JPH11191715A - Array antenna power feeding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the processing of plural signals and to attain miniaturization by integrally providing plural high frequency dielectric layers forming a triplate high frequency circuit, low frequency dielectric layer, high frequency terminal and control terminal on a multilayer air-tight package. SOLUTION: A high frequency signal inputted from the high frequency terminal is transmitted through a through hole 11 to a triplate high frequency line 10 provided on a high frequency dielectric layer 13. A control signal inputted from a control terminal 5 is inputted through a control line 12, which is constituted inside a low frequency dielectric layer 14, and the through hole 11 to a control circuit 8 and converted to a drive signal. The converted signal is passed through a through hole 10 and control line 12 again and controls an integrated circuit 1. The high frequency signal is processed by the integrated circuit 1 but since the triplate high frequency line 10 of one independent layer is formed corresponding to one signal processing circuit, the high frequency signal to pass can be shielded between the outside of a multilayer air-tight package 7 and the other signal processing circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array antenna feeding apparatus for transmitting or receiving signals by controlling a plurality of signals.

[0002]

2. Description of the Related Art FIG. 8 shows a hermetic schedule mounted on a conventional array antenna feeder, wherein 1 is an integrated circuit constituted by a monolithic microwave integrated circuit or a microwave integrated circuit, and 2 is an airtight package. ,
Reference numeral 3 denotes a connection board, 4 denotes a high-frequency terminal, 5 denotes a control terminal, and 6 denotes a hermetic cover. The high-frequency terminal 4 and the control terminal 5 are connected to the connection board 3 provided in the hermetic package 2. 3 is connected to the integrated circuit 1. The conventional array antenna power supply device is constituted by providing a plurality of the above-described hermetic modules, and a signal input through the high-frequency terminal 4 is connected to the connection board 3 in the hermetic package 2.
Through a plurality of integrated circuits 1. On the other hand, the control signal input from the control terminal 5 is input to the plurality of integrated circuits 1 through the connection substrate 3 in the hermetic package 2 and controls the integrated circuit 1. The high-frequency signal is processed by a circuit constituted by the plurality of integrated circuits 1 and the connection substrate 3 with respect to the input signal, and then output to the high-frequency terminal 4 through the connection substrate 3. Further, since the hermetic package 2 is covered with the metal layer 9, signals radiated from the integrated circuit 1 or the connection substrate 3 inside the hermetic package can be shielded, and influence from the surroundings can be prevented.

[0003]

As described above, since the airtight module mounted on the conventional array antenna power supply device is constituted, there are the following problems. That is, since the high-frequency terminal 4 and the control terminal 5 are provided for one hermetic package 2, the hermetic module is large,
Further, even when a control circuit is provided, since it is necessary for each airtight module, there is a problem in that when used in an array antenna power supply device requiring a plurality of high-frequency signal processings, the size becomes large. Further, when processing a plurality of high-frequency signals in one hermetic package 2, there is a problem in that the plurality of high-frequency signals interfere with each other and an intended output signal is not output.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. A plurality of hermetic parts are provided on the same hermetic package, an integrated circuit is installed in each hermetic part, and a high-frequency line including a passive circuit is further provided. It is an object of the present invention to provide a hermetically sealed module capable of processing a plurality of signals and having a reduced size by providing in a hermetically sealed package.

[0005]

According to a first aspect of the present invention, there is provided an array antenna feeder comprising: an integrated circuit mainly including an active element; a multilayer airtight package for mounting the integrated circuit;
A plurality of high-frequency dielectric layers provided integrally with the multilayer hermetic package and forming a triplate high-frequency circuit, and a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit. A frequency dielectric layer, provided integrally with the multilayer airtight package,
The input / output high-frequency terminal connected to the high-frequency dielectric layer, the control terminal connected to the low-frequency dielectric layer provided integrally with the multilayer airtight package, and the integrated terminal provided to the multilayer airtight package, A plurality of digging surfaces for individually attaching integrated circuits, a surface metal layer provided integrally with the digging surface and the surface of the multilayer airtight package, the high-frequency dielectric layer and the low-frequency dielectric layer, A plurality of modules comprising a metal connecting the surface metal layer and a metal plate that hermetically seals the dug surface and has the same potential as the surface metal layer are provided, and each of the modules is It has a function of controlling a plurality of signals in parallel.

