JPH11281543A - Sample stage and particle size-measuring apparatus using the sample stage - Google Patents

Sample stage and particle size-measuring apparatus using the sample stage

Info

Publication number
JPH11281543A
JPH11281543A JP10103354A JP10335498A JPH11281543A JP H11281543 A JPH11281543 A JP H11281543A JP 10103354 A JP10103354 A JP 10103354A JP 10335498 A JP10335498 A JP 10335498A JP H11281543 A JPH11281543 A JP H11281543A
Authority
JP
Japan
Prior art keywords
angle
measured
sample
information
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10103354A
Other languages
Japanese (ja)
Other versions
JP4128262B2 (en
Inventor
Yuzo Mori
勇蔵 森
Shinichiro Watanabe
伸一郎 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jasco Corp
Japan Science and Technology Agency
Original Assignee
Jasco Corp
Japan Science and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jasco Corp, Japan Science and Technology Corp filed Critical Jasco Corp
Priority to JP10335498A priority Critical patent/JP4128262B2/en
Publication of JPH11281543A publication Critical patent/JPH11281543A/en
Application granted granted Critical
Publication of JP4128262B2 publication Critical patent/JP4128262B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Abstract

PROBLEM TO BE SOLVED: To correctly readjust an up-down positional deviation of a face to be measured by moving a sample-holding plate so that the position information obtained by a position determination means becomes a predetermined true position. SOLUTION: When an angle of a face to be measured is shifted from when an optimum focal position is set, two keen position detectors PSD 142, 144 are arranged so as to correctly obtain a positional information. A position is determined with taking into consideration an angle information of the face to be measured which is obtained from an output voltage difference C of the detectors. The obtained angle information is compared by a CPU 246 with the angle when the optimum focal position is set. When the obtained angle information is judged to be shifted from a predetermined angle, a position of the face to be measured when regularly reflecting is estimated from the angle information and an output voltage A of the PSD 142, and set as a true position of the face to be measured. On the contrary, when the angle information is judged not to contain errors, a temporary position information is set as a true position information. The obtained position information and the position information when the optimum focal position is set are compared by the CPU 246. If the obtained position information is judged to error, a control circuit 138 makes a rectangular movement means 148 move a sample-holding plate 128 in a Z direction so that the position information determined by the CPU 246 becomes the optimum focal position.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は試料ステージ及びそ
れを用いた粒径計測装置、特に試料ステージの上下位置
の制御機構の改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sample stage and a particle size measuring apparatus using the same, and more particularly to an improvement in a mechanism for controlling the vertical position of the sample stage.

【0002】[0002]

【従来の技術】従来、例えばパターン未形成シリコンウ
エハ上のナノメータオーダの粒子直径を計測するため、
各種の粒径計測装置が用いられている。
2. Description of the Related Art Conventionally, for measuring a particle diameter on the order of nanometer on a silicon wafer on which a pattern is not formed, for example,
Various particle size measuring devices are used.

【0003】図1に示すように、かかる粒径計測装置1
0は、レーザ光L1を出射する光源12と、レーザ光L
1を収束する凸レンズ14と、シリコンウエハ等の試料
16が装填される試料ステージ18と、レーザ光L1の
微粒子19よりのレーリ散乱光L2を検出器20に集光
する集光器22と、検出器20で得た散乱光の強度変化
より粒径を計測する検出回路24を備える。このように
して粒径計測装置10を構成することにより、シリコン
ウエハ等の試料16に付着した微粒子19の直径を計測
することができる。
[0003] As shown in FIG.
0 is the light source 12 for emitting the laser light L1, and the laser light L
1, a sample stage 18 on which a sample 16 such as a silicon wafer is loaded, a condenser 22 for condensing Rayleigh scattered light L2 of laser light L1 from fine particles 19 on a detector 20, A detection circuit 24 is provided for measuring the particle diameter from the intensity change of the scattered light obtained by the detector 20. By configuring the particle size measuring device 10 in this manner, the diameter of the fine particles 19 attached to the sample 16 such as a silicon wafer can be measured.

【0004】ところで、シリコンウエハ上の異物である
微粒子19を検出する際、収束レーザ光L1を被測定面
上の任意方向、XY方向に走査する必要がある。このた
めに、試料ステージ18は、試料16が装填される試料
保持板28と、X軸モータ30と、Y軸モータ32と、
駆動回路34,36と、制御回路38を備える。そし
て、制御回路38は、駆動回路34,36に指示を与
え、X軸モータ30、Y軸モータ32の動作を制御する
ことにより、試料保持板28上の試料16をXY方向に
移動させる。これにより、レーザ光L1をXY方向に走
査するのである。なお、正反射光L3は、集光器22の
外へ出す構造となっている。
When detecting the fine particles 19 as foreign matter on the silicon wafer, it is necessary to scan the convergent laser beam L1 in an arbitrary direction on the surface to be measured, that is, in the XY directions. To this end, the sample stage 18 includes a sample holding plate 28 on which the sample 16 is loaded, an X-axis motor 30, a Y-axis motor 32,
Drive circuits 34 and 36 and a control circuit 38 are provided. Then, the control circuit 38 gives instructions to the drive circuits 34 and 36 to control the operations of the X-axis motor 30 and the Y-axis motor 32, thereby moving the sample 16 on the sample holding plate 28 in the XY directions. Thus, the laser beam L1 is scanned in the XY directions. Note that the regular reflection light L3 has a structure to exit the light collector 22.

【0005】[0005]

【発明が解決しようとする課題】ところで、微粒子19
よりのレーリ散乱光L2を検出するためには、被測定面
に焦点を合わせなければならない。このため、一般に、
測定前、被測定面の特定部位の焦点合わせを行ってい
た。
The fine particles 19
In order to detect the Rayleigh scattered light L2, the surface to be measured must be focused. For this reason, in general,
Prior to the measurement, a specific portion of the surface to be measured was focused.

【0006】しかしながら、前記焦点合わせ後、従来の
試料ステージ18を用いた粒径計測装置10では、一般
に試料ステージ18をXY方向へのみ移動させながら検
出を行っていたため、試料16の状態が悪く測定面にう
ねりがあったり、試料ステージ18の精度が悪いと、走
査中に被測定面の上下位置が最適焦点位置よりZ方向に
ずれてしまう。このため、焦点が被測定面に合っていな
い状態で測定をしたり、又は測定を中断して焦点を合わ
せるための微妙な再調整を手動的にしなければならず、
面倒であった。
However, after the focusing, the particle size measuring apparatus 10 using the conventional sample stage 18 generally performs detection while moving the sample stage 18 only in the X and Y directions. If the surface has undulation or the accuracy of the sample stage 18 is poor, the vertical position of the surface to be measured is shifted from the optimum focus position in the Z direction during scanning. For this reason, it is necessary to perform the measurement in a state where the focus is not on the surface to be measured, or to manually perform a delicate readjustment for focusing by stopping the measurement,
It was troublesome.

