JPH11262117A - Board temperature monitoring method and equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent accident in a board, improve efficiency of monitoring and checking, and facilitate abnormality judgment of current carrying function of the board. SOLUTION: A board 11 accommodates a heat source element causing heat generation inside a carbonate. A plurality of local temperature sensors 12 which are arranged in specified portions of the board 11 and measure temperature distribution at the specified portions, a sensor 13 for peripheral temperature which measures the peripheral temperature of the board 11, and a signal processing means 15 are installed. On the basis of the temperatures measured with the local temperature sensors 12 and the sensor 13 for peripheral temperature, data concerning the temperature rise at the specified portions of the board 11 are calculated. Difference data between the data concerning the temperature rise and data concerning temperature rise of the specified portions of the board at the time of normal operation are calculated. A correlation coefficient is introduced by applying Walsh transformation to the difference data. On the basis of change of the correlation coefficient, abnormality is judgment performed, and current flowing function of the board 11 is monitored.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature monitoring method and apparatus for a board for monitoring and inspecting an energizing function of a panel such as a switchboard, and more particularly to a method for preventing a panel accident from occurring and the efficiency of monitoring and inspection work. TECHNICAL FIELD The present invention relates to a panel temperature monitoring method and apparatus which can be used in a computer.

[0002]

2. Description of the Related Art Generally, industrial plant equipment, electric equipment,
In large-scale systems such as public facilities, the use of electric energy is indispensable for facility operation. For example, a switchboard configured by housing a power receiving and transforming facility or the like in a housing plays an important role of supplying electric energy to electric and mechanical facilities in the facility.

[0003] Once a problem occurs in these facilities, some or all of the facilities are shut down, and it is certain that the facilities will be greatly affected. We are focusing on equipment diagnosis.

[0004] On the other hand, the functions of the switchboard mainly include an energizing function, an insulating function, a closing function, and the like, depending on the equipment housed in the housing. However, current-carrying parts such as buses and circuit breakers that transmit and cut off electricity may have partial electrical resistance due to adhesion of decomposition products to the contact surface due to poor material quality, and poor contact due to damage, breakage, or improper installation. May increase and the energization function may decrease.

Further, it is known that the increase in the electric resistance causes a local temperature rise. When such a state progresses, not only does the power supply function fail, but also smoke is generated. Accidents, such as fire.

Therefore, in order to prevent such an accident, it is conceivable to monitor the temperature by attaching a temperature sensor to or near the surface of a bus, a circuit breaker, or the like, where many accidents occur.

However, since these parts are high-voltage power receiving parts, high insulation characteristics or insulation distance must be ensured. Further, if there are electric wires and the like in the temperature sensor attached to these parts, The deterioration of insulation performance due to the adhesion of dust to the surface must be sufficiently considered.

For this reason, the temperature sensors are hardly attached to the above-mentioned parts for such reasons, and the monitoring and inspection of the power distribution function of the switchboard are performed mainly by manual inspection work. .

[0009] That is, the main monitoring and inspection work of the switchboard includes the appearance, the operating mechanism, the connection state of the connection section,
We conduct a wide range of inspections such as heating discoloration, abnormal noise, abnormal odor, and contamination and damage of insulators. Inspection points differ depending on the type of switchboard. For this reason, in many cases, these monitoring and inspection operations are mainly performed by manual patrol inspection operations at present.

[0010]

However, in general, these facilities are scattered over a vast site or area.
Due to the large number of models, restrictions on power outages during inspections, and the shortage of technicians with specialized knowledge, there was a problem that a great deal of labor and time was required, and as a result, monitoring and inspection operations could not be performed efficiently. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a panel temperature capable of monitoring and inspecting the power supply function of a panel to prevent accidents on the panel and to improve the efficiency of the monitoring and inspection tasks. It is to provide a monitoring method and a monitoring device.

[0012]

SUMMARY OF THE INVENTION In order to achieve the above object, a board for monitoring and inspecting an energizing function of a board configured to house a heat source element which causes heat generation in a housing is provided. In the temperature monitoring device for use, in the invention according to claim 1, a plurality of local temperature sensors are provided at a predetermined portion of the panel and measure a temperature distribution of the predetermined portion, and a group of local temperature sensors are installed near the panel to control an ambient temperature of the panel. Based on the ambient temperature sensor to be measured, and the temperature measured by the local temperature sensor group and the ambient temperature sensor, data on the temperature rise of a predetermined portion of the panel is calculated, and the data on the temperature rise and the board during normal operation are calculated. Calculating the difference data from the data relating to the temperature rise of the predetermined portion, and performing a Walsh transform on the difference data to derive a correlation coefficient, and determining an abnormality based on the change in the correlation coefficient. Going on and a signal processing means for monitoring the board of the energizing function.

