JPH11218448A - Temp. sensor and manufacture thereof - Google Patents

Temp. sensor and manufacture thereof

Info

Publication number
JPH11218448A
JPH11218448A JP2288698A JP2288698A JPH11218448A JP H11218448 A JPH11218448 A JP H11218448A JP 2288698 A JP2288698 A JP 2288698A JP 2288698 A JP2288698 A JP 2288698A JP H11218448 A JPH11218448 A JP H11218448A
Authority
JP
Japan
Prior art keywords
substrate
cylindrical body
inorganic filler
temperature sensor
rear end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2288698A
Other languages
Japanese (ja)
Inventor
Masato Shoji
理人 東海林
Takashi Tamai
孝 玉井
Katsunori Matsubara
克憲 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2288698A priority Critical patent/JPH11218448A/en
Priority to EP99900155A priority patent/EP0965826A4/en
Priority to US09/380,952 priority patent/US6297723B1/en
Priority to PCT/JP1999/000044 priority patent/WO1999035475A1/en
Publication of JPH11218448A publication Critical patent/JPH11218448A/en
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)

Abstract

PROBLEM TO BE SOLVED: To avoid the wire breaking due to the thermal expansion in a temp. sensor having a temp. detector element on a ceramic board. SOLUTION: A metal tube 1, ceramic long board 2 housed in the tube 1, at least two conductive patterns 4 disposed from the top end of the board 2 surface to the rear end, and temp. detector element 3 connected between the top ends of these conductive patterns 4 are provided, the top end of the board 2 is fixed to the top end of the tube 1 through an inorg. filler 5, and the rear end of the board 2 is supported with an elastic member at the rear end of the tube 1. Since only a part of the space between the tube 1 and board 2 is secured by the inorg. filler 5, the stress due to the thermal expansion coefficient difference between the tube 1 and board 2 is not exerted on the entire board 2, the wire breaking never occurs and hence a temp. sensor good in yield can be obtd.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は温度センサおよびそ
の製造方法に関するものである。
The present invention relates to a temperature sensor and a method for manufacturing the same.

【0002】[0002]

【従来の技術】温度検出素子によって高温を検出する温
度センサにおいては、その構成として温度検出素子にリ
ード線を直接ハンダ付けすることができなかった。すな
わち、検出温度が高温であるが故に、ハンダ付け部が溶
融して温度検出素子とリード線の接続が外れてしまうの
であった。
2. Description of the Related Art In a temperature sensor for detecting a high temperature by a temperature detecting element, a lead wire cannot be directly soldered to the temperature detecting element. That is, since the detection temperature is high, the soldered portion melts and the connection between the temperature detection element and the lead wire is disconnected.

【0003】そこで、セラミックス基板上に二本の導電
パターンを形成し、この導電パターンの先端側間に温度
検出素子を接続した構成の温度センサが提案されてい
る。つまり、この構成においては基板の後端部まで導電
パターンを形成し、温度検出素子より十分低温な基板の
後端部側でリード線を接続するのである。
Therefore, a temperature sensor has been proposed in which two conductive patterns are formed on a ceramic substrate, and a temperature detecting element is connected between the ends of the conductive patterns. That is, in this configuration, a conductive pattern is formed up to the rear end of the substrate, and the lead wire is connected at the rear end of the substrate which is sufficiently lower than the temperature detecting element.

【0004】[0004]

【発明が解決しようとする課題】このような温度センサ
を多数個作製したところ、センサ内部で断線が発生し、
その歩留まりは良品がわずか30%以下しか得られない
ことが明らかになった。この原因を検討した結果、この
温度センサは、基板先端の温度検出素子部分を金属製キ
ャップで保護するとともに、基板全体を金属製の筒体内
に収納させ、この筒体の両先端部内に無機充填材を充填
することによって、基板の両端を固定しているが、温度
センサが高温になると、筒体と基板の熱膨張係数差によ
り、基板に応力が加わって損傷し、断線に至ったものと
考えられる。従って、従来の構成では断線が多発し、歩
留まりが非常に悪いという課題があった。
When a large number of such temperature sensors were manufactured, disconnection occurred inside the sensor,
It has been found that the yield is only 30% or less for good products. As a result of investigating the cause, this temperature sensor protects the temperature detection element at the tip of the substrate with a metal cap, stores the entire substrate in a metal cylinder, and fills both ends of this cylinder with inorganic filler. By filling the material, both ends of the board are fixed, but when the temperature sensor becomes high temperature, the board is damaged due to stress applied due to the difference in thermal expansion coefficient between the cylinder and the board, resulting in disconnection. Conceivable. Therefore, the conventional configuration has a problem that disconnection occurs frequently and the yield is very poor.

【0005】本発明は上記従来の課題を解決するもの
で、歩留まりが良好な温度センサを提供することを目的
とする。
An object of the present invention is to solve the above-mentioned conventional problems and to provide a temperature sensor having a good yield.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、基板の先端側を無機充填材で筒体の先端
部に固定するとともに、この基板の後端側は筒体の後端
側に弾性体によって支持した構成を有するものであり、
この構成とすれば基板の後端側が弾性体によって支持さ
れているので、筒体と基板の熱膨張係数の差による伸縮
が生じようとしても基板に応力が加わりにくく、この結
果として基板が損傷せず、断線のない歩留まりが良好な
温度センサを構成することができる。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method of fixing a front end of a substrate to a front end of a cylindrical body with an inorganic filler, and a rear end of the substrate with a cylindrical body. It has a configuration supported by an elastic body on the rear end side,
With this configuration, since the rear end side of the substrate is supported by the elastic body, stress is not easily applied to the substrate even if expansion and contraction due to the difference in the thermal expansion coefficient between the cylindrical body and the substrate occurs, and as a result, the substrate is damaged. Therefore, it is possible to configure a temperature sensor having a good yield without disconnection.

【0007】[0007]

【発明の実施の形態】本発明の請求項1に記載の発明
は、金属製の筒体と、この筒体内に収納されたセラミッ
クス製の長尺状基板と、この基板表面の先端側から後端
側に設けられた少なくとも二本の導電パターンと、これ
らの導電パターンの先端側間に接続された温度検出素子
とを備え、前記基板の先端側を無機充填材で筒体の先端
部に固定するとともに、この基板の後端側は前記筒体の
後端側に弾性体によって支持したものであり、筒体と基
板の隙間の一部分だけを無機充填材で固定するため、熱
膨張係数差による応力が基板全体に加わらず、断線が発
生しない。従って、歩留まりの良好な温度センサが実現
できるという作用を有する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a metal cylindrical body, a ceramic long substrate housed in the cylindrical body, and a rear surface from the front end side of the substrate surface. At least two conductive patterns provided on the end side, and a temperature detecting element connected between the front end sides of these conductive patterns, and the front end side of the substrate is fixed to the front end of the cylindrical body with an inorganic filler. At the same time, the rear end side of the substrate is supported by an elastic body on the rear end side of the cylindrical body, and only a part of the gap between the cylindrical body and the substrate is fixed with an inorganic filler. No stress is applied to the entire substrate, and no disconnection occurs. Accordingly, the temperature sensor having a good yield can be realized.

