JPH1118270A - Cable connection and terminal sections - Google Patents

Abstract

PROBLEM TO BE SOLVED: To compensate for the drop in crosslinking strength between a semiconductor layer and an insulating layer, even in the case that interface diffusion method is used by providing a polyolefin layer made of polyolefin resin material which is higher in the content of crosslinking agents than the insulating layer, between the semiconductor layer and the insulating layer. SOLUTION: There are provided an inner semiconductor layer 6, an insulating layer 7, and an outer semiconductor layer 8 for connection, on the conductor connection which is coupled by a compressive coupling 5 or the like, the exposed parts at the tips of resin-covered cables where the conductors 1 are covered with inner semiconductor layers 2, insulating layers 3, and outer semiconductor layers 4. Then, this is provided with polyolefin reinforcing layers 9, made of a polyolefin resin material higher in the content of crosslinking agents than the insulating layer between the inner semiconductor layer 6 and the insulating layer 7, and between the insulating layer 7 and the outer semiconductor layer 8. As a result even if interface diffusion method is adopted, the degree of crosslinking in the vicinity of the interface between the semiconductor layer and the insulating layer is improved, so that the insulation performance of the cable connection, etc., can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a polyolefin-coated cable connection portion or a terminal portion in which a semiconductive layer and an insulating layer are coated on the periphery of a conductor connection portion, and particularly to a structure near an interface with the semiconductive layer. The present invention relates to a polyolefin-coated cable connection or termination having improved density and crystallinity of an insulating material. The present invention also relates to a method for manufacturing the above-described cable connecting portion and terminal portion.

[0002]

2. Description of the Related Art A power cable using a polyolefin as an insulating coating, for example, a CV cable, is easy to lay and maintain, and has a small power transmission loss. Therefore, it has begun to be used as a high-voltage power cable. However, in the case of the polyolefin insulated cable, the insulation deteriorates greatly over time, and the design potential gradient must be smaller than that of the OF cable or the like, and there is a problem that the thickness of the insulating layer must be increased accordingly.

[0003] Regarding the problem of the deterioration of the insulation of a polyolefin insulated cable over time, a high-pressure polyolefin insulated cable is usually provided on a conductor 21 in addition to an insulator layer 22, as shown in cross section in FIG. It has a structure in which semiconductive layers 23 and 24 are provided on the conductor side and the outer peripheral side of the cable for electric field relaxation and partial discharge prevention. It has been found that there is a major cause for electric field concentration due to interface irregularities.

On the other hand, some of the present inventors have made a semiconductive layer contain a surfactant-based high-dielectric substance, and diffused it toward the insulating layer side by heating at the time of crosslinking of the coating material, thereby forming a semiconductive layer. It has been proposed that a diffusion layer for electric field relaxation having a continuous dielectric constant gradient is formed near the interface between the layer and the insulating layer to prevent insulation deterioration (Japanese Patent Publication No. 5-32846, Japanese Patent Application Laid-Open No. 4-5600).
No. 9, hereinafter this method is referred to as “interface diffusion method”).

On the other hand, the connecting portion and the terminal portion of the cable as described above are formed by an extrusion mold joint method (EMJ method), a tape winding mold joint method (TMJ method), or the like. For example, FIG. As shown in the figure (the cable section is not shown in cross section), an inner semiconductive layer 33
An insulating layer 32 and an external semiconductive layer 34 are sequentially provided.
Therefore, it is conceivable that the above interface diffusion method is applied to such a cable connection portion to prevent insulation deterioration.

However, it has been found that a surfactant-based high dielectric substance used in the interfacial diffusion method has an effect of inhibiting crosslinking of a resin material. Therefore, in order to obtain a sufficient effect of adding a surfactant-based high dielectric substance in the interfacial diffusion method, and at the same time, to obtain a sufficient cross-linking of the resin in the diffusion portion and to prevent the deterioration of the insulating performance of the insulating material, the vicinity of the interface is required. Must have a higher than normal crosslinking agent content.

[0007] As for the cable itself, the semiconductive layer and the insulator layer are usually extruded and cross-linked at the same time when the cable is manufactured. Can be easily compensated for.

[0008] However, in the manufacture of the above-described cable connection portion, the above-described layers are sometimes laminated and formed at the connection site as in the EMJ method. In order to simplify the process, a pre-formed material is used for each layer. May be used. In particular, since the thickness of the semiconductive layer is relatively small, it is more advantageous to use a preformed sheet or the like at the connection site and integrate it with the insulating layer.