Therefore, in the panel temperature monitoring apparatus according to the first aspect of the present invention, it is possible to easily determine whether the power supply function of the panel is abnormal. In other words, when the signal processing means determines the abnormality of the energizing function of the panel, the data (for example, the rate of temperature increase) regarding the temperature rise obtained by monitoring the temperature of the panel also has a small signal change. Is difficult to judge.

Therefore, as a typical method for analyzing a signal which is small in signal change and synthesized with a plurality of elements, for example, a frequency or the like, there is Fourier series expansion. Although it can be decomposed for each element, the operation is complicated, requires a lot of calculation time, and requires an advanced computer.

In this respect, in the panel temperature monitoring apparatus according to the first aspect of the present invention, a Walsh transform for performing a function expansion by an operation similar to a Fourier series expansion using a binary conversion matrix is used to correspond to each temperature measurement point. By performing a Walsh transform of a data sequence composed of data relating to temperature rise (temperature rise rate difference) as a waveform, a feature is found from a change in a correlation coefficient obtained in a short time with a small computer, Abnormality determination of the power supply function of the panel can be easily performed.

According to the second aspect of the present invention, a sensor optical cable is provided at a predetermined portion of the panel and measures a temperature distribution of the predetermined portion, and an ambient temperature measurement is provided near the panel and measures an ambient temperature of the panel. Unit, and calculates data relating to a temperature rise of a predetermined portion of the panel based on the temperatures measured by the sensor optical cable and the ambient temperature measuring unit, and calculates the data relating to the temperature rise and the temperature rise of the predetermined portion of the panel during normal operation. Signal processing for calculating difference data from the data, performing a Walsh transform on the difference data to derive a correlation coefficient, performing an abnormality determination based on a change in the correlation coefficient, and monitoring a power supply function of the panel. Means.

Accordingly, in the panel temperature monitoring device according to the second aspect of the present invention, it is possible to easily determine whether the power supply function of the panel is abnormal. In other words, when the signal processing means determines the abnormality of the energizing function of the panel, the data (for example, the rate of temperature increase) regarding the temperature rise obtained by monitoring the temperature of the panel also has a small signal change. Is difficult to judge.

Therefore, as a typical method for analyzing a signal having a small change in signal and synthesized with a plurality of elements, for example, a frequency or the like, there is Fourier series expansion. Although it can be decomposed for each element, the operation is complicated, requires a lot of calculation time, and requires an advanced computer.

In this respect, in the panel temperature monitoring apparatus according to the second aspect of the present invention, a Walsh transform for performing a function expansion by an operation similar to a Fourier series expansion using a binary conversion matrix is used to correspond to each temperature measurement point. By performing a Walsh transform of a data sequence composed of data relating to temperature rise (temperature rise rate difference) as a waveform, a feature is found from a change in a correlation coefficient obtained in a short time with a small computer, Abnormality determination of the power supply function of the panel can be easily performed.

On the other hand, in a panel temperature monitoring method for monitoring and inspecting an energizing function of a panel configured to house a heat source element that causes heat generation in a housing, Measure the temperature distribution of a predetermined part of the panel,
The ambient temperature of the panel is measured, and data on the temperature rise of a predetermined portion of the panel is calculated based on the measured temperatures, and the data on the calculated temperature rise and the temperature of the predetermined portion of the panel during normal operation are calculated. The difference data related to the temperature rise is calculated by comparing the calculated difference data with the data related to the rise, a Walsh transform is performed on the calculated difference data to derive a correlation coefficient, and an abnormality is determined based on the change in the derived correlation coefficient. A judgment is made to monitor the power supply function of the panel.

Therefore, in the panel temperature monitoring method according to the third aspect of the present invention, it is possible to easily determine whether the power supply function of the panel is abnormal. That is, when performing an abnormality determination of the power supply function of the panel, the threshold value of the width corresponding to each temperature measurement point is obtained from the data (temperature increase rate) relating to the temperature rise from which the influence of the ambient temperature fluctuation and the load fluctuation is removed. Although the abnormality determination can be performed by providing a value, the change in the data relating to the temperature rise (temperature rise rate) is a small value, so it is difficult to perform the abnormality determination.

In this respect, in the panel temperature monitoring method according to the third aspect of the present invention, Walsh transform for performing a function expansion by an operation similar to Fourier series expansion using a binary conversion matrix is used to correspond to each temperature measurement point. By performing a Walsh transform of a data sequence composed of data relating to temperature rise (temperature rise rate difference) as a waveform, a feature is found from a change in a correlation coefficient obtained in a short time with a small computer, Abnormality determination of the power supply function of the panel can be easily performed.

