JPH11274712A - Furnace for soldering circuit substrate - Google Patents
Furnace for soldering circuit substrateInfo
- Publication number
- JPH11274712A JPH11274712A JP7384998A JP7384998A JPH11274712A JP H11274712 A JPH11274712 A JP H11274712A JP 7384998 A JP7384998 A JP 7384998A JP 7384998 A JP7384998 A JP 7384998A JP H11274712 A JPH11274712 A JP H11274712A
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- gas
- heating chamber
- circuit board
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子部品を回路基
板にはんだ付けするためのはんだ付け用加熱炉に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating furnace for soldering an electronic component to a circuit board.
【0002】[0002]
【従来の技術】電子部品を回路基板にはんだ付けにより
実装する場合には、電子部品を所定の位置に搭載した回
路基板を加熱炉に通し、はんだを溶融させてはんだ付け
を行う。この場合、加熱炉内には窒素ガスなどの不活性
ガスを充満させ、回路基板や、搭載する電子部品の酸化
を防止している。2. Description of the Related Art When an electronic component is mounted on a circuit board by soldering, the circuit board on which the electronic component is mounted at a predetermined position is passed through a heating furnace to melt the solder and perform soldering. In this case, the heating furnace is filled with an inert gas such as nitrogen gas to prevent the circuit board and the mounted electronic components from being oxidized.
【0003】従来のこの種の加熱炉を図4に示す。加熱
炉10は、内部にヒーター1が設置された加熱室2と、
加熱室2の入口側に設けられた回路基板5を搬入する搬
入通路3と、加熱炉2の出口側に設けられた回路基板5
を搬出する搬出通路4とから構成されている。FIG. 4 shows a conventional heating furnace of this type. The heating furnace 10 includes a heating chamber 2 in which a heater 1 is installed,
A carry-in passage 3 for carrying in a circuit board 5 provided on the inlet side of the heating chamber 2; and a circuit board 5 provided on the outlet side of the heating furnace 2.
And an unloading passage 4 for unloading.
【0004】加熱炉内は回路基板や電子部品の酸化を防
止するために窒素ガスなどの不活性ガスを供給して低酸
素濃度に保つことが望ましい。加熱室内を不活性ガス雰
囲気にして所定の酸素濃度で安定させるためには、供給
する不活性ガスの流量を増やせばよいが、運転時のラン
ニングコストを低く抑え、不活性ガスの炉外への流出量
をできるだけ小さくする必要がある。[0004] It is desirable to supply an inert gas such as nitrogen gas in the heating furnace to keep the oxygen concentration low so as to prevent oxidation of the circuit board and electronic components. In order to make the heating chamber an inert gas atmosphere and stabilize it at a predetermined oxygen concentration, the flow rate of the inert gas to be supplied may be increased, but the running cost during operation is kept low, and the inert gas to the outside of the furnace is reduced. It is necessary to minimize the outflow.
【0005】そこで、従来、回路基板5の搬入通路3、
搬出通路4にコンベア6を挟んで上下に複数のフィン7
を設け、ラビリンスシール効果(フィン間にガスを巻き
込んで滞留させることでガスの流入出を抑制する効果)
によって不活性ガスの炉外への流出量を減らし、外気の
炉内への巻き込みを減らすようにしている。Therefore, conventionally, the carry-in passage 3 of the circuit board 5,
A plurality of fins 7 are vertically arranged with the conveyor 6 interposed between the carry-out passages 4.
To provide a labyrinth seal effect (effect of suppressing gas inflow and outflow by trapping and retaining gas between fins)
As a result, the amount of inert gas flowing out of the furnace is reduced, and the entrainment of outside air into the furnace is reduced.
【0006】また、加熱炉10では、フィン7の部分に
不活性ガス吹き出し口8が設けられており、ガス吹き出
し口8から加熱室2内へ不活性ガスを供給し、かつ、ガ
スを回路基板5に向かって吹き付けることによってガス
の流入出を抑えるガスシール効果を併用している。ガス
吹き出し口8は、例えば図5に示すような、金属パイプ
38に長手方向に適当な間隔をおいて多数のガス吹き出
し孔39を形成したもの等である。In the heating furnace 10, an inert gas outlet 8 is provided at the fin 7, the inert gas is supplied from the gas outlet 8 into the heating chamber 2, and the gas is supplied to the circuit board. The gas sealing effect which suppresses inflow and outflow of gas by blowing toward 5 is also used. The gas outlet 8 is, for example, a metal pipe 38 having a number of gas outlets 39 formed at appropriate intervals in the longitudinal direction as shown in FIG.