Such a preformed semiconductive layer material is usually manufactured as a heat-shrinkable sheet or the like, but if it contains a cross-linking agent, the cross-linking proceeds during the formation of the sheet or the like itself. Since a problem such as inability to obtain heat shrinkage or inability to integrate with an insulating layer may occur, it is manufactured by cross-linking a required amount with an electron beam or the like without using a cross-linking agent.

However, such a semiconductive layer material containing no cross-linking agent cannot compensate for a decrease in cross-linking near the interface when the above-mentioned interface diffusion method is used, and the insulation performance of the cable itself deteriorates. As a result, the advantages of the interface diffusion method cannot be utilized. On the other hand, it is conceivable to increase the cross-linking agent of the insulating layer material.However, if the cross-linking agent of the insulating layer material is increased, the cross-linking of the insulator layer proceeds excessively quickly, which makes it difficult to extrude at the connection site. It may interfere with the manufacturing process. Excessive cross-linking is also undesirable as a characteristic of the insulating layer itself.

[0011]

Accordingly, the present invention is directed to a method of forming a connection between a semiconductive layer and an insulating layer even when an interfacial diffusion method is used to prevent insulation deterioration at a connection portion or a termination portion of a polyolefin-coated cable as described above. It is an object of the present invention to provide a structure of a connection portion or a terminal portion of a cable which can compensate for inhibition of cross-linking near an interface, and a method of manufacturing the same.

[0012]

As a result of the research conducted by the present inventors, a polyolefin resin material containing a surfactant-based high dielectric substance was formed on the periphery of the above-mentioned conductor connection portion by an interfacial diffusion method. At the cable connection portion or the terminal portion coated with the semiconductive layer and the insulating layer formed of the polyolefin resin material, the crosslinker content is lower than that of the polyolefin resin material forming the insulating layer between the semiconductive layer and the insulating layer. By providing a polyolefin layer formed from a high polyolefin resin material, it is possible to compensate for a decrease in the degree of cross-linking near the interface between the semiconductive layer and the insulating layer even when using the interface diffusion method. It has been found that the density and crystallinity of the resin material can be improved.

Accordingly, the present invention provides a cable connection portion in which a semiconductive layer formed of a polyolefin resin material containing a surfactant-based high dielectric substance and an insulating layer formed of a polyolefin resin material are coated on a conductor periphery. Or a cable provided with a polyolefin reinforcing layer formed of a polyolefin resin material having a higher crosslinking agent content than the polyolefin resin material forming the insulating layer between the semiconductive layer and the insulating layer at the terminal end. Provide connections or terminations.

According to a preferred embodiment of the cable connecting portion or terminal end of the present invention, the semiconductive layer is formed of a polyolefin resin material containing no crosslinking agent. Part; the reinforcing layer is provided between the outer semiconductive layer and the insulating layer; the cable connection part or the terminal part; wherein the content of the crosslinking agent of the polyolefin resin material forming the polyolefin reinforcing layer is Wherein the amount of the crosslinking agent is from 0.5 to 5 parts by weight based on 100 parts by weight of the polyolefin resin material; In terms of 100 parts by weight of the resin material with respect to the amount of the crosslinking agent of the polyolefin resin material forming
The high-dielectric substance having a surfactant content of 200 to 4.0 parts by weight;
Sorbitan fatty acid ester, glycerin fatty acid ester, decaglycerin fatty acid ester, polyglycerin fatty acid ester, propylene glycol / pentaerythritol fatty acid ester having a molecular weight of about 20,000 or less,
Polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbite fatty acid ester, polyoxylenglycerin fatty acid ester, polyethylene glycol fatty acid ester, polyoxyethylene alkyl ether, polyoxyethylene fistosterol phytostanol, polyoxyethylene polyoxypropylene alkyl ether, Polyoxyethylene alkylamine
The above cable connection or terminal part selected from a fatty acid amide, a polyoxyethylene alkylphenyl formaldehyde condensate, a single chain polyoxyethylene alkyl ether, and a styrene-maleic acid copolymer derivative; and an interface The amount of the activator-based high dielectric substance is
The above cable connection portion or terminal portion is provided in an amount of 0.1 to 30 parts by weight with respect to 100 parts by weight of the polyolefin resin material forming the semiconductive layer.

