JPH11259823A - Production of magnetic head and apparatus for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to cut the lead wires of a magnetic head without the occurrence of static electricity breakdown of a magnetoresistive element in particular in the work for cutting the lead wires. SOLUTION: A terminal substrate 9 connected to the lead wires 7a, 7b, 7c, 7d of the magnetoresistive element and inductive head of the thin-film magnetic head H is connected to the ground g via a second supply base 32 consisting of a semiconductor (surface resistance 1×10<6> to 1×10<10> (Ω/square)) and thereafter, the lead wires are cut at a P-P line in this production. The destruction of the magnetoresistive element by static electricity is prevented by cutting the lead wires by such procedures. Since a metallic blade is used, the need for exchanging edges is eliminated and the running cost may be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a magnetic head having a magnetoresistive element or the like mounted thereon, and more particularly to a method for removing static electricity generated on a lead wire of a magnetoresistive element or a flexible printed circuit board. The present invention relates to a method for manufacturing a magnetic head for cutting a line.

[0002]

FIG. 4 is a perspective view showing a unit structure of a magnetic head, FIG. 5 is a perspective view schematically showing a structure of a thin film magnetic head formed on a slider, and FIG. 6 is an ABS of a magnetoresistive element. It is sectional drawing in the surface vicinity. In the unit structure of the magnetic head shown in FIG. 4, reference numeral 1 denotes a leaf spring (gimbal).
Is shown. Base end (X) of leaf spring (gimbal) 1
The (+)) side is a fixed part (mount part) 1a fixed to a magnetic recording / reproducing device such as a hard disk device. The fixed portion 1a of the leaf spring 1 has an elastic deformation portion 1c having a cutout window 1b formed at the center thereof.
Is mainly such that the elastically deformable portion 1c bends.
The arm portion (load beam portion) ahead of the elastic deformation portion 1c
1d. In the arm portion (load beam portion) 1d, both sides of the leaf spring material are bent to form flanges 1f, 1f. The formation of the flanges 1f, 1f makes it difficult for the arm portion 1d to be elastically deformed. ing. A mounting member 2 is fixed to the lower surface of the fixing portion 1a by means such as welding, and a cylindrical caulking portion 1e is formed at the center of the mounting member 2 so as to protrude. This caulking part 1e
Is above (Z) from the hole formed in the fixing portion 1a.
(+)).

The distal end of the arm portion 1d of the leaf spring 1 is a slider supporting portion, and a slider 4 is supported on this portion via a flexure 3 formed of a thin leaf spring. The slider 4 is formed of a ceramic material or the like. The lower surface of the slider 4 is a surface (ABS surface) 4a facing a magnetic recording medium such as a hard disk, and the upper surface of the slider 4 is the surface of the flexure 3. The support surface 4b is bonded to the support piece. The opposing surface 4a is formed with a groove 4c for adjusting the air flow (air bearing) between the magnetic recording medium and the floating surface to set the flying distance.

[0005] As shown in FIG.
A thin-film magnetic head H is provided on the end surface on the (-) side. A lower gap layer (not shown) made of a non-magnetic material is provided on a lower shield layer 12 made of a magnetic material formed on the trailing end 11a of the slider 4 via a lower gap layer (not shown) made of a non-magnetic material. An upper shield layer 13 made of a magnetic material is formed on a valve-type thin film element or an anisotropic magnetoresistance effect thin film element 10 via an upper gap layer (not shown) made of a nonmagnetic material. The layers from the lower shield layer 12 to the upper shield layer 13 function as the read head h1. The thin-film magnetic head H is a so-called composite thin-film magnetic head in which a write inductive head h2 is stacked on the read head h1.
However, it also functions as a lower core layer of the inductive head h2.

