JPH11248989A - Optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device having a large number of high-yield optical systems. SOLUTION: On a 2nd optical element substrate 110b, an ultraviolet-ray setting type adhesive 140 is provided by screen printing without overlapping with 2nd CGH(computer generated hologram) elements 116b formed at a time. On this 2nd optical element substrate 110b, a 1st optical element substrate 110a where 1st CGH elements 116a are formed at a time is placed and adhered with the ultraviolet-ray setting type adhesive 140, thus forming an optical device 100 having the optical systems 130 formed together. An optical device consisting a desired number of optical system can be obtained by cutting a desired number of optical system units out of this optical device 100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, more specifically, a predetermined optical system group formed by laminating two or more optical element substrates in which optical element groups are formed in a predetermined arrangement. The present invention relates to an optical device.

[0002]

2. Description of the Related Art Recently, a computer generated hologram (Computer Gen), which is a diffractive optical element utilizing a light diffraction phenomenon, in particular, a hologram element formed using a computer.
eraded Hologram. Hereinafter, it is referred to as “CGH”. ) Research on devices has been actively conducted. C
The GH element has, for example, a characteristic that a complicated aspheric lens function can be realized on one substrate, a characteristic that a focal length, a deflection angle, and the like can be arbitrarily controlled. Also, CG
The H element has a characteristic that, for example, there is no aberration which is easily generated in a lens formed by polishing an optical material,
It also has the property that it can be realized using conventional LSI manufacturing technology.

A CGH element having such excellent characteristics is formed through a design process using a computer and a manufacturing process on an optical substrate by photolithography and etching. Here, a method of forming the CGH element will be described with reference to FIG. In FIG. 31, FIG.
31 (a) to FIG. 31 (d) are explanatory diagrams of a CGH element designing process, and FIGS. 31 (e) to 31 (h) are explanatory diagrams of a CGH element manufacturing process.

First, a design process using a computer for a CGH element will be described. The design of the CGH element can be performed by obtaining the optical path difference function of the CGH element. Here, the optical path difference function is a two-dimensional function representing an optical path difference obtained for an optical element by obtaining an optical path length along a propagation path of a light ray. Therefore, in an optical element in which the constituent materials have a uniform refractive index, the appearance of the optical element can be represented by an optical path difference function.

More specifically, the design process will be described using a CGH element 700 having a lens function as an example. The optical path difference function of the CGH element 700 can be obtained through three stages. First, in the first stage, FIG.
An optical path difference function of the lens 700a showing the appearance as shown in FIG. In addition, since the ordinary lens has a uniform refractive index of the constituent material, as described above, the appearance of the lens 700a is proportional to the optical path difference function of the lens 700a.

Subsequently, in the second stage, the lens 700
a Fresnel lens 700 having a thickness equal to the wavelength λ of light to be processed by the CGH element 700 from the optical path difference function
Find the optical path difference function of b. The Fresnel lens is
A lens that realizes substantially the same function as a normal lens by combining a plurality of concentric annular lenses using the property of a propagating light as a wave. The Fresnel lens has a practical advantage in being formed as an optical element because it is thinner and lighter than a normal lens having the same function.

The optical path difference function of the Fresnel lens 700b is
It is obtained as a function representing the fraction of the optical path difference required for the lens 700a with respect to an integral multiple of the wavelength λ. Therefore, the appearance of the Fresnel lens 700b is
31B, the portion having an optical path difference exceeding an integral multiple of the wavelength λ as shown in FIG. 31B has the omitted appearance as shown in FIG. 31C.

In the third stage, the spherical portion of each annular lens of the Fresnel lens 700b is approximated as shown in FIG. The approximation of the Fresnel lens 700b in a step shape as described above is the CGH element 70.
0. Therefore, the optical path difference function of the CGH element 700 can be obtained from the optical path difference function of the Fresnel lens 700b. When the number of steps in the approximation is increased in the third stage, the degree of approximation of the CGH element 700 to an ideal Fresnel lens is increased, and the diffraction efficiency is improved.

Next, the manufacturing process of the CGH element by photolithography and etching will be described.
In the manufacturing process of the H element, first, an etching pattern on the optical substrate and a mask pattern for realizing the etching pattern are determined based on the optical path difference function obtained in the above-described design process. Next, a CGH element is formed on the optical element substrate by sequentially repeating formation of a mask by photolithography and etching of the optical substrate.

For example, when a CGH element is formed using two (M = 2) mask patterns, FIG.
First, a groove is formed on the substrate using the first mask pattern to form a step shape of 2 ¹ = 2 steps. Next, as shown in FIG. 31 (f), using the second mask pattern, a portion not etched by the first mask pattern and a groove formed by etching using the first mask pattern. By cutting off a part of the shape, a step shape of 2 ² = 4 steps can be formed. in this way,
If M mask patterns are used, it becomes possible to form a CGH element in which a Fresnel lens is approximated to a 2 ^M -stepped shape on a substrate by etching.

FIGS. 31 (g) and 31 (h) show examples of two mask patterns necessary for forming a general CGH element having a coaxial lens function. The two mask patterns are obtained by using a computer as described above.
It can be obtained from the optical path difference function of the CGH element.

Although the CGH element having a lens function has been described above as an example, the CGH element is not limited to such a configuration. In principle, if an optical path difference function necessary for realizing a target function is obtained, any CGH element corresponding to the function can be formed. Further, a CGH element having two or more functions such as a lens and a prism can be formed. Further, since the CGH element is formed in a flat plate shape on an optical substrate by etching, it can be extremely miniaturized. At present, its typical size is several hundred microns to several millimeters.

By utilizing the features of the CGH element, particularly, the fact that it can be miniaturized and that it can be formed in a flat plate shape on a substrate, an optical device in which a predetermined number of optical system groups are collectively formed can be formed. It is possible to In such an optical device, first, an alignment mark is formed on the optical element substrate at the same time as the formation of the CGH element to assure the alignment accuracy of the CGH element, and the optical substrates are sequentially laminated based on the alignment mark. Can be formed.

Next, with respect to the conventional optical device in which the optical system is integrally formed as described above, an optical device 80 shown in FIG.
An example will be described with reference to 0. Such a conventional optical device 800
Are formed from a plurality of optical element substrates 804 on which CGH elements 802 are formed in the same arrangement pattern. As shown in FIG. 33, the optical device 800 is formed by fixing adjacent optical element substrates 802 to each other so that the arrangement of the CGH elements 802 overlap each other, and sequentially stacking a plurality of optical element substrates 802. You. As shown in FIG. 32 again, in the optical device 800, collective formation of the optical system 806 is realized by mutual alignment of the CGH elements 802 by the stack.

From the conventional optical device 800 in which optical systems are collectively formed, a plurality of optical devices each having one or a small number of optical systems 806 of the same type are individually cut out by simple dicing. Can be. As described above, if an optical device including one or a small number of optical systems is formed, an extremely large contribution can be made to mass production of optical systems.

[0016]

However, in order to form the above-mentioned conventional optical device 800, it is necessary to fix adjacent optical element substrates 804 to each other. At the time of such fixing, for example, simply applying an adhesive such as an epoxy resin to the optical element substrate 804 is not sufficient.
The adhesive spreads on the optical element substrate 804 when the four are pressed. Therefore, in the conventional optical device 800,
During the formation, there is a high possibility that the spread adhesive enters the CGH element 802 formed on the optical element substrate 804.

At present, the etching depth of the CGH element is generally about 1 to 2 μm, which is almost the same as the substrate surface. Therefore, when the adhesive is likely to enter the CGH element as in the conventional optical device 800, the possibility that the CGH element does not function as designed becomes extremely high. As a result, in the conventional optical device, there is a case where the designed optical system cannot be expected to operate as designed.

When an optical system is simply formed, for example, as shown in FIG. 34A, a large number of CGH elements 812 are collectively formed on an optical element substrate 814 as shown in FIG.
As shown in (b), a chip 8 is provided for each CGH element 812.
Then, as shown in FIG. 34C, the minute chips 818 are aligned and fixed so that the optical system 816 is formed from the CGH element 812, thereby fixing the desired optical system 816. It is possible to realize. However, in such a case, each CG forming the optical system
There is a practical problem that alignment and fixing between H elements are required for each optical system.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of a conventional optical device, and has a new and improved optical device in which a predetermined number of optical system groups that operate as designed are formed at a time. The purpose is to provide. It is another object of the present invention to provide a new and improved optical device which has a high yield, is suitable for mass production, is inexpensive and has high operation reliability.