The present invention further relates to the above-mentioned method for producing a cable connecting portion or terminal portion according to the present invention, wherein the polyolefin resin material forming a semiconductive layer and the polyolefin resin material forming an insulating layer on the periphery of a conductor are provided. The cable connecting portion, wherein when covering and crosslinking, a polyolefin resin material having a higher crosslinking agent content than a polyolefin resin forming an insulating layer is interposed between the semiconductive layer material and the insulating layer material. Alternatively, a method for manufacturing the terminal portion is provided.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.

The cable connecting portion and the terminal portion of the present invention are formed on a conductor 1 by an internal semiconductive layer 2, an insulating layer 3 and an external portion, as shown in FIG. The semiconductive layer 4 is coated on the conductor connecting portion where the exposed conductor at the end of the resin-coated cable is joined by a compression joint (conductor sleeve) 5 or the like. A polyolefin resin provided with a semiconductive layer 8 and having a higher crosslinking agent content than the insulating layer between the inner semiconductive layer 6 and the insulating layer 7 and between the insulating layer 7 and the outer semiconductive layer 8 It has a structure in which a polyolefin reinforcing layer 9 made of a material is provided.

In the connection shown in FIG. 1, a polyolefin reinforcing layer 8 is provided both between the inner semiconductive layer 5 and the insulating layer 6 and between the insulating layer 6 and the outer semiconductive layer 7. However, a polyolefin reinforcing layer may be provided between any one of the semiconductive layer and the insulating layer. Since a preformed polyolefin resin semiconductive layer material is often used as an external semiconductive layer, it is preferable to provide a polyolefin reinforcing layer 8 between the insulating layer 6 and the external semiconductive layer 7.

The base polymer used for the production of the semiconductive layer, the insulating layer and the polyolefin reinforcing layer may be a polyolefin used for ordinary polyolefin resin-coated cables and their connection parts, and is preferably, for example, polyethylene or ethylene and An ethylene copolymer composed of a monomer copolymerizable therewith may be included. Examples of the ethylene copolymer include an ethylene / vinyl acetate copolymer and an ethylene / ethyl acrylate copolymer.

In the case of polyethylene, the molecular weight is generally tens of thousands to hundreds of thousands, preferably 50,000 to 200,000, and particularly preferably about 70 to 80,000. The molecular weight of the ethylene copolymer is generally tens of thousands to hundreds of thousands, and preferably about 50,000 to 100,000. When the ethylene copolymer is contained in the polyethylene, the amount of the ethylene copolymer is usually about 10 to 40% by weight of the whole resin. The amount of a portion derived from a monomer other than ethylene in the ethylene copolymer is generally 20 to 50% by weight, preferably 25 to 4% by weight.
It is about 0% by weight.

These polyolefin resins are crosslinked in advance or at the time of manufacturing the cable connecting portion to form each layer.

The insulating layer and the polyolefin reinforcing layer are crosslinked by a commonly used crosslinking agent, and preferably a peroxide crosslinking agent is used. Examples of peroxides include benzyl peroxide, 1,1-bis-t-butylperoxy-
3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclododecane, n-butyl-4,4-bis-t-butyl peroxide, dicumyl peroxide, t-butyl peroxy Benzoate,
Di-t-butyl peroxide, di (t-butylperoxy) -m-diisopropylbenzene, 2,5-dimethyl-2,5-di (t-butyl) peroxybenzene, t
-Butylperoxycumene and the like, and dicumyl peroxide is particularly preferred. These organic peroxides can be used alone or in combination of two or more.

The amount of the cross-linking agent may be the same as that used in the polyolefin material used for forming the insulating layer of the cable connection portion in the past, and varies depending on the type of the material. It is generally used in an amount of about 0.2 to 5.0 parts by weight per 100 parts by weight of the resin. The polyolefin reinforcing layer is also generally used in an amount of about 0.2 to 5 parts by weight per 100 parts by weight of the polyolefin resin forming the semiconductive layer. In order to compensate for a decrease in the degree of crosslinking near the interface between the insulating layer and the insulating layer, the insulating layer has a higher crosslinking agent content than the insulating layer. The amount of the cross-linking agent of the polyolefin material forming the polyolefin reinforcing layer is preferably 0.05 to 4.0 parts by weight in terms of 100 parts by weight of the resin material with respect to the amount of the cross-linking agent of the insulating layer as described above. It is assumed that there are many. If the difference in the amount of the crosslinking agent with the polyolefin resin material forming the insulating layer is less than 0.05 parts by weight, the effect of compensating the degree of crosslinking is not sufficient. Become excessive.

