JPH11214482A - Stage unit, aligner and fabrication of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance operation efficiency by eliminating cables, and the like, connecting sensors in a wafer stage with a power supply, and the like, on a surface plate by forming a magnetic circuit for electrically connecting circuit parts on a water stage with circuit parts on the surface plate between a stage side electromagnetic core and a surface plate side electromagnetic core. SOLUTION: A circuit part, i.e., a sensor substrate 21, for detecting fluctuation in the illuminance of exposing light and a power supply circuit 22 therefor are mounted on a wafer stage E1 . The power supply circuit 22 comprises a battery 22a connected with an exposed stage side electromagnetic core 23, and a charging circuit 22b. A circuit part, i.e., a power supply section 31 and a controller 32, and a surface plate side electromagnetic core 33 arranged to face the core 23 upon movement of the wafer stage E1 are mounted on a surface plate 10. When a field is generated in the core 33, a field is induced in the core 23 facing the core 33 and power is fed to a power supply circuit 22 on the wafer stage side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method used in a semiconductor manufacturing apparatus for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of semiconductor elements and the like, a semiconductor exposure apparatus capable of transferring a finer pattern has been required. In such an exposure apparatus, a substrate such as a wafer has been used. It is also required that the function of the stage device for holding and positioning be further improved in accuracy.

[0003] A stage apparatus such as a semiconductor exposure apparatus generally includes a sensor for measuring uneven illuminance with high accuracy on a wafer stage (XY stage) and a θ stage for controlling the rotation direction of the wafer stage with high accuracy. It moves with a large number of sensors and a signal processing unit, such as a mechanism and a sensor that detects the amount of displacement in the rotation direction with high accuracy.

[0004] Power supply and signal transfer to the sensors and signal processing units on the moving stage are performed by a cable connecting the moving stage to a surface plate supporting the moving stage.

The cable for electrically connecting the moving stage and the surface plate, etc., expands and contracts following the moving stage and changes its curved shape. Therefore, a thin and soft wire is used so as not to adversely affect the movement of the stage. At the same time, it is necessary to pay close attention to the wiring position and the like so as not to cut off the exposure light.

[0006]

However, according to the above-mentioned prior art, as described above, a thin and soft electric wire is used for a cable for electrically connecting a sensor or the like on a moving stage to a power source such as a surface plate or a controller. Also, even if attention is paid to the wiring position, troubles such as the movement of the moving stage being affected by the tension of the cable, the bending of the cable in an unexpected direction and the exposure light being blocked, etc. I can't avoid it.

In some cases, the cable is covered by a cover so that the cable does not block the exposure light. However, the addition of the cover increases the weight of the moving stage.

As described above, when the movement of the moving stage is hindered by the tension of the cable or the like, the operation efficiency of the apparatus is deteriorated due to an emergency stop or the like due to a stage drive error. In addition, if the exposure light is shielded by the cable, defective products are generated and the productivity of the apparatus is significantly reduced. Further, if a cover for covering the cable is added, the size of the stage device is increased, and the space efficiency of the clean room is reduced.

[0009] In addition, the sheath of the cable is deteriorated due to the leaking light of the exposure light, and the deteriorated material is peeled off to become dust.
By floating in the stage space, the incidence of defective products is further increased. Insulation failure due to deterioration of the cable jacket also results in occurrence of a device error and a reduction in the operation rate due to an emergency stop of the device.

The present invention has been made in view of the above-mentioned unresolved problems of the prior art, and includes a cable for connecting a sensor, a signal processing unit, and the like on a moving stage to a power supply unit, a CPU, and the like on a surface plate. By omitting the wiring means, a stage apparatus, an exposure apparatus, and a device manufacturing method that can greatly improve the operation efficiency and productivity of the apparatus and also contribute significantly to the improvement of the space efficiency of a clean room by downsizing the apparatus. It is intended to provide.

[0011]

In order to achieve the above-mentioned object, a stage apparatus according to the present invention comprises: a movable stage movable along guide means of a fixed base; It is characterized by having magnetic coupling means for forming a magnetic circuit for electrically connecting a circuit part of the fixed base between the moving stage and the fixed base.

The circuit section of the fixed base is preferably a power supply section for supplying power to circuit components on the moving stage.

[0013] The circuit section of the fixed base may be a signal processing section for transferring electric signals to and from circuit components on the moving stage.

Preferably, the magnetic coupling means has a pair of electromagnetic cores respectively mounted on the moving stage and the fixed base.

[0015] The magnetic coupling means may have a pair of electromagnetic coils mounted on the moving stage and the fixed base, respectively.

[0016]

When the moving stage is moved to, for example, a wafer transfer position at which a wafer is transferred to and from the transfer means, the two electromagnetic cores are arranged so that the electromagnetic core of the magnetic coupling means and the electromagnetic core of the fixed base face each other. The power and electric signals are transferred between the circuit components on the moving stage and the circuit section on the fixed base while the moving stage transfers wafers and the like.

