JPH11203440A - Substrate for ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an IC card capable of separating a part loaded with an IC module by a neat cutting face and securing the security of the IC module or the like until the card is issued to a user. SOLUTION: The IC card consists of a body part 1 corresponding to standardized specification and a separating part 2 constituting a part of the body part 1 and including a surface loading an IC module M, a material having adhesion is selected as a material for forming at least either one of the body part 1 and the separating part 2 and an interface 4 between the body part 1 and the separating part 2 is incompletely fused so as to have adhesive strength capable of releasing a united body by the pressure of a finger.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of an IC card substrate serving as a core sheet of an IC card on which an IC module including one or more elements such as a CPU and a memory is mounted.

[0002]

2. Description of the Related Art Conventionally, as an IC card, for example, those described in JP-A-6-24188 and JP-A-6-199082 are known.

A conventional IC card described in Japanese Patent Application Laid-Open No. 6-24188 has a precut in which a notch structure is intermittently provided around a portion where an IC module is mounted, and a portion where the IC module is mounted is connected to a bridge. It can be cut and separated.

A conventional IC card described in Japanese Patent Application Laid-Open No. 6-199082 uses a fixing member such as an adhesive tape for a portion where an IC module configured to be separable as described above is mounted. To reconnect.

[0005] These conventional IC cards are mounted on existing equipment as cards that comply with standardized standards.
It is designed to be able to separate and set only the part where the IC module is mounted on portable electronic devices (mobile phones, etc.) where printing work is performed and miniaturization is progressing during use. Demand is increasing with the spread of electronic devices for home use.

[0006]

SUMMARY OF THE INVENTION The aforementioned Japanese Patent Laid-Open No. 6-24 / 1994
In the conventional IC card described in Japanese Patent Publication No. 188, a bridge is formed by pre-cutting in advance, so that the user cuts the bridge by prying the separation portion with a finger, but remains in the separation portion. The cut marks of the bridge are likely to be twisted or rough cut marks that leave a part of the forming material on the main body portion peeled off. In particular, since the bridge is present at a plurality of locations, the cut trace between the bridge and the main body portion side has a discontinuous uneven contour. For this reason, it is impossible to set the portion where the IC module is mounted on the portable electronic device, or the connection terminal of the portable electronic device is damaged by a rough cut surface of the portion where the IC module is mounted. There is.

Further, in the conventional IC card described in the above-mentioned Japanese Patent Application Laid-Open No. 6-199082, the pre-cut is issued to the user after the pre-cut is cut finely.
Since the separation and reconnection of the portion on which the C module is mounted is easily performed, there is a problem that security of the IC module and the like from the time of manufacture to the time of issuance cannot be ensured.

The present invention has been made in view of such problems, and can separate a portion on which an IC module is mounted by a continuous and clean cut surface, and furthermore, until it is issued to a user. An IC card substrate for obtaining an IC card, such as an IC module, which ensures security;
An object of the present invention is to provide a method for manufacturing an IC card substrate suitable for manufacturing the IC card substrate.

[0009]

Means for Solving the Problems To solve the above-mentioned problems, the IC card substrate according to the present invention employs the following means.

That is, as set forth in claim 1, a main body portion conforming to a standardized standard, and a separating portion which forms a part of the main body portion and includes a surface on which an IC module is mounted. A material having adhesiveness is selected as a material for forming at least one of the main body and the separating portion, and the interface between the main body and the separating portion has an adhesive strength such that the integration is released by pressing with a finger. It becomes.

According to this means, since the main body and the separating portion are joined together at the interface without being completely fused,
The interface to be separated becomes clean with the flatness of the molding surface transferred from the mold. In addition, the separated part for separation is in a state where the integral joining to the main body is released, and can be easily distinguished from an unseparated state.

Further, as described in claim 2, claim 1
And at least one cut line that does not completely pass through the front and back of the main body from the interface between the main body and the separation portion to the edge of the main body, is provided on the IC card substrate. The connection strength of the part is set to be equal to or slightly lower than the adhesion strength of the main body part and the separation part.

According to this means, since the cut line is broken when the separation portion is separated from the main body, the separation of the separation portion can be more clearly identified.