Further, an array antenna feeder according to a second aspect of the present invention is an integrated circuit having an active element as a main component, a multilayer hermetic package for mounting the integrated circuit, and an integrated circuit provided in the multilayer hermetic package. A high-frequency dielectric layer forming a circuit, provided integrally with the multilayer hermetic package, a low-frequency dielectric layer forming a control circuit for controlling the integrated circuit, and provided integrally with the multilayer hermetic package; The input / output high-frequency terminal connected to the high-frequency dielectric layer, the control terminal connected to the low-frequency dielectric layer provided integrally with the multilayer airtight package, and the integrated terminal provided to the multilayer airtight package, A plurality of digging surfaces for individually mounting integrated circuits, and the digging surfaces and the surface of the multilayer airtight package are integrally provided. The high-frequency dielectric layer, the metal connecting the low-frequency dielectric layer and the surface metal layer, and the high-frequency dielectric layer to prevent signal interference in the high-frequency dielectric layer. A plurality of modules comprising a signal shielding metal provided on the base plate and a metal plate hermetically sealing the dug surface and having the same potential as the surface metal layer are provided, and each of the modules is provided with a plurality of modules. It has a function of controlling signals in parallel.

The array antenna feeder according to a third aspect of the present invention provides an integrated circuit mainly composed of active elements, a multilayer hermetic package for mounting the integrated circuit, and a triplate high frequency integrated with the multilayer hermetic package. A plurality of high-frequency dielectric layers forming a circuit and a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and integrated with the multilayer hermetic package An input / output high-frequency terminal connected to the high-frequency dielectric layer, a control terminal connected to the low-frequency dielectric layer, and a control terminal connected to the low-frequency dielectric layer. Antenna element connected to the high-frequency dielectric layer, and provided integrally with the multilayer airtight package,
A plurality of digging surfaces for individually mounting the integrated circuits,
A surface metal layer provided integrally with the dug surface and the surface of the multilayer hermetic package, a metal connecting the high-frequency dielectric layer, the low-frequency dielectric layer, and the surface metal layer, A plurality of modules, each of which has a function of controlling a plurality of signals in parallel. It is a feature.

The array antenna feeder according to a fourth aspect of the present invention provides an integrated circuit mainly composed of active elements, a multilayer hermetic package for mounting the integrated circuit, and a triplate high frequency integrated with the multilayer hermetic package. A plurality of high-frequency dielectric layers forming a circuit and a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and integrated with the multilayer hermetic package An input / output high-frequency terminal connected to the high-frequency dielectric layer, a control terminal connected to the low-frequency dielectric layer, and a control terminal connected to the low-frequency dielectric layer. A waveguide / triplate high-frequency line converter capable of connecting the high-frequency dielectric layer and the waveguide; A plurality of digging surfaces provided integrally with the cage and individually mounting the integrated circuits; a surface metal layer provided integrally with the digging surfaces and the surface of the multilayer airtight package; A module comprising a metal that connects the layer, the low-frequency dielectric layer, and the surface metal layer, and a metal plate that hermetically seals the dug surface and has the same potential as the surface metal layer. A plurality of modules are provided, and each of the modules has a function of controlling a plurality of signals in parallel.

The array antenna feeding device according to a fifth aspect of the present invention provides an integrated circuit mainly composed of active elements, a multilayer hermetic package for mounting the integrated circuit, and a triplate high frequency integrated circuit provided integrally with the multilayer hermetic package. A plurality of high-frequency dielectric layers forming a circuit and a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and integrated with the multilayer hermetic package An input / output high-frequency terminal connected to the high-frequency dielectric layer, a control terminal connected to the low-frequency dielectric layer, and a control terminal connected to the low-frequency dielectric layer. A plurality of digging surfaces for individually attaching the integrated circuit, a surface metal layer provided integrally with the digging surface, A metal connecting the wave absorber which is provided integrally on the surface of the layer airtight package, and the high-frequency dielectric layer and the low-frequency dielectric layer and the surface metal layer,
A plurality of modules are hermetically sealed on the digging surface, and a metal plate having the same potential as the surface metal layer, and each module has a function of controlling a plurality of signals in parallel. It is characterized by the following.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment l. FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a top view showing the first embodiment of the present invention, and FIG. 3 is a view of FIG. 2 showing the first embodiment of the present invention. It is sectional drawing of AA '. Figure 1,
2 and 3, 7 is a multilayer airtight package, 8 is a control circuit, 9 is a surface metal layer, 10 is a triplate high-frequency line, 11 is a through hole, 12 is a control line, 13 is a high-frequency dielectric layer, and 14 is a low-frequency dielectric layer. It is a frequency dielectric layer. By providing a plurality of modules shown in FIG. 1, an array antenna feeding device is configured. The multilayer airtight package 7 is an integrated circuit 1
The control circuit 8 is mounted on the back surface of the surface on which the integrated circuit 1 is mounted.

