JPH11204040A - Gas discharge panel and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gas discharge panel and its manufacturing method capable of forming a more stable image without generation of a cross-talk than a conventional one. SOLUTION: This gas discharge panel comprises: a first panel substrate 104 having a first electrode 24; a second panel substrate 108 having a second electrode 23 opposed to the first panel substrate 104; a sealed part provided between outer circumferential edges both the substrates 104, 108 to make a gas discharge space 112 between both the substrates 104, 108; a partition wall 30 which divides the gas discharge space 112 provided at the second panel substrate 108; an upper end of the partition wall 30 is adhered 31 to an inner face of the first panel substrate 104.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a gas discharge panel and a method for manufacturing the same.

[0002]

2. Description of the Related Art As an example of a gas discharge panel, an AC type plasma display panel (hereinafter, referred to as PDP) as shown in FIG. 7 has been known.

[0003] A panel configuration of a conventional PDP and its operation will be described below with reference to the drawings.

FIG. 20 is a schematic sectional perspective view of a conventional PDP.

In FIG. 1, reference numeral 4 denotes a front substrate (also called an upper panel substrate), and reference numeral 8 denotes a back substrate (also called a lower panel substrate). In the envelope 10, a front substrate 4 and a back substrate 8 are arranged to face each other, and a sealing member 9 made of low melting point glass (FIG. 21) is formed between the outer peripheral edges to form a gas discharge space. Reference), and in the sealed space, 300 Torr to 500 Torr.
In this configuration, a rare gas of r (mixed gas of helium and xenon) is sealed.

The front substrate 4 is formed on a front panel glass 201, a display electrode 1 formed on the front panel glass 201 by patterning, a dielectric film 2 formed so as to cover the front panel glass 201, and a dielectric film 2. It is composed of an MgO protective film 3.

On the other hand, the back substrate 8 includes a back panel glass 202 and address electrodes 5 (also referred to as data electrodes) which are patterned on the surface of the back panel glass 202.
And a dielectric film 6 formed so as to cover it, a partition wall 7 composed of a plurality of ribs, and RGB phosphors 11a to 11c applied between the ribs. Here, the partition 7 is a means for partitioning the gas discharge space. The space section 12 thus partitioned
Are light emitting areas, and the phosphor 11 is applied to each of the light emitting areas. The rib of the partition 7 and the address electrode 5 are formed in the same direction, and the display electrode 1 is orthogonal to the address electrode 5.

In the envelope 10 configured as described above, by applying a voltage to the address electrode 5 and the display electrode 1 at an appropriate timing, a space 12 corresponding to a display pixel and divided by the partition 7 is provided. Discharge occurs, and ultraviolet rays are generated,
Visible light is emitted from the RGB phosphors 11a to 11c excited by the ultraviolet rays, and is displayed as an image.

The front panel glass and the back panel glass are sealed with a discharge gas sealed therein. However, since the pressure of the sealed discharge gas is generally lower than the atmospheric pressure, the front panel glass and the back panel glass are large toward the inside. It is pushed by the air pressure, and the upper end of the partition 7, that is, the top of each rib, and the inner surface of the front panel glass 201 are in contact with each other, and the gap between the front panel glass 201 and the back panel glass 202 is maintained. Therefore, the upper end of the partition wall 7 and the inner surface of the front panel glass 201 do not need to be adhered to each other, and have a structure in which they are simply brought into contact.

Next, a method for manufacturing such a conventional PDP will be described with reference to the drawings.

FIG. 21 is a schematic partial sectional perspective view of the same conventional PDP as that shown in FIG.

As shown in FIG. 21, for a front substrate 4, an electrode 1 is formed on a glass substrate 201, a dielectric 2 is formed to cover the electrode 1, fired, and a protective film (Mg) is formed thereon.
O) 3 is formed by EB evaporation.

As for the back substrate 8, an electrode 5 is formed on a glass substrate 202, a dielectric film 6 is formed to cover the electrode 5, baked, and a barrier rib material is formed by printing on the entire surface. Thereafter, a portion where the partition 7 is not formed is scraped off by sandblasting, and the partition 7 is formed into a line shape through a firing step. After that, the phosphor 11 is filled between the ribs of the partition wall 7 by a printing method or the like, dried, and fired to manufacture.

The front substrate 4 and the back substrate 8 completed in this manner are coated with a low-melting glass as a sealing member 9 and then fired to seal them, thereby forming a chip tube (also referred to as a piping member) 13. After further evacuation, a rare gas is sealed and the chip is turned off to complete the PDP.

Next, the sealing of the rare gas using the tip tube 13 and the tip-off will be described in more detail with reference to FIGS.

That is, as shown in FIG.
When manufacturing a DP (vessel after gas filling), a piping member 13 communicating with a gas discharge space in the envelope 10 through a through hole 8 a formed in the lower panel substrate 8 is provided outside the lower panel substrate 8. Attach in position. Next, this piping member 13
After exhausting the inside of the envelope (vessel before gas filling) 10 and filling the discharge gas through the above, the inside of the envelope 10 is sealed with the sealing of the piping member 13. ing.

When the pipe member 13 is sealed, as shown in FIG. 22 (a), the sealing portion 13a of the pipe member 13 is softened and melted while being externally heated using a gas burner 14 or the like. Let it. Then, FIG.
(B) As shown in FIG.
A method of causing the material of the piping member 13 to contract by moving the lower portion of 3a away from the envelope 10 and then fusing the piping member 13 as shown in FIG. Have been done. As described above, in the conventional case, since the atmospheric pressure is higher than the internal pressure of the envelope 10, the sealing portion 13a of the pipe member 13 in which the material shrinks is completely closed due to the shrinkage of the inner wall portion of the pipe. Will be.

The lower panel substrate 8 has a piping member 13 used when exhausting the envelope 10 and filling the discharge gas.
Remain adhered using the same material as the sealing member 9.

[0019]

However, in the structure of the conventional PDP as described above, the front substrate 4 and the back substrate 8 are fixed around the frit glass (sealing member 9) for sealing. However, in most cases, the front substrate is fixed in such a manner that the front substrate is pressed against the partition wall by the pressure difference between the atmospheric pressure applied from the outside and the gas of 1 atm or less sealed between the front substrate and the back substrate, and the shape is maintained. .

The gas to be enclosed is generally 300 To
rr to 500 Torr, and the difference from the atmospheric pressure of 760 Torr is not so large.

For this reason, for example, a conventional PD is used for an airplane or the like.
When the P is mounted and the flight conditions are such that the air pressure inside the airplane is much lower than the normal atmospheric pressure, in the configuration of the conventional PDP, the inner surface of the front substrate is separated by a partition at the center of the PDP. There is a problem that the liquid crystal floats from the upper end portion of the liquid crystal and crosstalk occurs.

Also, even under normal atmospheric pressure, when vibration is applied to the PDP, the front substrate is temporarily separated from the partition walls, causing a problem that crosstalk occurs and an image is disturbed.

For this reason, the conventional PDP configuration has a problem that when mounted on a vehicle such as a train or a bus, the image is disturbed by vibration or the like.

Furthermore, the conventional PDP manufacturing process has many firing steps and requires a large number of electric furnaces, resulting in extremely high utility costs and realizing efficient production by energy saving. There was also a problem that it was difficult to do.

On the other hand, in the configuration of the conventional PDP described above,
There has been a problem that a sufficiently satisfactory luminance cannot always be obtained. In order to improve the brightness, the internal pressure of the discharge gas sealed in the envelope 10 is set to 500 Torr.
It is considered necessary to increase it to a level exceeding r.

However, in the conventional structure, the envelope 1
The internal pressure of the discharge gas within 0 is 760 Torr to 100
When the pressure is increased to 0 Torr, a gap occurs between the upper end of the partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4, or the upper panel substrate 4 and the lower panel substrate 8 Or swell toward.

As a result, the space portions 12 adjacent to each other and separated by the ribs of the partition walls 7 are connected to each other due to the above-mentioned gaps, and crosstalk occurs, thereby deteriorating the display quality of the PDP. Had the problem that When the internal pressure of the discharge gas sealed in the envelope 10 is close to the atmospheric pressure or is higher than the atmospheric pressure, the charged gas as described in the above-described conventional manufacturing method is used. There is also a problem that the sealing method using the atmospheric pressure which is higher than the pressure can no longer be adopted.

The present invention has been made in consideration of the above-described problems of the conventional plasma display panel, and provides a gas discharge panel which is less likely to cause crosstalk and can form a more stable image as compared with the conventional plasma display panel, and a method of manufacturing the same. The purpose is to:

Further, the present invention has been made in view of the above-mentioned problems of the above-mentioned conventional method of manufacturing a plasma display panel, and has an object to provide a method of manufacturing a gas discharge panel capable of reducing the number of firing steps as compared with the conventional method. Aim.

Another object of the present invention is to provide a gas discharge panel and a method of manufacturing the same, which can increase the luminance as compared with the related art, in consideration of the above-described problems of the conventional plasma display panel.

[0031]

According to a first aspect of the present invention, there is provided a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and a sealing portion provided on the second panel substrate. And a partition partitioning the gas discharge space, wherein the upper end of the partition is bonded to an inner surface of the first panel substrate.

According to a second aspect of the present invention, the bonding includes:
2. The gas discharge panel according to claim 1, wherein an adhesive member containing a light transmissive material is used.

According to a third aspect of the present invention, the bonding includes:
2. The gas discharge panel according to claim 1, wherein an adhesive member containing a light-absorbing material is used, and a material of the partition wall includes a light-reflective material.