【0007】本発明は、前記従来技術の課題に鑑みなさ
れたものであり、その目的は、被測定面の上下位置が所
定の位置よりずれた場合であっても、それを正確に再調
整することが容易にできる試料ステージ及びそれを用い
た粒径計測装置を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the related art, and has as its object to accurately readjust even if the vertical position of the surface to be measured is shifted from a predetermined position. It is an object of the present invention to provide a sample stage which can easily perform the measurement and a particle size measuring device using the same.

【0008】[0008]

【課題を解決するための手段】前記目的を達成するため
に、本発明に係る試料ステージは、試料を保持する試料
保持板を、試料の被測定面に対し平行方向へ移動可能な
平行移動手段を備えた試料ステージにおいて、直角移動
手段と、位置検出手段と、角度検出手段、位置決定手段
と、ステージ制御手段と、を備えたことを特徴とする。
In order to achieve the above-mentioned object, a sample stage according to the present invention comprises a parallel moving means for moving a sample holding plate for holding a sample in a direction parallel to a surface to be measured of the sample. In the sample stage provided with the above, a right angle moving means, a position detecting means, an angle detecting means, a position determining means, and a stage control means are provided.

【0009】前記直角移動手段は、前記試料保持板を被
測定面に対し直角方向へ移動可能なものである。前記位
置検出手段は、前記被測定面よりの反射光を受光し、該
反射光の受光位置より、被測定面の仮の位置情報を得る
ためのものである。前記角度検出手段は、前記反射光を
受光し、該反射光の受光位置より被測定面の角度情報を
得るためのものである。
The right-angle moving means is capable of moving the sample holding plate in a direction perpendicular to the surface to be measured. The position detecting means is for receiving reflected light from the surface to be measured and obtaining temporary position information of the surface to be measured from the light receiving position of the reflected light. The angle detecting means is for receiving the reflected light and obtaining angle information of the surface to be measured from a light receiving position of the reflected light.

【0010】前記位置決定手段は、前記角度検出手段で
得た角度情報と所定の角度情報とを比較し、誤差なしと
判断したときは、前記位置検出手段で得た位置情報をそ
のまま真の位置情報とし、また誤差ありと判断したとき
は、該誤差に基づいて前記位置検出手段で得た位置情報
を校正して真の位置情報とする。ここでいう「所定の角
度情報」とは、例えば最適焦点位置の設定時における被
測定面の角度をいう。
The position determining means compares the angle information obtained by the angle detecting means with predetermined angle information. If it is determined that there is no error, the position information obtained by the position detecting means is used as the true position. Information, and when it is determined that there is an error, the position information obtained by the position detecting means is calibrated based on the error to be true position information. The “predetermined angle information” here refers to, for example, the angle of the surface to be measured at the time of setting the optimum focus position.

【0011】前記ステージ制御手段は、前記位置決定手
段で得た位置情報が所定の位置となるように、前記直角
移動手段により試料保持板を移動させる。また、前記目
的を達成するために、本発明に係る試料ステージは、試
料を保持する試料保持板を、試料の被測定面に対し平行
へ移動可能な平行移動手段を備えた試料ステージにおい
て、直角移動手段と、角度変更手段と、角度検出手段
と、位置検出手段と、ステージ制御手段と、を備えたこ
とを特徴とする。
The stage control means moves the sample holding plate by the right-angle moving means so that the position information obtained by the position determining means becomes a predetermined position. In order to achieve the above object, a sample stage according to the present invention is characterized in that a sample holding plate for holding a sample is provided at a right angle with a sample stage provided with a parallel moving means capable of moving the sample holding plate in parallel to a measured surface of the sample. It is characterized by comprising a moving means, an angle changing means, an angle detecting means, a position detecting means, and a stage control means.

【0012】前記直角移動手段は、前記試料保持板を被
測定面に対し直角方向へ移動可能なものである。前記角
度変更手段は、前記試料保持板の角度を変更可能なもの
である。前記角度検出手段は、前記被測定面よりの反射
光を受光し、該反射光の受光位置より被測定面の角度情
報を得るためのものである。
The right-angle moving means is capable of moving the sample holding plate in a direction perpendicular to the surface to be measured. The angle changing means can change the angle of the sample holding plate. The angle detection means is for receiving reflected light from the surface to be measured and obtaining angle information of the surface to be measured from a light receiving position of the reflected light.

【0013】前記位置検出手段は、前記反射光を受光
し、該反射光の受光位置より、被測定面の位置情報を得
るためのものである。前記ステージ制御手段は、前記角
度検出手段で得た角度情報が所定の角度となるように、
前記角度変更手段により試料保持板を傾斜させた後、前
記位置検出手段で得た位置情報が所定の位置となるよう
に、前記直角移動手段により該試料保持板を移動させ
る。
The position detecting means is for receiving the reflected light and obtaining position information of the surface to be measured from the light receiving position of the reflected light. The stage control means, so that the angle information obtained by the angle detection means is a predetermined angle,
After the sample holding plate is tilted by the angle changing unit, the sample holding plate is moved by the right-angle moving unit so that the position information obtained by the position detecting unit becomes a predetermined position.

【0014】なお、前記試料ステージにおいて、前記被
測定面よりの反射光を2分割し、その一方の光を前記位
置検出手段に入射させ、その他方の光を前記角度検出手
段に入射させるビームスプリッタを備えることが好適で
ある。また、前記目的を達成するために、本発明に係る
粒径計測装置は、前記本発明に係る試料ステージにおい
て、粒径計測手段を備えたことを特徴とする。前記粒径
計測手段は、収束レーザ光を被測定面に照射して走査し
ながら粒子からのレーリ散乱光を検出し、該粒子からの
散乱光強度よりその粒径を計測する。
In the sample stage, a reflected beam from the surface to be measured is divided into two parts, one of which is incident on the position detecting means and the other is incident on the angle detecting means. It is preferable to provide In order to achieve the above object, a particle size measuring apparatus according to the present invention is characterized in that the sample stage according to the present invention includes a particle size measuring means. The particle size measuring means detects the Rayleigh scattered light from the particles while irradiating the surface to be measured with the convergent laser light and scans the particles, and measures the particle size from the intensity of the scattered light from the particles.

