JPH11216560A - Soldering method and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve soldering quality by preventing an improper soldering. SOLUTION: To nip hold an article to be joined with a heated chip and a table by lowering a pressing mechanism (regions 96a, 96b). After maintaining this status for only a squeezing time T1 (a region 96c), the depth D of the article to be joined is measured by a magnetic conduction type displacement sensor to judge if there is a discrepancy in the article to be joined (a region 96d). Then, a soldering is carried out by applying a heating electric current to the heating chip while measuring a displacement volume AD of the depth D of the article (a region 96c). When the depth of the article is gradually getting thinner and its displacement volume ΔD reaches a given value, the heating current is stopped to finish the soldering. After it is passed for only a holding time T2 and a cream solder is solidified (a region 96f), the depth D of the article to be joined is measured to judge if the quality of soldering is good or bad (a region 96g). Then the pressing mechanism is raised and the joined article is taken out (a region 96g).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method and a soldering apparatus capable of obtaining good soldering quality by measuring the thickness of an object to be joined.

[0002]

2. Description of the Related Art Conventionally, a soldering apparatus has been used to join two objects to be joined. This soldering device has a heating chip at the tip of the pressing mechanism,
When soldering, cream solder is applied to a gap between the two objects, the two chips are pressed by the heating chip, and the heating chip is heated to melt the cream solder. The objects to be joined are joined.

In this case, in order to control the soldering quality, there is a method of measuring the temperature of the heating chip with a thermocouple and judging the soldering quality from the measured value. However, the temperature of the heating chip is different from the mechanical accuracy of the object to be joined, for example, the thickness of the object to be joined, or the variation due to the consumption of the heating chip due to repeated soldering.
There is a problem that the soldering quality cannot be completely controlled only by the temperature of the heating chip due to variations caused by more than kinds of factors. In addition, the thermocouple may be broken by a thermal shock during use.

[0004] On the other hand, there is known a method of judging the bonding strength by detecting the amount of movement of a heating chip with respect to a workpiece after soldering. In this method, if the moving amount of the heating chip is within a predetermined range, it is determined that the soldering has been successfully completed, and if the moving amount is smaller than the predetermined range,
Or, when it is larger, it can be determined that the soldering is defective.

[0005]

However, in the above-mentioned prior art, since the thickness of the object to be joined before soldering is not measured and its quality is not judged, if the thickness varies, the heating chip In some cases, the proper joining state may not be achieved even if the amount of movement of the wire is within the predetermined range. For this reason, there was a problem that soldering failure could not be prevented in advance, and soldering quality could not be improved. Further, since the quality of the soldering is not determined after the soldering, for example, when the soldering is extremely short, the control accuracy of the heating current based on the displacement of the thickness becomes low, and the soldering is not performed. Even when a defect occurred, it could not be detected.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a soldering method and a soldering apparatus capable of preventing poor soldering and improving soldering quality.

[0007]

In order to achieve the above-mentioned object, the present invention provides a step of pressing a heating chip for soldering on a workpiece, and measuring a thickness of the workpiece before soldering. And, if the thickness is outside the allowable range, stop the soldering, while if the thickness is within the allowable range, applying a heating current to the heating chip and soldering, It is characterized by having.

According to the present invention, it is possible to detect a defect of an object to be joined before soldering, and to prevent defective soldering.

The present invention also provides a step of pressing a soldering heating chip against an object, a step of measuring a thickness of the object before soldering, and applying a heating current to the heating chip. And the step of measuring the thickness of the object to be joined after soldering to determine the amount of displacement of the thickness of the object to be joined, and determining the quality of the soldering quality from the amount of displacement. It is characterized by having.

According to the present invention, since the thickness of the object to be joined is measured before and after soldering, it is possible to judge whether or not soldering has been performed with an appropriate displacement amount, which is preferable. .