Next, the operation will be described. The multi-layer airtight package 7 is provided with a triplate high-frequency line 1 so that signal processing can be performed independently on a plurality of high-frequency input signals.
1 is used to form a signal processing circuit. Triplate high-frequency line 11 constituting each signal processing circuit
Are formed in different layers in the high-frequency dielectric layer 13, so that the respective high-frequency signals do not interfere with each other. For one high-frequency signal, the high-frequency signal input from the high-frequency terminal 4 is transmitted to the triplate high-frequency line 10 provided in the high-frequency dielectric layer 13 via the through-hole 11. The triplate high-frequency line 11 is connected to the integrated circuit 1, and a high-frequency signal is input to the integrated circuit 1. On the other hand, the control signal input from the control terminal 5 is connected to the control circuit 8 via the control line 12 and the through hole 11 formed in the low-frequency dielectric layer 14, and the control circuit 8 On the other hand,
Each integrated circuit 1 is converted into a drive signal for directly controlling the integrated signal.
The drive signal output from the control circuit 8 is again input to the integrated circuit 1 via the through hole 10 and the control line 12, and controls the integrated circuit 1. High frequency signal is integrated circuit 1
After signal processing is performed by the drive signal, the signal is transmitted again through the triplate high-frequency line 10 and the through-hole 11 and output to the high-frequency terminal 4. At this time, since the triplate high-frequency line 10 is constituted by one independent layer for one signal processing circuit, the high-frequency signal passing through the high-frequency dielectric layer 13 is transmitted to the outside of the multilayer hermetic package 7 and to another signal. It is possible to shield between signal processing circuits. Further, since the digging inner surface of the multilayer airtight module 7 and the airtight cover 6 are covered with the surface metal layer 9, the integrated circuit 1 can also be shielded from the outside. Therefore, a plurality of high-frequency signals can be processed by one airtight module, and the size can be reduced. Further, the high-frequency signal and the control signal are respectively transmitted to the low-frequency dielectric layer 14 and the high-frequency dielectric layer 13.
In this case, it is possible to use a dielectric material in which each layer is adapted to the characteristics of a transmission signal, thereby achieving cost reduction.

Although only the triplate high-frequency line is used here for the sake of simplicity, it goes without saying that the line may include a passive element.

Embodiment 2 FIG. FIG. 2 is a top view showing Embodiment 2 of the present invention, and FIG. 4 is a cross-sectional view taken along AA ′ of FIG. 2 showing Embodiment 2 of the present invention. Reference numeral 15 denotes a through hole for shielding a high-frequency signal. Next, the operation will be described. A plurality of high-frequency signal shielding through holes 15 connected to a metal layer are provided on both sides of the triplate high-frequency line 10 constituting a plurality of signal processing circuits in the same layer in the high-frequency dielectric layer 13. Since the interval between the high-frequency signal shielding through holes 15 is sufficiently narrow with respect to the operating frequency, the electric field radiated from the triplate high-frequency line 10 is grounded by the high-frequency signal shielding through hole 13. Therefore, the high-frequency signal flowing through the triplate high-frequency line 10 is transmitted to another triplate high-frequency line 10 in the same layer.
Does not interfere with Therefore, each triplate high-frequency line 10 can handle an independent signal.

Here, a through hole is used as a method of shielding a high-frequency signal, but it goes without saying that the high-frequency signal may be shielded by a metal column or the like.

Embodiment 3 FIG. 5 is a perspective view showing Embodiment 3 of the present invention. Reference numeral 14 denotes an antenna element. Next, the operation will be described. Here, a receiving module will be described as an example. Antenna element 14 is through hole 1
The high-frequency signal connected to the triplate high-frequency line 10 through the antenna 1 and received by the antenna element 14 is input to the integrated circuit 1, subjected to signal processing as in the first embodiment, and output from the high-frequency terminal 4. The reverse operation is performed for the transmission module.