【0015】[0015]

【発明の実施形態】以下、図面に基づき本発明の好適な
実施形態を説明する。第1実施形態 図2には本発明の第1実施形態に係る粒径計測装置の概
略構成の図が示されいる。なお、前記図1と対応する部
分には符号100を加えて示し説明を省略する。同図に
示す粒径計測装置110は、光源112と、凸レンズ1
14と、検出器120と、集光器122と、検出回路1
24と、水平移動手段であるX軸モータ130、Y軸モ
ータ132及び駆動回路134,136を備える。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. First Embodiment FIG. 2 is a diagram showing a schematic configuration of a particle size measuring apparatus according to a first embodiment of the present invention. The portions corresponding to those in FIG. 1 are denoted by reference numeral 100, and description thereof is omitted. A particle size measuring device 110 shown in FIG.
14, the detector 120, the condenser 122, and the detection circuit 1
24, an X-axis motor 130, a Y-axis motor 132, and drive circuits 134 and 136 as horizontal moving means.

【0016】前記凸レンズ114は、光源112よりの
レーザ光L1を収束して試料116の被測定面に照射す
る(例えば入射角は、被測定面に対し45度)。前記集
光器122は、例えば楕円面鏡よりなり、収束レーザ光
L1の被測定面よりのレーリ散乱光L2を1点に集光し
て検出器120に集める。
The convex lens 114 converges the laser beam L1 from the light source 112 and irradiates the laser beam L1 onto the surface to be measured of the sample 116 (for example, the incident angle is 45 degrees with respect to the surface to be measured). The condenser 122 is composed of, for example, an elliptical mirror, and condenses the Rayleigh scattered light L2 of the converged laser light L1 from the surface to be measured to one point and collects it at the detector 120.

【0017】前記検出器120は、例えば光電子増倍管
(PMT)よりなり、集光器124よりのレーリ散乱光
L2を検出し、該散乱光強度に比例した電気信号に変換
する。前記X軸モータ130及びY軸モータ132は、
例えばステッピングモータよりなり、試料保持板128
をXY方向に一定範囲で移動可能なものである。
The detector 120 comprises, for example, a photomultiplier tube (PMT), detects the Rayleigh scattered light L2 from the condenser 124, and converts it into an electric signal proportional to the scattered light intensity. The X-axis motor 130 and the Y-axis motor 132
For example, the sample holding plate 128 includes a stepping motor.
Can be moved within a certain range in the X and Y directions.

【0018】このようにして粒径測定装置110を構成
することにより、シリコンウエハ等の試料126に付着
した微粒子119の直径を計測することができる。本発
明において特徴的なことは、被測定面の上下位置が最適
焦点位置よりずれた場合であっても、それを正確に再調
整することが容易にできることであり、このために本実
施形態においては、まず垂直移動手段140を備える。
By configuring the particle size measuring device 110 as described above, the diameter of the fine particles 119 attached to the sample 126 such as a silicon wafer can be measured. A feature of the present invention is that even when the vertical position of the surface to be measured is shifted from the optimum focus position, it can be easily readjusted accurately. First, a vertical movement unit 140 is provided.

【0019】前記垂直移動手段140は、例えばステッ
ピングモータよりなるZ軸モータ148と、その駆動回
路150を含み、制御回路138よりの指示により、試
料保持板128をZ方向へ一定範囲で移動可能なもので
ある。さらに本実施形態においては、図3に示すように
ビームスプリッタ141と、位置検出手段142と、角
度検出手段144と、決定手段146と、電圧データ格
納手段147と、ステージ制御手段である制御回路13
8を備える。
The vertical moving means 140 includes, for example, a Z-axis motor 148 composed of, for example, a stepping motor and a driving circuit 150, and can move the sample holding plate 128 in the Z direction within a certain range according to an instruction from the control circuit 138. Things. Further, in the present embodiment, as shown in FIG. 3, the beam splitter 141, the position detecting means 142, the angle detecting means 144, the determining means 146, the voltage data storing means 147, and the control circuit 13 which is a stage controlling means.
8 is provided.

【0020】同図に示すように、前記ビームスプリッタ
141は、レーザ光L1の被測定面よりの反射光L3を
2分割して、一方の光L4を位置検出手段142に、他
方の光L5を角度検出手段144に、それぞれ入射させ
る。前記位置検出手段142は、例えば位置敏感検出器
(以下、PSD142という)よりなり、反射光L4を
受光し、該反射光L4の受光位置に対応した電圧Aを出
力する。
As shown in the figure, the beam splitter 141 splits the reflected light L3 of the laser light L1 from the surface to be measured into two parts, one light L4 to the position detecting means 142, and the other light L5 to the position detecting means 142. The light is incident on the angle detecting means 144. The position detecting means 142 includes, for example, a position sensitive detector (hereinafter, referred to as a PSD 142), receives the reflected light L4, and outputs a voltage A corresponding to the light receiving position of the reflected light L4.

【0021】前記角度検出手段144は、例えば前記位
置検出手段144と同様のPSD(以下、PSD144
という)よりなり、反射光L5を受光し、該反射光L5
の受光位置に対応した電圧Bを出力する。位置決定手段
146は、例えばCPU(以下、CPU146という)
よりなり、PSD142の出力電圧Aを、電圧データ格
納手段147に格納された、標準試料による電圧A−位
置特性と照合することにより、被測定面の仮の位置情報
を得る。
The angle detecting means 144 is, for example, a PSD (hereinafter referred to as PSD 144) similar to the position detecting means 144.
), And receives the reflected light L5.
And outputs a voltage B corresponding to the light receiving position. The position determining unit 146 includes, for example, a CPU (hereinafter, referred to as a CPU 146).
By comparing the output voltage A of the PSD 142 with the voltage A-position characteristic of the standard sample stored in the voltage data storage unit 147, temporary position information of the surface to be measured is obtained.

【0022】このCPU146は、PSD142の出力
電圧Aと、PSD144の出力電圧Bとの差(A−B=
C)を、電圧データ格納手段147に格納された、標準
試料による電圧差C−角度特性と照合することにより、
被測定面の角度情報を得る。また、このCPU146
は、得られた被測定面の角度情報より、被測定面の位置
を決定する。すなわち、CPU146は、得られた角度
情報と、最適焦点位置の設定時の角度とを比較し、誤差
なしと判断したときは、前記仮の位置情報をそのまま真
の位置情報とする。
The CPU 146 calculates the difference between the output voltage A of the PSD 142 and the output voltage B of the PSD 144 (A−B =
By comparing C) with the voltage difference C-angle characteristic of the standard sample stored in the voltage data storage unit 147,
Obtain angle information of the surface to be measured. Also, this CPU 146
Determines the position of the measured surface from the obtained angle information of the measured surface. That is, the CPU 146 compares the obtained angle information with the angle at the time of setting the optimum focus position, and when it is determined that there is no error, the temporary position information is used as true position information as it is.