As described above, monitoring of the power supply function of the panel
By supporting the inspection work, it is possible to prevent the accident of the panel beforehand and to improve the efficiency of the monitoring and inspection work. As the difference data relating to the temperature rise, for example, as described in claim 4, a temperature rise value is calculated by subtracting the ambient temperature of the board from the measured temperature distribution of the predetermined portion of the board, The value obtained by adding the temperature rise value of the entire predetermined portion of the panel is divided by the calculated temperature rise value to calculate a standardized temperature rise rate, and thereafter, the calculated temperature rise rate is measured in advance. It is preferable to calculate the temperature rise rate difference (the deviation of the temperature distribution from the normal operation state) by taking the difference from the reference temperature rise rate during normal operation.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the concept of the present invention will be described. When heat is generated inside the rectangular parallelepiped housing in which the heat source element that causes the heat generation is stored, the air around the heat source element is heated and convection occurs. Then, the heat generated by the convection is intensively carried to the upper portion (the ceiling portion) of the housing, and at the same time, moves from the surface of the housing to the surrounding air and the floor.

FIG. 8 is a block diagram showing an example of a switchboard to be monitored for temperature according to the present invention. In FIG. 8, a switchboard 31 is configured by housing devices such as a bus 32, a current detector 33, a circuit breaker 34, a transformer 35, and a second bus 36 inside a rectangular parallelepiped casing.

On the other hand, the front face of the switchboard 31 is a front panel of various devices housed in the switchboard 31 and a door 3 of the switchboard 31.
7 is doubly isolated from the outside. In addition, the back surface is also the same as the front surface, and the protection plate 38 and the door 3 of the protection plate 38 are provided.
7 is doubly isolated from the outside.

Further, with respect to the bottom surface, since most of the heat moves to the upper portion due to the convection described above, the temperature gradient with the outside is small. The switchboards 31 are connected to each other, and the switchboards 31 under similar temperature conditions are disposed in close contact with each other. For this reason, the heat radiation from these surfaces is significantly reduced.

For this reason, in the switchboard 31, most of the heat is radiated from the upper part (the ceiling part) and the upper part (the ceiling part).
Are strongly affected by the temperature change in the switchboard 31.

Therefore, by measuring the temperature of a predetermined portion of the switchboard 31, particularly the upper part (ceiling portion), the heat generation state inside the switchboard 31 and the energizing function of the switchboard 31 can be monitored without contacting the high-voltage power receiving portion. can do.

Hereinafter, embodiments of the present invention based on the above concept will be described in detail with reference to the drawings. (First Embodiment) FIG. 1 is a schematic diagram showing a configuration example of a switchboard temperature monitoring device according to the present embodiment.

That is, as shown in FIG. 1, the temperature monitoring device for a switchboard according to the present embodiment includes a local temperature sensor 12,
It comprises an ambient temperature sensor 13, a temperature converter 14, and a signal processing unit 15.

A plurality (eight in this example) of local temperature sensors 12 are installed on a predetermined portion (the ceiling in this example) of the switchboard 11 at predetermined intervals linearly as shown in FIG. And measure the temperature distribution at the ceiling. As the local temperature sensor 12, it is preferable to use, for example, a thermocouple.

The ambient temperature sensor 13 is installed near the switchboard 11 and measures the ambient temperature of the switchboard 11. The temperature converter 14 performs signal processing (performs correction of a weak signal, etc.) on the output signal from each of the local temperature sensors 12 and the ambient temperature sensor 13 and converts the output signal into corresponding temperature data.

The signal processing section 15 calculates data (temperature increase rate in this example) relating to the temperature rise of the ceiling portion of the switchboard 11 based on the output signal from the temperature converter 14, and calculates the data (temperature increase rate) relating to this temperature rise. Difference data (temperature rise rate difference) between the temperature rise rate of the switchboard 11 and the temperature rise rate of the switchboard 11 during normal operation (temperature rise rate) is calculated, and this difference data (temperature rise rate difference) is set in advance. By comparing with the threshold value thus determined, an abnormality determination is made and the power supply function of the switchboard 11 is monitored.

Next, the operation of the switchboard temperature monitoring apparatus of the present embodiment configured as described above will be described with reference to FIGS.
This will be described with reference to FIG. In FIG. 1, the temperature distribution of the ceiling portion is measured by a group of local temperature sensors 12 installed at a plurality of temperature measurement points on the ceiling portion of the switchboard 11.

Since the temperature distribution changes due to fluctuations in the ambient temperature of the switchboard 11, the ambient temperature of the switchboard 11 is measured by an ambient temperature sensor 13 installed near the switchboard 11.

Output signals from the local temperature sensor 12 and the ambient temperature sensor 13 are input to a temperature converter 14 and subjected to predetermined signal processing.
Temperature data t1 to t8 and ambient temperature data t9 corresponding to each are converted.

Next, the output signal from the temperature converter 14 is input to a signal processing unit 15. Then, in the signal processing unit 15, the temperature data t1 to t8 are converted into the ambient temperature data t.
9 are converted to temperature rise values Δt1 to Δt8.

