JPH11255A - Adhesive hook and sticking method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive hook capable of being easily stuck to a wall surface or the like by utilizing adhesion, strongly joined to the wall surface when hardening is completed and constituted by using a material with inferior heat resistance. SOLUTION: For this adhesive hook 1, a hook part 1d is provided on one surface of a planar base material 1a and an adhesive material layer 1b is provided on the other surface. In this case, as the adhesive material layer 1b, a hardening type tacky adhesive material layer containing an acrylic polymer, a compound containing an epoxy group and a light cationic polymerization starting agent for inducing the ring-opening polymerization of the compound containing the epoxy group by the irradiation of light is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive hook used for hanging an object on a wall or the like and a method for attaching the same, and more particularly, to a method in which an adhesive layer is cured by irradiation of light.
The present invention relates to an adhesive hook that is firmly adhered to a wall or the like, and a method of attaching the hook.

[0002]

2. Description of the Related Art Adhesive hooks are frequently used for hanging articles on a wall or the like. The adhesive hook has a structure in which a hook portion is formed on one surface of a plate-shaped substrate and an adhesive layer is formed on the other surface. At the time of use, the product is adhered and fixed to a predetermined position such as a wall surface from the pressure-sensitive adhesive layer side, and the article is hung on the hook portion side.

However, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive hook has permanent tackiness, and the adhesive strength itself is constant from the initial state, and the adhesive strength is not improved. Therefore, there is a limit to the weight of the articles that can be hung, and there is a problem in that if a heavy article is hung, the creep properties are not sufficient, and the article falls down over time.

[0004] On the other hand, as a hook capable of suspending a heavy article, a hook fixed to a wall or the like using a liquid adhesive is known. That is, a structure is known in which a hook portion is provided on one side of a plate-shaped base material, and the other side is fixed to a wall surface or the like with a liquid adhesive such as an epoxy-based adhesive. In this hook, after hardening, it is firmly joined to the wall surface, so that a relatively heavy article can be hung stably.

However, since the liquid adhesive has insufficient initial cohesive force, there is a problem that it is necessary to temporarily fix the adhesive by some method until the curing is completed. Also, the portion to which the hook is fixed is often a surface extending in a vertical direction such as a wall surface, and in the case of a liquid adhesive, the adhesive drips until curing is completed, which impairs the appearance of the wall surface. There were also problems.

Accordingly, Japanese Patent Application Laid-Open No. 61-81476 discloses a thermosetting adhesive sheet used for attaching small articles such as hooks to an adherend. This thermosetting adhesive sheet has a configuration in which a thermosetting resin composition having tackiness obtained by mixing short fibers with a plurality of types of thermosetting resins in a specific ratio is applied or impregnated to a substrate. However, since it shows adhesiveness at room temperature, when it is used for a hook, it can be easily attached to a wall surface or the like by utilizing the adhesive force. Also,
Since the thermosetting adhesive sheet is cured when heated, small articles such as hooks are firmly joined to a wall surface or the like.

However, since the thermosetting adhesive sheet requires heat for curing, a heat-sensitive resin cannot be used as a base material of the hook. In addition, even when the adherend, that is, the material to which the hook is attached is easily deteriorated by heat, the use of the thermosetting adhesive sheet causes a problem that the heat deforms the wall and the like.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks of the prior art, to easily apply the adhesive to a wall or the like by utilizing the adhesive property, and to firmly attach to the wall or the like when curing is completed. It is another object of the present invention to provide an adhesive hook that can be formed using a material having low heat resistance and that is less restricted by a material on an adherend side such as a wall surface.

[0009]

According to a first aspect of the present invention, there is provided an adhesive hook comprising a plate-shaped substrate having a hook portion on one surface and an adhesive layer provided on the other surface. The layer is composed of a curable adhesive containing an acrylic polymer, a compound having an epoxy group, and a photocationic polymerization initiator which induces ring-opening polymerization of the compound having an epoxy group by light irradiation. It is characterized by the following.

According to a second aspect of the present invention, the pressure-sensitive adhesive layer of the adhesive hook according to the first aspect is irradiated with light until the conversion of the epoxy group of the compound having an epoxy group becomes 50%. Is a method of sticking an adhesive hook, which comprises stopping irradiation of light on the hook and sticking it to a wall surface or the like.