In this case, in the step of soldering the object to be joined, a step of measuring the amount of displacement of the thickness of the object to be joined and applying a heating current to the heating chip to perform soldering; When the displacement of the thickness of the object reaches a predetermined value,
When the step of stopping the supply of the heating current is stopped, the supply of the heating current is stopped when the displacement reaches a predetermined value, so that a good soldering state can be obtained.

In this case, in the step of measuring the thickness of the object to be joined before soldering, the heating chip is pressed against the object to be joined, and the state is maintained for a predetermined time. When the thickness of the object is measured, the thickness of the object can be measured after the vibration of the object generated when the object is pressed by the heating tip is calmed down. It is possible to accurately measure the thickness of the workpiece.

Further, the present invention provides a pressing mechanism for pressing a soldering heating chip against an object to be bonded, and a pressing force transmission mounted with the heating chip and urged against the object via an elastic member. A shaft, a displacement sensor for detecting a displacement amount of the pressing force transmission shaft, and an output from the displacement sensor when the heating chip is pressed against the workpiece, a thickness of the workpiece, Detecting means for obtaining the displacement of the thickness of the article to be joined.

According to the present invention, it is possible to measure the thickness of the article to be joined before soldering. By measuring the displacement of the thickness of the joint and stopping the soldering when the displacement reaches a predetermined value, it is possible to obtain a good soldering condition.

In this case, when the displacement sensor is a magnetic induction type displacement sensor, the response of the heating chip to a change in the thickness of the workpiece is good, and the displacement of the thickness of the workpiece while soldering is performed. Can be measured with high accuracy, which is preferable.

Further, in this case, by forming the magnet used for the magnetic induction type displacement sensor on the pressure transmitting shaft, weight reduction is achieved, and the responsiveness of the heating tip to changes in the thickness of the workpiece is improved. It is further improved and suitable.

Further, in this case, it is preferable that the magnetic induction type displacement sensor is covered with a shield formed of iron or an iron alloy, since there is no concern that an error occurs in measurement results due to electromagnetic noise or magnetic noise.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a soldering method and apparatus according to the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, reference numeral 10 indicates a soldering apparatus according to a first embodiment of the present invention. The soldering apparatus 10 includes a displacement unit 16 that displaces the heating chip 12 in a direction to approach or separate from the table 14,
The controller includes a controller 18 serving as a displacement detecting means for controlling the displacement unit 16 and monitoring the displacement of the heating chip 12, and a power supply device 20 for supplying a heating current to the heating chip 12.

The controller 18 includes an LCD display 18a showing the thickness D of the workpiece, the displacement ΔD, the operating status of the soldering device 10, and a plurality of devices for setting and operating the soldering device 10. Switch 18b is provided.

As shown in FIG. 2, the displacement unit 16 is provided with a table 14 which can be displaced in the horizontal direction under the guide action of a guide mechanism 24 on a base 22.

A column 28 is erected on the base 22, and a rail member 30 is fixed to a side portion of the column 28 so as to extend in a vertical direction. A plurality of guide members 32 are slidably engaged with the rail member 30, and a displacement member 36 is fixed to the guide member 32. The support member 28 is attached to the displacement member 36.
Rod 40 of the cylinder 38 fixed to the upper part of the cylinder
Is fixed. As shown in FIG. 1, a compressed air supply source 43 is connected to the cylinder 38 via an electromagnetic valve 41, and the electromagnetic valve 41 is controlled by the controller 18.

A pressing mechanism 42 is fixed to the displacement member 36. The pressing mechanism 42 is, as shown in FIG.
4 and a chamber 46 is defined inside the housing 44.
The housing 44 is a shield 4 made of iron or an iron alloy.
8 and noise such as electromagnetic waves and magnetism
Is prevented from entering the inside.

