JPH11260513A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the contact face shape of a contact pin, and omit the wiping action of foreign matter so as to avoid a foreign matter deposition phenomenon with the lapse of time to avoid a contact failure. SOLUTION: An IC socket 10 is equipped with a spring mechanism generating plastically elastic force in response to plastic deformation, a contact face 13A energized by the plastically elastic force generated by the spring mechanism so as to electrically make contact with an external terminal 12, a contact pin 13 provided with a through hole formed along the thrusting direction in the nearly central part of the contact face 13A, a mounting terminal 13B electrically transferring an electrical contact state with an external terminal 12 on the contact face 13A to a wiring pattern formed on a wiring board, and an elastic pin 14 electrically transferring the electrical contact state with the external terminal 12, which is elastically disposed against the mounting terminal 13B in a state interposed in the through hole bellow the contact face 13A, to the mounting terminal 13B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to a contact structure of a surface mount type IC socket.

[0002]

2. Description of the Related Art A contact pin of an ordinary IC socket has a planar contact surface with an external terminal of a semiconductor device.

However, such prior art ICs
In the socket, for example, when foreign matter is present on the back surface of the external terminal, there is a problem that electrical contact with the contact pin cannot be made and there is a high possibility that a contact failure occurs.

[0006] Here, the foreign substance is, specifically, debris or filler of a mold resin used for a semiconductor device, or a deposit formed by transferring and depositing solder plating applied to an external terminal. . The non-defective semiconductor device is erroneously determined due to the contact failure due to the foreign matter or the like, and a non-defective semiconductor device is discarded in the final inspection process.

A first prior art for solving such a conventional problem is disclosed in, for example, Japanese Patent Laid-Open No.
No. 202079 (applicant: Mitsubishi Electric Corporation, filing date: December 28, 1993, see FIG. 5).

The contact pin A8 in the first prior art IC socket is connected to the external terminal A6, which is a lead portion of the device A5, when the contact pin A8 and the external terminal A6 come into electrical contact due to the lowering of the external terminal retainer A7. The contact pin has a first contact surface A8a for wiping the surface and a second contact surface A8b for re-contacting the position. That is, by using a contact pin structure that removes foreign matter adhering to the external terminal A6 and makes contact with the removed position again, a countermeasure against contact failure is realized, and as a result, good electrical contact is obtained. Is disclosed.

A second prior art for solving the conventional problem is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-177.
No. 286 (Applicant: Mitsubishi Electric Corporation, filing date: 1)
(See FIG. 6, December 3, 992).

A contact pin B2 in the second prior art IC socket is connected to a lead portion B of a device (not shown).
1 and has a saw-tooth waveform B2b.

A third prior art for solving the conventional problems is disclosed in Japanese Patent Application Laid-Open No. Hei 8-203643.
Gazette (Applicant: Kyushu NEC Corporation, Filing date: 19
(See FIG. 7, Jan. 30, 1995).

A third prior art IC socket C30 has an I socket
Contact pins C21, C24, C of C socket C30
25, air C40, C41, C42, C44, C4 at a predetermined angle θ1 for removing foreign matter adhering on C26.
5, a foreign matter removing device provided with air blow-out blowout ports C1, C2, C3, and C4 for blowing C46 and C47.

[0011]

However, in the IC socket of the first prior art, when the contact pin A8 makes electrical contact with the external terminal A6 due to the lowering of the external terminal presser A7, the device does not work. The contact pin A8 has a first contact surface A8a for wiping the surface of the external terminal A6, which is a lead portion of A5, and a second contact surface A8b for re-contacting the position. There is a problem in that the shape of the portion becomes complicated, and the foreign matter is deposited as the device is used because of the wiping of the foreign matter, and there is a high possibility that a contact failure is caused.