As shown in FIG. 6, a magnetoresistive element 10 provided in a read head h 1 has an antiferromagnetic layer 18, a pinned magnetic layer (pinned magnetic layer) 19, and a nonmagnetic conductive layer 20 on an underlayer 17. , And the free magnetic layer 21 are continuously stacked. In the magnetoresistive element 10, a steady current (sense current) is applied to the fixed magnetic layer 19, the nonmagnetic conductive layer 20, and the free magnetic layer 21 from the conductive layers 23 formed on the hard bias layers 22. Can be The running direction of a recording medium such as a hard disk is the Z direction. When a leakage magnetic field from the recording medium is applied in the Y direction, the magnetization of the free magnetic layer 21 changes from the Y direction to the Z direction. The electric resistance changes depending on the relationship between the change in the magnetization direction in the free magnetic layer 21 and the fixed magnetization direction in the fixed magnetic layer 19,
The leakage magnetic field from the recording medium is detected by the voltage change based on the change in the electric resistance value. Alternatively, the same applies to the AMR having a three-layer structure of the SAL layer, the SHANT layer, and the magnetoresistive layer.

Next, as shown in FIG. 5, in the inductive head h2, the lower core layer (upper shield layer) 13
A gap layer made of alumina or the like is formed thereon, a resist layer is formed thereon (both are not shown), and a coil layer 16 formed spirally in a plane is provided on the resist layer. ing. Note that an upper core layer is formed on the coil layer 16 via a resist layer (not shown).

The layers from the lower core layer 13 to the upper core layer function as an inductive head h2,
In the inductive head h2, a recording current is applied to the coil layer 16, and a recording magnetic field is induced from the coil layer 16 to the lower core layer 13 and the upper core layer. Then, a magnetic signal is recorded on a recording medium such as a hard disk by a leakage magnetic field between the lower core layer 13 and the upper core layer at the portion of the magnetic gap G. As shown in FIG. 4, a lead wire 7 is connected to the thin-film magnetic head H, and a direction (X) from the end surface of the slider 4 to the rear end portion along the upper surface of the leaf spring 1.
(+) Direction. That is, a pair of lead wires 7a and 7b extending from the read head h1 and a pair of lead wires 7c and 7 extending from the inductive head h2.
A total of four lead wires d extend.

FIG. 7 is an enlarged sectional view of a lead wire. As shown in FIG. 7, the lead wire 7 has a conductor 7A made of an ultrafine copper wire or the like covered with a coating 7B made of an insulator such as polyimide. These lead wires 7 are provided with protective tubes 8 as necessary (see FIG. 4).

As shown in FIG. 4, the other end of the lead wire 7 is connected to a terminal board 9 for evaluation made of a glass epoxy board or polyimide. That is, lead wire 7 (lead wires 7a, 7b, 7c and 7
The lead wire portion 7A at the end of d) is connected to the land portions 9a, 9b, 9c, and 9d formed on the terminal board 9 by copper foil or the like by welding means such as soldering. The terminal board 9 is an auxiliary board for evaluating the electrical characteristics of the magnetic head. The terminal board 9 has the other end (X (+)) side to which the lead wire 7 is not connected inserted into a dedicated connector or the like (not shown), and is connected to an evaluation device (not shown), so that the electric power of the magnetic head is reduced. Characteristic evaluation is performed.

[0010]

As described above, the terminal board 9 is an auxiliary board for inspection and becomes unnecessary when the magnetic head unit is mounted on a driver such as a hard disk. Therefore, it is necessary to separate the terminal board 9 from the magnetic head unit before mounting. This separation work can be performed, for example, by re-melting the solder. However, the work is complicated, and the lead wire 7 must be set to a predetermined length. This is performed by a device (not shown).

However, as shown in FIG. 7, the covering portion 7B of the lead wire 7 and the terminal board 9 are both formed of an insulator, and peeling electrification and the like between the covering portion 7B and the manufacturing equipment easily occur. 100 to 200 on the terminal board 9
In some cases, a charged potential is observed at V. Therefore, for example, when the coating portion 7B is charged to the (+) potential by peeling charging,
Due to the capacitance, the (−) electrons in the conductor 7A are converted into the conductor 7A.
(+) Charge of the opposite polarity due to lack of electrons appears at the terminal 9a on the terminal substrate 9 connected to the conductive portion 7A. In this case, the electric charges of the conductor 7A and the land 9a are preserved before and after the occurrence of the electrostatic induction. Therefore, the electrical neutrality is satisfied.