By avoiding troubles such as when the moving stage and the fixed base are electrically connected by a cable or the like,
The operating efficiency and productivity of the equipment can be greatly improved. Further, the omission of a cable and a cover for covering the same makes it possible to reduce the size of the entire stage apparatus and contribute to improvement in space efficiency of a clean room in which an exposure apparatus is provided.

[0018]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an exposure apparatus according to a first embodiment, which includes a wafer stage (XY stage) E _{1 as} a moving stage for positioning a wafer (substrate) W as a work, Exposure light generated from a lamp R of the light source optical system C includes a projection optical system A, a reticle stage B, a light source optical system C, etc.
The light passes through the reticle on the reticle stage B, forms an image on the wafer W by the projection optical system A, and transfers the reticle pattern onto the wafer W.

The wafer stage E ₁ is disposed on a base 10, which is a fixed base on which a main body frame for supporting the projection optical system A and the reticle stage B is erected, and a base for supporting the base 10 and a floor surface. A vibration damping device is provided between them.

As shown in FIG. 2, the drive unit of the wafer stage E ₁ is capable of reciprocating on the surface plate 10 in the Y-axis direction, and reciprocating on the Y stage 12 in the X-axis direction. X stage 13 and Y stage 12 are Y
A pair of Y linear motors 14 for moving in the axial direction and an X linear motor 15 for moving the X stage 13 in the X axis direction
Having.

The platen 10 has an XY guide surface 11a as guide means for supporting the lower surfaces of the Y stage 12 and the X stage 13 in a non-contact manner through an air pad or the like (not shown).
At one end of the surface plate 10 in the X-axis direction, a Y guide (yaw guide) 11b for guiding the Y stage 12 in the Y-axis direction is provided upright. A space between the Y guide surface of the Y guide 11b and the Y stage 12 is not shown. Non-contact is maintained by an air pad or the like. When both Y linear motors 14 are driven, the Y stage 12 moves on the XY guide surface 11 a of the
Move along 1b.

The Y stage 12 includes a pair of Y sliders 12.
a and a long frame composed of a pair of X guides 12b disposed between them, and the lower surfaces of both Y sliders 12a face the XY guide surface 11a of the surface plate 10, as described above. It is supported in a non-contact manner via an air pad or the like. In addition, each Y
The side surface of the slider 12a faces the Y guide 11b,
As described above, it is guided in a non-contact manner through an air pad or the like. The two Y sliders 12a are integrally connected to the mover 14a of the Y linear motor 14 by a connecting plate 12c, respectively, and the X guides 12b integrated with the Y sliders 12a are respectively provided.
Above the stator of the X linear motor 15 is fixed.

The X stage 13 is a hollow frame having a pair of top plates 13a and the like. The X guide 12b of the Y stage 12 and the stator of the X linear motor 15 pass through the hollow portion. The bottom surface of the lower top plate 13a faces the XY guide surface 11a of the surface plate 10 and is supported in a non-contact manner via an air pad or the like as described above, and the upper surface of the upper top plate 13a corresponds to the wafer W of FIG. Is formed on the wafer holding surface for sucking and holding.

When the stator 14b of the Y linear motor 14 is excited by energization, the Y stage 12 moves in the Y axis direction together with the X stage 13. When the stator of the X linear motor 15 is excited by energization, the X stage 13 moves on the X guide 12b in the X axis direction. In this way, the wafer W on the wafer stage E ₁ is positioned in the XY direction. Wafer stage E ₁ has a mirror 16 of the L-shaped, an interferometer receiving the reflected light, for detecting the position of the X-axis direction and the Y-axis direction of the wafer W.

After positioning the wafer W as described above, exposure light is applied to transfer the reticle pattern.

[0027] On the wafer stage E _1, as shown in FIG. 3, the sensor substrate 21 mounted with the illuminance sensor is a circuit part for detecting the uneven illuminance of the exposure light, the power supply circuit 22 for supplying power thereto mounted and feeder circuit 22 includes a battery 22a that is connected to the stage-side electromagnetic core 23 exposed at one end of the wafer stage E ₁ has a charging circuit 22b, the charging circuit 22b, a stage-side electromagnetic as described below It has a function of rectifying, charging, and supplying power to the pseudo AC supplied from the core 23.

On the other hand, a power supply section 31 and a controller 32 as circuit sections and a wafer stage E ₁
A surface plate-side electromagnetic core 33 disposed so as to face the stage-side electromagnetic core 23 when is moved to a predetermined wafer transfer position or the like is mounted. Switch 31 for performing
a and a DC-AC converter 31b.
The converter 31b has a function of generating a pseudo alternating current from a direct current.

The power supply to the sensor substrate 21 on the wafer stage E ₁ is carried out as follows by a magnetic circuit formed by the stage-side electromagnetic core 23 and the platen-side electromagnetic core 33 is a magnetic coupling means.

[0030] when the normal idling state, the wafer stage E ₁ is stopped at the wafer transfer position. The controller 32 monitors the coordinate position of the wafer stage E _1, confirms that the entering wafer transfer position, turning on the switch 31a of the platen 10. When the switch 31a is turned on, a pseudo AC is generated from DC by the DC-AC converter 31b. Thus, when a magnetic field is generated in the platen-side electromagnetic core 33, a magnetic field is generated in the stage-side electromagnetic core 23 facing the platen-side electromagnetic core 33, and power is supplied to the power supply circuit 22 on the wafer stage side. . Since the supplied power is AC power, it is rectified by the charging circuit 22b and charged into the storage battery 22a. At the same time, the charging circuit 2
2b, the voltage of the storage battery 22a and the input AC power are measured,
Be compared. In the charging circuit 22b, when the input voltage (after rectification)> the voltage of the storage battery, the charging circuit 22b performs the charging operation and the power supply operation to the sensor board 21. When the input voltage (after rectification) <the voltage of the storage battery, the charging circuit 22b turns off the input and turns off the storage battery 2
The circuit is switched so as to perform the power supply operation to the sensor substrate 21 via 2a.

The wafer stage E ₁ is, away from the wafer transfer position in order to perform the actual illuminance unevenness measurement operation, the controller 32 confirms that the wafer stage E ₁ is other than the wafer transfer position, the off signal to the switch 31a Is output, and the electric circuit connected to the platen-side electromagnetic core 33 is turned off.

From the wafer transfer position to the wafer stage E
_{Even if 1} moves, the sensor substrate 21 can be operated by power supply from the storage battery 22a.

The wafer stage E ₁ is completed the illuminance unevenness measurement operation, moving the wafer transfer position again, in the same manner as described above, the wafer stage E by the controller 32
The switch 31a of the surface plate side electromagnetic core 33 is turned on after monitoring the coordinate position of ₁ and confirming that it enters the transfer position.

[0034] FIG. 4 is an electrical block diagram of the illuminance sensor 41 is a circuit component mounted on the wafer stage E ₂ of the exposure apparatus according to the second embodiment. The output of the illuminance sensor 41 is amplified by an amplifier 41a, and is introduced into a sensor CPU 42 that performs data processing through an AD converter 41b for converting an analog signal into a digital signal. The data processed here is stored in a memory 42a. Store it temporarily. The serial signal output from the sensor CPU unit 42 is modulated by the modulation / demodulation unit 42b,
A magnetic field is generated in the core part of No. 3. On the other hand, the platen-side electromagnetic core 53 is connected to a stage control CPU 52 which is a signal processing unit via a modulation / demodulation unit 52a.
1a is connected to the main bus line 51.

When measuring the illuminance unevenness in the exposure apparatus as in the apparatus shown in FIG. 1, the wafer stage E ₂ is stopped at the wafer transfer position in a normal idling state. At this time, a communication permission signal is output from the stage control CPU 52 to the sensor CPU unit 42. The signal output from the stage control CPU 52 is transmitted to the modulation / demodulation unit 5.
2a and converted into a modulated voltage signal.

A magnetic field is generated by the modulated voltage signal in the platen-side electromagnetic core 53, and the modulation / demodulation unit 42 connected to the core of the stage-side electromagnetic core 43 is generated by the magnetic field.
An electric signal is input to b. The modulation / demodulation unit 42b demodulates the modulated signal and outputs it to the sensor CPU unit 42 as a serial signal. When receiving the communication permission signal from the stage control CPU 52, the sensor CPU unit 42 checks whether there is any transmission data remaining in the connected memory unit 42a.

When transmission data remains, measurement data is transmitted to the stage control CPU 52 in the reverse order.

When receiving the measurement data, the stage control CPU 52 outputs the measurement data to the main bus line 51 through the individual bus line 51a in order to send the measurement data to a CPU (not shown) related to the exposure.

The stage control CPU 52 outputs a communication inhibit signal to the sensor CPU section 42 immediately before the wafer stage E ₂ moves away from the wafer transfer position in order to perform an actual uneven illuminance measurement operation.

When the sensor CPU section 42 receives the communication inhibition signal, it enters a data measurement mode, and performs data collection and storage of the collected data in the memory section 42a.

When the sensor CPU 42 enters the data measurement mode, the illuminance sensor 41, the amplifier 41b, and the AD converter 4
Measure the digitized data through 1b. This measurement data is processed by the sensor CPU unit 42, and the processed data is stored in the memory unit 42a.

When the wafer stage E ₂ completes the measurement and moves to the transfer position, a communication permission signal is output from the stage control CPU 52 and the sensor CP
Communication between the U unit 42 and the stage control CPU 52 is resumed.

In the first and second embodiments, the stage-side electromagnetic core is opposed to the platen-side electromagnetic core so that the illuminance sensor on the wafer stage and the power supply unit or signal processing unit on the platen can be connected. It transfers power or electric signals, and does not require wiring means such as a cable connecting the wafer stage and the surface plate.

Therefore, there is no risk that a stage drive error occurs due to tension or the like when the cable follows the movement of the wafer stage, or that a product defect occurs due to the exposure light being blocked by the cable. Further, the operation efficiency and throughput of the apparatus can be greatly improved without troubles such as poor insulation of the cable and generation of impurities due to deterioration of the cable jacket. In addition, there is an advantage that the space use efficiency and energy efficiency of the clean room can be greatly improved by avoiding an increase in the size and weight of the stage as in the case where a cover is added to the cable.

Incidentally, it is general to use the first and second embodiments in combination. In this case, as shown in FIG. 5, features stage side electromagnetic core 23 for feeding the wafer stage E ₃ and the stage side electromagnetic core 43 for transmission, the magnetic shield plate 61 for preventing magnetic interference therebetween In addition to the above, a platen-side electromagnetic core 33 for power supply and a platen-side electromagnetic core 53 for transmission are provided side by side on the platen 60, and a magnetic shield plate 62 for preventing magnetic interference between them is added.

In place of the electromagnetic cores 23, 33, 43, 53 in the first and second embodiments, as shown in FIG. 6, electromagnetic coils 63, 73 having no core are opposed to each other. The change in magnetism may be used to transfer electric power or an electric signal.

Next, an embodiment of a method of manufacturing a semiconductor device using the above-described exposure apparatus will be described. FIG. 7 shows a manufacturing flow of a semiconductor device (a semiconductor chip such as an IC or an LSI, or a liquid crystal panel or a CCD). In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing, bonding),
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, the semiconductor device is completed,
This is shipped (step 7).

FIG. 8 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device which has been conventionally difficult to manufacture.

[0049]

Since the present invention is configured as described above, it has the following effects.

By omitting cables connecting the sensors and the like on the moving stage and the power supply unit and the CPU and the like on the surface plate, the operation efficiency and the like are improved, and the size of the apparatus and the productivity are greatly improved. Can contribute. By using an exposure apparatus equipped with such a moving stage, the manufacturing cost of semiconductor devices and the like can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing an exposure apparatus according to a first embodiment.

FIG. 2 is a perspective view showing a wafer stage of the apparatus of FIG. 1 and a driving unit thereof.

FIG. 3 shows an electrical block diagram of the device of FIG. 2;

FIG. 4 shows an electric block diagram according to a second embodiment.

FIG. 5 shows an electric block diagram according to a modification.

FIG. 6 is a diagram showing still another modified example.

FIG. 7 is a flowchart showing a semiconductor manufacturing process.

FIG. 8 is a flowchart showing a wafer process.

[Explanation of symbols]

 10, 40, 60 Surface plate 12 Y stage 13 X stage 14 Y linear motor 15 X linear motor 21 Sensor substrate 23, 43 Stage side electromagnetic core 31 Power supply unit 33, 53 Surface plate side electromagnetic core 41 Illuminance sensor 42 Sensor CPU unit 52 Stage control CPU 61, 62 Magnetic shield plate 63, 73 Electromagnetic coil

Claims (8)

[Claims] 1. A moving stage movable along guide means of a fixed base, and a magnetic circuit for electrically connecting a circuit component on the moving stage to a circuit part of the fixed base, wherein the moving stage and the magnetic circuit are electrically connected to each other. A stage device having a magnetic coupling means formed between fixed stands. 2. The stage device according to claim 1, wherein the circuit section of the fixed base is a power supply section for supplying power to circuit components on the moving stage. 3. The stage apparatus according to claim 1, wherein the circuit section of the fixed base is a signal processing section that exchanges an electric signal with a circuit component on the moving stage. 4. The stage apparatus according to claim 1, wherein the magnetic coupling means has a pair of electromagnetic cores mounted on the moving stage and the fixed base, respectively. 5. The stage apparatus according to claim 1, wherein the magnetic coupling means has a pair of electromagnetic coils mounted on the moving stage and the fixed base, respectively. 6. The magnetic coupling device according to claim 1, wherein the magnetic coupling means is configured to form a magnetic circuit between the fixed base and the movable stage when the movable stage moves to a workpiece transfer position. The stage device according to any one of claims 5 to 5. 7. An exposure apparatus comprising: the stage device according to claim 1; and an exposure optical system that exposes a substrate held by the stage device. 8. A device manufacturing method comprising a step of exposing a wafer by the exposure apparatus according to claim 7.