JPH11288619A - Heat radiator of electronic ballast - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiator of an electronic ballast with which the space required for installing the electronic ballast can be reduced without decreasing its heat radiating effect. SOLUTION: Heat generated at the heating element 67 of an electronic ballast 100 is conducted to a casing 41 via a metallic heat conducting member 61 and radiated from the entire casing 41. Also, the metallic heat conducting member 61 which conducts the heat from the heating element 67 to the casing 41 is mounted on the inner surface of the casing, and the base 57 of the electronic ballast 100 is supported while being floated from the bottom surface of the casing via a base supporting part 53 and the heat conducting member 61. The heating element is attached to the heat conducting member and the base is connected to the terminal of the heating element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for an electronic ballast that radiates heat from a heating element housed in a housing of an electronic ballast to the outside of the housing.

[0002]

2. Description of the Related Art Generally, a showcase is provided with a fluorescent lamp (discharge lamp) for illuminating the inside of a refrigerator. Provided in a machine room or the like.

An electronic ballast of this type has a substrate inside a housing, and a heating element (semiconductor element) such as a transistor or a diode for controlling a current for lighting the fluorescent lamp is mounted on the substrate. This heating element generates heat as a loss due to on-resistance and the like when a current flows.
A metal radiator plate is attached to the heating element, and this radiator plate is projected from the opening formed in the housing to the outside of the housing to radiate heat to the outside and prevent the heating element from being broken due to a temperature rise. Was.

[0004]

However, in the above-described heat radiating device for an electronic ballast, since the heat radiating plate protrudes outside the housing, a large installation space is required as the electronic ballast, and the installation space is effectively used. There is a problem that can not be.

It is an object of the present invention to provide a heat radiating device for an electronic ballast which can solve the above-mentioned problems of the prior art and can reduce the installation space for the electronic ballast without reducing the heat radiating effect.

[0006]

According to the first aspect of the present invention,
In a heat radiating device for an electronic ballast that radiates heat from a heating element housed in a casing of an electronic ballast to the outside of the casing, a metal heat transfer that conducts heat from the heating element to the casing. A member is attached to the inner surface of the housing, and a heat generator is attached to the heat transfer member.

According to a second aspect of the present invention, a metal heat transfer member for conducting heat from the heating element to the housing is mounted on the inner surface of the housing, and the substrate support mounted on the inner surface of the housing. The board of the electronic ballast was supported in a state of being floated from the bottom surface of the housing via the portion and the heat transfer member, the heating element was attached to the heat transfer member, and the terminal of the heating element was connected to the board. It is characterized by the following.

[0008] According to these inventions, the heat generated by the heating element is released from the entire housing, the heat radiation area is widened, and the heat radiation effect is improved.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the casing is coated with black.

According to the present invention, the amount of heat radiation increases, and the heat radiation effect improves.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a showcase provided with a heat radiating device for an electronic ballast according to the present embodiment. This showcase 1 is an open type having an opening 3 on the front surface. The showcase 1 is provided with a heat insulating panel 5 having a substantially U-shaped cross section. Inside the heat insulating panel 5, there are provided cool air passages 7a to 7c.
A storage room 11 is provided on the inside of ~ 7c via a partition plate 9. Also, both sides of the storage room 11 are side plates 13 respectively.
Blocked by

A suction port 15 is provided at an end of the lower cold air passage 7a.
Is provided in the lower cold air passage 7a.
7, a cooler 19 is provided in the rear cool air passage 7b, and an outlet 21 is provided at an end of the upper cool air passage 7c.

During the cooling operation, as indicated by the dotted arrow,
The cool air in the storage room 11 is sucked into the cool air passage 7a through the suction port 15, is drawn into the blower 17 for the cooler, rises, is cooled by the cooler 19, and descends from the outlet 21 to form the air curtain A. Then, part of the cool air forming the air curtain A flows into the storage room 11 and cools the storage room 11. The cool air is collected in the lower cool air passage 7a through the suction port 15.

A fluorescent lamp 23 extending in the width direction of the showcase 1 is provided on the front side of the outlet 21, and a fluorescent lamp 25 extending in the vertical direction is provided on the front side of the side plate 13. The storage room 11 has three display shelves 27a, 27
b, 27c are provided, and the display shelves 27a and 27c
Behind the fluorescent lamp 29 extending in the width direction of the showcase 1
Is provided. The above-described fluorescent lamps 23, 25, and 29 illuminate products displayed in the storage room 11.

A machine room 31 is formed at the bottom of the showcase 1. The machine room 31 is provided with a condenser 33, a condenser blower 35, and a compressor 37. When the condenser blower 35 is operated, air flows into the machine room 31 from the front side of the machine room 31, and the condenser 33 and the compressor 37 are air-cooled.

A raceway 39 made of a steel plate is provided below the front wall 5a of the heat insulating panel 5 and extends in the width direction of the showcase 1. A predetermined fixed portion 39a inside the raceway 39 has the fluorescent lamp 23. , 25 and 29 are mounted.

As shown in FIG. 2, the electronic ballast 100 has a metal housing 41 containing various circuit elements and the like, and the entire inner surface and the entire outer surface of the housing 41 are about 50 μm by alumite coating or the like. Painted in black with a thickness of. Case 41
A connector 47 for connecting a lead wire connected to the fluorescent lamps 23, 25, 29 or a lead wire connected to an AC power supply is provided on a side surface 45a of the light emitting device. As shown in FIG. 3, an opening 48 is formed on the opposite side of the bottom surface 43 of the housing 41. Folded portions 49a and 4b are provided on side surface 45a and side surface 45b facing side surface 45a, respectively.
9b, and two bent holes 49a and 49b are provided with two screw holes 51, respectively. Electronic ballast 1
No. 00 is attached by fastening a screw (not shown) to the fixing portion 39 a (FIG. 1) through the screw hole 51.