【0008】請求項2に記載の発明は、筒体がその先端
側と後端側に開口を有する構成とし、この先端側を無機
充填材で覆うとともに、この無機充填材内に基板の先端
部が位置するものであり、高温下で振動を受けても温度
検出素子が筒体内で動くことがないため、高温振動下で
の断線が防止できるという作用を有する。
According to a second aspect of the present invention, the cylindrical body has an opening at a front end side and a rear end side, and the front end side is covered with an inorganic filler, and the front end of the substrate is contained in the inorganic filler. Since the temperature detecting element does not move in the cylinder even when it is vibrated at a high temperature, there is an effect that disconnection under the high temperature vibration can be prevented.

【0009】請求項3に記載の発明は、少なくとも二本
の導電パターンの後端部に接続される端子の先端部を基
板の後端部に固定し、この端子の後端部にリード線を接
続する構成とするとともに、前記端子の先端部と後端部
の間には伸縮吸収部を形成したものであり、筒体と基板
の熱膨張係数差による伸縮を伸縮吸収部で吸収するた
め、基板に応力が加わらず断線が防止できるという作用
を有する。
According to a third aspect of the present invention, a terminal connected to a rear end of at least two conductive patterns is fixed to a rear end of a substrate, and a lead wire is connected to the rear end of the terminal. Along with the connection configuration, a stretch-absorbing portion is formed between the front end portion and the rear end portion of the terminal, and the stretch-absorbing portion absorbs expansion and contraction due to a difference in thermal expansion coefficient between the cylindrical body and the substrate. This has the effect that disconnection can be prevented without applying stress to the substrate.

【0010】請求項4に記載の発明は、端子の後端部を
保持体中に突入させるとともに、伸縮吸収部はこの端子
の中部を湾曲させることにより形成したものであり、最
も単純な形状で効果的な伸縮吸収部を形成できるという
作用を有する。
According to a fourth aspect of the present invention, the rear end portion of the terminal protrudes into the holding body, and the expansion and contraction absorbing portion is formed by bending the middle portion of the terminal. It has the effect that an effective expansion-contraction part can be formed.

【0011】請求項5に記載の発明は、端子が表面をニ
ッケルメッキしたステンレス鋼からなるものであり、ニ
ッケルメッキすることで導電パターンとハンダ付けによ
り容易に接続できるとともに、材質をステンレス鋼とす
ることで、リード線の引っ張りに対し十分な強度を有
し、かつ、端子の防錆効果を持つという作用を有する。
According to a fifth aspect of the present invention, the terminal is made of stainless steel whose surface is nickel-plated. The terminal can be easily connected to the conductive pattern by soldering by nickel plating, and the material is stainless steel. This has the effect of having sufficient strength against the pulling of the lead wire and having the effect of preventing the terminal from rusting.

【0012】請求項6に記載の発明は、端子の先端部
が、断面がU字、または、コの字形状であり、その内部
に基板を挿入して固定したものであり、単純な形状で基
板を容易かつ確実に固定できるという作用を有する。
According to a sixth aspect of the present invention, the tip of the terminal has a U-shaped or U-shaped cross-section, and a substrate is inserted and fixed inside the terminal. This has the effect that the substrate can be fixed easily and reliably.

【0013】請求項7に記載の発明は、端子の先端部の
一部に切り欠きを設けたものであり、切り欠き部でハン
ダ付けを行うことで端子と導電パターンが確実に接続で
きるという作用を有する。
According to a seventh aspect of the present invention, a notch is provided at a part of the tip of the terminal, and the terminal and the conductive pattern can be securely connected by performing soldering at the notch. Having.

【0014】請求項8に記載の発明は、弾性体がシリコ
ンまたはポリイミドからなるものであり、いずれも高耐
熱性樹脂であることから、高信頼性の温度センサを構成
できるという作用を有する。
The invention described in claim 8 has an effect that a highly reliable temperature sensor can be constituted since the elastic body is made of silicon or polyimide and both are made of high heat resistant resin.

【0015】請求項9に記載の発明は、筒体の温度検出
素子に対応する部分に開口部を形成したものであり、基
板を筒体に無機充填材で固定する際、開口部を通して基
板を保持しながら固定できるとともに、温度検出素子に
直接温度が伝わるため高速応答性の温度センサを構成で
きるという作用を有する。
According to a ninth aspect of the present invention, an opening is formed in a portion of the cylinder corresponding to the temperature detecting element. When the substrate is fixed to the cylinder with an inorganic filler, the substrate is passed through the opening. The temperature sensor can be fixed while being held, and the temperature is directly transmitted to the temperature detecting element, so that a high-speed responsive temperature sensor can be configured.

【0016】請求項10に記載の発明は、開口部の大き
さが温度検出素子の面積より大きいものであり、開口部
を通して基板を保持しながら筒体に固定する際、基板固
定治具の大きさを温度検出素子の断面積より大きくでき
るため、無機充填材が温度検出素子に付着するのを防止
できるとともに、温度検出素子に直接温度が伝わるため
高速応答性の温度センサを構成できるという作用を有す
る。
According to a tenth aspect of the present invention, when the size of the opening is larger than the area of the temperature detecting element, and the substrate is fixed to the cylinder while holding the substrate through the opening, the size of the substrate fixing jig is increased. Can be larger than the cross-sectional area of the temperature detection element, which prevents the inorganic filler from adhering to the temperature detection element, and has the effect of forming a high-speed response temperature sensor because the temperature is directly transmitted to the temperature detection element. Have.

【0017】請求項11に記載の発明は、温度検出素子
が白金、または、サーミスタとした構成であり、高温ま
で高精度に測定できるという作用を有する。
According to the eleventh aspect of the present invention, the temperature detecting element is formed of platinum or a thermistor, and has an effect of being able to measure a high temperature with high accuracy.

【0018】請求項12に記載の発明は、金属製の筒体
と、この筒体内に収納されたセラミックス製の長尺状基
板と、この基板表面の先端側から後端側に設けられた少
なくとも二本の導電パターンと、これらの導電パターン
の先端側間に接続された温度検出素子とを備え、前記基
板の先端側を無機充填材で筒体の先端部に固定するとと
もに、この基板の後端側は前記筒体の後端側に弾性体に
よって支持された温度センサにおいて、筒体の温度検出
素子に対応する部分に形成した開口部を通して、前記開
口部の面積より小さく、かつ、前記温度検出素子の面積
より大きい断面積を有する基板固定治具を基板の表裏を
挟持するごとく突入し、筒体先端から開口部先端までの
距離に略等しい深さの窪みを有する無機充填材硬化治具
の、前記窪み内に無機充填材を充填するとともに、この
窪み内に前記筒体先端を浸漬し、この筒体先端部内に無
機充填材を浸入させて温度センサを製造するものであ
り、基板固定治具が温度検出素子を保護した状態で無機
充填材を筒体先端部内に浸入させられるので、温度検出
素子に無機充填材が付着することなく、規定量だけ容易
に無機充填材を充填できるという作用を有する。
According to a twelfth aspect of the present invention, there is provided a metal cylindrical body, a ceramic long substrate housed in the cylindrical body, and at least a ceramic substrate provided from a front end side to a rear end side of the substrate surface. It is provided with two conductive patterns and a temperature detecting element connected between the front ends of these conductive patterns. The front end of the substrate is fixed to the front end of the cylinder with an inorganic filler, and An end side of the temperature sensor supported by an elastic body on a rear end side of the cylindrical body, through an opening formed in a portion corresponding to a temperature detecting element of the cylindrical body, is smaller than the area of the opening, and An inorganic filler hardening jig having a dent having a depth substantially equal to the distance from the tip of the cylindrical body to the tip of the opening by piercing a substrate fixing jig having a cross-sectional area larger than the area of the detection element so as to sandwich the front and back of the substrate In the depression In addition to filling the filling material, the tip of the cylindrical body is immersed in the depression, and the inorganic filler is penetrated into the tip of the cylindrical body to produce a temperature sensor. Since the inorganic filler is allowed to penetrate into the distal end portion of the cylindrical body while the inorganic filler is protected, there is an effect that the inorganic filler can be easily filled in a specified amount without adhering to the temperature detecting element.