According to a third aspect of the present invention, in the IC card substrate according to the second aspect, the main body is formed by solidifying and molding a molten forming material, and a weld line of the forming material of the main body is set to a cut line. It is characterized by having been done.

[0015] In this means, the generation of the weld line is actively used, and the flow front is set so as to join the cut line, which is a portion of the main body having a low mechanical strength.

Further, as described in claim 4, claims 1 to
In any one of the IC card substrates according to any one of the first to third aspects, the material for forming the main body and the separation portion is made of a different material.

According to this means, the joining and releasing of the main body and the separating portion can be favorably performed by selecting different materials.

Further, as described in claim 5, claims 1 to 5
In any one of the IC card substrates according to any one of the first to third aspects, the material for forming the main body and the separation portion is the same material.

In this means, the main body and the separating portion can be easily formed by selecting the same material.

Further, in order to solve the above-mentioned problems, a method for manufacturing an IC card substrate according to the present invention employs the following means.

That is, as described in claim 6, a main body corresponding to the standardized standard and a separation part which constitutes a part of the main body and includes a surface on which the IC module is mounted are time-lagged. Select a synthetic resin material that has adhesiveness as the material for the post-molding. The interface between the main body and the separation part should be tight enough to cancel the integration by pressing with a finger. It is molded to have.

In this means, one of the main body portion and the separating portion is preformed and solidified, and the other is melted and integrated by post molding. Since the pre-molded solidified portion functions as a mold surface, the synthetic resin melted by post-molding is molded integrally with the solidified portion as the mold surface and is integrated with the mold surface.

As described in claim 7, the IC of claim 6
In the method of manufacturing a card substrate, after setting one of the already molded main body portion and the separating portion in a molding die,
It is characterized by injecting the other synthetic resin material of the molten main part and the separating part into the molding die.

In this means, a so-called insert molding technique is used.

Further, as described in claim 8, claim 6
In the method of manufacturing a substrate for an IC card, the synthetic resin material of one of the melted main body and the separating part is injected into a molding die, and then the other of the molten main body and the separating part is synthesized in the same molding die. It is characterized by injecting a resin material.

In this means, a so-called two-color molding technique is used.

[0027] Further, as described in claim 9, claim 6
In the method for manufacturing an IC card substrate according to any one of the first to eighth aspects, the material for forming the main body portion and the separation portion is a synthetic resin material of a different material.

According to this means, it is possible to perform the molding in which the joining and the disengaging of the main body and the separating portion are good by selecting the different synthetic resin materials.

According to a tenth aspect of the present invention, in the method for manufacturing an IC card substrate according to any one of the sixth to eighth aspects, the material for forming the main body and the separating portion is a synthetic resin material of the same material. It is characterized by the following.

In this means, the main body and the separating portion can be easily formed by selecting the same synthetic resin material.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an IC card substrate and a method of manufacturing the same according to the present invention will be described below with reference to the drawings.

This embodiment, as shown in FIG. 1, comprises a main body 1, a separating part 2, and a score line 3.

The main body 1 is formed in accordance with a standard (particularly, size and thickness) standardized by an international standard (ISO). Such a standard is updated with time, and in the process of reaching an international standard, it is standardized in advance only for a specific country or a specific company series. Therefore, the main body 1 can be adapted to a standardized standard other than the international standard.

The separating portion 2 is formed in a size having a margin including a surface on which the IC module M is mounted, and is formed so as to form a part of the main body 1.
Occupy a part of. At a substantially central portion of the separating portion 2, a concave groove 2 'for mounting the IC module M is formed (see FIG. 2).

The interface 4 between the main body 1 and the separating portion 2
A material having an adhesive property is selected as a material for forming one or both of the main body portion 1 and the separating portion 2 and has an adhesive strength such that the integral joining is released by pressing with a finger. Here, the close contact means that one of the main body portion 1 and the separation portion 2 has a solidified or semi-solidified interface 4, and this interface 4 functions as a mold surface of a mold to form the other material. Means that they are integrated when they are shaped. For example, when a thermoplastic resin is used as another forming material, it means that the thermoplastic resin is heated and melted into a shape, solidified and integrated by using one interface 4 as a mold surface, and completely integrated. It means a temporary attachment state that has not been performed. Therefore, the main body portion 1 and the separating portion 2 are integrated via the interface 4 and can be separated.

