JPH112823A - Method and device for manufacturing liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the method and device for the manufacture of the liquid crystal device which reduces combination deviation between substrates an reduces the curvature and recessing of the substrates constituting a liquid crystal cell and can form an accurate and uniform cell gap. SOLUTION: With a pressing head, a small-size substrate is pressed against a large-size substrate. In this case, the pressing force of the pressing head is set to approximately 4 kg/chip in a step (1) and the plane positions of the substrates are roughly determined in this state. In a step (2), the pressing force of the pressing head is increased up to approximately 8 kg and the lane positions of the substrates are accurately aligned. Lastly, a seal material is set in a step (3) by being irradiated with ultraviolet rays without varying the pressing force.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing a liquid crystal display device, and more particularly to a method for manufacturing a liquid crystal cell constituted by bonding two substrates via a sealing material. Related to the device.

[0002]

2. Description of the Related Art Conventionally, there are various methods for manufacturing a liquid crystal display device, and the following method is generally employed. First, a wiring layer and a pixel electrode are respectively formed on the inner surfaces of two glass substrates, and an active element, a color filter, and the like are also formed as necessary. Next, a sealing material is applied to one of the two glass substrates so as to surround the liquid crystal display area while leaving one opening,
The other glass substrate is attached via the sealing material.

[0003] The two glass substrates are bonded to each other in a state of being adhered to each other with a predetermined pressure by a pressing device.
Light or heat is applied to the two pressed glass substrates to cure the sealing material, whereby a liquid crystal cell is formed. Liquid crystal is injected into the liquid crystal cell from the opening of the sealing material under reduced pressure, and after the injection is completed, the opening is sealed.

[0004] The pressure bonding step of the glass substrate and the curing step of the sealing material are performed by various methods depending on the type of the liquid crystal cell. For example, when a large number of spacers are dispersedly arranged between glass substrates, two glass substrates are pressurized and pre-compressed, and the gap between the glass substrates is kept as it is or transferred to another jig. By curing the sealing material while holding it, a liquid crystal cell having an accurate cell gap can be formed.

Although no spacer is provided between the glass substrates, a spacer having the same size as a desired cell gap is mixed in the sealing material, and pressure is applied to the portion where the sealing material exists. In addition, there is also a case where the sealant is temporarily compressed and then the sealing material is cured.

[0006]

In the above-mentioned conventional method for manufacturing a liquid crystal display device, when two glass substrates are bonded to each other, the plane position between the substrates cannot always be set accurately. (2) A misalignment occurs between the two glass substrates, which causes a problem of variation and deterioration of display characteristics due to a misalignment of a pixel structure formed on the inner surface of the glass substrate.

In a method of manufacturing the other glass substrate as a small substrate corresponding to a liquid crystal display cell while keeping the other glass substrate in a large format, pressure bonding and temporary curing are performed at once on a plurality of small substrates. In addition, the degree of deformation of the glass substrate changes greatly depending on the pressure at the time of pressure bonding and the degree of hardening of the sealing material, so that the glass substrate after the completion of the liquid crystal cell warps and dents, and the liquid crystal with a uniform cell gap There is also a problem that it is difficult to form cells. On the other hand, if pressure bonding and temporary curing are individually performed on the small substrates, the positioning operation must be performed for each small substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to reduce misalignment between substrates and reduce warpage and dents of substrates constituting a liquid crystal cell, thereby achieving accurate and uniform processing. An object of the present invention is to provide a method and an apparatus for manufacturing a liquid crystal display device capable of forming a cell gap.

[0009]

In order to solve the above-mentioned problems, the present invention provides a liquid crystal device in which two substrates are adhered to each other via a sealing material and a liquid crystal is injected between the substrates. In the method for manufacturing a display device, an alignment is performed in which one of the substrates is pressed with a predetermined pressure on the other substrate via the uncured sealing material, and one of the substrates is aligned with the other of the substrates. And a curing step of at least semi-curing the sealing material under a pressure substantially equal to the predetermined pressure.

According to this means, the alignment is performed in a state where one substrate and the other substrate are pressed against each other in the alignment step, and in the subsequent curing step, the pressure is almost the same without substantially changing the pressure during the alignment. Since the sealing material is cured in the state of being pressed by pressure, the occurrence of positional deviation after alignment can be suppressed, so that misalignment between substrates is prevented, and the accuracy and uniformity of the substrate spacing are also improved. Can be improved.