According to a fourth aspect of the present invention, the width of the bonding portion between the upper end portion of the partition and the first panel substrate is such that the bonding portion does not protrude into the light emitting region in the partitioned gas discharge space. 4. The gas discharge panel according to claim 1, wherein the gas discharge panel is adjusted in the following manner.

According to a fifth aspect of the present invention, the bonding includes:
2. The gas discharge panel according to claim 1, wherein an adhesive member containing a fusible glass is used.

The present invention according to claim 6 is the gas discharge panel according to claim 1, wherein the softening point of the adhesive member is lower than the softening point of the partition walls.

The present invention according to claim 7 is the gas discharge panel according to claim 6, wherein the difference between the softening points of the adhesive member and the partition walls is not less than 20 ° C and not more than 200 ° C.

The present invention according to claim 8 is the gas discharge panel according to claim 5, wherein the partition has a hole at an upper end thereof, and the adhesive member penetrates the hole.

According to a ninth aspect of the present invention, there is provided the gas discharge panel according to the fifth or eighth aspect, wherein the partition walls are formed by a thermal spraying method.

According to a tenth aspect of the present invention, at least one of a surface of an upper end portion of the partition wall and a surface of a portion of the inner surface of the first panel substrate which is bonded to the upper end portion has: The gas discharge panel according to claim 1, wherein the gas discharge panel has an uneven shape.

The present invention according to claim 11 is the gas discharge panel according to claim 1, wherein all or a part of an upper end portion of the partition wall is adhered to an inner surface of the first panel substrate.

According to a twelfth aspect of the present invention, the partition wall comprises:
12. A plurality of long plate-shaped ribs arranged in parallel, and the bonding is performed using a bonding member formed in a line in a direction substantially orthogonal to a longitudinal direction of the ribs.
It is a gas discharge panel of description.

According to a thirteenth aspect of the present invention, there is provided the gas discharge panel according to the twelfth aspect, wherein the adhesive member includes a light absorbing material.

According to a fourteenth aspect of the present invention, a part of the upper end of the partition wall is bonded to the inner surface of the first panel substrate. 14. The gas discharge panel according to claim 11, wherein the bonding is performed in the vicinity.

According to a fifteenth aspect of the present invention, there is provided the gas discharge panel according to the first aspect, wherein a concave depression is formed at an upper end portion of the partition wall, and the bonding is performed using the depression. .

The present invention according to claim 16 is the gas discharge panel according to claim 1, wherein the partition wall and the second panel substrate are bonded by frit glass.

According to a seventeenth aspect of the present invention, there is provided the gas discharge panel according to the first aspect, wherein the gas discharge space is filled with a discharge gas having a pressure exceeding 500 Torr.

According to the present invention, there is provided a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A gas discharge panel, comprising: a partition member for separating an upper end portion of the partition wall from the first panel substrate; and an adhesive member used for bonding the upper end portion of the partition wall to the first panel substrate. Step of providing on the inner surface of, so that pressure is applied to at least the portion where the adhesive member is provided,
And a sealing step of forming a gas discharge space by applying pressure to the opposed first panel substrate and / or the second panel substrate.

The present invention according to claim 19, wherein the pressurizing is
19. The method for manufacturing a gas discharge panel according to claim 18, wherein the gas discharge panel is performed by using an elastic force of a spring member.

According to a twentieth aspect of the present invention, the pressurizing is
19. The method for manufacturing a gas discharge panel according to claim 18, wherein the method is performed using a load of a plate material.

According to a twenty-first aspect of the present invention, the pressurizing includes:
21. The method of manufacturing a gas discharge panel according to claim 20, wherein the method is performed by interposing a buffer member between the plate member and the panel substrate.

According to a twenty-second aspect of the present invention, a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels are provided. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A partition member for partitioning the gas discharge panel, comprising: an adhesive member containing fusible glass, an organic binder, and an organic solvent, which is used for bonding an upper end portion of the partition wall and the first panel substrate. And a heating step of heating the applied adhesive member to a temperature higher than the softening point of the fusible glass. This is a method for manufacturing a discharge panel.

According to a twenty-third aspect of the present invention, in the coating step and the heating step, the adhesive member is heated to such an extent that most of the organic binder and the organic solvent contained in the applied adhesive member are removed. A calcination step provided between the calcination step and the heating step, wherein the gas discharge panel is assembled using the first panel substrate, the second panel substrate, and the sealing portion. 23. The method for manufacturing a gas discharge panel according to claim 22, comprising an assembling step.

According to a twenty-fourth aspect of the present invention, a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels are provided. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A method of manufacturing a gas discharge panel, comprising: a partition wall forming a partition wall on the second panel substrate; and a bonding step between an upper end portion of the partition wall and the first panel substrate. An adhesive member to be disposed on the upper end portion, and the partition wall forming step,
A first step of providing a mask member having a predetermined opening on the second panel substrate, and a second step of providing the partition wall forming material in the opening, wherein the adhesive member providing step includes: A method for manufacturing a gas discharge panel, comprising: a third step of providing the adhesive member using the mask member on the upper end of the partition wall formed in the second step; and a fourth step of removing the mask member. It is.

According to a twenty-fifth aspect of the present invention, there is provided a method of manufacturing a gas discharge panel according to the twenty-fourth aspect, wherein a thermal spraying method is used in the second step and / or the third step.

The present invention according to claim 26 is the method for manufacturing a gas discharge panel according to claim 24 or 25, wherein the mask member contains a photosensitive material.

The present invention according to claim 27 is the method according to claim 26, wherein the mask member is a photosensitive resin film.

The present invention according to claim 28, wherein the material for the partition contains fusible glass, and the firing of the partition and the firing of the adhesive member are performed in the same step. This is a method for manufacturing a gas discharge panel.

The present invention according to claim 29, wherein a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels are provided. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A partition wall forming a partition on the second panel substrate, and a coating step of applying a fusible glass paste to an upper end of the partition. And a firing step of firing the fusible glass paste.

The present invention according to claim 30 is the method for manufacturing a gas discharge panel according to claim 29, wherein the coating step uses a screen printing method.

The present invention according to claim 31 is the method for manufacturing a gas discharge panel according to claim 30, wherein the screen mask used in the screen printing method does not have a pattern shape.

The present invention according to claim 32, wherein a part of the partition has light reflectivity, and the fusible glass paste is
32. The method for manufacturing a gas discharge panel according to claim 29, 30 or 31, having a light absorbing property.

According to a thirty-third aspect of the present invention, in the sintering step, the upper end portion of the partition wall and the inner surface of the first panel substrate are bonded using the fusible glass paste. 32. A method of manufacturing a gas discharge panel according to 30 or 31.

According to a thirty-fourth aspect of the present invention, there is provided a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A gas discharge panel, comprising: exposing a photosensitive material provided on the second panel substrate to form a groove; and forming a dielectric for forming the partition. Spraying a body material or frit glass into the groove formed by a thermal spraying method, wherein the thermal spraying process cools the second panel substrate along a flow of a material ejected from a thermal spray nozzle. Gas discharge panel for flowing gas It is a method of manufacture.

According to a thirty-fifth aspect of the present invention, the gas discharge panel has a dielectric film covering the second electrode, and the material of the dielectric film and the partition is alumina.
It is a manufacturing method of the gas discharge panel of a statement.

The present invention according to claim 36, wherein a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels are provided. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; And a partition partitioning the gas discharge panel, comprising: an assembling step of assembling the gas discharge panel using the first panel substrate, the second panel substrate, and the sealing portion; A step of attaching a pipe member communicating with the gas discharge space through a through hole formed in the first or second panel substrate to a panel substrate having the through hole, and using the pipe member, Discharge gas into gas discharge space And a sealing step of setting the ambient pressure of the pipe member higher than the internal pressure of the sealed discharge gas to seal the pipe member. It is.

According to a thirty-seventh aspect of the present invention, in the sealing step, the pipe member is heated and pressed from the outside to the inside of the pipe member so as to close the pipe portion of the pipe member. 37. The method of manufacturing a gas discharge panel according to claim 36, wherein the sealing is performed.

According to a thirty-eighth aspect of the present invention, in the sealing step, the pipe member is heated to melt the sealing member housed inside the pipe member, and the pipe part of the pipe member is melted. 37. The method according to claim 36, wherein the sealing is performed by closing the panel.

According to a thirty-ninth aspect of the present invention, in the sealing step, the outer peripheral portion of the pipe member is surrounded by using a cylindrical member, and a portion of the pipe member surrounded by the cylindrical member is heated. 37. The method of manufacturing a gas discharge panel according to claim 36, wherein the sealing is performed by pressing the pipe member along an axial direction of the tubular member so that a portion is closed.

The present invention according to claim 40, wherein a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and the first and second panels are provided. A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the substrate and the gas discharge space provided on the second panel substrate; A gas discharge panel, comprising: a partition member for separating an upper end portion of the partition wall from the first panel substrate; and an adhesive member used for bonding the upper end portion of the partition wall to the first panel substrate. And a step of adhering the upper end of the partition wall and the first panel substrate with the adhesive member.

[0071]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a gas discharge panel and a method for manufacturing the same according to the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 shows a plasma display panel (PDP) as an embodiment of a gas discharge panel of the present invention.
It is a figure which shows the general | schematic partial cross section. The configuration of the PDP according to the present embodiment will be described with reference to FIG.

In the present embodiment, except that the frit glass 31 is used as an adhesive member of the present invention, FIG.
Is basically the same as that of the conventional PDP described with reference to FIG. The frit glass 31 will be described later.