【0019】請求項13に記載の発明は、筒体先端部を
無機充填材硬化治具の窪み内に浸漬した状態で、この筒
体先端部内の無機充填材を硬化して温度センサを製造す
るものであり、硬化する際に筒体と基板が動くことがな
く、基板を筒体の略中心に固定することができるという
作用を有する。
According to a thirteenth aspect of the present invention, the temperature sensor is manufactured by curing the inorganic filler in the distal end of the cylindrical body while the distal end of the cylindrical body is immersed in the recess of the inorganic filler curing jig. It has an effect that the substrate and the substrate do not move during curing, and the substrate can be fixed to substantially the center of the cylinder.

【0020】請求項14に記載の発明は、基板固定治
具、および、無機充填材硬化治具がテフロン製、また
は、表面をテフロンでコーティングした金属製とするも
のであり、いずれの治具にも無機充填材が固着せず、無
機充填材硬化後に容易に治具を取り外せるという作用を
有する。
According to a fourteenth aspect of the present invention, the substrate fixing jig and the inorganic filler curing jig are made of Teflon or a metal whose surface is coated with Teflon. Also, there is an effect that the inorganic filler is not fixed and the jig can be easily removed after the inorganic filler is cured.

【0021】請求項15に記載の発明は、金属製の筒体
と、この筒体内に収納されたセラミックス製の長尺状基
板と、この基板表面の先端側から後端側に設けられた少
なくとも二本の導電パターンと、これらの導電パターン
の先端側間に接続された温度検出素子とを備え、前記基
板の先端側を無機充填材で筒体の先端部に固定するとと
もに、この基板の後端側は前記筒体の後端側に弾性体に
よって支持された温度センサにおいて、筒体の温度検出
素子に対応する部分に形成した開口部を通して、前記開
口部の面積より小さく、かつ、前記温度検出素子の面積
より大きい断面積を有する基板固定治具を突入して基板
の表裏を挟持し、筒体の後端側から、筒体と基板がなす
隙間より小さい断面積を有し、かつ、筒体の後端から開
口部の後端までの距離より短い長さの無機充填材硬化治
具を、筒体と基板表裏の隙間に挿入し、前記開口部から
無機充填材を注入し、硬化して温度センサを製造するも
のであり、基板固定治具が温度検出素子を保護した状態
で無機充填材を筒体の開口部後端部分内に注入、硬化で
きるので、温度検出素子に無機充填材が付着することな
く容易に無機充填材を充填できるという作用を有する。
According to a fifteenth aspect of the present invention, there is provided a metal cylindrical body, a ceramic long substrate housed in the cylindrical body, and at least a ceramic substrate provided from a front end side to a rear end side of the substrate surface. It is provided with two conductive patterns and a temperature detecting element connected between the front ends of these conductive patterns. The front end of the substrate is fixed to the front end of the cylinder with an inorganic filler, and An end side of the temperature sensor supported by an elastic body on a rear end side of the cylindrical body, through an opening formed in a portion corresponding to a temperature detecting element of the cylindrical body, is smaller than the area of the opening, and The substrate fixing jig having a cross-sectional area larger than the area of the detection element is inserted and the front and back of the substrate are sandwiched, from the rear end side of the cylindrical body, having a cross-sectional area smaller than a gap formed between the cylindrical body and the substrate, and From the rear end of the cylinder to the rear end of the opening An inorganic filler curing jig having a length shorter than the separation is inserted into the gap between the cylindrical body and the front and back of the substrate, the inorganic filler is injected from the opening, and cured to produce a temperature sensor. With the jig protecting the temperature detection element, the inorganic filler can be injected into the rear end of the opening of the cylinder and cured, so the inorganic filler can be easily filled without sticking to the temperature detection element Has the effect of being able to.

【0022】請求項16に記載の発明は、無機充填材を
ディスペンサーにより定量注入して温度センサを製造す
るものであり、無機充填材を規定量だけ容易に注入でき
るという作用を有する。
The invention according to claim 16 is to manufacture a temperature sensor by injecting a fixed amount of an inorganic filler by a dispenser, and has an effect that a specified amount of the inorganic filler can be easily injected.

【0023】請求項17に記載の発明は、基板固定治
具、および、無機充填材硬化治具がテフロン製、また
は、表面をテフロンでコーティングした金属製とするも
のであり、いずれの治具にも無機充填材が固着せず、無
機充填材硬化後に容易に治具を取り外せるという作用を
有する。
According to a seventeenth aspect of the present invention, the substrate fixing jig and the inorganic filler curing jig are made of Teflon or a metal whose surface is coated with Teflon. Also, there is an effect that the inorganic filler is not fixed and the jig can be easily removed after the inorganic filler is cured.

【0024】以下、本発明の実施の形態について、図1
から図7を用いて説明する。 (第1の実施の形態)図1は本発明の第1の実施形態に
よる温度センサの概略断面図を、図2は温度検出部分の
断面図をそれぞれ示す。
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (First Embodiment) FIG. 1 is a schematic sectional view of a temperature sensor according to a first embodiment of the present invention, and FIG. 2 is a sectional view of a temperature detecting portion.

【0025】1は外径3mm、厚さ0.4mmの耐熱ステン
レス鋼からなり、先端側と後端側に開口を有する筒体
で、その内部には厚さ0.5mm、幅2mm、長さ70mmの
アルミナセラミックス製の長尺状基板2が収納されてい
る。基板2の先端側には膜状の温度検出素子3がCVD
法により成膜されている。ここで、温度検出素子3はA
l,Cr,Feの複合酸化物からなるサーミスタを用
い、長さ2mm、幅1.5mmとした。温度検出素子3の表
面には、その抵抗値を電気的に検出するための二本の導
電パターン4が接続されている。ここで、導電パターン
4は白金ペーストを基板先端側から後端側にわたって印
刷、焼成することにより形成し、幅およびパターン間隔
をそれぞれ0.5mmとした。
Reference numeral 1 denotes a cylindrical body made of heat-resistant stainless steel having an outer diameter of 3 mm and a thickness of 0.4 mm and having openings at the front and rear ends, and having a thickness of 0.5 mm, a width of 2 mm, and a length. A 70 mm alumina ceramic long substrate 2 is housed. A temperature detecting element 3 in the form of a film is formed on the tip side of the
It is formed by a method. Here, the temperature detection element 3 is A
Using a thermistor made of a composite oxide of l, Cr, and Fe, the length was 2 mm and the width was 1.5 mm. Two conductive patterns 4 for electrically detecting the resistance value are connected to the surface of the temperature detecting element 3. Here, the conductive pattern 4 was formed by printing and baking a platinum paste from the front end side to the rear end side of the substrate, and the width and pattern interval were each 0.5 mm.

