JPH11277500A - Ultrasonic machining device - Google Patents

Ultrasonic machining device

Info

Publication number
JPH11277500A
JPH11277500A JP8599398A JP8599398A JPH11277500A JP H11277500 A JPH11277500 A JP H11277500A JP 8599398 A JP8599398 A JP 8599398A JP 8599398 A JP8599398 A JP 8599398A JP H11277500 A JPH11277500 A JP H11277500A
Authority
JP
Japan
Prior art keywords
ultrasonic
workpiece
processing
head
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8599398A
Other languages
Japanese (ja)
Inventor
Yoichi Ito
洋一 伊藤
Takaaki Okada
貴章 岡田
Shigeaki Nawa
成明 名和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Edge Inc
Original Assignee
Toppan Forms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Priority to JP8599398A priority Critical patent/JPH11277500A/en
Publication of JPH11277500A publication Critical patent/JPH11277500A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B29C65/083Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations using a rotary sonotrode or a rotary anvil
    • B29C65/086Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations using a rotary sonotrode or a rotary anvil using a rotary anvil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411Roller, cylinder or drum types
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/92Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/922Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9231Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the displacement of the joining tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate a need to move a ultrasonic head for regulation of a ultrasonic machine force. SOLUTION: A paper sheet 14 being a work is fed through between a ultrasonic head 10 and a cylinder 12 with blades. The paper sheet 14 is conveyed by a conveyance mechanism consisting of rollers 16 and 18. A distance measuring device 20 measures a distance between the ultrasonic head 10 and the cylinder 12 with a blade, and a rotary encoder 22 detects the rotation of the cylinder 12. A control circuit 24 controls a supersonic wave oscillation circuit 26 according to the outputs of a distance measuring device 20 and a rotary encoder 22, the thickness and the material of the paper sheet 14, and information indicating distribution of the blades of the cylinder 12 with blades. The vibration amplitude generating by a ultrasonic head 10 is rendered proper to the processing purpose of the paper sheet 14. An ultrasonic oscillation circuit 26 drives the supersonic vibrator of a ultrasonic head 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、超音波加工装置に
関し、より具体的には、超音波を使用して用紙等を加工
する超音波加工装置に関する。
[0001] 1. Field of the Invention [0002] The present invention relates to an ultrasonic processing apparatus, and more particularly, to an ultrasonic processing apparatus for processing a sheet or the like using ultrasonic waves.

【0002】[0002]

【従来の技術】超音波加工装置としては、例えば、超音
波エネルギーを高分子系物質に与えることにより、素材
に機械的摩擦や構成分子間の振動による熱を発生させて
素材同士のウエルド、エンボス及びダイカットなどを行
なうものがある。
2. Description of the Related Art As an ultrasonic processing apparatus, for example, ultrasonic energy is applied to a polymer material to generate heat due to mechanical friction or vibration between constituent molecules in the material, thereby welding or embossing the materials. And die cutting.

【0003】超音波振動子はそれ自体では振幅が小さい
ので、通常、ブースタと呼ばれる増幅手段で超音波振動
子の発生する振幅を増大し、ホーン又はコーンと呼ばれ
る手段で対象物に超音波を集中させるようにしている。
通常、超音波振動子、ブースタ及びホーン又はコーンは
一体化されており、本明細書では、これを超音波ヘッド
と呼ぶことにする。
[0003] Since the amplitude of the ultrasonic vibrator itself is small, the amplitude generated by the ultrasonic vibrator is usually increased by amplifying means called a booster, and the ultrasonic wave is concentrated on an object by means called a horn or a cone. I try to make it.
Typically, the ultrasound transducer, booster and horn or cone are integral and will be referred to herein as an ultrasound head.

【0004】超音波加工装置を生産ラインで安定的に使
用するには、加工対象物における超音波の機械力を安定
的に制御する必要がある。対象物における超音波の機械
力は、対象物自体の状態のみならず、その移動速度によ
っても変化するからである。従来例では、超音波ヘッド
を機械的に対象物に近づけたり、遠ざけたりするアクチ
ュエータを設け、超音波ヘッドと加工対象物との距離を
調整することで、対応していた。
[0004] In order to use an ultrasonic processing device stably on a production line, it is necessary to stably control the mechanical force of ultrasonic waves on a processing object. This is because the mechanical force of the ultrasonic wave on the object changes not only according to the state of the object itself, but also according to the moving speed thereof. In the conventional example, an actuator for mechanically moving the ultrasonic head closer to or away from the object is provided, and the distance between the ultrasonic head and the object to be processed is adjusted.