[0020]

In order to solve the above-mentioned problems, the invention according to the first aspect is characterized in that a predetermined number of optical element substrates in which a group of optical elements are formed in a predetermined arrangement are laminated. An optical device in which an optical system group is formed, wherein adjacent optical element substrates are fixed to each other by an adhesive applied by screen printing in a region where the optical element group is not formed.

According to the first aspect of the present invention, when forming the optical device, the adhesive for fixing the optical element substrates to each other is fixed to the predetermined area where the optical element group is not formed. Applied to Therefore, on the optical element substrate, a predetermined interval can be easily maintained between each optical element constituting the optical element group and the position where the adhesive is applied. As a result, according to the first aspect of the invention, when laminating the optical element substrates, the adhesive does not spread to the optical element portion on the optical element substrate, and the spread adhesive can adhere to the optical element. Performance is reduced. That is, according to the first aspect of the invention, it is possible to realize an optical device in which an optical system group that performs an operation as designed with a high probability is formed.

According to a second aspect of the present invention, there is provided an optical device in which a predetermined optical system group is formed by laminating two or more optical element substrates each having an optical element group formed in a predetermined arrangement. A groove is formed in a region where the optical element group is not formed in the optical element substrate; adjacent optical element substrates are fixed to each other by an adhesive applied to the region;

In the second aspect of the present invention having such a configuration, when a predetermined optical system group is formed by laminating optical element substrates, the spread adhesive flows into the grooves. Therefore, the spread of the adhesive on the optical element substrate can be suppressed. As a result, according to the second aspect of the present invention, by appropriately setting the depth and size of the groove, it is possible to prevent the adhesive from spreading to the region where the optical element is formed when the optical device is formed. can do. That is, according to the second aspect of the invention, the formation of a defective optical system having no function as designed is greatly reduced, and an improvement in the yield of the optical system formed in the optical device can be expected. .

According to a third aspect of the present invention, there is provided an optical device in which a predetermined optical system group is formed by laminating two or more optical element substrates having optical element groups formed in a predetermined arrangement. The optical element substrate is provided with a through hole penetrating a region where the optical element group is not formed; adjacent optical element substrates are fixed to each other by an adhesive poured into the through hole;

According to the third aspect of the present invention having such a configuration, adjacent optical element substrates can be fixed to each other without forming an adhesive between adjacent optical element substrates when forming an optical device. . Therefore, according to the third aspect of the present invention, it is possible to form an optical device having a predetermined number of optical system groups while preventing the adhesive from entering the optical element formed on the optical element substrate. is there. That is, according to the third aspect of the present invention, it is possible to realize an optical device in which an optical system with high operation reliability is formed in a large amount in a lump.

According to a fourth aspect of the present invention, there is provided an optical device in which a predetermined optical system group is formed by laminating two or more optical element substrates having optical element groups formed in a predetermined arrangement. Adjacent optical element substrates are fixed to each other by an adhesive spacer; the adhesive spacer is disposed in a region where the optical element group is not formed;

According to the fourth aspect of the present invention having such a configuration, since the adjacent optical element substrates are fixed to each other using the bonding spacer, the optical element substrates are bonded to the optical elements formed on the optical element substrate. There is no penetration of the agent. That is, according to the invention described in claim 4, the probability that the optical system possessed by the optical device has a function as designed can be extremely increased.

Further, as in the invention according to claim 5,
If the adhesive has a configuration in which particles for spacers are mixed, the optical element substrates can be laminated and fixed while maintaining an appropriate space between adjacent optical element substrates.
Therefore, by suppressing the spread of the adhesive on the optical substrate, the yield of the optical system finally formed can be greatly improved. According to the fifth aspect of the present invention, the possibility that the optical element is damaged by contact with the facing optical element substrate is greatly reduced. As a result, according to the fifth aspect of the present invention, it is possible to realize an optical device that can be formed without considering the adhesion of the adhesive and the damage due to the contact with the optical element substrate.

The invention according to claim 6 employs a configuration in which alignment marks for alignment when the optical element substrates are laminated are formed on each optical element substrate. According to the sixth aspect of the present invention having such a configuration, alignment of an optical system having a designed function can be reliably and easily realized when an optical device is formed. Furthermore, if the optical element adopts a configuration of a computer generated hologram, as in the invention described in claim 7,
It is possible to realize an optical device in which a large number of optical systems that are fine, have no aberration, and are excellent in controllability of function formation are formed in large quantities.

Further, in the present invention, the optical element substrate is a glass substrate as in the invention of claim 8, and the adhesive is made of an ultraviolet-curable material as in the invention of claim 9. A configuration that is a mold adhesive can be employed. Further, as in the tenth aspect of the present invention,
When cutting out a predetermined number of optical system units from the optical device described in any one of 2, 3, 4.5, 6, 7, 8, and 9,
An optical device having a high yield and a low initial cost and having a predetermined number of optical systems can be realized.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which the present invention is applied to an optical device composed of two optical element substrates will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, components having substantially the same functions and configurations are denoted by the same reference numerals, and redundant description will be omitted.

(First Embodiment) First, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing a schematic configuration of a first optical element substrate 110a which is a component of the optical device 100, and FIG. 2 is a second optical element substrate 110b which is another component of the optical device 100. It is a top view which shows schematic structure of. FIG. 3 is a plan view showing a schematic configuration of a screen printing plate 120 used for bonding and fixing the first optical element substrate 110a and the second optical element substrate 110b.
FIG. 4 shows an ultraviolet-curable pressure-sensitive adhesive 1 as an adhesive by screen printing using a screen printing plate 120.
FIG. 4 is a plan view showing a second optical element substrate 110b to which a coating 40 has been applied. FIG. 5 is a perspective view showing a schematic configuration of the optical device 100 according to the present embodiment, and FIG.
FIG. 2 is an enlarged cross-sectional view of an optical system 130 formed in the optical device 100. FIG. 7 is a schematic explanatory view of a method of forming an optical device 150 according to an application example of the present embodiment.
FIG. 8 is a cross-sectional view showing a schematic configuration of the optical device 150, and FIG. 9 is a functional explanatory diagram of a certain optical network terminal.

As shown in FIG. 5, the optical device 100 according to the present embodiment includes a first optical element substrate 110a and a second optical element substrate 110b. First, the first
The optical element substrate 110a will be described with reference to FIG. 1. The first optical element substrate 110a is a disk-shaped first optical element substrate.
It is composed of a glass substrate 112a. In the first optical element substrate 110a, the first glass substrate 11
On the second glass substrate 2a, a substantially square first region 114a centered on the center of the first glass substrate 112a is formed. In the first region 114a, for example, a circular first CGH element 116a having a diameter of 500 μm, which corresponds to an optical element, is provided.
For example, they are formed in a matrix at intervals of 5 mm.

Further, the first CGH element 1 is placed on the first glass substrate 112a constituting the first optical element substrate 110a.
Four substantially cross-shaped first cross marks Ma are formed around the first region 114a where the 16a is formed.
In the first optical element substrate 110a, the first cross marks Ma are formed by chromium (Cr) evaporation, one by one, near predetermined positions on four sides surrounding the first region 114a. For example, the first cross mark Ma having a size of 50 μm × 50 μm can be formed.

Next, the second optical element substrate 110b will be described with reference to FIGS. 1 and 2. The second optical element substrate 110b shown in FIG. 2 is substantially the same as the first glass substrate 110a shown in FIG. -Shaped second glass substrate 112b
It is constituted by. The second glass substrate 112
On b, a second region 114b, a second CGH element 116a, and a second cross mark are formed in the same arrangement as the arrangement of the elements formed on the first glass substrate 112a.

In the second optical element substrate 110b, the second
Describing each element formed on the glass substrate 112b, the second region 114b is formed so as to have substantially the same size and shape as the first region 114a. Also, a second CGH element 116b corresponding to an optical element
Is formed with an etching pattern different from that of the first CGH element 116a so that the size is substantially the same as that of the first CGH element 116a. Further, the second cross mark Mb is formed by chromium evaporation so that the size and the shape are substantially the same as the first cross mark Ma.

Therefore, the first cross mark Ma of the first optical element substrate 110a and the second cross mark Ma of the second optical element substrate 110b
Using the cross mark Mb as a reference for alignment, the second
First optical element substrate 110 with respect to optical element substrate 110b
a, the first CGH element 1 sharing the optical axis
The pair of 16a and the second CGH element 116b can be formed collectively. In the present embodiment, the first
The optical system 130 (FIG. 5) is formed from a pair of the CGH element 116a and the second CGH element 116b.