【0026】基板2の先端側は筒体1の先端部内部を無
機充填材5で覆うことにより固定されている。無機充填
材5はアルミナが主成分で、シリカ、および、Li2
を含んだペースト状のものを用い、その内部に基板2の
先端部が位置するよう配した。
The front end of the substrate 2 is fixed by covering the inside of the front end of the cylindrical body 1 with an inorganic filler 5. The inorganic filler 5 is mainly composed of alumina, silica, and Li 2 O.
Was used, and was arranged such that the tip of the substrate 2 was located inside the paste.

【0027】基板2の後端側は筒体1の後端側にシリコ
ンからなる弾性体6を固着することにより支持した。
The rear end of the substrate 2 was supported by fixing an elastic body 6 made of silicon to the rear end of the cylindrical body 1.

【0028】導電パターン4の後端部には、断面がU字
形状の先端部を有し、表面をニッケルメッキした厚さ
0.3mmのステンレス製端子7が、U字形状の内部に基
板2を挿入することにより固定される。挿入の様子を図
3に示す。なお、本実施形態では端子7の断面がU字形
状としたが、これはコの字形状でもよく、いずれか作製
しやすい形状を選択すればよい。端子7は後端部がガラ
ス繊維強化樹脂製の保持体8中に固定される。端子7と
保持体8は射出成形により一体成形した。また、端子7
はその中部に湾曲した形状で幅0.3mmの伸縮吸収部9
を形成してある。
At the rear end of the conductive pattern 4, a 0.3 mm thick stainless steel terminal 7 having a nickel-plated surface and a U-shaped cross section is provided inside the U-shaped substrate 2. Is fixed by inserting. The state of insertion is shown in FIG. Although the terminal 7 has a U-shaped cross section in the present embodiment, the terminal 7 may have a U-shape, and any shape that is easy to manufacture may be selected. The terminal 7 has a rear end fixed in a holding body 8 made of glass fiber reinforced resin. The terminal 7 and the holder 8 were integrally formed by injection molding. Terminal 7
Is a stretch-absorbing portion 9 having a width of 0.3 mm and having a curved shape in the center thereof.
Is formed.

【0029】端子7の後端にはリード線10が溶接によ
り接続してある。溶接したのはリード線の引っ張り強度
を十分に得るためである。
A lead wire 10 is connected to the rear end of the terminal 7 by welding. Welding is for obtaining sufficient tensile strength of the lead wire.

【0030】端子7の先端部は一部分にコの字形状の切
り欠き11を設けてある。この部分に高融点ハンダ12
をハンダ付けすることにより導電パターン4との電気的
接続を得ている。接続部分の拡大図を図4に示す。な
お、切り欠き11を設けることにより、ハンダ12が確
実に導電パターンに付着し、かつ、端子7の表面をニッ
ケルメッキすることによりステンレスに確実にハンダが
付着するため、端子7と導電パターン4との高信頼接続
が実現できる。
The distal end of the terminal 7 is partially provided with a U-shaped notch 11. High melting point solder 12
Is electrically connected to the conductive pattern 4 by soldering. FIG. 4 shows an enlarged view of the connection portion. The provision of the notch 11 ensures that the solder 12 adheres to the conductive pattern, and that the surface of the terminal 7 is nickel-plated so that the solder adheres to stainless steel. High reliability connection can be realized.

【0031】筒体1の温度検出素子3に対応する部分に
は長さ5mm、幅1.7mm、すなわち、温度検出素子の面
積(2×1.5mm)より大きい開口部13が対称位置と
なるように4個所形成してある。
In the portion corresponding to the temperature detecting element 3 of the cylindrical body 1, an opening 13 having a length of 5 mm and a width of 1.7 mm, that is, an opening 13 larger than the area (2 × 1.5 mm) of the temperature detecting element is located at a symmetric position. As shown in FIG.

【0032】17は筒体1の外周に設けた温度センサ取
り付け用ナットである。次に温度検出部分の製造方法に
ついて説明する。
Reference numeral 17 denotes a temperature sensor mounting nut provided on the outer periphery of the cylinder 1. Next, a method of manufacturing the temperature detecting portion will be described.

【0033】図5は温度検出素子3および導電パターン
4を設けた基板2と、開口部13を設けた筒体1の分解
図である。まず、図5の矢印方向に基板2を筒体1内に
挿入する。次に、開口部13を通してテフロン製基板固
定治具14を基板2の表裏を挟持するごとく突入する。
この時の様子を図6に示す。ここで、基板固定治具14
の断面積は長さ3mm、幅1.6mm、すなわち、開口部1
3の面積(5×1.7mm)より小さく、温度検出素子3
の面積(2×1.5mm)より大きいものとした。
FIG. 5 is an exploded view of the substrate 2 provided with the temperature detecting element 3 and the conductive pattern 4 and the cylinder 1 provided with the opening 13. First, the substrate 2 is inserted into the cylinder 1 in the direction of the arrow in FIG. Next, a Teflon-made substrate fixing jig 14 is inserted through the opening 13 so as to sandwich the front and back of the substrate 2.
The situation at this time is shown in FIG. Here, the substrate fixing jig 14
Has a cross-sectional area of 3 mm in length and 1.6 mm in width, ie, an opening 1
3 (5 × 1.7 mm) smaller than the temperature detecting element 3
(2 × 1.5 mm).

【0034】次に、図7のごとくテフロン製無機充填材
硬化治具15の窪み16内に無機充填材5を満たす。窪
み16の深さは筒体1の先端から開口部13の先端まで
の距離(図7のLp)にほぼ等しくしてある。また直径
は筒体1の直径よりやや大きくしてある。この窪み16
の中に基板2を基板固定治具14で固定した状態で筒体
1の先端を浸漬する。これによって筒体1の先端部内に
無機充填材5が窪み16の直径と深さによって決まる規
定量だけ浸入する。
Next, as shown in FIG. 7, the inorganic filler 5 is filled in the depression 16 of the Teflon inorganic filler curing jig 15. The depth of the depression 16 is substantially equal to the distance from the tip of the cylindrical body 1 to the tip of the opening 13 (Lp in FIG. 7). The diameter is slightly larger than the diameter of the cylinder 1. This depression 16
The tip of the cylindrical body 1 is immersed in a state where the substrate 2 is fixed by the substrate fixing jig 14 in the inside. As a result, the inorganic filler 5 penetrates into the distal end portion of the cylindrical body 1 by a specified amount determined by the diameter and the depth of the depression 16.