On the other hand, the cutting device itself is grounded to ground, and the cutting metal blade is also at ground potential. Therefore, when the conducting wire portion 7A of the lead wire 7 comes into contact with the metal blade of the cutting device at the time of cutting, the conducting wire portion 7A becomes the ground potential via the metal blade of the cutting device. At this time, (−) electrons move from the ground to the conductive wire portion 7A so as to cancel out the electrostatic charge generated by the electrostatic induction on the land portion 9a of the conductive wire portion 7A, so that a current flows from the center of the conductive wire portion 7A. At this time, the electrical neutrality is broken, and (−) electrons remain in the conductive portion 7A and the land portion 9a. When the covering portion 7B is charged to a high potential, the number of moving (-) electrons also increases, so that a large current may flow through the read head h1 or the inductive head h2 connected to the lead wire 7. .

By the way, as shown in FIGS. 5 and 6,
The magnetoresistive element 10 of the read head h1 is smaller and thinner than the inductive head h2. Accordingly, the cross-sectional areas of the conductive layers 23, 23, the fixed magnetic layer 19, the nonmagnetic conductive layer 20, and the free magnetic layer 21 through which the sense current flows are smaller than the cross-sectional areas of the coil layer 16 through which the recording current flows. I have. Further, as described above, in the magnetoresistive element 10, the recording medium is controlled by a voltage change based on a change in the electric resistance in relation to the change in the magnetization direction in the free magnetic layer 21 and the fixed magnetization direction of the fixed magnetic layer 19. In order to detect the leakage magnetic field from the sensor, the value of the electric resistance is set to a certain high value in order to increase the detection sensitivity.
That is, the sense current that can be passed through the magnetoresistive element 10 is much smaller than that of the coil layer 16. Therefore, the large current generated at the time of cutting is reduced by the read head h.
When the current flows to the inductive head h2 and the inductive head h2, there is a problem that power is consumed by the electric resistance particularly on the read head h1 side, the conductive layers 23 and 23 are burned out, or the magnetic characteristics deteriorate due to migration between layers.

Conventionally, this problem has been dealt with by cutting the blade of the cutting device using a high-resistance material, for example, ceramic. That is, at the time of cutting, the conductive wire portion 7A
Is in contact with the ceramic blade, the conductive wire portion 7A is connected to the ground via the high-resistance ceramic blade. This allows
Since the conductor 7A is prevented from being directly short-circuited to the ground, it is possible to suppress the generation of a large current, and the lead wire is cut in this state. However, the damage of the magnetic head is not limited to the case where the magnetic head is burned out by the current, but may be caused by the voltage at the time of charging. In other words, electrostatic induction can also occur on the ceramic blade side,
In some cases, the ceramic blade is charged and a high voltage is generated at both ends of the magnetoresistive element 10 via the lead wires 7a and 7b. This voltage causes a potential difference in each thin film layer inside the magnetic head. Therefore, when the charging voltage reaches or exceeds the withstand voltage of the thin film layer, dielectric breakdown occurs, and the magnetoresistive element 1
There is a problem that 0 is destroyed.

In the above cutting operation, the covering portion 7B of the lead wire and the conducting wire portion 7A are cut at the same time. However, since the conducting wire portion 7A is a metal wire, when the cutting is repeated, the ceramic blade is spilled (chipping). There is a problem that such a situation is likely to occur. In particular, as the number of cuts increases, the quality of the cut is likely to deteriorate. For example, cutting of about 5,000 times causes blade spillage, and the problem of poor cutting such as damage to the lead wire or disconnection is likely to occur. Therefore, it is necessary to replace the cutting edge every certain number of cuts, and the running cost is higher than that of a metal blade. In addition, the replacement of the cutting edge is a complicated operation, and it is necessary to temporarily suspend the operation. Therefore, it has been desired to improve the operation in terms of work efficiency.