That is, in FIG. 1, reference numeral 21 denotes a front panel glass, and reference numeral 22 denotes a back panel glass. A display electrode 24 is patterned on the front panel glass 21, and a dielectric film 28 and a protective film 29 are formed thereon.
Are laminated to form a front substrate 104.

On the other hand, the back substrate 108 is composed of a back panel glass 22, an address electrode 23 patterned on the back panel glass 22, a partition wall 30, and a phosphor 25. The partition 30 is formed integrally with a dielectric film covering the address electrode 23, and is formed by spraying alumina in the present embodiment. Note that, as described above, the partition 30 is also configured integrally with the dielectric film, which is different from the configuration in FIG. The partition 30 is composed of a plurality of plate-shaped ribs.

The PDP 100 includes the front substrate 104
And the back substrate 108 are opposed to each other, and are sealed by a sealing member (not shown) made of low-melting glass to form a gas discharge space between the outer peripheral edge portions thereof. 300 Torr to 500 Torr in space
In this configuration, a rare gas of r (mixed gas of helium and xenon) is sealed. In addition, the partition 30 is a means for partitioning the gas discharge space. The space 112 thus partitioned becomes a light emitting area.

Next, the frit glass 31 which is a feature of the present embodiment will be described.

The frit glass 31 is previously applied to the upper end of the partition 30 in the manufacturing process. And
The front substrate 104 and the back substrate 108 are arranged to face each other, and the panel is sealed, so that the inner surface of the front substrate 104 is
0 is bonded to the upper end.

Also, there are some small holes on the surface of the partition 30. These holes can be formed when the partition wall 30 is formed by a thermal spraying method. Frit glass 31
Penetrates into the above-mentioned hole of the partition wall 30 during melting, so that the partition wall 3
0, and the adhesive strength between the two substrates 104 and 108 increases.

The partition 30 and the dielectric integrated with the partition 30 can be manufactured by printing or the like. The partition 30 and the lower dielectric may be made of the same material or different materials.

As a result, good image quality can be realized with less crosstalk and image disturbance.

With such a configuration, the pressure of the sealed gas can be increased to the atmospheric pressure or higher. In this case, a PDP with high luminance and high efficiency can be realized. (Embodiment 2) FIG. 2 shows a schematic partial cross section of a PDP which is a second embodiment of the gas discharge panel of the present invention. The configuration of the PDP of the present embodiment will be described below with reference to FIG.

The structure of the PDP of the present embodiment is
Except that the bottom of is bonded to the back substrate 108 side by the frit glass 52, the configuration is almost the same as that shown in FIG.

The partition 50 has a bottom 50b and an upper end 50.
Frit glass 31, 52 is applied to a in advance.

Frit glass 31 used for bonding the inner surface of front substrate 21 and upper end 50a of partition 50
May be applied to the upper end portion 50a of the partition 50 in advance, or may be applied to the inner surface of the front substrate 21 in advance by pattern application and adhered to the partition 50.

On the other hand, the frit glass 52 between the partition 50 and the dielectric 53 is effective when the material of the partition 50 and the material of the dielectric film 53 are different and the adhesive strength of both is relatively weak. Further, the frit glass 52 has a function of strengthening the partition wall 50 by penetrating the hole formed in the partition wall 50. The frit glass 52 may be formed at the same time when the partition 50 is formed, or may be patterned on the dielectric 53 in advance, and the partition 50 may be formed thereon. As described above, according to the present embodiment, the same effects as in the first embodiment are exhibited. (Embodiment 3) FIGS. 3 (a) to 3 (e) are views showing schematic steps of an embodiment of a method for manufacturing a gas discharge panel of the present invention. The method of manufacturing the PDP according to the present embodiment will be described below with reference to FIG.

As shown in FIG. 3A, 61 is an address electrode, and 62 is a back panel glass. In this step, the address electrodes 61 are
2 is formed by patterning.

Next, as shown in FIG. 3B, reference numeral 63 denotes a dielectric film. The dielectric film 63 is applied to cover the surfaces of the address electrodes 61 and the back panel glass 62.

Thereafter, as shown in FIG. 3C, a resist 64 is applied to the surface of the dielectric film 63 and is patterned by exposing.

Next, as shown in FIG. 3D, a partition 65 mainly composed of alumina is buried by a thermal spraying method in a place where the resist 64 has come off.
Embed The frit glass 66 may be embedded by thermal spraying, or may be embedded by another method, for example, printing or simple squeezing.

Thereafter, as shown in FIG. 3E, the resist 64 is then peeled off, leaving the partition wall 65 coated with frit glass 66 on the upper end.

The back substrate manufactured through the above-described series of steps is disposed so as to face the front substrate, sealed through a firing step, and sealed with gas.

By the above method, a PDP having a structure similar to that described in the first and second embodiments, in which the front substrate and the back substrate are bonded by the upper end of the partition wall 65, can be obtained very easily.

By adopting such a method, the baking process of the partition wall becomes unnecessary and energy saving is obtained.

Further, after the formation of the partition walls by the thermal spraying method and the application of the frit glass are completed, the phosphor is applied to the partition walls 6.
5 is applied between the ribs, and the firing of the phosphor and the bonding and sealing of the two substrates are performed simultaneously, whereby the firing step can be made one.

That is, in the conventional case, the baking process of the partition wall, the baking process of the phosphor, and the baking process performed at the time of sealing the entire panel are provided independently of each other.
According to the present embodiment, the number of firing steps can be reduced by two, and a great effect can be expected for reduction of equipment and reduction of utility cost.

When a fusible glass is contained as a material for the partition walls, a baking step is required. By performing the baking step at the same time as the baking step for sealing the entire panel,
As in the above case, the number of firing steps can be reduced by two compared to the conventional case.

When the bonding member used for bonding the upper end portion of the partition wall and the inner surface of the front substrate contains fusible glass, an organic binder and an organic solvent, the organic binder and the organic solvent contained in the bonding member are used. In order to remove this, heating by preliminary firing is required. This calcination step is provided after applying the adhesive member and before sealing the panel. (Embodiment 4) FIGS. 4 (a) to 4 (e) are schematic views showing the steps of an embodiment of a method for manufacturing a gas discharge panel according to the present invention. The method of manufacturing the PDP according to the present embodiment will be described below with reference to FIG.

As shown in FIG. 4A, 71 is an address electrode, 72 is a dielectric, and 73 is a back panel glass. A mixture of alumina and frit glass, which is a material for forming the partition wall 74, was formed on one surface of the dielectric 72 (the reference numeral 701 in the figure).

Thereafter, as shown in FIG. 4B, one surface of the frit glass 75 is formed. The partition wall 74 and the frit glass 75 are formed by thermal spraying.

The frit glass 75 may be applied by a printing method or the like and fired.

Thereafter, as shown in FIG. 4C, the resist 76 or a dry film is exposed to perform patterning.

Thereafter, as shown in FIG. 4D, a portion where the resist 76 is not adhered is removed by sand blast, thereby forming the partition wall 74. The frit glass film described with reference to FIG. 4B is attached to the upper end of the partition wall 74.

Thereafter, as shown in FIG. 4E, a panel is assembled using a front substrate, a back substrate, and a sealing member, and sealing is performed by firing, and at the same time, adhesion to the partition wall 74 is performed. As described above, the sealing and the bonding between the upper end of the partition wall 74 and the inner surface of the front substrate are preferably performed at the same time from the viewpoint of realizing energy saving in the manufacturing process. Of course, it is good.

The phosphor 78 is applied after the formation of the partition wall 74, and the phosphor 78 may be fired at the time of the sealing or individually before the sealing.

This manufacturing method can also reduce the number of sintering steps, which is very effective in reducing equipment and energy costs.

In this embodiment, since the frit glass is mixed with alumina as a material for the partition walls, the frit glass fills the pores of the alumina during sealing.
The porosity is reduced, and a partition wall with less outgas can be realized. Therefore, it is possible to reduce the contamination due to the impurity gas and extend the life of the panel. (Embodiment 5) FIG. 5 is a schematic explanatory view of a method of forming a partition wall by a thermal spraying method, which is an embodiment of a method of manufacturing a gas discharge panel of the present invention. The thermal spraying method according to the present embodiment will be described below with reference to FIG.

As shown in FIG. 5, reference numeral 81 denotes a spraying torch;
2 is a cooling gas. The cooling gas 82 cools unnecessary heat generated again by thermal spraying, and can keep the substrate temperature at 200 ° C. or less. Reference numeral 83 denotes a raw material powder, which supplies a material for forming the partition wall 84 and the frit glass 87 in powder form. Reference numeral 86 denotes a dry film which masks a place where a partition is not desired to be formed. 85 is a back panel glass, 89 is an address electrode, and 88 is a dielectric film.

Of the raw material powder 83 melted and ejected from the thermal spraying torch 81, the material of the partition wall is formed in the gap of the dry film 86 which has been exposed and developed in advance, and is formed to a depth of about 60% of the gap depth. Thereafter, frit glass 87 is sprayed to form a film. Since the thermal spraying is performed while being cooled by the cooling gas 82, the dry film 86 is cooled to a temperature at which no damage occurs. Thereafter, the dry film is peeled off to obtain a film in which the frit glass 87 is formed on the partition 84.

According to the present embodiment, a partition can be formed by a very simple method, and a film in which frit glass is formed on the upper end of the partition can be obtained.
It has a great effect on equipment reduction and utility cost reduction.

As described above, according to the present embodiment, since the front substrate and the back substrate are bonded to each other, even when the internal pressure of the PDP increases, the panel swells at the center of the panel as in the related art. Nothing.

