JPH11223891A - Cutting method for stimulable phosphor plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a stimulable phosphor layer from being chipped or peeled at a cutting time or a handling time without deteriorating fluorescent performance by setting the angle of a blade edge to be a specified value and cutting a stimulable phosphor plate by using a cutting blade whose blade surface on a product side is provided with a specified angle with respect to the stimulable phosphor plate. SOLUTION: The stimulable phosphor plate 1 is placed on a flat surface. The plural cutting blades 12 are arranged at an upper blade so that the shape of the product which is obtained can be punched by one cutting operation. By moving the upper blade in the direction of the flat surface and pushing and cutting the plate 1, the plate 1 is separated to the punched product P and the loss L on a frame covering the outside edge part of the product P. The angle θ of the edge of the blade 12 of the upper blade is set to be 20 deg. to 60 deg. and the angle of the blade surface on the product P side is set to be 90 deg.±5 deg. with respect to the plate 1. Thus, tensile/compressive stress generated at the plate 1 on the product P side is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for cutting a stimulable phosphor plate having a stimulable phosphor layer formed on a plastic film.

[0002]

2. Description of the Related Art Radiation images such as X-ray images are widely used for diagnosis of diseases. In order to obtain this X-ray image, X-rays that have passed through the subject are irradiated on a phosphor (fluorescent screen), thereby generating visible light, and the visible light is converted into a silver salt in the same manner as when a normal photograph is taken. A so-called radiograph which is developed by irradiating the used film is used. However, in recent years, a method has been devised for directly taking out an image from a phosphor without using a film coated with a silver salt.

In this method, radiation transmitted through a subject is absorbed by a phosphor, and then the phosphor is excited by, for example, light or heat energy, so that the radiation energy accumulated by the phosphor is absorbed by the phosphor. Then, there is a method of detecting and imaging this fluorescence.

Specifically, a radiation image conversion method using a stimulable phosphor as described in, for example, US Pat. No. 3,859,527 and JP-A-55-12144 is known. This method uses a stimulable phosphor plate in which a stimulable phosphor layer is formed on a rigid plate or a non-rigid film.
(Radiation image conversion panel) is used to irradiate the stimulable phosphor layer of this stimulable phosphor plate with radiation transmitted through the subject to accumulate radiation energy corresponding to the radiation transmission density of each part of the subject. Then, by stimulating the stimulable phosphor layer with electromagnetic waves (excitation light) such as visible light and infrared light in a time series manner, the radiation energy accumulated in the stimulable phosphor layer is stimulated to emit light. The signal according to the intensity of the light is photoelectrically converted, for example, to obtain an electric signal, and this signal is reproduced as a visible image on a recording material such as a photosensitive film or a display device such as a CRT.

According to the radiographic image recording / reproducing method, a radiographic image having a much smaller amount of exposure and a larger amount of information than a radiographic method using a combination of a conventional radiographic film and an intensifying screen. There is an advantage that can be obtained.

[0006] Such a stimulable phosphor is a phosphor that emits stimulable light when irradiated with radiation and then with excitation light. However, in practice, excitation light having a wavelength in the range of 400 to 900 nm is used. In general, phosphors exhibiting stimulated emission in the wavelength range of 300 to 500 nm are used.

When the film on which the stimulable phosphor layer is formed is cut and formed into a stimulable phosphor plate having a predetermined size, the stimulable phosphor layer may be chipped or peeled off. is there.

[0008] Further, in the case where the positioning is performed by abutting, and the sheet is cut into each side to obtain a predetermined product shape, the stimulable phosphor layer may be chipped or peeled off due to the impact at the time of the abutting. Conversely, if soft bumping is performed so as not to give an impact to the stimulable phosphor layer, the positioning accuracy will be degraded, and another problem that the dimensional accuracy of the product will be deteriorated will occur.

Further, when a stimulable phosphor plate is applied to another object during handling and a large impact force is applied to the corner, the stimulable phosphor layer at the corner is chipped or peeled off. .

Therefore, it has been attempted to increase the film-forming strength of the stimulable phosphor layer on the film to suppress such chipping and peeling.