Holes 50, 51, and 52 are defined in the casing 44 so as to extend coaxially and vertically.
1 are provided with bushings 54 and 56. The bush 54,
A pressure transmission shaft 58 is slidably inserted through 56. A heating tip 1 is provided below the pressure transmitting shaft 58.
2 is provided, and a plurality of heat dissipating fins 61 are formed on the chip holder 60 (see FIG. 2). An electric wire 62 that supplies a heating current from the power supply device 20 to the heating chip 12 is connected to the tip holder 60. The heating chip 12 is formed in a plate shape made of a high-resistance metal such as molybdenum or titanium, and a slit 63 is formed on an upper portion thereof.

A flange portion 64 is formed on the upper portion of the pressure transmitting shaft 58, and the flange portion 64 contacts the upper portion of the bush 56 so that the pressure transmitting shaft 58 is prevented from coming off. A coil spring 66, which is an elastic member, is provided inside the hole 52 above the flange 64, and the upper portion of the coil spring 66 is a seating member slidably provided inside the hole 52. Sit at 68.

A cylindrical member 70 is fixed to the upper part of the hole 52. A male screw 72 is threaded on the outer periphery of the upper part of the cylindrical member 70, and a knob 74 is screwed into the male screw 72. A rod-shaped pressing portion 76 inserted into the cylindrical member 70 is formed inside the knob 74, and a lower end portion of the pressing portion 76 contacts the seating member 68. Therefore, when the knob 74 is rotated, the pressing portion 76 vertically displaces the inside of the tubular member 70 to displace the seating member 68.

The pressure transmitting shaft 58 is provided with the chamber 4.
A plate-shaped member 78 disposed inside the fixed member 6 is fixed, and a rod-shaped magnet 82 constituting a magnetic induction type displacement sensor 80 is fixed to the plate-shaped member 78 in parallel with the pressing force transmission shaft 58. The magnet 82 is configured to be able to pass through the inside of a coil 84 of the magnetic induction type displacement sensor 80 fixed to the housing 44. Although not shown, a primary coil and a secondary coil are wound around the coil 84, and when an AC reference voltage such as a sine wave is applied to the primary coil from the controller 18, the magnet is applied to the secondary coil. An AC signal whose phase is deviated from the reference voltage in accordance with the displacement amount of 82 is output.

The plate-like member 78 has a rod-like member 86.
Are fixed in parallel with the pressure transmission shaft 58, and when the pressure transmission shaft 58 is displaced,
Turns on or off the microswitch 88 fixed to the housing 44. In this case, the micro switch 88 and the bar member 86 may be a photo sensor and a light shielding plate.

The soldering apparatus 10 according to the first embodiment
Is basically configured as described above. Next, regarding its operation, in connection with the soldering method according to the first embodiment, the flowcharts of FIGS. This will be described with reference to a time chart.

First, when the knob 74 of the pressing mechanism 42 is rotated in a predetermined direction, the pressing portion 76 descends and the seating member 68
, The coil spring 66 contracts (see FIG. 3). Therefore, the force of pressing the pressing force transmission shaft 58 by the coil spring 66 increases, and the force of pressing the object to be bonded by the heating tip 12 during soldering increases. Then, the knob 74 is rotated to a position corresponding to the pressing force so that the force for pressing the object to be bonded by the heating tip 12 becomes a predetermined magnitude.

On the other hand, a printed circuit board 90 to be joined is
Is placed on the table 14 as shown in FIG. 7A.
Cream solder 9 is applied to the copper foil portion 90a of the printed circuit board 90.
2 is applied, and an electric wire 94 to be joined is placed on the copper foil portion 90a.

When the soldering apparatus 10 is energized through the above-described preparation steps, the soldering apparatus 10 waits for a key input (step S1 in FIG. 4). Next, when "setting" is selected by the switch 18b on the controller 18 (step S2), the printed board 90 and the electric wire 94 are sandwiched by the heating chip 12 and the table 14, and then the thickness of the printed board 90 and the electric wire 94 is changed. squeeze time T ₁ of the up to measure the hold time T ₂ of the up cream solder 92 that is melted from the soldering completion is solidified, before soldering of the printed circuit board 90, the thickness of the allowable minimum value Da of the wire 94
_min, the allowable maximum value Da _max, after soldering of the printed circuit board 90, the thickness of the allowable minimum value Db _{mi n} of the wire 94, the allowable maximum value Db _max printed circuit board 90 when, and the soldering is completed, the wire 94 The thickness displacement amount setting value ΔD ₁ is set (step S3).