Further, even when vibration is applied, another vibration does not occur due to a difference in resonance frequency due to a difference in mass between the front substrate and the back substrate.

Therefore, according to the present embodiment, even in a place where the atmospheric pressure is likely to be unstable, such as in an airplane, a place where the atmospheric pressure is low, or an environment where there is a lot of vibration, the crosstalk and image quality can be improved. And good image quality can be realized.

Further, with the above configuration, it is possible to increase the pressure of the charged gas to a level higher than the atmospheric pressure, thereby realizing a PDP with high luminance and high efficiency.

In addition, by implementing the manufacturing method of the present invention, it is possible to greatly reduce the number of sintering steps, and it is possible to expect a great effect on the reduction of equipment and the cost of utilities.

As is clear from what has been described in each of the above embodiments, the PDP of the present invention is, for example,
A partition formed on a back substrate or a front substrate has a configuration in which the other substrate is bonded to the other substrate by frit glass. Further, in the manufacturing method, for example, a partition wall is formed by a thermal spraying method, and a frit glass to be applied to the upper end thereof is also formed by a thermal spraying method, so that the partition wall and the front substrate are bonded, and the front substrate and the back substrate are sealed. The deposition and the firing of the phosphor are performed at once.

Therefore, since the front substrate and the back substrate are bonded via the frit glass at the upper part of the partition wall, even if the gas pressure in the panel becomes higher than the external pressure, the panel may be broken or the panel may swell. Not even. Therefore, a good image can be obtained and safety is high even when mounted on an airplane or the like without causing problems such as crosstalk. Further, even if vibrations or the like are applied to the panel, the front substrate and the back substrate are bonded, so that each substrate does not bend, and a good image can be obtained even in a train, a car, or the like. In addition, since the pressure of the discharge gas sealed inside can be increased to the atmospheric pressure or more by implementing the present invention, a PDP with high luminance and high efficiency can be realized.

On the other hand, unlike the conventional method, the number of firing steps can be reduced by simultaneously performing the bonding between the partition walls and the front substrate, the sealing between the front substrate and the back substrate, and the firing of the phosphor. This reduces the amount of electrical energy required and reduces costs.

Hereinafter, embodiments of a gas discharge panel and a method of manufacturing the same according to the present invention will be described with reference to the drawings. (Embodiment 6) FIG. 6 is a cutaway perspective view showing a simplified configuration of a main part of a PDP according to an embodiment of the gas discharge panel of the present invention, FIG. 7 is a sectional view showing a modification thereof, and FIG. FIG. 4 is an explanatory view showing a method of sealing a pipe member in the PDP manufacturing method according to the present embodiment. 9 to 11
FIG. 9 is an explanatory view showing a first modification to a third modification of a method of sealing a piping member and a procedure of sealing the piping member.

The overall structure of the PDP according to the present embodiment is as follows.
Since there are many basically the same parts as the conventional PDP described in FIGS. 20 and 21, the same or corresponding parts or parts as those described in FIGS. 20 and 21 are denoted by the same reference numerals.

As shown in FIG. 6, in the envelope 10 according to the present embodiment, the upper panel substrate 4 and the lower panel substrate 8 are arranged to face each other, and the outer peripheral edges of the panel substrates 4 and 8 are connected to each other. Is sealed by a sealing member 9 made of low melting point glass to form a discharge space inside.

The upper panel substrate 4 includes a plurality of display electrodes 1.
In addition, this is a glass substrate on which a dielectric layer 2 made of low-melting glass and a thin protective layer 3 made of magnesium oxide, which cover these display electrodes 1, are formed on the inner surface.
Further, the lower panel substrate 8 has a plurality of data electrodes 5 and a dielectric layer 6 made of low-melting glass which are arranged along a direction orthogonal to the display electrodes 1 on an inner surface thereof. It is a glass substrate on which low-melting-point glass partitions 7 that define light-emitting regions are formed in parallel at predetermined positions on the body layer 6.

At the uppermost ends of these partition walls 7, a low melting point material such as frit glass (melting point: about 450 ° C.) or water glass having a melting point lower than that of the partition walls 7 made of a material having a melting point of 500 to 600 ° C. The partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4 are bonded to each other via the bonding member 15.

The material for forming the adhesive member 15 is as follows.
It is also possible to use an ultraviolet adhesive having low hygroscopicity and low outgassing or a general sealing material in a vacuum device. Here, it is assumed that the material of the adhesive member 15 has a lower melting point than the partition wall 7 in consideration of the convenience in the manufacturing process. However, if there is no problem in the manufacturing process, a general adhesive having an unlimited melting point may be used. It is also possible to use. Further, the adhesive member 15 may not be provided over the entire length of the rib of the partition wall 7. That is, it is a matter of course that the adhesive member 15 may be provided in a separated state at each predetermined position.

As shown in FIG. 7, a portion 2a to be bonded on the dielectric layer 2 of the upper panel substrate 4, that is, a predetermined portion bonded to the upper end portion of the partition wall 7 with the bonding member 15 interposed therebetween. The formation portion 6a of the partition wall 7 on the dielectric layer 6 of the lower panel substrate 8, that is, both or one of the predetermined portions 2a and 6a of the dielectric layer 2 and the dielectric layer 6 are formed with fine irregularities. May be formed as a rough surface portion. With such a configuration, the anchor effect is exhibited by the rough surface.

That is, the thin protective film 3 and the adhesive member 15
The bonding strength between the dielectric layer 2 of the upper panel substrate 4 and the upper end of the partition wall 7 and the bonding strength between the dielectric layer 6 of the lower panel substrate 8 and the bottom of the partition wall 7 are increased, respectively. Will be.

In order to provide such a rough surface portion, a general method such as executing a sand blasting process after covering a portion that does not need to be roughened with a mask may be used. Further, in this case, since the dielectric layer 6 of the lower panel substrate 8 is covered with the phosphor 11, it is possible to roughen the entire surface of the dielectric layer 6.

Further, a phosphor 11 for realizing a color display is applied on the dielectric layer 6 for each light emitting area partitioned by the partition wall 7. Also, inside the envelope 10 in which the upper panel substrate 4 and the partition walls 7 on the lower panel substrate 8 are bonded via the bonding member 15, a discharge gas formed by mixing helium, xenon, neon, or the like is supplied at 500 Torr.
Internal pressure exceeding 760 Torr or 1000 To
It is sealed after having an internal pressure of rr.

In this case, as shown in FIG. 6, a pipe member 13 used at the time of exhausting the envelope 10 and at the time of filling the discharge gas is sealed at a predetermined portion of the lower panel substrate 8. It remains bonded using a material equivalent to 9.

Further, according to the present configuration, even if the outer ambient pressure of the envelope 10, that is, the internal pressure of the envelope 10 is higher than the atmospheric pressure, the upper panel substrate 4 and the lower panel substrate 8 are connected to each other. The partition 7 is adhered by an adhesive member 15 provided at the uppermost end. Therefore, the adjacent space portions 12 that are light emitting regions do not communicate with each other via the gap,
The separation between the adjacent space portions 12 is reliably ensured, and the panel substrates 4 and 8 do not bulge outward and deform.

In this case, the envelope 10 provided in the PDP is
Is filled with a discharge gas having a pressure exceeding 500 Torr.
The pressure does not need to be higher than Torr, and it goes without saying that the sealing pressure may be 500 Torr or less.

That is, the PDP is also used in aircraft and trains, and changes in air pressure when the aircraft suddenly rises or falls suddenly and vibrations generated by running trains are caused by PDP.
However, if the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 are adhered to each other with the adhesive member 15 provided at the uppermost end of the partition wall 7, the pressure change and the Even when the vibration is applied, the envelope 10 cannot swell outward and deform.

Next, as one embodiment of the method for manufacturing a gas discharge panel according to the present invention, a method for manufacturing a PDP having the above-described structure will be described with reference to the drawings.

First, the upper panel substrate 4 on which the display electrode 1, the dielectric layer 2 and the protective layer 3 are formed, the data electrode 5, the dielectric layer 6 and the partition 7 are formed, and the phosphor 11 is applied. The manufactured lower panel substrate 8 is manufactured.

Then, after preparing both of these panel substrates, an adhesive member 15 made of a low melting point material such as frit glass is provided on the uppermost end of the partition wall 7 in the lower panel substrate 8.

When the bonding member 15 is provided, a method such as screen printing or transfer using a stamper is employed. However, after the bonding member 15 is provided by a method such as lift-off, the phosphor 11 is removed. It is also possible to apply. If the partition 7 is formed by a plurality of times of screen printing or the like, it is possible to provide the adhesive member 15 by forming only the uppermost layer with frit glass or the like, or to provide the lower panel substrate. It is also possible to apply frit glass or the like to be the adhesive member 15 to a predetermined portion on the upper panel substrate 4 corresponding to the partition wall 7 on the upper surface 8. By the way, in screen printing, it is general that a pattern through which an adhesive material having a predetermined viscosity passes is formed in advance on a screen plate abutting on the uppermost end of the partition wall 7, but the screen plate itself is adhered over the entire surface. It is a matter of course that the adhesive member 15 may be provided only on the uppermost end of the partition wall 7 by screen printing after allowing the material to pass through.

Next, the upper panel substrate 4 and the lower panel substrate 8 are arranged to face each other via the partition wall 7 on which the adhesive member 15 is provided as described above. The heating is performed after the sealing member 9 is interposed between the edge portions. As a result, the outer peripheral edge portions of the upper panel substrate 4 and the lower panel substrate 8 are sealed by the sealing member 9, and as a result, the envelope 10 is formed.
The upper panel substrate 4 and the lower panel substrate 8 are bonded to each other by the bonding member 15 melted in the heating step at that time.

