JPH1120093A - Electronic device sealing film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an electronic device sealing film of good workability demonstrated at the time of sealing an electronic device and also of high fire retardance to be used for sealing securely the electronic device in a good manner. SOLUTION: A heat-curing and/or a photo-setting bonding agent layer composed of a copolymer of ethylene, vinyl acetate and an acrylate and/or methacrylate monomer copolymer doped with a mixture of a halogenated compound with antimony oxide as a fire retardant is formed at least on one face of a base film of light transmission properties on an electronic device sealing film. A bonding agent is formed of a copolymer of 100 pts.wt. doped with organic peroxide of 0.1-1.0 pts.wt. Or the bonding agent is formed of a copolymer of 100 pts.wt. doped with a photosensitizer of 0.1-10 pts.wt.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an EL device, a liquid crystal device, a solar cell device (crystal, polycrystal, amorphous, etc.),
The present invention relates to a sealing film for electronic devices used for sealing and protecting electronic devices such as touch panels, various electrodes (ITO, copper electrodes, tin electrodes, solder electrodes, etc.), IC drivers, and the like.

[0002]

2. Description of the Related Art
When sealing and protecting the electronic device, separately prepare a substrate film having light transmissivity and an adhesive, apply the adhesive to the substrate film, and integrate this with the electronic device. Had been done.

However, the sealing method of this electronic device is as follows.
It has a step of applying an adhesive to a base film, and thus has poor workability and has a problem in productivity.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and simplifies a sealing operation for an electronic device, and seals an electronic device with good adhesion to the electronic device and without sealing defects such as pinholes. An object of the present invention is to provide a sealing film for an electronic device that can be protected and has excellent flame retardancy.

[0005]

Means for Solving the Problems and Embodiments of the Invention In order to achieve the above object, the present invention provides the following sealing films for electronic devices. (1) Ethylene, vinyl acetate, acrylate and / or
Alternatively, a heat and / or photocurable adhesive layer containing a copolymer of a methacrylate monomer as a main component and a mixture of a halogen compound and an antimony oxide as a flame retardant is provided. Sealing film. (2) The film according to (1), wherein the adhesive is prepared by adding 0.1 to 10 parts by weight of an organic peroxide to 100 parts by weight of the copolymer. (3) The film according to (1), wherein the adhesive comprises 0.1 to 10 parts by weight of a photosensitizer per 100 parts by weight of the copolymer. (4) The adhesive is 0.1 to 10 parts by weight of a photosensitizer and 0.1 to 10 parts by weight of an organic peroxide based on 100 parts by weight of the copolymer.
The film according to (1), wherein 10 parts by weight are added. (5) The film according to any one of (1) to (4), wherein the adhesive comprises 0.01 to 5 parts by weight of a silane coupling agent based on 100 parts by weight of the copolymer. (6) The adhesive is prepared by adding at least one of an acryloxy group-containing compound, a methacryloxy group-containing compound and an allyl group-containing compound to 0.1 part by weight based on 100 parts by weight of the copolymer.
The film according to any one of (1) to (5), wherein the film is added by 50 to 50 parts by weight. (7) The film according to any one of (1) to (6), wherein the adhesive is obtained by adding 1 to 200 parts by weight of a hydrocarbon resin to 100 parts by weight of the copolymer. . (8) The copolymer has a vinyl acetate unit content of 2 to 5
The film according to any one of (1) to (7), wherein the content of the acrylate-based and / or methacrylate-based units is 0.01 to 20% by weight. (9) The film according to any one of (1) to (8), wherein irregularities having an average roughness of 50 μm or less are formed on the surface of the adhesive layer. (10) The substrate has a light transmittance of 50% or more and a refractive index of 1.
The film according to any one of (1) to (9), wherein the film thickness is 8 or less.