[0011]

However, there is a problem that when the film-forming strength of the stimulable phosphor layer having the above-mentioned structure with respect to the film is increased, the fluorescence (emission) performance of the stimulable phosphor layer is deteriorated.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a stimulable phosphor at the time of cutting or handling without deteriorating the fluorescent performance of the stimulable phosphor layer. It is an object of the present invention to provide a method for cutting a stimulable phosphor plate in which chipping or peeling of a layer does not occur.

It is a second object of the present invention to provide a method for cutting a stimulable phosphor plate having a good quality of a cutting section.

[0014]

According to a first aspect of the present invention, there is provided a method for cutting a stimulable phosphor plate having a stimulable phosphor layer formed on a plastic film. Is 20 ° ~ 60 °, the stimulable phosphor plate of the stimulable phosphor plate, characterized in that the cutting surface is cut using a cutting blade 90 ° ± 5 ° to the stimulable phosphor plate. It is a cutting method.

The cutting edge is 90 ° ± 5 ° with respect to the stimulable phosphor plate, that is, substantially perpendicular to the stimulable phosphor plate, so that the cutting edge is a stimulable phosphor plate (stimulable phosphor plate). Layer and plastic film), the tensile / compressive stress generated in the stimulable phosphor plate on the product side is small, the deformation of the stimulable phosphor plate is reduced, and the chipping of the stimulable phosphor layer No peeling occurs.

Further, by setting the angle of the cutting edge of the cutting blade to 20 ° to 60 °, deformation of the cut portion is reduced, and chipping or peeling of the stimulable phosphor layer does not occur. According to a second aspect of the present invention, there is provided a method of cutting a stimulable phosphor plate according to the first aspect of the present invention, wherein a product shape is punched by one cutting.

[0017] Positioning by bumping becomes unnecessary, and chipping or peeling of the stimulable phosphor layer due to the impact of positioning does not occur. According to a third aspect of the present invention, there is provided a method for cutting a stimulable phosphor plate according to the second aspect, wherein a loss portion is divided into a plurality of pieces when a product shape is punched by one cutting. .

When a product shape is punched out by one cutting and a frame-shaped loss portion is generated, the stimulable phosphor layer is chipped or peeled off due to a compressive stress acting on the product from the loss portion via the cutting blade. However, when a product shape is punched out by one cutting, the loss part is divided into a plurality of parts, so that the compressive stress is dispersed, and chipping or peeling of the stimulable phosphor layer does not occur.

Further, since the product part and the loss part are completely separated, the product can be easily collected. The invention according to claim 4 is the invention according to any one of claims 1 to 3,
A method for cutting a stimulable phosphor plate, comprising placing the stimulable phosphor plate on a flat surface and cutting the stimulable phosphor plate.

Since one surface of the stimulable phosphor plate is placed on a flat surface, the deflection of the stimulable phosphor plate during cutting is prevented, the cutting surface is less deformed, and the cutting quality is reduced. It will be good.

According to a fifth aspect of the present invention, in the invention of the first or second aspect, the cutting is performed by using one of the cutting blades, the upper blade and the lower blade. This is a method for cutting the luminescent phosphor plate.

By optimally setting the clearance (interval) between the upper blade and the lower blade, the cut surface is less deformed and the cutting quality is improved. According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, one of rounded and chamfered corners is formed. Is the way.

By forming one of the rounded and chamfered corners, even if an impact is applied to the corner, the stimulable phosphor layer at the corner is not chipped or peeled off.

[0024]

Embodiments of the present invention will now be described with reference to the drawings. First, the configuration of the stimulable phosphor plate used in each embodiment will be described with reference to FIG. The stimulable phosphor plate 1 is composed of a plastic film 2 mainly composed of PET (polyethylene terephthalate) and a stimulable phosphor layer 3 formed on the plastic film 2.

In each of the embodiments of the present invention, the term “stimulable phosphor” refers to an optical, thermal, mechanical, scientific, or electrical A phosphor that emits photostimulated light corresponding to the dose of the first light or high-energy radiation when stimulated by photostimulation (stimulated excitation). A phosphor exhibiting enhanced luminescence is preferable, and has a wavelength of 500 nm or more and 1
Phosphors that exhibit stimulated emission by stimulated excitation light of μm or less are preferred.