Further, through the through holes 8a formed in the lower panel substrate 8 constituting the envelope 10, the envelope 10
A piping member 13 communicating with the inside is attached to an external position of the lower panel substrate 8.

Then, the exhaust process and the discharge gas enclosing process in the envelope 10 are executed via the piping member 13.

Thereafter, when the inside of the envelope 10 is sealed by sealing the piping member 13, the PD shown in FIG.
P is completed.

When the discharge gas having a pressure exceeding 500 Torr is sealed in the envelope 10, the piping member 13
Is performed, for example, by a method as shown in FIG.

That is, as shown in FIG. 8, first, the through holes 8 provided in the lower panel substrate 8 constituting the envelope 10 are formed.
The pipe member 13 communicating with the inside of the envelope 10 through the a is attached to the lower panel substrate 8. Then, the envelope 10 to which the pipe member 13 is attached is placed at a predetermined position in the high-pressure chamber 16, and a heating means 17 such as a high-frequency heater or an electric heater is provided around the outer periphery of the sealing portion 13 a of the pipe member 13. Place along.

[0143] Then, the envelope 1 is
The inside of the envelope 10 is evacuated, and a discharge gas is filled in the envelope 10 until the internal pressure reaches a required internal pressure exceeding 500 Torr.

After that, the internal pressure of the high-pressure chamber 16 is set higher than the internal pressure of the discharge gas sealed in the envelope 10.

Since the internal pressure of the high-pressure chamber 16 is higher than the internal pressure of the envelope 10, the sealing of the piping member 13 can be performed in the same procedure as in the conventional embodiment.

That is, the sealing portion 13a of the pipe member 13
Is softened and melted while being heated by the heating means 17, and the portion below the sealing portion 13 a is blown away from the envelope 10.
3 is closed, and the inside of the envelope 10 is sealed with the sealing of the piping member 13. Here, the outer peripheral pressure of the entire envelope 10 is set to be higher than the internal pressure of the discharge gas, and then the piping member 1
3 is sealed, but it is not necessary to adopt such a large-scale method.
It is of course possible to seal the piping member 13 in the same manner as in the conventional embodiment only by setting the outer peripheral pressure of 3 to be higher than the internal pressure of the discharge gas sealed in the envelope 10. It is.

Next, a modified example of the method and procedure for sealing the piping member 13 will be described with reference to FIGS.

First, FIGS. 9A to 9C show a first modification of the method and procedure for sealing the piping member 13. FIG.

In adopting this method, a sealing jig 17, that is, a semicircular cross-section in which the pipe member 13 is pressed in the radial direction from at least two directions facing the pipe member 13 in the radial direction. Projection 17a of shape or triangular shape
Is formed, and a sealing jig 17 having a function of heating the pipe member 13 via the projection 17a is used. That is, in this method, the through holes 8 formed in the lower panel substrate 8 which is one side panel substrate are provided.
9A, after the piping member 13 communicating with the inside of the envelope 10 is attached through a and the exhaust of the envelope 10 and the filling of the discharge gas are performed through the piping member 13. As shown in FIG. 9, after the projection 17 a of the sealing jig 17 is applied to the cut-off portion 13 a of the pipe member 13,
As shown in FIG. 9B, the pipe member 13 is heated while being pressed in the radial direction by the projections 17a of the sealing jig 17, and then, as shown in FIG. Then, the melted pipe member 13 is blown.
When this method is adopted, as a result of being pressed by the projections 17a of the pipe member 13 that has been softened and melted by heating despite the inner pressure of the envelope 10 being higher than the atmospheric pressure, Since the sealing portion 13a is closed, the pipe member 13 can be easily sealed,
The envelope 10 is now sealed.

Further, as in a second modification shown in FIG.
A cylindrical heating jig 18 is externally fitted to the pipe member 13, and the heating jig 18 is heated by a gas burner 14 or the like, so that the sealing cut 13
After softening and melting the sealing member 13a, the lower portion of the sealing portion 13a is pressed in the direction of the arrow, and the piping member 13 is sealed in such a manner that the sealing portion 13a is twisted while approaching the envelope 10. It is also possible. Here, the heating jig 18 is a pipe member 1 having an internal pressure higher than the atmospheric pressure.
What is necessary is just to be able to prevent the bulging 3 from bulging outward. Although not shown, it may be made using a metal net or the like. If the heating jig 18 is fixed to the piping member 13, the heating jig 18 is left fixed to the piping member 13. It goes without saying that any inconvenience does not occur even if 18 is left.

Further, FIGS. 11 (a) and 11 (b)
It is also possible to adopt a sealing method of the piping member 13 as shown in place of the above sealing method.

That is, in the method according to the third modification, the piping member 13 communicating with the inside of the envelope 10 through the through hole 8a formed in the lower panel substrate 8, which is one of the panel substrates, is attached. After the exhaust of the envelope 10 and the filling of the discharge gas are sequentially performed through the pipe member 13, as shown in FIG. 11A, a short rod shape made of a material having a lower melting point than the pipe member 13 is used. The sealing member 19 that has been manufactured as described above and housed in the pipe member 13 is melted while being heated from the outside with a gas burner 14 or the like, and then, as shown in FIG. Is closed and then sealed. Unnecessary portions of the pipe member 13 sealed with the sealing member 19 are removed after employing a method such as cutting. Note that the sealing member 19 at this time may be one that has been stored in the piping member 13 in advance, but may be one that has been inserted and stored in the piping member 13 that has been attached to the lower panel substrate 8. Further, a black pigment or the like may be mixed therein, and may be excellent in heat absorption, and may be melted by laser light irradiation.

It should be noted that the above-described charged gas pressure is 500
If the discharge gas of Torr or less is sealed in the envelope 10, it is general to adopt a manufacturing method having the same procedure as the conventional method. However, in such a case, that is, even when the internal pressure of the envelope 10 at the time of manufacturing is lower than the external pressure, the method of the present embodiment may of course be adopted.

As is apparent from the above description, the gas discharge panel according to the present invention has a structure in which, for example, the panel substrates constituting the envelope are bonded together via the bonding member provided at the uppermost end of the partition wall. In this case, a discharge gas having a pressure exceeding 500 Torr may be sealed in the envelope. In addition,
Here, the adhesive member is preferably made of a material having a lower melting point than the partition wall. Then, when an envelope having a configuration in which the panel substrates are bonded to each other is employed, it is impossible for the envelope to expand outward and deform,
In addition, when a configuration in which a discharge gas having a pressure exceeding 500 Torr is sealed in the envelope is employed, there is an advantage that the brightness of the gas discharge panel is improved. The improvement in the brightness of the gas discharge panel is due to the improvement in the gas discharge efficiency.

[0154] Meanwhile, production of the gas discharge panel according to the present invention
The method is, for example, that the internal pressure of the
Pressure is higher than the pressure
The outer ambient pressure of the member is controlled by the discharge gas sealed in the envelope.
Pressure, and then seal the piping members.
Alternatively, at least two pipe members facing each other in the radial direction
After heating while pressing the piping member from the direction, the piping part
Sealing material or sealing housed in piping member
The pipe member by melting the
It is characterized by. And according to these manufacturing methods
For example, if the internal pressure of the envelope is higher than the external pressure,
In addition, the sealing of piping members can be performed easily and reliably.
Become.

As described above, according to the gas discharge panel of the present invention, for example, the panel substrates forming the envelope are bonded together via the bonding member provided at the uppermost end of the partition. With such a configuration, there is obtained an effect that a gap is not generated between the partition wall and the panel substrate, and that the envelope does not bulge outward and deform. Therefore, even if a discharge gas having a pressure exceeding 500 Torr is sealed in the envelope, no inconvenience will occur, and the brightness of the gas discharge panel can be improved.

According to the gas discharge panel manufacturing method of the present invention, for example, the internal pressure of the discharge gas sealed in the envelope at the time of manufacture is close to or higher than the atmospheric pressure. Even in such a case, the pipe member can be easily and stably sealed. As a result, an effect that a gas discharge panel with improved luminance can be easily manufactured is obtained.

In the above-described embodiment, as a means for forming the adhesive member 15 on the upper end of the partition wall 7, for example, screen printing or the like can be considered. However, the uppermost end of the partition wall 7 is a very thin and long region, and it may be difficult to form the adhesive member 15 thereon uniformly.

The partition 7 is formed by a method such as printing, lift-off, or sand blasting, and the uppermost end may have an uneven shape. Particularly, the adhesive member may not be formed in the concave portion at the uppermost end of the partition wall 7,
At that part, the upper panel substrate 4 and the partition 7 cannot be bonded,
It is conceivable that such a portion may lead to deterioration of display quality.

When the amount of the adhesive member 15 formed is large, or when the adhesive member 15 is formed beyond the width of the partition wall 7,
It is conceivable that the width of the bonding member 15 after bonding becomes larger than the width of the partition wall 7, and in that portion, the light emitting region viewed from the outside of the upper panel substrate 4 is narrowed, which may cause a decrease in luminance.

On the other hand, the conventional sealing member 9 is formed only on the outer peripheral edge of the panel substrate, and at the time of sealing, only the outer peripheral edge of the panel substrate is pressed. However, in order to realize an envelope that can easily prevent deformation, it is necessary to securely bond the partition 7 and the upper panel substrate 4 with the adhesive member 15 as described above. In some cases, it is conceivable that sufficient pressure cannot be achieved in the display area inside the panel substrate by pressing only the peripheral edge.