The electronic device sealing film of the present invention has the following advantages. Since the curable adhesive layer can be provided and integrated on the base film, the number of members is reduced and the productivity is improved when the electronic device is sealed. Since it can be integrated with the base film, only one punching operation is required. In addition, punching cutability is greatly improved. There are no sealing defects such as pinholes as compared with the liquid sealant. In addition, handling is extremely easy in the form of a film. Heat roll laminator, vacuum laminator, vacuum bag,
A wide range of continuous or batch-type sealing methods such as a hot press, a heating oven, and an autoclave can be selected according to the purpose.

In this case, since the adhesive used in the present invention can be in the form of a film, it can be easily and accurately bonded to a base film. Since it has a surface tack, it can be easily bonded to an electronic device, and can be bonded at a relatively low temperature of about room temperature to 80 ° C. Further, as described above, since this adhesive has self-adhesiveness, there is no deviation or peeling after bonding, and it can be handled freely before curing. Further, the adhesive has a low elastic modulus after curing and is rich in flexibility, so that the adhesive has an excellent protective effect on electronic devices.

Further, since a mixture of a halogen compound and an antimony oxide is added as a flame retardant, the flame retardant is extremely high.

Hereinafter, the present invention will be described in more detail.
The sealing film for an electronic device of the present invention has a heat and / or light mainly composed of a copolymer of ethylene, vinyl acetate, and an acrylate and / or methacrylate monomer on one surface of a base film having light transmittance. To form a curable adhesive layer which is cured by the heat treatment.

Here, the substrate film preferably has a light transmittance of 50% or more, particularly 70% or more. When the light transmittance is low, the efficiency of the device is reduced, and in particular, the efficiency of a device that takes in light, for example, a power generation device, a sensor using light, a device using a change in electrical conductivity, and the like may be reduced. Further, the refractive index is preferably 1.8 or less, particularly preferably 1.3 to 1.65 from the viewpoint of light use efficiency.

The base film has a Young's modulus of 0.1.
kg / cm ² or more, preferably not more particularly 0.5 kg / cm ² or more, occur expansion and contraction with little force when the Young's modulus is too small, deformation occurs, sealing property may be deteriorated.

The thickness of the base film is appropriately selected.
Usually, it is in the range of 1 to 1000 μm. In this case, the thickness is preferably selected so that the light transmittance of the base film is 50% or more, particularly 70% or more.

More specifically, as the base film, polyester resins such as polyethylene terephthalate, polycyclohexylene terephthalate and polyethylene naphthalate, nylon 46, modified nylon 6T, nylon MX
D6, polyamide resins such as polyphthalamide, ketone resins such as polyphenylene sulfide, polythioethersulfone, sulfone resins such as polysulfone and polyethersulfone, as well as polyether nitrile, polyarylate, polyetherimide, Polyimide, polyamide imide, polycarbonate, polymethyl methacrylate, triacetyl cellulose, polystyrene, polyvinyl chloride, etc., as well as polytetrafluoroethylene, tetrafluoroethylene-fluoroalkyl vinyl ether copolymer, tetrafluoroethylene
Hexafluoropropylene copolymer, tetrafluoroethylene-hexafluoropropylene-perfluoroalkylvinyl ether copolymer, tetrafluoroethylene-ethylene copolymer, polychlorotrifluoroethylene, chlorotrifluoroethylene-ethylene copolymer,
An organic film mainly containing an organic resin such as a fluorine-containing resin such as polyvinylidene fluoride and polyvinyl fluoride can be used. In some cases, for the purpose of improving the weather resistance, an ultraviolet absorber may be kneaded into these resins, or a resin film surface may be coated before use. Especially in this,
Polyimide, polyether sulfone, polyarylate, and polyethylene terephthalate are preferably used in terms of heat resistance and flexibility.

On the other hand, copolymers of ethylene, vinyl acetate, and acrylate and / or methacrylate monomers, which are the main components of the adhesive layer used in the present invention, have reactivity during curing, flexibility after curing, and the like. From the viewpoint of durability, the vinyl acetate content is preferably 2 to 50% by weight, and more preferably 5 to 20% by weight.