In the second prior art, contact pins B
2 has a contact surface for contacting a lead portion B1 of a device (not shown), and further has a sawtooth-shaped B2b
Therefore, the shape of the contact surface portion of the contact pin B2 becomes complicated, and the foreign matter is likely to accumulate as it is used for wiping of the foreign matter, resulting in poor contact. there were.

In the third prior art, the IC socket C3
The air C40, C41, C42, C44, C45, C46, C at a predetermined angle θ1 for removing foreign matter adhering on the contact pins C21, C24, C25, C26 of the zero.
Air blow outlets C1, C2, C for blowing 47
Since such a configuration is effective for removing foreign matter on the IC socket C30 side, there is a technical problem that it is difficult to remove foreign matter on the semiconductor device side. There is also a problem that the removing mechanism becomes large.

An object of the present invention is to solve such a conventional problem. First, the shape of a contact surface of a contact pin is simplified, and a wiping action for foreign matter is omitted to reduce the time. It is an object of the present invention to avoid a defective contact by avoiding a typical foreign matter accumulation phenomenon.

Second, by simplifying the foreign matter removing mechanism, I
It is an object of the present invention to remove foreign matter on the semiconductor device side in addition to removing foreign matter on the C socket.

[0016]

According to an aspect of the present invention, there is provided an IC socket for mounting a semiconductor device on a wiring board. A spring mechanism that plastically deforms in response to a pressure generated when the external terminal 12 of the device 11 is pressed, and generates a plastic elastic force in accordance with the plastic deformation;
A contact surface 13A that is urged by the plastic elastic force generated by the spring mechanism to be in electrical contact with the external terminal 12, and a through hole 13C formed along the pressing direction at a substantially central portion of the contact surface 13A. Contact pin 1 with
3 and the wiring electrically connected to the contact pins 13 and showing the state of electrical contact with the external terminals 12 at the contact surface 13A when mounted on the wiring board. The mounting terminal 13B electrically transmitting the pattern and the mounting terminal 13B resiliently provided in the through-hole 13C below the contact surface 13A so as to penetrate the mounting terminal 13B. Is plastically deformed independently of the contact pin 13 in response to the pressure generated when the external terminal 12 is pressed against its own head, and is urged by the plastic elastic force generated by itself in response to the plastic deformation.
The IC socket 10 has a structure including an elastic pin 14 that electrically contacts the external terminal 12 and electrically transmits a state of electrical contact with the external terminal 12 to the mounting terminal 13B.

According to the first aspect of the present invention, the shape of the contact surface 13A of the contact pin 13 is simplified, and the wiping action of the foreign substance is omitted to avoid the foreign substance accumulation phenomenon with time, resulting in poor contact. Can be avoided. In addition, the external terminals 12 of the semiconductor device 11
Even if there is a foreign substance between the contact pin 13 and the contact pin 13, the elastic pin 14 enables a good electrical connection without poor contact.

According to a second aspect of the present invention, there is provided the IC socket of the first aspect, wherein the elastic pin
The IC socket 10 has a structure in which a head pressed against the contact pin 13 is elastically mounted on the mounting terminal 13B such that the head is located on the same plane as the contact surface 13A.

According to the second aspect of the present invention, the first aspect is provided.
In addition to the effects described in, the simplification of the foreign matter removal mechanism
In addition to removing foreign matter on the IC socket 10 side, the semiconductor device 1
Removal of foreign matter on one side can be realized.

In addition, since the elastic pins 14 are located on the same plane as the contact surface 13A of the contact pins 13 with the external terminals 12, deformation of the external terminals 12 in the case of protrusion and poor contact in the case of dents are prevented. Can be prevented.

According to a third aspect of the present invention, there is provided the IC socket of the second aspect, wherein the elastic pin
Has a head pressed against the contact pin 13,
The IC socket 10 has a structure in which the contact pins 13 come into contact with the external terminals 12 again.

According to the invention of claim 3, according to claim 2,
The same effect as the effect described in (1) is obtained.