Here, before the alignment step, there is provided a positioning step of roughly positioning one of the substrates with respect to the other substrate in a state where the substrate is pressurized at a pressure lower than the predetermined pressure. Is preferred.

According to this means, in the positioning step, the positioning is performed in a state where the sealing material is pressed under a low pressure, so that the positioning is performed without greatly deforming the sealing material and without applying a large stress. Therefore, accurate alignment can be performed quickly and without impairing the sealing performance of the seal portion.

On the other hand, in a manufacturing apparatus for a liquid crystal display device in which two substrates are bonded via a photocurable sealing material and a liquid crystal is injected between the substrates, one of the substrates is not In a liquid crystal display device manufacturing apparatus for press-fitting the other substrate with a predetermined pressure via the cured sealing material at a predetermined pressure to make the sealing material at least semi-cured, A pressing base having a pressing surface for pressing against the substrate, and the pressing surface of the pressing base is disposed on the opposite side to the pressing surface, and when aligning one substrate with respect to the other substrate, Light detecting means for detecting light from the substrate and light irradiating means for light curing the sealing material; and pressing for relatively moving the pressing base in a pressing direction of the pressing surface with a predetermined pressure. Transportation means Positioning means for relatively moving the pressing surface in the direction of the installation plane of the substrate is provided, and the crimping base is at least from the pressing surface to the installation side of the light detection means and the light irradiation means. It is characterized by having a translucency.

According to this means, when one of the substrates is pressed against the other substrate by the pressing surface of the pressing base,
Because it is configured to have a light transmitting property from the pressing surface of the pressure bonding base to the installation position of the light detection unit and the light irradiation unit,
The position deviation between the substrates can be observed at any time by the light detection means, and the sealing material can be cured at any time by the light irradiation means. The positioning between the substrates can be corrected by the positioning means, the misalignment between the substrates can be reduced, and the substrates can be pressure-bonded with high accuracy.

Here, the pressure-bonding base has a suction port formed on the pressing surface for sucking one of the substrates, and is communicated from the suction port to a position closer to the periphery than the plane position of the pressing surface. A suction passage formed so as to be disengaged, and an exhaust passage connected to the suction passage at a position on the installation side of the light detection unit and the light irradiation unit, which is deviated to a peripheral side from a plane position of the pressing surface. Preferably, it is provided.

According to this means, the one substrate can be pressed against the other substrate while being held by the suction action. Here, the suction passage connected to the suction port is formed so as to deviate from the plane position of the pressing surface to the peripheral side,
Since it is connected to the exhaust path at this deviated position, there is no hindrance to the observation of the substrate position by the light detection means and the curing treatment by the light irradiation means.

[0017] Further, in a state where one of the substrates is pressed against the other substrate by the pressing and moving means, the planar position of one of the substrates is aligned with the other substrate by the positioning means, Then, it is preferable that the light irradiation unit is configured to at least partially cure the sealing material.

According to this means, since the planar position of the substrate is aligned in the pressed state, and then the sealing material is cured, misalignment between the substrates can be reduced.

[0019]

Next, an embodiment according to the present invention will be described with reference to the accompanying drawings. FIG. 1 shows a schematic structure of a liquid crystal display device manufacturing apparatus (substrate bonding apparatus) according to an embodiment of the present invention.

In this embodiment, the XY table 1
The cushioning material 11 is placed on the upper surface of the cushioning member 0, and a large-sized substrate 31 made of glass or the like is arranged on the surface of the cushioning material 11. On the surface of the large-sized substrate 31, a sealing material 32 made of an ultraviolet curable resin is applied in advance by a dispenser or the like so as to surround the liquid crystal sealing region. A spacer (not shown) is mixed in the sealing material. A small substrate 33 made of glass or the like is pressed on the sealing material 32 by a pressing head 20 described later, and thereafter, the sealing material 32 is in a semi-cured state.

The pressure bonding head 20 can be raised and lowered by a lifting mechanism (not shown) and a pressing mechanism using hydraulic pressure, pneumatic pressure or the like, and apply a controlled pressure between the large-sized substrate 31 and the small-sized substrate 33. It is configured to be able to. The crimping head 20 is provided with a [theta] positioning mechanism for rotatably rotating itself about a vertical axis.
The X and Y direction adjustment mechanisms are configured to perform the alignment described later.