Examples of the acrylate-based monomer and methacrylate-based monomer include acrylic acid, methacrylic acid, esters thereof, and the like. Specifically, (meth) methyl (meth) acrylate, ethyl (meth) acrylate, etc. In addition to lower alkyl (meth) acrylate, glycidyl (meth) acrylate and the like are exemplified. One of these may be used alone, or two or more of them may be used in combination. The content of the acrylate-based or methacrylate-based unit in the copolymer is 0.01 to 20% by weight, particularly Preferably it is 0.05 to 15% by weight. If the content exceeds 20% by weight, workability may be reduced.

For curing the adhesive of the present invention, an organic peroxide or a photosensitizer can be used. However, when the curable adhesive is a thermosetting adhesive, usually an organic peroxide or a photosensitizer is used. When a peroxide is used and the curable adhesive is a photocurable adhesive, a photosensitizer is usually used.

As the organic peroxide added for curing the adhesive layer of the present invention, any organic peroxide which decomposes at a temperature of 70 ° C. or more to generate radicals can be used. It is preferable that the decomposition temperature during the 10-hour period is 50 ° C. or higher, and is selected in consideration of the adhesive preparation conditions, film forming temperature, curing (bonding) conditions, storage stability of the adhesive, and the like.

Examples of usable peroxides include, for example, 2,
5-dimethylhexane-2,5-dihydroxy peroxide; 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3; di-t-butyl peroxide; t-butylcumyl peroxide 2,5-dimethyl-2,5-di (t-butylperoxy) hexane;
Dicumyl peroxide; α, α'-bis (t-butylperoxyisopropyl) benzene; n-butyl-4,
4-bis- (t-butylperoxy) valerate; 2,
2-bis (t-butylperoxy) butane; 1,1-bis (t-butylperoxy) cyclohexane; 1,1-
Bis (t-butylperoxy) -3,3,5-trimethylcyclohexane; t-butylperoxybenzoate; benzoyl peroxide; t-butylperoxyacetate; 1,1-bis (t-butylperoxy)-
3,3,5-trimethylcyclohexane; 1,1-bis (t-butylperoxy) cyclohexane; methyl ethyl ketone peroxide; t-butyl hydroperoxide; p-menthane hydroperoxide; hydroxyheptyl peroxide; chlorohexanone peroxide Octanoyl peroxide; decanoyl peroxide; lauroyl peroxide; cumyl peroxy octoate; succinic acid peroxide; acetyl peroxide; t-butyl peroxy (2-ethylhexanoate); Oxide; benzoyl peroxide; t-butyl peroxyisobutyrate; 2,4-dichlorobenzoyl peroxide and the like.

As the organic peroxide, one of these is used.
Species can be used alone or as a mixture of two or more,
The amount of addition was 0.1 parts with respect to 100 parts by weight of the copolymer.
10 to 10 parts by weight is sufficient.

On the other hand, when the adhesive is photocured,
A photosensitizer can be added. As the photosensitizer, a radical photopolymerization initiator is suitably used.

Among the radical photopolymerization initiators, examples of the hydrogen abstraction initiator include benzophenone, methyl orthobenzoylbenzoate, 4-benzoyl-4'-methyldiphenylsulfide, isopropylthioxanthone, diethylthioxanthone, and ethyl-4- (diethylamino).
-Benzoate and the like are used. Among radical photopolymerization initiators, examples of intramolecular cleavage initiators include benzoin ether and benzyldimethyl ketal, and α-hydroxyalkylphenones include 2-hydroxy-2-methyl-1-phenylpropan-1-one, -Hydroxycyclohexyl phenyl ketone, alkyl phenyl glyoxylate, diethoxy acetophenone and the like can be used. Furthermore, as an α-aminoalkylphenone type,
Methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 and the like; Phosphine oxide or the like is used.