【0007】このようにラビリンスシール効果とガスシ
ール効果を併用した加熱炉は、少ない不活性ガス供給量
で炉内を低酸素濃度に保つことができるという利点があ
る。As described above, the heating furnace using both the labyrinth sealing effect and the gas sealing effect has an advantage that the inside of the furnace can be maintained at a low oxygen concentration with a small amount of inert gas supplied.
【0008】[0008]
【発明が解決しようとする課題】ところが、図4に示す
加熱炉10で、実際に回路基板を搬送させると、酸素濃
度が大きく変動する場合があることがわかった。However, it has been found that when the circuit board is actually transported in the heating furnace 10 shown in FIG. 4, the oxygen concentration may fluctuate greatly.
【0009】[0009]
【課題を解決するための手段】本発明者らが、回路基板
搬送時に酸素濃度が変動する現象について検討した結
果、図6に示すように、回路基板5が搬出通路4を通過
する際に、ガス吹き出し口8の周辺に生じる圧力差によ
って、炉内の不活性ガスがガス吹き出し口8の、搬送路
とは反対側の空間4aを通って炉外に流出し、または外
気が流入し、これが炉内酸素濃度に影響を与えているこ
とを突き止めた。The present inventors have studied the phenomenon that the oxygen concentration fluctuates during the transfer of the circuit board. As a result, as shown in FIG. Due to the pressure difference generated around the gas outlet 8, the inert gas in the furnace flows out of the furnace through the space 4a of the gas outlet 8 on the side opposite to the transport path, or the outside air flows in, It was found that it was affecting the oxygen concentration in the furnace.
【0010】本発明は上記の知見に基づいてなされたも
ので、少ない不活性ガス供給量で、炉内酸素濃度をより
少ない変動幅に安定して保つことができる回路基板のは
んだ付け用加熱炉を提供するものである。[0010] The present invention has been made based on the above findings, and is a heating furnace for soldering a circuit board which can stably maintain the oxygen concentration in the furnace within a small fluctuation range with a small supply amount of inert gas. Is provided.
【0011】すなわち、本発明においては、加熱室と、
前記加熱室に通じる回路基板搬入通路および搬出通路
と、前記搬入通路から加熱室を通り搬出通路に回路基板
を案内する搬送路とを備え、前記通路の少なくとも一方
の通路には搬送路の上方側および、または下方側に向け
た複数のフィンを配列させ、該フィンの部分には、搬送
路に向かってガスを吹き出すガス吹き出し口と該ガス吹
き出し口の搬送路とは反対側の空間を通り抜けるガスを
妨げる遮蔽板とを設けた、回路基板のはんだ付け用加熱
炉を提供することを目的とするものである。That is, in the present invention, a heating chamber,
A circuit board carry-in passage and a carry-out passage leading to the heating chamber, and a carrying passage for guiding the circuit board from the carry-in passage through the heating chamber to the carry-out passage, wherein at least one of the passages is above the carrying passage. And / or arrange a plurality of fins directed downward, and in the fin portion, a gas blowout port for blowing gas toward the transfer path and a gas passing through a space opposite to the transfer path of the gas discharge port. It is an object of the present invention to provide a heating furnace for soldering a circuit board, which is provided with a shielding plate for preventing the soldering.
【0012】本発明では、ガス吹き出し口の搬送路とは
反対側の空間を通ってガスが炉外に流出するのを妨げる
遮蔽板が設けられている。これによって、加熱室内のガ
スが流出したり、炉外の空気が加熱室に侵入したりする
のを抑制することができ、加熱室内の酸素濃度の変動幅
を小さく安定して保つことができる。In the present invention, a shielding plate is provided for preventing gas from flowing out of the furnace through a space opposite to the conveying path of the gas outlet. Thereby, it is possible to suppress the outflow of gas in the heating chamber and the intrusion of air outside the furnace into the heating chamber, and it is possible to stably keep the fluctuation range of the oxygen concentration in the heating chamber small.
【0013】[0013]
【発明の実施の形態】以下、本発明の実施例を図面を参
照して詳細に説明する。図において、先に説明した図4
および図6の加熱炉と同一部分には同一符号を付して詳
細な説明は省略し、ここでは本発明の特徴点を主に説明
する。Embodiments of the present invention will be described below in detail with reference to the drawings. In the figure, FIG.