The degree of crosslinking of the polyolefin in the reinforcing layer portion is as follows:
It is preferable that the degree of cross-linking of the insulating layer be substantially equal to the degree of cross-linking after the production of the connection portion and the like.

The polyolefin resin material forming the insulating layer and the polyolefin reinforcing layer may use a commonly used crosslinking aid, such as triallyl isocyanurate (TAIC) or trimethylolpropane trimetalate (TMM). And the like.

The polyolefin resin material forming the semiconductive layer is not hindered from containing a cross-linking agent, but as described above, the present invention relates to the case where the cross-linking degree near the interface cannot be compensated for by the cross-linking agent of the semi-conductive layer. Since the purpose is to compensate for the degree of crosslinking near the interface, in a preferred embodiment of the present invention, the semiconductive layer does not contain a crosslinking agent.

The thicknesses of the semiconductive layer and the insulating layer may be those used in conventional cable connection parts. Although it depends on the specification voltage of the cable, the semiconductive layer usually has a thickness of about 0.5 to 2 mm, and the insulating layer has a thickness of about 10 to 30 mm.

The semiconductive layer having the above-mentioned thickness can be easily formed by crosslinking without a crosslinking agent by electron beam irradiation or the like.
It is preferably used for the above cable connection part. In the present invention, even when such a semiconductive layer containing no cross-linking agent is used, the presence of the polyolefin reinforcing layer formed from the polyolefin resin material having a high cross-linking agent content causes the presence of a semi-conductive layer and an insulating layer. A decrease in the degree of crosslinking near the interface is compensated.

The thickness of the polyolefin reinforcing layer is preferably about 0.1 to 2 mm. When the polyolefin reinforcing layer has the cross-linking agent content as described above and has a thickness in such a range, a decrease in the degree of cross-linking near the interface between the semiconductive layer and the insulating layer is compensated.

The resin material for the polyolefin reinforcing layer and the semiconductive layer having the above-mentioned thickness is prepared by mixing necessary components in a base polymer and molding in advance as a sheet, a tape or the like, and using it at a cable connection site. Is preferred.

The conductive material for imparting conductivity to the semiconductive layer may also be those conventionally used, and usually carbon black is used. The type of carbon black may be one conventionally used as a conductive agent. The amount of the conductive material is about 50 to 200 parts by weight based on 100 parts by weight of the base polymer. When the amount of the conductive substance is less than 50 parts by weight, the conductive properties are not sufficient, and when the amount exceeds 200 parts by weight, the mechanical properties of the semiconductive layer are significantly reduced.

Further, a surfactant-based high dielectric substance is added to the polyolefin resin material forming the semiconductive layer in order to obtain an electric field relaxation effect by the above-mentioned interface diffusion method. The surfactant-based high dielectric constant material is preferably 200 to 20,000.
About sorbitan fatty acid ester, glycerin fatty acid ester, decaglycerin fatty acid ester, polyglycerin fatty acid ester, propylene glycol pentaerythritol fatty acid ester, polyoxyethylene sorbitan fatty acid ester , Polyoxyethylene sorbite fatty acid ester, polyoxylen glycerin fatty acid ester, polyethylene glycol fatty acid ester, polyoxyethylene alkyl ether, polyoxyethylene fistosterol phytostanol, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene alkylamine. Fatty acid amide, polyoxyethylene alkylphenyl formaldehyde condensate, single chain polyoxyethylene Down alkyl ether, styrene Miles acid copolymer derivatives.

These surfactant-based high dielectric substances can be used alone or as a mixture of two or more kinds.
About 0.1 to 30 parts by weight is added to 100 parts by weight of the semiconductive layer forming material. If the addition amount is less than 0.1 part by weight, the effect of increasing the density or crystallinity of the insulating material is reduced. If the amount is more than 30 parts by weight, the adhesion between the semiconductive layer and the polyolefin reinforcing layer deteriorates. This is considered to be due to the fact that the surfactant-based substance added has an increased surface activity and weakens the bond between the semiconductive layer and the insulating layer.