As the photosensitizer, at least one of them is used alone or in combination of two or more, and is used by adding 0.1 to 10 parts by weight to 100 parts by weight of the copolymer.

In the adhesive of the present invention, the photosensitizer and the organic peroxide may be used in combination, whereby the photocuring and the thermosetting can be used together.

Further, a silane coupling agent can be added to the adhesive of the present invention as an adhesion promoter. Examples of the silane coupling agent include vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane,
γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl)
Ethyltrimethoxysilane, γ-chloropropylmethoxysilane, vinyltrichlorosilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, etc. These may be used alone or in combination of two or more. The amount of these silane coupling agents to be added depends on the amount of the copolymer 1
Usually, 0.01 to 5 parts by weight per 100 parts by weight is sufficient.

Further, an epoxy group-containing compound can be similarly added to the adhesive of the present invention for the purpose of promoting adhesion and curing. Examples of the epoxy group-containing compound include triglycidyl tris (2-hydroxyethyl) isocyanurate; neopentyl glycol diglycidyl ether; 1,6-hexanediol diglycidyl ether;
Acrylic glycidyl ether; 2-ethylhexyl glycidyl ether; phenyl glycidyl ether; phenol glycidyl ether; pt-butylphenyl glycidyl ether; diglycidyl adipic ester;
-Phthalic acid diglycidyl ester; glycidyl methacrylate; butyl glycidyl ether and the like. The same effect can be obtained by adding an oligomer having an epoxy group and having a molecular weight of hundreds to thousands or a polymer having a weight average molecular weight of thousands to hundreds of thousands. The addition amount of these epoxy group-containing compounds is sufficient to be 0.1 to 20 parts by weight based on 100 parts by weight of the copolymer, and at least one of the epoxy group-containing compounds can be added alone or in combination. .

Further, for the purpose of further improving various physical properties (adhesion, mechanical strength, heat resistance, wet heat resistance, weather resistance, etc.) of the adhesive layer of the present invention or promoting the curing of the adhesive, an acryloxy group, A methacryloxy or allyl group-containing compound can be added.

As the compound used for this purpose, acrylic acid or methacrylic acid derivatives, for example, esters and amides thereof are most common. In this case, as an ester residue, in addition to an alkyl group such as methyl, ethyl, dodecyl, stearyl, lauryl, a cyclohexyl group, a tetrahydrofurfuryl group, an aminoethyl group,
-Hydroethyl group, 3-hydroxypropyl group, 3-chloro-2-hydroxypropyl group and the like. Esters of acrylic acid or methacrylic acid with polyfunctional alcohols such as ethylene glycol, triethylene glycol, polyethylene glycol, glycerin, trimethylolpropane, and pentaerythritol are also used. A typical amide is acrylamide. Further, examples of the allyl group-containing compound include triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, diallyl isophthalate, diallyl maleate, and the like. One or a mixture of two or more of these may be used as the above copolymer. 0.1 to 50 parts by weight, preferably 0.5 to 20 parts by weight, is used per 100 parts by weight of the combined. 0.1
When the amount is less than part by weight, the effect of improving heat resistance and mechanical strength may be reduced, and when the amount is more than 50 parts by weight, workability and film forming property during preparation of the adhesive may be reduced.

Further, a hydrocarbon resin can be added to the adhesive of the present invention for the purpose of improving processability such as processability and bonding. In this case, the hydrocarbon resin to be added may be either a natural resin or a synthetic resin. Rosin, rosin derivatives, and terpene resins are preferably used in the natural resin system. For rosin, gum-based resins, tall oil-based resins, and wood-based resins can be used. As rosin derivatives, rosin is hydrogenated, heterogenized, polymerized,
Esterified or metal salted ones can be used.
As the terpene-based resin, terpene-based resins such as α-pinene and β-pinene, as well as terpene phenol resins can be used. Also, Dammar as other natural resin,
Coral and shellac can be used. On the other hand, in the case of synthetic resins, petroleum resins, phenol resins, and xylene resins are preferably used. Petroleum resins include aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, copolymerized petroleum resins, hydrogenated petroleum resins, pure monomer petroleum resins,
Coumarone indene resin can be used. As the phenolic resin, an alkylphenol resin and a modified phenol resin can be used. As the xylene-based resin, a xylene resin or a modified xylene resin can be used.