Further, as shown in FIG. 2, four substantially cross-shaped third cross marks 118 are formed around the second area 114b of the second optical element substrate 110b.
Chromium is deposited near the middle point of each side surrounding b so that one side corresponds to each side. The third
The cross mark 118 can be formed, for example, in a size of 3 mm × 3 mm.

Next, the optical device 10 according to the present embodiment
The method of forming 0 will be described with reference to FIGS. FIG. 3 is a plan view showing a schematic configuration of the screen printing plate 120, and FIG. 4 is a plan view showing the ultraviolet curable adhesive 1 as described in the opening description of the present embodiment.
It is a top view which shows the 2nd optical element board 110b which applied 40 by printing. FIG. 5 is a perspective view showing a schematic configuration of the optical device 100 according to the present embodiment.

In forming the optical device 100, first,
As shown in FIG. 4, the second region 11 on the second optical element substrate 110b is formed by using the screen printing plate 120 shown in FIG.
As an adhesive, for example, an ultraviolet-curable pressure-sensitive adhesive 140 mainly containing a resin containing an ultraviolet-curing agent is applied to 4b.

As shown in FIGS. 2 and 3, a screen printing plate 120 used for forming the optical device 100 according to the present embodiment has a substantially square print area 124 and a substantially cross-shaped fourth cross mark 128. Are formed. In the screen printing plate 120, such a printing area 124 is
Second region 114 formed on second optical element substrate 110b
b has substantially the same outer shape. The fourth cross mark 128 is formed by chromium evaporation so as to have substantially the same shape as the third cross mark 118 of the second optical element substrate 110b. Further, on the screen printing plate 120, the positional relationship between the printing region 124 and the fourth cross mark 128 is substantially the same as the positional relationship between the second region 114b and the third cross mark 118 on the second optical element substrate 110b. It consists of

Therefore, the third cross mark 118 and the fourth cross mark 118
Using the cross mark 128 as an alignment mark, the screen printing plate 120 is attached to the second optical element substrate 110.
b, the printing region 128 is superimposed on the second region 114b of the second optical element substrate 110b.

Further, in the printing area 128 of the screen printing plate 120, a grid-like printing pattern is formed by arranging the square masks 124a in a matrix. In the print area 128, the square mask 12
4a shows the print area 128 in the second area 114b shown in FIG.
, The square masks 124a are formed in a matrix arrangement so as to cover one second CGH element 116b.

For example, when the diameter of the second CGH element 116b is 500 μm and the interval between the adjacent second CGH elements 116b is 5 mm, one side of the square mask 124a is formed to be 4.5 mm, for example. , The distance between adjacent square masks 124a is, for example, 1
mm.

Screen printing plate 12 having such a configuration
0, the ultraviolet curable adhesive 140 as an adhesive is screen-printed on the second optical element substrate 110b.
As shown in FIG. 4, the UV curable adhesive 140 is printed on the second optical element substrate 110b in a grid pattern. At this time, on the second optical element substrate 110b, the second CGH element 116b is arranged between the lattices of the UV-curable adhesive 140 while maintaining a predetermined distance from the UV-curable adhesive 140. Become.

Next, when forming the optical device 100,
The second UV-curable adhesive 140 is screen printed
The optical element substrate 110b and the first optical element substrate 110a shown in FIG.
b and using them as alignment marks, and superimposed on each other and crimped.

In the present embodiment, as described above,
The ultraviolet curable adhesive 140 screen-printed on the second optical element substrate 110a is applied to a portion separated from the second CGH element 116b by a predetermined distance. Therefore, the first optical element substrate 110a and the second optical element substrate 110
b, the UV-curable pressure-sensitive adhesive 140
On the optical substrate 110b, it does not extend to the second CGH element 116b.

When the optical device 100 is formed, when the first optical element substrate 110a and the second optical element substrate 110b are press-bonded as described above, ultraviolet rays are irradiated to apply the ultraviolet curable adhesive 140. Let it cure. As a result, as shown in FIG. 5, the first optical element substrate 110a and the second optical element substrate 110b are fixed in a state of being laminated on each other, and the first CGH element 11 sharing the optical axis.
6a and the second CGH element 116b form an optical system 1
The optical device 10 according to the present embodiment in which the
0 is formed.

Next, the operation of the optical device 100 according to the present embodiment formed as described above will be described with reference to FIG. FIG. 6 is a cross-sectional view of the optical system 130 formed in the optical device 100, as described in the introduction of the present embodiment.

The optical device 100 includes the second optical element substrate 11
0b input light P1 input to the optical system 130 from the lower surface side
First, the input light P1 is applied to the second optical element substrate 1
After passing through 10a, processing is performed by the second CGH element 116b. Next, after the input light P1 has passed through the first optical element substrate 110b, the optical device 100 starts the first CGH element 116.
Processing is performed in a. As a result, in the optical device 100, the processing light P2 from the upper surface side of the first optical element substrate 110a.
Output. In the optical device 100 according to the present embodiment, the processing light P2 can be generated by the above operation in each of the plurality of optical systems 130. Therefore, if the optical device 100 is used, a plurality of processing lights can be generated at a time.

As described above, in the present embodiment, the adhesive for fixing the two optical element substrates to each other is provided by an arbitrary distance from the optical element on the optical element substrate by a predetermined distance by screen printing. Can be applied. Therefore, it is possible to prevent the adhesive from entering the optical element portion in the process of laminating the optical element substrates. As a result, according to the present embodiment, it is possible to provide an optical device having an optical system formed collectively and in large quantities while preventing functional deterioration of the optical element due to adhesion of an adhesive.

The optical device 10 according to the present embodiment
0 may be cut off by a predetermined cutting device in units of a small number of optical systems 130 to form separate optical devices.
That is, according to the present embodiment, a large number of optical devices including a small number of optical systems can be formed with a high yield. This can be expected to have a great advantage in practical use. As the predetermined cutting of the optical device 100, specifically, for example, dicing by a dicing saw device can be considered.

Further, a specific example of the optical device comprising one optical system among the optical devices comprising a small number of optical systems according to the present embodiment is, for example, the case exemplified in the above description, that is, the second CGH element 110b Is 500μ in diameter
m and the distance between adjacent second CGH elements 110b is 5
In the case of mm, an optical device having one optical system 130 and having a size of, for example, 5 mm × 5 mm can be used.

Here, an application example of the present embodiment to an optical network terminal will be described with reference to FIGS. As an application example of the present embodiment, an optical device 160 will be described as an example. 7 is a schematic explanatory view of a method of forming the optical device 160, and FIG. 8 is a cross-sectional view illustrating a schematic configuration of the optical device 160, as described at the beginning of this embodiment. And FIG. 9 are explanatory diagrams of the functions of the optical network terminal.

In recent years, a so-called fiber-to-the-home (Fiber-to-the-Home) system in which an optical fiber is laid to each home or business office
er to the home. Hereinafter, it is referred to as “FTTH”. Is attracting attention because it enables high-speed exchange of multimedia information such as video and audio in an optical communication network. The application example of the present embodiment described here is an application example to an optical network terminal provided at the end of an optical communication network in each home or office when realizing such FTTH.

In the communication network system, the network terminal must have both a function of extracting a predetermined signal from the transmitted signals and a function of transmitting a signal to the network body. In order to realize FTTH, an optical network terminal having a function required for such a network termination for an optical signal is required.

According to the knowledge of the inventors, as an optical network terminal having a function necessary for terminating the network, for example, a terminal device 150 having a schematic function shown in FIG.
Can be considered. The terminal device 150 is a device that can transmit and receive an optical signal corresponding to an audio signal, for example, having a wavelength of 1.3 μm, and receive an optical signal corresponding to a video signal, for example, having a wavelength of 1.55 μm. Yes, it is mainly composed of a wavelength demultiplexer 152 and an optical coupler 154.

When the optical signal S is input to the terminal device 150, first, it is separated into a video signal Sa and an audio signal Sb by the wavelength demultiplexer 152, and then separately after the wavelength demultiplexer 152. Is output. Of the two optical signals output from the wavelength demultiplexer 152, the video signal Sa
Is output to the video device V.

On the other hand, the audio signal Sb, which is the other optical signal output from the wavelength demultiplexer 152, is input to the optical coupler 154, is further divided into two by the optical coupler 154, and is divided into a photodiode PD as a light receiver. It is output to a semiconductor laser diode LD as a light source.

