JPH11249747A - Method and device for controlling temperature - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cook an object to be cooled when cooling the object to be cooled by circulating and supplying a fluid through the fluid passage of a hot plate for placing the object to be cooled. SOLUTION: After the return fluid from a cooling chamber 7 is cooled at a certain level by a heat exchanger 8, this return fluid is supplied to a cooling layer 4b of a fluid tank 4, cooled and heated by a heating layer 4c and the low temperature fluid at the target temperature is supplied to the cooling chamber 7 again. In this case, two routes of a cooling route 10 and a non-cooling route 11 are provided as the route for returning the return fluid from the cooling chamber 7 into the fluid tank 4 and based on a temperature T4 or the like of the cooling layer 4b of the fluid tank 4, the opening/closing of valves A and B respectively provided on the respective routes is controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature control system for circulating a fluid adjusted to a predetermined temperature through a temperature control chamber and cooling an object to be temperature controlled such as a semiconductor wafer by heat conduction with the temperature control chamber. More particularly, the present invention relates to a temperature control method and apparatus for efficiently controlling the temperature of an object to be controlled.

[0002]

2. Description of the Related Art Conventionally, in manufacturing a semiconductor wafer, a fluid passage is provided in a hot plate on which the semiconductor wafer is mounted, and the heated semiconductor wafer is cooled through a cooling system which circulates a cool / hot fluid to the fluid passage. Techniques for doing so are known.

[0003] More specifically, a cold fluid staying in a tank forming a part of the cooling system is circulated through a heat exchanger, and a cooler such as a chiller unit supplies cooling water to the heat exchanger. This cools the cold fluid in the tank to a desired temperature.

[0004] Therefore, by using such a conventional technique, the temperature of the cold fluid in the tank can be controlled by controlling the pressure of the cooling water supplied from the cooler to the heat exchanger.

[0005]

However, even if such a conventional technique is used, it is difficult to maintain the temperature in the tank at a target temperature. For example, a cold temperature flowing out of a fluid passage of a hot plate on which a semiconductor wafer is placed is placed. If the temperature of the fluid is too high, the cold fluid supplied to the fluid passage cannot be cooled sufficiently.

For this reason, the inside of the tank is divided into two layers, a first layer and a second layer. The first layer is maintained in a supercooled state, and the return fluid from the fluid passage is sufficiently cooled. 2. Description of the Related Art There is known a technique of supplying a cold fluid at a target temperature to a fluid passage by heating a cold fluid that is excessively cooled in a first layer to a desired temperature in a second layer.

However, when this conventional technique is used,
Energy for supercooling the return fluid and energy for warming the cold fluid cooled below the target temperature to the target temperature are required, so that the energy consumption increases.

[0008] For this reason, it is a very important issue how to efficiently cool the cold fluid supplied to the fluid passage of the hot plate on which the semiconductor wafer is placed.

Therefore, the present invention solves the above-mentioned problem, and circulates and supplies a fluid to a fluid passage of a hot plate on which an object to be cooled is placed, thereby cooling the object to be cooled. It is an object of the present invention to provide a temperature control method and apparatus capable of efficiently controlling the temperature of a device.

[0010]

In order to achieve the above object, a first aspect of the present invention is to circulate a fluid adjusted to a predetermined temperature through a temperature control chamber, and to conduct heat by communicating with the temperature control chamber. In a temperature control device that cools an object to be temperature-controlled, a cooling unit that cools the fluid, a fluid tank that stores a fluid to be circulated to the temperature control chamber, and a fluid that passes through the temperature control chamber to the fluid tank. A first path for direct supply and a second path for cooling the fluid passing through the temperature control chamber through the cooling means and then supplying the fluid to the fluid tank
And a path for supplying the fluid that has passed through the temperature control chamber to the fluid tank based on the fluid temperature of the fluid remaining in the fluid tank and / or the fluid temperature of the fluid that has passed through the temperature control chamber. And selecting means for performing the selection.

Therefore, the temperature can be controlled efficiently by selecting the path of the return fluid from the temperature control chamber without cooling the fluid remaining in the fluid tank.

In a second aspect of the present invention, the fluid tank includes:
A cooling layer for supercooling the stored fluid, and a heating layer for heating the fluid cooled by the cooling layer to a predetermined temperature,
The apparatus further includes a third path for supplying the fluid that has passed through the temperature control chamber to the heating layer of the fluid tank.