The amount of the hydrocarbon resin to be added is appropriately selected, but is preferably from 1 to 200 parts by weight, more preferably from 5 to 150 parts by weight, per 100 parts by weight of the copolymer.

It is essential to add a mixture of a halogen compound and an antimony oxide as a flame retardant to the adhesive used in the present invention. In this case, as the halogen compound, chlorinated paraffin, perchloropentacyclodecane, chlorinated polyethylene, chlorendic anhydride, chlorendic acid, tetrabromobisphenol A, decabromodiphenyl ether, dibromocresyl glycidyl ether, hexabromobenzene, hexabromobenzene Cyclododecane, octabromodiphenyl oxide, tetrabromodiphenyl oxide, polydibromophenylene oxide, 1,2-bis (2,4,6-tribromophenoxy) ethane, 2,4,6-tribromophenol, ethylenebistetrabromo Examples include phthalimide, tetrabromobisphenol A epoxy oligomer, and tetrabromobisphenol A polycarbonate oligomer. On the other hand, examples of the antimony-based oxide include antimony trioxide and antimony pentoxide.

The amount of the halogen compound to be added is preferably 1 to 100 parts by weight, more preferably 5 to 80 parts by weight, further preferably 10 to 50 parts by weight, based on 100 parts by weight of the copolymer. 0.1% of antimony oxide
It is preferably from 20 to 20 parts by weight, more preferably from 1 to 20 parts by weight, even more preferably from 2 to 15 parts by weight. If the added amount of the flame retardant is too small, the flame retardancy becomes insufficient, and if it is too large, the film forming property and the curing reactivity are liable to be inhibited.

Furthermore, in the present invention, other than the above, adhesion promoters, antioxidants (polymerization inhibitors, antioxidants, ultraviolet absorbers, etc.), and other inorganic or organic fillers, as long as the object is not impaired. An agent may be added.

The adhesive of the present invention is prepared by uniformly mixing the above-mentioned copolymer and the above-mentioned additives, kneading them with an extruder, a roll or the like, and then using a calender, roll, T-die extrusion, inflation or other film forming method. Can be used after being formed into a predetermined shape. In forming the film, an embossing process may be performed to prevent blocking and facilitate degassing during pressure bonding with the base film. As a method of embossing, a known method can be adopted, for example, molding with an embossing roll,
A transfer method using an embossed film having releasability is suitably adopted. Further, the copolymer and the above-mentioned additives can be uniformly dissolved in a solvent that does not affect the base film at all, and used as a solution-type adhesive. After pressure bonding, the adhesive can be cured by heating.

In this case, the surface of the adhesive layer (the surface to be bonded to the electronic device) has an average roughness (Ra) of 50 μm or less, more preferably 0.1 μm or less, by the embossing or the like.
It is preferable to form unevenness of from 01 to 50 μm, more preferably from 0.1 to 20 μm, whereby air can easily escape from the surface to be bonded to the device, and it is possible to fill complicated unevenness on the device surface.

The thickness of the adhesive layer is 1 to 1000 μm.
m, particularly preferably 5 to 500 μm. 1 μm
If the thickness is thinner, the sealing property is inferior, and there may be cases where the unevenness of the device cannot be filled. On the other hand, if the thickness is more than 1000 μm, the thickness of the entire device increases, which may cause problems in device storage, assembly, and the like, and may further affect light transmission.