【0005】[0005]

【発明が解決しようとする課題】超音波ヘッドを移動さ
せる従来例では、超音波ヘッドを移動自在に支持する手
段、例えば、Oリングが使用に連れて又は発生する超音
波により歪みやすいという問題点である。
In the prior art in which the ultrasonic head is moved, there is a problem that the means for movably supporting the ultrasonic head, for example, the O-ring is easily distorted by ultrasonic waves generated during use or generated. It is.

【0006】また、アクチュエータとして空気圧シリン
ダ方式を使用する場合、空気圧シリンダは、ラインスピ
ードの変化や加工対象物の状態変化によってはハンチン
グを起こしやすいという問題がある。また、ステッピン
グ・モータを駆動源とすれば、ハンチングの問題は生じ
ないが、その制御系も必要になり、非常に高価なシステ
ムになる。
In the case where a pneumatic cylinder system is used as an actuator, the pneumatic cylinder has a problem that hunting is likely to occur depending on a change in line speed or a change in the state of a workpiece. If a stepping motor is used as a drive source, the problem of hunting does not occur, but a control system for the hunting is required, resulting in a very expensive system.

【0007】本発明は、このような問題点を解決し、よ
り安定的に使用できる超音波加工装置を提示することを
目的とする。
An object of the present invention is to solve such a problem and to provide an ultrasonic processing apparatus that can be used more stably.

【0008】[0008]

【課題を解決するための手段】本発明では、超音波ヘッ
ドと加工部材との間の距離を測定する距離測定手段を設
け、その測定距離に応じて超音波ヘッドの駆動回路を制
御して、超音波ヘッドの振動の振幅を所定値に制御す
る。これにより、超音波ヘッドと加工部材、例えば加工
刃との間の距離が所定の範囲内(例えば、100μm程
度)にあれば、厳密に調整しなくても、所望の超音波エ
ネルギーを被加工物に照射でき、所望の加工性能を得ら
れる。
According to the present invention, a distance measuring means for measuring a distance between an ultrasonic head and a processing member is provided, and a driving circuit of the ultrasonic head is controlled in accordance with the measured distance. The amplitude of the vibration of the ultrasonic head is controlled to a predetermined value. Accordingly, if the distance between the ultrasonic head and a processing member, for example, a processing blade is within a predetermined range (for example, about 100 μm), desired ultrasonic energy can be applied to the workpiece without strict adjustment. To obtain desired processing performance.

【0009】更には、加工部材の加工量も加味して超音
波ヘッドの駆動回路を制御することより、加工量が多い
ところと少ないところのどちらでも、一定の安定した加
工性能が得られる。
Further, by controlling the drive circuit of the ultrasonic head in consideration of the processing amount of the processing member, a constant and stable processing performance can be obtained regardless of whether the processing amount is large or small.

【0010】更には、被加工物の厚み及び素材の情報も
加味して超音波ヘッドの駆動回路を制御することより、
より安定した加工が可能になる。
Further, by controlling the driving circuit of the ultrasonic head in consideration of the thickness and material information of the workpiece,
More stable processing becomes possible.

【0011】本発明ではまた、加工部材による加工量に
従い超音波ヘッドの駆動回路を制御して、超音波ヘッド
から供給する超音波エネルギーを所定値に制御する。こ
れにより、加工量が多いところと少ないところのどちら
でも、一定の安定した加工性能が得られる。
In the present invention, the driving circuit of the ultrasonic head is controlled in accordance with the processing amount of the processing member, and the ultrasonic energy supplied from the ultrasonic head is controlled to a predetermined value. As a result, a constant and stable processing performance can be obtained regardless of whether the processing amount is large or small.

【0012】[0012]

【発明の実施の形態】以下、図面を参照して、本発明の
実施の形態を詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0013】図1は、本発明の一実施例の概略構成ブロ
ック図を示す。本実施例は、用紙の一部を切り抜く装置
に適用したものである。10は超音波ヘッドであり、刃
付きシリンダ12に対面して、刃付きシリンダ12に向
けて超音波を照射する向きに適宜の間隔を開けて配置さ
れる。超音波ヘッド10と刃付きシリンダ12との間
に、加工対象の用紙14が通される。用紙14は、ロー
ラ16,18からなる搬送機構により搬送される。搬送
機構の駆動源は、通常のモータであり、図示を省略し
た。
FIG. 1 is a schematic block diagram showing an embodiment of the present invention. The present embodiment is applied to an apparatus for cutting out a part of a sheet. Reference numeral 10 denotes an ultrasonic head, which faces the cylinder 12 with a blade and is disposed at an appropriate interval in a direction in which ultrasonic waves are emitted toward the cylinder 12 with a blade. Paper 14 to be processed is passed between the ultrasonic head 10 and the bladed cylinder 12. The paper 14 is transported by a transport mechanism including rollers 16 and 18. The drive source of the transport mechanism is a normal motor, and is not shown.

【0014】理由は後述するが、本実施例では、超音波
ヘッド10の先端部(超音波照射面)と刃付きシリンダ
12との間隔は、厳密に一定である必要はない。用紙1
4の厚みによっては、超音波ヘッド10の先端部(超音
波照射面)と刃付きシリンダ12との間隔を調整する必
要がある。
Although the reason will be described later, in the present embodiment, the interval between the tip portion (ultrasonic irradiation surface) of the ultrasonic head 10 and the bladed cylinder 12 does not need to be strictly constant. Paper 1
Depending on the thickness of 4, it is necessary to adjust the distance between the tip of the ultrasonic head 10 (ultrasonic irradiation surface) and the bladed cylinder 12.

【0015】本実施例では、超音波ヘッド10の先端面
と刃付きシリンダ12との間の距離を測定する距離測定
装置20を設けると共に、刃付きシリンダ12の回転位
置を検出するロータリ・エンコーダ22を設けてある。
距離測定装置20の測定結果及びロータリ・エンコーダ
22の検出角度情報は、制御回路24に印加される。制
御回路24には、他に、用紙14の厚み及び素材並びに
刃付きシリンダ12の刃の分布を示す情報が入力され
る。
In this embodiment, a distance measuring device 20 for measuring the distance between the tip end surface of the ultrasonic head 10 and the bladed cylinder 12 is provided, and a rotary encoder 22 for detecting the rotational position of the bladed cylinder 12 is provided. Is provided.
The measurement result of the distance measuring device 20 and the detected angle information of the rotary encoder 22 are applied to the control circuit 24. In addition, information indicating the thickness and the material of the paper 14 and the distribution of the blades of the bladed cylinder 12 are input to the control circuit 24.

【0016】制御回路24はこれらの入力情報から超音
波ヘッド10の発生する超音波の振動振幅が用紙14の
加工目的に対して適切なものになるように(例えば、1
00μm程度)、超音波発振回路26を制御する。超音
波発振回路26は、制御回路24により指定された振幅
又は電力の交流信号を生成し、超音波ヘッド10の超音
波振動子に印加する。
The control circuit 24 determines from the input information that the vibration amplitude of the ultrasonic wave generated by the ultrasonic head 10 is appropriate for the purpose of processing the paper 14 (for example, 1).
The ultrasonic oscillation circuit 26 is controlled. The ultrasonic oscillation circuit 26 generates an AC signal having an amplitude or power specified by the control circuit 24 and applies the AC signal to the ultrasonic transducer of the ultrasonic head 10.

【0017】図2は、超音波ヘッド10、刃付きシリン
ダ12、並びに、超音波ヘッド10と刃付きシリンダ1
2の間に挿通された用紙14の斜視図を示す。超音波ヘ
ッド10は、周知の通り、発振回路26からの17kH
z乃至100kHzの交流信号により駆動されて超音波
を発生する超音波振動子30、超音波振動子30の発生
する超音波を増幅するブースタ32、ブースタ32で増
幅された超音波を、刃付きシリンダ12の回転軸に平行
な直線上に収束するホーン34からなる。本実施例で
は、用紙14を四角に切り抜くような刃36を刃付きシ
リンダ12に設けてある。
FIG. 2 shows the ultrasonic head 10, the bladed cylinder 12, and the ultrasonic head 10 and the bladed cylinder 1.
2 shows a perspective view of a sheet 14 inserted between the sheets 2. As is well known, the ultrasonic head 10 receives 17 kHz from the oscillation circuit 26.
An ultrasonic vibrator 30 that is driven by an AC signal of z to 100 kHz to generate ultrasonic waves, a booster 32 that amplifies the ultrasonic waves generated by the ultrasonic vibrator 30, a ultrasonic cylinder amplified by the booster 32, and a cylinder with a blade The horn 34 converges on a straight line parallel to the twelve rotation axes. In this embodiment, a blade 36 for cutting the paper 14 into a square is provided in the bladed cylinder 12.

【0018】図3は、本実施例の制御回路24による制
御動作のフローチャートを示す。図4は、本実施例によ
る加工パターンを示す。図4(a)は超音波ヘッド10
のホーン34の開口が、四角い加工パターンの、用紙1
4の進行方向に垂直な方向に長い辺に対面しているとき
の、ホーン34の配置を示し、図4(b)は、四角い加
工パターンの中間にホーン34の開口が対面していると
きの、ホーン34の配置を示す。図4(a)の場合が、
切断長が最も長くなるので、超音波ヘッド10の発生す
る超音波の振動エネルギーを最大にする必要がある。こ
れに対して、図4(b)に示す状態では、超音波ヘッド
10の発生する超音波の振動エネルギーを比較的小さく
する。
FIG. 3 shows a flowchart of a control operation by the control circuit 24 of the present embodiment. FIG. 4 shows a processing pattern according to the present embodiment. FIG. 4A shows the ultrasonic head 10.
Horn 34 has a square processing pattern,
4 shows the arrangement of the horn 34 when facing the long side in the direction perpendicular to the traveling direction of FIG. 4, and FIG. 4B shows the case where the opening of the horn 34 faces the middle of the square processing pattern. , Horn 34 are shown. In the case of FIG.
Since the cutting length is the longest, it is necessary to maximize the vibration energy of the ultrasonic waves generated by the ultrasonic head 10. On the other hand, in the state shown in FIG. 4B, the vibration energy of the ultrasonic waves generated by the ultrasonic head 10 is made relatively small.

【0019】図3を参照して、本実施例の動作を説明す
る。先ず、加工しようとする用紙14の厚み及び素材、
並びに、刃付きシリンダ12の刃の分布の情報を制御回
路24にセットする(S1)。加工しようとする用紙1
4を、ローラ16,18からなる搬送装置により刃付き
シリンダ12の刃に極く近く、例えば、ぎりぎり接する
程度に搬送し、刃付きシリンダ12を用紙14の搬送に
同期させて回転する。
The operation of this embodiment will be described with reference to FIG. First, the thickness and material of the paper 14 to be processed,
In addition, information on the distribution of the blades of the bladed cylinder 12 is set in the control circuit 24 (S1). Paper 1 to be processed
The roller 4 is transported by a transport device including rollers 16 and 18 very close to, for example, the blade of the bladed cylinder 12, for example, so that the blade 4 comes into close contact therewith.

【0020】距離測定装置20は、超音波ヘッド10と
刃付きシリンダ12との間の距離を測定し、測定結果を
制御回路24に供給する。また、ロータリ・エンコーダ
22は、刃付きシリンダ12の回転角度位置情報を制御
回路24に供給する。制御回路24は、これらの情報を
取り込み(S2,S3)、先に入力された、用紙14の
厚み及び素材並びに刃付きシリンダ12の刃の分布情報
と併せて、目的の加工に最適な、超音波振動子30の振
動振幅を算出する(S4)。この算出には、例えば、試
験的な加工を繰り返して、各状況に対して最適な振幅値
を予め調べておき、その対応表を制御回路24に格納し
ておけばよい。
The distance measuring device 20 measures the distance between the ultrasonic head 10 and the bladed cylinder 12, and supplies the measurement result to the control circuit 24. Further, the rotary encoder 22 supplies rotation angle position information of the bladed cylinder 12 to the control circuit 24. The control circuit 24 fetches the information (S2, S3) and, together with the previously input information on the thickness and the material of the paper 14 and the distribution information of the blades of the bladed cylinder 12, provides the optimum The vibration amplitude of the sonic transducer 30 is calculated (S4). For this calculation, for example, a trial processing may be repeated to find the optimum amplitude value for each situation in advance, and the correspondence table may be stored in the control circuit 24.

【0021】制御回路24は、発振回路26を制御し
て、算出された振幅値になるような駆動電流を超音波ヘ
ッド10の超音波振動子30に供給させる(S5)。超
音波ヘッド10が発生する超音波の機械力で用紙14が
刃付きシリンダ12に押し付けられ、刃付きシリンダ1
2の刃36により、図2に示すように四角が切り抜かれ
る。加工しようとする用紙14の厚み及び素材、刃付き
シリンダ12の刃の分布、並びに、超音波ヘッド10と
刃付きシリンダ12との距離に応じて適応的に、超音波
ヘッド10の発生する超音波の振幅を制御するので、最
適な切断結果を得ることができる。
The control circuit 24 controls the oscillation circuit 26 to supply a drive current having the calculated amplitude value to the ultrasonic transducer 30 of the ultrasonic head 10 (S5). The paper 14 is pressed against the bladed cylinder 12 by the mechanical force of the ultrasonic waves generated by the ultrasonic head 10,
A square is cut out by the second blade 36 as shown in FIG. The ultrasonic waves generated by the ultrasonic head 10 adaptively according to the thickness and the material of the paper 14 to be processed, the distribution of the blades of the bladed cylinder 12, and the distance between the ultrasonic head 10 and the bladed cylinder 12. , The optimum cutting result can be obtained.

【0022】用紙14の変更がなければ(S6)、S2
以降を繰り返し、用紙14の変更があれば、S1に戻
り、用紙14の厚みなどの情報入力を再び実行する。
If there is no change in the paper 14 (S6), S2
The subsequent steps are repeated, and if there is a change in the sheet 14, the process returns to S1, and information such as the thickness of the sheet 14 is input again.

【0023】このようにして、本実施例では、超音波ヘ
ッド10自体を移動させなくてもよくなるので、従来例
での問題が完全に解決される。また、超音波ヘッドの発
生する超音波の振幅を電気的に制御するだけでよいの
で、低速のマイクロコントローラなどでも実現でき、安
価で安定な装置になる。
As described above, in the present embodiment, it is not necessary to move the ultrasonic head 10 itself, so that the problem in the conventional example is completely solved. Further, since it is only necessary to electrically control the amplitude of the ultrasonic wave generated by the ultrasonic head, it can be realized even by a low-speed microcontroller or the like, and the device is inexpensive and stable.

【0024】切断の深さを振動振幅により制御できるの
で、例えば、段ボールに浅い切り込みを入れることや、
2枚の用紙を接着したものの片方のみに切り込みを入れ
ることも容易に実現できる。
Since the cutting depth can be controlled by the vibration amplitude, for example, a shallow cut in a corrugated cardboard,
It is also easy to realize a cut in only one of the two sheets bonded together.

【0025】[0025]

【発明の効果】以上の説明から容易に理解できるよう
に、本発明によれば、安定に動作し、加工性能の良い超
音波加工装置を実現できる。加工性能の調整のために超
音波ヘッド自体を被加工物に対して移動させる必要が無
くなるので、生産ラインへの適用も容易になる。
As can be easily understood from the above description, according to the present invention, an ultrasonic processing apparatus which operates stably and has good processing performance can be realized. Since it is not necessary to move the ultrasonic head itself with respect to the workpiece in order to adjust the processing performance, application to a production line is facilitated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の一実施例の概略構成ブロック図であ
る。
FIG. 1 is a schematic block diagram of an embodiment of the present invention.

【図2】 本実施例の超音波ヘッド10、刃付きシリン
ダ12及び用紙14の位置関係を示す斜視図である。
FIG. 2 is a perspective view showing a positional relationship among an ultrasonic head 10, a bladed cylinder 12, and a sheet 14 of the present embodiment.

【図3】 本実施例の動作フローチャートである。FIG. 3 is an operation flowchart of the embodiment.

【図4】 加工位置と音圧の関係の説明図である。FIG. 4 is an explanatory diagram of a relationship between a processing position and a sound pressure.

【符号の説明】[Explanation of symbols]

10:超音波ヘッド 12:刃付きシリンダ 14:用紙 16,18:ローラ 20:距離測定装置 22:ロータリ・エンコーダ 24:制御回路 26:超音波発振回路 30:超音波振動子 32:ブースタ 34:ホーン 36:刃 10: Ultrasonic head 12: Cylinder with blade 14: Paper 16, 18: Roller 20: Distance measuring device 22: Rotary encoder 24: Control circuit 26: Ultrasonic oscillation circuit 30: Ultrasonic oscillator 32: Booster 34: Horn 36: Blade

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 被加工物に超音波エネルギーを照射して
加工する超音波加工装置であって、 超音波ヘッドと、 当該超音波ヘッドの超音波放射面との間に、当該被加工
物を挿通し得る間隔を開けて配置され、当該被加工物を
加工する加工部材と、 当該被加工物を当該超音波ヘッドと当該加工部材との間
に搬送する搬送部材と、 当該超音波ヘッドの超音波振動子を駆動する駆動回路
と、 当該超音波ヘッドと当該加工部材との間の距離を測定す
る距離測定手段と、 当該距離測定手段の測定距離に従い、当該駆動回路を制
御して、当該超音波ヘッドの放射音波の振幅を所定値に
制御する制御手段とからなることを特徴とする超音波加
工装置。
An ultrasonic processing apparatus for irradiating a workpiece with ultrasonic energy to process the workpiece, wherein the workpiece is disposed between an ultrasonic head and an ultrasonic radiation surface of the ultrasonic head. A processing member that is disposed at an interval capable of being inserted and processes the workpiece, a transport member that transports the workpiece between the ultrasonic head and the processing member, A drive circuit for driving the ultrasonic transducer, a distance measuring means for measuring a distance between the ultrasonic head and the processing member, and a drive circuit for controlling the drive circuit in accordance with a measurement distance of the distance measuring means. An ultrasonic processing apparatus comprising: a control unit that controls an amplitude of a radiation sound wave of a sound wave head to a predetermined value.
【請求項2】 当該加工部材が、当該被加工物の搬送速
度に同期して回転し、当該被加工物に対する加工刃を具
備する刃付きシリンダである請求項1に記載の超音波加
工装置。
2. The ultrasonic processing apparatus according to claim 1, wherein the processing member is a bladed cylinder that rotates in synchronization with a transfer speed of the workpiece and includes a processing blade for the workpiece.
【請求項3】 更に、当該刃付きシリンダの回転位置を
検出する回転位置検出手段を具備し、 当該制御回路には、当該刃付きシリンダの刃の分布を示
す情報が入力され、 当該制御回路は、当該距離測定手段の測定距離及び当該
回転位置検出手段により検出された当該刃付きシリンダ
の回転位置に応じて当該駆動回路を制御して、当該超音
波ヘッドの放射音波の振幅を所定値に制御する請求項2
に記載の超音波加工装置。
And a rotation position detecting means for detecting a rotation position of the bladed cylinder. The control circuit is supplied with information indicating a distribution of the blades of the bladed cylinder. Controlling the drive circuit in accordance with the measured distance of the distance measuring means and the rotational position of the bladed cylinder detected by the rotational position detecting means to control the amplitude of the radiated sound wave of the ultrasonic head to a predetermined value. Claim 2
The ultrasonic processing apparatus according to item 1.
【請求項4】 当該制御手段には更に、被加工物の厚み
及び素材の情報が入力され、これらの情報も加味して当
該駆動回路を制御し、当該超音波ヘッドの振動の振幅を
所定値に制御する請求項1に記載の超音波加工装置。
4. The controller further receives information on the thickness and the material of the workpiece, controls the drive circuit in consideration of the information, and sets the amplitude of the vibration of the ultrasonic head to a predetermined value. The ultrasonic processing apparatus according to claim 1, wherein the ultrasonic processing apparatus controls the ultrasonic processing.
【請求項5】 当該被加工物が紙材である請求項1乃至
4の何れか1項に記載の超音波加工装置。
5. The ultrasonic processing apparatus according to claim 1, wherein the workpiece is a paper material.
【請求項6】 被加工物に超音波エネルギーを照射して
加工する超音波加工装置であって、 超音波ヘッドと、 当該超音波ヘッドの超音波放射面との間に、当該被加工
物を挿通し得る間隔を開けて配置され、当該被加工物を
加工する加工部材と、 当該被加工物を当該超音波ヘッドと当該加工部材との間
に搬送する搬送部材と、 当該超音波ヘッドの超音波振動子を駆動する駆動回路
と、 当該加工部材による当該被加工物の加工量に従い当該駆
動回路を制御して、当該超音波ヘッドの放射音波の振幅
を所定値に制御する制御手段とからなることを特徴とす
る超音波加工装置。
6. An ultrasonic processing apparatus for processing a workpiece by irradiating the workpiece with ultrasonic energy, wherein the workpiece is disposed between an ultrasonic head and an ultrasonic radiation surface of the ultrasonic head. A processing member that is disposed at an interval capable of being inserted and processes the workpiece, a transport member that transports the workpiece between the ultrasonic head and the processing member, A drive circuit for driving the ultrasonic vibrator; and control means for controlling the drive circuit in accordance with the processing amount of the workpiece by the processing member and controlling the amplitude of the radiation sound wave of the ultrasonic head to a predetermined value. An ultrasonic processing apparatus characterized by the above-mentioned.
【請求項7】 当該加工部材が、当該被加工物の搬送速
度に同期して回転し、当該被加工物に対する加工刃を具
備する刃付きシリンダである請求項6に記載の超音波加
工装置。
7. The ultrasonic processing apparatus according to claim 6, wherein the processing member is a bladed cylinder that rotates in synchronization with a transfer speed of the workpiece and includes a processing blade for the workpiece.
【請求項8】 更に、当該刃付きシリンダの回転位置を
検出する回転位置検出手段を具備し、 当該制御回路には当該刃付きシリンダの刃の分布を示す
情報が入力され、 当該制御回路は、当該回転位置検出手段により検出され
た当該刃付きシリンダの回転位置に応じて当該駆動回路
を制御して、当該超音波ヘッドの振動の振幅を所定値に
制御する請求項7に記載の超音波加工装置。
And a rotation position detecting means for detecting a rotation position of the bladed cylinder, wherein the control circuit is supplied with information indicating a distribution of blades of the bladed cylinder; 8. The ultrasonic processing according to claim 7, wherein the drive circuit is controlled in accordance with the rotational position of the bladed cylinder detected by the rotational position detection means, and the amplitude of the vibration of the ultrasonic head is controlled to a predetermined value. apparatus.
【請求項9】 当該制御手段には更に、被加工物の厚み
及び素材の情報が入力され、これらの情報も加味して当
該駆動回路を制御し、当該超音波ヘッドの振動の振幅を
所定値に制御する請求項6に記載の超音波加工装置。
9. The control means further receives information on the thickness and the material of the workpiece, controls the drive circuit in consideration of the information, and sets the amplitude of the vibration of the ultrasonic head to a predetermined value. The ultrasonic processing apparatus according to claim 6, wherein the ultrasonic processing is controlled at a time.
【請求項10】 当該被加工物が紙材である請求項6乃
至4の何れか8項に記載の超音波加工装置。
10. The ultrasonic processing apparatus according to claim 6, wherein the workpiece is a paper material.
JP8599398A 1998-03-31 1998-03-31 Ultrasonic machining device Pending JPH11277500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8599398A JPH11277500A (en) 1998-03-31 1998-03-31 Ultrasonic machining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8599398A JPH11277500A (en) 1998-03-31 1998-03-31 Ultrasonic machining device

Publications (1)

Publication Number Publication Date
JPH11277500A true JPH11277500A (en) 1999-10-12

Family

ID=13874197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8599398A Pending JPH11277500A (en) 1998-03-31 1998-03-31 Ultrasonic machining device

Country Status (1)

Country Link
JP (1) JPH11277500A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6537403B1 (en) 2001-12-18 2003-03-25 Kimberly-Clark Worldwide, Inc. Nip adjustment for a rigid ultrasonic bonder or processor
FR2829961A1 (en) * 2001-09-25 2003-03-28 Clip Off Ultrasound welding procedure and apparatus for two or more films uses uniform level of ultrasound radiation in lengthwise and transverse directions
US6547903B1 (en) 2001-12-18 2003-04-15 Kimberly-Clark Worldwide, Inc. Rotary ultrasonic bonder or processor capable of high speed intermittent processing
US6613171B2 (en) 2001-12-18 2003-09-02 Kimberly-Clark Worldwide, Inc. Rotary ultrasonic bonder or processor capable of fixed gap operation
US6620270B2 (en) 2001-12-18 2003-09-16 Kimberly-Clark Worldwide, Inc. Control of processing force and process gap in rigid rotary ultrasonic systems
US6676003B2 (en) 2001-12-18 2004-01-13 Kimberly-Clark Worldwide, Inc. Rigid isolation of rotary ultrasonic horn
JP2009285835A (en) * 2008-05-27 2009-12-10 Daiwa Can Co Ltd Trimming method for polyester resin container
WO2014065401A1 (en) * 2012-10-26 2014-05-01 株式会社アドウェルズ Apparatus for cutting process
CN104842400A (en) * 2015-04-17 2015-08-19 苏州琼派瑞特电子科技有限公司 Cutting mechanism of magic tape cutting machine
CN106737996A (en) * 2017-03-08 2017-05-31 长葛市大阳纸业有限公司 The tipping paper cutter that cut-off knife is automatically controlled
CN113211507A (en) * 2021-04-25 2021-08-06 安徽万创医疗科技有限公司 Wet piece of cloth production and processing equipment disinfects

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2829961A1 (en) * 2001-09-25 2003-03-28 Clip Off Ultrasound welding procedure and apparatus for two or more films uses uniform level of ultrasound radiation in lengthwise and transverse directions
US6537403B1 (en) 2001-12-18 2003-03-25 Kimberly-Clark Worldwide, Inc. Nip adjustment for a rigid ultrasonic bonder or processor
US6547903B1 (en) 2001-12-18 2003-04-15 Kimberly-Clark Worldwide, Inc. Rotary ultrasonic bonder or processor capable of high speed intermittent processing
WO2003051532A1 (en) * 2001-12-18 2003-06-26 Kimberly-Clark Worldwide, Inc. Rotary ultrasonic bonder or processor capable of high speed intermittent processing
US6613171B2 (en) 2001-12-18 2003-09-02 Kimberly-Clark Worldwide, Inc. Rotary ultrasonic bonder or processor capable of fixed gap operation
US6620270B2 (en) 2001-12-18 2003-09-16 Kimberly-Clark Worldwide, Inc. Control of processing force and process gap in rigid rotary ultrasonic systems
US6676003B2 (en) 2001-12-18 2004-01-13 Kimberly-Clark Worldwide, Inc. Rigid isolation of rotary ultrasonic horn
JP2009285835A (en) * 2008-05-27 2009-12-10 Daiwa Can Co Ltd Trimming method for polyester resin container
WO2014065401A1 (en) * 2012-10-26 2014-05-01 株式会社アドウェルズ Apparatus for cutting process
CN104842400A (en) * 2015-04-17 2015-08-19 苏州琼派瑞特电子科技有限公司 Cutting mechanism of magic tape cutting machine
CN106737996A (en) * 2017-03-08 2017-05-31 长葛市大阳纸业有限公司 The tipping paper cutter that cut-off knife is automatically controlled
CN113211507A (en) * 2021-04-25 2021-08-06 安徽万创医疗科技有限公司 Wet piece of cloth production and processing equipment disinfects

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