JPH1126029A - Battery - Google Patents

Battery

Info

Publication number
JPH1126029A
JPH1126029A JP9174341A JP17434197A JPH1126029A JP H1126029 A JPH1126029 A JP H1126029A JP 9174341 A JP9174341 A JP 9174341A JP 17434197 A JP17434197 A JP 17434197A JP H1126029 A JPH1126029 A JP H1126029A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit board
hybrid integrated
battery
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9174341A
Other languages
Japanese (ja)
Inventor
Hisashi Shimizu
永 清水
Noriaki Sakamoto
則明 坂本
Hideshi Saito
秀史 西塔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP9174341A priority Critical patent/JPH1126029A/en
Publication of JPH1126029A publication Critical patent/JPH1126029A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

PROBLEM TO BE SOLVED: To shield most noises with an exterior package can and a hybrid integrated circuit board and prevent the malfunctions of a protective circuit by mounting a hybrid integrated circuit board having a shield function on the back face, so that its mounting face faces the exterior package can. SOLUTION: An electrode section 60 of this battery is made into a negative electrode (or a positive electrode), and an exterior package can 63 is made into a positive electrode (or a negative electrode). The electrode section 60 and the exterior package can 63 are made of a metal, particularly a metal which allows spot welding or wire bonding. On the other hand, a hybrid integrated circuit board 62 is provided with an opening section 64 at the portion corresponding to the electrode section 60. The hybrid integrated circuit 62 is generally made of a ceramic board, a printed board, an epoxy board, a metal board or the like. Wires 66 are stuck via an insulting resin 65 to the hybrid integrated circuit board 62, if it is made of the metal board or directly stuck to the hybrid integrated circuit board 62 if it is made of an insulating board. The wires 66 are electrically connected and fixed to circuit elements, such as a semiconductor element 67 and a passive element 68.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電池に関するも
のであり、電池に実装される充放電回路等の誤動作を防
止する構成、この充放電回路のコンパクト実装に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a battery, and more particularly to a structure for preventing a malfunction of a charge / discharge circuit mounted on a battery and a compact mounting of the charge / discharge circuit.

【0002】[0002]

【従来の技術】近年、各種電子機器の小型軽量化が進ん
で、携帯しても軽くて持ち運びが簡単な機器が多数商品
化されている。携帯用の機器に対しては、駆動用の電源
として商用交流が使用できないので、電池が使用され
る。使用される電池は、長時間の連続使用や大電流によ
る放電にも耐えるような高エネルギー密度の電池が望ま
れている。
2. Description of the Related Art In recent years, various electronic devices have been reduced in size and weight, and a large number of devices that are light and easy to carry even when they are carried have been commercialized. A battery is used for portable equipment because commercial AC cannot be used as a power source for driving. As the battery to be used, a battery having a high energy density that can withstand continuous use for a long time and discharge by a large current is desired.

【0003】そこで、ニッケル−カドミウム電池やニッ
ケル−水素電池のような二次電池を複数本組み合わせた
パック電池が広く用いられてきた。二次電池は充放電す
ることによって繰り返し使用できるし、また複数本組み
合わせることによって簡単に高電圧や高容量の電源を得
ることができる。さらに、組み合わせる際に、その形状
を電気機器の電池装着部の形状に合わせることによっ
て、その機器に適したパック電池を構成することができ
る。
[0003] Therefore, a pack battery in which a plurality of secondary batteries such as a nickel-cadmium battery and a nickel-hydrogen battery are combined has been widely used. The secondary battery can be repeatedly used by charging and discharging, and a high-voltage or high-capacity power supply can be easily obtained by combining a plurality of the secondary batteries. Further, when the battery packs are combined, the shape is matched to the shape of the battery mounting portion of the electric device, whereby a battery pack suitable for the device can be formed.

【0004】また、最近では、ニッケル−カドミウム電
池よりもさらに高エネルギー密度を持ったリチウムイオ
ン電池が開発されている。しかしながら、リチウムイオ
ン電池は、過充電や過放電を行うと劣化を招きやすいこ
とから、過充電や過放電を防止する保護回路が必要とさ
れている。従って、リチウムイオン電池を内蔵するパッ
ク電池は、保護回路を構成したプリント基板等を、電池
と一緒に収納していた。
[0004] Recently, lithium ion batteries having higher energy density than nickel-cadmium batteries have been developed. However, since a lithium ion battery is liable to be deteriorated when overcharged or overdischarged, a protection circuit for preventing overcharge or overdischarge is required. Therefore, in a battery pack containing a lithium ion battery, a printed circuit board or the like forming a protection circuit is housed together with the battery.

【0005】以上の事柄を説明するものとしては、特開
平08−329913号公報に詳細に述べられており、
図5および図6を参照して説明する。10は箱型の本体ケ
ース、11は蓋である。この本体ケース10と蓋11とでパッ
ク電池の外形が構成されている。本体ケース10は、蓋11
を装着する部分に段差部12を形成しており、ここに蓋11
が装着されることによって、本体ケース10の端面と蓋11
とがフラットになってきれいな直方体の外形が完成す
る。
[0005] Japanese Patent Application Laid-Open No. 08-329913 discloses the above matters in detail.
This will be described with reference to FIGS. 10 is a box-shaped main body case, and 11 is a lid. The body case 10 and the lid 11 constitute the outer shape of the battery pack. The body case 10 has a lid 11
A step 12 is formed in the part where the
Is attached, the end face of the main body case 10 and the lid 11
Is flattened and a beautiful rectangular solid is completed.