【0035】この状態で、無機充填材5を150℃の恒
温槽中で硬化させる。その後、基板固定治具14および
無機充填材硬化治具15を取り外す。この時、両治具1
4,15はテフロンでできているため、無機充填材が付
着せず、容易に取り外すことができる。なお、基板固定
治具14および無機充填材硬化治具15は表面をテフロ
ンでコーティングした金属製のものでも全く同様の効果
を有する。
In this state, the inorganic filler 5 is cured in a thermostat at 150 ° C. Thereafter, the substrate fixing jig 14 and the inorganic filler curing jig 15 are removed. At this time, both jigs 1
Since Nos. 4 and 15 are made of Teflon, the inorganic filler does not adhere thereto and can be easily removed. It should be noted that the substrate fixing jig 14 and the inorganic filler curing jig 15 have the same effect even if they are made of metal whose surface is coated with Teflon.

【0036】以上の製造方法により、温度検出素子3に
無機充填材5が付着せず、基板2の先端部のみを筒体1
のほぼ中心に固定することができた。
According to the above manufacturing method, the inorganic filler 5 does not adhere to the temperature detecting element 3 and only the front end of the substrate 2 is
Could be fixed almost in the center.

【0037】温度の検出は、温度検出素子3の温度によ
る抵抗値の変化として電気的に行った。
The temperature was detected electrically as a change in the resistance value of the temperature detecting element 3 depending on the temperature.

【0038】このような構成の温度センサを10個試作
し、歩留まりを評価した。その結果、全数断線せず、従
来構成に比べ著しく歩留まりが改善された。これは、基
板2を筒体1の先端のみで固定し、後端を弾性体6で支
持し、さらに端子7に伸縮吸収部9を設けたことで、温
度変化に伴う筒体1と基板2の熱膨張係数差に起因する
基板2の伸縮が弾性体6を通して伸縮吸収部9で吸収さ
れ、基板2に応力が加わらなくなったためである。な
お、出力特性については従来例と同様に良好な抵抗温度
特性が得られることを確認した。信頼性についても、高
温振動下での耐久試験の結果、断線は発生せず、極めて
良好であることが明らかになった。
Ten prototypes of the temperature sensor having such a configuration were manufactured, and the yield was evaluated. As a result, all the wires were not disconnected, and the yield was significantly improved as compared with the conventional configuration. This is because the substrate 2 is fixed only at the front end of the cylindrical body 1, the rear end is supported by the elastic body 6, and the terminal 7 is provided with the expansion-contraction absorber 9, so that the cylindrical body 1 and the substrate 2 This is because the expansion and contraction of the substrate 2 caused by the difference in thermal expansion coefficient is absorbed by the expansion and contraction absorbing section 9 through the elastic body 6 and the substrate 2 is no longer stressed. As for the output characteristics, it was confirmed that good resistance temperature characteristics could be obtained as in the conventional example. As for reliability, as a result of a durability test under high-temperature vibration, no breakage occurred and it was found that the reliability was extremely good.

【0039】また、センサ応答性についても評価した結
果、従来例比約40%の高速化を実現した。これは、従
来例の構成では温度検出素子を金属製キャップ内に収納
して保護していたが、本構成では温度検出素子3を筒体
1内部に配するとともに、筒体1の先端に開口部13を
設けたことにより、従来キャップを介して伝達していた
温度変化が直接温度検出素子3に伝わるためである。
Further, as a result of evaluating the sensor responsiveness, the speed was increased by about 40% compared with the conventional example. In this configuration, the temperature detecting element is housed in a metal cap for protection in the conventional configuration, but in the present configuration, the temperature detecting element 3 is disposed inside the cylinder 1 and an opening is formed at the tip of the cylinder 1. This is because the provision of the portion 13 directly transmits the temperature change transmitted through the cap to the temperature detecting element 3.

【0040】なお、本実施形態では弾性体6をシリコン
で形成したが、これはポリイミドでもよい。ポリイミド
の場合はシリコンよりも耐熱温度が高いため、さらなる
高温用途の温度センサを構成する場合に有効である。
In this embodiment, the elastic body 6 is made of silicon, but may be made of polyimide. Since polyimide has a higher heat-resistant temperature than silicon, it is effective in constructing a temperature sensor for further high-temperature use.

【0041】さらに、温度検出素子3はサーミスタを用
いたが、これは白金でもよい。この場合、温度による抵
抗変化率はサーミスタより小さくなるが、導電パターン
4と同時に成膜できるため、工程が少なくなるという長
所があり、用途に応じて適切な温度検出素子を選択すれ
ばよい。また、白金を用いた場合、抵抗変化率が小さい
ゆえに高精度な抵抗測定が要求されるため、導電パター
ン4を4線にし、4線式抵抗測定方法を用いれば、導電
パターン4自体の温度による抵抗変化をキャンセルでき
るので、温度検出素子3のみの抵抗変化を得ることがで
きる。
Furthermore, although the thermistor is used as the temperature detecting element 3, it may be made of platinum. In this case, although the rate of change in resistance due to temperature is smaller than that of the thermistor, since the film can be formed simultaneously with the conductive pattern 4, there is an advantage that the number of steps is reduced, and an appropriate temperature detecting element may be selected according to the application. In addition, when platinum is used, since the resistance change rate is small, high-precision resistance measurement is required. Therefore, if the conductive pattern 4 is made of four wires and the 4-wire resistance measuring method is used, the temperature of the conductive pattern 4 itself depends on the temperature. Since the resistance change can be canceled, the resistance change of only the temperature detecting element 3 can be obtained.

【0042】以上のことから、歩留まりが良好な温度セ
ンサを実現することができた。 (第2の実施の形態)本発明の第2の実施形態による温
度センサは、図8のごとく、第1の実施の形態と同一構
造部分が多いため、同一部分には同一番号を付して、説
明を簡略化する。すなわち、本実施形態の特長は、基板
2の最先端を無機充填材5で固定するのではなく、開口
部13の後端で基板2を筒体1に固定したことである。
以下、実際にこのようにして作製した温度センサについ
て述べる。
From the above, it was possible to realize a temperature sensor having a good yield. (Second Embodiment) As shown in FIG. 8, a temperature sensor according to a second embodiment of the present invention has many structural parts identical to those of the first embodiment. , To simplify the description. That is, the feature of this embodiment is that the substrate 2 is fixed to the cylindrical body 1 at the rear end of the opening 13 instead of fixing the front end of the substrate 2 with the inorganic filler 5.
Hereinafter, the temperature sensor actually manufactured in this manner will be described.

【0043】図8は温度検出部分の断面図を示す。無機
充填材5は、開口部13の後端から約2mmにわたって充
填され、この部分で基板2を筒体1に固定した。
FIG. 8 is a sectional view of a temperature detecting portion. The inorganic filler 5 was filled over about 2 mm from the rear end of the opening 13, and the substrate 2 was fixed to the cylindrical body 1 at this portion.

【0044】温度検出部分は以下のようにして製造し
た。まず、図5に示すように基板2を筒体1に挿入す
る。次に、開口部13を通してテフロン製基板固定治具
14を基板の表裏を挟持するごとく突入する。この時の
様子を図9に示す。ここで、基板固定治具14の断面積
は実施の形態1と同様とした。
The temperature detecting part was manufactured as follows. First, the substrate 2 is inserted into the cylinder 1 as shown in FIG. Next, a Teflon-made substrate fixing jig 14 is inserted through the opening 13 so as to sandwich the front and back of the substrate. The situation at this time is shown in FIG. Here, the cross-sectional area of the substrate fixing jig 14 was the same as that of the first embodiment.

【0045】次に、図9に示す形状の無機充填材硬化治
具15Aを筒体1の後端から筒体1と基板2の表裏の隙
間に挿入する。ここで、無機充填材硬化治具15Aの長
さは筒体1の後端から開口部13の後端までの長さより
2mm短くしてある。さらに、無機充填材硬化治具15A
の土台部分18は基板2の断面積よりわずかに大きく、
基板2の後端飛び出し部分の長さ(図9のLk)と略等
しい深さの孔19を設けてある。この孔19に基板2の
後端飛び出し部分が挿入される。なお、無機充填材硬化
治具15Aは細長い上に小さく複雑な形状をしているの
で、ステンレス鋼を切削加工して形成し、その表面にテ
フロンの膜をコーティングすることによって作製した。
Next, an inorganic filler hardening jig 15A having a shape shown in FIG. 9 is inserted from the rear end of the cylindrical body 1 into a gap between the front and back of the cylindrical body 1 and the substrate 2. Here, the length of the inorganic filler hardening jig 15A is shorter than the length from the rear end of the cylindrical body 1 to the rear end of the opening 13 by 2 mm. Further, the inorganic filler curing jig 15A
The base portion 18 is slightly larger than the cross-sectional area of the substrate 2,
A hole 19 having a depth substantially equal to the length (Lk in FIG. 9) of the rear end protruding portion of the substrate 2 is provided. The protruding portion of the rear end of the substrate 2 is inserted into the hole 19. Since the inorganic filler hardening jig 15A is elongated and small and has a complicated shape, it was formed by cutting stainless steel and coating the surface with a Teflon film.

【0046】無機充填材硬化治具15Aを筒体1と基板
2の表裏の隙間に挿入した状態を図10に示す。なお、
図10はわかりやすくするために筒体1の一部を切開し
た図である。
FIG. 10 shows a state in which the inorganic filler hardening jig 15A is inserted into the gap between the front and back of the cylindrical body 1 and the substrate 2. In addition,
FIG. 10 is a view in which a part of the cylindrical body 1 is cut away for easy understanding.

【0047】次に、開口部13の隙間に、図10に示す
ようにディスペンサー20の先端を基板両側から突入
し、無機充填材5を、筒体1と基板2と無機充填材硬化
治具15Aが形成する空間に規定量注入する。
Next, as shown in FIG. 10, the tip of the dispenser 20 is inserted into the gap between the openings 13 from both sides of the substrate, and the inorganic filler 5 is filled with the cylindrical body 1, the substrate 2, and the inorganic filler curing jig 15A. Is injected into the space defined by the specified amount.

【0048】この状態で、無機充填材5を150℃の恒
温槽中で硬化させる。その後、基板固定治具14および
無機充填材硬化治具15Aを取り外す。この時、両治具
はテフロン、または、表面をテフロンでコーティングし
たステンレス鋼でできているため、無機充填材が付着せ
ず、容易に取り外すことができる。
In this state, the inorganic filler 5 is cured in a thermostat at 150 ° C. Thereafter, the substrate fixing jig 14 and the inorganic filler curing jig 15A are removed. At this time, since both the jigs are made of Teflon or stainless steel whose surface is coated with Teflon, the jig can be easily removed without the attachment of the inorganic filler.

【0049】以上の製造方法により、基板2を筒体1に
固定できた。なお、上記製造方法では、基板固定治具1
4で基板2を固定した後、無機充填材硬化治具15Aを
筒体1に挿入しているが、この手順は逆にしても全く同
様に基板2を固定できる。
The substrate 2 was fixed to the cylindrical body 1 by the above-described manufacturing method. In the above manufacturing method, the substrate fixing jig 1
After fixing the substrate 2 with 4, the inorganic filler hardening jig 15A is inserted into the cylindrical body 1. However, even if this procedure is reversed, the substrate 2 can be fixed in exactly the same manner.

【0050】このようにして作製した温度センサは、第
1の実施の形態と同様、良好な歩留まり、出力特性、お
よび、信頼性を示し、高速応答性も実現できることを確
認した。
It was confirmed that the temperature sensor manufactured in this manner exhibited good yield, output characteristics, and reliability, as well as high-speed response, as in the first embodiment.

【0051】なお、弾性体6を腐食するガス等の温度を
計測した場合、第1の実施の形態では開口部13からガ
スが流入し、直接弾性体6に触れ、腐食させてしまう
が、本実施形態のように無機充填材5を開口部13の後
端に配すれば、ガスがセンサ内部に流入するのを無機充
填材5が防ぐため、腐食性ガスでも温度計測が可能とな
る。
When the temperature of a gas or the like that corrodes the elastic body 6 is measured, in the first embodiment, the gas flows in from the opening 13 and directly touches the elastic body 6 to cause corrosion. If the inorganic filler 5 is disposed at the rear end of the opening 13 as in the embodiment, the inorganic filler 5 prevents gas from flowing into the inside of the sensor, so that temperature measurement can be performed even with corrosive gas.

【0052】以上の構成により、歩留まりが良好な温度
センサを実現することができた。
With the above configuration, a temperature sensor having a good yield can be realized.

【0053】[0053]

【発明の効果】以上の説明から明らかなように、本発明
によれば、金属製の筒体と、この筒体内に収納されたセ
ラミックス製の長尺状基板と、この基板表面の先端側か
ら後端側に設けられた少なくとも二本の導電パターン
と、これらの導電パターンの先端側間に接続された温度
検出素子とを備え、前記基板の先端側を無機充填材で筒
体の先端部に固定するとともに、この基板の後端側は前
記筒体の後端側に弾性体によって支持した構成とするも
のであり、筒体と基板の隙間の一部分だけを無機充填材
で固定するため、筒体と基板の熱膨張係数差による応力
が基板全体に加わらず、断線が発生しない。従って、歩
留まりの良好な温度センサを提供することができるとい
う有利な効果が得られる。
As is apparent from the above description, according to the present invention, a metal cylindrical body, a ceramic long substrate housed in the cylindrical body, and a front end side of the substrate surface. At least two conductive patterns provided on the rear end side, and a temperature detecting element connected between the front end sides of these conductive patterns, and the front end side of the substrate is made of an inorganic filler at the front end of the cylindrical body. In addition to fixing, the rear end side of the substrate is supported by an elastic body on the rear end side of the cylindrical body, and only a part of the gap between the cylindrical body and the substrate is fixed with an inorganic filler. The stress due to the difference in thermal expansion coefficient between the body and the substrate is not applied to the entire substrate, and no disconnection occurs. Therefore, an advantageous effect that a temperature sensor with a good yield can be provided can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施形態による温度センサの概
略断面図
FIG. 1 is a schematic sectional view of a temperature sensor according to a first embodiment of the present invention.

【図2】本発明の第1の実施形態による温度センサの温
度検出部分の断面図
FIG. 2 is a sectional view of a temperature detecting portion of the temperature sensor according to the first embodiment of the present invention.

