JPH11181054A - Resin composition having heat-resistant and low dielectric-constant its production and part of electronic equipment using the same composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject readily handleable composition excellent in heat resistance and electrical characteristics and useful for parts, etc., of electronic equipment by combining a polyfunctional epoxy compound with a polyfunctional acrylate. SOLUTION: This composition is obtained by combining (A) a polyfunctional epoxy compound (e.g. a bisphenol A type epoxy resin) with (B) a polyfunctional acrylate (e.g. bisphenol A EO-modified diacrylate) using preferably (C) any amine of a primary, a secondary or a tertiary amine (e.g. diethylenetriamine or triethylenetetramine) as a catalyst.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant low dielectric constant resin composition which can be used for all electronic parts requiring excellent heat resistance and low dielectric constant, a method for producing the same, and an electronic device using the same. For equipment parts, in particular, PWB (Prin
ted wiring board), MCM (MultiChip Module),
T-BGA (Tape-Ball Grid Array) or TAB
(Electrical equipment parts such as (TapeAutomated Bonding)) need to have insulation properties, especially for electronic equipment parts whose clock frequency exceeds about 500MHz, which requires physical properties of low dielectric constant and low dielectric loss tangent. It is widely and suitably used as an insulating material for a portion to be formed.

[0002]

2. Description of the Related Art In recent years, the frequency of semiconductor elements mounted on electronic equipment has been increased, and resins used in PWBs, T-BGAs, TABs, and the like have been used to prevent power loss due to an increase in dielectric loss accompanying the increase in frequencies. Are required to have a low dielectric constant and a low dielectric loss tangent. In addition to these, as other requirements for the resin for the electronic device component,
Heat resistance, moisture resistance, low stress, electrical insulation, ease of processing, etc. However, epoxy resins and phenolic resins, which have been widely used as insulating resins for electronic components, have poor dielectric properties in a high frequency region, and have not been able to obtain satisfactory properties as high frequency resins. Polyimide, which is known for its high heat resistance, has poor moldability and moisture resistance, and balances various required properties, such as fluorine resin, which is known for its excellent electrical properties, which has poor processability. A resin that sufficiently satisfies the requirements has not yet been obtained.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object the object of being easy to handle (and requiring no heating when forming a coating film). A good storage stability, etc.) and excellent heat resistance and electrical properties (low dielectric constant, low dielectric loss tangent); a heat-resistant low dielectric constant resin; To provide electronic device parts.

[0004]

Heretofore, it has generally been considered that a material using acrylate generally has a low Tg. However, the present inventors have intensively studied and found that the dielectric constant is lowered by decreasing the proportion of polar groups in the resin, and the glass transition temperature (T
The above problem was solved by raising the temperature in g). Then, as a result of reacting a specific acrylate with an epoxy resin while being known as a general-purpose resin, a cured film made of the resin composition has excellent high heat resistance and dielectric properties (preferable low dielectric constant and low dielectric constant). Tangent).

[0005] In order to solve the above-mentioned problems, a means provided by the present invention is that a polyfunctional epoxy compound and a polyfunctional acrylate are combined as described in claim 1 first. It is a dielectric resin composition. Since these are general-purpose resins, they have a great advantage that they are inexpensive and can be easily obtained.

The invention described in claim 2 is claim 1.
And a heat-resistant low dielectric constant resin composition described in (1), which is characterized by containing a primary, secondary or tertiary amine. According to this, an excellent effect that the reaction can be quickly performed at a lower temperature can be obtained.

[0007] Then, the invention according to claim 3 is a first-class,
A method for producing a heat-resistant low dielectric constant resin composition, which comprises combining a polyfunctional epoxy compound and a polyfunctional acrylate using a secondary or tertiary amine as a catalyst.

According to a fourth aspect of the present invention, the conductor pattern for an electronic device is provided over one or more layers, and the support, the boundary with the support, or any of those layers is electrically insulated. An electronic device component provided with a layer, wherein a resin obtained by curing the heat resistant low dielectric constant resin composition according to any one of claims 1 to 3 is used for the electric insulating layer. Electronic component. This resin has low dielectric constant and low dielectric loss tangent,
An excellent effect of suppressing an increase in signal delay and dielectric loss, which is a problem when the clock frequency exceeds about 500 MHz, can be obtained.