【0006】本体ケース10の短手方向の側面板には一対
の端子窓13が開孔し、長手方向の側面板にはリブ14が設
けられている。そして、本体ケース10の四隅の内、前記
リブ14が設けられた側面板側の二隅は、逆収納防止部15
が形成されている。残りの二隅はほぼ直角のコーナーに
なっている。20は角型のリチウムイオン電池である。こ
の電池20は角型の外装缶21に電極部22が突出した外形と
なっている。電極部22は負極(または正極でも良い)
で、外装缶21は全て正極(または負極でも良い)となっ
ている。23は絶縁紙で、電極部22が露出するように孔が
開けられている。絶縁紙23は両面テープ等によって電池
20に固定されている。この絶縁紙23は後述するリード板
42を電極部22に溶接した際にリード板42と外装缶21とが
接触してショートすることを防止する。
A pair of terminal windows 13 are opened in the lateral side plate of the main body case 10, and ribs 14 are provided in the longitudinal side plate. Of the four corners of the main body case 10, two corners on the side plate side where the ribs 14 are provided are
Are formed. The remaining two corners are almost right-angled corners. 20 is a prismatic lithium ion battery. The battery 20 has an outer shape in which an electrode portion 22 protrudes from a rectangular outer can 21. The electrode part 22 is a negative electrode (or may be a positive electrode)
Thus, the outer can 21 is all a positive electrode (or may be a negative electrode). Reference numeral 23 denotes insulating paper, which has a hole so that the electrode portion 22 is exposed. Insulating paper 23 is a battery with double-sided tape etc.
Fixed to 20. This insulating paper 23 is a lead plate described later.
When the 42 is welded to the electrode section 22, the short circuit caused by the contact between the lead plate 42 and the outer can 21 is prevented.

【0007】30は第1のプリント基板、31は第2のプリ
ント基板である。2枚のプリント基板30、31はともに細
長い板状であり、第1のプリント基板30の端部領域32を
除いた中央部分に回路素子33が実装されている。回路素
子33は背の高い素子や背の低い素子が入り混じって、各
素子間にはわずかなスペースがある。なお、回路素子33
は前記リチウムイオン電池20と接続されて、過充電や過
放電から電池を守る保護回路を構成している。
Reference numeral 30 denotes a first printed board, and 31 denotes a second printed board. Each of the two printed boards 30 and 31 has an elongated plate shape, and a circuit element 33 is mounted on a central portion of the first printed board 30 excluding an end region 32. As the circuit element 33, a tall element and a short element are mixed, and there is a slight space between each element. The circuit element 33
Is connected to the lithium-ion battery 20 and constitutes a protection circuit for protecting the battery from overcharge or overdischarge.

【0008】35は温度変化に応じて抵抗値が変化するサ
ーミスタであり、電池20と直列に接続されることによっ
て電池20に過大電流が流れることを防止している。サー
ミスタ35は絶縁紙36によって電池の外装缶21との絶縁が
保たれている。絶縁紙36は両面テープによってサーミス
タ35に固定されている。また、両基板30、31や、サーミ
スタ35及び絶縁紙36の幅は、電池20の厚みと同一となっ
ており、両基板30、31やサーミスタ35を電池20に沿わせ
たときに、電池20の厚みからはみでないようになってい
る。従って、前記本体ケース10の厚みの内寸はほぼ電池
20の厚みと同一であって、それ以上厚くしなくても良
い。
Reference numeral 35 denotes a thermistor whose resistance value changes in accordance with a change in temperature. The thermistor 35 is connected in series with the battery 20 to prevent an excessive current from flowing through the battery 20. The thermistor 35 is insulated from the battery outer can 21 by insulating paper 36. The insulating paper 36 is fixed to the thermistor 35 with a double-sided tape. The widths of the two substrates 30, 31 and the thermistor 35 and the insulating paper 36 are the same as the thickness of the battery 20, and when the two substrates 30, 31 and the thermistor 35 are aligned with the battery 20, It does not look out of the thickness of. Therefore, the inner dimension of the thickness of the main body case 10 is substantially
It is the same as the thickness of 20 and need not be thicker.

【0009】40は第1のリード板、41は第2のリード板
である。42は前記電極部22と前記サーミスタ35とを接続
するリード板である。第1のリード板40は、第1のプリ
ント基板30と第2のプリント基板31とを連結している。
第2のリード板41は、第2のプリント基板31と電池の外
装缶21とを連結している。これらのリード板によって、
前記サーミスタ35及び第1のプリント基板30とが、電池
20の長手方向の側面に沿って配置され、第2のプリント
基板32が短手方向の側面に沿って配置される。そして第
2のリード板41がさらに折れ曲がって前記第1のプリン
ト基板30と対向する側の外装缶21に接続される。
Reference numeral 40 denotes a first lead plate, and reference numeral 41 denotes a second lead plate. Reference numeral 42 denotes a lead plate for connecting the electrode section 22 and the thermistor 35. The first lead board 40 connects the first printed board 30 and the second printed board 31.
The second lead plate 41 connects the second printed circuit board 31 and the battery outer can 21. With these lead plates,
The thermistor 35 and the first printed circuit board 30 are
The second printed circuit board 32 is arranged along the lateral sides of the longitudinal direction of the second printed circuit board. Then, the second lead plate 41 is further bent and connected to the outer can 21 on the side facing the first printed circuit board 30.

【0010】また、リード板41は、サーミスタ35、第
1のプリント基板30を介して、電池の外装缶21と電気
接続される。一方、リード板42は外装缶とは異なる電
極部22と電気接続される。
The lead plate 41 is electrically connected to the battery outer can 21 via the thermistor 35 and the first printed circuit board 30. On the other hand, the lead plate 42 is electrically connected to the electrode portion 22 different from the outer can.

【0011】[0011]

【発明が解決しようとする課題】しかしながら、プリン
ト基板をパック電池の中に収納すると、その分だけスペ
ースが必要となってパック電池が大型化してしまうし、
また、電池の電極端子及びパック電池の外部端子に対し
て保護回路を電気的及び機械的に接続しなければならな
いので、プリント基板の収納位置や外部端子の配置が難
しい等の問題がある。
However, if the printed circuit board is housed in a battery pack, the battery pack requires a corresponding amount of space and the battery pack becomes large.
In addition, since the protection circuit must be electrically and mechanically connected to the electrode terminals of the battery and the external terminals of the battery pack, there is a problem that the storage position of the printed circuit board and the arrangement of the external terminals are difficult.

【0012】また電池としてリチウム電池を採用する
と、最大のメリットであるエネルギー密度が高く、高電
圧が確保できるため携帯電話やノート型パソコン等幅広
く採用されるが、逆に安全性に問題があることが知られ
ている。特に充放電時が問題であり、従来例では、サー
ミスタを設けているほどである。しかも充放電回路にマ
イコン等のICが実装されるようになり、特に携帯電話
等は、ギガオーダーの周波数を採用しているため、この
高周波ノイズが電話の特定方向から侵入し、誤動作を引
き起こしたりする問題があった。
When a lithium battery is used as a battery, the greatest advantages are high energy density and a high voltage, so that it can be widely used in mobile phones and notebook computers, but it has a problem in safety. It has been known. In particular, charging / discharging is a problem. In the conventional example, a thermistor is provided. In addition, ICs such as microcomputers are now mounted on the charge / discharge circuit. In particular, mobile phones and the like use frequencies in the giga order, so this high-frequency noise can enter the phone from a specific direction and cause malfunctions. There was a problem to do.