Embodiment 4 FIG. 6 is a perspective view of Embodiment 4 of the present invention. 15 is a waveguide / triplate conversion, and 16 is a waveguide. Next, the operation will be described. Here, a receiving module will be described as an example. The waveguide / triplate converter 15 is connected to the triplate high-frequency line 10, and the high-frequency signal output from the waveguide 16 is converted by the waveguide / triplate converter 15 into the triplate high-frequency line 1.
It is converted to a high frequency signal on 0. This high-frequency signal is input to the integrated circuit 1, subjected to signal processing as in the first embodiment, and output from the high-frequency terminal 4. The reverse operation is performed for the transmission module.

Embodiment 5 FIG. 2 is a top view showing a fifth embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line AA ′ of FIG. 2 showing a fifth embodiment of the present invention. 17 is a radio wave absorber. Next, the operation will be described. In the first embodiment of the present invention, the metal layer 9 is used, but the metal layer 9 is not used, and a radio wave absorber 17 may be used instead. By using the radio wave absorber 17, high-frequency signals are sufficiently shielded, and the same effect as that of the metal layer 9 can be obtained. Furthermore, since the signal from the outside of the airtight module is absorbed, even when the airtight module is provided near the element antenna, it is not necessary to consider the influence of the airtight module on the radiation characteristics.

[0018]

According to the first aspect of the present invention, the area occupied by one signal processing circuit can be increased, so that a complicated circuit can be formed.

Further, according to the second invention, it is possible to handle a plurality of high-frequency signals in the same layer,
The size can be reduced.

Further, according to the third aspect, since signals can be directly transmitted and received by the airtight module, the configuration of the array antenna power supply device can be simplified.

According to the fourth aspect, it is possible to easily connect the element antenna of the array antenna having the waveguide input / output.

According to the fifth aspect, when the module is provided near the element antenna, disturbance of the electric field can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing Embodiment 1 of an airtight module provided in an array antenna power supply device according to the present invention.

FIG. 2 is a top view showing Embodiments 1, 2, and 5 of the airtight module provided in the array antenna power supply device according to the present invention.

FIG. 3 is a diagram illustrating an airtight module of the array antenna feeder according to the first embodiment of the present invention;
It is sectional drawing of A '.

FIG. 4 is a diagram illustrating a second embodiment of an airtight module included in the array antenna power supply device according to the present invention;
It is sectional drawing of A '.

FIG. 5 is a perspective view showing Embodiment 3 of an airtight module provided in the array antenna power supply device according to the present invention.

FIG. 6 is a perspective view showing a fourth embodiment of an airtight module provided in the array antenna power supply device according to the present invention.

FIG. 7 is a diagram illustrating a fifth embodiment of an airtight module included in the array antenna power supply device according to the present invention;
It is sectional drawing of A '.

FIG. 8 is a perspective view showing a hermetic module provided in a conventional array antenna power supply device.

[Explanation of symbols]

1 integrated circuit, 2 hermetic package, 3 connection board, 4
High frequency terminal, 5 control terminal, 6 hermetic cover, 7 multilayer hermetic package, 8 control circuit, 9 surface metal layer, 1
0 Triplate high frequency circuit, 11 through hole, 1
2 Control line, 13 High frequency signal shielding metal, 14 High frequency dielectric layer, 15 Low frequency dielectric layer, 16 Antenna element, 17 Waveguide / Triplate conversion, 18 Waveguide, 19 Radio wave absorber.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Hitoshi Mizumi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (5)