The resin material used for the cable connecting portion of the present invention may include, if desired, magnesium oxide, aluminum oxide, and the like within a range not to impair the object effect of the present invention.
Inorganic fillers such as zirconium oxide, titanium oxide, silicon carbide, mica, clay, etc., plasticizers such as fatty acids such as stearic acid and oleic acid or metal salts thereof, processing aids, mineral oils,
Waxes, softeners such as paraffins, anti-aging agents such as esters and amides, crosslinking accelerators, coloring agents, antioxidants,
Other additives such as an ultraviolet absorber, a lubricant, and a stabilizer may be added.

The method for manufacturing a cable connecting portion or a terminal portion according to the present invention is characterized in that a polyolefin resin material forming a semiconductive layer and a polyolefin resin material forming an insulating layer are covered and crosslinked on the periphery of a conductor. It is characterized by interposing a polyolefin resin material having a higher cross-linking agent content than the polyolefin resin forming the insulating layer between the conductive layer material and the insulating layer material. Can be performed in the same manner.

The cable connecting portion or terminal portion of the present invention can be manufactured by, for example, the TMJ method as follows. First, the cable is straightened and cut to expose the conductor. The exposed portion of the conductor is connected by a conductor sleeve, and the inner conductor is treated by coating a sheet or the like made of a resin composition for a semiconductive layer, for example, and further made of a resin material for a polyolefin reinforcing layer, for example. Wrap the tape. Then, a tape made of a resin material for forming an insulating layer is wound thereon, and further a tape made of a resin material for a polyolefin reinforcing layer is wound. Further, for example, a sheet or the like made of a resin material for a semiconductive layer is wound thereon to perform an external conduction process. Then, the whole is heated and pressurized to be crosslinked to integrate the whole. The crosslinking temperature depends on the thickness of each layer,
Although it depends on materials and the like, it is usually performed at a temperature of about 150 to 200 ° C. for about 5 to 15 hours. Thereafter, an external shielding process is performed in the same manner as in the manufacture of a conventional connection portion.

In the above, the method of manufacturing the cable connection portion of the present invention has been described for the TMJ method, but the EMJ method or the like can also be used. Although the above description has been made with reference to the drawings showing the cable connecting portion of the present invention, the configuration of the present invention is applied to a cable terminal portion, for example, a gas terminal portion (EB-G) or an air terminal portion (EB-A). Etc. can be applied as it is.

[0038]

[Example] Polyethylene resin (cross-linked polyethylene HFD)
J4201, Nippon Yunika) 1 part by weight of carbon black as a conductive agent (polyethylene containing carbon black, ultra-high pressure semicon polyethylene [introduced in Nippon Yunika]) per 100 parts by weight of a surfactant-based high dielectric substance (Sorbitan fatty acid ester, glycerin fatty acid ester) 2 parts by weight were added, formed into a sheet having a thickness of 1.0 mm, and electron beam crosslinked was used as a material for forming a semiconductive layer, and polyethylene resin (HFDJ42) was used.
01, Nippon Yunika) 2 parts by weight of a crosslinking agent (dicumyl peroxide) were added to 100 parts by weight, and the thickness was 1.0 m
A tape-shaped product having a width of 25 mm and a width of 25 mm was used as a material for forming an insulating layer.

Further, a polyethylene resin (HFDJ420)
1, 100 parts by weight of Nihon Unica), 3 parts by weight of a crosslinking agent (dicumyl peroxide) was added, and the thickness was 0.2 m.
A tape-shaped material having a width of 25 mm and a width of 25 mm was used as a material for forming a reinforcing layer.

An experimental cable connector was manufactured using a 6.6 kVCV cable having a conductor diameter of 22 mm and an insulation thickness of 3.7 mm. This experimental cable connection portion had the same structure as that shown in FIG. 1 except that the length of the exposed conductor of the connection portion was 20 mm and the length (longest portion) of the insulating layer of the connection portion was 440 mm. Each of the above layer materials is laminated on this conductor, and an inner semiconductive layer (thickness 1.0 mm), a reinforcing layer (thickness 0.5 m)
m), an insulating layer (thickness of 3.7 mm), a reinforcing layer (thickness of 0.5 mm)
mm) and an external semiconductive layer (thickness: 1.0 mm). The connection was heated at about 200 ° C. for 2 hours to form a cross-linking unit, thereby obtaining an experimental cable connection of the present invention.