【0013】[0013]

【課題を解決するための手段】本発明は、前述の問題に
鑑みてなされ、第1に、裏面に侵入するノイズを防止す
るシールド機能を有した混成集積回路基板を前記外装缶
の何れかの側面に実装することで解決するものである。
特に混成集積回路基板として金属基板を採用し、ベアチ
ップ実装をすることで解決するものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. First, a hybrid integrated circuit board having a shielding function for preventing noise from entering the back surface is provided by using any one of the above-mentioned outer cans. This can be solved by mounting it on the side.
In particular, this problem can be solved by adopting a metal substrate as a hybrid integrated circuit substrate and mounting it on a bare chip.

【0014】つまり混成集積回路基板として金属基板や
その他シールド機能を施した基板を採用すれば、金属よ
り成る外装缶に配置することで、混成集積回路基板上の
回路のシールドが可能となる。第3に、電極部の有る外
装缶の側面に配置され、前記電極部が露出する開口部を
有した混成集積回路基板と、前記開口部から露出した前
記電極部と電気的に接続された第1の接続手段と、前記
混成集積回路基板上に設けられた配線と電気的に接続さ
れ、且つ前記外装缶と電気的に接続された第2の接続手
段とを有することで解決するものである。特に電極部の
有る側面に混成集積回路基板を実装することで電池のコ
ンパクト化が可能となり、且つ開口部を混成集積回路基
板に設けることで電極部との接続が容易となり、組立工
程の簡略化が図れる。
That is, if a metal substrate or another substrate having a shielding function is employed as the hybrid integrated circuit board, the circuit on the hybrid integrated circuit board can be shielded by disposing the board on a metal outer can. Third, a hybrid integrated circuit board disposed on a side surface of an outer can having an electrode portion and having an opening through which the electrode portion is exposed, and a hybrid integrated circuit board electrically connected to the electrode portion exposed through the opening portion This problem is solved by including the first connection means and the second connection means electrically connected to the wiring provided on the hybrid integrated circuit board and electrically connected to the outer can. . In particular, by mounting the hybrid integrated circuit board on the side surface having the electrode portion, the battery can be made compact, and by providing the opening portion in the hybrid integrated circuit board, connection with the electrode portion becomes easy, and the assembly process is simplified. Can be achieved.

【0015】第4に、混成集積回路基板をシールド機能
を有する基板で構成することで、例えば充放電回路等の
ノイズによる誤動作を防止することができる。第5に、
電極部の有る外装缶側面の周囲から実装空間を構成する
ために設けられた突出部と、裏面が前記実装空間の蓋と
なるように配置された混成集積回路基板とで、完全な実
装空間を実現できるため、ノイズによる誤動作を防止で
きる。
Fourth, by constituting the hybrid integrated circuit board with a board having a shielding function, it is possible to prevent a malfunction due to noise in a charge / discharge circuit or the like. Fifth,
A complete mounting space is formed by a protruding portion provided to form a mounting space from the periphery of the outer can having the electrode portion and a hybrid integrated circuit board arranged such that the back surface serves as a lid of the mounting space. Since it can be realized, malfunction due to noise can be prevented.

【0016】また第6に、第1の接続手段が例えば前記
突出部と勘合するように構成すれば、この実装空間を密
閉シールする事ができ、ベアチップ実装、ノイズシール
ド等が可能となる。
Sixth, if the first connecting means is configured to engage with, for example, the protruding portion, the mounting space can be hermetically sealed, and bare chip mounting, noise shielding, and the like can be performed.

【0017】[0017]

【発明の実施の形態】以下本発明の第1の実施の形態に
ついて図4を参照して説明する。符号50は、電池の概
略図を示すもので、図5と同様に、角型の外装缶21に
電極部52が突出した外形となっている。電極部52
は、負極(または正極)で、外装缶51は、全て正極
(または負極)と成っている。
The first embodiment of the present invention will be described below with reference to FIG. Reference numeral 50 indicates a schematic view of the battery, which has an outer shape in which the electrode portion 52 protrudes from the rectangular outer can 21 as in FIG. Electrode section 52
Is a negative electrode (or a positive electrode), and the outer can 51 is entirely a positive electrode (or a negative electrode).

【0018】符号53、54は、混成集積回路基板の概
略を示し、この上には、電池50に必要な回路が実装さ
れている。回路としては、例えば充放電用の保護回路等
である。本発明の特徴は、ノイズが侵入する方向を裏面
に混成集積回路基板を外装缶に配置することであり、ノ
イズの遮断をするために、この混成集積回路基板として
金属基板を採用したり、シールド可能な金属フィルムを
全面に貼った多層基板(プリント基板、セラミック基
板、エポキシ基板等)から成る絶縁性基板を採用するこ
とである。また特に半導体素子はベアチップで実装する
ため、混成集積回路基板を外装缶に配置できるサイズで
足りる。
Reference numerals 53 and 54 schematically denote a hybrid integrated circuit board on which circuits necessary for the battery 50 are mounted. The circuit is, for example, a protection circuit for charging and discharging. A feature of the present invention is that a hybrid integrated circuit board is disposed on an outer can in a direction in which noise enters, on a back surface.In order to cut off noise, a metal substrate is employed as the hybrid integrated circuit board or a shield is adopted. An insulative substrate composed of a multi-layer substrate (printed substrate, ceramic substrate, epoxy substrate, etc.) having a possible metal film adhered to the entire surface is employed. In particular, since the semiconductor element is mounted on a bare chip, a size sufficient to arrange the hybrid integrated circuit board in the outer can is sufficient.