On the other hand, in step S1, a printed circuit board 90 and an electric wire 94 are disposed between the heating chip 12 of the displacement unit 16 and the table 14 in a state of being superposed, and "joining start" is performed by the switch 18b on the controller 18.
Is selected (step S2), the controller 18 controls the electromagnetic valve 41 to introduce compressed air from the compressed air supply source 43 to the cylinder 38, and lowers the pressing mechanism 42 (step S4, the area in FIG. 6). 96a, 96b).
For this reason, the heating tip 12 contacts the upper part of the electric wire 94,
The printed board 90 and the electric wire 94 are sandwiched between the heating chip 12 and the table 14 (see FIG. 7A).

Under the further lowering action of the pressing mechanism 42, the pressing force transmission shaft 58 relatively rises against the resilience of the coil spring 66 (see FIG. 3), and the rod member 86 presses the micro switch 88. The micro switch 88
Is turned on (step S5). For this reason, the controller 18 controls the electromagnetic valve 41 to stop the lowering of the pressing mechanism 42 (Step S6). At this time, the printed circuit board 9
There is a concern that vibrations or the like may be generated by the shock when the heating chip 12 and the table 14 are sandwiched between the heating chip 12 and the table 14.

[0035] Therefore, the printed circuit board 90, for converging the vibration generated in the wire 94, only squeeze time T ₁ set in step S3 maintains this state (step S7, in FIG. 6, the region 96c). Then, the thickness D of the workpiece, that is, the printed board 90 and the electric wires 94 is measured by the magnetic induction type displacement sensor 80 (step S8, area 96d). This thickness D is the allowable minimum value Da.
or the determining whether the range of the allowable maximum value Da _max from _min (in FIG. 5, step S9). If the thickness D is out of range, the LCD display 18 of the controller 18
A indicates that the printed board 90 and the electric wire 94 are defective (step S10), and the pressing mechanism 42 is raised (step S18). On the other hand, the thickness D is the allowable minimum value Da.
If the _min is within the maximum allowed Da _max, it sets the output of the magnetic induction type displacement sensor 80 at this time is the reference value 0 (step S11). Therefore, thereafter, the output of the magnetic induction type displacement sensor 80 indicates the displacement amount ΔD of the thickness of the printed board 90 and the electric wire 94.

Next, the controller 18
, And outputs a soldering command signal (region 96e). Then, the power supply device 20 supplies a heating current to the heating chip 12 according to the soldering command signal, the heating chip 12 is heated, and soldering to the printed circuit board 90 and the electric wire 94 is started (step S12). At this time, the magnetic induction type displacement sensor 80 has a thickness D of the printed circuit board 90 and the electric wire 94.
Is continuously measured.

As soldering progresses, cream solder 92
Gradually dissolves and the thickness D of the printed circuit board 90 and the electric wire 94
Gradually becomes thinner, and the displacement ΔD, which is the output of the magnetic induction type displacement sensor 80, increases. At this time, since the insulating coating of the electric wire 94 is also melted by the heat of the heating tip 12, the displacement ΔD is further increased.

The displacement amount ΔD is equal to the displacement amount set value ΔD ₁
At this point (step S13), it can be determined that the cream solder 92 has melted, so the controller 18 stops outputting the soldering command signal to the power supply device 20. For this reason, the power supply device 20 is connected to the heating chip 1
Then, the heating current flowing through 2 is stopped, and the soldering is completed (step S14). At this time, the copper solder portion 90 a of the printed circuit board 90 and the cream solder 92 adhered to the electric wire 94.
Is in a molten state. Therefore, the cream solder 92 is solidified after the lapse of the hold time T ₂ (step S1
5, region 96f).