As a comparative example, an experimental cable connection was manufactured in the same manner as described above except that the reinforcing layer was not provided (inner semiconductive layer thickness: 1.0 mm, insulating layer thickness: 3.7 m).
m, outer semiconductive layer thickness 1.0 mm).

The initial connection voltage of 20 kV (A) was applied to the cable connection of the present invention and the cable connection for comparison.
C) is applied for 10 minutes, then the voltage is applied up to 100 kV in steps of 20 kV / 10 minutes, and after a breakdown voltage of 100 kV for 10 minutes, the voltage is further applied in steps of 10 kV / 10 minutes until the insulation is broken down, and AC breakdown occurs. The test was performed.

As a result, the average breakdown voltage of the cable connection portion of the present invention was 250 kV, and the average breakdown voltage of the cable connection portion of the comparative example was 150 kV. The improvement in the average breakdown voltage of the cable connection portion of the present invention is considered to be due to the fact that the degree of crosslinking near the interface between the semiconductive layer and the insulating layer is improved by the reinforcing layer as compared with the comparative example. .

According to an experiment for evaluating the temperature dependence of the escape rate of a surfactant-based high dielectric substance by a thermogravimetric reduction method (TG method), which is an accelerated deterioration test method, it was found that the electric field relaxation at room temperature was about 30 years. It was found that the effect could be maintained.

[0045]

According to the cable connecting portion and the like of the present invention, the degree of crosslinking near the interface between the semiconductive layer and the insulating layer is improved by the presence of the polyolefin resin reinforcing layer even when the above interface diffusion method is employed. Thereby, the insulation performance of the cable connection portion and the like is improved. At the same time, by adopting the interface diffusion method, the effect of improving the insulating performance can be stably exhibited over a long period of time. That is, the effect of the interface diffusion method can be obtained without deteriorating the insulation performance of the cable connection portion and the like.

The surfactant-based high-dielectric substance used in the cable connection portion of the present invention has a thermal decomposition temperature of 250 to 300.
Since the temperature is in the range of ° C. and is higher than room temperature, it is thermally stable, and a highly reliable cable connection portion and the like can be obtained.

Therefore, according to the present invention, it is possible to reduce the thickness of the insulating layer of the power cable connection portion and the like, thereby reducing the diameter of the cable connection portion, and to increase the current capacity with respect to the diameter of the cable connection portion and the like. Can be planned. These effects are particularly useful in applications such as high voltage class polyolefin insulated power cable connections.

Further, since the surfactant-based high dielectric constant substance used in the present invention has a high molecular weight, the extrusion characteristics of the semiconductive layer material are improved as compared with the case where no surfactant is added,
When the semiconductive layer is formed at the connection site by extrusion, the production speed of the cable connection portion can be improved. Further, since the surfactant-based high dielectric substance is an inexpensive industrial material, the cost of the connecting portion and the like hardly matters.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of an example of a cable connecting portion of the present invention.

FIG. 2 is a cross-sectional view of a polyolefin insulated power cable.

FIG. 3 is a schematic cross-sectional view of an example of a conventional cable connection portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Conductor 2 ... Inner semiconductive layer of cable 3 ... Insulating layer of cable 4 ... Outer semiconductive layer of cable 5 ... ··· Compression joint 6 ······ Inner semiconductive layer of cable connection part 7 ····· Insulating layer of cable connection part 8 ····· Outer semiconductive layer of cable connection part 9 ··· ···· Polyolefin reinforcement layer 21 ··· Conductor 22 ··· Cable insulating layer 23 ··· Cable internal conductive layer 24 ··· Cable external conductive layer 31 ··· Conductor 32 ····· Insulating layer of cable connecting portion 33 ··· Inner conductive layer of cable connecting portion 34 ··· Outer conductive layer of cable connecting portion

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[Procedure amendment]

[Submission date] July 3, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction contents]

In the connection portion shown in FIG. 1, a polyolefin reinforcing layer 9 is provided both between the inner semiconductive layer 6 and the insulating layer 7 and between the insulating layer 7 and the outer semiconductive layer 8. However, a polyolefin reinforcing layer may be provided between any one of the semiconductive layer and the insulating layer. Since a preformed polyolefin resin semiconductive layer material is often used as an external semiconductive layer, it is preferable to provide a polyolefin reinforcing layer 9 between the insulating layer 7 and the external semiconductive layer 8.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

The base polymer used in the production of the semiconductive layer, the insulating layer and the polyolefin reinforcing layer may be a polyolefin used for ordinary polyolefin resin-coated cables and their connection parts, and is preferably, for example, polyethylene or ethylene and An ethylene copolymer composed of a monomer copolymerizable therewith may be included. Examples of the ethylene copolymer include an ethylene / vinyl acetate copolymer and an ethylene / ethyl acrylate copolymer.