【0019】例えば、携帯用の電話等は、内部の回路か
らノイズを発生する。特にこのノイズは、殆どがその発
生方向および侵入方向が決まっており、そのノイズによ
り回路誤動作を発生する。例えば、ある機種では矢印A
からノイズが侵入するので、ノイズの発生源の方向を裏
面にして図のように混成集積回路基板54を設ける。ま
た別の機種では矢印Bからノイズが侵入するので、ノイ
ズの発生源を裏面にして図のように混成集積回路基板5
3を設ける。その結果、混成集積回路基板に実装される
回路は、外装缶51と混成集積回路基板でサンドウィッ
チされ、殆どのノイズを遮断することができる。
For example, a portable telephone or the like generates noise from an internal circuit. In particular, most of the noise is determined in the direction in which the noise is generated and invaded, and the noise causes a malfunction in the circuit. For example, in some models, arrow A
The hybrid integrated circuit board 54 is provided as shown in FIG. In another model, noise enters from arrow B, so that the source of the noise is on the back side and the hybrid integrated circuit board 5 as shown in the figure.
3 is provided. As a result, the circuit mounted on the hybrid integrated circuit board is sandwiched between the outer can 51 and the hybrid integrated circuit board, and most of the noise can be cut off.

【0020】図2、図3は、このシールド方法の一例を
示すもので、更に無駄な領域となってしまう電極部52
の突出部を有効に活用しているものである。以下、図
1、図2および図3を順に説明する。図1は、主として
電極部60の突出領域を活用して配置したものであり、
電池61の電極部60がある外装缶63の側面63に混
成集積回路基板62を配置したものである。
FIGS. 2 and 3 show an example of this shielding method.
The effective use of the protruding part. Hereinafter, FIG. 1, FIG. 2, and FIG. 3 will be described in order. FIG. 1 mainly shows an arrangement in which the projecting region of the electrode unit 60 is utilized.
A hybrid integrated circuit board 62 is arranged on a side surface 63 of an outer can 63 having an electrode portion 60 of a battery 61.

【0021】電池60は、図5で説明したように、例え
ば角型の外装缶63に電極部60が突出した外形となっ
ており、電極部60は負極(または正極でも良い)で、
外装缶63は全て正極(または負極でも良い)となって
いる。そしてこの電極部および外装缶は、金属より成
り、特にスポットウェルドやワイヤボンドが実現できる
金属で成っている。
As described with reference to FIG. 5, the battery 60 has an outer shape in which the electrode portion 60 protrudes from, for example, a rectangular outer can 63. The electrode portion 60 is a negative electrode (or may be a positive electrode).
The outer cans 63 are all positive electrodes (or negative electrodes). The electrode portion and the outer can are made of a metal, particularly a metal capable of realizing spot welding and wire bonding.

【0022】一方、混成集積回路基板62は、前記側面
と実質同じサイズまたはそれより小さいサイズで構成さ
れ、電極部60に対応する部分は、開口部64が設けら
れている。ここの混成集積回路基板は、一般に混成集積
回路装置として採用されるもので良く、セラミック基
板、プリント基板、エポキシ基板および金属基板等が考
えられる。
On the other hand, the hybrid integrated circuit board 62 has a size substantially equal to or smaller than that of the side surface, and a portion corresponding to the electrode portion 60 is provided with an opening 64. The hybrid integrated circuit board here may be generally adopted as a hybrid integrated circuit device, and may be a ceramic substrate, a printed board, an epoxy board, a metal board, or the like.

【0023】この混成集積回路基板には、金属基板であ
れば絶縁樹脂65を介して、絶縁基板であれば直接配線
66が貼着され、この配線66は回路素子である半導体
素子67や受動素子68等が電気的に接続され固着され
ている。最終的には、この電池60の為の回路が実現さ
れており、例えばここでは充放電用保護回路が構成され
ている。
A wiring 66 is adhered to the hybrid integrated circuit board via an insulating resin 65 if the substrate is a metal substrate, or a wiring 66 directly if the substrate is an insulating substrate. 68 and the like are electrically connected and fixed. Eventually, a circuit for the battery 60 is realized. For example, a charge / discharge protection circuit is configured here.

【0024】この混成集積回路基板を平面的に見たもの
が図7であり、開口部64の左右を渡るように第1の接
続手段である第1の金属電極69が設けられており、こ
の電極は、混成集積回路基板の配線基板と電気的に接続
されている。ここで金属電極69は、開口部64の左右
の側辺に近接延在された配線と接続されているがこの限
りでない。とにかくこの開口部に位置していれば良く、
混成集積回路基板の配線と電気的に接続された第1の金
属基板69が一方の方向から延在され、電極部60上に
延在されていればよい。また混成集積回路基板の左右に
は、第2の接続手段である、第2の金属電極70が設け
られている。これは一方だけでも両側に設けても良い。
FIG. 7 is a plan view of the hybrid integrated circuit board, in which a first metal electrode 69 as a first connection means is provided so as to cross right and left of the opening 64. The electrodes are electrically connected to the wiring board of the hybrid integrated circuit board. Here, the metal electrode 69 is connected to a wiring extending close to the left and right sides of the opening 64, but is not limited thereto. It just needs to be located in this opening,
It is sufficient that the first metal substrate 69 electrically connected to the wiring of the hybrid integrated circuit board extends from one direction and extends over the electrode section 60. On the left and right sides of the hybrid integrated circuit board, second metal electrodes 70 as second connection means are provided. This may be provided only on one side or on both sides.

【0025】本発明の特徴は、前記開口部64を設けた
混成集積回路基板62にある。つまり混成集積回路基板
上の配線66と電極部60を開口部64を介して接続す
ることにある。図面では、第1の金属電極69を設け、
セットした後スポットウェルダーで溶接している。また
この金属電極を省略し、配線と電極部を直接金属細線を
ボンディングしても良い。また同様に第2の金属電極7
0も図1に示すように、下方に折り曲げられ、外装缶と
スポットウェルドまたはワイヤーボンドで電気的に接続
されている。開口部を設けた混成集積回路基板を図1の
ような側面に配置すれば、図5のようにわざわざ電極部
と外装缶に接続する電極を長く延在する必要が無くな
る。
A feature of the present invention resides in a hybrid integrated circuit board 62 provided with the opening 64. In other words, the purpose is to connect the wiring 66 on the hybrid integrated circuit board and the electrode section 60 via the opening 64. In the drawing, a first metal electrode 69 is provided,
After setting, it is welded with a spot welder. Alternatively, the metal electrode may be omitted, and a thin metal wire may be directly bonded between the wiring and the electrode portion. Similarly, the second metal electrode 7
1 is bent downward as shown in FIG. 1 and is electrically connected to the outer can by spot welding or wire bonding. If the hybrid integrated circuit board provided with the opening is disposed on the side surface as shown in FIG. 1, it is not necessary to extend the electrode connected to the electrode portion and the outer can as shown in FIG.