Next, the thickness D of the printed circuit board 90 and the electric wire 94 is measured (step S16, area 96g), and it is determined whether or not this thickness D is within the range of the allowable minimum value Db _min to the allowable maximum value Db _max. A determination is made (step S17). if,
If the thickness D is out of range, the LCD of the controller 18
The display 18a indicates that the printed circuit board 90 and the electric wire 94 are defective (step S10), and the pressing mechanism 42 is raised (step S18). On the other hand, if the thickness D is within the range of the allowable minimum value Db _min to the allowable maximum value Db _max , the controller 18 controls the solenoid valve 41 to raise the pressing mechanism 42, and the printed circuit board 90 on which the soldering is completed, The electric wire 94 is taken out (step S18, area 96h).

As described above, by measuring the thickness D of the printed circuit board 90 and the electric wire 94 before soldering, defective soldering can be prevented in advance. By measuring the thickness D of 94, it is possible to easily determine the quality of the soldering quality. Also, the displacement ΔD of the printed circuit board 90 and the electric wire 94
Was subjected to soldering while measuring, the displacement amount [Delta] D is to stop the soldering when a displacement amount set value [Delta] D _1, there is no fear of excess and deficiency of the soldering time,
Soldering can be completed in a good soldering state.

Also, since the displacement .DELTA.D of the heating chip 12 is measured by the magnetic induction type displacement sensor 80 having good response, the displacement .DELTA.D can be accurately measured even when the soldering is extremely short. Can be.

Further, since the magnetic induction type displacement sensor 80 is covered with the shield 48, there is no concern that an error occurs in the output signal of the magnetic induction type displacement sensor 80 due to electromagnetic noise or magnetic noise.

Next, a soldering apparatus 100 according to a second embodiment will be described with reference to FIG. The same components as those of the soldering apparatus 10 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The pressing mechanism 102 of the soldering device 100
Is provided with a housing 104, and a chamber 106 is provided inside the housing 104.
Is defined. The housing 104 is covered with a shield 108 made of iron or an iron alloy, and the shield 108 causes noise such as electromagnetic waves and magnetism to be generated in the housing 10.
4 is prevented from entering.

The housing 104 has holes 110, 111,
112 is defined to extend vertically and the holes 110, 1;
11, bushings 114a and 114b are provided. A pressurizing force transmission shaft 116 is
Are slidably inserted. A heating tip 120 is attached to a lower portion of the pressure transmitting shaft 116 via an electrode holder 118. A flange portion 122 is formed on an upper portion of the pressing force transmission shaft 116, and the pressing force transmission shaft 116 is prevented from coming off when the flange portion 122 contacts the bush 114b. A coil spring 124 is disposed in the hole 112 above the flange 122, and the coil spring 124 is provided in the hole 1.
The seat 12 is seated on a seating member 125 provided slidably inside.

A cylindrical member 126 is provided above the hole 112.
Is fixed, and a male screw is screwed on the upper part of the cylindrical member 126, and a knob 128 is screwed into the male screw. The knob 12
8, a rod-shaped pressing portion 130 inserted into the cylindrical member 126 is formed, and a lower end portion of the pressing portion 130 contacts the seating member 125.

A plate-like member 132 is fixed to the pressure transmitting shaft 116 inside the chamber 106, and a guide rod 134 is attached to the plate-like member 132 to the pressure transmitting shaft 1.
The guide rod 134 is fixed in parallel with the housing 1.
04 is slidably inserted into a guide hole 136 defined in the cover.

A coil 140 of a magnetic induction type displacement sensor 138 through which the pressure transmitting shaft 116 is inserted is fixed to the housing 104, and a magnetizing process is performed on a region of the pressure transmitting shaft 116 corresponding to the coil 140 by magnetizing. 142 is formed.