Further, the 1.3 μm wavelength audio signal Sc output from the semiconductor laser diode LD is transmitted from the terminal device 150 to the network main unit through the optical coupler 154 and the wavelength demultiplexer 152 in order. You. As a result, the terminal device 150 realizes bidirectionality with respect to the audio signal.

As shown in FIG. 8, an optical device 160 according to an application of the present embodiment includes a first glass block 162, a second glass block 164, and a third glass block, each of which corresponds to an optical element substrate. With the configuration in which the blocks 166 are sequentially stacked by the method according to the present embodiment,
The function as the optical network terminal described above is realized.

The optical device 160 has a total of five CGs.
An H element is formed. First, the second glass block 1
On the surface that is in contact with the first glass block 162, a first CGH lens having the same etching pattern
A CGH element 164a and a second CGH element 164b are formed. On the surface of the third glass block 166 that is in contact with the second glass block 164, a third CGH element 166a, which is a CGH optical coupler corresponding to an optical coupler, is formed. Further, on the surface of the third glass block 166 on the side opposite to the second glass block 164, a CGH lens having the same etching pattern as the fourth glass block 164 is formed.
The GH element 166b and the fifth CGH element 166c are formed. The optical device 160 includes the five CGs.
In addition to the H element, a wavelength filter 164c corresponding to a wavelength demultiplexer is formed on a surface of the second glass block 164 in contact with the third glass block 166. The wavelength filter 164c reflects light of 1.55 μm,
Is transmitted.

The optical device 160 having the above configuration
The first optical element substrate 172 and the second optical element substrate 172, as shown in FIG.
By laminating the optical element substrate 174 and the third optical element substrate 176 by the method according to the present embodiment, a large amount can be formed. That is, first, a first optical element substrate, a second optical element substrate 174 in which a CGH lens 174A is formed in a matrix on the upper surface and a wavelength filter 174B is formed in a lower surface, and a CGH optical coupler 176A is formed in a matrix on the upper surface. And CG on the bottom
A third optical element substrate 176 in which H lenses 176B are formed in a matrix is formed. Next, the second optical element substrate 1
An adhesive is applied to the upper surface of the substrate 74 and the upper surface of the third optical element substrate 176 by screen printing according to the present embodiment, respectively. Further, the lower surface of the second optical element substrate 174 is bonded to the upper surface of the third optical element substrate 176, and the lower surface of the first optical element substrate 172 is bonded to the upper surface of the second optical element substrate 174. To form an optical device. Finally, a plurality of optical devices 16 are removed from the optical device in which the optical system is collectively formed by a predetermined cutting device.
Zero can be cut out.

When the optical device 160 is formed in a lump as described above, the CGH lens 174A is connected to the first CGH element 164.
a and the second CGH element 164b.
74B becomes the wavelength filter 164c. Further, the CGH optical coupler 176A becomes the third CGH element 166a,
The GH lens 176B is connected to the fourth CGH element 166b and the fifth CGH element 166b.
It becomes the CGH element 166c.

In the optical device 160 configured as described above, when the optical signal S is input from the input optical fiber 160a into the first glass block 162 as shown in FIG. The light propagates to the first CGH element 164a via the inside of the first CGH element 164a. In the first CGH element 164a, the optical signal S is converted into a parallel light and input into the second glass block 164. Further, the optical signal S propagates through the second glass block 164 to the wavelength filter 164c,
By 4c, the video signal Sa having a wavelength of 1.55 μm and the audio signal Sb having a wavelength of 1.3 μm are separated.

Of the separated optical signals, the video signal Sa is converted by the wavelength filter 164c into the second glass block 164.
The light is reflected to the side and output from the second CGH element 164b to the first glass block 162. Further, the video signal Sa is
The optical device 160 is provided through the first glass block 162.
Is output to the output optical fiber 160b.

The audio signal Sb, which is another optical signal after the separation, passes through the wavelength filter 164c and is split into two by the third CGH element 166a. Further, the bisected audio signal Sb is transmitted through the third glass block 166 to the fourth CGH element 166b and the fifth CGH element 166.
c, and is output from the fourth CGH element 166b and the fifth CGH element 166c to the outside of the optical device 160.

Further, of the audio signals Sb, the audio signal Sb output from the fourth CGH element 166b to the outside of the optical device 160 is the photodiode P serving as a light receiver.
Entered into D. The audio signal Sb output from the fifth CGH element 166c to the outside of the optical device 160 is input to a semiconductor laser diode LD as a light source.

In the optical device 160, when the audio signal Sc from the semiconductor laser diode LD is input from the fifth CGH element 166c, the audio signal Sc becomes
The light is collimated by the fifth CGH element 166c and passes through the inside of the third glass block 166 to the third CGH element 16c.
6a. Further, the audio signal Sc propagated to the third CGH element 166a passes through the wavelength filter 164c and is input to the second glass block 164. Furthermore, the audio signal Sc propagates through the second glass block 164 to the first CGH element 164a, and further, the first CGH element 164a.
The light is output from the GH element 164a to the input optical fiber 160a outside the optical device 160 via the first glass block 162. By a series of operations described above, the optical device 160 according to the application example of the present embodiment can realize a function as an optical network terminal.

(Second Embodiment) Next, the second embodiment of the present invention will be described.
The embodiment will be described mainly with reference to FIG. FIG. 10 is a partial cross-sectional view showing a characteristic portion of the optical device 200 according to the present embodiment. The optical device 200 according to the present embodiment has basically the same configuration as the optical device 100 according to the first embodiment shown in FIGS. That is, as shown in FIG. 10, in the optical device 200 according to the present embodiment, the first optical element substrate 110a and the second optical element substrate 110b use the screen printing plate 120 (FIG. 3) to form the second optical element substrate 110a. The optical system 230 is formed by being bonded on the element substrate 110b by an adhesive printed on the screen.

However, the optical device 2 according to the present embodiment
00, as shown in FIG. 10, the first optical element substrate 11
As an adhesive for fixing the optical element 0a and the second optical element substrate 110b to each other, an adhesive 240 mixed with spacer particles 240a is used. This is different from the optical device 100 according to the first embodiment, which uses the ultraviolet curing adhesive 140 as shown in FIG. The pressure-sensitive adhesive 240 used in the optical device 200 is adjusted by mixing and dispersing the spacer particles 240a in the UV-curable pressure-sensitive adhesive 240b mainly composed of a resin containing a UV-curable agent. In the present embodiment, for example, a spherical glass having a diameter of 9 μm is used as the spacer particles 240a.
The adhesive 240 can be prepared by mixing 5% by weight.

The spacer particles 240a function as spacers interposed between the first optical element substrate 110a and the second optical element substrate 110b when they are pressed against each other. Therefore, it is necessary to have a hardness at least not to be crushed by crimping. Further, it is desirable that the spacer particles 240a have the same size in view of the function as the spacer.

The operation of the optical device 200 according to this embodiment having such a configuration is similar to that of the optical device 100 according to the first embodiment shown in FIG. First, the input light P1 input from the lower surface side of the first optical element substrate 110a is processed by the second CGH element 116b, and then processed by the first CGH element 116a. Output.

As described above, according to the present embodiment, similarly to the first embodiment, when forming an optical device in which the optical system is formed collectively, the adhesive is applied to the optical element portion. Intrusion can be prevented. Therefore, according to the present embodiment, it is possible to improve the yield of the optical system formed in a large amount in the optical device at one time. Also,
According to the present embodiment, by improving the yield, an optical device in which a large number of optical systems are formed is used to cut out separate optical devices in units of a small number of optical systems, thereby initializing an optical device including a small number of optical systems. Cost can also be reduced.

Further, according to the present embodiment, the spacer particles are mixed and dispersed in the adhesive for screen printing on the optical element substrate. Therefore, according to the present embodiment, the distance between the optical element substrates is kept constant by the spacer particles. As a result, the spread of the adhesive on the optical element substrate can be suppressed, and the possibility that the optical element is damaged by contact with the optical element substrate can be reduced. That is, according to the present embodiment, in an optical device formed by aligning and fixing optical element substrates formed collectively, it is possible to further improve the yield of an optical system formed in large quantities. it can.

(Third Embodiment) Next, a third embodiment will be described with reference to FIG. 1 and FIGS. FIG. 11 is a plan view showing a schematic configuration of a third optical element substrate 310b which is a characteristic component of the optical device 300 according to the present embodiment, and FIG. FIG. 2 is a perspective view showing a schematic configuration of an apparatus 300. FIG. 13 shows the optical device 30 being formed.
FIG. 14 is a partial sectional view of an optical system 330 of the optical device 300. FIG.