According to a fifth aspect of the present invention, the electronic device component includes a printed wiring board, a multi-chip module,
-An electronic device component characterized by being one of BGA and TAB.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a bifunctional or higher polyfunctional epoxy resin is used as an epoxy resin. For example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, phenol novolak epoxy resin, cresol novolac epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin, cycloaliphatic epoxy resin or Heterocyclic epoxy resin and the like. As a specific example, the chemical structural formula (A1) shown below
To (A13).

[0011]

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[0012]

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As the acrylate, a polyfunctional acrylate having two or more functional groups is used. As specific examples, the chemical structural formulas (B1) to (B21) shown below or the chemical structural formulas (C
Any of the compounds 1) to (C6) can be mentioned.

[0014]

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[0015]

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[0016]

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From the viewpoint of performance, the polyfunctional acrylate according to the present invention particularly has the following chemical structural formula (C)
Compounds 1) to (C6) are preferred.

[0018]

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[0019]

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Each of these (C1) to (C6) is available as, for example, the following products. (C1) ... Trade name: Alonix M-210, manufactured by Toa Gosei Co., Ltd. (C2) ... Trade name: Alonix M-309, manufactured by Toa Gosei Co., Ltd. (C3) ... Trade name: Alonix M-310, manufactured by Toa Gosei Co., Ltd. (C4) ... Trade name: Alonix M-350, manufactured by Toa Gosei Co., Ltd. (C5) ... Trade name: Alonix M-400, manufactured by Toa Gosei Co., Ltd. (C6) ... Trade name: Alonix M-450, manufactured by Toagosei Co., Ltd.

Examples of primary, secondary or tertiary amines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, isophoronediamine, bis (4-amino-3-methyldicyclohexyl). ) Methane, diaminodicyclohexylmethane, bis (aminomethyl) cyclohexane, metaphenylenediamine, diaminodiphenylmethane, diaminodimethyldiphenylmethane, mensendiamine, benzyldimethylamine, N, N'-dimethylpiperazine, pyridine, piperidine, picoline, or 1, 8-diazabiscyclo (5,4,0) undecene-1 (DBU) and the like can be mentioned.

The compound of the present invention is applied to a glass epoxy plate, a metal plate, a film, a glass plate, a resin, or the like by a coating method using a spin coater, dipping, an applicator, a bar coater, a slot coater, or the like to obtain PWB. , MCM, T-BGA, TAB, and interlayer insulating materials.

[0023]

<Example 1> 74.0 g of Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy) also shown as (Chemical Formula 8) as an epoxy resin,

[0024]

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Further, as a polyfunctional acrylate,
Aronix M450 (trade name, Toagosei Co., Ltd.)
21.2 g)

[0026]

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Further, 1.1 g of triethylenetetramine was placed in a beaker, stirred at room temperature for 30 minutes using a stirrer, and then defoamed under reduced pressure. This is applied to a copper plate by an applicator, and then left on a hot plate at 70 ° C. for 3 minutes for leveling, and then heated in a clean oven at 120 ° C. for 1 hour, 150 ° C. for 1 hour, and further heated at 230 ° C. for 3 hours. As a result, a cured resin film having a thickness of 20 μm was obtained.

Example 2 Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin was 74.0.
g, and Aronix M450 as a polyfunctional acrylate
31.8 g (trade name, manufactured by Toagosei Co., Ltd.) and 1.1 g of triethylenetetramine were placed in a beaker.
In the same manner as in <1>, stirring, coating and heating were performed to obtain a cured resin film having a thickness of 20 μm. The results of the dielectric constant, dielectric loss tangent, and glass transition temperature are shown in (Table 1).

Example 3 As an epoxy resin, Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy) was 37.0.
g, and Alonix M210 (trade name, manufactured by Toagosei Co., Ltd.) also shown as a polyfunctional acrylate in Chemical Formula 10
6.8 g,

[0030]

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Then, triethylenetetramine was added to 0.56
g In a beaker, stirring, coating, and heating were performed in the same manner as in Example 1 to obtain a cured resin film having a thickness of 20 μm. The results of the dielectric constant, dielectric loss tangent, and glass transition temperature are shown in (Table 1).

Example 4 55.5 of Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) was used as an epoxy resin.
g, as well as 44.4 g of Alonix M309 (trade name, manufactured by Toagosei Co., Ltd.) also shown as (Chemical Formula 11) as a polyfunctional acrylate;

[0033]

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0.83 g of triethylenetetramine was placed in a beaker, and stirred, coated and heated in the same manner as in Example 1 to obtain a cured resin film having a thickness of 20 μm.
Regarding the results of dielectric constant, dielectric loss tangent, and glass transition temperature,
It is shown in (Table 1).