The crimping head 20 is composed of a crimping base 21 made of a translucent material such as glass, and a translucent plate made of a translucent material such as glass which is stacked on the crimping base 21 via a packing 23. 24, a plurality of alignment cameras 25 disposed above the translucent plate 24, and light emitted from an ultraviolet lamp for irradiating ultraviolet rays from above the translucent plate 24 is guided by an optical fiber 26a. And a light irradiation unit 26 configured to irradiate the light.

On the bottom surface of the crimping base 21, a pressing surface portion 21a having substantially the same area as that of the small rectangular substrate 33 of 1.3 inches is formed. The pressing surface 21a has a small substrate 3
A frame-shaped portion formed on the outer edge of the bottom surface portion of the pressure-bonding base 21 so as to abut on the upper surface of the contact region for the seal material of 3
An intake recess formed on the inside is provided.
The intake concave portion communicates with an intake hole 21b formed so as to vertically penetrate a substantially central portion of the crimping base 21. The periphery of the pressing surface portion 21a of the pressure-bonding base 21 is covered with the light shielding plate 22. When the sealing material described later is semi-cured, another sealing material corresponding to the other small substrate 33 around the same is hardened. Preventing.

The upper opening of the air intake hole 21b is opened in a gap provided between the air intake hole 21b and the light transmissive plate 24. This gap communicates with the air intake hole 24a provided in the light transmissive plate 24. ing. The intake hole 24a is formed at a position shifted outward from the plane position of the pressing surface portion 21a, and is connected to an exhaust pipe 27 connected to an exhaust device (not shown). The suction hole 21b, the gap, and the suction hole 24a are formed on the pressing surface 21a.
The intake passage is formed so as to be deviated from the inside of the plane position to the outside.

When the exhaust valve of the exhaust device (not shown) is opened, the air is exhausted from the intake recess through the intake passage formed by the intake hole 21b, the gap, and the intake hole 24a. For this reason, the small-sized board | substrate 33 can be made to adsorb | suck to the pressing surface part 21a of the said press-bonding base 21.

Next, the operation of the device having the above structure will be described. First, the small substrate 33 is placed at a feeding position (not shown).
Then, the pressure bonding head 20 is moved onto the large-sized substrate 31 and lowered in accordance with the position of the sealing material 32 applied in advance. Next, the pressure bonding head 20 is lowered so that the outer edge of the small substrate 33 contacts the sealing material 32, and the small substrate 33 is pressed against the large-sized substrate 31.

When the position of the pressure bonding head 20 is stabilized, the position of the XY table is corrected by the alignment camera 25 so that alignment marks (not shown) of the small substrate 33 and the large-sized substrate 31 are aligned. By correcting the rotation direction of the pressure bonding base 21 by the positioning mechanism, alignment is performed so that the small-sized substrate 33 is pressed against the large-sized substrate 31 at a regular position.

Next, the sealing material is semi-cured by irradiating ultraviolet rays from the light irradiating section 26. As will be described later, the degree of curing of the sealing material is set according to the degree of warpage or dent of the glass substrate, in particular, the small substrate 33 in the liquid crystal cell to be formed. When the semi-curing of the sealing material is completed, the exhaust valve of the exhaust device (not shown) is closed, and the pressing surface 20a is separated from the small substrate 33 by raising the pressure bonding head 20. In this way, the above-described apparatus is used for the large-sized substrate 3.
The configuration is such that a plurality of small substrates 33 are sequentially pressed to a predetermined position on one.

FIG. 2 shows the pressed state of the pressure bonding head 20. When the pressure bonding head 20 descends to press the small substrate 33 against the large-sized substrate 31, the pressure bonding head 20 first holds the pressing force at about 4 kg, during which the small substrate 3 is pressed.
Step 3 is performed for the large-sized substrate 31 to perform a general position correction. For example, in this step, using the above-mentioned alignment camera 25 or another position sensor, the small substrate 3
3 is 5 μm in positional deviation from the normal position on the large-size substrate 31.
m to be within m. The processing time of this step is about 1 second.

Next, the pressure of the pressure bonding head 20 is increased to about 8 kg, and thereafter, the pressure is kept constant. In this state, a step for alignment is executed. In this step, the plane position of the small substrate 33 is
The correction is made so that the error is within 1 μm with respect to 1.
The processing time of this step is about 6 seconds.