In consideration of these points, a gas discharge panel capable of more reliably preventing the deformation of the PDP and realizing an improvement in luminance and a method of manufacturing the gas discharge panel will be described below.

FIG. 12 is a plan view for explaining the application of the adhesive member 15. FIG. 14 is a plan view according to the modification. FIG. 13 shows a PDP according to the present embodiment.
FIG. 4 is a schematic cross-sectional view for explaining the relationship between the material particle diameter of the adhesive member and the partition wall width. FIG. 17 is a cross-sectional view illustrating a pressing method at the time of sealing, and FIGS. 18 and 19 are cross-sectional views illustrating a specific method of pressing at the time of sealing.

Since the overall configuration of the PDP in the present embodiment is basically the same as that described with reference to FIG.
In the following description, the same or corresponding parts and portions are denoted by the same reference numerals as in FIG. 6, and description thereof will be omitted.

The PDP according to the present embodiment is as described with reference to FIG.

That is, as shown in FIG. 12, an adhesive member 15 made of a transparent material is provided on the uppermost end of the partition wall 7 in a line along the longitudinal direction of the partition wall 7. The partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4 are adhered to each other via an adhesive member 15.

As described above, the adhesive member formed on the uppermost end of the partition wall 7 may partially extend beyond the width of the partition wall due to unevenness in the application amount or the like. In addition, when the adhesive member is adhered to the upper panel substrate 4 and the amount of application is large, the adhesive member may be pushed out at the top of the partition wall and may protrude into the light emitting region beyond the partition wall width.

However, since the present adhesive member 15 is a transparent material, even if it slightly protrudes into the light emitting region, it does not block the light emission, and does not cause deterioration in display characteristics, particularly luminance.

Further, a phosphor 11 for realizing a color display is applied on the dielectric layer 6 for each light emitting area partitioned by the partition wall 7. Then, inside the envelope 10 in which the upper panel substrate 4 and the partition walls 7 on the lower panel substrate 8 are adhered via the adhesive member 15, a discharge gas formed by mixing helium, xenon, neon, or the like is charged for 500T.
Internal pressure exceeding orr, for example, 760 Torr or 100
It is sealed after having an internal pressure of 0 Torr.

Next, a modification of the bonding member 15 will be described with reference to FIG.

Conventionally, frit glass used as an adhesive member contains a filler such as ceramics in a material such as lead oxide in order to adjust thermal characteristics and obtain adhesive strength to a glass substrate.

FIG. 13 shows a case where the maximum particle diameter D of a material such as a filler contained in the adhesive member 15 does not exceed W with respect to the width W of the partition wall 7. In this case, the adhesive member 1
5 does not protrude from the partition wall width when the largest particle is located at the center of the partition wall 7, and does not largely protrude from the partition wall width even if the maximum particle is formed slightly deviated from the center of the partition wall 7. After the upper panel 4 is bonded, a PDP with good display characteristics can be realized without covering the display area with the bonding member 15. In this case, it is important that the partition does not protrude significantly from the width of the upper end portion of the partition after bonding.
With the above configuration, it can be realized. Here, the phrase “do not protrude significantly from the width of the upper end portion of the partition wall” means that the width of the fluorescent region in each space portion 12 (see FIG. 6) is not reduced to a width that substantially reduces. The fluorescent region is determined by the application region of the phosphor 11 applied to each space portion 12.

Although not shown, if there is a gap exceeding 5 μm between the partition and the upper panel substrate, display deterioration such as crosstalk occurs when the panel is turned on.

On the other hand, if the size of the particles contained in the adhesive member is large, unevenness in the formation of the adhesive member is likely to occur, and there is a possibility that the partition wall and the upper panel will adhere only to the portion where the largest particles exist. Therefore, the maximum particle size of the adhesive member is 5 μm.
m is more desirable. In the present embodiment, the width W of the rib of the partition (see FIG. 13) is about 40 μm.

A PDP according to another modification of the bonding member 15 will be described with reference to FIG.

Although the above-mentioned adhesive member 15 is provided at the uppermost end of the partition wall 7, in this example, it is provided in a line on the inner surface of the upper panel substrate 4. That is, as shown in FIG. 14, the main adhesive member 15 extends in a direction substantially intersecting with the partition wall 7 formed on the lower panel substrate 8 (for example, in a direction substantially perpendicular to the extending direction (longitudinal direction) of the partition wall 7). 2), a line is provided at the center of one group of display electrodes arranged in pairs and one group of display electrodes adjacent thereto.

In this case, the method for forming the adhesive member 15 may be screen printing or drawing with a dispenser or the like. The two panel substrates 4 and 8 facing each other at the intersection of the adhesive member 15 and the partition wall 7 are bonded. Here, since the adhesive member 15 is formed on a plane,
In addition to being easily formed, the partition wall 7 and the adhesive member 15 are both linear and substantially intersect with each other, so that the alignment at the time of sealing is also facilitated. Also, the adhesion is more reliable.

The adhesive member 15 also has a function of visually separating pixels adjacent in the longitudinal direction of the partition wall 7 so as to prevent the envelope 10 from expanding outward and deforming. It is also effective for improving the contrast.

In this embodiment, the case where the adhesive member 15 is formed only on the inner surface of the upper panel substrate 4 has been described. However, the adhesive member 15 is also formed on the uppermost end of the partition wall 7 formed on the lower panel substrate 8. Even if there is no problem, an adhesive member is sufficiently formed on the adhesive portion to ensure the adhesion, which is more effective.

When the adhesive member 15 shown in FIGS. 13 and 14 is made of a light absorbing material, it goes without saying that the PDP contrast is further improved.

A PDP according to another modification of the bonding member 15 will be described with reference to FIG. Although the above-mentioned adhesive member 15 is provided on almost the uppermost portion of the partition wall 7 and adheres to the upper panel substrate 4, it is not always necessary to adhere on most of the portion, and as shown in FIG. Also effective in bonding.

As described above, these adhesions not only have the effect of preventing the panel from bulging outward and being deformed, but also have the effect of preventing the panel from being bonded to the upper panel substrate formed at the uppermost end of the partition wall. By filling the gap with an adhesive member and completely separating each discharge cell (discharge space), there is also an effect of preventing crosstalk between discharge cells.

At this time, a portion to be bonded and a portion not to be bonded can be arbitrarily selected. As shown in FIG. 15, a portion of the upper end of the partition wall which crosses the display electrode 1 and a portion in the vicinity thereof are provided. It is more desirable to provide the adhesive member 15 in the first position. This is because a larger discharge occurs in such a portion.

Although FIG. 15 shows an example in which the adhesive is uniformly applied to all the portions in the vicinity of the display electrode 1, it is not always necessary that the adhesive is uniform. Alternatively, the uppermost end of the partition wall may be partially adhered in a line shape.

Here, another example according to the present embodiment will be described with reference to FIG. PD according to the present embodiment
P is an upper panel substrate 4 having a plurality of display electrodes 1 formed on the inner surface, a plurality of data electrodes 5 and a partition wall 7 arranged in a direction perpendicular to the display electrodes 1, as in the conventional embodiment.
And a lower panel substrate 8 having an inner surface formed on the inner surface, and the outer peripheral edges of both panels are sealed with an adhesive member 15 made of low-melting glass. The uppermost ends of the partition walls 7 have concave grooves, and an adhesive member 15 is provided so as to fill the grooves.
Are joined through. In addition, the said partition 7 is formed as follows, for example. A dry film resist is laminated as a resin coating layer on the lower panel substrate 8, and is selectively exposed using an exposure mask, and then subjected to a development process to provide a negative pattern. Further, a paste is embedded in the opening of the pattern to the same height as the outermost surface of the resin coating layer using a squeegee or the like. Then, when the lower panel substrate 8 is dried and the solvent in the paste is removed, the paste has a concave shape with a concave center. This shape can be controlled by the amount of the solvent contained in the paste, the amount of the filler, or the shape of the opening of the resin coating layer. other,
It is also possible to mechanically cut off the uppermost end of the partition wall 7 or to process it into a concave shape by irradiating a laser beam. The adhesive member 1 is inserted into the recess of the partition wall 7 thus formed.
When 5 is formed, the bonding area between the partition wall 7 and the adhesive member 15 increases, the bonding strength increases, and the apparent emission area can be increased by reducing the protrusion of the bonding member 15 from the partition wall width.

Next, a method of manufacturing a PDP according to the present embodiment will be described in accordance with procedures.

First, the upper panel substrate 4 on which the display electrode 1, the dielectric layer 2 and the protective layer 3 are formed, the data electrode 5, the dielectric layer 6 and the partition 7 are formed, and the phosphor 11 is applied. After the lower panel substrate 8 is prepared, an adhesive member 15 made of a low melting point material such as frit glass is provided on the uppermost end of the partition wall 7.

When the adhesive member 15 is provided, a method such as screen printing or transfer using a stamper is employed, but it is also possible to apply the adhesive member 15 by a method such as lift-off. Alternatively, it is also possible to provide the adhesive member 15 by forming only the layer located at the uppermost end of the partition wall 7 with frit glass or the like. Or
It is also possible to apply frit glass or the like to be the adhesive member 15 to a predetermined portion on the upper panel substrate 4 corresponding to the partition wall 7 on the lower panel substrate 8.

By the way, in screen printing, it is general that a pattern through which an adhesive material having a predetermined viscosity passes is formed in advance on a screen plate abutting on the uppermost end of the partition wall 7. It goes without saying that the adhesive member 15 may be provided only on the uppermost end of the partition wall 7 by screen printing after the adhesive material is allowed to pass over the entire surface.