Specific examples of the phosphor constituting the stimulable phosphor layer 3 include the following. 1.General formula aBaX ₂・ (1-a) BaY ₂ : bEu ²⁺ described in JP-A-2-58593 (wherein X and Y are each at least one of F, Cl, Br and I Wherein X ≠ Y, and a and b represent numbers satisfying 0 <a <1, 10 ⁻⁵ <b <10 ^-1 .) 2. JP 61-72087 formula No. described in Japanese _{M I X · aM II X '} 2 · bM III X "3: cA ( where, M _I is, Li, Na, K, Rb , at least Cs M _II represents at least one divalent metal of Be, Mg, Ca, Sr, Ba, Zn, Cd, Cu, Ni, and M _III represents Sc, Y, La. , C
e, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Al, Ga, In
Represents at least one trivalent metal of X, X ′, X ″ is F, C
l, Br, represents at least one halogen of I, A is Eu, Tb,
Ce, Tm, Dy, Pr, Ho, Nd, Yb, Er, Gd, Lu, Sm, Y, Tl, Na, Ag, Cu, Mg
Represents at least one metal, a, b, c is 0 ≦ a <0.5, 0
It represents a number that satisfies ≦ b <0.5 and 0 ≦ c <0.2. An alkali-hydrogen phosphor represented by). 3. General formula (Ba _1-x (M _I ) _x ) FX: yA described in JP-A-55-12145 (where M _I is at least one of Mg, Ca, Sr, Zn, and Cd) Represent
X represents at least one of Cl, Br, I, and A represents Eu, Tb, Ce, T
m, Dy, Pr, Ho, Nd, Yb, represents at least one of Er, x, y is 0
It represents a number that satisfies ≦ x <0.6 and 0 ≦ y <0.2. The phosphor represented by). 4. General formula M _I FXxA: yLn described in JP-A-55-160078 (where M _I represents at least one of Mg, Ca, Ba, Sr, Zn, and Cd, and A represents BeO , MgO, CaO, SrO, BaO, ZnO, Al ₂ O ₃ , Y ₂ O ₃ , La ₂ O ₃ , In
₂ O ₃ , SiO ₂ , TiO ₂ , ZrO ₂ , GeO ₂ , SnO ₂ , Nb ₂ O ₅ , Ta ₂ O ₅ , represents at least one of ThO ₂ , Ln is Eu, Tb, Ce, Tm, Dy , Pr, Ho, Nd, Y
b, Er, Sm, represents at least one kind of Gd, X represents at least one kind of Cl, Br, I, x, y represents 5 × 10 ⁻⁵ ≦ x ≦ 0.5, 0 <y ≦ 0.2
Represents a number that satisfies The phosphor represented by). 1. First Embodiment Next, a cutting device used in the first embodiment will be described. FIG. 2 is a configuration diagram of the cutting device used in the first embodiment.

In the figure, a stimulable phosphor plate 1 is mounted on a flat surface 10. An upper blade 11 is provided so as to be movable in a direction perpendicular to the flat surface 10. As shown in FIG. 3, a plurality of cutting blades 1 are provided on the upper blade 11 so as to cut through the shape of the product to be obtained by one cutting.
2 are arranged.

Further, 14 presses the portion of the product P to be punched out of the stimulable phosphor plate 1 by using a biasing means such as a spring 15 to press the stimulable phosphor plate 1 against the flat surface 10. It is a stripper to be fixed.

The stripper may be of a type which is itself made of an elastic body and directly presses the stimulable phosphor plate 1 in addition to the type which is biased by the spring 15 as described above. Good.

By moving the upper blade 11 in the direction of the flat surface 10 and pushing off the stimulable phosphor plate 1, as shown in FIG. 4, the stimulable phosphor plate 1 And a loss L on a frame that covers the outer edge of the product P.

Here, as shown in FIG. 1, the cutting blade 12 of the upper blade 11 has a blade edge angle θ of 20 ° to 60 °, and the blade surface on the product P side is in relation to the stimulable phosphor plate 1. 90 ° ± 5 °. According to such a cutting method, the following effects can be obtained.

(1) Since the cutting surface of the cutting blade 12 on the product P side is 90 ° ± 5 °, that is, substantially perpendicular to the stimulable phosphor plate 1, the cutting edge is a stimulable phosphor plate. 1, the tensile / compressive stress generated in the stimulable phosphor plate 1 on the product P side is small, the deformation of the stimulable phosphor layer 3 is small, and the chipping of the stimulable phosphor layer 3 No peeling occurs.