【0023】これに対し、得られた角度情報が、前記設
定時の角度よりずれていると判断したときは、この角度
情報とPSD142の出力電圧Aとより、正反射したと
きの被測定面の位置を推定し、これを真の位置とする。
なお、この場合、前記仮の位置情報を無効とする。そし
て、前記制御回路138は、CPU146で決定された
位置情報が、最適焦点位置となるように、前記Z軸モー
タ148及びその駆動回路150等の直角移動手段によ
り試料保持板128をZ方向へ移動させる。
On the other hand, when it is determined that the obtained angle information deviates from the angle at the time of the setting, the angle information and the output voltage A of the PSD 142 are used to determine the angle of the surface to be measured at the time of regular reflection. Estimate the position and use this as the true position.
In this case, the temporary position information is invalidated. Then, the control circuit 138 moves the sample holding plate 128 in the Z direction by the Z-axis motor 148 and the right-angle moving means such as the drive circuit 150 so that the position information determined by the CPU 146 becomes the optimum focus position. Let it.

【0024】なお、図4に示すように前記2のPSD1
42,144は、試料保持板(図示省略)に載置された
試料116をZ方向に移動しても、入射面の角度が同じ
であれば、これらのPSD142、144による受光位
置は、P1〜P3へと同様に移動するように配置されて
いる。これにより、試料116をZ方向に移動しても、
入射面の角度が同じであれば、これらの出力電圧A,B
は同じように変化するため、電圧差Cも一定となるが、
入射面の角度が変われば、電圧差Cも変化するようにな
っている。
Note that, as shown in FIG.
The light receiving positions of the PSDs 142 and 144 are P1 to P4 when the angle of the incident surface is the same even when the sample 116 mounted on the sample holding plate (not shown) is moved in the Z direction. It is arranged to move similarly to P3. Thereby, even if the sample 116 is moved in the Z direction,
If the angles of the incident surfaces are the same, these output voltages A, B
Changes in the same way, the voltage difference C is also constant,
If the angle of the incident surface changes, the voltage difference C also changes.

【0025】本発明の第1実施形態に係る粒径計測装置
110は概略以上のように構成され、以下にその作用を
図5を参照しつつ説明する。まず、標準試料を用いて、
一方のPSD142の出力電圧Aと位置との関係、電圧
差Cと角度との関係等の比較用データを得る(ステップ
100)。すなわち、被測定面上の角度が均一に水平の
標準試料をZ方向に所定距離、例えば2μmづつ移動さ
せるごとに、PSD142の出力電圧Aを測定し、これ
を標準試料による電圧A−位置特性としてデータ格納手
段147に格納する。
The particle size measuring apparatus 110 according to the first embodiment of the present invention is configured as described above, and its operation will be described below with reference to FIG. First, using a standard sample,
Comparison data such as the relationship between the output voltage A of one PSD 142 and the position and the relationship between the voltage difference C and the angle are obtained (step 100). That is, each time the standard sample having a uniform angle on the surface to be measured is moved in the Z direction by a predetermined distance, for example, 2 μm, the output voltage A of the PSD 142 is measured, and this is taken as the voltage A-position characteristic of the standard sample. The data is stored in the data storage unit 147.

【0026】また、被測定面の角度が既知の標準試料を
所定角度、例えば2°づつ変更させるごとに、PSD1
42の出力電圧AとPSD144の出力電圧Bより、電
圧差Cを測定し、これを標準試料による電圧差C−角度
特性としてデータ格納手段147に格納する。つぎに、
被測定試料を用いて最適焦点位置を合わせたときの被測
定面の位置情報と角度情報を設定する(ステップ10
2)。設定後、粒径計測のためのレーリ散乱光測定を測
定を開始する(ステップ104)。
Each time the standard sample whose angle of the surface to be measured is changed by a predetermined angle, for example, 2 °, the PSD1 is changed.
The voltage difference C is measured from the output voltage A of the P.42 and the output voltage B of the PSD 144, and is stored in the data storage unit 147 as a voltage difference C-angle characteristic of the standard sample. Next,
Position information and angle information of the surface to be measured when the optimum focus position is adjusted using the sample to be measured are set (step 10).
2). After the setting, the measurement of the Rayleigh scattered light measurement for measuring the particle size is started (step 104).

【0027】ところで、例えば1の位置検出手段、例え
ばPSD142のみを設けた場合では、試料の状態が悪
く被測定面にうねりがあったり、ステージの精度が悪
く、ステージ移動中に被測定面の角度が設定時の角度よ
りθずれることがある。すると、図6に示すように反射
光L3の進行方向が変化するため、PSD142による
反射光L4の受光位置がP4からP5へと変わってしま
う。すると、出力電圧Aも変化するため、理論上の位置
と実際の位置との間に誤差が生じてしまう場合があっ
た。
By the way, for example, when only one position detecting means, for example, PSD 142 is provided, the state of the sample is poor and the surface to be measured has undulation, the precision of the stage is poor, and the angle of the surface to be measured during the movement of the stage is reduced. May be shifted by θ from the angle at the time of setting. Then, since the traveling direction of the reflected light L3 changes as shown in FIG. 6, the light receiving position of the reflected light L4 by the PSD 142 changes from P4 to P5. Then, since the output voltage A also changes, an error may occur between the theoretical position and the actual position.

【0028】そこで、本実施形態においては、前述のよ
うに被測定面の角度が、最適焦点位置の設定時よりずれ
た場合であっても、位置情報を正確に得るため、2のP
SD142,144を配置し、これらの出力電圧差Cよ
り得られた被測定面の角度情報を考慮して位置を決定す
ることとした。
Therefore, in this embodiment, as described above, even if the angle of the surface to be measured deviates from the time when the optimum focus position is set, 2P
SDs 142 and 144 are arranged, and the position is determined in consideration of the angle information of the measured surface obtained from the output voltage difference C.

【0029】すなわち、前記図5に示すようにCPU1
46は、PSD142の出力電圧Aを、電圧データ格納
手段147に格納された、標準試料による電圧A−位置
特性と照合することにより、被測定面の仮の位置情報を
得る(ステップ106)。また、このCPU146は、
PSD142の出力電圧Aと、PSD144の出力電圧
Bとの差、電圧差Cを、電圧データ格納手段147に格
納された、標準試料による電圧差C−角度特性と照合す
ることにより、被測定面の角度情報を得る。
That is, as shown in FIG.
46 obtains temporary position information of the surface to be measured by comparing the output voltage A of the PSD 142 with the voltage A-position characteristic of the standard sample stored in the voltage data storage means 147 (step 106). Also, this CPU 146
By comparing the difference between the output voltage A of the PSD 142 and the output voltage B of the PSD 144, and the voltage difference C, with the voltage difference C-angle characteristic of the standard sample stored in the voltage data storage unit 147, Get angle information.