Subsequently, a step for semi-curing the sealing material 32 is executed while maintaining the pressing force of the pressure bonding head 20 as it is. In this step, the light irradiation unit 2
UV light is applied from step 6 to cure the sealing material to a predetermined extent within a range that does not completely cure the sealing material. The processing time of this step is about 7 seconds.

In this embodiment, coarse position correction is performed in a state where the substrate is pressed against the substrate with a small pressing force in a step, and then high-precision position correction is performed in a state where the final pressing force is applied in a step. Thereafter, in a step, the sealing material is semi-cured by irradiating light without changing the pressurized state.

In the step, the position can be easily corrected due to the low pressing force, and the large correction can be easily performed without causing a large deformation of the sealing material and without applying a large stress. In addition, in the step, since alignment is performed with the final pressing force or a pressing force close to the final pressing force, there is almost no change in the pressure-bonding state between the substrates even after the alignment, and finally the liquid crystal cell assembly that has been completely pressed. It is possible to prevent occurrence of a shift (a shift in a plane direction between two substrates).

Since the pressure is hardly changed from step to step, the sealing material can be hardened while maintaining the alignment accuracy performed in the step. Where, for example,
As shown by the dashed line in FIG. 2, when the pressure of the step is large and the pressure is reduced in the step, the substrate is lifted at the seal portion, resulting in poor sealing, variation in cell thickness, misalignment of the substrate, and the like. Conversely, as shown by the dotted line in FIG. 2, if the pressing force of the step is higher than the pressing force of the step, the misalignment occurs again in the step by increasing the pressing force after that, even if the angle alignment is performed in the step. There is a disadvantage of doing so.

In the present embodiment, the small substrate 33 is pressed by the crimping base 21 so that the small substrate 33 is pressed.
Is deformed in a downward convex shape, and the large-sized substrate 31 is also deformed in a downward convex shape due to the deformation of the cushioning material 11. If the pressure applied by the pressure bonding head 20 is somewhat large, the small substrate 33
Since the amount of deformation of the large substrate 31 is larger than the amount of deformation of the large substrate 31, as shown on the left side of FIG. The gap increases. When the pressing force is released in this state, the sealing material is incompletely hardened, and there is a certain binding force against the deformation of the substrate, and the pressing force forcibly deforms the substrate. Due to the presence of the restoring force of the substrate, the warpage of the substrate is reduced to a substantially flat state as shown on the right side of FIG. 3A, and the cell gap of the liquid crystal cell is also made uniform. You.

However, as shown on the left side of FIG. 3B, when the pressing force is too large and the amount of warpage of the large substrate 31 becomes too large, as shown on the right side of FIG. Even after the pressure is released after curing, the substrate may remain warped. Also, such residual warpage of the substrate is caused by
In particular, when the sealing material is excessively hardened, a similar problem occurs because the deformation of the substrate in the pressurized state is difficult to be eliminated by the binding force of the sealing material.

Unlike the present embodiment, the present embodiment is different from the present embodiment in the case where small substrates are pressure-bonded to each other, or when a plurality of small substrates are pressed on a large substrate by a large and flat integrated pressing surface. It has a different appearance. That is, while the upper substrate is deformed in a downwardly convex shape by the pressing force at the time of press bonding, when the small substrates are pressed together, almost no force is generated to deform the lower substrate,
When a plurality of small substrates are integrally pressed on a large substrate, the force for deforming the lower substrate is weak. Therefore, in any case, the amount of deformation of the lower substrate is small, and the lower substrate in FIG. As shown in (1), the cell gap at the center of the liquid crystal cell is smaller than that at the periphery. When the pressure is released in this state, FIG.
As shown on the right side of (c), the upper substrate is deformed from the recessed state toward the warped state when released.

When the pressing force of the pressure bonding head 20 is small, as shown on the left side of FIG. 3D, the substrate is almost flat and the cell gap is uniform, but when the pressing force is released, Due to the inherent distortion of the substrate,
As shown on the right side of FIG. 3D, the substrate may have a slightly warped shape, or may have a concave shape.

Conversely, if the pressing force of the pressure bonding head 20 becomes considerably large, the substrate becomes largely concave as shown on the left side of FIG. 3E, and in this state, the curing of the sealing material 32 proceeds excessively. Even if the pressure is released, FIG.
As shown on the right side of FIG.