Further, the temperature rise values Δt1 to Δt8 are divided by the added values of the temperature rise values Δt1 to Δt8 to be converted into temperature rise rates D1 to D8. Further, from the temperature rise rates D1 to D8, the temperature rise rates (reference temperature rise rates) Dr1 to Dr8 of the ceiling portion of the switchboard 11 during normal operation, which are measured in advance, are subtracted, and the temperature rise rate differences dD1 to Dr8 are subtracted.
dD8 is calculated.

Then, this temperature rise rate difference dD1 to dD8
Is compared with a preset threshold value, an abnormality is determined, and the power distribution function of the switchboard 11 is monitored. FIG. 2 is a diagram illustrating an example of a signal processing procedure from the temperature data collection to the temperature rise rate difference calculation.

That is, as shown in FIG. 2A, the local temperature sensor 12
From the temperature data t1 to t8 obtained by
As shown in (5), by subtracting the ambient temperature data t9 and converting it into the temperature rise values Δt1 to Δt8, the influence of the ambient temperature fluctuation of the switchboard 11 can be removed.

In addition, under the influence of the load fluctuation of the switchboard 11, each heating point in the switchboard 11 changes at a fixed rate, so that the temperature rise of the ceiling also changes at a fixed rate. That is, as shown in FIG. 3, the temperature rise pattern of the ceiling portion of the switchboard 11 changes while maintaining a similar shape with electric power corresponding to each load current.

Accordingly, as shown in FIG. 2 (c), the temperature obtained by adding the respective temperature rise values Δt1 to Δt8 of the entire top portion of the switchboard 11 and dividing the temperature rise values Δt1 to Δt8 into standardized values. By converting into the rise rates D1 to D8,
The influence of the load fluctuation of the switchboard 11 can be eliminated.

Further, as shown in FIG. 2D, the difference between the temperature rise rates D1 to D8 and the previously measured reference temperature rise rates Dr1 to Dr8 at the time of normal operation is calculated to obtain a normal value. Temperature rise rate differences dD1 to dD8, which are differences in temperature distribution from the operating state, can be calculated.

Then, this temperature rise rate difference dD1 to dD8
Is compared with a preset threshold value, an abnormality determination can be made and the power distribution function of the switchboard 11 can be monitored.

In this case, as an example of the threshold value, a plurality of temperature data in a normal operation state are collected, and the threshold value is determined in consideration of variations in maximum and minimum values. According to this method, the temperature distribution of the ceiling of the switchboard 11 changes depending on the position of abnormal heat generation due to the failure, so that the inside of the switchboard 11 can be widely monitored and the high-voltage power receiving unit can be monitored without contact.

FIG. 4 shows a circuit breaker 3 in a state in which devices are connected to the switchboard 31 shown in FIG.
FIG. 11 is a graph showing an example in which an abnormal simulation test with a calorific value of 100 W is performed in the vicinity of No. 4 and a temperature rise rate difference is obtained by the above-described conversion procedure.

From this graph, it can be seen that the abnormal temperature of the circuit breaker 34 installed in front of the switchboard 31 increases the rate of temperature rise on the front side of the ceiling portion and conversely decreases on the rear side.

FIG. 5 shows that the current supplied to the switchboard 31 is 150,
FIG. 9 is a graph showing an example of a temperature measurement result when a load fluctuation test is performed at 300 W and a difference in temperature rise rate after signal processing.

From this graph, the temperature rise rate difference is very small as compared with the abnormality simulation test shown in FIG. 4, and by setting an appropriate judgment level, it is possible to distinguish the abnormal state. .

As described above, in the switchboard temperature monitoring apparatus of the present embodiment, the temperature distribution of the ceiling portion of the switchboard 11 is measured by the local temperature sensors 12 and the ambient temperature of the switchboard 11 is measured by the ambient temperature sensor 13. , And based on the respective measured temperatures signal-processed by the temperature converter 14,
The signal processor 15 subtracts the ambient temperature of the switchboard 11 from the temperature distribution of the ceiling of the switchboard 11 to calculate a temperature rise value,
The above-mentioned temperature rise value is divided by a value obtained by adding the temperature rise value of the entire ceiling portion of the switchboard 11 to calculate the temperature rise rate of the ceiling portion of the switchboard 11, and this temperature rise rate and the ceiling portion of the switchboard 11 during normal operation are calculated. The temperature rise rate difference is calculated by comparing the temperature rise rate with the temperature rise rate, and the difference between the ambient temperature and the load fluctuation of the switchboard 11 is removed. By comparing with the value, the abnormality determination of the power distribution function of the switchboard 11 is performed, so that the monitoring and inspection work of the power distribution function of the switchboard 11 is supported,
It is possible to prevent an accident of the switchboard 11 beforehand and to improve the efficiency of monitoring and inspection work.

(Second Embodiment) FIG. 6 is a schematic diagram showing an example of the configuration of a switchboard temperature monitoring device according to the present embodiment.