The curing condition of the adhesive of the present invention depends on the kind of the organic peroxide to be used in the case of heat curing using an organic peroxide.
It is preferable that the heating time is 150 ° C. for 2 to 60 minutes, particularly 5 to 30 minutes. In this case, the curing is preferably 0.01 to 50 k
It is recommended to carry out under a pressure of gf / cm ² , especially 0.1 to 20 kgf / cm ² .

In the case of photocuring using a photosensitizer,
Many light sources that emit light in the ultraviolet to visible range can be adopted as the light source, for example, ultra-high pressure, high pressure, low pressure mercury lamp, chemical lamp, xenon lamp, halogen lamp, mercury halogen lamp, carbon arc lamp, incandescent lamp, laser light, etc. Can be The irradiation time cannot be determined unconditionally depending on the type of lamp and the intensity of the light source, but is about several tens of seconds to several tens of minutes.

Further, in order to accelerate the curing, the laminate is preliminarily 4
It may be heated to 0 to 120 ° C. and irradiated with ultraviolet rays.

The method for producing a sealing film for an electronic device according to the present invention is illustrated below, but is not necessarily limited to these methods. Any method can be used as long as the object of the present invention can be achieved. May be used.

First, in the method for preparing an adhesive according to the present invention, the above-mentioned required components are added to the above-mentioned copolymer in a required amount, and other adhesion promoters and anti-aging agents other than those mentioned above are added as long as the purpose is not impaired. (Polymerization inhibitor, antioxidant, ultraviolet absorber, etc.), other inorganic or organic fillers, etc. are weighed, and these components are uniformly mixed and dissolved and dispersed in a good solvent. Next, this solution is applied on a substrate film by a flow coating method, a roll coating method, a gravure roll method, a Myer bar method, a lip die coating method or the like to have a dry thickness of 1 to 10
Coating is performed so that the film thickness accuracy is ± 3 μm in the range of 0 μm. A release film treated with a silicone or fluorine-based release agent may be laminated on this coated adhesive layer and wound up, or adhered for degassing during lamination and integration with circuits, etc. The surface of the agent layer may be wound while being embossed.

As a method of bonding the sealing film and the electronic device, the electronic device is continuously laminated with a pressure roll or the like immediately after the application of the adhesive, that is, immediately after the sealing film comes out of the heating furnace. Or after lamination,
Further, the adhesive layer may be cured in-line by heating using an infrared heater, induction heating, a heat roll or the like. Also, instead of bonding electronic devices inline,
The laminate (sealing film) of the base material film and the adhesive may be once wound up, and bonded to the electronic device off-line using a hot press, a vacuum bag, a vacuum laminator, or the like. The adhesive of the present invention may be applied to one side or both sides of the base film according to the purpose, and is bonded to the same or different base film in multiple layers in consideration of the barrier property of acid or steam. You may.

Since the adhesive used for the sealing film of the present invention contains the above-mentioned copolymer as a main component, the melt viscosity at the time of heating is 5,000 cps or more. Since it can be formed, a highly reliable sealing film can be provided.

The sealing film of the present invention includes EL elements, liquid crystal elements, solar cell elements (crystal, polycrystal, amorphous, etc.), touch panels, various electrodes (ITO, copper electrodes, tin electrodes, solder electrodes, etc.), IC drivers And the like, but are not limited to electronic devices to which the present invention is applied.

[0044]

Industrial Applicability The sealing film for an electronic device of the present invention has good workability at the time of sealing the electronic device, can reliably and satisfactorily seal the electronic device, and has further improved flame retardancy. It is expensive.

[0045]

EXAMPLES The present invention will be described below in detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

[Examples and Comparative Examples]
The components A to F were weighed and uniformly mixed and dissolved in toluene at 40 ° C. to prepare a toluene solution having a solute concentration of 20%. This solution was applied on a tetrafluoroethylene-ethylene copolymer film having a thickness of 50 μm using a reverse roll coater, and a dry thickness of 20 μm was applied.
A laminate having an adhesive layer having a thickness accuracy of ± 1 μm was produced.