As described above, in the present embodiment, the semi-curing of the sealing material causes an effect of restoring the deformation of the substrate when the pressing force is released. The distortion of the liquid crystal cell can be reduced. Therefore, without worrying about the deformation of the liquid crystal cell,
At the time of pressure bonding, it is possible to apply pressure to a certain degree in order to surely obtain a desired cell gap, and it is also possible to reduce poor pressure bonding of the substrate.

The amount of restoration at the time of releasing the above pressing force is as follows:
It depends on the degree of curing of the sealing material. FIG. 4 shows the relationship between the amount of warpage of the liquid crystal cell and the light irradiation time in this embodiment. In the present embodiment, if the light irradiation time on the sealing material is too short, the binding force of the substrate by the sealing material is too small, and the warpage (or dent amount) of the substrate due to the original distortion of the small substrate 33 Increases. On the other hand, if the light irradiation time on the sealing material is too long, the sealing material is too hardened, the binding force is increased, and the warped state of the substrate at the time of pressurization is maintained, and the liquid crystal cell exhibits large warpage. Become.

In the region A shown in FIG. 4, the amount of warpage of the substrate is small, and the variation in the amount of warpage is small, so that a stable cross-sectional shape of the liquid crystal cell can be obtained. In this case, the area A
In (2), a slight warp exists in the substrate, and the formed liquid crystal cell has a slightly large cell gap at the center. However, when forming a liquid crystal display, it is better to have a slight warp on the substrate in the state of an empty cell,
More preferred than when the substrate is completely flat.
This is because in the subsequent liquid crystal injection step, the inside of the liquid crystal cell is decompressed and the liquid crystal is injected by the pressure difference between the inside and outside, so that the liquid crystal can be injected smoothly if the substrate is slightly warped. This is because an almost flat liquid crystal cell tends to be formed after liquid crystal injection.

FIG. 5 shows the amount of warpage of the liquid crystal cell and the light applied to the sealing material when the small substrates are pressed together or when a plurality of small substrates are pressed on a large substrate by a large and flat integrated pressing surface. The relationship with the irradiation time is shown. Here, a region above the horizontal axis indicates a case where the substrate is warped, and a region below the horizontal axis indicates a case where the substrate is concave.

In this case, the amount of warpage of the liquid crystal cell decreases almost linearly by increasing the light irradiation time to the sealing material, and the formed liquid crystal cell eventually has a cross section with a concave central portion. It takes on a shape. Again, in this case,
As shown as a region B in FIG. 5, it is preferable to adjust the light irradiation time and set the degree of curing of the sealing material so that the amount of warpage of the liquid crystal cell is small. The dotted line in FIG. 5 shows the amount of warpage when the pressure of the pressure bonding head is increased.

The liquid crystal cell temporarily cured as described above is fully cured in a free state without applying pressure. This main curing step is performed separately in a first stage shown in FIG. 6 and a second stage shown in FIG. In this step, by completely curing the sealing material, the shape of the liquid crystal cell formed in an almost ideal state in the above-mentioned temporary curing step is hardly deformed so as to withstand external force. Further, as will be described later, by performing the process using an apparatus provided with a cooling mechanism in this step, it is possible to suppress overheating of the substrate and prevent displacement of the substrate that occurs when the sealing material is cured.

In the first stage, as shown in FIG.
A liquid crystal cell in a state in which a plurality of small substrates 33 are bonded on a large-sized substrate 31 via a sealing material 32 is placed on a cooling stage
And ultraviolet light is irradiated from above by an ultraviolet lamp 41. The cooling stage 40 is made of a surface material having high thermal conductivity, and cooling water is circulated inside the cooling stage 40 to constantly cool the stage surface. Cooling air is blown from the air nozzle 42 along the installation surface of the liquid crystal cell from obliquely above the liquid crystal cell. The entire curing device is sealed by a hood or a casing of the device, and an exhaust duct (not shown) is attached.

The first stage is a large-size substrate 31 of a liquid crystal cell.
In order to cure the photocurable conductive resin (such as a mixture of photocurable resin and conductive particles) applied on the upper electrode pad, a small substrate is used so that the conductive resin does not shadow the electrode pad. This is mainly provided because it is necessary to irradiate light from the 33 side. However, in the first stage, the curing of the sealing material 32 also proceeds at the same time.