【0030】また、このCPU146は、得られた被測
定面の角度情報より、被測定面の位置を決定する。すな
わち、CPU146は、得られた角度情報と、最適焦点
位置の設定時の角度とを比較し(ステップ108)、得
られた角度情報が所定の角度よりずれていると判断した
ときは、この角度情報とPSD142の出力電圧Aとよ
り、正反射したときの被測定面の位置を推定し、これを
被測定面の真の位置とする(ステップ110)。
The CPU 146 determines the position of the measured surface from the obtained angle information of the measured surface. That is, the CPU 146 compares the obtained angle information with the angle at the time of setting the optimum focus position (step 108), and when it is determined that the obtained angle information is deviated from the predetermined angle, this angle information is determined. From the information and the output voltage A of the PSD 142, the position of the surface to be measured when specularly reflected is estimated, and this is set as the true position of the surface to be measured (step 110).

【0031】これに対し、誤差なしと判断したときは、
前記仮の位置情報をそのまま真の位置情報とする(ステ
ップ112)。そして、CPU146は、得られた位置
情報と、最適焦点位置の設定時の位置情報とを比較し
(ステップ114)、誤差ありと判断したときは、制御
回路138は、CPU146で決定された位置情報が、
最適焦点位置となるように、直角移動手段により試料保
持板128をZ方向へ移動させる(ステップ116)。
On the other hand, when it is determined that there is no error,
The temporary position information is used as true position information as it is (step 112). Then, the CPU 146 compares the obtained position information with the position information at the time of setting the optimum focus position (step 114). When it is determined that there is an error, the control circuit 138 returns to the position information determined by the CPU 146. But,
The sample holding plate 128 is moved in the Z direction by the right-angle moving means so as to be at the optimum focus position (step 116).

【0032】その後、つぎの被測定面の仮の位置情報及
び角度情報測定を開始する(前記ステップ106)。こ
れに対し、誤差なしと判断したときは、すぐに、つぎの
被測定面の仮の位置情報及び角度情報測定を開始する
(前記ステップ106)。そして、これらの処理を測定
中、繰り返す。また、本実施形態において、ステージ制
御は、前記XY方向へのステージ移動に限られるもので
なく、Z軸モータ等の直角移動手段によりZ方向へステ
ージ移動を行い、被測定面の傾きが変わった場合であっ
ても、前記ステップ206〜ステップ216の処理を行
うことにより、前述のようにして被測定面の位置を、再
度正確に設定時の最適焦点位置に調整することが容易に
できる。
Thereafter, measurement of the next provisional position information and angle information on the surface to be measured is started (step 106). On the other hand, when it is determined that there is no error, measurement of the temporary position information and angle information of the next surface to be measured is started immediately (step 106). These processes are repeated during the measurement. In the present embodiment, the stage control is not limited to the stage movement in the XY directions. The stage is moved in the Z direction by a right-angle moving means such as a Z-axis motor, and the inclination of the surface to be measured is changed. Even in this case, by performing the processing of steps 206 to 216, the position of the surface to be measured can be easily adjusted to the optimum focus position at the time of setting again accurately as described above.

【0033】以上のように、本発明の第1実施形態に係
る粒径計測装置110によれば、水平移動手段によるス
テージ移動中や、直角移動手段によるステージ移動中
に、被被測定面の位置が最適焦点位置よりずれた場合、
被測定面の角度が一定の時は勿論、変わったときであっ
ても、正確な位置情報を得ることができるので、容易に
被測定面の位置を再度正確に最適焦点位置に調整するこ
とができる。これにより、被測定面の状態や試料ステー
ジの精度に拘わらず、常に最適焦点位置を保ちながら粒
径計測のためのレーリ散乱光検出を行うことができるた
め、測定精度の結果向上を図ることができる。
As described above, according to the particle size measuring apparatus 110 according to the first embodiment of the present invention, the position of the surface to be measured can be adjusted during the stage movement by the horizontal movement means or the stage movement by the right angle movement means. Is shifted from the optimal focus position,
Accurate positional information can be obtained even when the angle of the surface to be measured is constant as well as when it changes, so that the position of the surface to be measured can be easily adjusted again to the optimum focus position. it can. As a result, regardless of the state of the surface to be measured and the accuracy of the sample stage, the Rayleigh scattered light detection for measuring the particle diameter can be performed while always maintaining the optimum focus position, thereby improving the measurement accuracy result. it can.

【0034】第2実施形態 図7には本発明の第2実施形態に係る試料ステージの概
略構成の図が、図8には本発明の第2実施形態に係る試
料ステージの概略構成の図が、それぞれ示されている。
なお、前記図2,3と対応する部分には符号100を加
えて示し説明を省略する。本実施形態においては、図7
に示すように角度変更手段を備えている。
Second Embodiment FIG. 7 shows a schematic configuration of a sample stage according to a second embodiment of the present invention, and FIG. 8 shows a schematic configuration of a sample stage according to the second embodiment of the present invention. , Respectively.
Parts corresponding to those in FIGS. 2 and 3 are denoted by reference numeral 100, and description thereof is omitted. In the present embodiment, FIG.
As shown in FIG.

【0035】前記角度変更手段は、例えばステッピング
モータ252と、その駆動回路254よりなり、シリコ
ンウエハ等の試料216が載置される試料保持板228
の角度を一定角度範囲で角度変更可能なものである。そ
して、制御回路238は、まず、2のPSD242,2
44(図8参照)の電圧差Cより得られた角度情報に基
づいて、該角度情報が所定の角度、例えば最適焦点位置
の設定時の被測定面の角度となるように、前記ステッピ
ングモータ252、その駆動回路254等の角度変更手
段により、試料保持板218を傾斜させる。
The angle changing means comprises, for example, a stepping motor 252 and its driving circuit 254, and a sample holding plate 228 on which a sample 216 such as a silicon wafer is mounted.
Can be changed within a certain angle range. Then, the control circuit 238 first detects the two PSDs 242, 2
Based on the angle information obtained from the voltage difference C of FIG. 44 (see FIG. 8), the stepping motor 252 is set so that the angle information becomes a predetermined angle, for example, the angle of the surface to be measured when the optimum focus position is set. The sample holding plate 218 is inclined by an angle changing means such as the drive circuit 254.

【0036】角度調整後、この制御回路238は、PS
D242で得た位置情報が最適焦点位置の設定時の位置
となるように、前記直角移動手段等によりに試料保持板
218をZ方向に移動させる。本発明の第2実施形態に
係る粒径計測装置210は概略以上のように構成され、
以下にその作用を図9を参照しつつ説明する。まず、標
準試料を用いて、一方のPSD242の出力電圧Aと位
置との関係、電圧差Cと角度との関係等の比較用データ
を得る(ステップ200)。
After the angle adjustment, this control circuit 238
The sample holding plate 218 is moved in the Z direction by the right-angle moving means or the like so that the position information obtained in D242 becomes the position at the time of setting the optimum focus position. The particle size measuring device 210 according to the second embodiment of the present invention is configured as outlined above,
The operation will be described below with reference to FIG. First, using the standard sample, comparison data such as the relationship between the output voltage A and the position of one PSD 242 and the relationship between the voltage difference C and the angle is obtained (step 200).