As shown in FIG. 4, a substrate supporting portion 53 having an L-shaped cross section is attached to the inner surface of the side surface 45d of the housing 41 by a screw 55, and a substrate 57 is attached to the substrate supporting portion 53 by a screw 59. It is attached in a state of being floated from the bottom surface 43. On the other hand, a heat transfer member 61 made of metal such as aluminum is attached to the inner surface of the side surface 45c of the housing 41 with three screws 63 (FIG. 3) in close contact therewith. Three substrate supporting portions 61a (FIG. 3) are attached to the heat transfer member 61, and the substrate 57 is attached to the substrate supporting portions 61a in a state of being floated from the bottom surface 43 by screws 65.

As described above, the substrate 57 is supported from both sides by the substrate supporting portion 53 and the substrate supporting portion 61a of the heat transfer member 61 in a state of being lifted from the bottom surface 43.
1 and the substrate 57 are improved in insulation.

In the conventional configuration, a cylindrical substrate spacer is disposed between the substrate and the bottom surface of the housing, and the substrate is screwed from the bottom side through a hole provided on the bottom surface and the hollow hole of the substrate spacer. Was fixed. However, if a hole is provided in the bottom surface, water may enter through the hole. However, in the present embodiment, since there is no need to make a hole in the bottom surface 43, water does not enter from the bottom surface 43 side.

In this embodiment, a heating element (semiconductor element) 67 such as an electronic component constituting an electronic ballast is connected to a heat transfer member 61 made of metal such as aluminum via a screw 69 as shown in FIG. It is attached. That is, in this embodiment, most of the plurality of circuit elements for lighting the fluorescent lamps 23, 25, and 29 (FIG. 1) are mounted on the substrate 57.
Only the electronic components (for example, semiconductor devices such as transistors and diodes) of these circuit elements which generate a large amount of heat are attached to the heat transfer member 61 and the terminals 67 thereof.
a is connected to the substrate 57 by soldering or the like.

When the heating element 67 generates heat by turning on the fluorescent lamps 23, 25, 29 (FIG. 1), this heat is first conducted to the heat transfer member 61, and then from the heat transfer member 61 to the side of the housing 41. The electric power is transmitted to the case 45c, further transmitted to the entire case 41, and emitted from the entire outer surface of the case 41 to the outside. At this time, if the casing 41 that dissipates heat is painted black, it is possible to obtain an effect that the temperature rise of the casing can be suppressed by about 10 ° C. as compared with a case where a conventional casing without black painting is used. Can be

This embodiment is characterized in that the heat transfer member 61 is attached to the inner surface of the housing 41 which is a dead space. According to this, the heat transfer member 61 can be transferred without enlarging the outer shape of the housing 41. The heat radiation area of the heat member 61 can be easily increased. In addition, since heat can be efficiently transmitted to the entire outer surface of the housing 41 through the heat transfer member 61, the housing 41 itself can function in the same manner as a conventional radiator plate. The heat radiation effect can be significantly improved.

Further, since the substrate 57 is supported by the substrate supporting portion 61a of the heat transfer member 61 that conducts the heat from the heating element 67, there is no need to provide a separate substrate supporting portion, and the number of components is reduced, and cost is reduced. Can be achieved.

Although the present invention has been described based on one embodiment, the present invention is not limited to this. For example, in the above-described embodiment, the black coating is applied to the entire inner surface and the entire outer surface of the housing, but may be applied only to the outer surface.

[0027]

According to the first or second aspect of the present invention, a metal heat transfer member for conducting heat from the heating element to the housing is attached to the inner surface of the housing, and the heating element is attached to the heat transmission member. Since it is attached, the heat radiation area is widened and the heat radiation effect is improved.

According to the third aspect of the present invention, since the casing is coated with black, the amount of heat radiation increases and the heat radiation effect improves.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a structure of a showcase including a heat radiating device for an electronic ballast according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a bottom surface side of the electronic ballast of FIG. 1;

FIG. 3 is a perspective view showing an opening side of the electronic ballast of FIG. 1;

FIG. 4 is a sectional view showing a heat transfer structure of the electronic ballast of FIG. 1;

[Description of Signs] 41 Housing 61 Heat Transfer Member 67 Heating Element 100 Electronic Ballast

Claims (3)

[Claims] 1. A heat radiating device for an electronic ballast that radiates heat from a heating element such as an electronic component housed in a housing of the electronic ballast to the outside of the housing, wherein the heat from the heating element is applied to the housing. A heat radiating device for an electronic ballast, wherein a metal heat conducting member for conducting heat is attached to an inner surface of the housing, and a heating element is attached to the heat conducting member. 2. A heat radiating device for an electronic ballast that discharges heat from a heating element such as an electronic component housed in a housing of the electronic ballast to the outside of the housing, wherein the heat from the heating element is applied to the housing. A metal heat transfer member that conducts heat is attached to the inner surface of the housing, and the substrate of the electronic ballast is moved from the bottom surface of the housing via the substrate support and the heat transfer member attached to the inner surface of the housing. A heat radiating device for an electronic ballast, wherein the heat generating element is mounted on the heat transfer member while being supported in a floating state, and a terminal of the heat generating element is connected to the substrate. 3. The heat radiating device for an electronic ballast according to claim 1, wherein a black paint is applied to the housing.