In the second stage, as shown in FIG.
A liquid crystal cell is placed on a cooling stage 50 having a light transmitting property, and an ultraviolet lamp 55 is arranged on the back side of the cooling stage 50 to irradiate light. Cooling stage 5
No. 0 secures the cooling performance by fixing two translucent plates 51 and 52 made of glass or the like via a packing 53 and flowing cooling water between the translucent plates 51 and 52. In addition, it is provided with a light-transmitting property. The air nozzle 54 blows cooling air onto the small substrate 33 in the same manner as described above, and the device is also sealed from the surroundings and has an exhaust duct as described above.

In the second stage, light is radiated from the large-sized substrate 31 side of the liquid crystal cell and the light irradiation side is mainly cooled, so that the cooling efficiency becomes better than in the first stage, The sealing material 32 can be cured without overheating the cell.

As described above, the curing step includes the first step and the second step.
By irradiating light from both the front and back surfaces of the liquid crystal cell into two stages, the efficiency of light irradiation on the sealing material 32 can be improved, and the sealing material 32 can be uniformly cured in a short time. Further, since the light curing of the sealing material can be efficiently performed in this manner, overheating of the liquid crystal cell can be prevented.

In the above-mentioned main curing step, cooling is performed as described above, and the ultraviolet lamps 41 and 5 are further cooled.
By intermittently irradiating light from 5, overheating of the liquid crystal cell is prevented. In the present embodiment, light irradiation is intermittently performed at a period of 100 seconds as shown by a dotted line in FIG.
As a result, the temperature of the liquid crystal cell rises and falls periodically as shown by the solid line in FIG. 8, and even if irradiation is continued for a long time, the temperature does not rise unnecessarily unlike the conventional case. For this reason, even if the light irradiation amount is increased, overheating of the liquid crystal cell can be prevented.

The intermittent period of the light irradiation is appropriately set according to the heat radiation of the liquid crystal cell. By optimizing the intermittent cycle and the light irradiation intensity, the curing can be completed quickly without overheating the liquid crystal cell. This light irradiation does not necessarily have to be intermittent, and the same effect can be obtained by increasing or decreasing the light irradiation intensity.

In the manufacturing method of the above embodiment, the sealing material is semi-cured in the temporary curing step and the sealing material is completely cured in the main curing step. However, the present invention is applied to such a manufacturing method. It is not limited to
For example, the present invention can be applied to a method of completely curing a sealing material at a time. However, in the method adopted in the present embodiment, the sealing material is allowed to have a certain degree of restraining force to prevent complete restoration while allowing the restoring of the substrate to some extent, so that the pressure-bonding head can be used. The substrate deformed by pressurization is restored to a certain extent when the pressure is released, and a cell shape that is as flat as possible is formed in the restored state. By this method, a more ideal cell shape can be reproduced. Can get better.

In the manufacturing method of the above embodiment, the present invention is applied to a manufacturing process set so that a plurality of small substrates are pressed against a large-sized substrate, but the present invention is applied to such a manufacturing process. The present invention is not limited to this, and can be applied to a manufacturing process of crimping large-sized substrates including a plurality of liquid crystal displays or a manufacturing process of crimping small substrates together to form a single liquid crystal display. Further, the present invention is not limited to the case where the small substrates are pressure-bonded one by one. For example, FIG.
As described with reference to FIGS. 5A to 5E and FIG. 5, a plurality of small substrates are crimped at a time, or a crimping head having a flat pressing surface is used to crimp a manufacturing process. Is also applicable.

[0055]

As described above, according to the present invention, the following effects can be obtained.

According to the first aspect, the alignment is performed in a state where one substrate and the other substrate are pressed against each other in the alignment step, and in the subsequent curing step, the pressure is substantially the same without substantially changing the pressure during the alignment. Since the sealing material is cured in the state where it is pressed with pressure, the occurrence of misalignment after alignment can be suppressed, so that misalignment between substrates can be prevented, and the accuracy and uniformity of substrate spacing can be prevented. Can also be improved.

According to the second aspect, in the positioning step, the positioning is performed in a state of being pressed with a low pressure, so that the sealing material is not greatly deformed and the position is not applied with a large stress. Since alignment can be performed, accurate alignment can be performed quickly and without impairing the sealing performance of the seal portion.

According to the third aspect, when one substrate is pressed against the other substrate by the pressing surface of the pressing base,
Because it is configured to have a light transmitting property from the pressing surface of the pressure bonding base to the installation position of the light detection unit and the light irradiation unit,
The position deviation between the substrates can be observed at any time by the light detection means, and the sealing material can be cured at any time by the light irradiation means. The positioning between the substrates can be corrected by the positioning means, the misalignment between the substrates can be reduced, and the substrates can be pressure-bonded with high accuracy.