For the production of the main body 1 and the separating portion 2, for example, an insert molding technique can be used. That is, first, one of the main body 1 and the separating portion 2 is molded (forming material and molding means are optional), and after the molded product is set in a molding die, the other of the main body 1 and the separating portion 2 is formed. A material having an adhesive property is selected as a material for forming, and the material is melted and injected into a molding die by injection or the like. After this, the material to be formed is tightly integrated with the preformed product when it is solidified inside the forming die. This integrated state has the property of changing by selecting the material of the material to be formed in the pre-molding and post-molding and adjusting the temperature of the molding die. It is easy to provide the required adhesion strength.

When the present inventor conducted joining experiments under various conditions, the separation part 2 was injection-molded by selecting polycarbonate (PC), which is a thermoplastic resin, as a material to be preformed. Injection molding of the main body 1 by selecting polycarbonate (PC), which is a thermoplastic resin, as a material to be formed as a post-molding, so that the bonding is relatively easily performed by pressing with a finger so that the bonding is released. I was able to.

For the production of the main body 1 and the separating portion 2, for example, a two-color molding technique can be used. That is, one forming material of the main body part 1 and the separating part 2 which is melted from one injection system into the molding die is injected by injection or the like, and then the injection system is switched to the molding die from another injection system. The other of the melted main body 1 and the separating portion 2 is injected with a material having the adhesive property by injection or the like. The production means using the two-color molding technique has the same effect as the production means using the insert molding technique described above.

According to these manufacturing means, since a technology that has matured in the field of molding synthetic resin is used, inexpensive and easy manufacturing becomes possible. Further, since the main body portion 1 and the separating portion 2 are formed with a time lag, it is possible to make the forming material of the pre-forming and the forming material of the post-forming different. For this reason, the conditions such as ultraviolet rays and X-rays required by the International Standard (ISO) for protection of the IC module M are satisfied by the separation part 2 on which the IC module M is mounted, and By selecting a relatively inexpensive material, the overall material cost can be reduced.

The score line 3 is composed of one piece provided from the interface 4 between the main body 1 and the separating portion 2 to the edge 1 ′ of the main body 1. The cut line 3 is cut in, for example, a V-shape in the thickness direction so as not to penetrate the front and back of the main body 1 (see FIG. 3). The connection strength (mechanical strength) of the main body 1 along the cut line 3 is set to be equal to or slightly lower than the adhesion strength of the interface 4 between the main body 1 and the separating portion 2. When the main body 1 is molded by injecting a synthetic resin material into a molding die, by adjusting the shape of the cutting line 3, the weld of the synthetic resin material flowing inside the molding die is adjusted. The line can be set as the score line 3, and the connection strength of the main body 1 is reduced, resulting in a break line.

In the IC card substrate of this embodiment, since the main body 1 is formed in accordance with the standard standardized by the international standard (ISO), mounting and printing are performed with existing equipment. Thus, an IC card can be obtained. Therefore, the mounting cost and the printing cost for obtaining the IC card from the IC card substrate of this embodiment do not increase.

When the obtained IC card is used, as shown in FIG. 4, the separation portion 2 is directly pressed with a finger or the vicinity of the interface 4 is flexed to apply pressure.
The separating portion 2 can be easily separated from the main body 1. The interface 4 of the separating portion 2 separated from the main body 1
Since the structure is separated from the molding surface, the cross section becomes beautiful with the flatness of the molding surface transferred from the mold. In other words, the interface 4 is constituted by a beautiful mold reflecting surface having a molding surface continuous with the peripheral contour. Therefore, it becomes impossible to set the separation part 2 on which the IC module M is mounted on the portable electronic device, or the connection terminal of the portable electronic device becomes
The cross section of the separating portion 2 on which the C module M is mounted is not damaged. Further, the separated part 2 for separation is in a state where the fusion to the main body 1 has been lost and the bonding has been released, and the separated part 2 falls off from the main body 1 even when reconnection is attempted. It becomes easily distinguishable from the state. This identification helps prevent unauthorized use such as an unused state.

Further, when the separating portion 2 is separated from the main body 1 by pressing the finger, the cut line 3 is necessarily broken due to the aforementioned connection strength and adhesion strength. Therefore, the separation of the main body 1 of the separating portion 2 can be more clearly identified.

Furthermore, while the separation of the main body 1 of the separating portion 2 is clearly identified, the main body 1 and the separating portion 2 are surely integrated in a molding applied state. Unauthorized use such as unauthorized use or tampering until issued to the user can be prevented, and security of the IC module M and the like can be ensured.

As described above, in addition to the illustrated embodiment, the separately molded body portion 1 and separating portion 2 are integrally joined via the interface 4 in a state where the molding is applied, and further, by heating or the like. It is also possible to select a manufacturing means for firm integration.

Further, the concave groove 2 ′ provided in the separation portion 2 can be formed by cutting after forming the separation portion 2.

[0047]

As described above, since the main body portion and the separating portion are in close contact with each other with the molding surface formed in the mold without being completely fused, the cross section to be separated is small. There is an effect that the flatness of the molding surface transferred from the mold is continuously provided in the peripheral contour to thereby make the surface beautiful.

Further, since the main body and the separating portion are incomplete but are surely integrated, and the separation of the separating portion from the main body is reliably identified, the IC card is issued from the manufacture of the IC card to the user. There is an effect that the security of the IC module and the like until the operation is performed can be ensured.

Further, the method of manufacturing a substrate for an IC card according to the present invention has an effect that inexpensive and easy manufacturing becomes possible because a technology that has matured in the synthetic resin molding field can be used.

Further, since the material for forming the main body and the separating portion can be made different from the molding time lag, there is an effect that the material cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an IC card substrate and a method of manufacturing the same according to the present invention.

FIG. 2 is an enlarged sectional view taken along line XX of FIG.

FIG. 3 is an enlarged sectional view taken along line YY of FIG. 1;

FIG. 4 is a perspective view showing an example of use of an IC card obtained from an embodiment of an IC card substrate and a method of manufacturing the same according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body part 1 'Edge 2 Separation part 2' Depression groove 3 Cut line 4 Interface MIC module

Claims (10)

[Claims] A main body corresponding to a standardized standard;
A separating portion including a surface on which the IC module is mounted, which constitutes a part of the main body, and a material having adhesiveness is selected as a material for forming at least one of the main body and the separating portion; An IC card substrate having an adhesive strength at which the interface between the main body and the separation portion is released from integration by pressing with a finger. 2. The IC card substrate according to claim 1, wherein
At least one cut line that does not completely penetrate the front and back of the main body from the interface between the main body and the separating portion to the edge of the main body is provided, and the connection strength of the main body along the cut line is the main body. ,
An IC card substrate, wherein the adhesion strength is set to be equal to or slightly lower than the adhesion strength of a separating portion. 3. The IC card substrate according to claim 2, wherein
An IC card substrate, wherein a main body is formed by solidifying a molten forming material, and a weld line of the forming material of the main body is set to a cut line. 4. The IC card substrate according to claim 1, wherein the material for forming the main body and the separating portion is made of a different material. 5. The IC card substrate according to claim 1, wherein the material for forming the main body and the separation portion is made of the same material. 6. A main body corresponding to a standardized standard,
A part of the main body and a part for separation including the surface on which the IC module is mounted are molded with synthetic resin with a time lag, and a synthetic resin material having adhesiveness is selected as a material for post-molding. A method for manufacturing an IC card substrate, wherein the interface between the main body and the separating portion is molded so as to have an adhesive strength in which integration is released by pressing with a finger. 7. The method for manufacturing a substrate for an IC card according to claim 6, wherein one of the already molded main body and the separating portion is set in a molding die, and then the main body and the separating portion are melted in the molding die. A method for manufacturing an IC card substrate, characterized by injecting the other synthetic resin material of the part for use. 8. The method for manufacturing a substrate for an IC card according to claim 6, wherein one of the molten synthetic resin material of the main body portion and the separating portion is injected into a molding die, and then the main body portion is melted in the same molding die. And injecting the other synthetic resin material of the separating portion. 9. The method for manufacturing an IC card substrate according to claim 6, wherein the material for forming the main body portion and the separation portion is a synthetic resin material of a different material.
Card substrate. 10. The method of manufacturing a substrate for an IC card according to claim 6, wherein the material for forming the main body and the separation portion is a synthetic resin material of the same material.
Substrate for C card.