【図3】本発明の第1の実施形態による温度センサの基
板の端子への挿入時の斜視図
FIG. 3 is a perspective view when the temperature sensor according to the first embodiment of the present invention is inserted into a terminal of a substrate.

【図4】本発明の第1の実施形態による温度センサの導
電パターンと端子の接続部分の拡大断面図
FIG. 4 is an enlarged sectional view of a connection portion between a conductive pattern and a terminal of the temperature sensor according to the first embodiment of the present invention.

【図5】本発明の第1の実施形態による温度センサの温
度検出部分の分解正面図
FIG. 5 is an exploded front view of a temperature detecting portion of the temperature sensor according to the first embodiment of the present invention.

【図6】本発明の第1の実施形態による温度センサの製
造方法における基板固定治具による基板固定方法を示す
斜視図
FIG. 6 is a perspective view showing a substrate fixing method using a substrate fixing jig in the temperature sensor manufacturing method according to the first embodiment of the present invention.

【図7】本発明の第1の実施形態による温度センサの製
造方法における筒体先端への無機充填材充填方法を示す
斜視図
FIG. 7 is a perspective view showing a method of filling the tip of the cylindrical body with the inorganic filler in the method of manufacturing the temperature sensor according to the first embodiment of the present invention.

【図8】本発明の第2の実施の形態による温度センサの
温度検出部分の断面図
FIG. 8 is a sectional view of a temperature detecting portion of a temperature sensor according to a second embodiment of the present invention.

【図9】本発明の第2の実施の形態による温度センサの
製造方法における無機充填材硬化治具による基板固定方
法を示す斜視図
FIG. 9 is a perspective view showing a method of fixing a substrate using an inorganic filler curing jig in a method of manufacturing a temperature sensor according to a second embodiment of the present invention.

【図10】本発明の第2の実施の形態による温度センサ
の製造方法における筒体への無機充填材充填方法を示す
斜視図
FIG. 10 is a perspective view showing a method of filling a cylindrical body with an inorganic filler in a method of manufacturing a temperature sensor according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 筒体 2 基板 3 温度検出素子 4 導電パターン 5 無機充填材 6 弾性体 7 端子 8 保持体 9 伸縮吸収部 10 リード線 11 切り欠き 12 ハンダ 13 開口部 14 基板固定治具 15,15A 無機充填材硬化治具 16 窪み 17 ナット 18 土台部分 19 孔 20 ディスペンサー DESCRIPTION OF SYMBOLS 1 Cylindrical body 2 Substrate 3 Temperature detection element 4 Conductive pattern 5 Inorganic filler 6 Elastic body 7 Terminal 8 Holder 9 Expansion-contraction absorber 10 Lead wire 11 Notch 12 Solder 13 Opening 14 Substrate fixing jig 15, 15A Inorganic filler Curing jig 16 Depression 17 Nut 18 Base part 19 Hole 20 Dispenser

Claims (17)