【0037】すなわち、測定面上の角度が均一に水平の
標準試料をZ方向に所定距離、例えば2μmづつ移動さ
せるごとに、PSD242の出力電圧Aを測定し、これ
を標準試料による電圧A−位置特性としてデータ格納手
段247に格納する。また、被測定面の角度が既知の標
準試料を所定角度、例えば2°づつ変更させるごとに電
圧差Cを測定し、これを標準試料による電圧差C−角度
特性としてデータ格納手段247に格納する。つぎに、
被測定試料を用いて最適焦点位置を合わせたときの被測
定面の位置情報と角度情報を設定する(ステップ20
2)。設定後、粒径計測のためのレーリ散乱光測定を行
う(ステップ204)。
That is, every time a standard sample having a uniform angle on the measurement surface is moved in the Z direction by a predetermined distance, for example, 2 μm, the output voltage A of the PSD 242 is measured, and this is measured as the voltage A-position of the standard sample. The data is stored in the data storage unit 247 as a characteristic. The voltage difference C is measured every time the standard sample whose angle of the surface to be measured is changed by a predetermined angle, for example, 2 °, is stored in the data storage unit 247 as a voltage difference C-angle characteristic of the standard sample. . Next,
Position information and angle information of the surface to be measured when the optimum focus position is adjusted using the sample to be measured are set (step 20).
2). After the setting, Rayleigh scattered light measurement for particle size measurement is performed (step 204).

【0038】ここで、CPU246は、PSD242の
出力電圧AとPSD244の出力電圧Bとの差Cを、電
圧データ格納手段247に格納された、標準試料による
電圧差C−角度特性と照合することにより、被測定面の
角度情報を得る(ステップ206)。そして、CPU2
46は、得られた角度情報と、最適焦点位置の設定時の
被測定面の角度とを比較し(ステップ208)、得られ
た角度情報が設定時の角度よりずれていると判断したと
きは、制御回路238は、得られた角度情報が設定時の
角度となるように前記角度変更手段により試料保持板2
18を傾斜させる(ステップ210)。
Here, the CPU 246 compares the difference C between the output voltage A of the PSD 242 and the output voltage B of the PSD 244 with the voltage difference C-angle characteristic of the standard sample stored in the voltage data storage means 247. Then, angle information of the surface to be measured is obtained (step 206). And CPU2
46 compares the obtained angle information with the angle of the surface to be measured at the time of setting the optimum focus position (step 208), and when it is determined that the obtained angle information is shifted from the angle at the time of setting, The control circuit 238 controls the sample holding plate 2 by the angle changing means so that the obtained angle information becomes the angle at the time of setting.
18 is tilted (step 210).

【0039】角度調整後、CPU246は、PSD24
2の出力電圧Aを、電圧データ格納手段247に格納さ
れた、標準試料による電圧A−位置特性と照合すること
により、被測定面の位置情報を得ている(ステップ21
2)。つぎに、CPU246は、得られた位置情報と、
設定時の位置情報とを比較し(ステップ214)、誤差
なしと判断したときは、すぐに、つぎの被測定面の角度
情報の測定を行う(前記ステップ206)。
After the angle adjustment, the CPU 246 sets the PSD 24
2 is compared with the voltage A-position characteristic of the standard sample stored in the voltage data storage means 247 to obtain position information on the surface to be measured (step 21).
2). Next, the CPU 246 sets the obtained position information and
The position information at the time of setting is compared (step 214), and when it is determined that there is no error, the next angle information of the surface to be measured is measured immediately (step 206).

【0040】これに対し、誤差ありと判断したときは、
角度調整後に得られたPSD242よりの位置情報が設
定時の位置情報となるように、前記直角移動手段により
試料保持板218をZ方向へ移動させる。その後、つぎ
の被測定面の角度情報の測定を行う(前記ステップ20
6)。そして、これらの処理を測定中、繰り返す。
On the other hand, when it is determined that there is an error,
The sample holding plate 218 is moved in the Z direction by the right-angle moving means so that the position information from the PSD 242 obtained after the angle adjustment becomes the position information at the time of setting. Thereafter, the next measurement of the angle information of the surface to be measured is performed (the step 20).
6). These processes are repeated during the measurement.

【0041】このように、ステージ移動中に被測定面の
角度が、設定時よりずれた場合であっても、被測定面の
角度を、設定時と同様の角度に調整した後、PSD14
2よりの位置情報を得ることとしたので、被測定面の位
置情報を正確に得ることができる。
As described above, even if the angle of the surface to be measured is shifted from the setting during the stage movement, the angle of the surface to be measured is adjusted to the same angle as that at the time of setting, and then the PSD 14 is adjusted.
Since the position information is obtained from the position 2, the position information of the surface to be measured can be obtained accurately.

【0042】以上のように、本発明の第2実施形態に係
る粒径計測装置210によれば、被測定面の角度を、設
定時と同様の角度に調整した後、PSD142よりの位
置情報を得ることとしたので、前記本発明の第1実施形
態に係る粒径計測装置110と同様、被測定面の位置情
報を正確に得ることができるため、被測定面の上下位置
が最適焦点位置よりZ方向にずれた場合であっても、被
測定面の位置を再度正確に最適焦点位置に調整すること
が容易にできる。これにより、被測定面の状態や試料ス
テージの精度に拘わらず、常に最適焦点位置を保ちなが
ら粒径計測のためのレーリ散乱光測定を行うことができ
るため、測定精度の向上を図ることができる。
As described above, according to the particle size measuring apparatus 210 according to the second embodiment of the present invention, after adjusting the angle of the surface to be measured to the same angle as at the time of setting, the position information from the PSD 142 is obtained. Since the position information is obtained, the position information of the surface to be measured can be accurately obtained similarly to the particle diameter measuring device 110 according to the first embodiment of the present invention. Even in the case of displacement in the Z direction, it is easy to adjust the position of the surface to be measured to the optimum focus position again accurately. Accordingly, the Rayleigh scattered light measurement for measuring the particle diameter can be performed while always maintaining the optimum focus position regardless of the state of the surface to be measured and the accuracy of the sample stage, so that the measurement accuracy can be improved. .