【0026】また本電池の電極は、第1の金属電極69
と混成集積回路基板上に延在された第2の金属電極70
でも良く、また本体ケースを採用する場合、本体ケース
に取り付けられた電極と前記電極69、70が電気的に
接続されている。更にはベアチップは、耐湿劣化防止の
ために樹脂で封止されている。一般には、図5のように
本体ケースに収納されるが、省略する場合もあり、その
場合は、混成集積回路基板、回路素子も含めて図2のよ
うに封止しても良い。
The electrode of the present battery is a first metal electrode 69.
And second metal electrode 70 extended on hybrid integrated circuit substrate
Alternatively, when a main body case is employed, the electrodes attached to the main body case and the electrodes 69 and 70 are electrically connected. Further, the bare chip is sealed with a resin in order to prevent moisture resistance deterioration. Generally, it is housed in the main body case as shown in FIG. 5, but it may be omitted. In this case, the hybrid integrated circuit board and the circuit element may be sealed as shown in FIG.

【0027】続いて第2の実施の形態である図2を説明
する。本実施の形態は、電極部60の突出領域の有効活
用およびシールドを主たる目的としている。従って混成
集積回路基板は、金属基板またはシールド処理された絶
縁基板で成る。ここではやはり金属基板で説明してゆ
く。図1と図2は、基本的には、混成集積回路基板62
の実装面を外装缶の側面に向けただけであり、実質同じ
である。従ってここでは異なる部分のみを説明する。混
成集積回路基板62は、実装面が外装缶63に対面する
ため、混成集積回路基板の実装部品がショートすること
を考慮し、封止樹脂71で覆われている。当然電極部6
0と第1の金属電極69をスポットウェルドするため、
開口部64に対応して封止樹脂も開口部が設けられてい
る。またワイヤボンドする際は、第1の金属電極69を
省略すると接続が不可能となるので、開口部に一部残し
て接続するか、または第1の金属電極69を混成集積回
路基板62の裏面に延在させ、実現している。
Next, FIG. 2 showing a second embodiment will be described. The present embodiment has a main object of effectively utilizing a protruding region of the electrode unit 60 and shielding. Therefore, the hybrid integrated circuit substrate is made of a metal substrate or a shielded insulating substrate. Here, a metal substrate will be described. FIGS. 1 and 2 basically show a hybrid integrated circuit board 62.
This is substantially the same except that the mounting surface of is facing the side surface of the outer can. Therefore, only different parts will be described here. Since the mounting surface of the hybrid integrated circuit board 62 faces the outer can 63, the hybrid integrated circuit board 62 is covered with the sealing resin 71 in consideration of short-circuiting of the mounted components of the hybrid integrated circuit board. Naturally the electrode part 6
In order to spot weld 0 and the first metal electrode 69,
The sealing resin also has an opening corresponding to the opening 64. In wire bonding, if the first metal electrode 69 is omitted, connection is impossible. Therefore, the connection is made while leaving a part in the opening, or the first metal electrode 69 is connected to the back surface of the hybrid integrated circuit board 62. And is realized.

【0028】本発明は、シールド部が混成集積回路基板
全面に設けられているため、特に上方または下方からの
ノイズをシールドする事ができる。また封止樹脂71が
ストッパーとなり、混成集積回路基板を電池に安定して
配置できる。更に第3の実施の形態に図3を参照しなが
ら説明する。本実施の形態も異なる部分のみ説明する。
In the present invention, since the shield portion is provided on the entire surface of the hybrid integrated circuit board, it is possible to shield noise particularly from above or below. Further, the sealing resin 71 serves as a stopper, so that the hybrid integrated circuit board can be stably arranged on the battery. Further, a third embodiment will be described with reference to FIG. In the present embodiment, only different portions will be described.

【0029】最大のポイントは、電極部60のある外装
缶63側面の周囲に一部設けられた突出部72にある。
この突出部72は、外装缶と一体成形されており、第2
の金属電極70と嵌合されている。この嵌合により電気
的接続と混成集積回路基板62の安定配置を実現してい
る。また突出部を側面周囲の全周に設け、実装空間を形
成すれば、混成集積回路基板62の裏面がこの実装空間
の蓋となり、外装缶、電極部および混成集積回路基板で
囲まれた空間のシールドを実現できる。また発生する隙
間は樹脂等で完全シールされる。また第2の金属電極
が、近年お弁当で使われるタッパ(商標名タッパウェア
ーの略)のように突出部全周に渡り勘合するようにすれ
ば、電気的接続、混成集積回路基板の安定配置およびシ
ールが一度で実現できる。この第2の金属電極72は、
図1の場合でも応用が可能である。
The greatest point is the protrusion 72 provided partially around the side surface of the outer can 63 where the electrode portion 60 is located.
The protrusion 72 is formed integrally with the outer can, and the second
With the metal electrode 70. This fitting realizes electrical connection and stable arrangement of the hybrid integrated circuit board 62. Further, if the protruding portion is provided on the entire periphery of the side surface to form a mounting space, the back surface of the hybrid integrated circuit board 62 serves as a lid of the mounting space, and the space surrounded by the outer can, the electrode section, and the hybrid integrated circuit board is formed. A shield can be realized. The generated gap is completely sealed with resin or the like. If the second metal electrode is fitted over the entire circumference of the protruding portion like a tapper (trade name of tapperware) recently used in a lunch box, electrical connection and stable arrangement of the hybrid integrated circuit board can be achieved. And sealing can be realized at one time. This second metal electrode 72
The application is also possible in the case of FIG.

【0030】全実施の形態とも、図3のような封止構造
を採用して良い。つまり混成集積回路基板の周囲および
開口部の周囲に、比較的硬い樹脂を形成し、この樹脂で
囲まれて形成される容器の中に熱応力の少ない樹脂、例
えばフィラー入りエポキし樹脂を流しこんでも良い。以
上完成された混成集積回路基板実装の電池は、必要によ
り本体ケースに実装されて蓋がはめられ、製品となる。
In all embodiments, a sealing structure as shown in FIG. 3 may be employed. In other words, a relatively hard resin is formed around the hybrid integrated circuit board and around the opening, and a resin having low thermal stress, for example, an epoxy resin containing filler is poured into a container formed by being surrounded by the resin. But it is good. The battery mounted on the hybrid integrated circuit board completed as described above is mounted on a main body case as required, and a cover is fitted thereto, thereby forming a product.