As shown in FIG. 12, the optical device 300 according to the present embodiment is a first optical element substrate 1 constituting the optical device 100 according to the first embodiment shown in FIG.
10a and the third optical element substrate 31 according to the present embodiment
0b. Third embodiment of the present invention
The optical element substrate 310b will be described in comparison with FIG. 11 and FIG. 1. The third optical element substrate 310b is a first glass substrate 11 that constitutes the first optical element substrate 110a.
Third glass substrate 3 having substantially the same size and shape as 2a
12b.

In the third optical element substrate 310b, the first optical element substrate 1 is placed on the first glass substrate 112a.
Each element is formed in the same positional relationship as that of each element formed on the first glass substrate 112a of 10a. That is, in the third optical element substrate 310b, the substantially square third region 314b corresponds to the first optical element substrate 110.
a is formed on the third glass substrate 312b with substantially the same size and shape as the first region 114a. Also,
In the third optical element substrate 310b, the third CGH element 316b corresponding to the optical element is the first CGH element 116a.
Are formed on the third glass substrate 312b with an etching pattern different from that of the first CGH element 116a so that the sizes are substantially the same. Furthermore, on the third optical element substrate 310b, the substantially cross-shaped third cross mark Mc is formed by chromium evaporation so as to have a size and shape with respect to the first cross mark Ma.

Therefore, the third optical element substrate 110b and the first optical element substrate 110a are connected to the first CGH element sharing the optical axis by using the first cross mark Ma and the third cross mark Mc as alignment marks. 1
16a and the third CGH element 316b can be overlapped so as to be formed collectively.

Further, as shown in FIG. 11, the third optical element substrate 310b according to the present embodiment is formed on the third glass substrate 312b by using a predetermined cutting device, for example, a dicing saw device. A straight dicing groove 320 is formed from one end of the three glass substrate 312b to the other. In the third optical element substrate 310b, the dicing groove 320 is formed in the matrix of the third CGH element 31.
In the arrangement of FIG. 6b, two pairs are formed almost in parallel between adjacent rows. In addition, dicing groove 3
Reference numerals 20 are also formed in parallel with each other in pairs between adjacent rows in the arrangement of the third CGH elements 316b.

When forming the optical device 300 according to the present embodiment, first, as shown in FIG. 13, an ultraviolet curing type The adhesive 140 is applied in a predetermined amount, for example, drop by drop. Further, a first cross mark Ma (FIG. 1) and a third cross mark Mb (FIG.
Positioning is performed so that 1) completely overlaps with 1). Furthermore, the first optical element substrate 110a and the third optical element substrate 3
10b is overlapped and crimped. Furthermore, the ultraviolet curing type adhesive 140 is cured by irradiation of ultraviolet rays,
First optical element substrate 110a and third optical element substrate 310b
And mutually fixed. Optical device 3 according to the present embodiment
00 is formed through such a series of processes.

As shown in FIG. 14, in the present embodiment, the first optical element substrate 110a and the third optical element substrate 3
The UV-curable adhesive 140 spread on the third optical element substrate 320b at the time of pressure bonding with the dicing groove 32b.
Flow into 0. Therefore, in the optical device 300, if the depth, width, and the like of the dicing grooves 320 are properly set, the ultraviolet curable adhesive 140 is prevented from spreading beyond the dicing grooves 320 between the paired dicing grooves 320. can do. That is, in the optical device 200, the ultraviolet curable adhesive 140 is used as the third CGH element 3.
It is possible not to spread until 16b.

At the time of operation of the optical apparatus 300 according to the present embodiment formed as described above, the third
Input light P input from the lower surface side of the optical element substrate 110b
1 is first processed by the third CGH element 316b, then processed by the first CGH element 116a, and output from the upper surface side of the first optical element substrate 110a as processing light P4. Note that the optical device 300 according to the present embodiment also has the optical system 3
Since the light can be processed in 30 units, a plurality of processed lights can be generated collectively as in the optical device 100 according to the first embodiment.

As described above, according to the present embodiment, by forming the dicing groove on the optical element substrate, even if the optical element substrates are pressed against each other at the time of bonding, excess adhesive flows into the groove. . That is, according to the present embodiment, the excess adhesive is evacuated to the dicing groove,
The possibility that the adhesive enters the optical element portion can be reduced. Therefore, it is possible to increase the yield of the optical system formed in a large amount in the optical device at one time,
Furthermore, it is possible to reduce the initial cost of an optical device formed by a small number of optical system units. as a result,
According to the present embodiment, it is possible to realize an optical device that can provide a large amount of optical systems at low cost.

In the present embodiment, the size of the dicing groove is determined in consideration of the size of the optical element formed on the optical element substrate and the amount of the adhesive to be applied.
For example, when exemplified in the description of the first embodiment, that is, when the size of the optical element formed on the optical substrate is 500 μm in diameter and the distance between adjacent optical elements is 5 mm, The dicing groove may be formed, for example, to have a depth of 0.6 mm and a width of 0.4 mm, and the interval between the paired dicing grooves may be, for example, 1.5 mm.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. FIG. 15 shows a first optical element substrate 410a which is a component of the optical device 400 according to the present embodiment.
FIG. 16 is a plan view showing a schematic configuration of the optical device 4.
FIG. 14 is a plan view showing a schematic configuration of a second optical element substrate 410b, which is another component of 00. FIG. 17 is a perspective view showing a schematic configuration of an optical device 400 according to the present embodiment, and FIGS. 18 and 19 are partial cross-sectional views near an optical system 430 formed in the optical device 400.

The basic configuration of the optical device 400 according to the present embodiment shown in FIG. 15 and the basic configuration of the optical device 100 according to the first embodiment shown in FIG. A CGH element group, which is an optical element, is formed on the element substrate in an array pattern of substantially the same matrix, and two optical element substrates are stacked so that the arrangement patterns of the CGH elements overlap each other. Thus, they are the same in that an optical system is formed.

On the other hand, the optical device 40 according to the present embodiment
In No. 0, an adhesive for fixing the two optical element substrates to each other is poured into through holes formed in each optical element substrate. This is the point of the basic configuration of the optical device 400 according to the present embodiment and the above-described configuration in which the adhesive for fixing the two optical element substrates to each other is interposed between the two optical element substrates as shown in FIG. Optical device 10 according to first embodiment
0 is different from the basic configuration.

Here, the optical device 4 according to the present embodiment
00 will be described. As shown in FIG. 15, in a first optical element substrate 410a, which is one of the optical element substrates of the optical device 400, a disk-shaped first glass substrate 412 is provided.
A substantially square first region 414a centered on the center of the first glass substrate 412a is formed on a. Further, in the first optical element substrate 410a, the first region 41
4a has an optical element, for example, a diameter of 500 μm.
Are formed in a matrix at intervals of, for example, 4 mm.

Further, in the first optical element substrate 410a, four first cross marks Md having a size of, for example, 50 μm × 50 μm are provided around the first region 414a on the first glass substrate 412a. Each of the four sides of the region 414a is formed by chromium evaporation corresponding to one of the four sides.

Further, in the first optical element substrate 410a, each first CGH element 41 is provided in the first region 418a.
A first through hole 420a is formed at a predetermined position around 6a using, for example, a laser. Specifically, for example, when the diameter of the first CGH element 416a is 500 μm and the distance between the adjacent first CGH elements is 4 mm, for example, the through hole 420a is formed in the first region 418.
On a straight line connecting each first CGH element in a direction parallel to the diagonal line of a, on both sides of the first CGH element 416a 1 mm away from the center of the first CGH element 416a, with a diameter of 400 μm,
Can be formed.

On the other hand, as shown in FIGS. 15 and 16, the second optical element substrate 410b has a second glass substrate 412b having substantially the same size and shape as the first glass substrate 412a.
It is constituted by. In the second optical element substrate 410b, a substantially square second region 414b is placed on the second glass substrate 410b in the same arrangement relationship as that of each element formed on the first glass substrate 412a. A second CGH element 416b corresponding to the element, a second cross mark Me having a substantially cross shape, and a second through hole 420b are formed.

In the second optical element substrate 410b, the second
The second region 414b formed on the glass substrate 410b is
The first region 414a is formed with substantially the same size and shape. In the second optical element substrate 410b, the second CGH element 416b is replaced with the first CGH element 416.
This is formed so as to have substantially the same size with a different etching pattern for a. Furthermore, the second cross mark Me is formed by substantially the same vapor deposition method so as to have the same size and shape as the first cross mark Md, and the second through-hole 420b is formed in the first through-hole 420a. On the other hand, they are formed by the same forming method so that they have substantially the same size.