【0043】なお、前記各構成では、本実施形態に係る
試料ステージを粒径計測装置の試料ステージに用いた例
について説明したが、これに限られるものでなく、例え
ば走査型電子顕微鏡(SEM)等の任意の機器の試料ス
テージに用いてもよい。また、本実施形態においては、
試料としてシリコンウエハを用いた例について説明した
が、これに限られるものでなく、その他のものを用いて
もよい。また、本実施形態においては、位置情報をPS
D142の出力電圧Aより得た例について説明したが、
これに限られるものでなく、PSD144の出力電圧B
より得てもよい。すなわち、被測定面の仮の位置情報
は、2のPSD142,144のうち、どちらか一方の
PSDの出力電圧より得ることができるからである。
In each configuration described above, an example was described in which the sample stage according to the present embodiment was used as a sample stage of a particle size measuring apparatus. However, the present invention is not limited to this. For example, a scanning electron microscope (SEM) And the like may be used for a sample stage of any device. In the present embodiment,
Although an example in which a silicon wafer is used as a sample has been described, the invention is not limited to this, and another material may be used. In the present embodiment, the position information is PS
Although the example obtained from the output voltage A of D142 has been described,
The output voltage B of the PSD 144 is not limited to this.
You may get more. That is, the temporary position information of the surface to be measured can be obtained from the output voltage of one of the two PSDs 142 and 144.

【0044】[0044]

【発明の効果】以上説明したように、本発明に係る試料
ステージによれば、上記角度検出手段及び位置決定手段
等により被測定面の角度を考慮して位置情報を得ること
としたので、ステージ移動中に被測定面の角度が変わっ
た場合であっても、被測定面の位置情報を正確に得るこ
とが容易にできる。これにより、ステージ移動中に被測
定面の位置が最適焦点位置よりずれた場合であっても、
被測定面の位置を再度正確に最適焦点位置に調整するこ
とが容易にできる。また、本発明に係る粒径計測装置に
よれば、試料ステージとして前記本発明に係る試料ステ
ージを用いることとしたので、被測定面の状態や試料ス
テージの精度に拘わらず、常に最適焦点位置を保ちなが
ら粒径計測のためのレーリ散乱光測定を行うことができ
るため、測定精度の向上を図ることができる。
As described above, according to the sample stage of the present invention, the position information is obtained by considering the angle of the surface to be measured by the angle detecting means and the position determining means. Even when the angle of the measured surface changes during the movement, it is easy to accurately obtain the position information of the measured surface. Thereby, even if the position of the measured surface is shifted from the optimal focus position during the stage movement,
It is easy to adjust the position of the surface to be measured again to the optimum focal position accurately. Further, according to the particle size measuring apparatus according to the present invention, since the sample stage according to the present invention is used as the sample stage, regardless of the state of the surface to be measured and the precision of the sample stage, the optimum focus position is always set. Since the Rayleigh scattered light measurement for measuring the particle size can be performed while maintaining the measurement, the measurement accuracy can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来の粒径計測装置の概略構成の説明図であ
る。
FIG. 1 is an explanatory diagram of a schematic configuration of a conventional particle size measuring device.

【図2】本発明の第1実施形態に係る粒径計測装置の概
略構成の説明図である。
FIG. 2 is an explanatory diagram of a schematic configuration of a particle size measuring device according to the first embodiment of the present invention.

【図3】本発明の第1実施形態に係る試料ステージの概
略構成の説明図である。
FIG. 3 is an explanatory diagram of a schematic configuration of a sample stage according to the first embodiment of the present invention.

【図4】図3に示したPSDの配置の説明図である。FIG. 4 is an explanatory diagram of an arrangement of the PSD shown in FIG. 3;

【図5】図3に示した試料ステージによる位置調整の処
理手順を示すフローチャートである。
FIG. 5 is a flowchart showing a processing procedure of position adjustment by the sample stage shown in FIG. 3;

【図6】図3に示したPSDの作用の説明図である。6 is an explanatory diagram of the operation of the PSD shown in FIG.

【図7】本発明の第2実施形態に係る粒径計測装置の概
略構成の説明図である。
FIG. 7 is an explanatory diagram of a schematic configuration of a particle size measuring device according to a second embodiment of the present invention.

【図8】本発明の第2実施形態に係る試料ステージの概
略構成の説明図である。
FIG. 8 is an explanatory diagram of a schematic configuration of a sample stage according to a second embodiment of the present invention.

【図9】図8に示した試料ステージによる位置調整の処
理手順を示すフローチャートである。
9 is a flowchart showing a processing procedure of position adjustment by the sample stage shown in FIG.

【符号の説明】[Explanation of symbols]

110 粒径計測装置 116 シリコンウエハ(試料) 118 試料ステージ 128 試料保持板 130 X軸モータ(水平移動手段) 132 Y軸モータ(水平移動手段) 134,136 駆動回路(水平移動手段) 138 制御回路(ステージ制御手段) 142 PSD(位置検出手段) 144 PSD(角度検出手段) 146 CPU(位置決定手段) 148 Z軸モータ(直角移動手段) 150 駆動回路(直角移動手段) L1 収束レーザ光 L3 正反射光(反射光) 110 particle size measuring device 116 silicon wafer (sample) 118 sample stage 128 sample holding plate 130 X-axis motor (horizontal moving means) 132 Y-axis motor (horizontal moving means) 134, 136 drive circuit (horizontal moving means) 138 control circuit ( Stage control means) 142 PSD (Position detecting means) 144 PSD (Angle detecting means) 146 CPU (Position determining means) 148 Z-axis motor (Right angle moving means) 150 Drive circuit (Right angle moving means) L1 Convergent laser light L3 Regular reflection light (reflected light)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 伸一郎 東京都八王子市石川町2967番地の5 日本 分光株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shinichiro Watanabe 2967 Ishikawacho, Hachioji-shi, Tokyo 5 Japan Spectroscopy Corporation