 ──────────────────────────────────────────────────続 き Continuation of the front page (71) Applicant 000002255 Showa Electric Wire & Cable Co., Ltd. 2-1-1 Oda Sakae, Kawasaki-ku, Kawasaki-shi, Kanagawa (72) Inventor Tatsuki Okamoto 2-6-1 Nagasaka, Yokosuka-shi, Kanagawa (72) Inventor Naohiro Hozumi 2-2-5 Kanaya, Yokosuka City, Kanagawa Prefecture (72) Inventor Katsumi Uchida 20-1, Kita-Sekiyama, Odaka-cho, Midori-ku, Nagoya City, Aichi Prefecture Inside Chubu Electric Power Co., Inc. Inside Electric Cable Co., Ltd.

Claims (8)

[Claims] 1. A cable connecting portion or a terminal portion in which a semiconductive layer formed of a polyolefin resin material containing a surfactant-based high dielectric substance and an insulating layer formed of a polyolefin resin material are coated on a conductor periphery. In the cable connection portion characterized by having provided a polyolefin reinforcing layer formed from a polyolefin resin material having a higher crosslinking agent content than the polyolefin resin material forming the insulating layer between the semiconductive layer and the insulating layer or Termination. 2. The cable connection or terminal according to claim 1, wherein the semiconductive layer is formed of a polyolefin resin material containing no crosslinking agent. 3. The cable connection or terminal according to claim 1, wherein the reinforcing layer is provided between the outer semiconductive layer and the insulating layer. 4. The polyolefin resin material forming the polyolefin reinforcing layer, wherein the content of the crosslinking agent is 0.5 to 5 parts by weight based on 100 parts by weight of the polyolefin resin material. A cable connection or termination according to any of the preceding claims. 5. The amount of the cross-linking agent of the polyolefin resin material forming the polyolefin reinforcing layer is more than the amount of the cross-linking agent of the polyolefin resin material forming the insulating layer.
The cable connection part or terminal part according to any one of claims 1 to 4, wherein the amount is 0.05 to 4.0 parts by weight when expressed in terms of an amount based on 00 parts by weight. 6. The surfactant-based high dielectric constant substance may have a content of 200 to 200.
Sorbitan fatty acid ester, glycerin fatty acid ester, decaglycerin fatty acid ester, polyglycerin fatty acid ester, propylene glycol / pentaerythrol fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbit fatty acid ester, polyoxyethylene sorbit fatty acid ester having a molecular weight of about 20,000 Glycene phosphorus fatty acid ester, polyethylene glycol fatty acid ester, polyoxyethylene alkyl ether, polyoxyethylene fistosterol phytostanol, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene alkylamine
The fatty acid amide, a polyoxyethylene alkylphenyl formaldehyde condensate, a single chain length polyoxyethylene alkyl ether, and a styrene-maleic acid copolymer derivative, selected from the group consisting of: Cable connections or terminations. 7. The method according to claim 1, wherein the amount of the surfactant-based high dielectric substance is 0.1 to 30 parts by weight based on 100 parts by weight of the polyolefin resin material forming the semiconductive layer. 7. The cable connection part or the termination part according to any one of 6. 8. A cable connection portion or a terminal portion in which a semiconductive layer formed of a polyolefin resin material containing a surfactant-based high dielectric constant material and an insulating layer formed of a polyolefin resin material are coated on a conductor periphery. In the method of manufacturing, when covering and cross-linking a polyolefin resin material forming a semiconductive layer and a polyolefin resin material forming an insulating layer on a conductor periphery, insulating between the semiconductive layer material and the insulating layer material The method for producing a cable connecting portion or the terminal portion, wherein a polyolefin resin material having a higher crosslinking agent content than a polyolefin resin forming a layer is interposed.