Example 5 As an epoxy resin,
2) 52.5 g of Epicoat 152 (trade name, made of Yuka Shell Epoxy) also shown in

[0036]

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Alonix M450 (trade name, manufactured by Yuka Shell Epoxy Co.) as a polyfunctional acrylate
9 g and 0.80 g of triethylenetetramine were placed in a beaker, and stirred, applied and heated in the same manner as in Example 1 to obtain a cured resin film having a thickness of 20 μm. The results of the dielectric constant, dielectric loss tangent, and glass transition temperature are shown in (Table 1).

<Comparative Example 1> Epicoat 828 (trade name,
50 g of oily shell epoxy) and 1.5 g of diaminodiphenylmethane were placed in a beaker, stirred in the same manner as in Example 1, applied to a copper plate with a spin coater, and then placed in a clean oven at 85 ° C. Heating was performed for 4 hours at 150 ° C. to obtain a cured resin film having a thickness of 20 μm. The results of the dielectric constant, dielectric loss tangent, and glass transition temperature are shown in (Table 1).

<Comparative Example 2> Data was cited and described with reference to a catalog of BT resin (Mitsubishi Gas Chemical Co., Ltd.), a bismaleimide-based polyimide. The values of the dielectric constant, dielectric loss tangent, and glass transition temperature are shown in (Table 1).

Comparative Example 3 A cresol novolak resin was applied on a copper plate by a spin coater and then heated in a clean oven at 200 ° C. for 3 hours to obtain a cured resin film having a thickness of 20 μm. Table 1 shows the results of dielectric constant, dielectric loss tangent, and glass transition temperature.

Using the resin cured films obtained in the above <Example 1> to <Example 5> and <Comparative Example 1> to <Comparative Example 3> as a sample, the resin cured film is defined in JIS-C-6184. The relative permittivity and the dielectric loss tangent were measured according to the methods described above.

For the measurement of Tg, see <Example 1>
> To <Example 5> and <Comparative Example 1> to <Comparative Example 3>
After applying each resin composition in the form of a polyimide film stuck on a copper plate and curing under the same heating conditions,
Using each cured resin film obtained by peeling the cured resin film from the polyimide film, a dynamic viscoelasticity measuring device (model name: RHEORO GRAPH S
OLID, manufactured by Toyo Seiki Seisaku-sho, Ltd.). The measurement was performed at 10 Hz.

[0043]

[Table 1]

[0044]

As described above, the heat resistant low dielectric constant resin composition of the present invention is not only excellent in heat resistance but also has a low dielectric constant and a low dielectric loss tangent. It can be widely used for various kinds of electronic components such as heat-resistant materials and insulating materials. In particular, PWB, MC
Among M, T-BGA, TAB, and the like, it is suitable as a material for electronic device parts used under a high frequency at which the clock frequency exceeds about 500 MHz, for example, as an insulating resin used between layers. As described above, according to the present invention, a heat-resistant low dielectric constant resin which is easy to handle and has excellent heat resistance and electrical properties (low dielectric constant and low dielectric loss tangent), a method for producing the same, and a heat resistant low dielectric constant An electronic device component using the resin composition could be provided.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H05K 3/46 H05K 3/46 T

Claims (5)

[Claims] 1. A heat-resistant low dielectric constant resin composition comprising a compound of a polyfunctional epoxy compound and a polyfunctional acrylate. 2. The heat-resistant low dielectric constant resin composition according to claim 1, further comprising a primary, secondary or tertiary amine. 3. A method for producing a heat-resistant low dielectric constant resin composition, comprising combining a polyfunctional epoxy compound with a polyfunctional acrylate using a primary, secondary or tertiary amine as a catalyst. . 4. A wiring circuit is provided in one layer or a plurality of layers, and in the case of one layer, a support or a boundary portion between the support and the wiring circuit, or in the case of a plurality of layers, An electronic device component having an electrical insulating layer provided between a support or a layer of the wiring circuit, wherein the heat-resistant low dielectric constant resin composition according to claim 1 is cured on the electrical insulating layer. An electronic device component characterized in that a resin obtained by using the same is used. 5. The electronic device component according to claim 4, wherein the electronic device component is one of a printed wiring board, a multi-chip module, a T-BGA, and a TAB.