The same parts as those of the heating furnace of FIG. 6 are denoted by the same reference numerals, and detailed description is omitted. Here, the features of the present invention will be mainly described.
【0014】図1の加熱炉は、搬入通路3および搬出通
路4の上面壁W1 と下面壁W2 にフィン7が設けてあ
る。搬出通路4に設けられたフィン間には図5に示すよ
うなガス吹き出し口8が、上面壁W1 側と下面壁W2 側
に設けられている。そして、ガス吹き出し口8が設けら
れたフィン間の上面壁W1 と下面壁W2 には遮蔽板9が
設けられている。図2に示すようにこの遮蔽板9によっ
て、回路基板搬送時に、ガス吹き出し口8と上面壁W1
または下面壁W2 との間隙をガスが通り抜けて炉外に流
出したり、外気が炉内に流入したりするのを妨げること
ができるので、加熱室内の酸素濃度を所定の濃度に安定
して維持することができる。In the heating furnace shown in FIG. 1, fins 7 are provided on the upper wall W 1 and the lower wall W 2 of the carry-in passage 3 and the carry-out passage 4. Between the fins provided in the discharge passage 4 gas outlet 8 as shown in FIG. 5, it is provided on the upper wall W 1 side and the lower wall W 2 side. Then, the shielding plate 9 is provided on the upper wall W 1 and the lower wall W 2 between fins gas outlet 8 is provided. As shown in FIG. 2, the gas outlet 8 and the upper wall W 1 are transferred by the shielding plate 9 when the circuit board is transported.
Or or the gap between the lower wall W 2 flows out of the furnace pass through a gas, since outside air can be prevented from or flow into the furnace, stable oxygen concentration in the heating chamber to a predetermined concentration Can be maintained.
【0015】なお、図1に示す遮蔽板9は、その拡大図
である図2に示すように上面壁W1または下面壁W
2 に、フィン7と平行に設けられているが、図3に示す
ようにガス吹き出し口8を挟む位置にあるフィン7に取
り付けても構わない。本発明における遮蔽板9は、ガス
吹き出し口8と上面壁W1 または下面壁W2との間隙を
ガスが通り抜けて炉外に流出するのを妨げる機能を有し
ていればよく、形状、位置は特に限定されない。ただ
し、運転状況によってはガス吹き出し口8から吹き出す
ガスの角度調整を行う場合もあるので、遮蔽板は角度調
整を妨げない位置、形状であることが望ましい。[0015] Incidentally, the shielding plate 9 shown in FIG. 1, the top wall W 1 or lower wall W as shown in FIG. 2 is an enlarged view thereof
2 , it is provided in parallel with the fin 7, but it may be attached to the fin 7 at a position sandwiching the gas outlet 8 as shown in FIG. Shielding plate 9 in the present invention has only to have the function of preventing outflow of the gap between the gas outlet 8 and the upper wall W 1 or lower wall W 2 out of the furnace pass through a gas, shape, location Is not particularly limited. However, since the angle of the gas blown from the gas outlet 8 may be adjusted depending on the driving situation, it is desirable that the shielding plate has a position and a shape that do not hinder the angle adjustment.
【0016】[0016]
【実施例】ガス吹き出し口8より供給するガスの流量を
200l/min、チェーンコンベア6の速度を0.8
m/minとし、サイズ250mm×330mmの回路基板
5を10枚、50秒の投入タクトで搬送したところ、炉
内酸素濃度は100ppm±30%以内で安定した。一
方、遮蔽板9を設けない以外は同じ構造の加熱炉で、同
様の条件で回路基板を搬送したところ、炉内酸素濃度は
100ppm±200%の範囲で大きく変動した。EXAMPLE The flow rate of the gas supplied from the gas outlet 8 was 200 l / min, and the speed of the chain conveyor 6 was 0.8.
When 10 circuit boards 5 each having a size of 250 mm × 330 mm were conveyed at a loading time of 50 seconds at a rate of m / min, the oxygen concentration in the furnace was stabilized within 100 ppm ± 30%. On the other hand, when the circuit board was transported under the same conditions in a heating furnace having the same structure except that the shielding plate 9 was not provided, the oxygen concentration in the furnace varied greatly in the range of 100 ppm ± 200%.