【0031】ここで図5を見れば判るように、端子窓1
3があり、ここで外部回路と接触できるようになってい
る。本発明の全ての実施の形態が、この構造を採用して
も良い。つまり配線のあるフレキシブルシート等を介し
て、電極キャップと異なる極性の電極(プレート等)を
端子窓と外装缶の間に配置しても良い。また端子窓を電
極キャップがある側面に設けても良い。この場合、図1
の実施の形態の混成集積回路基板上にに第1の金属電極
69と異なる極性の配線または電極プレートを配置し、
この電極プレートと第1の金属電極69が露出するよう
に本体ケースに端子窓を開けても良い。更には、図2の
実施の形態、図3の実施の形態では、端子窓に露出する
ように、混成集積回路基板の裏面に絶縁処理された一方
の極性と他方の極性の電極(プーレートや配線)を設け
ても良い。
Here, as can be seen from FIG.
3 where it can come into contact with external circuits. All embodiments of the present invention may employ this structure. That is, an electrode (a plate or the like) having a polarity different from that of the electrode cap may be arranged between the terminal window and the outer can through a flexible sheet or the like having wiring. Further, the terminal window may be provided on the side surface where the electrode cap is located. In this case, FIG.
A wiring or an electrode plate having a polarity different from that of the first metal electrode 69 is disposed on the hybrid integrated circuit substrate according to the embodiment;
A terminal window may be opened in the main body case so that the electrode plate and the first metal electrode 69 are exposed. Further, in the embodiment of FIG. 2 and the embodiment of FIG. 3, electrodes (plates and wirings) of one polarity and the other polarity insulated on the back surface of the hybrid integrated circuit board so as to be exposed in the terminal window. ) May be provided.

【0032】[0032]

【発明の効果】本発明によれば、第1に、裏面にシール
ド機能を有した混成集積回路基板の実装面と外装缶が対
面するように実装することで、外装缶と混成集積回路基
板で殆どのノイズを遮断でき、例えばリチウム電池等の
保護回路の誤動作を防止できる。
According to the present invention, first, the mounting surface of the hybrid integrated circuit board having the shield function on the back surface is mounted so that the outer can faces the outer can. Most noise can be cut off, and malfunction of a protection circuit such as a lithium battery can be prevented.

【0033】また混成集積回路基板として金属基板を採
用し、ベアチップ実装をすれば、電極部のある狭い面積
の側面に実装でき、コンパクトな電池が提供できる。第
3に、電極部の有る外装缶の側面に配置され、前記電極
部が露出する開口部を有した混成集積回路基板を採用す
ることで、開口部を介して電極部と混成集積回路基板の
第1の金属電極が簡単に接続できる。また外装缶は、殆
どの側面をしめるため簡単な構造でなんら長く延在しな
くとも簡単に接続することができる。従ってコンパクト
な電池が実現できる。
If a metal substrate is adopted as the hybrid integrated circuit substrate and the chip is mounted on a bare chip, it can be mounted on the side of a small area having an electrode portion, and a compact battery can be provided. Third, by employing a hybrid integrated circuit board that is disposed on a side surface of an outer can having an electrode portion and has an opening through which the electrode portion is exposed, the electrode portion and the hybrid integrated circuit board can be formed through the opening. The first metal electrode can be easily connected. In addition, the outer can can be easily connected without extending for a long time with a simple structure because most of the sides are closed. Therefore, a compact battery can be realized.

【0034】第4に、混成集積回路基板をシールド機能
を有する基板を電極部の部分に配置すれば、コンパクト
で且つ充放電回路等のノイズによる誤動作を防止するこ
とができる。第5に、電極部の有る外装缶側面の周囲か
ら実装空間を構成するために設けられた突出部と、裏面
が前記実装空間の蓋となるように配置された混成集積回
路基板とで、完全な実装空間を実現できるため、ノイズ
による誤動作を防止できる。
Fourth, if the hybrid integrated circuit substrate is provided with a substrate having a shielding function at the electrode portion, it is compact and can prevent malfunction of the charge / discharge circuit due to noise. Fifth, a protrusion provided to form a mounting space from the periphery of the outer can side having the electrode portion, and a hybrid integrated circuit board whose rear surface is arranged as a lid of the mounting space are completely formed. Since a compact mounting space can be realized, malfunction due to noise can be prevented.

【0035】また突出部と第1の金属電極が勘合される
ことで、電気的接続と混成集積回路基板の機械的固定が
一度に実現できる。また第6に、第1の接続手段が例え
ば前記突出部と勘合するように構成すれば、この実装空
間を密閉シールする事ができ、ベアチップ実装、ノイズ
シールド等が可能となる。
Further, by fitting the protruding portion and the first metal electrode, electrical connection and mechanical fixing of the hybrid integrated circuit board can be realized at one time. Sixth, if the first connecting means is configured to engage with the protruding portion, for example, the mounting space can be hermetically sealed, and bare chip mounting, noise shielding, and the like can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による電池の断面図である。FIG. 1 is a sectional view of a battery according to the present invention.

【図2】本発明による電池の断面図である。FIG. 2 is a sectional view of a battery according to the present invention.

【図3】本発明による電池の断面図である。FIG. 3 is a sectional view of a battery according to the present invention.

【図4】本発明による電池の断面図である。FIG. 4 is a sectional view of a battery according to the present invention.

【図5】従来の電池の組立図である。FIG. 5 is an assembly view of a conventional battery.

【図6】電池を本体ケースに実装した際の図である。FIG. 6 is a diagram when a battery is mounted on a main body case.

【図7】本発明の混成集積回路基板を説明する平面図で
ある。
FIG. 7 is a plan view illustrating a hybrid integrated circuit board of the present invention.