【特許請求の範囲】[Claims] 【請求項1】 金属製の筒体と、この筒体内に収納され
たセラミックス製の長尺状基板と、この基板表面の先端
側から後端側に設けられた少なくとも二本の導電パター
ンと、これらの導電パターンの先端側間に接続された温
度検出素子とを備え、前記基板の先端側を無機充填材で
筒体の先端部に固定するとともに、この基板の後端側は
前記筒体の後端側に弾性体によって支持した温度セン
サ。
A metal cylindrical body, a ceramic long substrate housed in the cylindrical body, at least two conductive patterns provided from a front end side to a rear end side of the substrate surface; A temperature detecting element connected between the leading ends of these conductive patterns, and fixing the leading end of the substrate to the leading end of the cylindrical body with an inorganic filler; A temperature sensor supported by an elastic body on the rear end side.
【請求項2】 筒体はその先端側と後端側に開口を有す
る構成とし、この先端側を無機充填材で覆うとともに、
この無機充填材内に基板の先端部が位置する請求項1に
記載の温度センサ。
2. The cylindrical body has an opening at a front end and a rear end thereof, and the front end is covered with an inorganic filler.
The temperature sensor according to claim 1, wherein the tip of the substrate is located within the inorganic filler.
【請求項3】 少なくとも二本の導電パターンの後端部
に接続される端子の先端部を基板の後端部に固定し、こ
の端子の後端部にリード線を接続する構成とするととも
に、前記端子の先端部と後端部の間には伸縮吸収部を形
成した請求項1または2に記載の温度センサ。
3. A structure in which a front end of a terminal connected to a rear end of at least two conductive patterns is fixed to a rear end of a substrate, and a lead wire is connected to the rear end of the terminal. The temperature sensor according to claim 1, wherein an expansion-contraction absorber is formed between a front end and a rear end of the terminal.
【請求項4】 端子の後端部を保持体中に突入させると
ともに、伸縮吸収部はこの端子の中部を湾曲させること
により形成した請求項3に記載の温度センサ。
4. The temperature sensor according to claim 3, wherein a rear end portion of the terminal protrudes into the holding body, and the expansion / contraction absorbing portion is formed by bending a middle portion of the terminal.
【請求項5】 端子は表面をニッケルメッキしたステン
レス鋼からなる請求項3または4に記載の温度センサ。
5. The temperature sensor according to claim 3, wherein the terminal is made of stainless steel whose surface is nickel-plated.
【請求項6】 端子の先端部は、断面がU字、または、
コの字形状であり、その内部に基板の後端部を挿入して
固定した請求項3に記載の温度センサ。
6. The terminal has a U-shaped cross section or
4. The temperature sensor according to claim 3, wherein the temperature sensor has a U-shape, and the rear end of the substrate is inserted and fixed therein.
【請求項7】 端子の先端部の一部に切り欠きを設けた
請求項3から6のいずれか一つに記載の温度センサ。
7. The temperature sensor according to claim 3, wherein a notch is provided at a part of a tip portion of the terminal.
【請求項8】 弾性体がシリコンまたはポリイミドから
なる請求項1に記載の温度センサ。
8. The temperature sensor according to claim 1, wherein the elastic body is made of silicon or polyimide.
【請求項9】 筒体の温度検出素子に対応する部分に開
口部を形成した請求項1から8のいずれか一つに記載の
温度センサ。
9. The temperature sensor according to claim 1, wherein an opening is formed in a portion of the cylindrical body corresponding to the temperature detecting element.
【請求項10】 開口部の大きさが温度検出素子の面積
より大きい請求項9に記載の温度センサ。
10. The temperature sensor according to claim 9, wherein the size of the opening is larger than the area of the temperature detecting element.
【請求項11】 温度検出素子が白金、または、サーミ
スタである請求項1から10のいずれか一つに記載の温
度センサ。
11. The temperature sensor according to claim 1, wherein the temperature detecting element is platinum or a thermistor.
【請求項12】 金属製の筒体と、この筒体内に収納さ
れたセラミックス製の長尺状基板と、この基板表面の先
端側から後端側に設けられた少なくとも二本の導電パタ
ーンと、これらの導電パターンの先端側間に接続された
温度検出素子とを備え、前記基板の先端側を無機充填材
で筒体の先端部に固定するとともに、この基板の後端側
は前記筒体の後端側に弾性体によって支持された温度セ
ンサにおいて、筒体の温度検出素子に対応する部分に形
成した開口部を通して、前記開口部の面積より小さく、
かつ、前記温度検出素子の面積より大きい断面積を有す
る基板固定治具を基板の表裏を挟持するごとく突入し、
筒体先端から開口部先端までの距離に略等しい深さの窪
みを有する無機充填材硬化治具の、前記窪み内に無機充
填材を充填するとともに、この窪み内に前記筒体先端を
浸漬し、この筒体先端部内に無機充填材を浸入させた温
度センサの製造方法。
12. A metal cylinder, a ceramic long substrate housed in the cylinder, and at least two conductive patterns provided from the front end to the rear end of the surface of the substrate. A temperature detecting element connected between the leading ends of these conductive patterns, and fixing the leading end of the substrate to the leading end of the cylindrical body with an inorganic filler; In the temperature sensor supported by the elastic body on the rear end side, through an opening formed in a portion corresponding to the temperature detecting element of the cylindrical body, smaller than the area of the opening,
And, piercing the substrate fixing jig having a cross-sectional area larger than the area of the temperature detection element as if sandwiching the front and back of the substrate,
An inorganic filler curing jig having a dent having a depth substantially equal to the distance from the tip of the cylindrical body to the tip of the opening, while filling the hollow with the inorganic filler, and immersing the tip of the cylindrical body in the dent. And a method of manufacturing a temperature sensor in which an inorganic filler is penetrated into the tip of the cylindrical body.
【請求項13】 筒体先端部を無機充填材硬化治具の窪
み内に浸漬した状態で、この筒体先端部内の無機充填材
を硬化した請求項12に記載の温度センサの製造方法。
13. The method of manufacturing a temperature sensor according to claim 12, wherein the inorganic filler in the distal end portion of the cylindrical body is cured while the distal end portion of the cylindrical body is immersed in the recess of the inorganic filler curing jig.
【請求項14】 基板固定治具、および、無機充填材硬
化治具がテフロン製、または、表面をテフロンでコーテ
ィングした金属製である請求項12または13に記載の
温度センサの製造方法。
14. The method according to claim 12, wherein the substrate fixing jig and the inorganic filler curing jig are made of Teflon or a metal whose surface is coated with Teflon.
【請求項15】 金属製の筒体と、この筒体内に収納さ
れたセラミックス製の長尺状基板と、この基板表面の先
端側から後端側に設けられた少なくとも二本の導電パタ
ーンと、これらの導電パターンの先端側間に接続された
温度検出素子とを備え、前記基板の先端側を無機充填材
で筒体の先端部に固定するとともに、この基板の後端側
は前記筒体の後端側に弾性体によって支持された温度セ
ンサにおいて、筒体の温度検出素子に対応する部分に形
成した開口部を通して、前記開口部の面積より小さく、
かつ、前記温度検出素子の面積より大きい断面積を有す
る基板固定治具を突入して基板の表裏を挟持し、筒体の
後端側から、筒体と基板がなす隙間より小さい断面積を
有し、かつ、筒体の後端から開口部の後端までの距離よ
り短い長さの無機充填材硬化治具を、筒体と基板表裏の
隙間に挿入し、前記開口部から無機充填材を注入し、硬
化する温度センサの製造方法。
15. A metal cylinder, a ceramic long substrate housed in the cylinder, and at least two conductive patterns provided from the front end to the rear end of the surface of the substrate. A temperature detecting element connected between the leading ends of these conductive patterns, and fixing the leading end of the substrate to the leading end of the cylindrical body with an inorganic filler; In the temperature sensor supported by the elastic body on the rear end side, through an opening formed in a portion corresponding to the temperature detecting element of the cylindrical body, smaller than the area of the opening,
In addition, a substrate fixing jig having a cross-sectional area larger than the area of the temperature detecting element is inserted to clamp the front and back of the substrate, and has a cross-sectional area smaller than a gap formed between the cylindrical body and the substrate from the rear end side of the cylindrical body. And, an inorganic filler hardening jig having a length shorter than the distance from the rear end of the cylindrical body to the rear end of the opening is inserted into the gap between the cylindrical body and the front and back of the substrate, and the inorganic filler is removed from the opening. A method of manufacturing a temperature sensor that is injected and cured.
【請求項16】 無機充填材をディスペンサーにより定
量注入した請求項15に記載の温度センサの製造方法。
16. The method for manufacturing a temperature sensor according to claim 15, wherein a fixed amount of the inorganic filler is injected by a dispenser.
【請求項17】 基板固定治具、および、無機充填材硬
化治具がテフロン製、または、表面をテフロンでコーテ
ィングした金属製である請求項15または16に記載の
温度センサの製造方法。
17. The method according to claim 15, wherein the substrate fixing jig and the inorganic filler curing jig are made of Teflon or a metal whose surface is coated with Teflon.
JP2288698A 1998-01-08 1998-02-04 Temp. sensor and manufacture thereof Pending JPH11218448A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2288698A JPH11218448A (en) 1998-02-04 1998-02-04 Temp. sensor and manufacture thereof
EP99900155A EP0965826A4 (en) 1998-01-08 1999-01-08 Temperature sensor and method of manufacturing
US09/380,952 US6297723B1 (en) 1998-01-08 1999-01-08 Temperature sensor and method of manufacturing the same
PCT/JP1999/000044 WO1999035475A1 (en) 1998-01-08 1999-01-08 Temperature sensor and method of manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2288698A JPH11218448A (en) 1998-02-04 1998-02-04 Temp. sensor and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH11218448A true JPH11218448A (en) 1999-08-10

Family

ID=12095168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2288698A Pending JPH11218448A (en) 1998-01-08 1998-02-04 Temp. sensor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH11218448A (en)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
JP2010117206A (en) * 2008-11-12 2010-05-27 Saginomiya Seisakusho Inc Temperature measurement sensor and method of manufacturing the same
KR101113532B1 (en) 2006-07-21 2012-02-29 보그와르너 베루 시스템스 게엠바흐 Temperature sensor for a resistance thermometer, in particular for use in the exhaust gas system of combustion engines
KR101321169B1 (en) * 2006-12-21 2013-10-23 제너럴 일렉트릭 캄파니 Temperature sensor
CN104142189A (en) * 2014-08-22 2014-11-12 国家电网公司 Fiber bragg grating temperature sensor applied to power equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101113532B1 (en) 2006-07-21 2012-02-29 보그와르너 베루 시스템스 게엠바흐 Temperature sensor for a resistance thermometer, in particular for use in the exhaust gas system of combustion engines
KR101321169B1 (en) * 2006-12-21 2013-10-23 제너럴 일렉트릭 캄파니 Temperature sensor
JP2010117206A (en) * 2008-11-12 2010-05-27 Saginomiya Seisakusho Inc Temperature measurement sensor and method of manufacturing the same
CN104142189A (en) * 2014-08-22 2014-11-12 国家电网公司 Fiber bragg grating temperature sensor applied to power equipment
CN104142189B (en) * 2014-08-22 2017-02-15 国家电网公司 Fiber bragg grating temperature sensor applied to power equipment

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