 XY table 3 image recognition device 4 monitor 5 drive device 6 control device 7 transfer device 8 pressure gauge 9 keyboard 101 lead frame 102 bonding stage 103 heat block 104 lead frame presser 105 loader 106 unloader 107 IC chip 108 magazine 114 bonding arm 115 Bonding head 116 Suction device 117 Pump

Claims (3)

[Claims] 1. A bonding stage on which a frame is mounted, a conveying unit for conveying the frame on the bonding stage, a suction unit for suctioning a lower surface of the frame on the bonding stage, and a suction pressure by the suction unit. A pressure measuring unit for measuring, and a control unit that receives information measured by the pressure measuring unit and determines whether the input information is equal to or less than a preset value. A bonding apparatus, wherein when the information measured by the pressure measuring means is less than or less than a preset value, the bonding operation is stopped. 2. The apparatus according to claim 1, wherein said pressure measuring means comprises a pressure gauge, and detects a leak between a lower surface of said frame and an upper surface of said bonding stage.
The bonding apparatus as described in the above. 3. A step of mounting and positioning a frame on a bonding stage by a transporting means, and a step of adsorbing a lower surface of the frame on the bonding stage by an adsorbing means so as to be between the lower surface of the frame and the upper surface of the bonding stage. Detecting a leak (leak) of the suction pressure by the pressure measuring means; and performing bonding if the information obtained by detecting the leak by the pressure measuring means is less than or less than a value preset in the control means. And a step of stopping the bonding.