That is, as shown in FIG. 6, the temperature monitoring device for a switchboard according to this embodiment has a sensor optical cable 22
An ambient temperature measuring unit 23, an optical temperature distribution sensor 24,
And a signal processing unit 25.

The sensor optical cable 22 has one optical cable installed at a predetermined portion (the ceiling in this example) of the switchboard 21 as shown in the figure, and measures the temperature distribution of the ceiling. The ambient temperature measuring unit 23 is installed near the switchboard 21 and measures the ambient temperature of the switchboard 21.

The light temperature distribution sensor 24 extracts a part of the backscattered light generated by the pulse light incident on the sensor optical cable 22, and calculates the temperature distribution from the intensity signal.
The signal processing unit 25 calculates data on the temperature rise of the ceiling of the switchboard 21 (the temperature rise rate in this example) based on the output signal from the optical temperature distribution sensor 24, and data on the temperature rise (temperature rise). Rate) and data (temperature rise rate) relating to the temperature rise of the ceiling portion of the switchboard 21 during normal operation are calculated, and the difference data (temperature rise rate difference) is set in advance. By comparing with the threshold value, an abnormality is determined and the switchboard 2
1. Monitor the energization function.

Next, the operation of the switchboard temperature monitoring apparatus of the present embodiment configured as described above will be described. FIG.
, The temperature distribution of the ceiling portion is measured by the sensor optical cables 22 installed at a plurality of temperature measurement points on the ceiling portion of the switchboard 21.

That is, temperature distributions corresponding to a plurality of temperature measurement points where the local temperature sensor 12 in FIG. 1 is installed are measured. Further, since the temperature distribution changes due to the fluctuation of the ambient temperature of the switchboard 21, the ambient temperature of the switchboard 21 is measured by the ambient temperature measuring unit 23 installed near the switchboard 21.

The output signals from the sensor optical cable 22 and the ambient temperature measuring section 23 are respectively input to the optical temperature distribution sensor 24 and converted into corresponding temperature data t1 to t8 and ambient temperature data t9. You.

Next, the output signal from the light temperature distribution sensor 24 is input to the signal processing unit 25. Then, in the signal processing unit 25, the temperature data t1 to t8 are converted into temperature rise values Δt1 to Δt8 by subtracting the ambient temperature data t9.

The temperature rise values Δt1 to Δt8 are converted into temperature rise rates D1 to D8 by dividing the respective temperature rise values Δt1 to Δt8 by the added value of the temperature rise values Δt1 to Δt8. Further, from the temperature rise rates D1 to D8, the temperature rise rates (reference temperature rise rates) Dr1 to Dr8 of the ceiling portion of the switchboard 21 during normal operation, which are measured in advance, are subtracted, and the temperature rise rate differences dD1 to Dr8 are subtracted.
dD8 is calculated.

Then, the temperature rise rate differences dD1 to dD8
Is compared with a preset threshold value, an abnormality is determined, and the energization function of the switchboard 21 is monitored. The signal processing procedure from the temperature data collection to the temperature rise rate difference calculation, and other operations are described below.
Since it is the same as the case shown in FIGS. 2 to 5 described above, the description is omitted here.

As described above, in the temperature monitoring device for a switchboard of this embodiment, the temperature distribution of the ceiling of the switchboard 21 is measured by the sensor optical cable 22 and the ambient temperature of the switchboard 21 is measured by the ambient temperature measuring unit 23. Then, based on the respective measured temperatures subjected to signal processing by the optical temperature distribution sensor 24, the signal processor 25 subtracts the ambient temperature of the switchboard 21 from the temperature distribution of the ceiling of the switchboard 21 to calculate a temperature rise value, The temperature rise value of the ceiling portion of the switchboard 21 is calculated by dividing the temperature rise value by a value obtained by adding the temperature rise value of the entire ceiling portion of the switchboard 21. The temperature rise rate and the ceiling portion of the switchboard 21 during normal operation are calculated. The temperature rise rate difference is calculated by comparing the temperature rise rate with the temperature rise rate, and the temperature rise rate difference from which the influence of the ambient temperature fluctuation and the load fluctuation of the switchboard 21 has been removed is defined as a threshold having a width corresponding to each temperature measurement point. By comparing the values, switchboard 2
Since the abnormality determination of the energization function of 1 is performed,
Supports the monitoring and inspection work of the power distribution function of the switchboard 21 to prevent the accident of the switchboard 21 from occurring,
Inspection work can be made more efficient.

On the other hand, since a high voltage and a large current are applied to the switchboard 21, a strong magnetic field or electric field may be generated around the switchboard 21 during operation. Since the surroundings are in a high-noise environment or a high voltage is drawn in from outside, a device having high noise resistance is desired because it is easily affected by lightning and the like.