Therefore, the first cross mark Md of the first optical element substrate 410a and the second cross mark Md of the first optical element substrate 410b
Using the cross mark Me as the alignment mark,
By aligning the optical element substrate 410b and the first optical element substrate 410a, the first C
A pair of the GH element 416a and the second CGH element 416b can be formed collectively. Further, in the present embodiment, when the first optical element substrate 410a and the second optical element substrate 410b are aligned as described above, the first penetrating element 416a and the second CGH element 416b are superimposed and the first The hole 420a and the second through hole 420b overlap.

When forming the optical device 400 according to the present embodiment, first, the first optical element substrate 410a and the second
By performing such alignment with the optical element substrate 410b, as shown in FIG. 18, an optical system 430 is formed from one first CGH element 416a and one second CGH element 416b, and one first through hole 420a is formed. One second through hole 4
20b to form a through-hole 420.

Further, when the optical device 400 is formed, as shown in FIG. 19, a through-hole 420 is coated by a coating device (not shown) with a resin containing an ultraviolet curing agent as a main component. The ultraviolet curable pressure-sensitive adhesive 440 to be poured is poured, and the ultraviolet curable pressure-sensitive adhesive 440 is cured by irradiation of ultraviolet rays. As a result, the first optical element substrate 410a and the second optical element substrate 410b are fixed to each other, and the optical device 400 according to the present embodiment shown in FIG.
Is formed.

As shown in FIG. 19, during operation of the optical device 400 formed as described above, the second
Input light P input from the lower surface side of the optical element substrate 410b
1 is first processed by the second CGH element 416b,
Next, processing is performed by the first CGH element 416a, and the processing light P
Is output from the upper surface side of the first optical element substrate 410a. Since the optical device 400 according to the present embodiment can process light in units of the optical system 430, similarly to the optical device 100 according to the first embodiment, a plurality of processing lights are collectively processed. Can be generated.

As described above, according to the present embodiment, the adhesive for fixing the optical element substrates is not applied to the optical element substrates but is poured into the through holes. Therefore, the adhesive does not enter the optical element portion formed on the optical element substrate. As a result, according to the present embodiment, particularly in terms of yield, it is possible to improve the productivity of the optical device in which the optical systems are collectively formed.

Further, according to the present embodiment, an optical device formed by cutting out an optical system unit or a small number of optical system units from an optical device in which optical systems are collectively formed can be manufactured at a low cost and in a large number. Can be provided. It should be noted that the case described in the description of the present embodiment, that is, when the optical element is 4
It is formed at a distance of 1 mm from the center of the optical element.
Is formed from the optical device according to the present embodiment, for example, 4 mm ×
An optical device composed of one optical system on a 4 mm scale can be cut out.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. FIG. 20 shows a first optical element substrate 510 which is a component of the optical device 500 according to the present embodiment.
21A is a plan view showing a schematic configuration of FIG. 21A, and FIG. 21 is a second optical element substrate 510b which is another component of the optical device 500.
It is a top view which shows schematic structure of. FIG. 22 shows a first optical element substrate 510 for forming the optical device 500.
FIG. 9 is a plan view showing a schematic configuration of an adhesive plate 520 used when bonding and fixing the second optical element substrate 510b to the second optical element substrate 510b;
FIG. 23 is a plan view showing a second optical element substrate 510b on which an adhesive plate 520 is overlapped. FIG. 24 is a perspective view illustrating a schematic configuration of an optical device 400 according to the present embodiment, and FIG. 25 is a partial cross-sectional view near an optical system 430 formed in the optical device 500.

The basic configuration of the optical device 500 according to the present embodiment shown in FIG. 24 and the basic configuration of the optical device 100 according to the first embodiment shown in FIG. 5 are firstly constituent elements. A CGH element group, which is an optical element, is formed on two optical element substrates in a matrix arrangement pattern substantially identical to each other. Second, the two CGH element groups are arranged such that the arrangement patterns of the CGH elements overlap each other. This is the same in that an optical element substrate is aligned and an optical system is formed.

On the other hand, the basic configuration of the optical device 500 according to the present embodiment shown in FIG. 21 and the basic configuration of the optical device 100 according to the first embodiment shown in FIG. In the optical device 100 according to the embodiment, 2
While the two optical element substrates are fixed to each other by an adhesive interposed between the two optical element substrates, in the optical device 500 according to the present embodiment, the two optical element substrates are: The difference is that they are fixed to each other by an adhesive plate 520 corresponding to an adhesive spacer interposed between the two optical element substrates.

As shown in FIG. 24, an optical device 500 according to the present embodiment includes a first optical element substrate 510a and a second optical element substrate 510b as optical element substrates. As shown in FIG. 20, the first optical element substrate 510a
In, a substantially square first region 514a centered on the center of the first glass substrate 512a is formed on the disk-shaped first glass substrate 512a. Further, in the first optical element substrate 510a, the first region 512a includes, for example, the first C corresponding to a circular optical element having a diameter of 500 μm.
The GH elements 516a are formed in a matrix at intervals of, for example, 4 mm.

Further, in the first optical element substrate 510a, two first cross marks Mf having a size of, for example, 50 μm × 50 μm are provided around the first region 514a on the first glass substrate 512a. Competing 2 in region 414a
It is formed by chromium evaporation corresponding to each one of the sides.

As shown in FIGS. 20 and 21, the second optical element substrate 510b is formed of a second glass substrate 512b having substantially the same shape as the first glass substrate 512a. In the second optical element substrate 510b, the second
On the glass substrate 512b, a substantially square second region 514b and a second C corresponding to an optical element are arranged in the same arrangement relationship as that of each element formed on the first glass substrate 512a.
A GH element 516b and a substantially cross-shaped second cross mark Mg are formed. In the second optical element substrate 510b, the second region 5 formed on the second glass substrate 512b
14b is formed in substantially the same size and shape as the second region 514a shown in FIG. Further, in the second optical element substrate 510b, the second CGH element 516b formed on the second glass substrate 512b has substantially the same size as the first CGH element 516a shown in FIG. Is formed. Further, in the second optical element substrate 510b, the second cross mark Mg formed on the second glass substrate 512b is shown in FIG.
The first cross mark Mf shown in FIG. 0 is formed in a size, a shape, and a vapor deposition method.

Further, as shown in FIG. 21, in the second optical element substrate 510a, the second glass substrate 512a
At the periphery of the second region 514b formed thereon, for example, two third cross marks 518 each having a size of 3 mm × 3 mm are provided.
Are formed. The third cross mark 518 having a substantially cross shape corresponds to the second cross mark Mg which does not correspond to the second cross mark Mg.
Each one is formed near the midpoint of two opposing sides of the region 514b.

Furthermore, the optical device 5 according to the present embodiment
00 is the first optical element substrate 510a and the second
In order to fix the optical element substrate 510b to each other, an adhesive plate 520 shown in FIG. 22 corresponding to an adhesive spacer is provided. The adhesive plate 520 is made of, for example, stainless steel, and on both surfaces thereof, an ultraviolet curable adhesive mainly composed of a resin containing an ultraviolet curable agent is applied.

Further, the adhesive plate 520 has a square window 524.
An adhesive plate region 524 in which a is formed in a matrix and a fourth cross mark window 528 having a size of, for example, 3 mm × 3 mm located near the midpoint of two opposing sides in the outer shape of the region 524 are formed. . The size and shape of the adhesive plate area 528 are determined by the adhesive plate 520 and the second optical element substrate 5.
10b is set so as to overlap the second region 514b when the third cross mark 518 and the fourth cross mark window 528 are stacked as alignment marks. Also, the square window 52 formed in the adhesive plate region 528
The formation pattern of 4a is such that when the adhesive plate 520 and the second optical element substrate 510b are laminated using the third cross mark 518 and the fourth cross mark window 528 as alignment marks, each square window is formed. 2nd C one by one from
The GH element 516b has a matrix shape so that it can be seen.

For example, when the diameter of the second CGH element 516b is 500 μm and the distance between the adjacent second CGH elements 516b is 4 mm, the square window 52
One side of 4a may be formed, for example, at 4.5 mm, and the space between adjacent square windows 524a may be formed at, for example, 1 mm.

When forming the optical device 500 according to the present embodiment including the components described above, first, as shown in FIG. 23, the third cross mark 518 and the fourth cross mark 518 are formed.
Using the cross mark window 528 as an alignment mark,
The adhesive plate 520 is overlaid on the second optical element substrate 510b.