This laminate and 2 μm on 3 mm thick glass
A simulated device formed by sputtering thick amorphous silicon, and blending A to C at 150 ° C.
Using a hot roll laminator set for the above, the blends D to F were depressurized by a hot roll laminator set to 100 ° C., and before cooling, a wavelength of 365 n was applied by a 4 kW irradiation device.
m for 1 minute to cure and integrate to obtain an electronic device sealing film. On the other hand, as a comparative example, Epicoat 828 (manufactured by Yuka Shell Epoxy) 10
10 parts by weight of glycidyl methacrylate and 0.5 parts by weight of dicyandiamide were added to 0 parts by weight, and a uniformly mixed adhesive layer was applied on the simulated device so as to have a film thickness of 20 μm. For 15 minutes to integrate. Each film was tested for reliability. Table 2 shows the results.

The evaluation items of the reliability test include heat resistance (100 ° C. × 1000 hours) and wet heat resistance (60 ° C.
90% RH x 1000 hours), thermal cycle endurance test (-50 cycles of -30 ° C x 6 hours → 70 ° C x 6 hours)
Was carried out for three types. As a criterion, after the end of the test, the presence or absence of appearance change such as adhesive peeling and warpage, deviation, pinhole, etc. was visually observed.If any abnormality was recognized, it was judged as x, and if there was no abnormality, it was judged as ○. .

[0049]

[Table 1]

[0050]

[Table 2]

The adhesive layers of the above embodiments were all UL9
Passed at 4-V0.

Continued on the front page (72) Inventor Takahiro Matsuse 3-1-1 Ogawa Higashicho, Kodaira City, Tokyo (72) Inventor Tetsuo Kitano 3-1-1 Ogawa Higashicho, Kodaira City, Tokyo

Claims (10)

[Claims] At least one surface of a light-transmitting substrate film is mainly composed of a copolymer of ethylene, vinyl acetate and an acrylate and / or methacrylate monomer, and a halogen compound and an antimony oxide as flame retardants. And a heat and / or light curable adhesive layer to which a mixture of the above is added. 2. The film according to claim 1, wherein the adhesive comprises 0.1 to 10 parts by weight of an organic peroxide based on 100 parts by weight of the copolymer. 3. The film according to claim 1, wherein the adhesive comprises 0.1 to 10 parts by weight of a photosensitizer per 100 parts by weight of the copolymer. 4. An adhesive comprising 0.1 to 10 parts by weight of a photosensitizer and 0.1 to 10 parts by weight of an organic peroxide, based on 100 parts by weight of the copolymer. The film according to 1. 5. The film according to claim 1, wherein the adhesive comprises 0.01 to 5 parts by weight of a silane coupling agent based on 100 parts by weight of the copolymer. 6. An adhesive obtained by adding at least one of an acryloxy group-containing compound, a methacryloxy group-containing compound and an allyl group-containing compound in an amount of 0.1 to 50 parts by weight to 100 parts by weight of the copolymer. The film according to any one of claims 1 to 5, wherein: 7. The film according to claim 1, wherein the adhesive is obtained by adding 1 to 200 parts by weight of a hydrocarbon resin to 100 parts by weight of the copolymer. . 8. The copolymer according to claim 1, wherein the content of vinyl acetate units is 2 to 50% by weight, and the content of acrylate and / or methacrylate units is 0.01 to 20% by weight. Item 8. The film according to any one of items 1 to 7. 9. The film according to claim 1, wherein irregularities having an average roughness of 50 μm or less are formed on the surface of the adhesive layer. 10. The substrate according to claim 1, wherein the substrate has a light transmittance of 50% or more and a refractive index of 1.8 or less.
The film according to any one of the preceding claims.