Next, the upper panel substrate 4 and the lower panel substrate 8 are arranged to face each other via the partition wall 7 on which the adhesive member 15 is provided as described above. The sealing member 9 is interposed between the outer peripheral edges.

In this case, as shown in FIG. 17, when heating is performed while applying pressure from the outer surface to the inner surface of both panel substrates, the upper panel substrate 4 and the lower panel substrate 8
Are sealed by a sealing member 9. At the same time, in the central display section, the upper panel substrate 4 and the lower panel substrate 8 are bonded to each other by the bonding member 15 melted by heating. As a result, the envelope 10 is formed.

Further, through the through holes 8a formed in the lower panel substrate 8 constituting the envelope 10, the envelope 10
After a piping member 13 communicating with the inside is attached to an external position of the lower panel substrate 8, an exhaust process in the envelope 10 and a discharge gas sealing process are executed through the piping member 13, When the inside of the envelope 10 is sealed by sealing the PDP, the PDP shown in FIG. 6 is completed.

By the way, the pressure at the time of bonding the upper panel substrate 4 and the lower panel substrate 8 is performed by, for example, a method as shown in FIG.

That is, first, the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 are temporarily fixed in accordance with a predetermined positional relationship, and then placed on the flat table 16.

Next, a plurality of pressing jigs 23 are installed at predetermined pressing positions. The pressing jig 23 has a spring receiver A (2
0), a spring receiver B (22), a spring 21, and a bolt 19. The spring receiver A (20) and the spring receiver B (22) are separated, and the spring 21 is inserted between them.

The pressing force of the spring 21 is adjusted by the spring receiver B (2
The position 2) can be adjusted with the bolt 19. The spring jig B (22) is provided between the envelope 10 and the frame 18 fixed to the base 16 via the support 17 so that the entire length of the jig 23 is larger than the interval. ) Is adjusted by the bolt 19 and inserted. Thus,
Since the spring 21 is installed with a compression force applied thereto, a pressing force is applied to both panel substrates.

The frit glass constituting the adhesive member 15 and the sealing member 9 is usually used after being heated to 450 ° C. and melted. The spring 21 used here does not lose its spring property even at 450 ° C. It goes without saying that the material is used. For example, an Inconel material is used.

Next, a modification of the pressing method will be described with reference to FIG. First, the upper panel substrate 4 constituting the envelope 10
And the lower panel substrate 8 are temporarily fixed in accordance with a predetermined positional relationship, and then installed on a flat table 16 as in the previous embodiment. Next, a resilient cushioning material 24 that does not change its properties even in a heating state of 450 degrees is installed so as to cover the entire surface at the upper part of the envelope 10. Here, the cushioning material 24
As such, something like steel wool is effective.

Next, a plate member 25 having a predetermined weight and a uniform plate thickness and covering the entire surface of the envelope 10 is placed on the cushioning member 24 above the envelope 10. Here, the cushioning material 24 is a plate material 24.
The necessity of interposing a foreign substance or the like between the housing 10 and the envelope 10 may cause the pressing force to be partially changed, thereby making the gap between the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 uneven. If the foreign matter is large, the force is applied locally,
This is because there is a possibility that the envelope 10 is broken.

As described above, according to the gas discharge panel of the present invention, for example, since the upper panel substrate and the lower panel substrate which constitute the envelope are bonded via the bonding member, the gas discharge panel is 500 Torr. Even if a discharge gas with a pressure exceeding the above is enclosed in the envelope, it is not possible to create a gap between the partition wall and the panel substrate, or to cause the envelope to bulge outward and deform. Is obtained.

In addition, since the adhesive member does not protrude from the partition wall or uses a transparent member even if it protrudes, the characteristics of the panel are not degraded. Further, when the adhesive member is formed in a direction perpendicular to the partition, pixels adjacent in the partition direction can be separated, and an effect of improving contrast can be obtained.

Further, according to the method for manufacturing a gas discharge panel of the present invention, for example, uniform adhesion between the partition and the panel substrate facing the partition can be realized over the entire surface of the envelope. The effect that it can be easily manufactured is obtained.

In the above embodiment, the case where the PDP has the dielectric film has been described. However, the present invention is not limited to this. For example, the PDP may be configured without the dielectric film.

In the above embodiment, the gas discharge panel is assumed to be an AC type PDP, but the gas discharge panel is not limited to the AC type PDP. Of course, the application becomes possible.

In the above embodiment, the first panel substrate and the second panel substrate of the present invention correspond to the front substrate and the back substrate, respectively. However, the present invention is not limited to this. The configuration may be such that the panel substrate corresponds to the back substrate and the second panel substrate corresponds to the front substrate. In this case, the bottom of the partition is provided on the inner surface of the front substrate, and the upper end of the partition is bonded to the inner surface of the back substrate.

In the above embodiment, the description has been made on the assumption that an adhesive member is used. However, the present invention is not limited to this. For example, the examples described in FIG. 5 and the examples described in FIGS. A configuration that does not require the use of an adhesive member may be used. That is,
In that case, for example, as a modified example of the above example described in FIG. 5, a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, and A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates, and a sealing portion provided on the second panel substrate; A method for manufacturing a gas discharge panel, comprising: a partition partitioning the gas discharge space, wherein a groove is formed by exposing a photosensitive material provided on the second panel substrate to light, and forming the partition. Spraying a dielectric material or frit glass for spraying into the formed grooves by a thermal spraying method, wherein the thermal spraying process includes the step of: forming the second panel substrate along a flow of a material ejected from a thermal spray nozzle. Flow cooling gas to cool DOO include manufacturing method for a gas discharge panel according to claim. In this manufacturing method, it is preferable that the gas discharge panel has a dielectric film covering the second electrode, and the material of the dielectric film and the partition is alumina. Thereby, the same effect as described above is exerted. For example, as a modified example of the above-described example described with reference to FIGS. 8 to 9, a first panel substrate having a first electrode,
Between a second panel substrate having a second electrode facing the panel substrate and an outer peripheral edge of both substrates for forming a gas discharge space between the first and second panel substrates. And a partition provided on the second panel substrate, the partition partitioning the gas discharge space, wherein the first panel substrate and the second panel substrate are provided. An assembling step of assembling the gas discharge panel using a panel substrate and the sealing portion;
A step of attaching a pipe member that communicates with the gas discharge space through a through hole formed in the panel substrate to a panel substrate having the through hole, and using the pipe member to attach the gas discharge space to the gas discharge space. A sealing step of sealing a discharge gas, and a sealing step of sealing the pipe member by increasing the ambient pressure of the pipe member to be higher than the internal pressure of the sealed discharge gas. And a method for manufacturing a gas discharge panel. Thereby, there is an effect that a manufacturing method different from the conventional method can be provided.

[0206]

As is apparent from the above description, the present invention can provide a gas discharge panel which is less likely to cause crosstalk and can form a more stable image than before, and a method of manufacturing the same.

Further, the present invention can provide a method for manufacturing a gas discharge panel in which the number of firing steps can be reduced as compared with the prior art.

Further, the present invention can provide a gas discharge panel capable of increasing the brightness as compared with the prior art, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a schematic partial sectional view of a plasma display panel according to a first embodiment of the present invention.

FIG. 2 is a schematic partial sectional view of a plasma display panel according to a second embodiment of the present invention.

FIGS. 3A to 3E are schematic process diagrams of a plasma display panel manufacturing method according to a third embodiment of the present invention.

FIGS. 4A to 4E are schematic process diagrams of a plasma display panel manufacturing method according to a fourth embodiment of the present invention.

FIG. 5 is a schematic view showing a method of forming a partition by thermal spraying in an embodiment of the present invention.

FIG. 6 is a cutaway perspective view showing a simplified configuration of a main part of the PDP according to the present embodiment.

FIG. 7 is a sectional view according to a modification of the configuration shown in FIG. 6;

FIG. 8 is an explanatory view showing a method of sealing the piping member of the PDP according to the present embodiment.

FIGS. 9A to 9C are explanatory views showing a first modification of a method and a procedure for sealing a piping member of a PDP according to the present embodiment.

FIG. 10 is an explanatory view showing a second modification of the method and the procedure for sealing the piping member of the PDP according to the present embodiment.

11 (a) and 11 (b): PDP according to the present embodiment
Explanatory drawing which shows the 3rd modification of the method and procedure of sealing the piping member of FIG.

FIG. 12 is a plan view showing an adhesive member of the PDP according to the present embodiment.

FIG. 13 is a schematic cross-sectional view for describing the particle size of the adhesive member according to the present embodiment.

FIG. 14 is a plan view according to a modification of the method for applying an adhesive member according to the present embodiment.

FIG. 15 is a plan view according to another example of the method for applying an adhesive member of the present embodiment.

FIG. 16 is a plan view according to another example regarding the shape of the upper end portion of the partition wall of the present embodiment.

FIG. 17 is a schematic view showing a method of sealing a PDP according to the present embodiment.

FIG. 18 is a cross-sectional view illustrating a pressing method during sealing according to the present embodiment.

FIG. 19 is a sectional view showing a modification of the pressurizing method at the time of sealing according to the present embodiment.

FIG. 20 is a perspective sectional view of a conventional plasma display panel portion.

FIG. 21 is a cutaway perspective view showing a simplified configuration of a main part of a PDP according to a conventional mode.