【0017】[0017]
【発明の効果】以上説明したように本発明の回路基板の
はんだ付け用加熱炉には、ガス吹き出し口を設けたフィ
ン間に設けられた、ガス吹き出し口の、搬送路とは反対
側の空間を通り抜けるガスを妨げる遮蔽板が備えられて
いるので、回路基板搬送時にも炉内ガスの流入出を抑制
するとことができ、少ない不活性ガス供給量で加熱室内
の酸素濃度をより小さな変動幅で安定して保つことがで
きる。As described above, in the heating furnace for soldering a circuit board according to the present invention, the space between the fins provided with the gas outlets and opposite to the transport path of the gas outlets is provided. A shielding plate is provided to prevent gas passing through the furnace, so it is possible to suppress the inflow and outflow of gas in the furnace even when transferring the circuit board, and to reduce the oxygen concentration in the heating chamber with a small fluctuation width by supplying a small amount of inert gas. It can be kept stable.
【図1】本発明の回路基板のはんだ付け用加熱炉の断面
図。FIG. 1 is a cross-sectional view of a heating furnace for soldering a circuit board according to the present invention.
【図2】図1の回路基板のはんだ付け用加熱炉における
搬出通路部分の断面図。FIG. 2 is a cross-sectional view of a carry-out passage in a heating furnace for soldering the circuit board of FIG. 1;
【図3】図1の回路基板のはんだ付け用加熱炉における
搬出通路部分の断面図。FIG. 3 is a cross-sectional view of a carry-out passage in a heating furnace for soldering the circuit board of FIG. 1;
【図4】従来の回路基板のはんだ付け用加熱炉の断面
図。FIG. 4 is a cross-sectional view of a conventional heating furnace for soldering a circuit board.
【図5】ガス吹き出し口の正面図。FIG. 5 is a front view of a gas outlet.
【図6】従来の回路基板のはんだ付け用加熱炉における
搬出通路部分の断面図。FIG. 6 is a sectional view of a carry-out passage in a conventional heating furnace for soldering circuit boards.
1 ヒーター 2 加熱室 3 搬入通路 4 搬出通路 5 回路基板 6 搬送路(コンベア) 7 フィン 8 ガス吹き出し口 38 金属パイプ 39 ガス吹き出し孔 9 遮蔽板 10 回路基板のはんだ付け用加熱炉 W1 上面壁 W2 下面壁Reference Signs List 1 heater 2 heating chamber 3 carry-in passage 4 carry-out passage 5 circuit board 6 transfer path (conveyor) 7 fin 8 gas outlet 38 metal pipe 39 gas outlet 9 shielding plate 10 heating board for soldering circuit board W 1 top wall W 2 Lower wall
Claims (1)
搬入通路および搬出通路と、前記搬入通路から加熱室を
通り搬出通路に回路基板を案内する搬送路とを備え、前
記通路の少なくとも一方の通路には搬送路の上方側およ
び、または下方側に向けた複数のフィンを配列させ、該
フィンの部分には、搬送路に向かってガスを吹き出すガ
ス吹き出し口と該ガス吹き出し口の搬送路とは反対側の
空間を通り抜けるガスを妨げる遮蔽板とを設けたことを
特徴とする回路基板のはんだ付け用加熱炉。1. A heating chamber, a circuit board carry-in passage and a carry-out passage leading to the heating chamber, and a conveyance passage guiding the circuit board from the carry-in passage through the heating chamber to the carry-out passage, and at least one of the passages A plurality of fins facing the upper side and / or the lower side of the transport path are arranged in the passage, and a gas outlet for blowing gas toward the transport path and a transport path for the gas outlet are provided in the fin portion. And a shielding plate for preventing gas passing through a space on the opposite side of the heating furnace.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7384998A JPH11274712A (en) | 1998-03-23 | 1998-03-23 | Furnace for soldering circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7384998A JPH11274712A (en) | 1998-03-23 | 1998-03-23 | Furnace for soldering circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11274712A true JPH11274712A (en) | 1999-10-08 |
Family
ID=13530017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7384998A Pending JPH11274712A (en) | 1998-03-23 | 1998-03-23 | Furnace for soldering circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11274712A (en) |
-
1998
- 1998-03-23 JP JP7384998A patent/JPH11274712A/en active Pending
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Legal Events
Date | Code | Title | Description |
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A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040312 |