According to the fourth aspect, the one substrate can be pressed against the other substrate while being held by the suction action. Here, the suction passage connected to the suction port is formed so as to deviate from the plane position of the pressing surface to the peripheral side,
Since it is connected to the exhaust path at this deviated position, there is no hindrance to the observation of the substrate position by the light detection means and the curing treatment by the light irradiation means.

According to the fifth aspect, the planar position of the substrate is aligned in the pressed state, and then the sealing material is cured, so that misalignment between the substrates can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a liquid crystal display device manufacturing apparatus according to the present invention.

FIG. 2 is a time chart showing a pressing force in a temporary curing step in the embodiment of the method for manufacturing a liquid crystal display device according to the present invention.

FIGS. 3A to 3E are conceptual explanatory views for explaining a cross-sectional shape of a liquid crystal cell at the time of pressurization in a temporary curing step and after the pressure is released.
It is.

FIG. 4 is a graph showing the relationship between the amount of warpage of the liquid crystal cell and the light irradiation time in the temporary curing step in the embodiment.

FIG. 5 is a graph showing the relationship between the amount of warpage of the liquid crystal cell and the light irradiation time in the temporary curing step in a method different from the above embodiment.

FIG. 6 is an apparatus configuration diagram showing a processing state in a first stage of a main curing step in the embodiment.

FIG. 7 is an apparatus configuration diagram showing a processing state in a second stage of a main curing step in the embodiment.

FIG. 8 is a graph showing a light irradiation cycle and a temperature change of a liquid crystal cell in a main curing step in the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 XY table 11 Buffer material 20 Crimping head 21 Crimping base 21a Pressing surface part 21b Suction hole 24 Translucent plate 24a Suction hole 25 Alignment camera 26 Light irradiation part 27 Exhaust pipe

Claims (5)

[Claims] 1. Two substrates are stuck together via a sealing material,
In a method for manufacturing a liquid crystal display device in which a liquid crystal is injected between the substrates, one of the substrates is pressurized at a predetermined pressure with respect to the other substrate via the uncured sealing material. A liquid crystal display comprising: an alignment step of aligning a substrate with respect to the other substrate; and a curing step of at least partially curing the sealing material while being pressed at a pressure substantially similar to the predetermined pressure. Device manufacturing method. 2. The alignment according to claim 1, wherein prior to the alignment step, one of the substrates is roughly aligned with the other under a pressure lower than the predetermined pressure. A method for manufacturing a liquid crystal display device, comprising: 3. A manufacturing apparatus for a liquid crystal display device comprising two substrates adhered to each other via a photocurable sealing material and injecting a liquid crystal between the substrates, wherein one of the substrates is not mounted. An apparatus for manufacturing a liquid crystal display device for press-fitting a predetermined pressure to the other substrate via the cured sealing material to make the sealing material at least semi-cured, wherein one of the substrates is the other A pressing base having a pressing surface for pressing against the substrate, and the pressing surface of the pressing base is disposed on the opposite side to the pressing surface, and when aligning one substrate with respect to the other substrate, Light detecting means for detecting light from the substrate and light irradiating means for light curing the sealing material; and pressing for relatively moving the pressing base in a pressing direction of the pressing surface with a predetermined pressure. Transportation and front Positioning means for relatively moving the pressing surface in the direction of the installation plane of the substrate, wherein the pressing base is transparent at least from the pressing surface to the installation side of the light detection means and the light irradiation means. An apparatus for manufacturing a liquid crystal display device, which is configured to have optical properties. 4. The pressing base according to claim 3, wherein the pressing base is formed on the pressing surface, and is connected to a suction port for sucking the one of the substrates, and is connected to the suction port so as to be closer to a plane position of the pressing surface. And a suction passage formed so as to be deviated to the peripheral side, and connected to the suction passage at a position deviated to a peripheral side from a plane position of the pressing surface on the installation side of the light detection unit and the light irradiation unit. An apparatus for manufacturing a liquid crystal display device, comprising: an exhaust path. 5. The apparatus according to claim 3, wherein, in a state where one of the substrates is pressed against the other substrate by the pressing and moving means, the plane position of one of the substrates is moved to the other of the substrates by the positioning means. To the alignment,
Thereafter, the manufacturing apparatus of the liquid crystal display device is configured to at least partially cure the sealing material by the light irradiation unit.