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 試料を保持する試料保持板を、試料の
被測定面に対し平行方向へ移動可能な平行移動手段を備
えた試料ステージにおいて、 前記試料保持板を被測定面に対し直角方向へ移動可能な
直角移動手段と、 前記被測定面よりの反射光を受光し、該反射光の受光位
置より被測定面の仮の位置情報を得るための位置検出手
段と、 前記反射光を受光し、該反射光の受光位置より被測定面
の角度情報を得るための角度検出手段と、 前記角度検出手段で得た角度情報と所定の角度情報とを
比較し、誤差なしと判断したときは、前記位置検出手段
で得た位置情報をそのまま真の位置情報とし、また誤差
ありと判断したときは、該誤差に基づいて前記位置検出
手段で得た位置情報を校正して真の位置情報とする位置
決定手段と、 前記位置決定手段で得た位置情報が所定の位置となるよ
うに、前記直角移動手段により試料保持板を移動させる
ステージ制御手段と、 を備えたことを特徴とする試料ステージ。
1. A sample stage provided with a parallel moving means capable of moving a sample holding plate for holding a sample in a direction parallel to a surface to be measured of the sample, wherein the sample holding plate is moved in a direction perpendicular to the surface to be measured. Movable right-angle moving means, a position detecting means for receiving reflected light from the measured surface, and obtaining temporary position information of the measured surface from a light receiving position of the reflected light, and receiving the reflected light An angle detector for obtaining angle information of the surface to be measured from the light receiving position of the reflected light, and comparing the angle information obtained by the angle detector with predetermined angle information, when it is determined that there is no error, The position information obtained by the position detecting means is used as true position information as it is, and when it is determined that there is an error, the position information obtained by the position detecting means is calibrated based on the error to be true position information. Position determining means, and the position determining means Location information such that a predetermined position, the sample stage, characterized in that and a stage control means for moving the sample holding plate by the right-angle moving means.
【請求項2】 試料を保持する試料保持板を、試料の
被測定面に対し平行に移動可能な平行移動手段を備えた
試料ステージにおいて、 前記試料保持板を被測定面に対し直角方向へ移動可能な
直角移動手段と、 前記試料保持板の角度を変更可能な角度変更手段と、 前記被測定面よりの反射光を受光し、該反射光の受光位
置より被測定面の角度情報を得るための角度検出手段
と、 前記反射光を受光し、該反射光の受光位置より、被測定
面の位置情報を得るための位置検出手段と、 前記角度検出手段で得た角度情報が所定の角度となるよ
うに、前記角度変更手段により試料保持板を傾斜させた
後、前記位置検出手段で得た位置情報が所定の位置とな
るように、前記直角移動手段により該試料保持板を移動
させるステージ制御手段と、 を備えたことを特徴とする試料ステージ。
2. A sample stage provided with a parallel moving means capable of moving a sample holding plate holding a sample in parallel with a surface to be measured of the sample, wherein the sample holding plate is moved in a direction perpendicular to the surface to be measured. A right-angle moving means, an angle changing means capable of changing an angle of the sample holding plate, and a device for receiving reflected light from the measured surface and obtaining angle information of the measured surface from a light receiving position of the reflected light. Angle detecting means, receiving the reflected light, from the light receiving position of the reflected light, position detecting means for obtaining the position information of the surface to be measured, the angle information obtained by the angle detecting means is a predetermined angle After tilting the sample holding plate by the angle changing means, the stage control for moving the sample holding plate by the right-angle moving means so that the position information obtained by the position detecting means becomes a predetermined position. Having means and A sample stage characterized by the following.
【請求項3】 請求項1又は2記載の試料ステージにお
いて、前記被測定面よりの反射光を2分割し、その一方
の光を前記位置検出手段に入射させ、その他方の光を前
記角度検出手段に入射させるビームスプリッタを備えた
ことを特徴とする試料ステージ。
3. The sample stage according to claim 1, wherein the reflected light from the surface to be measured is split into two, one of which is incident on the position detecting means, and the other light is subjected to the angle detection. A sample stage provided with a beam splitter for allowing the beam to enter the means.
【請求項4】 請求項1乃至3の何れかに記載の試料ス
テージにおいて、収束レーザ光を被測定面に照射して走
査しながら粒子よりのレーリ散乱光を検出し、該散乱光
強度より粒子の粒径を計測する粒径計測手段を備えたこ
とを特徴とする粒径計測装置。
4. The sample stage according to claim 1, wherein the surface to be measured is irradiated with a converging laser beam to detect Rayleigh scattered light from the particle while scanning the surface, and the intensity of the particle is determined based on the scattered light intensity. A particle size measuring device comprising a particle size measuring means for measuring the particle size of the particles.
JP10335498A 1998-03-30 1998-03-30 Sample stage and particle size measuring apparatus using the same Expired - Fee Related JP4128262B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10335498A JP4128262B2 (en) 1998-03-30 1998-03-30 Sample stage and particle size measuring apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10335498A JP4128262B2 (en) 1998-03-30 1998-03-30 Sample stage and particle size measuring apparatus using the same

Publications (2)

Publication Number Publication Date
JPH11281543A true JPH11281543A (en) 1999-10-15
JP4128262B2 JP4128262B2 (en) 2008-07-30

Family

ID=14351807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10335498A Expired - Fee Related JP4128262B2 (en) 1998-03-30 1998-03-30 Sample stage and particle size measuring apparatus using the same

Country Status (1)

Country Link
JP (1) JP4128262B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365234A (en) * 2001-06-06 2002-12-18 Silicon Technology Co Ltd Surface-evaluating apparatus and method
JP2010236920A (en) * 2009-03-30 2010-10-21 Jasco Corp Particle measuring device
CN107467714A (en) * 2016-06-07 2017-12-15 贵州中烟工业有限责任公司 A kind of detecting system of the detection method of cigarette, control device and cigarette

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365234A (en) * 2001-06-06 2002-12-18 Silicon Technology Co Ltd Surface-evaluating apparatus and method
JP4690584B2 (en) * 2001-06-06 2011-06-01 有限会社ユナテック Surface evaluation apparatus and surface evaluation method
JP2010236920A (en) * 2009-03-30 2010-10-21 Jasco Corp Particle measuring device
CN107467714A (en) * 2016-06-07 2017-12-15 贵州中烟工业有限责任公司 A kind of detecting system of the detection method of cigarette, control device and cigarette

Also Published As

Publication number Publication date
JP4128262B2 (en) 2008-07-30

Similar Documents

Publication Publication Date Title
JP2690443B2 (en) Autofocus device
US5194743A (en) Device for positioning circular semiconductor wafers
US7716970B2 (en) Scanning probe microscope and sample observation method using the same
US6677565B1 (en) High speed autofocus and tilt for an optical imaging system
US8791414B2 (en) Dynamic focus adjustment with optical height detection apparatus in electron beam system
TW466332B (en) Measuring instrument and method for measuring features on an substrate
US7064820B2 (en) Surface inspection method and surface inspection system
US6479832B1 (en) Surface height detecting apparatus and exposure apparatus using the same
US6486964B2 (en) Measuring apparatus
JPH10318718A (en) Optical height detecting device
JP3817630B2 (en) Two-dimensional angle sensor
US6576902B2 (en) Correction method of scanning electron microscope
JP2005070225A (en) Surface image projector and the surface image projection method
JP2000114137A (en) Electron beam exposure system and aligning method
JP4128262B2 (en) Sample stage and particle size measuring apparatus using the same
JPH077653B2 (en) Observation device by scanning electron microscope
JP4382315B2 (en) Wafer bump appearance inspection method and wafer bump appearance inspection apparatus
JP3218466B2 (en) Exposure method and apparatus
JPH05203431A (en) Surface shape measuring instrument
JP3969640B2 (en) Charged particle beam drawing apparatus and drawing method using the same
JPH08327332A (en) Apparatus for measuring film thickness of solder paste
US6118123A (en) Electron probe microanalyzer
JP2003303758A5 (en)
JPH07218234A (en) Size measuring method for fine pattern
JPH09199573A (en) Positioning stage apparatus and aligner using the same

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20031031

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20040129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050303

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071101

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080430

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080514

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees