JPH11276433A - Electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic endoscope having a further thinned tip part, and having no orientation irregularity, in which assemblage workability is considered. SOLUTION: On a solid camera element substrate 21A, a CCD camera part 22, and a light emitting part 23 comprising a plurality of light emitting elements 23A collected and disposed are arranged. In this solid camera element substrate 21A, a through hole 24 for a treatment member tube in which a tube for a treatment member is inserted, a through hole 25 for a gas feeding/water feeding tube in which a gas feeding/water feeding tube is inserted, and a through hole 26 for a suction tube in which a suction tube is inserted are formed. In making the respective tubes communicate with an opening for a treatment member disposed at a tip part, a gas feeding/water feeding nozzle, and a suction through hole, these tubes are connected through the through holes 24, 25, 26 corresponding to the respective tubes formed in the solid camera element substrate 21A to compose an endoscope, thereby diameter of the tip part of the endoscope can be thinned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electronic endoscope having a light-emitting element as a light source for illumination provided on a surface of a solid-state imaging device substrate.

[0002]

2. Description of the Related Art Conventionally, an elongated insertion portion is inserted into a body cavity to observe organs in the body cavity, and, when necessary, to perform various treatments using a treatment tool inserted into a treatment tool channel. Medical endoscopes that can be used are widely used.

[0003] In recent years, with the development of electronic technology, computerization has advanced in the field of endoscopes, and electronic endoscopes using a solid-state imaging device such as a charge-coupled device (CCD) as imaging means have been used. . In this electronic endoscope, an imaging device is provided on a distal end hard portion constituting an endoscope distal end portion, and the imaging device includes an observation optical system including a plurality of lens systems in order from a distal end side, and a solid-state imaging device. And a circuit board on which electronic components for amplifying the output of the solid-state imaging device are mounted. Recently, as the size of the solid-state imaging device has been reduced, it has been desired to reduce the diameter of the insertion portion.

In order to meet the demand for miniaturization from the user side, for example, Japanese Patent Application Laid-Open No. 6-153097 discloses a solid-state imaging device in which a light-emitting device is formed on the surface of a solid-state imaging device and used as a light source for illumination. There has been disclosed a solid-state imaging device which does not require a separate illumination light source to achieve downsizing and a simplified structure.

[0005]

However, in the endoscope, a treatment instrument insertion channel for guiding the treatment instrument and an air supply / supply channel are provided.
Since various channels such as a channel for water supply are inserted, the above-mentioned Japanese Patent Application Laid-Open No. Hei 6-153
By simply arranging the solid-state imaging device disclosed in Japanese Patent No. 097,
Since the sum of the diameter of the channel provided in the endoscope and the outer dimensions of the solid-state imaging device becomes the inner diameter of the endoscope end portion, the limit of miniaturization of the outer dimensions of the solid-state imaging device is limited. This is the limit of reducing the diameter of the endoscope tip.
In addition, a configuration in which the light-emitting elements are simply arranged on the solid-state imaging element has a problem that insufficient light quantity and uneven light distribution occur. Furthermore, there has been a problem that no contrivance has been made for actually incorporating the solid-state imaging device substrate into the endoscope end portion.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic endoscope in which the end portion of the endoscope is made thinner, the orientation is not uneven, and the workability in assembling is considered. I am aiming.

[0007]

An electronic endoscope according to the present invention comprises:
A light-emitting element is provided on a surface of a solid-state imaging device substrate, and the electronic endoscope uses the light-emitting device as a light source for illumination. The solid-state imaging device substrate is provided with a through hole for inserting a tube for a channel.

According to this structure, the diameter of the distal end of the endoscope can be reduced by disposing the channel tube passing through the inside of the endoscope in the solid-state imaging device substrate provided with the light emitting element.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to an embodiment of the present invention. FIG. 1 is an explanatory diagram showing a configuration example of an endoscope device provided with an electronic endoscope. FIG. 2 is a view showing a distal end portion of an insertion portion of the endoscope. FIG. 3 is a diagram illustrating the configuration, and FIG. 3 is an explanatory diagram illustrating the configuration of a solid-state imaging device substrate.

As shown in FIG. 1, an electronic endoscope (hereinafter abbreviated as an endoscope) 1 has an elongated insertion portion 2 which can be inserted into a body cavity or the like. From the side, a distal end portion 3 having a rigid distal end member, a bending portion 4 connected to a plurality of bending pieces and capable of bending vertically and horizontally, and a flexible tube portion 5 having flexibility are provided in series.

An operation portion 6 also serving as a grip portion is provided at the proximal end of the insertion portion 2, and a universal cord 7 into which a signal cable or the like is inserted extends from the side of the operation portion 6. . A connector 8 is provided at an end of the universal cord 7, and a camera control unit (hereinafter, referred to as a CCU) 9 which is an external device constituting the endoscope device and the electronic device via the connector 8. Endoscope 1
And are detachably connected. This CC
In U9, a charge-coupled device (abbreviated as CCD), which is one of the solid-state imaging devices described later provided in the distal end portion 3
An electric signal of the subject, which is formed on the imaging unit and photoelectrically converted, is generated as a video signal, and the video signal is transmitted to the monitor 11 via the signal cable 10 to display an endoscopic image on a screen for observation. Can be done. Reference numeral 12 denotes a treatment tool insertion port for guiding a treatment tool such as a grasping forceps into a body cavity through a treatment tool insertion channel provided in the endoscope.

As shown in FIG. 2, the endoscope 1 of this embodiment is a direct-view type endoscope in which an observation lens cover 13 and an illumination lens cover 14 are disposed on a distal end surface 3a of a distal end portion 3. The treatment instrument insertion port 1 provided on the operation unit 6 is provided on the surface 3a.
Air for removing water droplets and dirt attached to the surface of the treatment instrument opening 15 and the surface of the observation lens cover 13 and the illumination lens cover 14 serving as an introduction port for introducing the treatment instrument inserted through the body cavity into the body cavity. An air supply / water supply nozzle 16 for ejecting water or water toward the cover surface is provided.

A solid imaging element substrate 21A having a substantially circular disk shape is provided on a rigid tip member (not shown) forming the tip portion 3. The solid-state imaging device substrate 21A is adapted to be engaged in a substrate arrangement hole formed in the rigid tip member (not shown) and having a shape substantially the same as the outer shape of the solid-state imaging device substrate 21A. .

A treatment instrument tube 24a, which is a tube for a treatment instrument constituting a treatment instrument insertion channel, communicates with the treatment instrument insertion port 12 provided on the distal end surface 3a. An air supply / water supply tube 25a, which is a tube for the air supply / water supply channel, communicates with the suction opening 26a, which is a channel tube, and a suction opening (not shown).

[0015] As shown in FIG.
A CCD imaging unit 22 on which an optical image of a test portion is formed through the observation lens cover 13 on a surface 21a of the 1A;
At a position corresponding to the illumination lens cover 14, a plurality of light emitting elements 23a are collectively arranged, and a light emitting section 23 is provided in consideration of light quantity and light distribution.

A treatment tool tube 24a having one end communicating with the treatment instrument opening 15 and the other end communicating with the treatment instrument insertion port 12 is inserted into the solid-state imaging device substrate 21A. Hole 24 and the air / water nozzle 1
One end communicates with an air supply / water supply tube through-hole 25 through which an air supply / water supply tube 25a is inserted, and one end communicates with a suction opening (not shown). The other end of the suction tube 26a communicates with an external device (not shown).
Are formed. The tube through-hole 24,
The diameters of the tubes 25 and 26 are formed to be larger than the outer diameters of the tubes constituting each channel tube. In addition, by using the treatment instrument tube 24a or the air / water supply tube 25a as a suction tube, the suction tube 26a may be omitted to reduce the total number of tubes.

The solid-state imaging device substrate 2 configured as described above
The operation of 1A will be described. A treatment instrument tube 24a, an air / water supply tube 25a, and a suction tube 26a are provided in the treatment instrument opening 15, the air supply / water supply nozzle 16, and the suction through hole provided in the distal end portion 3 of the endoscope 1. When the tubes 24a, 25a, and 26a are respectively communicated with each other, the tubes 24a, 25a, and 26a are respectively formed in the solid-state imaging device substrate 21A through the treatment tool tube through-holes 24, the air / water supply tube through-holes 25, and the suction tube through-holes 26. Connect through the hole. After that, the solid-state imaging device substrate 21A is arranged and fixed at a predetermined position of the rigid distal end member constituting the distal end portion 3.

As described above, a through hole for a tube through which a tube for a channel, for example, a treatment instrument tube, an air supply / water supply tube, and a suction tube, which are provided for the endoscope, is formed in the solid-state imaging device substrate. By configuring the endoscope by inserting the channel tubes corresponding to these tube through holes, it is possible to reduce the diameter of the endoscope distal end.

Further, by providing a plurality of light emitting elements collectively at positions corresponding to the illumination lens cover and providing a light emitting section, illumination light emitted from each light emitting element can be efficiently detected from the illumination lens cover. Part can be irradiated.

[0020] By these, the lighting performance is good,
It is possible to provide an electronic endoscope in which the diameter of the distal end of the endoscope is reduced.

Further, by forming the outer shape of the solid-state imaging device substrate and the inner peripheral surface shape of the substrate disposing hole formed in the rigid distal end member constituting the distal end portion substantially in conformity with each other, the solid-state imaging device substrate is incorporated. Workability can be significantly improved, and water-tightness and air-tightness can be easily maintained between the distal end portion and the imaging element substrate.

FIG. 4 is an explanatory diagram showing another configuration of the solid-state imaging device substrate according to an application example of the first embodiment. As shown in the figure, in the present embodiment, the CCD imaging unit 22 is used.
And a strip-shaped light emitting element installation portion 27 as shown by oblique lines is provided on the outer peripheral side of the solid-state imaging element substrate 21A so as to surround the plurality of tube through holes 24, 25, 26 formed in the solid-state imaging element substrate 21A. A plurality of light emitting elements are arranged in the light emitting element installation part 27. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

As described above, by disposing a plurality of light emitting elements on the light emitting element installation portion provided on the outer peripheral side of the solid-state image pickup device substrate, it is possible to provide an appropriate illumination light for preventing illumination light distribution unevenness. Irradiation can be performed from the cover toward the test portion.

Further, since a plurality of light emitting elements are arranged on the outer peripheral side of the solid-state image pickup device substrate, the area of the solid-state image pickup device substrate can be reduced by effectively utilizing the area of the solid-state image pickup device substrate, and the endoscope end portion can be formed. The diameter can be reduced.

FIG. 5 is an explanatory diagram showing the configuration of the outer peripheral surface of the solid-state image sensor substrate according to the first embodiment and a modification of the application example. In the present embodiment, a groove 28 having a V-shaped cross section is formed on the outer peripheral surface 21b of the solid-state imaging device substrate 21A as shown in FIG. 5A, or a cross-sectional shape is formed on the outer peripheral surface 21b as shown in FIG. A U-shaped groove 29 is formed. The cross-sectional shape of the groove formed on the outer peripheral surface 21b is not limited to a V-shape or a U-shape, but may be a u-shape or the like. Also, the grooves 28,
29 may be formed at a constant interval with respect to the outer peripheral surface 21b, or may be irregularly formed at an arbitrary interval.

As described above, by providing the groove on the outer peripheral surface of the solid-state image sensor substrate, the inner peripheral surface of the arrangement hole when the solid-state image sensor substrate is engaged with the substrate arrangement hole provided in the rigid member at the distal end. In addition to reducing the contact resistance between the substrate and the outer peripheral surface of the solid-state imaging device substrate, the mounting workability can be improved, and the adhesive is sufficiently spread over the outer peripheral surface by applying the adhesive through the groove. The adhesive strength to the inner peripheral surface of the arrangement hole of the solid-state imaging element substrate can be improved.

In the above-described embodiment, the solid-state imaging device substrate is formed in a disk shape and the configuration used for a direct-view endoscope. However, the endoscope is replaced with a direct-view endoscope. It is not limited, and the outer shape of the solid-state imaging device substrate is not limited to a disk shape. As shown in FIG. 6, a solid-state imaging device substrate having a rectangular shape is applied to a side-view type endoscope. You may.

FIG. 6A is an explanatory diagram showing a schematic configuration of a distal end portion of a side-viewing type endoscope, FIG. 6B is an explanatory diagram showing a configuration of a solid-state imaging device substrate, and FIG. It is explanatory drawing which shows the application example of an imaging element board.

In the case of a side-view type endoscope in which an observation lens cover and an illumination lens cover (not shown) are disposed on the side surface of the distal end portion as shown in FIG. An opening for a treatment tool also serving as an opening and an air / water supply nozzle are provided, and for example, the outer shape is formed in a square shape so as to substantially correspond to a substrate disposing hole provided in a not-shown hard tip member constituting the tip portion 3. A solid-state imaging device substrate 21B is provided.

As shown in FIGS. 3A and 3B, a CCD image pickup section 22 on the surface 21a of the solid-state image pickup device substrate 21B, through which the optical image of the test section is formed through the observation lens cover, A plurality of light emitting elements 23a arranged at positions corresponding to the illumination lens cover are collectively arranged to provide a light emitting section 23 in consideration of light quantity and light distribution. A treatment instrument tube through-hole 24 through which a treatment instrument tube (not shown) that communicates with the treatment instrument opening and the treatment instrument insertion port 12, and an air / water supply tube that communicates with the air / water nozzle. (Not shown) and a through hole 25 for an air supply / water supply tube to be inserted. Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted. With this configuration, the same operation and effect as in the above embodiment can be obtained.

Further, as shown in FIG.
A light emitting element installation part 27 provided in a band shape as shown by oblique lines on the outer peripheral side of the solid state imaging element substrate 21B so as to surround the plurality of tube through holes 24 and 25 formed in the imaging part 22 and the solid state imaging element substrate 21B. By arranging a plurality of light-emitting elements on the illuminator, it is possible to irradiate an appropriate illumination light from the illumination lens cover to the portion to be inspected while preventing uneven light distribution of the illumination light, and the area of the solid-state imaging element substrate. Can be effectively used to reduce the area of the solid-state imaging device substrate, thereby making it possible to reduce the diameter of the endoscope end portion.

The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the spirit of the invention.

[Appendix] According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.

(1) A light-emitting element is provided on the surface of a solid-state image sensor substrate, and in the electronic endoscope using the light-emitting element as a light source for illumination, a through-hole for inserting a tube for a channel is provided in the solid-state image sensor substrate. Electronic endoscope.

(2) The electronic endoscope according to appendix 1, wherein the light-emitting element is disposed so as to surround an imaging section of the solid-state imaging element and the through hole.

(3) The electronic endoscope according to appendix 1, wherein an outer shape of the solid-state imaging device substrate is a circle or a square.

(4) The electronic endoscope according to appendix 3, wherein a plurality of grooves are provided on the outer peripheral surface of the solid-state imaging device substrate.

[0038]

As described above, according to the present invention, it is possible to provide an electronic endoscope in which the diameter of the distal end portion of the endoscope is made smaller, the orientation is not uneven, and the workability in assembling is considered. .

[Brief description of the drawings]

FIG. 1 to FIG. 3 relate to an embodiment of the present invention,
FIG. 1 is an explanatory diagram illustrating a configuration example of an endoscope apparatus including an electronic endoscope.

FIG. 2 is a diagram illustrating a configuration of a distal end portion of an insertion section of an endoscope.

FIG. 3 is an explanatory diagram illustrating a configuration of a solid-state imaging device substrate.

FIG. 4 is an explanatory diagram showing another configuration of the solid-state imaging device substrate according to the application example of the first embodiment;

FIG. 5 is an explanatory diagram illustrating a configuration of an outer peripheral surface of a solid-state imaging device substrate according to a modification of the first embodiment and an application example.

FIG. 6 is an explanatory diagram showing a state in which a rectangular solid-state imaging device substrate is applied to a side-viewing type endoscope;

[Explanation of symbols]

 21A, 21B: solid-state imaging device substrate 22: CCD imaging unit 23: light emitting unit 23a: light emitting device 24: through hole for treatment instrument tube 25: through hole for air / water supply tube 26: through hole for suction tube

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 27/15 H01L 27/14 B (72) Inventor Keiichi Arai 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. Within the company (72) Koichi Yoshimitsu 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Makoto Tsunakawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo Stock of Olympus Optical Within the company (72) Inventor Takashi Mihori 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Inventor Akihiro Miyashita 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. In company

Claims (1)

[Claims] 1. An electronic endoscope having a light-emitting element provided on a surface of a solid-state image sensor substrate and using the light-emitting element as a light source for illumination, wherein the solid-state image sensor substrate is provided with a through hole for inserting a tube for a channel. An electronic endoscope characterized by the above-mentioned.