In this respect, in the panel temperature monitoring apparatus of the present embodiment, since the sensor optical cable 22 is used for measuring the temperature distribution, it is not affected by a strong magnetic field or electric field generated by the current flowing through the switchboard 21. In addition, since the noise resistance is high, the influence of external noise such as lightning is very small, and a highly reliable temperature measurement can be performed.

Furthermore, the panel temperature monitoring device of the present embodiment has the advantage that the temperature measurement at multiple points required for the present invention can be easily performed, and a highly reliable configuration can be realized with a small number of devices. It can be realized.

That is, when the temperature of the switchboard is monitored by the switchboard temperature monitoring apparatus of the first embodiment,
A plurality (multipoint) of local temperature sensor groups are required. However, in this point, in the switchboard temperature monitoring device of the present embodiment, a pulse is applied to the sensor optical cable 22 laid on the ceiling portion of the switchboard 21 to be measured. Since backscattered light generated when light is incident is received and the temperature distribution is measured from a change in its intensity, temperature data at multiple points can be collected simultaneously with one sensor optical cable 22, Most suitable for the temperature measurement of the present invention.

As described above, while realizing a highly reliable configuration with a small number of devices, the monitoring and inspection work of the power supply function of the panel is supported to prevent the accident of the panel from occurring, and the efficiency of the monitoring and inspection work is improved. Can be achieved.

(Third Embodiment) The temperature monitoring device for a switchboard according to the present embodiment is a signal processing unit 15 or a signal processor in the temperature monitoring device for a switchboard according to the first or second embodiment. The only difference is that the functions of the processing unit 25 are changed, and the other configurations and functions are the same as those described above.

That is, in the present embodiment, as a function of the signal processing unit 15 or 25, the temperature converter 1
4 or the output signal from the optical temperature distribution sensor 24, the data relating to the temperature rise of the switchboard 11 or the ceiling of the switchboard 21 (in this example, the temperature rise rate) is calculated, and the data relating to this temperature rise (the temperature rise rate) ) And the data (temperature rise rate difference) relating to the temperature rise of the ceiling of the switchboard 11 or the switchboard 21 during normal operation (temperature rise rate difference), and calculate the difference data (temperature rise rate difference). A configuration is provided in which a Walsh transform is performed to derive a correlation coefficient, an abnormality is determined based on a change in the correlation coefficient, and a function of monitoring the power distribution function of the switchboard 11 or the switchboard 21 is provided.

Next, the operation of the switchboard temperature monitoring device of the present embodiment configured as described above will be described. Here, only the operation of a portion different from the switchboard temperature monitoring device of the first or second embodiment, that is, the operation of the signal processing unit 15 or the signal processing unit 25 will be described.

That is, in the signal processing unit 15 or the signal processing unit 25, the temperature converter 14 or the optical temperature distribution sensor 2
The temperature data t1 to t8, which are the output signals from No. 4, are subtracted from the ambient temperature data t9 to obtain the temperature rise values Δt1 to Δt8.
Is converted to

The temperature rise values Δt1 to Δt8 are converted into temperature rise rates D1 to D8 by dividing the respective temperature rise values Δt1 to Δt8 by the sum of the temperature rise values Δt1 to Δt8. Further, from the temperature rise rates D1 to D8, the temperature rise rates (reference temperature rise rates) Dr1 to Dr8 of the ceiling portion of the switchboard 11 during normal operation, which are measured in advance, are subtracted to obtain the temperature rise rate differences dD1 to dD1.
dD8 is calculated.

Further, the temperature rise rate differences dD1 to dD1
A correlation coefficient is derived by performing a Walsh transform on D8. Then, based on the change in the correlation coefficient, abnormality determination is performed, and the power distribution function of the switchboard 11 or the switchboard 21 is monitored.

In this case, the Walsh transform is a transform for performing a function expansion by an operation similar to the Fourier series expansion, using a binary function having properties similar to a triangular function as a basic function.

The Walsh function is represented by a rectangular signal, is an orthonormal system, and can develop an arbitrary signal. Further, there is an alternating number as a concept corresponding to the frequency of the Fourier series expansion.

That is, when the temperature rise rate differences dD1 to dD8 obtained by the above method are decomposed into the number of alternations and the correlation coefficient is obtained, a change in the measurement signal can be grasped.
In addition, since a binary conversion matrix is used, there is an advantage that high-speed arithmetic processing can be performed by a small computer.

FIG. 7 is a diagram showing an example of the Walsh transform obtained by applying the Walsh transform to the result of the abnormal simulation test shown in FIG. That is, the temperature rise rate difference at the time of the 100 W abnormality simulation shown in FIG. 4 is expressed as follows: a value larger than 0.5 is 1, a value between -0.5 and 0.5 is 0, and a value smaller than -0.5 is Each of them is converted to -1 and an operation is performed using the conversion matrix.

Here, the reason why -0.5 to 0.5 is converted to 0 is to remove the influence of disturbance. The conversion result is a value from -8 to 8. In this conversion example, the absolute value of the conversion value is taken, and the correlation coefficient is assigned to 0 to 1 to make a graph.