According to a fourth aspect of the present invention, in the IC socket 10 according to any one of the first to third aspects, the elastic pin 14 has the external terminal 12 pressed against its own head. The IC socket 10 has a structure that has a spring mechanism that undergoes plastic deformation independently of the contact pin 13 in response to a pressure generated when the spring pin generates a plastic elastic force in accordance with the plastic deformation.

According to the invention of claim 4, according to claim 1,
In addition to the effects described in any one of (3) to (3), a spring mechanism is provided so that the external terminal 12 can be contacted with an appropriate load and stable contact can be obtained. Also, the durability is improved. In addition, by providing a spring mechanism, the shape of the contact surface 13A of the contact pin 13 can be simplified, and a wiping action of a foreign substance can be omitted to avoid a foreign substance accumulation phenomenon over time to avoid a contact failure. Can be achieved. In addition, the semiconductor device 11
Even if there is a foreign substance between the external terminal 12 and the contact pin 13, the elastic pin 14 enables good electrical connection without poor contact.

According to a fifth aspect of the present invention, in the IC socket 10 according to any one of the first to fourth aspects, the elastic pins 14 are provided on the opposite side of the contact surface 13A to the mounting terminals. 13B is an IC socket 10 having a structure electrically connected to 13B.

According to the invention described in claim 5, claim 1 is
In addition to the effects described in any one of (4) to (4), the elastic pin 14 is provided on the contact surface 13
Since it is electrically connected to the contact pin 13 on the side opposite to A, the electric path from the semiconductor device 11 to the outside (specifically, a test board or the like) is reinforced, and more stable electric characteristics are obtained. Will be able to do it.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view for explaining an embodiment of the IC socket 10 of the present invention.

The IC socket 10 shown in FIG. 1 is an IC used when the semiconductor element 11 for QFP is mounted on a wiring board.
Socket. In the following description, the semiconductor device 11 will be referred to as Quad F
The semiconductor device 11 for a late package (QFP) QFP will be represented. Further, the external terminals 12 will be referred to as lead frame terminals 12. IC socket 1
0 is a lead frame terminal 1 of the semiconductor element 11 for QFP.
2 corresponding to the contact pin 13 and the mounting terminal 13B
It has a hardware configuration centered on the elastic pin 14.

The contact pin 13 has a hardware structure centered on a spring mechanism and a through hole 13C (FIGS. 3 and 4).

The spring mechanism plastically deforms in response to the pressure generated when the lead frame terminal 12 of the QFP semiconductor element 11 is pressed, and generates a plastic elastic force in accordance with the plastic deformation. The through hole 13C is formed along the pressing direction at a substantially central portion of the contact surface 13A that is urged by the plastic elastic force generated by the spring mechanism and electrically contacts the lead frame terminal 12.

The mounting terminal 13B is connected to the contact pin 13
And a pin shape for electrically transmitting a state of electrical contact with the lead frame terminal 12 at the contact surface 13A when mounted on the wiring board to a wiring pattern formed on the wiring board. Terminal.

The elastic pin 14 has a structure in which it is elastically mounted on the mounting terminal 13B while penetrating into the through hole 13C below the contact surface 13A.

Further, the elastic pin 14 is plastically deformed independently of the contact pin 13 in response to the pressure generated when the lead frame terminal 12 of the QFP semiconductor element 11 is pressed against its own head, and becomes plastically deformed. In response to the plastic elastic force generated by itself, the lead frame terminal 12 is electrically contacted with the lead frame terminal 12 and, at the same time, the electrical contact state with the lead frame terminal 12 is electrically transmitted to the mounting terminal 13B. I have.

Further, the elastic pin 14 is
Is elastically mounted on the mounting terminal 13B so that the head pressed against the mounting terminal 13B is located on the same plane as the contact surface 13A.

Further, the elastic pin 14 is
Has a structure in which the head pressed against the contact pin 13 contacts again the position where the contact pin 13 contacts the lead frame terminal 12.