FIGS. 22A to 22C are explanatory views showing a procedure for sealing a piping member of a PDP according to a conventional embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Display electrode 2, 6 Dielectric film 3 Protective film 4 Upper panel substrate (front substrate) 5 Address electrode 7 Partition 8 Lower panel substrate (back substrate) 10 Enclosure 11 Phosphor 12 Space 13 Piping member 15 Adhesive member 19 Sealing member

 ──────────────────────────────────────────────────続 き Continuation of the front page (31) Priority claim number Japanese Patent Application No. 9-281716 (32) Priority date Hei 9 (1997) October 15, (33) Priority claim country Japan (JP) (31) Priority Claim No. 9-314938 Japanese Patent Application No. Hei 9-314938 (32) Priority Date Hei 9 (1997) November 17, (33) Priority Country Japan (JP) (72) Inventor Hideaki Yasui 1006 Kazuma Kazuma, Kadoma City, Osaka Matsushita Electric Within Sangyo Co., Ltd. (72) Inventor Masatoshi Kudo 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Akira Shiokawa 1006 Okadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Junichi Hibino 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hidetaka Higashino 1006 Odaka Kadoma, Kadoma City Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Kinzo Nonomura Osaka 1006 Kadoma, Kadoma Matsushita Electric Industrial Co., Ltd. Sangyo Co., Ltd.

Claims (40)

[Claims] A first panel substrate having a first electrode; and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates to form a gas discharge space between the first and second panel substrates; and the second panel A gas discharge panel, comprising: a partition provided on a substrate for partitioning the gas discharge space; and an upper end of the partition is adhered to an inner surface of the first panel substrate. 2. The gas discharge panel according to claim 1, wherein an adhesive member containing a light transmissive material is used for the adhesion. 3. The gas according to claim 1, wherein an adhesive member containing a light-absorbing material is used for the bonding, and the material of the partition wall includes a light-reflective material. Discharge panel. 4. A width of a bonding portion between an upper end portion of the partition and the first panel substrate is adjusted so that the bonding portion does not protrude into a light emitting area in the partitioned gas discharge space. The gas discharge panel according to claim 1, 2 or 3, wherein: 5. The gas discharge panel according to claim 1, wherein an adhesive member containing a fusible glass is used for the bonding. 6. The gas discharge panel according to claim 1, wherein a softening point of the adhesive member is lower than a softening point of the partition. 7. The gas discharge panel according to claim 6, wherein the difference between the softening points of the adhesive member and the partition wall is 20 ° C. or more and 200 ° C. or less. 8. The gas discharge panel according to claim 5, wherein the partition has a hole at an upper end thereof, and the adhesive member penetrates the hole. 9. The gas discharge panel according to claim 5, wherein the partition wall is formed by a thermal spraying method. 10. The method according to claim 1, wherein at least one of a surface of an upper end portion of the partition wall and a surface of a portion of the inner surface of the first panel substrate that is bonded to the upper end portion has an uneven shape. The gas discharge panel according to claim 1 or 5, wherein 11. The whole or a part of the upper end of the partition wall,
2. The gas discharge panel according to claim 1, wherein the gas discharge panel is adhered to an inner surface of the first panel substrate. 12. The partition is a plurality of long plate-shaped ribs arranged in parallel, and the bonding includes a bonding member formed in a line in a direction substantially orthogonal to a longitudinal direction of the rib. The gas discharge panel according to claim 11, which is used. 13. The gas discharge panel according to claim 12, wherein the adhesive member includes a light absorbing material. 14. A part of the upper end of the partition wall,
14. The gas discharge according to claim 11, 12, or 13, wherein said being bonded to the inner surface of the panel substrate means that the bonding is performed near the first electrode in the upper end portion of the partition wall. panel. 15. The gas discharge panel according to claim 1, wherein a concave depression is formed at an upper end of the partition wall, and the bonding is performed using the depression. 16. The gas discharge panel according to claim 1, wherein the partition and the second panel substrate are bonded by frit glass. 17. The gas discharge space has a capacity of 500 Torr.
2. The gas discharge panel according to claim 1, wherein a discharge gas having a pressure exceeding r is sealed. 18. A first panel substrate having a first electrode,
A second electrode having a second electrode facing the first panel substrate;
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate; and a partition for partitioning the gas discharge space, comprising: an adhesive member used for bonding an upper end portion of the partition and the first panel substrate; Providing at the upper end of the partition wall or the inner surface of the first panel substrate, the first panel substrate and / or the second panel substrate facing each other so that pressure is applied to at least a portion where the adhesive member is provided. And a sealing step of forming a space for gas discharge by applying pressure to the gas discharge panel. 19. The method according to claim 18, wherein the pressing is performed using an elastic force of a spring member. 20. The method according to claim 18, wherein the pressing is performed by using a load of a plate material. 21. The method according to claim 20, wherein the pressing is performed with a buffer member interposed between the plate member and the panel substrate. 22. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate, for partitioning the gas discharge space, wherein a fusible glass used for bonding between an upper end portion of the partition and the first panel substrate. An applying step of applying an adhesive member containing an organic binder and an organic solvent to the upper end of the partition wall and / or the inner surface of the first panel substrate; and applying the applied adhesive member to a temperature above the softening point of the fusible glass. A method of manufacturing a gas discharge panel, comprising: 23. A calcination provided between the applying step and the heating step, wherein the adhesive member is heated to such an extent that most of the organic binder and the organic solvent contained in the applied adhesive member are removed. And a step of assembling the gas discharge panel using the first panel substrate, the second panel substrate, and the sealing portion, wherein the assembling step is provided between the preliminary firing step and the heating step. 23. The method of manufacturing a gas discharge panel according to claim 22, wherein: 24. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates to form a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate; the partition configured to partition the gas discharge space; and a partition forming step of forming the partition on the second panel substrate; and an upper end of the partition. A step of disposing an adhesive member used for adhering the portion and the first panel substrate to the upper end portion, wherein the partition wall forming step includes a step of forming a predetermined opening on the second panel substrate. A first step of providing a mask member having: a second step of providing the partition wall forming material in the opening; and the adhesive member providing step includes: an upper end of the partition wall formed in the second step. In the part, the adhesive part using the mask member Third step and the fourth step in the method of manufacturing the gas discharge panel comprising the removing the mask member be provided. 25. The method according to claim 24, wherein a thermal spraying method is used in the second step and / or the third step. 26. The method according to claim 24, wherein the mask member includes a photosensitive material. 27. The method according to claim 26, wherein the mask member is a photosensitive resin film. 28. The gas according to claim 24, wherein the material for the partition contains fusible glass, and the baking of the partition and the baking of the adhesive member are performed in the same step. A method for manufacturing a discharge panel. 29. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates to form a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate, for partitioning the space for gas discharge; a partition forming step of forming the partition on the second panel substrate; and an upper end of the partition A method for manufacturing a gas discharge panel, comprising: a coating step of coating a fusible glass paste on a portion; and a firing step of firing the fusible glass paste. 30. The method according to claim 29, wherein the applying step uses a screen printing method. 31. The method of manufacturing a gas discharge panel according to claim 30, wherein a screen mask used for the screen printing method does not have a pattern shape. 32. A part of the partition has light reflectivity,
The method for manufacturing a gas discharge panel according to claim 29, 30, or 31, wherein the fusible glass paste has a light absorbing property. 33. The sintering step, wherein an upper end portion of the partition wall and an inner surface of the first panel substrate are adhered to each other by using the fusible glass paste. Or a method for manufacturing a gas discharge panel according to item 31. 34. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates to form a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate, for partitioning the gas discharge space, wherein a groove is formed by exposing a photosensitive material provided on the second panel substrate to light. And a thermal spraying step of embedding a dielectric material or frit glass for forming the partition walls in the formed grooves by a thermal spraying method. And flowing a cooling gas for cooling the second panel substrate. 35. The gas discharge panel according to claim 34, wherein the gas discharge panel has a dielectric film covering the second electrode, and a material of the dielectric film and the partition is alumina. Manufacturing method. 36. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates to form a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate, for partitioning the gas discharge space, wherein the first panel substrate, the second panel substrate, and the sealing portion are used. An assembling step of assembling the gas discharge panel; and a step of attaching a pipe member communicating with the gas discharge space via a through hole formed in the first or second panel substrate to the panel substrate having the through hole. Using the pipe member to fill a discharge gas into the gas discharge space, and a surrounding pressure of the pipe member is set higher than an internal pressure of the sealed discharge gas, Sealing to seal piping members Method for manufacturing a gas discharge panel comprising: the degree, the. 37. In the sealing step, the sealing is performed by heating the piping member and pressing the piping member from outside to inside so as to close a pipe portion of the piping member. 37. The method of manufacturing a gas discharge panel according to claim 36, wherein: 38. In the sealing step, the pipe member is heated, a sealing member housed inside the pipe member is melted, and the pipe portion of the pipe member is closed to close the pipe member. The method for manufacturing a gas discharge panel according to claim 36, wherein: 39. In the sealing step, a tubular member is used to surround an outer peripheral portion of the piping member, and a portion of the piping member surrounded by the tubular member is heated so that the portion is closed. The method for manufacturing a gas discharge panel according to claim 36, wherein the sealing is performed by pressing the pipe member along the axial direction of the tubular member. 40. A first panel substrate having a first electrode, and a second panel having a second electrode facing the first panel substrate.
A panel substrate; a sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and the second panel A method for manufacturing a gas discharge panel, comprising: a partition provided on a substrate; and a partition for partitioning the gas discharge space, wherein an adhesive member used for bonding an upper end portion of the partition and the first panel substrate is provided. A step of providing the upper end of the partition or the inner surface of the first panel substrate; and a step of bonding the upper end of the partition and the first panel substrate with the adhesive member. Panel manufacturing method.