The adhesive hook according to the first aspect of the present invention is an adhesive hook having a hook portion on one surface of a plate-shaped substrate and an adhesive layer provided on the other surface. It is characterized by being constituted by a photocurable adhesive layer having the above specific composition. That is, the curable adhesive has sufficient initial adhesive strength and cohesive strength at room temperature, and can be easily attached to a wall or the like by utilizing the adhesiveness, and the curing reaction is performed by irradiating light. When the curing is completed, the adhesive hook is firmly joined to the wall surface or the like.

In the present invention, the acrylic polymer is blended so that the pressure-sensitive adhesive layer has tackiness and initial cohesion in a normal state, and is not particularly limited as long as it can provide tackiness and cohesion. Not something.

The molecular weight of the acrylic polymer is not particularly limited, but is preferably large, and the weight average molecular weight is preferably in the range of 200,000 to 5,000,000, more preferably 600,000 to 3,000,000. When the weight-average molecular weight of the acrylic polymer is less than 200,000, the cohesive force of the curable adhesive is insufficient, and stringing may occur at the time of application, and peeling may occur. In some cases, the viscosity of the composition containing the polymer and the compound having an epoxy group becomes too high to form a pressure-sensitive adhesive layer.

The structure of the acrylic polymer is not particularly limited, and may be, for example, a homopolymer structure, a random copolymer structure, a block copolymer structure, an alternating copolymer structure, a stereoregular structure, a multibranched structure. , A star-shaped structure, a dendritic structure, a ladder structure, a ring structure, a helical structure and the like.

Specific examples of the acrylic polymer include homopolymers and copolymers of the following (meth) acrylate monomers. In this specification, (meth) acrylate is used as a general term for acrylate and methacrylate.

The above (meth) acrylate monomers include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and tert-acrylate. Butyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-
Ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isomyristyl (meth) acrylate, stearyl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate , 2-butoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, hexanediol di (meth) acrylate, ethylene glycol di (meth)
Acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate,
Trimethylolpropane tri (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, urethane acrylate , 2-hydroxyethyl (meth) acrylate, 3
-Hydroxypropyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth) ) Acrylate, 3-hydroxy-3-methylbutyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-[(meth) acryloyloxy] ethyl-2-hydroxyethylphthalic acid,
2-[(meth) acryloyloxy] ethyl-2-hydroxypropylphthalic acid and the like can be mentioned.

Preferably, as the acrylic polyester, a copolymer of the (meth) acrylate monomer and a compound having an unsaturated bond capable of copolymerizing the (meth) acrylate monomer is used. In order to enhance the storage stability of the adhesive layer, as the compound having an unsaturated bond, a vinyl monomer that is non-reactive with an epoxy group contained in the curable adhesive layer is preferably used. .

In view of the above, it is not preferable to use a vinyl monomer having a carboxyl group such as acrylic acid or methacrylic acid, or a vinyl monomer such as maleic anhydride having an acid anhydride skeleton.

Examples of the above vinyl monomers include (meth) acrylonitrile, N-vinylpyrrolidone, N-acryloylmorpholine, N-vinylcaprolactone,
N-vinylpiperidine, styrene, indene, α-methylstyrene, p-methylstyrene, p-chlorostyrene, p-chloromethylstyrene, p-methoxystyrene, p-tert-butoxystyrene, divinylbenzene, vinyl acetate, propionic acid Examples thereof include vinyl, vinyl butyrate, vinyl caproate, vinyl benzoate, vinyl cinnamate and the like.

In the present invention, the compound having an epoxy group is used for ring-opening polymerization by the action of a photocationic polymerization initiator when irradiated with light to cure the curable adhesive layer.

The compound having an epoxy group includes
The compound is not particularly limited as long as it is a compound containing an epoxy group. For example, bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol S epoxy resin, bisphenol F epoxy resin, novolac epoxy resin , Cycloaliphatic epoxy resins, glycidyl ester compounds and the like.

In the present invention, the above-mentioned cationic photopolymerization initiator is used in order to cause the compound containing an epoxy group to undergo ring-opening polymerization by light irradiation to promote curing. The cationic photopolymerization initiator is not particularly limited as long as the epoxy group can be subjected to ring-opening polymerization by light irradiation,
For example, photosensitive onium salts, photosensitive organic metal complexes, and the like can be used. In addition, as the light to be applied to advance the curing reaction, the energy intensity that promptly causes a ring-opening reaction of the epoxy group and the transmittance to the curable adhesive layer can be balanced.
Ultraviolet light having a wavelength of 300 nm to 370 nm is preferably used, and the above-mentioned photosensitive onium salt compound is suitably used as a compound activated by irradiation with ultraviolet light having such a wavelength.

As the above-mentioned cationic photopolymerization initiator, those which are stable at a temperature of from 20 to 80 ° C. and have low thermocatalytic activity are preferable for enhancing the storage stability.
Examples thereof include iron allene complex compounds, aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, and pyridinium salts.

More specifically, for example, Optomer SP
-150 (manufactured by Asahi Denka Kogyo), Optmer SP-151
(Made by Asahi Denka Kogyo), Optmer SP-170 (made by Asahi Denka Kogyo), Optmer SP-171 (made by Asahi Denka Kogyo), UVE-1014 (made by General Electronics), CD-1012 (made by Sartomer). , Sun-Aid SI-60L (manufactured by Sanshin Chemical Industry), Sun-Aid SI-
80L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun-Aid SI-100
L (manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2064 (manufactured by Nippon Soda Co., Ltd.), CI-2639 (manufactured by Nippon Soda Co., Ltd.), CI-262
4 (Nippon Soda Co., Ltd.), CI-2481 (Nippon Soda Co., Ltd.)
And other commercially available compounds can be used.

As the lamp used for the light irradiation, any lamp can be used as long as it has an emission distribution of 800 nm or less. For example, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, chemical lamps, black light lamps, microwave-excited mercury lamps, metal halide lamps, fluorescent lamps, and the like are used without any particular limitation. In this case, in order to prevent curing of only the surface layer and achieve internal curing, light having a wavelength of 300 nm or less may be cut and irradiated.

(Blending ratio) In the present invention, the blending ratio of the acrylic polymer and the compound having an epoxy group is appropriately determined according to the desired initial adhesive strength, the adhesive strength after curing, and the like, and is particularly limited. However, preferably, the compound having an epoxy group is blended in an amount of 10 to 300 parts by weight based on 100 parts by weight of the acrylic polymer.

The compounding ratio of the compound having an epoxy group is 1
If the amount is less than 0 parts by weight, it may not be possible to obtain sufficient adhesive strength even when cured by irradiating light.
If it exceeds 300 parts by weight, the relative blending ratio of the acrylic polymer may decrease, and a sufficient initial adhesive strength may not be obtained.

The mixing ratio of the above-mentioned cationic photopolymerization initiator is not particularly limited because it varies depending on the kind thereof, but preferably, the cationic photopolymerization initiator is added to 100 parts by weight of the compound having an epoxy group. The agent will range from 0.01 to 5 parts by weight. When the proportion of the cationic photopolymerization initiator is less than 0.01 parts by weight, the ring-opening reaction of the epoxy group may not be able to proceed sufficiently even when irradiated with light, and an adhesive cured product having a high adhesive strength may be obtained. May not be obtained, and even if it is added in an amount exceeding 5 parts by weight, the effect of promoting curing may not be further increased, and conversely, the initial adhesive strength may be reduced.

(Method of Manufacturing Adhesive Hook) The method of manufacturing the adhesive hook according to the first aspect of the present invention is not particularly limited. That is, as in the case of a known adhesive hook, a method in which the above-mentioned curable adhesive layer is formed as an adhesive layer on a release-treated film by application and then transferred to a hook base material, or A method in which the curable adhesive is directly applied to the surface of the hook base on which the adhesive layer is formed can be used.

As for the coating method, hot melt coating,
Examples include cast coating, extrusion coating, and UV polymerization coating, and are not particularly limited. In the UV polymerization coating method, a monomer component such as a (meth) acrylate monomer, a compound having an epoxy group, a photocationic polymerization initiator, and a photoradical polymerization initiator sensitive to light in a wavelength region where the cationic photopolymerization initiator is not sensitive A photopolymerizable composition containing is used. This photopolymerizable composition is applied to a hook base material, only the photoradical polymerization initiator is exposed, only radical polymerization is caused to form an acrylic polymer, and a curable adhesive layer can be obtained. .

In the above preferred embodiment, a photo-radical polymerization initiator sensitive to light in a wavelength region where the photo-cationic polymerization initiator is not used is used. As the photo-radical polymerization initiator, the energy to the photo-cationic polymerization initiator is used. Those that do not cause movement are preferred.

Preferred examples of such a photo-radical polymerization initiator include, for example, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone , Methoxyacetophenone, 2,2-dimethoxy-2
Acetophenone derivative compounds such as phenylacetophenone; benzoin ether compounds such as benzoin ethyl ether and benzoin propyl ether; ketal derivative compounds such as benzyl dimethyl ketal; halogenated ketones; acylphosphine oxides; acylphosphonates; , 6-Dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide.

Among the above examples of the photopolymerization initiator, in particular, 3
Acylphosphine oxide, acylphosphonate, bis- (2,6-dimethoxybenzoyl) -2, which has a high absorption coefficient for light in a wavelength region exceeding 50 nm.
4,4-Trimethylpentylphosphine oxide is preferred.

As the lamp used for light irradiation in the photoradical polymerization, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp,
A high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a chemical lamp, a black light lamp, a microwave excitation mercury lamp, a metal halide lamp, a fluorescent lamp, and the like can be used.

(Hook Substrate) In the present invention, as for the plate-like substrate for forming the hook, any conventionally known suitable substrate can be used as long as it has a hook portion on one side and an adhesive layer can be provided on the other side. A plate base material can be used, and the shape and number of hook portions are not particularly limited.

Further, the hook portion and the plate-shaped base material may be formed of separate members, or may be formed integrally with a synthetic resin or the like. In addition, the material forming the hook portion and the plate-shaped substrate may be a synthetic resin, a metal, or the like, and is not particularly limited. In the present invention, since the curable adhesive does not require heat for curing, the plate-shaped substrate and the hook portion,
It is also possible to use a synthetic resin having poor heat resistance.

(Attaching Method of Adhesive Hook) When attaching the adhesive hook according to the first aspect of the present invention to a wall surface or the like, light is applied to the adhesive layer made of a curable adhesive of the adhesive hook. Then, the light irradiation is stopped until the conversion ratio of the epoxy group of the compound having an epoxy group becomes 50%, and the compound is attached to a wall surface or the like.

As the irradiation light, light having a wavelength capable of activating the above-mentioned cationic photopolymerization initiator is used, and preferably, light having a wavelength of 300 to 800 nm is used. 3
If it is less than 00 nm, it will be uncured from the inside and sufficient adhesive strength may not be exhibited. If it exceeds 800 nm, it will be difficult to effectively absorb light energy and may not be cured.

As described above, the light irradiation is stopped until the conversion of the epoxy group of the compound having an epoxy group reaches a reaction of 50% because the conversion of the epoxy group is 50%.
If the reaction is performed so as to exceed the limit, the curing will proceed too much, and it will be difficult to easily attach the composition to a wall surface or the like.

The conversion of the epoxy group is measured in the following manner. (Epoxy group conversion) The content of epoxy group was determined by adding hydrochloric acid-
It can be determined by a method called the dioxane method. That is, a hydrogen chloride dioxane solution and ethanol are added at a ratio of 1: 1 to the curable adhesive layer laminated on a predetermined amount of the hook base material, and the mixture is stirred at room temperature for about 5 hours, and then unreacted. Of hydrogen chloride is determined by back titration with potassium hydroxide. The formula for calculating the epoxy group content Z (mol / g) is as follows.

Z (mol / g) = (S ₁ -S ₂ ) × C ×
f / (W _s × 1000) S ₁ (mL): Titration of potassium hydroxide in ethanol solution required for this test S ₂ (mL): Titration of potassium hydroxide in ethanol solution required for blank test C ( mol / L): Concentration of potassium hydroxide in ethanol solution used for titration f: Factor of potassium hydroxide in ethanol solution used for titration W _S (c): Collection amount of titration sample However, carboxyl group etc. When the acid is present, the concentration of the acid is determined in advance, and the value obtained by subtracting the value from Z is the epoxy group content.

The conversion ratio of the epoxy group (Conv
(%)) Was determined by the following equation. Conv (%) = (Z ₀ −Z ₁ ) / Z ₀ × 100 Z ₀ (mol / g): epoxy group content Z ₁ (mol / g) of the curable adhesive layer before light irradiation. : Epoxy group content of the curable adhesive layer for a certain time after light irradiation, where Z ₀ and Z ₁ are determined by the hydrochloric acid-dioxane method described above.