For this reason, when supercooling and heating the fluid in the fluid tank, the supply of an excessive amount of heat during heating is prevented, and the fluid having a desired fluid temperature is efficiently supplied to the temperature control chamber. be able to.

Further, the third invention is characterized in that a path for supplying the fluid stored in the fluid tank to the temperature control chamber further includes a fourth path for bypassing the fluid passing through the temperature control chamber. And

Therefore, even if the number of fluid tanks is one, the temperature can be controlled efficiently.

According to a fourth aspect of the present invention, there is provided a temperature control apparatus which circulates a fluid adjusted to a predetermined temperature held in a fluid tank through a temperature control chamber and cools the object to be temperature-controlled by heat conduction with the temperature control chamber. In the control method, the fluid temperature of the fluid stored in the fluid tank is measured, and if the measured fluid temperature is higher than a predetermined target temperature of the fluid tank, the fluid that has passed through the temperature control chamber is cooled, and then the fluid tank is cooled. If the fluid temperature is equal to or lower than the target temperature, the fluid that has passed through the temperature control chamber is supplied to the fluid tank as it is.

Therefore, the temperature can be efficiently controlled by selecting the path of the return fluid from the temperature control chamber without cooling the fluid remaining in the fluid tank.

According to a fifth aspect of the present invention, there is provided a temperature control apparatus which circulates a fluid held in a fluid tank at a predetermined temperature through a temperature control chamber and cools an object to be temperature controlled by heat conduction with the temperature control chamber. In the control method, the fluid temperature of the first fluid stored in the fluid tank and the fluid temperature of the second fluid passing through the temperature control chamber are measured, and the measured fluid temperature of the first fluid and the second fluid are measured. And selecting whether or not to cool the second fluid supplied to the fluid tank based on the fluid temperature and a predetermined target temperature of the fluid tank.

Therefore, the inside of the fluid tank can be maintained at the target temperature in response to the amount of heat of the fluid passing through the temperature control chamber.

According to a sixth aspect of the present invention, there is provided a temperature control device for circulating a fluid adjusted to a predetermined temperature held in a fluid tank through a temperature control chamber and cooling an object to be temperature controlled by heat conduction with the temperature control chamber. In the control method, the fluid temperature of the first fluid stored in the fluid tank and the fluid temperature of the second fluid passing through the temperature control chamber are measured, and the measured fluid temperature of the first fluid and the second fluid are measured. And selecting whether to heat the fluid flowing out of the fluid tank with the second fluid based on the fluid temperature of the fluid tank and a predetermined target temperature of the fluid tank.

For this reason, the temperature can be controlled efficiently by utilizing the thermal effect of the return fluid from the temperature control chamber.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

First, the overall configuration of the temperature control device used in the first embodiment will be described.

FIG. 2 is a diagram showing the overall configuration of the temperature control device used in the first embodiment.

In FIG. 1, a wafer 1 is mounted on a heater 2 and a uniform gap is formed between the wafer 1 and the heater 2 by means of a shim (not shown). 2 is conducted. Wafer 1
Is a disk shape as is well known, and the heater 2 has a larger circular surface than the shape of the wafer 1.

The heater 2 has a heating wire (not shown) formed uniformly on its surface so that the heater 2 can be uniformly heated. The heating of the heater 2 is power-controlled by the controller 3.

On the other hand, when the wafer 1 is cooled, a low-temperature fluid stored in the fluid tank 4 and adjusted to a predetermined temperature flows into the cooling chamber 7.

That is, the low-temperature fluid stored in the fluid tank 4 is supplied to the cooling chamber 7 by the valve opening / closing control (not shown) and the pump control by the controller 3. The low-temperature fluid flowing into the cooling chamber 7 removes heat from the wafer 1 via the heater 2 and is returned to the fluid tank 4.

The fluid tank 4 includes a partition plate 4a.
And a layer on the return side from the cooling chamber 7 is a cooling layer 4 b for supercooling the low-temperature fluid using the cooling unit 5.
The layer on the side that supplies the low-temperature fluid to the cooling chamber 7 is the heating layer 4c that heats the temperature of the supercooled low-temperature fluid using the heater 6 to the target temperature.

Next, a cooling system using the fluid tank 4 shown in FIG. 1 will be specifically described.

FIG. 1 is a diagram showing a specific configuration of a cooling system of the temperature control device according to the first embodiment.

As shown in the figure, in this cooling system, after the return fluid from the cooling chamber 7 is cooled to some extent by the heat exchanger 8, the return fluid is supplied to the cooling layer 4b of the fluid tank 4 for cooling. At the same time, the low-temperature fluid heated by the heating layer 4c to the target temperature is supplied to the cooling chamber 7 again.

That is, if all the return fluid from the cooling chamber 7 is to be cooled via the heat exchanging section 4d, the fluid tank 4 can be cooled if the return fluid temperature T1 or T2 is relatively low.
Temperature T4 of the fluid staying in the cooling layer 4b becomes excessively low, and the heater 6 must supply a large amount of heat.
Not efficient.

For this reason, in the present embodiment, two paths, a cooling path 10 and a non-cooling path 11 shown in the figure, are provided as paths for returning the fluid from the cooling chamber 7 into the fluid tank 4. The opening and closing of the valves A and B provided in each path is controlled based on the temperature T4 of the cooling layer 4b of FIG. The opening and closing control of the valves A and B is performed by the controller 3 shown in FIG.

The first path and the second path of claim 1 correspond to the non-cooling path 11 and the cooling path 10, respectively, and the first path of claim 1 directs the fluid to the “direct” fluid tank. The description of supply includes a case where the return fluid from the cooling chamber 7 is supplied to the fluid tank as it is and a case where the return fluid is supplied to the fluid tank via the heat exchanger 8.

In the present embodiment, the fluid temperature T1 before passing through the heat exchanger 8, the fluid temperature T2 after passing through the heat exchanger 8, and the cooling by the heat exchanger 8 taking heat from the fluid. The water temperature T3 and the fluid temperature T4 of the cooling layer 4b of the fluid tank 4
The fluid temperature T5 of the cold fluid output from the heating layer 4c of the fluid tank 4 is measured by a thermometer.

FIG. 3 is a flowchart showing one control procedure of the cooling system of the temperature control device shown in FIG.

As shown in the figure, in this cooling system, first, a target temperature SV in the cooling layer 4b of the fluid tank 4 is set (step 301), and then the temperature of the cooling layer 4b in the fluid tank 4 is set. T4 is measured (step 302).

Then, the fluid temperature T4 of the cooling layer 4b is compared with the target temperature SV (step 303). If the fluid temperature T4 of the cooling layer 4b is higher, the valve A is turned on and the valve B is turned off (step 303). 304), cooling is performed via the heat exchange unit 4d by controlling the return fluid to pass through the path 10.

On the other hand, when the target temperature SV is the fluid temperature T
If it is four or more, the valve A is turned off and the valve B is turned on (step 305), the return fluid is controlled to pass through the path 11, and the return fluid is not cooled.

By repeating the above series of processes until an end instruction is given (step 306), the supply of an excessive amount of heat by the heater 6 is prevented beforehand, and a cold fluid having a desired fluid temperature is efficiently transferred to the cooling chamber 7. Can be supplied.

In the flowchart shown in FIG. 3, the case where the temperature is controlled only based on the fluid temperature T4 of the cooling layer 4a of the liquid tank 4 has been described. In such a case, the temperature of the return fluid is not considered at all. Therefore, the flow of the return fluid into the cooling layer 4a may cause the fluid temperature of the cooling layer 4a to exceed the target temperature.

Therefore, another processing procedure for opening and closing the valves A and B in consideration of the temperatures T1 and T4 will be described.

FIG. 4 is a flowchart showing another control procedure of the cooling system of the temperature control device shown in FIG.

As shown in the figure, first, after setting the target temperature SV in the cooling layer 4b of the fluid tank 4 (step 401), the fluid temperature T1 of the return fluid before entering the heat exchanger 8 and the fluid temperature T1 The temperature T4 of the cooling layer 4b in the tank 4 is measured (Step 402).

Then, the fluid temperature T4 of the cooling layer 4b is compared with the target temperature SV (step 403). If the fluid temperature T4 of the cooling layer 4b is higher, the threshold value CB is set to '0' (step 404). ), If the target temperature SV is higher,
The threshold value CB is set to k × (SV-T4) (step 405). Here, k is a predetermined coefficient.

Next, the temperature difference (T1-T4) is set to a threshold value C.
B (step 406), and the temperature difference (T1-T4)
Is higher, the valve A is turned on and the valve B is turned off (step 407), and the return fluid is controlled to pass through the path 10 to perform cooling through the heat exchange unit 4d.

On the other hand, if the threshold value CB is higher, the valve A is turned off and the valve B is turned on (step 4).
08), the return fluid is controlled to pass through the path 11, and the return fluid is not cooled.

As described above, in this processing procedure, the cooling layer 4
If the fluid temperature T4 of a is lower than the target temperature SV, the return fluid is not cooled unless the return fluid temperature T1 is considerably high, and the fluid temperature T4 is set to the target temperature SV.
If it is higher, whether or not the return fluid is cooled is determined based on whether or not the temperature T1 of the return fluid is higher than the fluid temperature T4.

By repeating the above series of processing until an end instruction is given (step 409), the supply of an excessive amount of heat by the heater 6 is prevented beforehand while taking the temperature of the return fluid into consideration, so that the cooling water having a desired fluid temperature can be obtained. The fluid can be efficiently supplied to the cooling chamber 7.

In this case, the temperature T1 of the return fluid before passing through the heat exchanger 8 is used.
Alternatively, the temperature T2 of the return fluid after passing through may be applied instead of the temperature T1.

As shown in FIG. 5, after the threshold value CB is set to “0” in step 404 in FIG. 4, the fluid temperature T4 in the cooling layer 4b is set to a predetermined temperature α above the target temperature SV.
If it is higher than the above (T4> SV + α), the process may be shifted to step 407, assuming that the return fluid is always cooled.

As described above, in the first embodiment, based on the fluid temperature T4 of the cooling layer 4b of the fluid tank 4 or the fluid temperature T4 and the fluid temperature T1 of the return fluid,
Since it is configured to determine whether or not the return fluid is to be cooled via the heat exchange unit 4d, the supply of an excessive amount of heat by the heater 6 is prevented beforehand, and the cold / hot fluid having a desired fluid temperature can be efficiently supplied to the cooling chamber 7 Can be supplied to

The first embodiment has been described above.

In the first embodiment, the case where the return fluid flows into the cooling layer 4b of the fluid tank 4 via either the path 10 or the path 11 has been described. It can also be poured into the heating layer 4c or the like. Therefore, hereinafter, a second embodiment in which the return fluid flows into the heating layer 4c or the like through a new path will be described.

FIG. 6 is a diagram showing a configuration of a cooling system used in the second embodiment.

As shown in the figure, in this cooling system, FIG.
In addition to the paths 10 and 11 shown in FIG. 1, a path 12 for directly flowing the return fluid into the heating layer 4c is provided, a valve C is provided in the path 12, and the heater of the heating layer 4c is removed.

More specifically, in the second embodiment, the return fluid from the cooling chamber 7 is supplied to the path 10 having the valve A, the path 11 having the valve B, or the path 12 having the valve C.
Is configured to flow into the fluid tank 4 via any of the above.

For example, the fluid temperature T4 of the cooling layer 4b of the fluid tank 4 or the temperature T5 of the fluid flowing out of the fluid tank 4
Is too low, valves A and B are closed and valve C
To open and supply the return fluid to the heating layer 4c.
The temperature of the low-temperature fluid supplied to the cooling chamber 7 will be increased.

As described above, in this cooling system, the heated return fluid is used as a heat source instead of the heater. Here, for convenience of explanation, the case where the heater is removed is shown, but the heater 6 shown in FIG.
May be provided in the heating layer 4c to reduce the output of the heater 6.

Next, the processing procedure of the cooling system shown in FIG. 6 will be specifically described.

FIG. 7 is a flowchart showing the processing procedure of the cooling system shown in FIG.

As shown in the figure, first, after setting the target temperature SV in the cooling layer 4b of the fluid tank 4 (step 701), the fluid temperature T1 of the return fluid before entering the heat exchanger 8 and the fluid temperature T1 The temperature T4 of the cooling layer 4b in the tank 4 is measured (Step 702).

Then, the fluid temperature T4 of the cooling layer 4b and (S
V-α) (step 703), and the fluid temperature T4
Is smaller, it is further compared whether the temperature T1 of the return fluid is higher than the target temperature SV (step 704),
If it is higher than the target temperature SV, the valve C is turned on and the valves A and B are turned off (step 705),
The return fluid flows into the heating unit 4c via the path 12, and the compressor 5a of the cooling unit 5 is turned off (step 706).

In such a case, since the low-temperature fluid output from the fluid tank 4 is too cold, the temperature of the fluid in the heating layer 4c is raised by the return fluid having a temperature higher than the target temperature SV.

On the other hand, the fluid temperature T4 of the cooling layer 4b
Is greater than or equal to (SV-α), it is necessary to cool the return fluid. If the temperature T1 of the return fluid is lower than the target temperature, the heating effect of the heating layer 4c cannot be obtained. The valve C is turned off, and the on / off of the valves A and B is determined (step 707). The ON / OFF of the valves A and B may be performed in the same manner as in the first embodiment shown in the flowcharts of FIGS.

By repeating the above series of processes until an end instruction is given (step 708), a cold fluid having a desired fluid temperature is efficiently supplied to the cooling chamber 7 while utilizing the thermal effect of the return fluid. Can be. Although the temperatures T1 and T4 are used here for convenience of description, the temperature T2 may be used instead of the temperature T1 and the temperature T5 may be used instead of the temperature T4.

Here, the case where the fluid tank 4 is composed of two layers of the cooling layer 4b and the heating layer 4c has been described.
The present embodiment can be applied even when the fluid tank 4 is not partitioned into two layers.

In this case, the heating layer 4
Since c does not exist, the path 12 having the valve C is connected to the fluid supply path toward the cooling chamber 7 as shown in FIG.
It is configured so as not to pass through the fluid tank 4.

Therefore, although the heating effect in the fluid tank 4 cannot be expected, if the fluid supplied to the cooling chamber 7 is too low due to the mixing of the return fluid and the low-temperature fluid on the fluid supply path, the temperature is increased. be able to.

As described above, in the second embodiment, in addition to the paths 10 and 11 shown in FIG. 1, a path 12 for directly flowing the return fluid into the heating layer 4c or the like is provided.
Since the return fluid that flows through the heating layer 4 is used as a heat source, the heater of the heating layer 4c can be removed or the load can be reduced, and the temperature can be controlled efficiently.

The second embodiment has been described above.

By the way, in the first and second embodiments, the characteristics relating to the process of the cooling chamber 7, that is, the chamber, are excluded. However, for example, as the number of chambers increases, the temperature of the return fluid generally increases. Therefore, such process information can be considered.

Originally, in the system using the two-layer type fluid tank 4, the fluid is supercooled in the cooling layer 4a, and the supercooled fluid is heated to the target temperature in the heating layer 4c.
Although a cooling fluid of a desired temperature is supplied to the cooling chamber 7, if such supercooling and heating are always performed uniformly, high-precision temperature control is possible, but power consumption and component fatigue are large. Become.

Therefore, in addition to the high-precision temperature control mode (hereinafter referred to as "high-accuracy mode"), a mode for reducing the power consumption of each component in consideration of the process information (hereinafter referred to as "energy-saving mode"). ) Can be provided.

In this energy saving mode, process information such as the future trend of the load is input by communication or the like, and the target temperature SV and the like of the cooling layer 4b of the fluid tank 4 are controlled based on the process information. Temperature control can be performed efficiently.

FIG. 9 is a flowchart showing an example of a target temperature control procedure based on process information.

As shown in the figure, first, the number n of mounted chambers is compared with a predetermined threshold value n1 (step 901). Target temperature SV of cooling layer 4b
(Step 902). Conversely, if the number n of chambers is less than the threshold value n1, the target temperature SV is set to SVH (Step 903). That is, automatic switching between the high target temperature SVH and the low target temperature SVL is performed according to the number of chambers.

Next, after measuring the chamber process temperature T (step 904), the temperature T is compared with a predetermined threshold value T1 (step 905).
If it is not less than 1, the target temperature SV of the cooling layer 4b of the fluid tank 4 is reduced by a predetermined amount α (step 906).

When there are k chambers that enter the chill process within t seconds, k is obtained by multiplying k by a predetermined amount β.
β is further reduced from the target temperature SV of the cooling layer 4b of the fluid tank 4 (step 907).

As described above, the temperature can be controlled more efficiently by setting the target temperature SV in accordance with the process state such as the number of chambers n and the number of chambers k to enter the chill process.

In the above embodiment, the fluid tank 4
Although the case where the heat exchange part 4d is provided inside and the path 10 having the valve A and the path 11 having the valve B are on / off controlled is shown, the present invention is not limited to this, and FIG. As shown, it is also possible to provide the heat exchange part 4d outside the fluid tank 4 and control the three-way valve 13 to switch between the path 10 and the path 11.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a cooling system used in a first embodiment.

FIG. 2 is a diagram illustrating an overall configuration of a temperature control device used in the first embodiment.

FIG. 3 is a flowchart illustrating an example of a processing procedure of the cooling system illustrated in FIG. 1;

FIG. 4 is a flowchart showing another processing procedure of the cooling system shown in FIG. 1;

FIG. 5 is a flowchart showing another processing procedure of the cooling system shown in FIG. 1;

FIG. 6 is a diagram showing a configuration of a cooling system used in a second embodiment.

FIG. 7 is a flowchart showing a processing procedure of the cooling system shown in FIG. 6;

FIG. 8 is a diagram showing a configuration in which a single fluid tank is provided.

FIG. 9 is a flowchart illustrating an example of a target temperature control procedure based on process information.

FIG. 10 is a diagram showing a configuration in a case where temperature control is performed using a three-way valve.

[Explanation of symbols]

1 ... wafer, 2 ... heater, 3 ... controller, 4
... fluid tank, 4a ... partition plate, 4b ... cooling layer, 4
c: heating layer, 4d: heat exchange section, 5: cooling section, 5a:
Compressor, 6 heater, 7 cooling chamber, 8 heat exchanger, 10, 11, 12 fluid path, A, B, C ...
Valve, 13 ... three-way valve

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kenji Okamura 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture, Komatsu Seisakusho Co., Ltd. (72) Inventor Takayoshi Endo 1200 Manda, Hiratsuka-shi, Kanagawa Pref.

Claims (6)

[Claims] 1. A temperature control device for circulating a fluid adjusted to a predetermined temperature through a temperature control chamber and cooling an object to be temperature-controlled by heat conduction with the temperature control chamber, wherein a cooling means for cooling the fluid A fluid tank that stores a fluid that is circulated and supplied to the temperature control chamber; a first path that directly supplies the fluid that has passed through the temperature control chamber to the fluid tank; A second passage for supplying the fluid to the fluid tank after cooling through the means, and the temperature control based on the fluid temperature of the fluid remaining in the fluid tank and / or the fluid temperature of the fluid passing through the temperature control chamber. Selecting means for selecting a path for supplying the fluid that has passed through the chamber to the fluid tank. 2. The fluid tank, comprising: a cooling layer for supercooling the stored fluid; and a heating layer for heating the fluid cooled by the cooling layer to a predetermined temperature, and having passed through the temperature control chamber. The temperature control device according to claim 1, further comprising a third path for supplying a fluid to a heating layer of the fluid tank. 3. The apparatus according to claim 1, wherein a path for supplying the fluid stored in the fluid tank to the temperature control chamber further includes a fourth path for bypassing the fluid that has passed through the temperature control chamber. Temperature control device. 4. A temperature control method for circulating a fluid adjusted to a predetermined temperature held in a fluid tank through a temperature control chamber and cooling an object to be temperature-controlled by heat conduction with the temperature control chamber, The fluid temperature of the fluid stored in the tank is measured, and if the measured fluid temperature is higher than a predetermined target temperature of the fluid tank, the fluid that has passed through the temperature control chamber is cooled and then supplied to the fluid tank, If the temperature is equal to or lower than the target temperature, most of the fluid that has passed through the temperature control chamber is supplied to the fluid tank as it is. 5. A temperature control method for circulating a fluid adjusted to a predetermined temperature held in a fluid tank through a temperature control chamber and cooling an object to be temperature-controlled by heat conduction with the temperature control chamber, Measuring the fluid temperature of the first fluid stored in the tank and the fluid temperature of the second fluid passing through the temperature control chamber; measuring the measured fluid temperature of the first fluid, the fluid temperature of the second fluid, and the fluid A temperature control method comprising selecting whether to cool a second fluid supplied to the fluid tank based on a predetermined target temperature of the tank. 6. A temperature control method for circulating a fluid adjusted to a predetermined temperature held in a fluid tank to a temperature control chamber and cooling an object to be temperature controlled by heat conduction with the temperature control chamber, Measuring the fluid temperature of the first fluid stored in the tank and the fluid temperature of the second fluid passing through the temperature control chamber; measuring the measured fluid temperature of the first fluid, the fluid temperature of the second fluid, and the fluid A temperature control method comprising: selecting whether to heat a fluid flowing out of the fluid tank with the second fluid based on a predetermined target temperature of the tank.