Next, the first optical element substrate 510a is overlaid on the second optical element substrate 510b on which the adhesive plate 520 is overlaid, using the first cross mark Mf and the second cross mark Mg as alignment marks. Further, by irradiating ultraviolet rays from the first optical element substrate 510a side and the second optical element substrate 510b side, the ultraviolet curable adhesive applied to the adhesive plate 520 is cured, and the first optical element substrate 510a and When the second optical element substrate 510b is fixed to each other, the optical device 500 according to the present embodiment shown in FIG. 24 is formed.

As shown in FIG. 25, when the optical device 500 according to the present embodiment configured as described above operates, the input light P1 input to the optical system 530 from the lower surface side of the second optical element substrate 510b. Is the second CGH element 5
16b, and then processed by the first CGH element 516a, and the first optical element substrate 51 as processing light P8.
0a is output from the upper surface side. Since the optical device 500 according to the present embodiment can also process light in units of the optical system 530, a plurality of processes are performed similarly to the optical device 100 according to the first embodiment shown in FIG. Light can be generated collectively.

As described above, according to the present embodiment, when fixing the optical element substrates to each other, an adhesive spacer is used without using an adhesive. Therefore, also in the present embodiment, the adhesive does not enter the optical element portion formed on the optical element substrate. As a result, according to the present embodiment, particularly in terms of yield, it is possible to improve the productivity of the optical device in which the optical systems are collectively formed.

Further, according to the present embodiment, an optical device formed by cutting out one or several optical system units from an optical device in which an optical system is collectively formed can be produced at a low cost and in large quantities. Can be provided. Specifically, in the case described in the description of the present embodiment, that is, when the optical element is 4 m
If the through holes are formed with a diameter of 500 μm at m intervals and the through holes are formed with a diameter of 400 μm at a position 1 mm away from the center of the optical element, the optical device according to the present embodiment may be 4 mm × 4 mm An optical device consisting of one optical system of a scale can be cut out by a cutting device.

(Sixth Embodiment) Next, the sixth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. FIG. 26 shows an optical device 600 according to the present embodiment as a first optical element substrate 610a as a constituent element.
FIG. 27 is a plan view showing a schematic configuration of the optical device 6.
FIG. 14 is a plan view showing a schematic configuration of a second optical element substrate 610a which is another component of 00. FIG. 28 shows a quartz glass plate 62 serving as an adhesive spacer according to the present embodiment.
FIG. 29 is a plan view showing a second optical element substrate 610b on which the optical device 600 is mounted, and FIG. 29 is a perspective view showing a schematic configuration of the optical device 600. FIG. 30 is a partial cross-sectional view near the optical system 630 of the optical device 600.

The optical device 600 according to the present embodiment shown in FIG. 29 is different from the optical device 500 shown in FIG. 24 according to the fifth embodiment in that two optical element substrates on each of which a CGH element group is formed. However, they are the same in that they are configured to be stacked via an adhesive spacer.

However, the optical device 600 according to the present embodiment shown in FIG. 29 is different from the optical device substrate in that the optical element substrate is formed of a quartz substrate and the bonding spacer is a band-shaped quartz glass plate. This is different from the optical device 500 according to the fifth embodiment shown in FIG. 24, which is formed of a glass substrate and in which the bonding spacer is a single plate-like bonding plate.

First, the optical device 60 according to the present embodiment
0 for the first optical element substrate 610a constituting FIG.
This will be described with reference to FIG. First optical element substrate 610a
, The first quartz substrate 612a having a disc shape
First region 614 centered on the center of quartz substrate 612a
a is formed. Further, in the first element substrate 612a, a first region 614a corresponds to an optical element.
For example, a circular first CGH element 616a having a diameter of 500 μm
Are formed in a matrix at intervals of, for example, 4 mm.

Further, in the first optical element substrate 610a, two first cross marks Mh having a size of, for example, 50 μm × 50 μm are provided around the first region 614a on the first quartz substrate 612a. The two opposite sides of the region 614a are formed by chromium evaporation, one for each.

As shown in FIGS. 26 and 27, the second optical element substrate 610b, which is the other optical element substrate in the optical device 600 according to the present embodiment, has substantially the same shape as the first quartz substrate 612a. Of the second quartz substrate 612b. In the second quartz substrate 612a, the first quartz substrate 612 is placed on the second quartz substrate 612b.
A substantially square second region 614b, a second CGH element 616b corresponding to an optical element, and a substantially cross-shaped second cross mark Mi are formed in the same arrangement relationship as the arrangement relationship of each element formed on a. I have.

In the second optical element substrate 610b, the second
The second region 614b formed on the quartz substrate 612b is
The first region 614a shown in FIG. 26 has substantially the same size and shape as the first region 614a. In the second optical element substrate 610b, the second CGH element 616b formed on the second quartz substrate 612b is the first CGH element shown in FIG.
The element 616a is formed so as to have substantially the same size and a different etching pattern from the element 616a. Further, in the second optical element substrate 610b, the second cross mark Mi formed on the second quartz substrate 612b is replaced with the first cross mark M
The size, shape, and vapor deposition method are substantially the same as h.

When the optical device 600 according to the present embodiment is formed, the first optical element substrate 610a and the second optical element substrate 6 composed of the quartz substrate as described above are used.
10b are bonded using a plurality of strip-shaped quartz glass plates 620. The quartz glass plate 6 according to the present embodiment.
Reference numeral 20 denotes a configuration in which a strip-shaped quartz glass having a width of, for example, 2 mm and a thickness of, for example, 0.5 mm is coated with an ultraviolet-curable adhesive mainly composed of a resin containing an ultraviolet-curing agent.

As shown in FIG. 28, when forming the optical device 600 according to the present embodiment, first, the second CGH element 61 is placed on the second region 614 b of the second optical substrate 620.
A plurality of quartz glass plates 620 are placed at intervals of, for example, 2.5 mm so that one plate is arranged between each row in the matrix arrangement of 6b. Further, when the optical device 600 is formed, the first optical element substrate 610a on which the quartz glass plate 620 is mounted is placed on the first optical element substrate 610a shown in FIG.
The optical element substrate 610a is laminated using the second cross mark Mi and the first cross mark Mh as alignment marks. Furthermore, the laminated first optical element substrate 61
The quartz glass substrate 620 is irradiated with ultraviolet rays from the side of the Oa and the side of the second optical element substrate 610b. As a result, FIG.
As shown in (1), an optical device 600 according to the present embodiment in which a plurality of optical systems 630 are collectively formed is formed.

As shown in FIG. 30, when the optical device 600 having the above-described configuration according to the present embodiment operates, the input light P1 input from the lower surface of the second optical element substrate 610b to the optical system 630. Is the second CGH element 6
16b, and then processed by the first CGH element 616a, the first optical element substrate 61 as processing light P9.
0a is output from the upper surface side. Since the optical device 600 according to the present embodiment can also process light in units of the optical system 630, a plurality of processes are performed similarly to the optical device 100 according to the first embodiment shown in FIG. Light can be generated collectively.

As described above, according to the embodiment of the present invention, adjacent optical substrates are arranged on the optical element substrate by using a band-shaped plate coated with an adhesive corresponding to an adhesive spacer. Glued. Therefore, even when laminating the optical element substrates, the adhesive is applied only to the strip-shaped plate, so that the adhesive does not spread on the optical element substrate and prevents the adhesive from entering the CGH element portion. I can do it. As a result, according to the present embodiment, it is possible to realize an optical device in which optical systems are collectively formed by collectively aligning optical elements without reducing the yield of the optical systems.

Further, the band-shaped plate used in the present embodiment does not require any processing such as perforation which was necessary for the adhesive plate used in the fifth embodiment.
Therefore, according to the present embodiment, the cost of the optical device can be reduced as compared with the fifth embodiment. Also,
Since a long plate can be easily obtained, it is possible to bond four or more optical element substrates simultaneously using the long plate.
According to the present embodiment, a plurality of optical devices themselves can be formed collectively.

From the optical device according to the present embodiment, an optical device composed of a small number of optical system units and an optical device composed of one optical system unit can be easily formed.
For example, from the optical device 600 according to the present embodiment,
If dicing is performed by a predetermined cutting method, for example, using a dicing saw device, for example, 1 mm having a size of 4 mm × 4 mm can be obtained.
An optical device composed of a plurality of optical systems can be obtained.

As described above, the preferred embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to such configurations. Within the scope of the technical idea described in the appended claims, those skilled in the art will be able to conceive various changes and modifications, and those changes and modifications are also within the technical scope of the present invention. It is understood that it belongs to.