[Claims] An integrated circuit mainly composed of an active element, a multilayer hermetic package for mounting the integrated circuit, and a plurality of high-frequency dielectric layers provided integrally with the multilayer hermetic package and forming a triplate high-frequency circuit And a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and provided integrally with the multilayer hermetic package and connected to the high-frequency dielectric layer. A plurality of input / output high-frequency terminals, a plurality of control terminals provided integrally with the multilayer hermetic package, and a control terminal connected to the low-frequency dielectric layer, and a plurality of integrated terminals provided separately with the multi-layer hermetic package and individually mounting the integrated circuit. A digging surface, a surface metal layer provided integrally with the digging surface and the surface of the multilayer airtight package, and the high-frequency dielectric layer. A metal connecting the low-frequency dielectric layer and the surface metal layer, hermetically sealing the dug surface,
An array antenna power supply apparatus, comprising: a plurality of modules each including a surface metal layer and a metal plate having the same potential; each module having a function of controlling a plurality of signals in parallel. 2. An integrated circuit mainly composed of active elements, a multilayer hermetic package for mounting the integrated circuit, a high-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a triplate high-frequency circuit, A low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit; and an input / output high frequency provided integrally with the multilayer hermetic package and connected to the high-frequency dielectric layer A terminal, a control terminal provided integrally with the multilayer hermetic package and connected to the low-frequency dielectric layer, and a plurality of dug surfaces provided integrally with the multilayer hermetic package and separately mounting the integrated circuit. A surface metal layer provided integrally with the digging surface and the surface of the multilayer hermetic package; the high-frequency dielectric layer and the low-frequency dielectric layer; A metal connecting the wave dielectric layer and the surface metal layer; a signal shielding metal provided on the high-frequency dielectric layer to prevent signal interference in the high-frequency dielectric layer; An array characterized in that a plurality of modules comprising a metal plate which is hermetically sealed and has the same potential as the surface metal layer are provided, and each of the modules has a function of controlling a plurality of signals in parallel. Antenna feeder. 3. An integrated circuit mainly composed of active elements, a multilayer hermetic package for mounting the integrated circuit, and a plurality of high-frequency dielectric layers integrally provided in the multilayer hermetic package and forming a triplate high-frequency circuit. And a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and provided integrally with the multilayer hermetic package and connected to the high-frequency dielectric layer. An input / output high-frequency terminal, a control terminal integrated with the multilayer hermetic package and connected to the low-frequency dielectric layer, and an antenna integrated with the multilayer hermetic package and connected to the high-frequency dielectric layer An element, a plurality of digging surfaces provided integrally with the multilayer hermetic package and individually mounting the integrated circuit, and the digging surfaces And a surface metal layer provided integrally with the surface of the multilayer airtight package, a metal connecting the high-frequency dielectric layer, the low-frequency dielectric layer, and the surface metal layer, and a digging surface. An array characterized in that a plurality of modules comprising a metal plate which is hermetically sealed and has the same potential as the surface metal layer are provided, and each of the modules has a function of controlling a plurality of signals in parallel. Antenna feeder. 4. An integrated circuit mainly composed of an active element, a multilayer hermetic package for mounting the integrated circuit, and a plurality of high frequency dielectric layers provided integrally with the multilayer hermetic package and forming a triplate high frequency circuit. And a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and provided integrally with the multilayer hermetic package and connected to the high-frequency dielectric layer. An input / output high-frequency terminal, a control terminal provided integrally with the multilayer hermetic package and connected to the low-frequency dielectric layer, and a control terminal provided integrally with the multilayer hermetic package; And a waveguide / triplate high-frequency line converter which can be connected to the multilayer airtight package.
A plurality of digging surfaces for individually mounting the integrated circuits,
A surface metal layer provided integrally with the dug surface and the surface of the multilayer hermetic package, a metal connecting the high-frequency dielectric layer, the low-frequency dielectric layer, and the surface metal layer, A plurality of modules, each of which has a function of controlling a plurality of signals in parallel. Characteristic array antenna feeder. 5. An integrated circuit mainly composed of an active element, a multilayer hermetic package for mounting the integrated circuit, and a plurality of high-frequency dielectric layers integrally provided in the multilayer hermetic package and forming a triplate high-frequency circuit. And a low-frequency dielectric layer provided integrally with the multilayer hermetic package and forming a control circuit for controlling the integrated circuit, and provided integrally with the multilayer hermetic package and connected to the high-frequency dielectric layer. A plurality of input / output high-frequency terminals, a plurality of control terminals provided integrally with the multilayer hermetic package, and a control terminal connected to the low-frequency dielectric layer, and a plurality of integrated terminals provided separately with the multi-layer hermetic package and individually mounting the integrated circuit. A digging surface, a surface metal layer provided integrally with the digging surface, and an electric current provided integrally with the surface of the multilayer airtight package. The wave absorber, the metal connecting the high-frequency dielectric layer, the low-frequency dielectric layer, and the surface metal layer, hermetically seal the dug surface, and have the same potential as the surface metal layer. A plurality of modules each comprising a metal plate having a function of controlling a plurality of signals in parallel.