As a result, the foreign matter removing mechanism can be simplified, and in addition to the foreign matter removal on the IC socket 10 side, the foreign matter removal on the QFP semiconductor element 11 side can be realized.

In addition, since the elastic pin 14 is located on the same plane as the contact surface 13A of the contact pin 13 with the lead frame terminal 12, the deformation of the lead frame terminal 12 in the case of protrusion and the contact in the case of dent Failure can be prevented.

Further, the elastic pin 14 is plastically deformed independently of the contact pin 13 in response to a pressure generated when the lead frame terminal 12 is pressed against its own head, and simultaneously has a plastic elastic force corresponding to the plastic deformation. Is provided.

Since the IC socket 10 of the present embodiment has such a spring mechanism, the IC socket 10 can come into contact with the lead frame terminal 12 with an appropriate load, and a stable contact can be obtained. Also, the durability is improved. In addition, by providing a spring mechanism, the shape of the contact surface 13A of the contact pin 13 can be simplified, and a wiping action of a foreign substance can be omitted to avoid a foreign substance accumulation phenomenon over time to avoid a contact failure. Can be achieved. In addition, the lead frame terminal 12 of the semiconductor element 11 for QFP
Even if there is a foreign substance between the contact pin 13 and the contact pin 13, the elastic pin 14 enables a good electrical connection without poor contact.

Further, the elastic pin 14 is electrically connected to the mounting terminal 13B on the side opposite to the contact surface 13A.

The elastic pin 14 is used for the semiconductor element 11 for QFP.
Is electrically connected to the contact pins 13 on the side opposite to the contact surface 13A with the lead frame terminal 12, so that an electrical path from the semiconductor element 11 for QFP to the outside (specifically, a test board or the like) is provided. Is reinforced, and more stable electrical characteristics can be obtained.

As described above, according to the present embodiment, the shape of the contact surface 13A of the contact pin 13 can be simplified, and the wiping action of the foreign matter can be omitted to avoid the temporal foreign matter accumulation phenomenon. It is possible to avoid poor contact. In addition, the lead frame terminal 12 and the contact pin 13 of the semiconductor element 11 for QFP are used.
Even if there is a foreign substance between them, the elastic pin 14 enables good electrical connection without poor contact.

The embodiment of the present invention will be described in more detail.

The QFP semiconductor element 11 is mounted on a pedestal 15 which is normally movable by a spring or the like. At this time, the lead frame terminal 12 of the semiconductor element 11 for QFP is used.
Are located on the contact surface 13A of the contact pin 13.

Thereafter, the lead frame terminal 12 comes into electrical contact with the contact pin 13 as the external terminal retainer 17 descends.

The contact pin 13 has a through hole 13C at the center of the contact surface 13A with the lead frame terminal 12 (FIGS. 3 and 4), and the elastic pin 14 is formed so as not to protrude from the upper surface of the contact surface 13A. Is located. Elastic pin 14
Has an inverted S-shaped spring mechanism at its center,
The lower end is electrically connected to the contact pin 13.

The contact surface 13A of the contact pin 13
The opposite end is a terminal 13 for mounting on a test board or the like.
B.

FIG. 2 is a view of FIG. 1 as viewed from above. FIG. 3 shows a lead frame terminal 1 of the semiconductor element 11 for QFP.
FIG. 4 is an enlarged view of a contact portion between the contact pin 2 and the contact pin 13.
FIG. 4 is a cross-sectional view taken along the line AA of the contact portion in FIG.

The through hole 13C is formed in the semiconductor element 11 for QFP.
Is located at the center of the contact surface 13A of the lead frame terminal 12 of the lead frame terminal 12.
2 contacts the contact pin 13 and the elastic pin 14 simultaneously.

For example, if foreign matter is attached to the lead frame terminal 12, if it is face-to-face, a contact failure occurs.
Electrical contact is provided by the elastic pins 14. Further, since the contact pin 13 has a spring mechanism, when the external terminal retainer 17 is lowered, the elastic pin 14 rubs the contact surface 12A of the lead frame terminal 12, so that more reliable contact is possible.

Since the elastic pin 14 is electrically connected to the contact pin 13 at the other end, the electrical characteristics are also improved.

Further, the elastic pin 14 is
By making the same surface without protruding from the contact surface with the lead frame terminal 12, the deformation of the lead frame terminal 12 when the semiconductor device is mounted on the IC socket 10 can be prevented.

[0054]

According to the IC socket of the present invention,
Even if there is a foreign substance between the external terminal of the semiconductor device and the contact pin, a good electrical connection without contact failure can be made by the elastic pin.

By arranging the elastic pin on the same plane as the contact surface of the contact pin with the external terminal, deformation of the external terminal in the case of protrusion and poor contact in the case of dent can be prevented.

Also, since the spring mechanism is provided, the external terminal can be contacted with an appropriate load and a stable contact can be obtained. Also, the durability is improved.

Since the elastic pin is electrically connected to the contact pin on the side opposite to the contact surface with the external terminal of the semiconductor device, the electric path from the semiconductor device to the outside (test board or the like) is reinforced, More stable electric characteristics can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating an embodiment of an IC socket of the present invention.

FIG. 2 is a view of FIG. 1 as viewed from above.

FIG. 3 is an enlarged view of a contact portion between an external terminal and a contact pin of the semiconductor device.

FIG. 4 is a sectional view taken along line AA of a contact point in FIG. 3;

FIG. 5 is a cross-sectional view illustrating an IC socket according to a first related art.

FIG. 6 is a cross-sectional view illustrating an IC socket according to a second related art.

FIG. 7 is a cross-sectional view illustrating an IC socket according to a third related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... IC socket 11 ... Semiconductor device 12 ... External terminal 13 ... Contact pin 13A ... Contact surface 13B ... Mounting terminal 13C ... Through-hole 14 ... Elastic pin 15 ... Pedestal 17 ... External terminal pressing

Claims (5)

[Claims] An IC socket used for mounting a semiconductor device on a wiring board, wherein the IC socket is plastically deformed in response to a pressure generated when an external terminal of the semiconductor device is pressed, and is also deformed in response to the plastic deformation. A spring mechanism that generates a plastic elastic force; a contact surface that is urged by the plastic elastic force generated by the spring mechanism to make electrical contact with the external terminal; and a substantially central portion of the contact surface along the pressing direction. A contact pin having a through-hole formed by forming the wiring board, and electrically connecting the contact pin to the external terminal on the contact surface when mounted on the wiring board. A mounting terminal that electrically transmits to a wiring pattern formed thereon; and a resilient terminal mounted on the mounting terminal in a state of being penetrated into the through-hole below the contact surface, and provided outside the semiconductor device. In response to the pressure generated when the external terminal is pressed against its own head, the external terminal is plastically deformed independently of the contact pin, and is urged by the plastic elastic force generated by itself in response to the plastic deformation to be electrically connected to the external terminal. And an elastic pin that electrically contacts and electrically transmits a state of electrical contact with the external terminal to the mounting terminal. 2. The mounting method according to claim 1, wherein the elastic pin is elastically mounted on the mounting terminal such that a head pressed against the contact pin is located on the same plane as the contact surface. IC described in 1
socket. 3. The elastic pin according to claim 2, wherein the head pressed against the contact pin has a structure in which the contact pin comes into contact with a position where the contact pin contacts the external terminal again. IC socket. 4. The elastic pin is plastically deformed independently of the contact pin in response to a pressure generated when the external terminal is pressed against the head of the self, and has a plastic elasticity corresponding to the plastic deformation. 4. A spring mechanism for generating a force.
The IC socket according to any one of the above. 5. The IC socket according to claim 1, wherein the elastic pin is electrically connected to the mounting terminal on a side opposite to the contact surface. .