The pressing mechanism 102 is mounted on the displacement unit 16 as in the first embodiment (see FIG. 1).

When the soldering is performed by the soldering apparatus 100, the cylinder 18 is urged by the controller 18 and the pressing mechanism 102 is moved down as in the first embodiment (the areas 96a and 96b in FIG. 6). ). Heating tip 120 and the table 14 and the printed circuit board 90 as an object to be welded, by squeezing time T ₁ by clamping the wire 94 was maintained in this state (region 96c), the printed circuit board 90 by the magnetic induction type displacement sensor 138, The thickness D of the electric wire 94 is measured (region 96d). If the thickness D is within the range of the allowable minimum value Da _min to the allowable maximum value Da _max , the output of the magnetic induction type displacement sensor 138 is set to 0,
A heating current is passed from the power supply device 20 to the heating chip 120 while measuring the displacement amount ΔD of the thickness D of the printed circuit board 90 and the electric wire 94 (region 96e). Therefore, the heating chip 120
Is heated to start soldering. Printed circuit board 90,
The thickness D of the wire 94 becomes thin, the amount of displacement [Delta] D reaches the displacement amount set value [Delta] D _1, to stop the heating current.

When the melted solder 92 has solidified after the elapse of the hold time T ₂ (in the region 96).
f) The thickness D of the printed circuit board 90 and the electric wire 94 is measured (area 96 g). If the thickness D is within the range of the allowable minimum value Db _min to the allowable maximum value Db _max , the pressing mechanism 102
Is raised (region 96h), and the printed circuit board 90 and the electric wire 94 are taken out.

The soldering apparatus 10 according to the second embodiment
0, the magnet 142 of the magnetic induction type displacement sensor 138 is attached to the pressing force transmission shaft 116.
Since there is no need to provide the pressing mechanism 102 separately, the number of components constituting the pressing mechanism 102 can be reduced, the pressing mechanism 102 can be made compact, and the manufacturing cost can be reduced. In addition, since the movable parts such as the pressure transmission shaft 116 and the heating chip 120 are lightened,
0, even if the pressing force transmission shaft 116 follows the change in the thickness D of the electric wire 94 without delay and the displacement amount ΔD reaches the displacement amount setting value ΔD ₁ in a short soldering time, the magnetic induction type Displacement ΔD without delay by displacement sensor 138
Can be measured. As a result, the timing of stopping the supply of the heating current can be controlled with high precision, and an extremely good soldering state can be obtained.

In the second embodiment, the magnet 142 is formed on the pressing force transmission shaft 116 by a magnetizing process.
6 may be fitted.

As described above, in the soldering apparatuses 10 and 100 according to the first and second embodiments, the magnetic induction type displacement sensors 80 and 138 are provided inside the pressing mechanisms 42 and 102. The inductive displacement sensors 80 and 138 may be provided outside the pressing mechanisms 42 and 102.

[0055]

According to the soldering method and apparatus according to the present invention, the following effects and advantages can be obtained.

Since the thickness of the article to be joined can be measured before soldering and a defect of the article to be joined can be detected based on the thickness, it is possible to prevent defective soldering in advance, and Since the thickness of the article to be joined is measured later, it is possible to determine the quality of the soldering.

Further, for example, the soldering is performed while measuring the displacement of the thickness of the article to be joined using a magnetic induction type displacement sensor having good responsiveness, and when the displacement reaches a predetermined value, the heating current is increased. Is stopped to complete the soldering, so there is no risk of excessive or insufficient soldering time,
Soldering can be completed in a good soldering state. Therefore, the fear of the occurrence of soldering defects is eliminated,
It is possible to improve the soldering quality.

Furthermore, even when the thickness of the article to be joined varies, the amount of displacement with respect to the thickness is measured to ensure good soldering regardless of the variation in the thickness of the article to be joined. Can be applied.