Further, the angle of the cutting edge of the cutting blade 12 is set to 20 ° to 60 °.
By setting the angle to °, deformation of the cut portion is reduced, and chipping or peeling of the stimulable phosphor layer 3 does not occur. (2) By punching out the product P from the stimulable phosphor plate 1 by using the upper blade 11 as shown in FIG. 3, positioning by bumping becomes unnecessary, and the stimulable phosphor by the impact of the positioning is radiated. No chipping or peeling of the stimulable phosphor layer 3 of the plate 1 occurs.

(3) Since one surface of the stimulable phosphor plate 1 is placed on the flat surface 10, the deflection of the stimulable phosphor plate 1 during cutting is prevented, and deformation of the cut surface is prevented. Less and good cutting quality.

The present invention is not limited to the above embodiment. In the above embodiment, the shape of the product P punched using the upper blade 11 was rectangular, but as shown in FIG. 5A, the product P punched from the stimulable phosphor plate 1 was used. May be provided with a chamfered portion PC or a rounded portion PR as shown in FIG. 5 (b). The chamfered portion PC is preferably C1 or more, and the rounded portion PR is preferably R1 or more.

As described above, the chamfered portion PC is provided at the corner of the product P.
Also, by providing the rounded portion PR, even if an impact acts on the corner of the product P, the stimulable phosphor layer 3 at the corner does not chip or peel. Further, the chamfered portion PC and the rounded portion PR may be formed by a single punching, or may be separately cut only at the corners after the punching.

Further, a cutting blade 12 having a shape as shown in FIG.
When the product P is punched by using the cutting blade 12, the cutting edge 12 has a blade angle of 20 to 60 °, and the blade surface on the product side has the stimulable phosphor plate 1.
Therefore, the blade surface on the loss L side is inclined with respect to the stimulable phosphor plate 1.

Therefore, at the time of cutting, as shown in FIGS. 1 and 7, the compressive stress C (indicated by an arrow) due to this slope acts on the product P side via the cutting edge, and the stimulable phosphor layer 3 is chipped. Or peel off.

Therefore, as shown in FIG. 6, when the stimulable phosphor plate 1 is punched by a single cutting of the product P, cuts L1 to L4 are made in the loss portions L on the frame, and the loss portions L are cut. It is preferable to divide into a plurality.

By dividing the loss portion L on the frame into a plurality of pieces as described above, the compressive stress acting on the cutting edge is dispersed, and chipping or peeling of the stimulable phosphor layer 3 does not occur. In addition, since the product P and the loss L are completely separated, the product can be easily collected.

Incidentally, the cuts L1 to L4 may be made in advance in the previous step, and the position where the cut is made is not limited to the position as shown in FIG. 6, and for example, as shown in FIG. The cuts L1 'to L4' may be made at such positions, and the number of cuts is not limited. 2. Second Embodiment FIG. 9 is a configuration diagram of a cutting apparatus used in a second embodiment. In the figure, the same parts as those in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.

The difference between this embodiment and the first embodiment is that a fixed lower blade 20 having a cutting blade 21 is used instead of using the flat surface 10. And
By moving the upper blade 11 in the direction of the lower blade 20 and pushing out the stimulable phosphor plate 1, as shown in FIG. 4, the stimulable phosphor plate 1 It is separated into the loss L on the frame that covers the outer edge.

According to such a cutting method, (1) the cutting surface of the cutting blade 12 on the product P side is 90 ° ± 5 °, that is, substantially perpendicular to the stimulable phosphor plate 1. When the blade bites into the stimulable phosphor plate 1, the tensile / compressive stress generated in the stimulable phosphor plate 1 on the product P side is small, and the deformation of the stimulable phosphor layer 3 is reduced. No chipping or peeling of the stimulable phosphor layer 3 occurs.