[0043] In the adhesive hook according to the invention described in the action claim 1, the adhesive hook affixed to a wall or the like, the adhesive layer for fixing, compounds and photocationic with the acrylic polymer, an epoxy group A curable adhesive containing a polymerization initiator is used. Since this curable adhesive has sufficient initial adhesive strength and cohesive strength at room temperature, an adhesive hook can be easily attached to a wall surface or the like.

The curable adhesive agent is activated by irradiating light to activate the cationic photopolymerization initiator.
The ring-opening polymerization of the compound having an epoxy group proceeds and cures. Since this curing reaction does not proceed immediately, the adhesive hook can be easily attached to the wall surface or the like as described above by utilizing the adhesiveness of the acrylic polymer.

When the curing is completed, the plate-like base material of the adhesive hook and the wall surface and the like are firmly joined via the curable adhesive layer. As described above, since it can be cured by irradiating light, even a plate-shaped substrate made of a material having poor heat resistance or a hook having a hook portion can be fixed to a wall surface or the like without deformation. Also, even when the wall surface or the like is made of a material having poor heat resistance, the adhesive hook can be securely fixed to the wall surface or the like without causing deformation of the wall surface or deterioration of appearance.

In the method of attaching the adhesive hook according to the second aspect of the present invention, curing is promoted by irradiating the adhesive layer of the adhesive hook made of a curable adhesive with light to cure the epoxy. Since the irradiation of light is stopped until the conversion of the compound having a group becomes 50%, the adhesive hook can be easily attached to a wall surface or the like while maintaining sufficient adhesiveness. Thereafter, even if the irradiation of the light is stopped, the curing reaction continues to progress, so that the adhesive hook is finally firmly joined to the wall surface or the like.

[0047]

The present invention will be clarified by the following non-limiting examples.

Example 1 In a 2 L separable flask, 30 g of glycidyl methacrylate, epoxy resin (trade name: Epicoat 82, manufactured by Yuka Shell Epoxy Co., Ltd.)
8) 50 g, epoxy resin (manufactured by Shin Nippon Rika Co., Ltd., trade name:
BEO-60E) 20 g, bis (2,6-dimethoxybenzoyl) -2,4,4-photoradical polymerization initiator
0.1 g of trimethylpentylphosphine oxide (manufactured by Ciba Geigy, trade name: Irgacure 1700) and 0.5 g of a cationic photopolymerization initiator (manufactured by Asahi Denka Kogyo Co., Ltd., trade name: Optmer SP-170) are stirred and mixed until uniform. After that, dissolved oxygen was removed by bubbling with nitrogen gas for 20 minutes to obtain a photopolymerizable composition.

The above photopolymerizable composition was obtained, and a 0.3 mm-thick polyethylene terephthalate film was subjected to a release treatment.
, And the coated composition layer was coated with a second polyethylene terephthalate film subjected to a release treatment. In the thus obtained laminate,
Irradiation was performed for 20 minutes using a fluorescent lamp having a maximum emission wavelength at 400 nm so that the light intensity became 1 mW / cm ² , thereby obtaining a curable adhesive layer.

Next, as shown in Table 1, the adhesive layer (not shown) of a commercially available adhesive hook (manufactured by KOKUYO Co., Ltd., product number: 17-10) was removed from the plate-like substrate 1a. The surface from which the layer was removed was washed with ethyl acetate, and the curable adhesive layer 1b was transferred to the washed surface to obtain an adhesive hook 1. In FIG. 1, reference numeral 1c denotes a release sheet, and 1d denotes a hook.

Comparative Example 1 The commercially available adhesive hook used in Example 1 was directly used as Comparative Example 1. The pressure-sensitive adhesive layer of a commercially available pressure-sensitive adhesive hook is formed of a double-sided tape in which a pressure-sensitive adhesive layer is attached to a foam tape.

(Comparative Example 2) Light having a wavelength of 360 nm and an intensity of 20 mW / cm ² was applied to the curable adhesive layer of the adhesive hook prepared in Example 1, and the conversion of the epoxy group was 50%.
, I.e., irradiation for 5 minutes, followed by sticking according to the sticking method described below.

(Attaching Method) Using a high-pressure mercury lamp in which light having a wavelength of 300 nm or less was cut off with a filter, ultraviolet light having a wavelength of 365 nm was applied to the adhesive layer of the adhesive hook obtained in Example 1 at an intensity of 20 mW / cm ² . For 1 minute, and then immediately attached to the cement mortar wall. In addition, the epoxy group conversion immediately after light irradiation was 15%. After affixing to a wall surface, curing at room temperature for 24 hours, and at room temperature, a total weight of 1
A 0 kg bag was hung on the adhesive hook, and the time until the adhesive hook dropped was measured.

In Comparative Example 1, a commercially available adhesive hook was attached to the cement mortar wall in the same manner as in Example 1, and after curing at room temperature for 24 hours, a 10 kg bag was hung in the same manner as in Example 1. The time until the adhesive hook fell was measured.

Further, in Comparative Example 2, after irradiating with light until the conversion ratio of the epoxy group exceeded 50% as described above, it was affixed, cured for 24 hours at room temperature, and then weighed 10 kg at room temperature.
g of the bag was hung and the time required for the adhesive hook to fall was measured. The results are shown in Table 1 below.

[0056]

[Table 1]

As is clear from Table 1, the commercially available adhesive hook of Comparative Example 1 took 5 days to drop a 10 kg bag, whereas the adhesive hook according to Example 1 required 90 days. Within, no sticky hooks fell.
Further, in Comparative Example 2 in which the light was irradiated until the conversion of the epoxy group exceeded 50% and then the adhesive was applied, the adhesive strength to the wall surface was insufficient, and the adhesive hook dropped after 10 days.

[0058]

According to the first aspect of the present invention, the pressure-sensitive adhesive hook includes the acrylic polymer, a compound having an epoxy group, and a cationic photopolymerization initiator as the pressure-sensitive adhesive layer formed on the plate-shaped substrate. Since the curable adhesive layer is formed, the acrylic polymer in the curable adhesive layer can be easily adhered to a wall surface as an adherend by the initial adhesive force and cohesive force of the acrylic polymer. it can. In addition, by irradiating light prior to sticking, the cationic photopolymerization initiator is activated, ring-opening polymerization of the compound having an epoxy group proceeds, and curing proceeds. Therefore, after the curing is completed, the adhesive hook is firmly joined to the wall surface or the like.

However, since the curing reaction does not proceed immediately, the adhesive is hardly lost even after irradiation with light, so that the adhesive hook can be easily attached to a wall surface or the like. Therefore, in the pressure-sensitive adhesive hook according to the first aspect of the present invention, since heating is not required for curing, the pressure-sensitive adhesive is made of a material having low heat resistance as a plate-shaped base material or a hook portion constituting the pressure-sensitive adhesive hook. In addition, even when the wall surface and the like are made of a material having low heat resistance, the wall surface and the like are hardly deformed and the appearance is not deteriorated. That is, the width of the material constituting the adhesive hook can be increased, and the width of the applied portion can be increased.

Further, when affixing to a wall surface or the like, since the acrylic polymer exhibits sufficient adhesive force and cohesive force, no temporary fixing is required. That is, the conventional method using a liquid adhesive requires complicated temporary fixing, whereas the adhesive hook according to the invention of claim 1 omits such complicated work. Can be.

In the method of attaching the adhesive hook according to the second aspect of the present invention, since the irradiation of light is stopped until the conversion of the epoxy group becomes 50%, the adhesion of the curable adhesive is reduced. Power is not lost. Therefore, the adhesive hook can be easily and reliably attached to a wall surface or the like, and the curing proceeds even after the light irradiation is stopped, so that the adhesive hook can be finally firmly bonded to the wall surface.

[Brief description of the drawings]

FIG. 1 is a side view for explaining an adhesive hook prepared in an example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Adhesive hook 1a ... Plate-like base material 1b ... Adhesive layer which consists of hardening type adhesive 1d ... Hook part

Claims (2)

[Claims] An adhesive hook in which a hook portion is provided on one surface of a plate-shaped substrate and an adhesive layer is provided on the other surface, wherein the adhesive layer has an acrylic polymer and a compound having an epoxy group. A pressure-sensitive adhesive hook comprising: a curable adhesive containing: a photo-cationic polymerization initiator that induces ring-opening polymerization of a compound having an epoxy group by light irradiation. 2. The adhesive layer of the adhesive hook according to claim 1, wherein the adhesive layer is irradiated with light, and the irradiation of the light is stopped until the conversion of the epoxy group of the compound having an epoxy group becomes 50%. ,
A method of attaching an adhesive hook, which is attached to a wall or the like.