An object of the present invention is to solve the above-mentioned conventional problems. In the work of cutting a lead wire of a magnetic head, the lead wire can be cut without causing electrostatic damage to the magnetoresistive element. It is an object of the present invention to provide a method of manufacturing a magnetic head.

[0017]

According to the present invention, there is provided a magnetoresistive element for reading a magnetic signal recorded on a magnetic recording medium, and a terminal portion is connected to a pair of output leads extending from the magnetoresistive element. A magnetic head comprising: a step of removing electricity at a land portion of the terminal portion that is electrically connected to the lead; and a step of cutting the lead with a metal blade.

In the above, it is preferable that in the step of removing electricity, the land portion is grounded to a ground via a predetermined resistance member.

In the present invention, first, a land portion of a terminal board or a land portion of a flexible printed board on which leads are formed by patterning are connected to a pair of lead wires extending from a magnetoresistive element on the read head h1 side of the magnetic head. By connecting to a ground potential via a resistive member (second support) made of a semiconductor, a center portion of a conductive wire portion in which (−) electrons are deficient ((+) charges are localized) is provided at the center ( −) Slowly moving electrons through the resistance member, and (+)
The central portion of the conductor portion where the electric charge is localized can be electrically canceled. That is, the portion of the conductor where the positive charge is localized is at a higher potential than the ground potential, so that a current flows from the conductor to the ground side. Can flow slowly. In addition, most of the current at this time flows in the order of the conductive wire portion → the land portion → the resistance member → the ground, and the current flowing through the magnetoresistive effect element can be extremely small. Can be prevented.

It is preferable that the resistance member is a support made of a semiconductor having a surface resistance in the range of 1 × 10 ⁶ to 1 × 10 ¹² (Ω / square).

By using the resistance member in the above range,
It is possible to restrict abrupt (-) transfer of electrons at the time of static elimination, and to reduce the magnitude of the generated current to the sense current or less. Therefore, power consumption in the electric resistance of the magnetoresistive element can be reduced, so that burn-in of the magnetoresistive element can be prevented.

As described above, if the conductor portion of the lead wire is grounded to the earth via the resistance member, the magnetoresistive effect element will not be burned when the lead wire is cut directly by the metal blade. Therefore, since it is not necessary to use a ceramic blade as in the related art, a problem due to blade spilling does not occur. Therefore, it is possible to always cut the lead wire to a predetermined length in a good state.

Furthermore, since the replacement of the cutting edge can be made unnecessary, the problems of running cost and work efficiency can be solved.

[0024] In the above, the step of removing electricity may include:
It is preferable to spray a gas ionized by an ionizer onto the land.

By blowing the ionized gas to the land, the same operation and effect can be obtained when the resistance member is used.

Further, the magnetic head manufacturing apparatus according to the present invention holds a first support base that supports a magnetic head unit and has a charge elimination function, and a terminal substrate provided at a tip end of a lead extending from the magnetic head unit. A second support having a static elimination function, and a cutting member provided between the first support and the second support and cutting the lead. .

In the above, the first support and the second support have a surface resistance of 1 × 10 ⁶ to 1 × 10 ^6.
Those made of a semiconductive material in the range of ¹² (Ω / square) are preferable.

Further, it is preferable that the first support and the second support are connected to ground.

By using the apparatus for manufacturing a magnetic head according to the present invention, the lead can be reliably cut to a predetermined length without destroying the magnetoresistive element.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the concept of a magnetic head lead wire cutting device according to the present invention. As shown in FIG. 1, in this lead wire cutting device, a first support 31 and a second support 32 are provided on a base 30. A cutting member 33 such as a cutter that operates manually or automatically is provided between the first support table 31 and the second support table 32.

The first support 31 and the second support 3
2 is made of a semiconductive material (ion conductive material), for example, a conductive ceramic (ion conductive ceramic) or a conductive synthetic resin, or zirconia (Zr ₂ O ₃ ). Is 1 × 10 ⁶ to 1
It is formed of a material in a range of × 10 ¹² (Ω / square), more preferably in a range of 1 × 10 ⁶ to 1 × 10 ⁹ (Ω / square). Here, the conductive material means
Generally, the surface resistance is from 0 to 1 × 10 ⁶ (Ω / square).
e) those having a surface resistance of 1 ×
The insulating material having a surface resistance of 1 × 10 ¹² (Ω / square) in the range of 10 ⁶ to 1 × 10 ¹² (Ω / square) is used.
quer).

On the upper surface of the first support table 31, the magnetic head unit shown in FIG. 4 is held. That is, a holding projection 31a is formed on the upper surface of the first support base 31 so as to protrude therefrom. The cylindrical caulking portion 1e formed at the center of the mounting member 2 of the magnetic head unit is formed on the holding projection 31a. It is held by inserting. The second support 32 is provided with a holder 32a, and a terminal board 9 connected between the holder 32a and the second support 32 via the lead wire 7 from the magnetic head unit.
Is provided. However, the holding state is such that the land portions 9a, 9b, 9c and 9d of the terminal board 9 are held in contact with the second support table 32. The holding projections 31a and the holders 32a are also formed of the same semiconductive material as the first support 31 and the second support 32.

The cutting member 33 includes a metal upper blade 34.
a and a lower blade 34b are provided, and a metal head unit and a terminal board 9 are provided therebetween.
And a lead wire 7 extending between them. Therefore,
By moving the upper blade 34a in the direction of the lower blade 34b,
The conductor 7A and the covering 7B of the lead wire 7 can be cut together. The same applies to the case where a flexible printed wiring board is used instead of the lead wire.

The first support 31 and the second support 3
2 is formed of a conductive material or a semiconductive material, and the base 30 is at the ground potential. Alternatively, the first support 31 and the second support 32 may be respectively connected to ground. The second support base 32 is provided so as to be movable in the X direction in the drawing, and can be cut with a certain tension applied to the lead wire 7. Therefore, it is possible to always set the length of the lead wire 7 after cutting to a predetermined length.

Next, a method of cutting the lead wire will be described. As described in the above description of the related art, the lead wire 7 is polarized by electrostatic induction, and the coating portion 7B is charged to a (+) potential by a positive electrostatic charge, and the outer peripheral surface of the conductive wire portion 7A. Indicates a (-) potential, and the central portion indicates a (+) potential. The lands 9a, 9b, 9c are placed on the second support 32.
And the terminal board 9 with the holder 3 with the 9d side facing the Z2 direction.
2a, the land portions 9a, 9b, 9c and 9
d can be brought into contact with the second support 32, and the lands 9a, 9b, 9c and 9d are connected to ground g directly or via the base 30.

FIG. 2 is a connection diagram equivalently showing FIG. As shown in FIG. 2, a magnetoresistive element (for example, a spin-valve thin film element or an anisotropic magnetoresistive element) 1
0, the lead wires 7a, 7b are connected to the land portions 9a,
9b and the ground g through the second support 32. The coil layer 16 of the thin-film magnetic head H also includes the lead wires 7c and 7d, the lands 9c and 9d, and the second support 32.
To the ground g.

As described above, the second support 32 is connected to the ground g directly or via the base 30, but the second support 32 is semiconductive, that is, from 1 × 10 ⁶ to 1 ×. 10
^With a surface resistance in the range of ¹² (Ω / square),
At the time of static elimination, (-) electrons can be prevented from abruptly moving in the conductor 7A of the lead wire 7. Therefore, it is possible to prevent a large current from flowing from the lead wire 7 (7a, 7b, 7c and 7d) to the ground g via the second support 32.

As described above, the second support 32
By supplying (-) electrons into the conductor 7A of the lead wire 7 while regulating the magnitude of the current, the central portion of the conductor 7A is neutralized, and the potential inside the conductor 7A is reduced. The potential difference from the ground potential can be reduced. The metal blade 34 is set to the ground potential from this place,
The potential of the conductor 7A and the ground potential can be made substantially the same. Therefore, the lead wire 7 in such a state
The metal blade 34 of the cutting member 33 shown in FIG.
Even if the lower blade 34b) is used for cutting along the PP line, (-) electrons hardly move to the conductor 7A, so that the current flowing through the read head h1 or the inductive head h2 is reduced. Even when the current flows to zero, the current can be extremely small, which is equal to or smaller than the sense current. As a result, it is possible to prevent the occurrence of electrostatic destruction such as burning of the read head h1.

In addition, since the metal blade 34 can be used, there is no problem of voltage destruction of the magnetic head caused by charging of the ceramic blade itself as in the case of using the ceramic blade. In addition, since the metal blade 34 can be used instead of the conventional ceramic blade, it is possible to cut the lead wire 7 to an optimum length in a favorable state. Furthermore, since a metal blade can be used, it is not necessary to replace the blade edge. Therefore, running cost can be reduced, and complicated replacement work can be omitted, so that work efficiency can be improved.

The above can be modeled as a transient phenomenon between the capacitor C and the resistor R. That is,
A capacitor C charged at a central portion of the conductive wire portion 7A at a (+) potential;
Can be regarded as a transient phenomenon of a general RC circuit. In the discharge of a general RC circuit, the peak value of the discharge current is the charge voltage V / R
Since the time constant is represented by the product R · C of the resistance R and the capacitor C, the resistance R (the second support 3
By increasing the value of 2), the peak value of the discharge current (the current flowing from the lead wire 7 to the ground g) can be reduced.

However, when the value of the resistor R is increased,
In other words, when the surface resistance of the second support 32 is increased, the degree of insulation is increased, and on the other hand, the charged voltage (potential of the conductor 7A) generated in the second support 32 tends to be increased. If the second support 32 is charged to a high potential, the peak value of the current may not be reduced after all. Therefore, the following test was performed to select an optimal surface resistance as the second support 32.

FIG. 3 is a diagram experimentally showing the relationship between the peak value of the discharge current and the charged voltage with respect to the surface resistance. In FIG. 3, a charging voltage of 1000 V is applied to a 20 pF capacitor.
And various second support bases 3 having different surface resistances.
2 is prepared by plotting the average of the peak value of the discharge current I when the secondary support 32 is discharged and the average of the charged voltages when the various second support bases 32 are charged. Note that, in FIG.
This indicates that the discharge current is 0 (mA) or more (measurable). The reason why the capacitance of the capacitor is set to 20 pF is that the equivalent capacitance of the read head h1 is approximately 10 pF.
To about 20 pF. On the other hand, the charging voltage is an imaginary potential difference between the central portion of the conductor 7A and the potential of the ground g.

As shown in FIG. 3, when the surface resistance is low, the discharge current I is large, and when the surface resistance is high, the discharge current I is small. On the other hand, it can be confirmed that the charged voltage is small when the surface resistance is low, and is sharply increased when the surface resistance is high, particularly when the surface resistance is 1 × 10 ⁸ (Ω / square) or more. The discharge current I is a current flowing from the conductor 7A of the lead wire 7 to the ground g via the second support 32, as described above.
Is connected to a read head h1. In general, the sense current of the read head h1 is about several mA to several tens mA. Therefore, if the discharge current I is set to be equal to or less than the sense current, it is possible to prevent the read head h1 from being burned out by the discharge current I. . That is, from FIG. 3, the surface resistance of the second support table 32 is 1 × 10 ⁶ (Ω / sq
ure) or more, it can be seen that the discharge current I can be made equal to or less than the sense current.