In the case of this example, the alternation number 0.5 shows a remarkably high value, and by performing such a conversion, the power supply function of the switchboard 11 or the switchboard 21 can be easily performed from the change of the correlation coefficient. Can be determined.

In the above signal processing, the absolute value is obtained during the conversion. However, if the calculation is performed without performing this processing, a more detailed analysis can be performed from the polarity of the correlation coefficient.

As described above, in the switchboard temperature monitoring apparatus according to the present embodiment, the temperature distribution of the ceiling portion of the switchboard 11 or the switchboard 21 is measured by the local temperature sensors 12 or the sensor optical cables 22 and the switchboard 11 or the switchboard The ambient temperature 21 is measured by the ambient temperature sensor 13 or the ambient temperature measurement unit 23, and based on the respective measured temperatures obtained by the temperature converter 14 or the optical temperature distribution sensor 24, the signal processing unit 15 or the signal processing unit Switchboard 11 at 25
Alternatively, from the temperature distribution at the ceiling of the switchboard 21,
Alternatively, the temperature rise value is calculated by subtracting the ambient temperature of the switchboard 21, and the temperature rise value is divided by a value obtained by adding the temperature rise value of the entire ceiling portion of the switchboard 11 or the switchboard 21, and the ceiling of the switchboard 11 or the switchboard 21 is calculated. The temperature rise rate of the switchboard 11 or the switchboard 21 during normal operation is compared to calculate the temperature rise rate difference. A correlation coefficient is derived by performing a Walsh transform on the temperature rise rate difference from which the influence of the ambient temperature fluctuation and the load fluctuation has been removed, and based on the derived change of the correlation coefficient, the power distribution function of the switchboard 11 or the switchboard 21 is performed. In the same manner as in the first and second embodiments, the monitoring / inspection of the power distribution function of the switchboard 11 or the switchboard 21 is performed. And assistance, switchboard 11 or switchboard 2
In addition to being able to prevent the accident 1 above, it is possible to increase the efficiency of monitoring and inspection work, and to perform Walsh transformation in which a data sequence composed of a temperature rise rate difference is viewed in a waveform. Thus, it is possible to easily determine an abnormality in the power distribution function of the switchboard 11 or the switchboard 21 by finding a feature from a change in the correlation coefficient obtained in a short time with a small computer.

(Other Embodiments) (a) In each of the first to third embodiments, at the time of conversion into the temperature rise value, the judgment is made using the maximum temperature rise value during normal operation as a threshold value. By setting so as to add, it is possible to detect abnormal heating that exceeds the rating of the switchboard due to excessive load fluctuation.

(B) In each of the first to third embodiments, the case where the temperature distribution of the ceiling portion of the panel is measured as the predetermined portion of the panel has been described. Even if the temperature distribution of a portion other than the ceiling portion of the panel (other than the bottom portion of the panel, such as the side portion of the panel is preferable) is measured, the same operation and effect as in the above case can be obtained. It is possible to obtain

(C) In each of the first to third embodiments, the case where the temperature monitoring target is a switchboard has been described. However, the present invention is not limited to this. The same operation and effect as in the above-described case can also be obtained in a case where a panel configured by storing the above, for example, a control panel, a substation, or the like is set as a temperature monitoring target.

(D) In each of the first to third embodiments, the case has been described in which the temperature rise rate difference (the deviation of the temperature distribution from the normal operation state) is calculated as the difference data relating to the temperature rise. However, the present invention is not limited to this, and it is possible to obtain the same operation and effect as described above when calculating other data as difference data relating to temperature rise.

[0086]

As described above, according to the panel temperature monitoring method and apparatus of the present invention, the temperature distribution of a predetermined portion of the panel is measured, and the ambient temperature of the panel is measured. The data relating to the temperature rise of a predetermined portion of the panel is calculated based on the temperature of the panel, and the data relating to the calculated temperature rise is compared with the data relating to the temperature rise of the predetermined portion of the panel during normal operation. Is calculated, a Walsh transform is performed on the calculated difference data to derive a correlation coefficient, and an abnormality determination is performed based on the change in the derived correlation coefficient to monitor the power supply function of the panel. Monitoring of the power distribution function of the panel
By supporting inspection work, it is possible to prevent panel accidents before they occur, and to improve the efficiency of monitoring and inspection work.
Further, it is possible to easily determine the abnormality of the power supply function of the panel.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of a temperature monitoring device for a switchboard according to the present invention.

FIG. 2 is a diagram showing an example of a signal processing procedure from temperature data collection to temperature rise rate difference calculation in the switchboard temperature monitoring device according to the present invention.

FIG. 3 is a diagram illustrating an example of a temperature rise pattern of a ceiling portion of a switchboard.