Further, by forming the magnet of the magnetic induction type displacement sensor on the pressing force transmission shaft, the manufacturing cost of the pressing mechanism can be reduced, and the pressing mechanism can be formed in a small size. Because the weight is reduced, the followability of the heating tip to changes in the thickness of the workpiece is improved,
Even if the soldering is extremely short, the displacement can be measured without delay. Therefore, good soldering can be performed on the workpiece.

[Brief description of the drawings]

FIG. 1 is a schematic block diagram illustrating a soldering device according to a first embodiment of the present invention.

FIG. 2 is a side view showing a drive unit of the soldering device of FIG.

FIG. 3 is a longitudinal sectional view showing a pressing mechanism of the soldering device of FIG. 1;

FIG. 4 is a flowchart illustrating a soldering method according to the first embodiment of the present invention.

FIG. 5 is a flowchart showing a soldering method according to the first embodiment of the present invention.

FIG. 6 is a timing chart showing a procedure for soldering by the soldering method according to the first embodiment of the present invention.

FIG. 7 is a partially enlarged longitudinal sectional view showing an object to be soldered by the soldering apparatus of FIG. 1, and FIG. 7A is a diagram showing a state in which the object to be joined is held between a heating chip and a table; FIG. 7B is a diagram showing a state in which the objects are soldered.

FIG. 8 is a longitudinal sectional view showing a pressing mechanism of a soldering device according to a second embodiment of the present invention.

[Explanation of symbols]

10, 100 ... soldering device 12, 120 ...
Heating tip 14 Table 18 Controller 42 102 Press mechanism 48 108
Shields 58, 116 ... Pressure transmission shafts 80, 138 ...
Magnetic induction type displacement sensors 82, 142 ... magnets 84, 140 ...
Coil 90 ... Printed circuit board 92 ... Cream solder 94 ... Electric wire

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Kiyoshi Koyama 8-7-3 Shimorenjaku, Mitaka-shi, Tokyo Inside Seiwa Manufacturing Co., Ltd.

Claims (8)

[Claims] 1. A step of pressing a heating chip for soldering on a workpiece, a step of measuring a thickness of the workpiece before soldering, and a step of soldering if the thickness is outside an allowable range. Stopping, and if the thickness is within an allowable range, applying a heating current to the heating chip to perform soldering. 2. A step of pressing a soldering heating chip against a workpiece, a step of measuring a thickness of the workpiece before soldering, and applying a heating current to the heating chip to perform soldering. Applying, and measuring the thickness of the object to be joined after soldering to determine the amount of displacement of the thickness of the object to be joined, and judging the quality of the soldering quality from the amount of displacement. And the soldering method. 3. The soldering method according to claim 1, wherein in the step of soldering the article, a displacement of a thickness of the article is measured, and a heating current is supplied to the heating chip. And a step of stopping the application of a heating current when the amount of displacement of the thickness of the workpiece reaches a predetermined value. 4. The soldering method according to claim 1, wherein in the step of measuring the thickness of the object before soldering, the heating chip is pressed against the object. A soldering method characterized by measuring the thickness of an object before soldering after maintaining the state for a predetermined time. 5. A pressing mechanism for pressing a heating chip for soldering onto an object to be bonded, a pressing force transmission shaft mounted with the heating chip and urged against the object via an elastic member; A displacement sensor for detecting an amount of displacement of the pressing force transmission shaft; and an output from the displacement sensor when the heating chip is pressed against the workpiece, the thickness of the workpiece and the workpiece during soldering. And a detecting means for obtaining a displacement amount of the thickness of the soldering device. 6. The soldering apparatus according to claim 5, wherein said displacement sensor is a magnetic induction type displacement sensor. 7. The soldering apparatus according to claim 6, wherein a magnet used for the magnetic induction type displacement sensor is formed on the pressing force transmission shaft. 8. The soldering device according to claim 6, wherein the magnetic induction type displacement sensor is covered by a shield made of iron or an iron alloy.