Further, the angle of the cutting edge of the cutting blade 12 is set to 20 ° to 60 °.
By setting the angle to °, deformation of the cut portion is reduced, and chipping or peeling of the stimulable phosphor layer 3 does not occur. (2) By punching out the product P from the stimulable phosphor plate 1 by using the upper blade 11 as shown in FIG. 3, positioning by bumping becomes unnecessary, and the stimulable phosphor by the impact of the positioning is radiated. No chipping or peeling of the stimulable phosphor layer 3 of the plate 1 occurs.

(3) By optimally setting the clearance (interval) between the cutting blade 12 of the upper blade 11 and the cutting blade 21 of the lower blade 20, the deformation of the cutting surface is small and the cutting quality is good. In the second embodiment, similarly to the first embodiment, a chamfered portion or a rounded portion may be provided at a corner of the product P, and the loss L may be divided into a plurality. May be.

[0046]

EXAMPLES The present inventor conducted the following experiments to confirm the effects of the present invention.

First, the stimulable phosphor plate used in the experiment of this embodiment will be described. 382 g of a europium-activated barium fluoride fluoride phosphor and 18 g of a polyester resin were added to a mixed solvent of methyl ethyl ketone-toluene (1: 1) and dispersed by a propeller mixer to prepare a coating solution having a viscosity of 25 to 30 PS.

This coating solution was applied on a polyethylene terephthalate film (188 μm in thickness) using a doctor blade, and then dried at 100 ° C. for 15 minutes.
The stimulable phosphor plate on which the stimulable phosphor layer is formed is used.

(1) Experiment on First Embodiment A cutting device using a flat surface having a 500 μm-thick polyethylene terephthalate film fixed on a smooth plane and an upper blade of hardness HRC60 made of tool steel SKD11 was used. An experiment was performed.

The stimulable phosphor plate is cut by using an upper blade having a blade surface on the product side of 90 ° with respect to the stimulable phosphor plate and a cutting edge angle of 20 ° to 90 ° (10 ° interval). Then, the chipping and peeling width of the stimulable phosphor layer on the product side of the cut portion were measured. Table 1 shows the results.

Cutting blades having a cutting edge angle smaller than 20 ° were excluded because they are difficult to manufacture and have no durability.

[0052]

[Table 1]

Further, the stimulable phosphor plate is formed by using an upper blade having an angle of 30 ° and a blade surface on the product side of 70 ° to 110 ° (5 ° interval) with respect to the stimulable phosphor plate. The sheet was cut, and the chipping and peeling width of the stimulable phosphor layer on the product side of the cut portion were measured. Table 2 shows the results.

[0054]

[Table 2]

As shown in Tables 1 and 2, the angle of the blade edge is
At 20 ° to 60 °, when the blade side of the product is 85 ° to 95 ° (90 ° ± 5 °) with respect to the stimulable phosphor plate, chipping and peeling of the stimulable phosphor layer are small. That was confirmed.

(3) Experiment on the Second Embodiment The upper blade and the lower blade are formed by using a hardness HRC60 made of tool steel SKD11 and a lower blade having a cutting edge angle of 90 °, and an upper blade made of tool steel SKD11 having a hardness HRC60. The experiment was performed with a cutting device in which the clearance between the two was set to 20 μm.

The stimulable phosphor plate is cut using the upper blade having a blade surface of 90 ° with respect to the stimulable phosphor plate and an angle of the cutting edge of 20 ° to 90 ° (interval of 10 °). Then, the chipping and peeling width of the stimulable phosphor layer on the product side of the cut portion were measured. Table 3 shows the results.

As in the experiment of (1), the angle of the blade
Cutting blades smaller than ° were excluded because they are difficult to manufacture and are not durable.

[0059]

[Table 3]

Further, the stimulable phosphor plate is formed by using an upper blade having an angle of 30 ° and a blade surface on the product side of 80 ° to 110 ° (5 ° interval) with respect to the stimulable phosphor plate. The sheet was cut, and the chipping and peeling width of the stimulable phosphor layer on the product side of the cut portion were measured. Table 4 shows the results.

[0061]

[Table 4]

As shown in Tables 3 and 4, the angle of the blade edge is
At 20 ° to 60 °, when the blade side of the product is 85 ° to 95 ° (90 ° ± 5 °) with respect to the stimulable phosphor plate, chipping and peeling of the stimulable phosphor layer are small. That was confirmed.

[0063]

As described above, according to the first aspect of the present invention, the cutting surface of the cutting blade on the product side is 90 ° ± 5 ° with respect to the stimulable phosphor plate, that is, substantially perpendicular. As a result, when the blade edge cuts into the stimulable phosphor plate, the tensile / compressive stress generated in the stimulable phosphor plate on the product side is small, and the deformation of the stimulable phosphor plate is reduced, resulting in No chipping or peeling of the conductive phosphor layer occurs.

Further, by setting the angle of the cutting edge of the cutting blade to 20 ° to 60 °, deformation of the cut portion is reduced, and chipping or peeling of the stimulable phosphor layer does not occur. According to the second aspect of the present invention, positioning by bumping becomes unnecessary, and chipping or peeling of the stimulable phosphor layer due to the impact of positioning does not occur.

According to the third aspect of the present invention, when a product shape is punched out by a single cutting and a frame-shaped loss portion is generated, a compressive stress acting on the product from the loss portion via the cutting blade causes a loss. The stimulable phosphor layer is chipped or peeled off,
By dividing the loss portion into a plurality of pieces when punching a product shape by one cutting, the compressive stress is dispersed and chipping or peeling of the stimulable phosphor layer does not occur.

Further, since the product part and the loss part are completely separated, the product can be easily collected. According to the fourth aspect of the present invention, since one surface of the stimulable phosphor plate is placed on a flat surface, the deflection of the stimulable phosphor plate is prevented at the time of cutting, so that the cutting is performed. The surface deformation is small, and the cutting quality is good.

According to the fifth aspect of the present invention, by optimally setting the clearance (interval) between the upper blade and the lower blade, the cut surface is less deformed and the cutting quality is improved. According to the invention as set forth in claim 6, by forming any one of roundness and chamfering in the corner, even if an impact is applied to the corner, chipping of the stimulable phosphor layer at the corner may cause the chipping. No peeling occurs.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a cutting blade used in a cutting device used in a first embodiment.

FIG. 2 is a configuration diagram of a cutting apparatus used in the first embodiment.

FIG. 3 is a perspective view of the upper blade of FIG. 2;

FIG. 4 is a view illustrating a shape obtained by punching a stimulable phosphor plate using the apparatus shown in FIG. 2;

5A is a configuration diagram of a product in which a chamfer is formed in a corner, and FIG. 5B is a configuration diagram of a product in which a round portion is formed in a corner.

FIG. 6 is a configuration diagram for explaining making a break in a loss.

FIG. 7 is a view for explaining stress acting on the cutting blade when punching is performed using the cutting blade having the cutting edge shown in FIG. 1;

FIG. 8 is a diagram for explaining another embodiment in which a loss is cut.

FIG. 9 is a configuration diagram of a cutting device used in a second embodiment.

FIG. 10 is a configuration diagram of a stimulable phosphor plate used in the first and second embodiments.

[Explanation of symbols]

 Reference Signs List 1 stimulable phosphor plate 2 plastic film 3 stimulable phosphor layer 12 cutting blade

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tetsu Honda 1 Sakura-cho, Hino-shi, Tokyo Inside Konica Corporation (72) Inventor Takehiko 1 Sakura-cho, Hino-shi, Tokyo Inside Konica Corporation

Claims (6)

[Claims] 1. A method for cutting a stimulable phosphor plate having a stimulable phosphor layer formed on a plastic film, wherein an angle of a blade edge is 20 ° to 60 °, and a blade surface on a product side is the same as the above. A method for cutting a stimulable phosphor plate, comprising cutting the stimulable phosphor plate with a cutting blade at 90 ° ± 5 °. 2. The method for cutting a stimulable phosphor plate according to claim 1, wherein a product shape is punched out by one cutting. 3. When punching a product shape by one cutting,
3. The method for cutting a stimulable phosphor plate according to claim 2, wherein the loss portion is divided into a plurality of portions. 4. The stimulable phosphor plate according to claim 1, wherein the stimulable phosphor plate is placed on a flat surface and cut. Cutting method. 5. The method for cutting a stimulable phosphor plate according to claim 1, wherein cutting is performed using an upper blade and a lower blade, one of which is the cutting blade. 6. The method for cutting a stimulable phosphor plate according to claim 1, wherein one of roundness and chamfering is formed at the corner.