FIG. 4 is a diagram showing an example of a result of performing an abnormal simulation test in a state where a device is connected to the switchboard with the configuration shown in the first embodiment.

FIG. 5 shows an example of a temperature measurement result when a load fluctuation test is performed on a switchboard and an example of a temperature rise rate difference after signal processing.

FIG. 6 is a configuration diagram showing a second embodiment of a temperature monitoring device for a switchboard according to the present invention.

FIG. 7 is a diagram showing an example of a Walsh transform obtained by applying a Walsh transform to the result of the abnormal simulation test shown in FIG. 4;

FIG. 8 is a configuration diagram showing an example of a switchboard to be monitored for temperature according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... switchboard, 12 ... local temperature sensor, 13 ... sensor for ambient temperature, 14 ... temperature converter, 15 ... signal processing part, 21 ... switchboard, 22 ... sensor optical cable, 23 ... ambient temperature measuring part, 24 ... light temperature distribution Sensor: 25: Signal processing unit: 31: Switchboard, 32: Busbar, 33: Current detector, 34: Circuit breaker, 35: Transformer, 36: No.2 busbar, 37: Door, 38: Protection plate.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takuya Tazaki 1-12-1 Aichigaoka, Aoba-ku, Yokohama-shi, Kanagawa Prefecture A-601 (72) Inventor Taku Kanemi 29-3 Takatsudocho, Midori-ku, Chiba-shi, Chiba Le Chiba 611 (72) Inventor Hiroyuki Kaneko 1 Toshiba-cho, Fuchu-shi, Tokyo Inside the Fuchu Plant, Toshiba Corporation (72) Inventor Yukio Sai 1-1-1, Shibaura, Minato-ku, Tokyo Inside the Toshiba Head Office (72 Inventor Ikuo Takahashi 1-1-1, Shibaura, Minato-ku, Tokyo Inside Toshiba head office

Claims (4)

[Claims] 1. A panel temperature monitoring device for monitoring and inspecting an energizing function of a panel configured by housing a heat source element that causes heat generation in a housing, wherein a plurality of components are provided on a predetermined portion of the panel. A group of local temperature sensors installed individually and measuring a temperature distribution of the predetermined portion; a sensor for ambient temperature installed near the board and measuring an ambient temperature of the board; a group of local temperature sensors and a sensor for ambient temperature Based on the temperature measured respectively, calculates data on the temperature rise of the predetermined portion of the board, calculates the difference data between the data on the temperature rise and the data on the temperature rise of the predetermined portion of the board during normal operation. Signal processing for performing a Walsh transform on the difference data to derive a correlation coefficient, performing an abnormality determination based on a change in the correlation coefficient, and monitoring an energizing function of the board. Means for monitoring the temperature of the panel. 2. A panel temperature monitoring device for monitoring and inspecting an energizing function of a panel configured by housing a heat source element that causes heat generation inside a housing, wherein the panel is installed at a predetermined portion of the panel. A sensor optical cable for measuring a temperature distribution of the predetermined portion; an ambient temperature measuring unit installed near the panel for measuring an ambient temperature of the panel; and a temperature measured by the sensor optical cable and the ambient temperature measuring unit, respectively. Based on the calculated data about the temperature rise of the predetermined portion of the board, calculate the difference data between the data about the temperature rise and the data about the temperature rise of the predetermined portion of the board during normal operation, and the difference data A signal processing means for performing a Walsh transform to derive a correlation coefficient, performing an abnormality determination based on a change in the correlation coefficient, and monitoring an energization function of the board; Panel for temperature monitoring apparatus characterized by comprising comprises. 3. A panel temperature monitoring method for monitoring and inspecting an energizing function of a panel configured to house a heat source element causing heat generation in a housing, wherein a temperature of a predetermined portion of the panel is controlled. Measuring the distribution, measuring the ambient temperature of the panel, calculating data relating to the temperature rise of a predetermined portion of the panel based on the measured temperatures, and calculating the data relating to the calculated temperature rise and normal operation The difference data regarding the temperature rise is calculated by comparing the data with respect to the temperature rise of a predetermined portion of the board at the time, and a Walsh transform is performed on the calculated difference data to derive a correlation coefficient. A temperature monitoring method for a panel, wherein an abnormality determination is performed based on a change in a correlation coefficient to monitor an energization function of the panel. 4. The board temperature monitoring method according to claim 3, wherein the difference data relating to the temperature rise is obtained by subtracting an ambient temperature of the board from a measured temperature distribution of a predetermined portion of the board. Next, a normalized temperature rise rate is calculated by dividing the calculated temperature rise value by a value obtained by adding the temperature rise value of the entire predetermined portion of the board, and then the calculation is performed. The difference between the measured temperature rise rate and the previously measured reference temperature rise rate during normal operation is taken as the difference between the temperature rise rates (the deviation of the temperature distribution from the normal operation state).
The panel temperature monitoring method characterized by calculating the following.