For example, in the above embodiment, the optical device formed by performing screen printing of an adhesive on a lattice pattern has been described as an example, but the present invention is not limited to such a configuration. The present invention can also be applied to an optical device formed by performing screen printing of an adhesive on other various patterns, for example, a pattern having a circular shape or a stripe pattern.

In the above embodiment, the optical device using glass particles as spacer particles has been described as an example, but the present invention is not limited to such a configuration. The present invention can also be applied to an optical device using particles made of other various materials, for example, alumina particles, zirconia particles, plastic particles, and the like as spacer particles. The spacer particles used in the present invention need only be rigid particles that are insoluble in the solvent used for the adhesive, and the material thereof is not particularly limited.

Further, in the above embodiment, the optical device using spherical spacer particles has been described as an example, but the present invention is not limited to such a configuration. The present invention can be applied to an optical device using spacer particles having various other shapes, for example, a rod shape.

In the above embodiment, an optical device using a through hole formed by using a laser has been described as an example, but the present invention is not limited to this configuration. The present invention can be applied to an optical device using a through-hole formed by various other forming methods, for example, grinding.

In the above embodiment, the optical device using the plate-like stainless steel bonding spacer and the optical device using the band-like glass bonding spacer have been described as examples. The invention is not limited to such a configuration. The present invention can be applied to an optical device using an adhesive spacer made of other various materials, for example, a metal such as aluminum or iron, a resin plate, or a glass plate.

In the above embodiment, the optical device using the bonding spacer having the square hole (square window) has been described as an example, but the present invention is not limited to this configuration. The present invention can be applied to an optical device using an adhesive spacer having a hole formed in various other shapes, for example, a rectangle or a circle.

Further, in the above-described embodiment, an optical device using an adhesive containing a resin containing an ultraviolet curing agent as a main component has been described as an example, but the present invention is not limited to this configuration. The present invention is applicable to optical devices using various other materials, for example, a resin containing a natural curing type ultraviolet curing agent, a thermosetting resin, or an epoxy resin as a main component. Can be.

In the above embodiment, the optical device in which the optical element substrates are fixed to each other by irradiating ultraviolet rays to cure the adhesive has been described as an example. However, the present invention is not limited to this configuration. Not done. The present invention can also be applied to an optical device in which optical element substrates are fixed to each other by various curing methods other than the pressure-sensitive adhesive, such as thermal curing and natural curing. In the present invention, the curing method of the pressure-sensitive adhesive is irrelevant to the configuration, operation, effect, and the like.

In the above embodiment, the optical device using an adhesive as an adhesive has been described as an example, but the present invention is not limited to this configuration. The present invention can be applied to an optical device using an adhesive having an adhesive action by various other bonding methods. In the present invention, it is only necessary that the optical element substrates can be fixed to each other by an adhesive, and there is no need to apply pressure to have an adhesive action.

[0138]

According to the present invention, when a very large number of optical systems are simultaneously formed from a small number of optical elements formed at once on an optical element substrate, the optical element substrates are mutually fixed. It is possible to prevent the optical element from being damaged or degraded by the adhesive. Further, according to the present invention, fine alignment of the optical elements is not required to form the optical system, and the optical system is formed by a process of laminating the optical element substrates. Therefore, according to the present invention, the efficiency of forming the optical system can be greatly improved and the yield can be significantly improved, so that an optical system with low initial cost and high reliability can be provided. is there.

[Brief description of the drawings]

FIG. 1 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG.

FIG. 2 is a plan view showing a schematic configuration of another optical element substrate according to the optical device shown in FIG.

FIG. 3 is a plan view showing a schematic configuration of a screen printing plate used to form the optical device shown in FIG.

FIG. 4 shows an adhesive applied by screen printing.
FIG. 3 is a plan view showing the optical element substrate shown in FIG.

FIG. 5 is a perspective view showing a schematic configuration of an optical device to which the present invention can be applied.

6 is a cross-sectional view near the optical system of the optical device 100 shown in FIG.

FIG. 7 is a schematic explanatory view showing a method of forming the optical device shown in FIG.

FIG. 8 is a cross-sectional view illustrating a schematic configuration of another optical device to which the present invention can be applied.

FIG. 9 is an explanatory diagram of functions of a certain optical network terminal.

FIG. 10 is a partial cross-sectional view showing a characteristic portion of another optical device to which the present invention can be applied.

11 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG.

FIG. 12 is a perspective view showing a schematic configuration of another optical device to which the present invention can be applied.

FIG. 13 is an explanatory diagram of a method of forming the optical device shown in FIG.

FIG. 14 is a cross-sectional view near the optical system of the optical device shown in FIG.

FIG. 15 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG. 17;

FIG. 16 is a plan view showing a schematic configuration of another optical element substrate 410b according to the optical device shown in FIG.

FIG. 17 is a perspective view showing a schematic configuration of another optical device to which the present invention can be applied.

18 is a cross-sectional view near the optical system of the optical device shown in FIG.

19 is another sectional view showing the vicinity of the optical system of the optical device shown in FIG.

20 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG. 24.

21 is a plan view showing a schematic configuration of another optical element substrate according to the optical device shown in FIG. 24.

22 is a plan view illustrating a schematic configuration of an adhesive plate according to the optical device illustrated in FIG. 24.

23 is a plan view showing the optical element substrate shown in FIG. 21 on which an adhesive plate is superimposed.

FIG. 24 is a perspective view showing a schematic configuration of an optical device to which the present invention can be applied.

25 is a partial cross-sectional view near the optical system of the optical device shown in FIG.

26 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG. 29.

FIG. 27 is a plan view showing a schematic configuration of an optical element substrate according to the optical device shown in FIG. 29;

28 is a plan view showing the optical element substrate shown in FIG. 27 on which a quartz glass plate is placed.

FIG. 29 is a perspective view showing a schematic configuration of another optical device to which the present invention can be applied.

30 is a cross-sectional view near the optical system of the optical device shown in FIG.

FIG. 31 is an explanatory diagram of the step of forming the CGH element.

FIG. 32 is a schematic structural explanatory view showing a conventional optical device.

FIG. 33 is an explanatory diagram of a method for forming the conventional optical device shown in FIG. 32.

FIG. 34 is an explanatory diagram of a conventional optical system forming method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 optical device 110a, 110b optical element substrate 116a, 116b CGH element 118, 128 cross mark 120 screen printing plate 130 optical system 140 ultraviolet curing adhesive 240a spacer particle 320 dicing groove 420 through hole 520 adhesive plate Ma, Mb cross mark

Claims (10)

[Claims] An optical element group formed in a predetermined arrangement;
An optical device in which a predetermined optical system group is formed by stacking the above optical element substrates: the adjacent optical element substrates are applied by screen printing to an area where the optical element groups are not formed. An optical device characterized by being fixed to each other by an adhesive. 2. An optical system comprising a plurality of optical elements formed in a predetermined arrangement.
An optical device in which a predetermined optical system group is formed by stacking the above optical element substrates: a groove is formed in an area where the optical element group is not formed in the optical element substrate; Wherein the optical element substrates are fixed to each other by an adhesive applied to the area. 3. An optical element group comprising a plurality of optical elements formed in a predetermined arrangement.
An optical device in which a predetermined optical system group is formed by laminating the above optical element substrates: the optical element substrate includes a through hole penetrating a region where the optical element group is not formed; The adjacent optical element substrates are fixed to each other by an adhesive poured into the through hole;
An optical device, characterized in that: 4. An optical element group comprising a plurality of optical elements formed in a predetermined arrangement.
An optical device in which a predetermined optical system group is formed by laminating the above optical element substrates: the adjacent optical element substrates are fixed to each other by an adhesive spacer;
An optical device, wherein the bonding spacer is disposed in a region where the optical element group is not formed. 5. The adhesive according to claim 1, wherein said adhesive is mixed with spacer particles.
The optical device according to any one of the above. 6. The optical element substrate according to claim 1, wherein alignment marks for alignment when the optical element substrates are stacked are formed on each of the optical element substrates. Or the optical device according to any one of 5. 7. The optical device according to claim 1, wherein the optical element is a computer generated hologram element. 8. The optical device according to claim 1, wherein the optical element substrate is a glass substrate. 9. The method according to claim 1, wherein the adhesive is a UV-curable adhesive.
The optical device according to any one of 7 and 8, 10. The optical device according to claim 1, 2, 3, 4, 5, 6, 7, 8, or 9 in a predetermined number of optical system units constituting the optical system group. An optical device characterized by being formed by: