JPH11204367A - Chip-shaped electronic component and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable discrimination of direction, without attaching marks in a chip-shaped electronic component having a chip-shaped component body with substantially the same dimension in the directions of width and thickness. SOLUTION: For at least one terminal electrode 29, an adjacent surface extending portion 31 is formed for extending to a part of at least one adjacent surface including first to fourth lateral surfaces 25-28, adjacent to an end surface 23 where the terminal electrode 29 is formed. The formation mode of the adjacent surface extending portion 31 on the first to fourth surfaces 25-28 is varied between the adjacent surfaces. Thus, the lateral surfaces can be discriminated on the basis of the formation mode of the adjacent surface extending portion 31, and consequently the direction of a chip-shaped electronic component 1 can be discriminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component and a method for manufacturing the same, and more particularly to an improvement in the appearance of a chip-shaped electronic component.

[0002]

2. Description of the Related Art FIG. 9 is a perspective view showing the appearance of a conventional chip-shaped electronic component 1 which is of interest to the present invention. The chip-shaped electronic component 1 includes a chip-shaped component body 2,
First and second terminal electrodes 5 formed on opposing first and second end faces 3 and 4 of component body 2, respectively.
And 6.

[0003] In addition to the first and second end faces 3 and 4 described above, a component body 2 has first, second, third and third links connecting the first and second end faces 3 and 4, respectively. 4, the length L is defined by the distance between the first and second end faces 3 and 4, and the thickness is determined by the distance between the first and third side faces 7 and 9. A direction dimension T is defined, and a width dimension W is defined by the distance between the second and fourth side surfaces 8 and 10. In particular, in the illustrated component body 2, the width dimension W and the thickness dimension T are substantially equal.

[0004] The first and second terminal electrodes 5 and 6 are
Each has first and second adjacent surface extensions 11 and 12, which are formed to extend to a part of the side surfaces 7 to 10 adjacent to the first and second end surfaces 3 and 4, respectively. The appearance of the chip-shaped electronic component 1 shown in FIG. 9 is employed in, for example, a multilayer electronic component, more specifically, a multilayer capacitor or a multilayer inductor. Further, such a chip-shaped electronic component 1 is mounted by soldering the terminal electrodes 5 and 6 to conductive lands provided on a wiring board (not shown).

In this mounting state, if the attitude of the chip-shaped electronic component 1 is different, that is, the first
Depending on which one of the fourth side surfaces 7 to 10 faces, or by reversing the positional relationship between the first and second terminal electrodes 5 and 6, the chip-shaped electronic component 1 gives The characteristics may change or deteriorate. More specifically, the chip-shaped electronic component 1
Is a multilayer capacitor, there may be a difference in generated stray capacitance between when the internal electrode is parallel to the mounting surface and when it is perpendicular. Further, when the chip-shaped electronic component 1 is a multilayer inductor, the manner in which the magnetic flux is generated differs depending on the direction of the coil axis with respect to the mounting surface, and the residual inductance may change.

Incidentally, such a change or deterioration of the characteristics is caused when the chip-shaped electronic component 1 is used in a high frequency range.
This poses a particularly serious problem. As described above, since the width dimension W and the thickness dimension T of the chip-shaped electronic component 1 shown in FIG. 9 are substantially equal, the first or third side surface with respect to the mounting surface. It is almost impossible to distinguish from the appearance whether 7 or 9 are arranged in parallel or the second or fourth side 8 or 10 is arranged in parallel.

Therefore, in order to make it easier to determine the direction of the chip-shaped electronic component 1, conventionally, as shown in FIG.
For example, a direction determination mark 13 is displayed on the first side surface 7. The direction determination mark 13 is
For example, it is in the form of an arrow and is provided with a colored resin. Such direction determination mark 13
Is recognized by, for example, an image processing technique.

According to the direction discriminating mark 13, first, it is possible to recognize in which direction the side face 7 to which it is attached faces. Further, the first terminal electrode 5 and the second terminal electrode 6 can be distinguished from each other by the direction in which the arrow of the direction determination mark 13 points, and the direction in the length direction can be determined.

[0009]

However, the direction discrimination using the direction discrimination mark 13 has the following problems. That is, as the size of the chip-shaped electronic component 1 is reduced, the size of the display by the direction discrimination mark 13 must be reduced accordingly. 1
It becomes difficult to align the position. Further, when the chip-shaped electronic component 1 is further downsized, it may be impossible to provide the direction discrimination mark 13 itself.

Further, there is a problem that the cost for forming the direction discriminating mark 13 is added and the cost for obtaining the chip-shaped electronic component 1 is increased. Therefore,
An object of the present invention is to provide a chip-shaped electronic component and a method for manufacturing the same, which can solve the above-mentioned problems.

[0011]

SUMMARY OF THE INVENTION The present invention is directed to a first, second, third and fourth side face for connecting opposing first and second end faces to each other between the first and second end faces. The length in the length direction is defined by the distance between the first and second end faces, the dimension in the thickness direction is defined by the distance between the first and third side faces, and the distance between the second and fourth side faces. A chip-shaped component body whose width dimension is defined, and the width dimension and the thickness dimension are substantially equal, and a chip-shaped component body formed on first and second end faces of the component body, respectively. The present invention is directed to a chip-shaped electronic component including the first and second terminal electrodes, and is characterized by having the following configuration in order to solve the above-described technical problem.

That is, the first and second terminal electrodes are
A first and a second, respectively, formed to extend to a portion of at least one adjacent surface including the first, second, third, and fourth sides adjacent the first and second end surfaces. It has an adjacent surface extension. At least one of the first and second adjacent surface extensions has a different form of formation on the first, second, third, and fourth side surfaces between the adjacent side surfaces.

As described above, according to the present invention, it is possible to determine the direction of the chip-shaped electronic component based on the difference in the form of the extension of the adjacent surface of the terminal electrode. In the present invention, preferably, the first adjacent surface extension and the second adjacent surface extension are asymmetrically formed on at least one of the first, second, third, and fourth side surfaces. have.

It is preferable that at least one of the first and second adjacent surface extensions has a different form on the first, second, third and fourth side surfaces.
Further, it is preferable to form the first and second adjacent surface extension portions differently as described above while locating each edge on the same plane. The present invention is also directed to a method for manufacturing a chip-like electronic component as described above. This manufacturing method includes a step of preparing the above-described component main body and a step of preparing at least one adjacent surface including first, second, third and fourth side surfaces adjacent to the first and second end surfaces of the component main body. First and second respectively having first and second adjacent surface extensions extending to a portion
Forming the terminal electrodes on the first and second end surfaces, respectively. Then, the step of forming such first and second terminal electrodes includes forming the first and second end surfaces of the component body and a part of the adjacent surface in the conductive paste to be the first and second terminal electrodes. Are respectively immersed.

The method of manufacturing a chip-shaped electronic component according to the present invention is characterized in that, in the immersion step, at least one of the first and second adjacent surface extensions is made of the first conductive paste. In a state in which the length direction of the component body is not perpendicular but inclined with respect to the outer surface of the conductive paste, so that each application mode on the second, third and fourth side surfaces is different between adjacent side surfaces. At least one of the first and second end faces and a part of the adjacent face of the component body are immersed in the conductive paste.

[0016]

1 and 2 are views for explaining a chip-shaped electronic component 21 according to a first embodiment of the present invention. FIG. 1 is a perspective view showing the appearance of the chip-shaped electronic component 21. FIG. 2 shows each side surface of the chip-shaped electronic component 21. The chip-shaped electronic component 21 includes a chip-shaped component main body 22. The component body 22
Opposite first and second end faces 23 and 24, and first, second, third and fourth side faces 25, 2 connecting between the first and second end faces 23 and 24, respectively.
6, 27 and 28. Also, the component body 2
2, the length dimension L is defined by the distance between the first and second end faces 23 and 24, the thickness dimension T is defined by the distance between the first and third side faces 25 and 27, and the width dimension W is defined by the distance between the second and fourth sides 26 and 28. The width dimension W and the thickness dimension T are substantially equal.

On the first and second end faces 23 and 24 of the component body 22, first and second terminal electrodes 29 are provided.
And 30 are each formed. The first and second terminal electrodes 29 and 30 are respectively connected to the first and second terminal electrodes 29 and 30.
And first, second, third and fourth sides 25, 26, 27 and 28 adjacent to the second end faces 23 and 24, respectively.
And first and second adjacent surface extensions 31 and 32 formed to extend to a portion of at least one adjacent surface including: For at least one of the first and second adjacent surface extensions 31 and 32,
Each of the forms on the first, second, third, and fourth side surfaces 25, 26, 27, and 28 corresponds to the adjacent side surfaces 25 to 28.
Are different between.

In the first embodiment, more specifically, as shown in FIG. 2, the second adjacent surface extension 32 is provided in the chip-shaped electronic component 1 shown in FIG. Like the second adjacent surface extension 12, the first to fourth
Are formed in the same manner on the side surfaces 25 to 28, but are characterized by the formation of the first adjacent surface extension 31.

More specifically, the first adjacent surface extension 31
Is not formed on the first side surface 25 shown in FIG. 2 (1), but is formed in the shape of a right triangle on the second side surface 26 shown in FIG. 2 (2). 3rd shown
2 has a rectangular shape on the side surface 27 of FIG.
On the fourth side surface 28 shown in (4), it is formed in the shape of a right triangle that is opposite to the right triangle on the second side surface 26.

Thus, the first adjacent surface extension 31 is
Since the forms on the first, second, third and fourth sides 25, 26, 27 and 28 are all different,
The first to fourth side surfaces 25 to 28 can be distinguished by recognizing the formation of the first adjacent surface extension 31 by image processing, for example. In addition, this first
In the embodiment, the first adjacent surface extension 31 and the second adjacent surface extension 32 are located on at least one of the first, second, third and fourth side surfaces 25, 26, 27 and 28. Have asymmetrical formation modes. More specifically, the first, second and fourth sides 25, 26 and 2
8, the first adjacent surface extension portion 31 and the second adjacent surface extension portion 32 have an asymmetrical form.
Thus, according to the first embodiment, the first terminal electrode 29 and the second terminal electrode 30 can be distinguished from each other, and therefore, it is possible to determine the direction in the length direction.

First and second terminal electrodes 29 and 30
Is preferably formed through a step of immersing the first and second end surfaces 23 and 24 of the component body 22 and a part of the adjacent surface in the conductive paste, respectively. In such an immersion step, the conductive paste that becomes the first adjacent surface extension 31 is formed such that the length direction of the component main body 22 is not perpendicular to the outer surface of the conductive paste having a predetermined thickness but is inclined. The first end face 23 of the component body 22 and a part of each of the second to fourth side faces 26 to 28 are provided by dipping the conductive paste in a conductive paste.

The conductive paste thus applied is
By firing, the first and second terminal electrodes 2
9 and 30. In these first and second terminal electrodes 29 and 30, the respective edges of the first and second adjacent surface extensions 31 and 32 are located on the same plane, respectively, as a result of the above-described applying method. . The obtained chip-shaped electronic component 21 is provided with first and second terminal electrodes 29.
The direction is determined based on each of the formation modes of the first and second adjacent surface extensions 31 and 32 of FIG.
It is subjected to a measuring step, is in the form of taping that is held at a predetermined interval in a certain direction, or is subjected to a mounting step while maintaining a state of being fixed in a certain direction.

FIGS. 3 and 4 are views for explaining a chip-shaped electronic component 21a according to a second embodiment of the present invention. FIG. 3 corresponds to FIG. 1, and FIG. 4 corresponds to FIG. I have. In FIGS. 3 and 4, and in FIGS. 5 to 8 to be described later, elements corresponding to the elements shown in FIGS. 1 and 2 are denoted by the same reference numerals, and overlapping description will be omitted. Omitted.

The chip-shaped electronic component 21a according to the second embodiment is different from the chip-shaped electronic component 21 according to the first embodiment only in the form of forming the first and second adjacent surface extension portions 31a and 32a. ing. That is,
On the first side surface 25 shown in FIG. 4A, the first adjacent surface extension 31a is formed in a rectangular shape, and
Is formed in a narrower rectangular shape. On the second side surface 26 shown in FIG. 4 (2), the first adjacent surface extension 31a is formed in a trapezoidal shape, and the second adjacent surface extension 32a is formed in a trapezoidal shape having a shorter upper side. It is formed with On the third side surface 27 shown in FIG. 4 (3), the first adjacent surface extension 31a
Is formed in a rectangular shape, and the second adjacent surface extension 32a is also formed in a similar rectangular shape.
On the fourth side surface 28 shown in FIG. 4 (4), the first and second adjacent surface extensions 31a and 32a respectively have the shape on the second side surface 26 shown in FIG. 4 (2). Is formed with an inverted trapezoidal shape.

According to the second embodiment, the first, second, third and fourth side surfaces 25, 26, 2 are provided for both the first and second adjacent surface extensions 31a and 32a.
Each of the forms on 7 and 28 is different.
Therefore, the first to fourth side surfaces 25 are recognized by recognizing at least one of the first and second adjacent surface extension portions 31a and 32a by, for example, image processing.
To 28 distinctions can be made.

In the second embodiment, the first, second, and fourth side surfaces 2 are similar to the first embodiment.
5, 26 and 28, the first adjacent surface extension 3
1a and the second adjacent surface extension 32a have an asymmetric formation with each other. Therefore, according to the second embodiment, the first terminal electrode 29 and the second terminal electrode 3
0 can be distinguished from each other, so that the direction can be determined in the length direction.

The first and second terminal electrodes 29 and 30 in the second embodiment are also substantially the same as the first and second terminal electrodes 29 and 30 in the first embodiment. It can be formed by a method. FIGS. 5 and 6 are views for explaining a chip-shaped electronic component 21b according to a third embodiment of the present invention, and correspond to FIGS. 1 and 2 described above, respectively.

The third embodiment is also characterized in the formation of the first and second adjacent surface extensions 31b and 32b of the first and second terminal electrodes 29 and 30, respectively. That is, on the first side surface 25 shown in FIG. 6A, neither the first nor the second adjacent surface extension 31b or 32b is formed. On the second side surface 26 shown in FIG. 6 (2), the first and second adjacent surface extensions 31b and 32b are both formed in the shape of a right triangle. On the third side surface 27 shown in FIG.
The first and second adjacent surface extensions 31b and 32b
Each is formed in a rectangular shape. Fig. 6 (4)
The first and second adjacent surface extensions 31b and 32b are formed in the shape of a right triangle opposite to the right triangle on the second side 26 on the fourth side surface 28 shown in FIG.

In the third embodiment, the first adjacent surface extension 31b and the second adjacent surface extension 32b are connected to the first, second, third and fourth side surfaces 25, 26, 27 and 28
Above all have a symmetrical form. For this reason, the first terminal electrode 29 and the second terminal electrode 30 cannot be distinguished from each other.
The direction cannot be determined in the length direction. Also, the first and second adjacent surface extensions 31b and 32b
6 (2), the second side surface 26 shown in FIG.
The above-mentioned one corresponds to the one on the fourth side surface 28 shown in FIG. 6D rotated by 180 degrees, so that these cannot be distinguished from each other from the appearance.

However, according to the third embodiment, the first and second adjacent surface extensions 31b and 32b
In any of the above, since the respective aspects of formation on the first, second, third and fourth side faces 25, 26, 27 and 28 are different between adjacent side faces, at least the first or third When the side surface 25 or 27 faces the mounting surface and the second
Alternatively, the state where the fourth side surface 26 or 28 faces the mounting surface can be distinguished from each other.

The method for forming the first and second terminal electrodes 29 and 30 in the third embodiment can be applied in the same manner as in the first embodiment. 7 and 8 illustrate a chip-like electronic component 21c according to a fourth embodiment of the present invention, and correspond to FIGS. 1 and 2 described above, respectively.

The fourth embodiment is also characterized in the formation of the first and second adjacent surface extensions 31c and 32c of the first and second terminal electrodes 29 and 30, respectively. That is, the first side surface 25 shown in FIG.
Above, the first and the second each have a rectangular shape.
Are formed on adjacent surface extensions 31c and 32c. FIG.
On the second side surface 26 shown in (2), first and second adjacent surface extension portions 31c and 32c are respectively formed in trapezoidal shapes. Third side surface 27 shown in FIG.
Above, the first and second adjacent surface extensions 31c and 32c are formed in a rectangular shape wider than the rectangle on the first side surface 25 shown in FIG. 8A. FIG. 8 (4)
On the fourth side surface 28 shown in FIG. 8, the first and second adjacent surface extension portions 31c and 32c are formed in a trapezoidal shape opposite to the trapezoidal shape on the second side surface 26 shown in FIG. Is done.

According to the fourth embodiment, the first terminal electrode 29 and the second terminal electrode 30 cannot be distinguished from each other, as in the third embodiment described above. The two adjacent surface extensions 31c and 32c are provided on the first, second, third and fourth side surfaces 25, 26, 2 respectively.
7 and 28 are different between the adjacent side surfaces, so that the first or third side surface 25 or 27 faces the mounting surface and the second or fourth side surface 26 or 2
8 can be distinguished from the state facing the mounting surface.

The first and second terminal electrodes 29 and 30 in the fourth embodiment are also the same as those in the first embodiment.
The same forming method as that of the embodiment can be applied.

[0035]

As described above, according to the chip-shaped electronic component of the present invention, at least one of the first and second adjacent surface extension portions of the first and second terminal electrodes is connected to the component body. Since the respective forms of formation on the first, second, third and fourth side surfaces are different between the adjacent side surfaces, the widthwise dimension and the thicknesswise dimension of the component body are substantially equalized. Also, by recognizing the extension of the adjacent surface by image processing, for example, it is possible to determine at least the direction in which the first or third side faces and the direction in which the second or fourth side faces. Therefore, when the chip-shaped electronic component is mounted, it is possible to prevent a difference or a decrease in characteristics due to the difference in these directions.

Further, according to the chip-shaped electronic component of the present invention, it is not necessary to add a mark for determining the direction. This is advantageous particularly when the chip-shaped electronic component is miniaturized. Further, the cost for forming the mark is not required. In the chip-shaped electronic component according to the present invention, the first adjacent surface extension and the second adjacent surface extension are asymmetrically formed on at least one of the first, second, third, and fourth. With the embodiment, the first terminal electrode and the second terminal electrode can be distinguished. This has an advantageous effect particularly when the chip-shaped electronic component forms an inductor. That is, in the case of an inductor, when the positional relationship between the first and second terminal electrodes is reversed, the manner in which magnetic flux is generated is different, and thus the characteristics may be different.

In the chip-shaped electronic component according to the present invention, at least one of the first and second adjacent surface extensions has a different form in each of the first, second, third and fourth side surfaces. Then, these can be distinguished for all of the first to fourth aspects. Further, in the chip-shaped electronic component according to the present invention, when the respective edges of the first and second adjacent surface extensions are located on the same plane, respectively, the first and second terminal electrodes are provided. In order to form the component, a step of immersing a predetermined portion of the component body in the conductive paste can be adopted. Therefore, the terminal electrodes can be efficiently formed.

On the other hand, according to the method of manufacturing a chip-shaped electronic component according to the present invention, the first and second terminal electrodes are formed, so that the component main body is placed in the conductive paste serving as the first and second terminal electrodes. Are respectively immersed, and in this immersion step, the first, second, third and fourth conductive pastes are provided for at least one of the first and second adjacent surface extensions. In a state where the length direction of the component body is not perpendicular to the outer surface of the conductive paste but is inclined with respect to the outer surface of the conductive paste, a predetermined portion of the Since it is immersed in the inside, the characteristic formation mode of the adjacent surface extension can be obtained easily and efficiently.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a chip-shaped electronic component 21 according to a first embodiment of the present invention.

FIG. 2 is a plan view of the chip-shaped electronic component 21 shown in FIG. 1 with first, second, third and fourth side surfaces 25, 2
It is the figure shown from each direction of 6, 27, and 28.

FIG. 3 is a perspective view showing an appearance of a chip-shaped electronic component 21a according to a second embodiment of the present invention.

FIG. 4 is a view showing a state in which the chip-shaped electronic component 21a shown in FIG.
It is the figure shown from each direction of 6, 27, and 28.

FIG. 5 is a perspective view showing an appearance of a chip-shaped electronic component 21b according to a third embodiment of the present invention.

FIG. 6 is a view showing a state in which the chip-shaped electronic component 21b shown in FIG.
It is the figure shown from each direction of 6, 27, and 28.

FIG. 7 is a perspective view showing an appearance of a chip-shaped electronic component 21c according to a fourth embodiment of the present invention.

8 is a view showing a state in which the chip-shaped electronic component 21c shown in FIG.
It is the figure shown from each direction of 6, 27, and 28.

FIG. 9 is a perspective view showing the appearance of a conventional chip-shaped electronic component 1 which is of interest to the present invention.

[Explanation of symbols]

 21, 21a, 21b, 22c Chip-shaped electronic component 22 Component main body 23 First end surface 24 Second end surface 25 First side surface 26 Second side surface 27 Third side surface 28 Fourth side surface 29 First terminal electrode 30 second terminal electrode 31, 31a, 31b, 31c first adjacent surface extension 32, 32a, 32b, 32c second adjacent surface extension

Claims (5)

[Claims] A first and a second end face opposed to each other, and first, second, third and fourth side faces connecting the first and second end faces, respectively, wherein the first and second end faces are connected to each other; The length dimension is defined by the distance between the first and second end faces, the thickness dimension is defined by the distance between the first and third side faces, and the width dimension is defined by the distance between the second and fourth side faces. A chip-shaped component main body defined and having the width dimension and the thickness dimension substantially equal to each other; and first formed on the first and second end faces of the component main body, respectively. And a second terminal electrode, wherein the first and second terminal electrodes respectively correspond to the first and second terminal electrodes.
And a first and second adjacent surface extension formed to extend to a portion of at least one adjacent surface including the first, second, third and fourth side surfaces adjacent the second end surface. At least one of the first and second adjacent surface extension portions is different between the adjacent side surfaces in the form of formation on the first, second, third, and fourth side surfaces. A chip-shaped electronic component. 2. The first adjacent surface extension and the second adjacent surface extension are asymmetrically formed on at least one of the first, second, third and fourth side surfaces. The chip-shaped electronic component according to claim 1 having an aspect. 3. The formation of at least one of the first and second adjacent surface extensions on the first, second, third and fourth side surfaces is all different. Or the chip-shaped electronic component according to 2. 4. The chip-shaped electronic component according to claim 1, wherein each edge of said first and second adjacent surface extensions is located on the same plane. 5. The semiconductor device according to claim 1, further comprising: first and second end faces opposed to each other, and first, second, third and fourth side faces connecting the first and second end faces, respectively. The length dimension is defined by the distance between the first and second end faces, the thickness dimension is defined by the distance between the first and third side faces, and the width dimension is defined by the distance between the second and fourth side faces. A step of preparing a chip-shaped component body, wherein the dimension in the width direction and the dimension in the thickness direction are substantially equal to each other; and a step of adjoining the first and second end faces of the component body. A first and second terminal electrode having first and second adjacent surface extensions respectively extending to at least a portion of at least one adjacent surface including first, second, third and fourth side surfaces; Forming on the first and second end faces respectively Forming the first and second terminal electrodes, wherein the first and second end surfaces and the adjacent surface of the component body are placed in a conductive paste to be the first and second terminal electrodes. And a step of immersing a part of the conductive paste in the immersing step, wherein at least one of the first and second adjacent surface extensions is the first, second, third and third portions of the conductive paste. In a state where the length direction of the component body is not perpendicular but inclined with respect to the outer surface of the conductive paste, the application mode on the side surface of the component 4 is different between the adjacent side surfaces. First
And at least one of the second end face and a part of the adjacent face is immersed in the conductive paste.