On the other hand, the charged voltage has a surface resistance of 1 × 10 ⁸ (Ω).
/ Square) is almost 1 (V),
When it is 1 × 10 ⁹ (Ω / square), it is about 5 (V). The charged voltage has a surface resistance of 1 × 10 ⁹ (Ω)
/ Square), it tends to sharply increase. Therefore, the surface resistance is set to 1 × 10 ⁹ from FIG.
It is understood that by setting the resistance to (Ω / square) or less, the charged voltage of the second support table 32 can be suppressed low. Thus, it is possible to prevent the magnetic head from being charged to a voltage higher than the withstand voltage. Further, if the charged voltage of the second support 32 can be suppressed low, the potential difference between the terminals of the magnetoresistive element via the lead wire 7 connected to the second support 32 does not increase.

From the above results, the surface resistance of the second support 32 should be 1 × 10 ⁶ (Ω / square) or more.
And 1 × 10 ¹² (Ω / square) or less, more preferably 1 × 10 ⁶ (Ω / square) or more and 1 × 1
It can be seen that it is preferable to select those having a value of 0 ⁹ (Ω / square) or less. In addition, by blowing gas ionized by an ionizer onto the land as another static elimination means, the same operation and effect can be obtained when the resistance member is used.

[0046]

According to the present invention described in detail above, it is possible to prevent a large current from flowing through the reading magnetoresistive element when cutting the lead wire of the magnetic head.

Therefore, it is possible to prevent a problem that the magnetoresistive element is broken by static electricity.

Further, since the lead wire can be cut with a metal blade, the length can always be optimized.

Further, since a metal blade can be used, it is not necessary to replace the blade, and the running cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a conceptual view showing a magnetic head lead wire cutting apparatus according to the present invention;

FIG. 2 is a connection diagram equivalently representing FIG. 1;

FIG. 3 is a diagram showing a relationship between a peak value of a discharge current and a charged voltage with respect to a surface resistance;

FIG. 4 is a perspective view showing a unit structure of a magnetic head;

FIG. 5 is a perspective view schematically showing the structure of a thin-film magnetic head formed on a slider.

FIG. 6 is a cross-sectional view of the magnetoresistive element in the vicinity of an ABS surface,

FIG. 7 is an enlarged sectional view of a lead wire;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Leaf spring 4 Slider 7 (7a, 7b, 7c, 7d) Lead wire 7A Conducting wire part 7B Covering part 9 Terminal board 9a, 9b, 9c, 9d Land part 10 Magnetoresistance effect element (spin valve thin film element or anisotropic element) (Magnetoresistance effect element) 16 Coil layer 31 First support 32 Second support 33 Cutting member 34 Metal blade h1 Read head h2 Inductive head g Earth

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yo Nakano 3-31 Meidori, Izumi-ku, Sendai, Miyagi Prefecture Frontech Co., Ltd.

Claims (7)

[Claims] 1. A magnetic head having a magnetoresistive element for reading a magnetic signal recorded on a magnetic recording medium and having a terminal connected to a pair of output leads extending from the magnetoresistive element. And a step of cutting the lead with a metal blade. 2. A method of manufacturing a magnetic head, comprising: 2. The method of manufacturing a magnetic head according to claim 1, wherein the step of removing the electric charge includes grounding the land to ground via a predetermined resistance member. 3. The resistance member has a surface resistance of 1 × 10 ^6.
3. The method of manufacturing a magnetic head according to claim 2, wherein the support is a support made of a semiconductive material in a range of from 1 × 10 ¹² (Ω / square). 4. The method of manufacturing a magnetic head according to claim 1, wherein the step of discharging comprises blowing a gas ionized by an ionizer onto the land. 5. A first support that supports a magnetic head unit and has a charge eliminating function, and a second support that holds a terminal board provided at a tip end of a lead extending from the magnetic head unit and has a charge eliminating function. An apparatus for manufacturing a magnetic head, comprising: a table; and a cutting member provided between the first support table and the second support table and cutting the lead. 6. The first support and the second support having a surface resistance of 1 × 10 ⁶ to 1 × 10 ¹² (Ω / squ).
The apparatus for manufacturing a magnetic head according to claim 5, comprising a semiconductor in the range of (are). 7. The magnetic head manufacturing apparatus according to claim 5, wherein the first support and the second support are connected to ground.