【符号の説明】[Explanation of symbols]

50 リチウムイオン電池 51 外装缶 52 電極部 53,54 混成集積回路基板 60 電極部 61 電池 62 混成集積回路基板 63 外装缶 64 開口部 69 第1の金属電極 70 第2の金属電極 72 突出部 50 Lithium ion battery 51 Outer can 52 Electrode 53,54 Hybrid integrated circuit board 60 Electrode 61 Battery 62 Hybrid integrated circuit board 63 Outer can 64 Opening 69 First metal electrode 70 Second metal electrode 72 Projection

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 極性を持つ突出した電極部と角型の外装
缶とによって外形が構成され、外装缶が前記電極部とは
異なる極性の電極を兼用している電池に於いて、 電池用の回路が実装された表面と相対向する裏面に侵入
するノイズを防止するシールド機能を有した混成集積回
路基板が前記外装缶の何れかの側面に実装されることを
特徴とした電池。
1. A battery in which an outer shape is constituted by a protruding electrode portion having a polarity and a rectangular outer can, wherein the outer can also serves as an electrode having a different polarity from the electrode portion. A battery characterized in that a hybrid integrated circuit board having a shielding function for preventing noise entering a back surface opposite to a front surface on which a circuit is mounted is mounted on any side surface of the outer can.
【請求項2】 前記混成集積回路基板は、絶縁処理され
た金属基板で、前記回路を構成する半導体素子は、ベア
チップで実装される請求項1記載の電池。
2. The battery according to claim 1, wherein the hybrid integrated circuit board is a metal substrate subjected to an insulation treatment, and a semiconductor element constituting the circuit is mounted on a bare chip.
【請求項3】 極性を持つ突出した電極部と角型の外装
缶とによって外形が構成され、外装缶が前記電極部とは
異なる極性の電極を兼用している電池に於いて、 前記電極部の有る前記外装缶の側面に配置され、前記電
極部が露出する開口部を有した混成集積回路基板と、 前記混成集積回路基板上に設けられた配線と電気的に接
続され、且つ前記混成集積回路基板に実装された半導体
ベアチップおよび受動素子と、 前記混成集積回路基板上に設けられた配線と電気的に接
続され、且つ前記開口部から露出した前記電極部と電気
的に接続された第1の接続手段と、 前記混成集積回路基板上に設けられた配線と電気的に接
続され、且つ前記外装缶と電気的に接続された第2の接
続手段とを有することを特徴とする電池。
3. A battery in which the outer shape is constituted by a protruding electrode portion having polarity and a rectangular outer can, wherein the outer can also serves as an electrode having a different polarity from the electrode portion. A hybrid integrated circuit board disposed on a side surface of the exterior can having an opening through which the electrode portion is exposed, and electrically connected to a wiring provided on the hybrid integrated circuit board, and A semiconductor bare chip and a passive element mounted on a circuit board, and a first electrically connected to a wiring provided on the hybrid integrated circuit board and electrically connected to the electrode part exposed from the opening. And a second connection means electrically connected to the wiring provided on the hybrid integrated circuit board and electrically connected to the outer can.
【請求項4】 前記半導体ベアチップの実装された混成
集積回路基板はシールド機能を有する基板より成る請求
項3記載の電池。
4. The battery according to claim 3, wherein the hybrid integrated circuit board on which the semiconductor bare chip is mounted is a board having a shielding function.
【請求項5】 極性を持つ突出した電極部と角型の外装
缶とによって外形が構成され、外装缶が前記電極部とは
異なる極性の電極を兼用している電池に於いて、 前記電極部の有る前記外装缶側面の周囲から実装空間を
構成するために設けられた突出部と、 前記電極部を露出する開口部を有し、裏面が前記実装空
間の蓋となるように配置された混成集積回路基板と、 前記混成集積回路基板の表面に実装された前記電池用の
回路を構成する回路素子と、 前記突出部および前記回路とを電気的に接続する第1の
接続手段と、 前記開口部に位置し、前記電極部と前記回路素子とを電
気的に接続する第2の接続手段とを有することを特徴と
する電池。
5. A battery in which an outer shape is constituted by a protruding electrode portion having a polarity and a rectangular outer can, wherein the outer can also serves as an electrode having a different polarity from the electrode portion. A projection provided to form a mounting space from the periphery of the side surface of the outer can having the opening, and an opening exposing the electrode portion, and a hybrid arranged so that a back surface serves as a lid of the mounting space. An integrated circuit board; a circuit element constituting the circuit for the battery mounted on the surface of the hybrid integrated circuit board; first connecting means for electrically connecting the protrusion and the circuit; and the opening A second connection means for electrically connecting the electrode unit and the circuit element to each other, the second connection unit being located in a portion of the battery.
【請求項6】 前記第1の接続手段と前記突出部で前記
実装空間をシールする請求項3、請求項4または請求項
5記載の電池。
6. The battery according to claim 3, wherein the mounting space is sealed by the first connection means and the protrusion.
JP9174341A 1997-06-30 1997-06-30 Battery Pending JPH1126029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9174341A JPH1126029A (en) 1997-06-30 1997-06-30 Battery

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9174341A JPH1126029A (en) 1997-06-30 1997-06-30 Battery

Publications (1)

Publication Number Publication Date
JPH1126029A true JPH1126029A (en) 1999-01-29

Family

ID=15976953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9174341A Pending JPH1126029A (en) 1997-06-30 1997-06-30 Battery

Country Status (1)

Country Link
JP (1) JPH1126029A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000079635A1 (en) * 1999-06-21 2000-12-28 The Procter & Gamble Company Battery having a housing for electronic circuitry
EP1087456A1 (en) * 1999-09-24 2001-03-28 Wilson Greatbatch Ltd. Protection device for protecting an electrical component and method of assembling a battery with a protection device and an electrical component
EP1093178A1 (en) * 1999-03-30 2001-04-18 Matsushita Electric Industrial Co., Ltd. Rechargeable battery with protective circuit
EP1152476A2 (en) * 2000-05-05 2001-11-07 Wilson Greatbatch Limited Protection device having tapered ribs and method of assembling a battery with a protection device and an electrical component
EP1191830A1 (en) * 2000-09-22 2002-03-27 Wilson Greatbatch Ltd. Protection device having a sleeve and method of assembling a battery with a protection device and an electrical component
JP2002537710A (en) * 1999-02-18 2002-11-05 テレフオンアクチーボラゲツト エル エム エリクソン Portable electrical device with removable power source unit
EP1487033A1 (en) * 2002-02-13 2004-12-15 Matsushita Electric Industrial Co., Ltd. Battery and method of manufacturing the battery
JP2005209365A (en) * 2004-01-20 2005-08-04 Matsushita Electric Ind Co Ltd Battery pack
US6979502B1 (en) 1999-06-21 2005-12-27 Board Of Trustees Of The University Of Illinois Battery having a housing for electronic circuitry
KR100585760B1 (en) * 2004-02-28 2006-06-07 엘지전자 주식회사 Apparatus to reinforce molding part for battery
JP2006520080A (en) * 2003-02-05 2006-08-31 アイティーティー マニュファクチャリング エンタープライジーズ, インコーポレイテッド Single battery housing assembly
US7297439B2 (en) 2002-02-26 2007-11-20 Kyocera Corporation Battery
JP2010135303A (en) * 2008-12-03 2010-06-17 Samsung Sdi Co Ltd Secondary battery
JP2010257604A (en) * 2009-04-21 2010-11-11 Hitachi Maxell Ltd Battery pack
JP2010267602A (en) * 2009-05-15 2010-11-25 Samsung Sdi Co Ltd Secondary battery
US7846577B2 (en) 2004-01-20 2010-12-07 Panasonic Corporation Battery pack
US7936571B2 (en) 2007-10-01 2011-05-03 Ricoh Company, Ltd. Protection circuit module for secondary battery
KR101384930B1 (en) * 2007-09-20 2014-04-14 삼성에스디아이 주식회사 Protection circuit module and secondary battery using the same

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002537710A (en) * 1999-02-18 2002-11-05 テレフオンアクチーボラゲツト エル エム エリクソン Portable electrical device with removable power source unit
EP1093178A1 (en) * 1999-03-30 2001-04-18 Matsushita Electric Industrial Co., Ltd. Rechargeable battery with protective circuit
EP1093178A4 (en) * 1999-03-30 2007-12-05 Matsushita Electric Ind Co Ltd Rechargeable battery with protective circuit
WO2000079635A1 (en) * 1999-06-21 2000-12-28 The Procter & Gamble Company Battery having a housing for electronic circuitry
US6979502B1 (en) 1999-06-21 2005-12-27 Board Of Trustees Of The University Of Illinois Battery having a housing for electronic circuitry
EP1087456A1 (en) * 1999-09-24 2001-03-28 Wilson Greatbatch Ltd. Protection device for protecting an electrical component and method of assembling a battery with a protection device and an electrical component
EP1152476A2 (en) * 2000-05-05 2001-11-07 Wilson Greatbatch Limited Protection device having tapered ribs and method of assembling a battery with a protection device and an electrical component
EP1152476A3 (en) * 2000-05-05 2003-01-22 Wilson Greatbatch Limited Protection device having tapered ribs and method of assembling a battery with a protection device and an electrical component
EP1191830A1 (en) * 2000-09-22 2002-03-27 Wilson Greatbatch Ltd. Protection device having a sleeve and method of assembling a battery with a protection device and an electrical component
EP1487033A1 (en) * 2002-02-13 2004-12-15 Matsushita Electric Industrial Co., Ltd. Battery and method of manufacturing the battery
EP1487033A4 (en) * 2002-02-13 2008-10-08 Matsushita Electric Ind Co Ltd Battery and method of manufacturing the battery
US7297439B2 (en) 2002-02-26 2007-11-20 Kyocera Corporation Battery
JP2006520080A (en) * 2003-02-05 2006-08-31 アイティーティー マニュファクチャリング エンタープライジーズ, インコーポレイテッド Single battery housing assembly
JP4855248B2 (en) * 2003-02-05 2012-01-18 アイティーティー マニュファクチャリング エンタープライジーズ, インコーポレイテッド Single battery housing assembly
US7846577B2 (en) 2004-01-20 2010-12-07 Panasonic Corporation Battery pack
JP2005209365A (en) * 2004-01-20 2005-08-04 Matsushita Electric Ind Co Ltd Battery pack
JP4662530B2 (en) * 2004-01-20 2011-03-30 パナソニック株式会社 Battery pack
KR100585760B1 (en) * 2004-02-28 2006-06-07 엘지전자 주식회사 Apparatus to reinforce molding part for battery
KR101384930B1 (en) * 2007-09-20 2014-04-14 삼성에스디아이 주식회사 Protection circuit module and secondary battery using the same
US7936571B2 (en) 2007-10-01 2011-05-03 Ricoh Company, Ltd. Protection circuit module for secondary battery
JP2010135303A (en) * 2008-12-03 2010-06-17 Samsung Sdi Co Ltd Secondary battery
US8349488B2 (en) 2008-12-03 2013-01-08 Samsung Sdi Co., Ltd. Secondary battery including a protective circuit board made of metal
JP2010257604A (en) * 2009-04-21 2010-11-11 Hitachi Maxell Ltd Battery pack
JP2010267602A (en) * 2009-05-15 2010-11-25 Samsung Sdi Co Ltd Secondary battery
US8871378B2 (en) 2009-05-15 2014-10-28 Samsung Sdi Co., Ltd. Secondary battery including a cap assembly having a protection circuit assembly

Similar Documents

Publication Publication Date Title
JPH1126029A (en) Battery
US8778531B2 (en) Pouch-type lithium polymer battery and method for manufacturing the same
JP5138488B2 (en) Protection circuit board and battery pack having the same
JP5511051B2 (en) Battery pack
US8440346B2 (en) Protection circuit board for secondary battery and secondary battery using the protection circuit board
US8691406B2 (en) Secondary battery and method for manufacturing the same
JP2001256937A (en) Compound battery and battery pack
KR20010043946A (en) Rechargeable battery with protective circuit
KR101483131B1 (en) Battery Pack
KR20090051590A (en) Secondary battery
US20130280558A1 (en) Rechargeable battery
JP3244400B2 (en) Battery pack
KR101318531B1 (en) Secondary battery
KR20160123788A (en) Battery pack
JP2006172942A (en) Battery pack
KR100670514B1 (en) Pouch type lithium secondary battery
JP2001307694A (en) Battery pack
JP2003257413A (en) Nonaqueous secondary battery
JPH11242949A (en) Packed battery
KR20040107868A (en) Pouched-type lithium secondary battery
JP2000114680A (en) Mounting circuit board and battery
JP2000114697A (en) Mounting substrate and battery
KR20070097144A (en) Secondary battery
KR20150058807A (en) Battery pack
JP2000114679A (en) Mounting substrate and battery